APTGT300DU120G [MICROSEMI]

Dual common source Fast Trench + Field Stop IGBT Power Module; 双共源快速沟道+场截止IGBT功率模块
APTGT300DU120G
型号: APTGT300DU120G
厂家: Microsemi    Microsemi
描述:

Dual common source Fast Trench + Field Stop IGBT Power Module
双共源快速沟道+场截止IGBT功率模块

晶体 晶体管 功率控制 双极性晶体管 局域网
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中文:  中文翻译
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APTGT300DU120G  
Dual common source  
Fast Trench + Field Stop IGBT®  
Power Module  
VCES = 1200V  
IC = 300A @ Tc = 80°C  
Application  
AC Switches  
C1  
C2  
Switched Mode Power Supplies  
Uninterruptible Power Supplies  
Q1  
Q2  
G1  
E1  
G2  
E2  
Features  
Fast Trench + Field Stop IGBT® Technology  
-
-
-
-
-
-
-
-
Low voltage drop  
Low tail current  
Switching frequency up to 20 kHz  
Soft recovery parallel diodes  
Low diode VF  
E
Low leakage current  
Avalanche energy rated  
RBSOA and SCSOA rated  
Kelvin emitter for easy drive  
Very low stray inductance  
-
-
Symmetrical design  
M5 power connectors  
High level of integration  
G1  
E1  
C1  
E
C2  
Benefits  
Stable temperature behavior  
Very rugged  
E2  
G2  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Easy paralleling due to positive TC of VCEsat  
Low profile  
RoHS Compliant  
Absolute maximum ratings  
Symbol  
Parameter  
Max ratings  
Unit  
VCES  
Collector - Emitter Breakdown Voltage  
1200  
420  
V
TC = 25°C  
IC  
Continuous Collector Current  
A
TC = 80°C  
TC = 25°C  
300  
ICM  
VGE  
PD  
Pulsed Collector Current  
Gate – Emitter Voltage  
Maximum Power Dissipation  
600  
±20  
1380  
V
W
TC = 25°C  
RBSOA Reverse Bias Safe Operating Area  
Tj = 125°C 600A @ 1100V  
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note  
APT0502 on www.microsemi.com  
1 - 5  
www.microsemi.com  
APTGT300DU120G  
All ratings @ Tj = 25°C unless otherwise specified  
Electrical Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
ICES  
Zero Gate Voltage Collector Current  
VGE = 0V, VCE = 1200V  
500  
2.1  
µA  
Tj = 25°C  
Tj = 125°C  
1.4  
5.0  
1.7  
2.0  
5.8  
VGE =15V  
VCE(sat) Collector Emitter Saturation Voltage  
VGE(th) Gate Threshold Voltage  
IGES  
V
IC = 300A  
VGE = VCE , IC = 4 mA  
6.5  
600  
V
nA  
Gate – Emitter Leakage Current  
VGE = 20V, VCE = 0V  
Dynamic Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Cies  
Coes  
Cres  
Input Capacitance  
VGE = 0V  
VCE = 25V  
f = 1MHz  
21  
nF  
Output Capacitance  
1.2  
0.9  
260  
30  
420  
70  
Reverse Transfer Capacitance  
Inductive Switching (25°C)  
VGE = ±15V  
Td(on) Turn-on Delay Time  
Tr Rise Time  
Td(off) Turn-off Delay Time  
Tf Fall Time  
Td(on) Turn-on Delay Time  
Tr Rise Time  
Td(off) Turn-off Delay Time  
ns  
VBus = 600V  
IC = 300A  
RG = 1.8  
Inductive Switching (125°C)  
VGE = ±15V  
290  
50  
520  
ns  
VBus = 600V  
IC = 300A  
Tf  
Fall Time  
90  
RG = 1.8Ω  
VGE = ±15V  
Tj = 125°C  
VBus = 600V  
Eon  
Turn on Energy  
30  
30  
mJ  
IC = 300A  
Tj = 125°C  
RG = 1.8Ω  
Eoff  
Turn off Energy  
Reverse diode ratings and characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
VRRM  
Maximum Peak Repetitive Reverse Voltage  
1200  
V
Tj = 25°C  
VR=1200V  
500  
700  
IRM  
Maximum Reverse Leakage Current  
µA  
