MM118-06L [MICROSEMI]
3 PHASE N-CHANNEL INSULATED GATE BIPOLAR TRANSISTOR IGBT BRIDGE; 3相N沟道绝缘栅双极晶体管IGBT桥型号: | MM118-06L |
厂家: | Microsemi |
描述: | 3 PHASE N-CHANNEL INSULATED GATE BIPOLAR TRANSISTOR IGBT BRIDGE |
文件: | 总3页 (文件大小:120K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
2830 S. Fairview St.
Santa Ana, CA 92704
PH: (714) 979-8220
FAX: (714) 966-5256
MM118-XX
SERIES
Features
·
Available in Low Conduction Loss Class as MM118-xxL or Fast
Switching Class as MM118-xxF
Compact and rugged construction offering weight and space savings
Available with PC board solderable pins (see mechanical outline below)
or threaded terminals (add “T” suffix to part number, see option below)
HPM (Hermetic Power Module)
Isolation voltage capability (in reference to the base) in excess of 3kV
Very low thermal resistance
Thermally matched construction provides excellent temperature and
power cycling capability
600 / 1200 Volts
150 Amps
3 PHASE N-CHANNEL
INSULATED GATE
BIPOLAR
·
·
·
·
·
·
TRANSISTOR (IGBT)
BRIDGE
Maximum Ratings per switch @ 25°C (unless otherwise specified)
PART NUMBER
SYMBOL
MM118-06
MM118-12
Collector-to-Emitter Breakdown Voltage (Gate shorted to
BVCES
600 V
1200 V
Emitter), @ Tj³ 25°C
BVCGR
600 V
1200 V
Collector-to-Gate Breakdown Voltage @ Tj³ 25°C, RGS= 1
MW
Gate-to-Emitter Voltage
continuous
transient
VGES
VGEM
IC25
+/- 20 V
+/- 30 V
60 A
+/- 20 V
+/- 30 V
52 A
Continuous Collector Current
Tj=
IC90
32 A
33 A
25°C
Tj= 90°C
Peak Collector Current, pulsewidth limited by Tj max
Power Dissipation
ICM
PD
120 A
165 W
104 A
165 W
Thermal resistance, junction to base
per switch
RQjc, max
0.75°C/W
0.75°C/W
Mechanical Outline
Datasheet# MSC0321A
MM-XX SERIES
Maximum Ratings @ 25°C (unless otherwise specified) - continued
DESCRIPTION
SYMBOL
MM118-06
MM118-12
Short Circuit Reverse Current (RBSOA) @ Tj= 125°C, VCE= 0.8 x VCES
Junction and Storage Temperature Range (°C)
Continuous Source Current (parallel Diode)
Imax
Tj, Tstg
IS
64 A
66 A
-55 to +150 -55 to +150
60 A
50 A
Pulse Source Current (parallel Diode)
ISM
100 A
100 A
Electrical Parameters, per switch @ 25°C (unless otherwise specified)
SYMBOL
PART
MIN
TYP.
MAX
UNIT
DESCRIPTION
Collector-to-Emitter Breakdown Voltage
(Gate Shorted to Emitter)
CONDITIONS
VGS = 0 V, IC = 250 mA
BVCES
MM118-06
MM118-12
MM118-06F
MM118-06L
MM118-12
600
1200
2.5
4
V
Gate Threshold Voltage
VGE(th)
4
5.0
7
6.5
±100
±200
200
V
VCE = VGE, IC = 250 mA
VCE = VGE, IC = 2.5 mA
VCE = VGE, IC = 350 mA
VGE = ± 20VDC, VCE = 0
4.5
5.5
Gate-to-Emitter Leakage Current
(ALL)
nA
mA
V
TJ = 25°C
TJ = 125°C
TJ = 25°C
TJ = 125°C
TJ = 25°C
TJ = 25°C
TJ = 125°C
TJ = 25°C
TJ = 25°C
TJ = 25°C
TJ = 125°C
IGES
ICES
Collector-to-Emitter Leakage Current
(Zero Gate Voltage Collector Current)
Collector-to-Emitter Saturation Voltage
(1)
(ALL)
VCE =0.8·BVCES
VGE = 0 V
VGE= 15V, IC= 30A
IC= 60A
IC= 30A
IC= 30A
VGE= 15V, IC= 25A
IC= 50A
1000
MM118-06F
MM118-06F
MM118-06F
MM018-06L
MM118-12
MM118-12
MM118-12
2.2
3.5
2.2
2.2
2.7
3.4
3.3
2.9
tbd
tbd
2.5
3.2
tbd
3.9
VCE(sat)
IC= 25A
Forward Transconductance (1)
gfs
MM118-06F
MM118-06L
MM118-12
MM118-06F
MM118-06L
MM118-12
MM118-06F
MM118-06L
MM118-12
