MASMLJ40AE3 [MICROSEMI]
Trans Voltage Suppressor Diode, 3000W, 40V V(RWM), Unidirectional, 1 Element, Silicon, DO-214AB, ROHS COMPLIANT, PLASTIC PACKAGE-2;型号: | MASMLJ40AE3 |
厂家: | Microsemi |
描述: | Trans Voltage Suppressor Diode, 3000W, 40V V(RWM), Unidirectional, 1 Element, Silicon, DO-214AB, ROHS COMPLIANT, PLASTIC PACKAGE-2 局域网 光电二极管 |
文件: | 总12页 (文件大小:950K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MSMLG5.0A – MSMLG170CAe3, MSMLJ5.0A – MSMLJ170CAe3 Surface
Mount 3000 Watt Transient Voltage Suppressor
1
Product Overview
The MSMLG5.0A–MSMLG170CA and the MSMLJ5.0A–MSMLJ170CA series of high-reliability transient
voltage suppressors (TVS) protect circuits from voltage spikes containing up to 3000 W (10/1000 μs
model pulse). The SMLG gull-wing design in the DO-215AB package allows for visible solder connections.
The SMLJ J-bend design in the DO-214AB package allows for greater PC board mounting density.
Selections include unidirectional and bidirectional as well as RoHS-compliant versions. These are
available with a variety of upscreening options for enhanced reliability. They protect against the
secondary effects of lightning per IEC61000-4-5 and against voltage pulses from inductive switching
environments and induced by RF radiation. Since their response time is virtually instantaneous, they can
also be used in protection from ESD and EFT per IEC61000-4-2 and IEC61000-4-4.
For the latest information, visit our website www.microsemi.com.
1.1
Features
The following are key features of the MSMLG5.0A through MSMLG170CAe3 and the MSMLJ5.0A
through MSMLJ170CAe3 devices:
High-reliability devices with fabrication and assembly lot traceability for all M prefix devices
All devices are 100% surge tested
3σ lot norm screening performed on standby current (ID) for all M prefix devices
Available in both unidirectional and bidirectional versions
Moisture classification is “Level 1” with no dry pack required per IPC/JEDEC J-STD-020B for all M
prefix devices.
Enhanced reliability screening options with M prefix are available in reference to MIL-PRF-19500.
Refer to High Reliability Up-Screened Plastic Products Portfolio for more details on the screening
options (see Part Nomenclature for all available options).
RoHS compliant versions available
Axial-lead equivalent packages for thru-hole mounting are available as M5KP5.0A to M5KP110CA
with 5000 W rating (contact Microsemi for other surface mount options).
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1.2
Applications and Benefits
The following are benefits of the MSMLG5.0A through MSMLG170CAe3 and the MSMLJ5.0A through
MSMLJ170CAe3 devices.
Suppresses transients up to 3000 W (10/1000 µs test pulse—see Figure 2 (see page 7))
Protection from switching transients and induced RF
Protection from ESD, and EFT per IEC 61000-4-2 and IEC 61000-4-4
Secondary lightning protection per IEC 61000-4-5 with 42 Ω source impedance:
Class 1 and 2: SML 5.0A to SML 170A or CA
Class 3: SML 5.0A to SML 150A or CA
Class 4: SML 5.0A to SML 75A or CA
Secondary lightning protection per IEC 61000-4-5 with 12 Ω source impedance:
Class 1: SML 5.0A to SML 170A or CA
Class 2: SML 5.0A to SML 90A or CA
Class 3: SML 5.0A to SML 48A or CA
Class 4: SML 5.0A to SML 24A or CA
Secondary lightning protection per IEC 61000-4-5 with 2 Ω source impedance:
Class 2: SML 5.0A to SML 43A or CA
Class 3: SML 5.0A to SML 22A or CA
Class 4: SML 5.0A to SML10A or CA
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1.3
Part Nomenclature
The following table lists the part nomenclature for the MSMLG5.0A through MSMLG170CAe3 and the
MSMLJ5.0 through MSMLJ170CAe3 devices.