Tj = 125°C  
IF  
DC Forward Current  
Tc = 80°C  
300  
1.6  
1.6  
A
V
IF = 300A  
VGE = 0V  
Tj = 25°C  
2.1  
VF  
Diode Forward Voltage  
Tj = 125°C  
Tj = 25°C  
170  
trr  
Reverse Recovery Time  
ns  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
280  
27  
54  
15  
27  
IF = 300A  
VR = 600V  
di/dt =3000A/µs  
Qrr  
Er  
Reverse Recovery Charge  
Reverse Recovery Energy  
µC  
mJ  
2 - 5  
www.microsemi.com  
APTGT300DU120G  
Thermal and package characteristics  
Symbol Characteristic  
Min Typ Max Unit  
IGBT  
Diode  
0.09  
0.17  
RthJC  
Junction to Case Thermal Resistance  
°C/W  
V
VISOL  
TJ  
TSTG  
TC  
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz  
Operating junction temperature range  
Storage Temperature Range  
2500  
-40  
-40  
-40  
3
150  
125  
100  
5
3.5  
280  
°C  
Operating Case Temperature  
To heatsink  
For terminals  
M6  
M5  
Torque Mounting torque  
N.m  
g
2
Wt  
Package Weight  
SP6 Package outline (dimensions in mm)  
See application note APT0601 - Mounting Instructions for SP6 Power Modules on www.microsemi.com  
3 - 5  
www.microsemi.com  
APTGT300DU120G  
Typical Performance Curve  
Output Characteristics (VGE=15V)  
Output Characteristics  
600  
500  
400  
300  
200  
100  
0
600  
TJ = 125°C  
500  
400  
300  
200  
100  
0
TJ=25°C  
VGE=17V  
VGE=13V  
VGE=15V  
TJ=125°C  
VGE=9V  
0
1
2
3
4
0
1
2
CE (V)  
3
4
VCE (V)  
V
Energy losses vs Collector Current  
Transfert Characteristics  
75  
600  
500  
400  
300  
200  
100  
0
VCE = 600V  
VGE = 15V  
Eon  
Eoff  
Er  
TJ=25°C  
62.5  
50  
RG = 1.8  
TJ=125°C  
TJ = 125°C  
37.5  
25  
Eon  
TJ=125°C  
12.5  
0
0
100 200 300 400 500 600  
C (A)  
5
6
7
8
9
10  
11  
12  
I
V
GE (V)  
Switching Energy Losses vs Gate Resistance  
Reverse Bias Safe Operating Area  
70  
700  
600  
500  
400  
300  
200  
100  
0
VCE = 600V  
GE =15V  
IC = 300A  
Eon  
60  
50  
40  
30  
20  
10  
0
V
TJ = 125°C  
Eoff  
Er  
VGE=15V  
TJ=125°C  
RG=1.8 Ω  
0
2
4
6
8
10  
12  
0
300  
600  
900  
1200  
1500  
VCE (V)  
Gate Resistance (ohms)  
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
0.1  
0.9  
0.7  
IGBT  
0.08  
0.06  
0.04  
0.02  
0
0.5  
0.3  
0.1  
Single Pulse  
0.01  
0.05  
0.00001  
0.0001  
0.001  
0.1  
1
10  
rectangular Pulse Duration (Seconds)  
4 - 5  
www.microsemi.com  
APTGT300DU120G  
Operating Frequency vs Collector Current  
Forward Characteristic of diode  
60  
50  
40  
30  
20  
10  
0
600  
VCE=600V  
D=50%  
RG=1.8  
TJ=125°C  
Tc=75°C  
TJ=25°C  
500  
ZVS  
400  
ZCS  
TJ=125°C  
300  
200  
100  
0
TJ=125°C  
Hard  
switching  
0
0.4  
0.8  
1.2  
F (V)  
1.6  
2
2.4  
0
50 100 150 200 250 300 350 400  
V
IC (A)  
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
0.2  
0.9  
0.7  
0.16  
0.12  
0.08  
0.04  
0
Diode  
0.5  
0.3  
0.1  
0.05  
Single Pulse  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
rectangular Pulse Duration (Seconds)  
Microsemi reserves the right to change, without notice, the specifications and information contained herein  
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522  
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.  
5 - 5  
www.microsemi.com  

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