MM118-06F
MM118-06L
MM118-12
15
7
8.5
20
13
20
2500
2760
1650
230
240
250
70
S
VCE ³ 10 V; IC = 30 A
VCE ³ 10 V; IC = 30 A
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Cies
Coes
Cres
VGE = 0 V, VCE = 25 V, f = 1 MHz
tbd
tbd
2200
tbd
tbd
380
tbd
pF
51
110
tbd
160
INDUCTIVE LOAD, Tj= 25°C (2,3)
Turn-on Delay Time
td(on)
MM118-06F
MM118-06L
MM118-12
MM118-06F
MM118-06L
MM118-12
MM118-12
MM118-06F
MM118-06L
MM118-12
MM118-06F
MM118-06L
MM118-12
MM118-06F
MM118-06L
MM118-12
25
60
75
30
130
65
3.6
175
400
420
125
400
45
1.3
5
2.4
tbd
tbd
110
tbd
tbd
100
-
tbd
tbd
560
175
tbd
60
-
ns
ns
ns
ns
ns
ns
mJ
ns
ns
ns
ns
ns
ns
mJ
mJ
mJ
VGE = 15 V, L= 100 mH note 2, 3
for MM118-06: VCE = 480 V,
IC = 30 A, RG = 4.7 W
for MM118-12: VCE= 600 V,
IC= 25 A, RG = 47 W
Rise Time
tri
On Energy
Turn-off Delay Time
Eon
td(off)
Fall Time
Off Energy
tfi
Eoff
-
-
Datasheet# MSC0321A
INDUCTIVE LOAD, Tj= 125°C (2,3)
Turn-on Delay Time
td(on)
MM118-06F
MM118-06L
MM118-12
MM118-06F
MM118-06L
MM118-12
MM118-06F
MM118-06L
MM118-12
MM118-06F
MM118-06L
MM118-12
MM118-06F
MM118-06L
MM118-12
MM118-06F
MM118-06L
MM118-12
MM118-06F
MM118-06L
MM118-12
MM118-06F
MM118-06L
MM118-12
MM118-06F
MM118-06L
MM118-12
MM118-06
MM118-06
MM118-06
MM118-06
MM118-12
MM118-12
25
60
95
35
130
90
1
4.2
10
250
540
420
260
600
45
4
12
4.2
125
110
160
23
34
20
50
47
75
-
tbd
tbd
tbd
tbd
tbd
tbd
-
ns
ns
ns
ns
ns
ns
mJ
mJ
mJ
ns
ns
ns
ns
ns
ns
mJ
mJ
mJ
nC
VGE = 15 V, L= 100 mH note 2, 3
for MM118-06: VCE = 480 V,
IC = 30 A, RG = 4.7 W
for MM118-12: VCE= 600 V,
IC= 25 A, RG = 47 W
Rise Time
tri
On Energy
Eon
td(off)
tfi
Turn-off Delay Time
Fall Time
-
-
tbd
1000
tbd
tbd
1500
tbd
-
Off Energy
Eoff
Qg
-
-
Total Gate Charge
VGE = 15 V,
for MM118-06: VCE = 300V, IC= 30 A
for MM118-12: VCE= 600 V, IC= 25 A
150
150
tbd
35
45
tbd
75
63
tbd
1.5
-
Gate-to-Emitter Charge
Gate-to-Collector (Miller) Charge
Qge
Qgc
VF
Antiparallel diode forward voltage (1)
V
IE= 15 A
IE= 30 A
IE= 50 A
IE= 15 A
IE= 10 A
IE= 10 A
TJ = 25 °C
TJ = 25 °C
TJ = 25 °C
TJ = 150 °C
TJ = 25 °C
TJ = 100 °C
1.7
1.9
-
2.4
2
-
1.3
3
-
Antiparallel diode reverse recovery time
Antiparallel diode reverse recovery charge
Antiparallel diode peak recovery current
trr
MM118-06
MM118-06
MM118-12
MM118-12
-
140
-
100
-
tbd
-
ns
nC
A
IE= 10 A, dIE/dt= 100 A/us, TJ= 25°C
IE= 30 A, dIE/dt= 100 A/us, TJ= 25°C
IE= 10 A, dIE/dt= 100 A/us, TJ= 25°C
IE= 10 A, dIE/dt= 100 A/us, TJ= 125°C
IE= 10 A, dIE/dt= 100 A/us, TJ= 25°C
IE= 30 A, dIE/dt= 100 A/us, TJ= 25°C
IE= 10 A, dIE/dt= 100 A/us, TJ= 25°C
IE= 10 A, dIE/dt= 100 A/us, TJ= 125°C
IE= 10 A, dIE/dt= 100 A/us, TJ= 25°C
IE= 30 A, dIE/dt= 100 A/us, TJ= 25°C
IE= 10 A, dIE/dt= 100 A/us, TJ= 25°C
IE= 10 A, dIE/dt= 100 A/us, TJ= 125°C
60
Qrr
MM118-06
MM118-06
MM118-12
MM118-12
160
320
tbd
800
IRM
MM118-06
MM118-06
MM118-12
MM118-12
3
4.2
tbd
22
Notes
(1) Pulse test, t £ 300 ms, duty cycle d £ 2%
(2) switching times and losses may increase for larger VCE and/or RG values or higher junction temperatures.
(3) switching losses include “tail” losses
(4) Microsemi does not manufacture the igbt die; contact Microsemi for details.
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