Table 1 • MXSMLG5.0CAe3 Part Nomenclature
MX
Reliability level*
M (controlled product)
MA (aviconics grade) MX (reference JANTX)
MXL (MX life)
Blank = commercial
*(see Hirel Non-Hermetic Product Portfolio)
SM
L
Surface-mount package
3000 W power level
G or J
5.0
Gull-wing or J-bend lead frame
Reverse standoff voltage
(see Typical Electrical Performance (see page 5)
table)
C
Uni/bidirectional
C = Bidirectional
Blank = Undirectional
A
± 5% Tolerance level
RoHS Compliance
e3
e3 = RoHS compliant
Blank = non-RoHS compliant
1.4
Symbols and Definitions
The following table lists the symbols and definitions used for the MSMLG5.0A through MSMLG170CAe3
and the MSMLJ5.0 through MSMLJ170CAe3 devices.
Table 2 • Symbols and Definitions
Symbol
I(BR)
ID
Value
Definition
Breakdown current
Standby current
The current used for measuring breakdown voltage V(BR).
The current at the rated standoff voltage VWM.
The forward current dc value, no alternating component.
The peak current during the impulse.
IF
Forward current
Peak impulse current
Peak pulse Power
Minimum breakdown voltage
Clamping voltage
IPP
PPP
V(BR)
VC
The peak power dissipation resulting from peak impulse current IPP.
The minimum voltage the device will exhibit at a specified current.
Clamping voltage at IPP (peak pulse current) at the specified pulse
conditions (typically shown as maximum value).
VWM
Rated working standoff voltage
The maximum peak voltage that can be applied over the operating
temperature range.
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2
Electrical Specifications
This section shows the electrical specifications for the MSMLG5.0A–MSMLG170CA and the MSMLJ5.0A–
MSMLJ170CA devices.
2.1
Maximum Ratings
The following table shows you the absolute maximum ratings for the MSMLG5.0A–MSMLG170CA and
the MSMLJ5.0A–MSMLJ170CA devices.
Table 3 • Absolute Maximum Ratings
Parameter/Test Conditions
Symbol
TJ and TSTG
RθJL
Value
–65 to 150
17.5
Unit
°C
Junction and storage temperature
Thermal resistance junction-to-lead
Thermal resistance junction-to-ambient1
°C/W
RθJA
77.5
Peak pulse power dissipation at 25 °C
(10/1000 μs, see Figures 1, 2, and 3).
PPP
3000
W
%
Impulse repetition rate (duty factor)
df
0.01 or
less
tclamping (0 V to V(BR) min)
Unidirectional
Bidirectional
TL = 45 °C
tclamping
<100
<5
ps
ns
W
Rated average power dissipation
PM(AV)
6
TL = 25 °C
1.611
200
260
Maximum forward surge current2
Solder temperature at 10 s
IFSM
TSP
A (pk)
°C
Notes:
1. When mounted on FR4 PC board (1 oz Cu) with recommended mounting pad (see pad layout).
2. Peak impulse of 8.3 ms half-sine wave at 25 °C (unidirectional only).
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2.2
Typical Electrical Performance
The following table shows the Electrical characteristics for the MSMLG5.0A–MSMLG170CA and the
MSMLJ5.05A–MSMLJ170CA devices at 25 °C unless otherwise specified.
For bidirectional device types, indicate a CA suffix after the part number (i.e. MSMLG170CA).
Table 4 • Typical Electrical Performance
Part Number
VWM
VBR Breakdown
Voltage at I(BR)
IBR Test
Current
VC Max
Clamping
Voltage
at IPP
IPP Max
Peak
ID Max
Reverse
Standoff
Voltage
Stand-by
Current
at V WM
Pulse
Current
Gull-wing
J-bend
(V)
(V)
(mA)
(V)
(A)
(µA)
SMLG5.0A
SMLG6.0A
SMLJ5.0A
SMLJ6.0A
5.0
6.0
6.40 – 7.00
6.67 – 7.37
10
10
9.2
326.0
291.3
1000
1000
10.3
SMLG6.5A
SMLG7.0A
SMLJ6.5A
SMLJ7.0A
6.5
7.0
7.22 – 7.98
7.78 – 8.60
10
10
11.2
12.0
267.9
250.0
500
200
SMLG7.5A
SMLG8.0A
SMLJ7.5A
SMLJ8.0A
7.5
8.0
8.33 – 9.21
8.89 – 9.83
1
1
12.9
13.6
232.6
220.6
100
50
SMLG8.5A
SMLG9.0A
SMLJ8.5A
SMLJ9.0A
8.5
9.0
9.44 – 10.4
10.0 – 11.1
1
1
14.4
15.4
208.4
194.8
25
10
SMLG10A
SMLG11A
SMLJ10A
SMLJ11A
10
11
11.1 – 12.3
12.2 – 13.5
1
1
17.0
18.2
176.4
164.8
5
5
SMLG12A
SMLG13A
SMLJ12A
SMLJ13A
12
13
13.3 – 14.7
14.4 – 15.9
1
1
19.9
21.5
150.6
139.4
5
5
SMLG14A
SMLG15A
SMLJ14A
SMLJ15A
14
15
15.6 – 17.2
16.7 – 18.5
1
1
23.2
24.4
129.4
123.0
2
2
SMLG16A
SMLG17A
SMLJ16A
SMLJ17A
16
17
17.8 – 19.7
18.9 – 20.9
1
1
26.0
27.6
115.4
106.6
2
2
SMLG18A
SMLG20A
SMLJ18A
SMLJ20A
18
20
20.0 – 22.1
22.2 – 24.5
1
1
29.2
32.4
102.8
92.6
2
2
SMLG22A
SMLG24A
SMLJ22A
SMLJ24A
22
24
24.4 – 26.9
26.7 – 29.5
1
1
35.5
38.9
84.4
77.2
2
2
SMLG26A
SMLG28A
SMLJ26A
SMLJ28A
26
28
28.9 – 31.9
31.1 – 34.4
1
1
42.1
45.4
71.2
66.0
2
2
SMLG30A
SMLG33A
SMLJ30A
SMLJ33A
30
33
33.3 – 36.8
36.7 – 40.6
1
1
48.4
53.3
62.0
56.2
2
2
SMLG36A
SMLG40A
SMLJ36A
SMLJ40A
36
40
40.0 – 44.2
44.4 – 49.1
1
1
58.1
64.5
51.6
46.4
2
2
SMLG43A
SMLG45A
SMLJ43A
SMLJ45A
43
45
47.8 – 52.8
50.0 – 55.3
1
1
69.4
72.7
43.2
41.2
2
2
SMLG48A
SMLG51A
SMLJ48A
SMLJ51A
48
51
53.3 – 58.9
56.7 – 62.7
1
1
77.4
82.4
38.8
36.4
2
2
SMLG54A
SMLG58A
SMLJ54A
SMLJ58A
54
58
60.0 – 66.3
64.4 – 71.2
1
1
87.1
93.6
34.4
32.0
2
2
SMLG60A
SMLG64A
SMLJ60A
SMLJ64A
60
64
66.7 – 73.7
71.1 – 78.6
1
1
96.8
31.0
29.2
2
2
103.0
SMLG70A
SMLG75A
SMLJ70A
SMLJ75A
70
75
77.8 – 86.0
83.3 – 92.1
1
1
113
121
26.6
24.8
2
2
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Part Number
VWM
VBR Breakdown
Voltage at I(BR)
IBR Test
Current
VC Max
Clamping
Voltage
at IPP
IPP Max
Peak
ID Max
Reverse
Standoff
Voltage
Stand-by
Current
at V WM
Pulse
Current
SMLG78A
SMLG85A
SMLJ78A
SMLJ85A
78
85
86.7 – 95.8
1
1
126
137
22.8
20.8
2
2
94.4 – 104.0
SMLG90A
SMLJ90A
90
100 – 111
111 – 123
1
1
146
162
20.6
18.6
2
2
SMLG100A
SMLJ100A
100
SMLG110A
SMLG120A
SMLJ110A
SMLJ120A
110
120
122 – 135
133 – 147
1
1
177
193
16.8
15.6
2
2
SMLG130A
SMLG150A
SMLJ130A
SMLJ150A
130
150
144 – 159
167 – 185
1
1
209
243
14.4
12.4
2
2
SMLG160A
SMLG170A
SMLJ160A
SMLJ170A
160
170
178 – 197
189 – 209
1
1
259
275
11.6
11.0
2
2
Bidirectional capacitance is half that shown in Figure 4 (see page 8) at 0 V.
2.3
Typical Performance Curves
This section shows the typical performance curves of the MSMLG5.0A–MSMLG170CA and the
MSMLJ5.0A–MSMLJ170CA devices.
The following graph shows peak-pulse power versus pulse time (up to 50% of exponentially decaying
pulse).
Figure 1 • Peak Pulse Power vs. Pulse Time (to 50% of exponentially decaying pulse)
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The following graph shows the pulse waveform with these parameters: tr = 10 µs and tp = 1000 µs.
Figure 2 • Pulse Waveform
The following graph shows the derating curve.
Figure 3 • Derating Curve
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The following graph shows the typical capacitance versus the breakdown voltage. Note that the
bidirectional capacitance is half that shown at 0 V.
Figure 4 • Typical Capacitance vs. Breakdown Voltage (Unidirectional Configuration)
Note:
Bidirectional capacitance is half that shown in Figure 4 at 0 V.
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3
Package Specification
The following sections shows the package specifications for the SMLG (DO-215AB) and SMLG (DO-
214AB) packages.
3.1
Package Information
The following illustration shows the SMLJ DO-214AB package dimensions. The typical standoff height is
0.004 in—0.008 in (0.1—0.2 mm).
Figure 5 • SMLG (DO-215AB) Package Dimensions
The following table shows the SMLG DO-215AB mechanical and packaging information.
Table 5 • SMLG (DO-215AB) Mechanical and Package Information
Letter
Dimensions (in.)
0.115—0.121
0.260—0.280
0.220—0.245
0.077—0.110
0.380—0.400
0.025—0.040
Dimensions (mm)
2.92—3.07
A
B
C
E
6.60—7.11
5.59—6.22
1.95—2.80
F1
K
9.65—10.16
0.635—1.016
Note:
1. Dimesion "E" exceeds the JEDEC outline as shown.
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The following illustration shows the mechanical and packaging information for the SMLG (DO-214AB)
package.
Figure 6 • SMLJ_(DO-214AB)_Package_Dimensions
The following table shows the SMLJ DO-214AB mechanical and packaging information.
Table 6 • SMLJ (DO-214AB) Mechanical and Package Information
Letter
Dimensions (in.)
0.115—0.121
0.260—0.280
0.220—0.245
0.305—0.320
0.077—0.110
0.030—0.060
Dimensions (mm)
2.92—3.07
A
B
C
D
E
L
6.60—7.11
5.59—6.22
7.75—8.13
1.95—2.80
0.760—1.52
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3.2
Pad Layout
The following illustration shows the pad layout for the SMLG (DO-215AB) and SMLJ (DO-214AB)
packages.
Figure 7 • Pad Layout
The following table shows the SMLG DO-215AB pad layout dimensions.
Table 7 • SMLG (DO-215AB) Pad Layout Dimensions
Letter
Dimensions (in.)
0.510
Dimensions (mm)
A
B
C
12.95
2.79
3.81
0.110
0.150
The following table shows the SMLJ DO-214AB pad layout dimensions.
Table 8 • SMLJ (DO-214AB) Pad Layout Dimensions
Letter
Dimensions (in.)
0.390
Dimensions (mm)
A
B
C
9.90
2.79
3.81
0.110
0.150
Microsemi Proprietary and Confidential. MSMLG5.0A–MSMLG170CAe3, MSMLJ5.0A–MSMLJ170CAe3 Datasheet Revision D
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Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services
for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The
products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with
mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and
complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data
and performance specifications or parameters provided by Microsemi. It is the Buyer's responsibility to independently determine suitability of any
products and to test and verify the same. The information provided by Microsemi hereunder is provided "as is, where is" and with all faults, and the
entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights,
licenses, or any other IP rights, whether with regard to such information itself or anything described by such information. Information provided in this
document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this document or to any products
and services at any time without notice.
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One Enterprise, Aliso Viejo,
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Microsemi Proprietary and Confidential. MSMLG5.0A–MSMLG170CAe3, MSMLJ5.0A–MSMLJ170CAe3 Datasheet Revision D
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