5772A [MICROSEMI]

Isolated Diode Array with HiRel MQ, MX, MV, and SP Screening Options; 与HiRel它MQ , MX , MV , SP和筛选选项隔离二极管阵列
5772A
型号: 5772A
厂家: Microsemi    Microsemi
描述:

Isolated Diode Array with HiRel MQ, MX, MV, and SP Screening Options
与HiRel它MQ , MX , MV , SP和筛选选项隔离二极管阵列

二极管
文件: 总2页 (文件大小:59K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
5772A  
Isolated Diode Array with  
HiRel MQ, MX, MV, and SP Screening Options  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
These low capacitance diode arrays are multiple, discrete, isolated junctions fabricated  
by a planar process and mounted in a 10-PIN package for use as steering diodes  
protecting up to eight I/O ports from ESD, EFT, or surge by directing them to the positive  
side of the power supply line and to ground (see figure 1). An external TVS diode may  
be added between the positive supply line and ground to prevent overvoltage on the  
supply rail. They may also be used in fast switching core-driver applications. This  
includes computers and peripheral equipment such as magnetic cores, thin-film  
memories, plated-wire memories, etc., as well as decoding or encoding applications.  
These arrays offer many advantages of integrated circuits such as high-density  
packaging and improved reliability. This is a result of fewer pick and place operations,  
smaller footprint, smaller weight, and elimination of various discrete packages that may  
not be as user friendly in PC board mounting.  
10-PIN Ceramic  
Flat Pack  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
High Frequency Data Lines  
RS-232 & RS-422 Interface Networks  
Ethernet: 10 Base T  
Computer I/O Ports  
LAN  
Hermetic Ceramic Package  
Isolated Diodes To Eliminate Cross-Talk Voltages  
High Breakdown Voltage VBR > 60 V at 10 μA  
Low Leakage IR< 100nA at 40 V  
Low Capacitance C < 8.0 pF  
Switching Core Drivers  
IEC 61000-4 Compatible (see circuit in figure 1)  
61000-4-2 ESD : Air 15kV, contact 8kW  
61000-4-4 (EFT) : 40A – 5/50 ns  
61000-4-5 (surge): 12A 8/20 μs  
Options for screening in accordance with MIL-PRF-  
19500/474 for JAN, JANTX, JANTXV, and JANS are  
available by adding MQ, MX, MV, or SP prefixes  
respectively to part numbers. For example, designate  
MX5772A for a JANTX screen.  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
Reverse Breakdown Voltage of 60 Vdc (Note 1 & 2)  
Continuous Forward Current of 300 mA dc (Note 1 & 3)  
Peak Surge Current (tp=1/120 s) of 500 mA dc (Note 1)  
400 mW Power Dissipation per Junction @ 25oC  
500 mW Power Dissipation per Package @ 25oC (Note 4)  
Operating Junction Temperature range –65 to +150oC  
Storage Temperature range of –65 to +150oC  
10-PIN Ceramic Flat Pack  
Weight 0.25 grams (approximate)  
Marking: Logo, part number, date code and dot  
identifying pin #1  
Carrier Tubes; 19 pcs (standard)  
NOTE 1: Each Diode  
NOTE 2: Pulsed: PW = 100 ms max; duty cycle <20%  
NOTE 3: Derate at 2.4 mA/oC above +25oC  
NOTE 4: Derate at 4.0 mW/oC above +25oC  
ELECTRICAL CHARACTERISTICS (Per Diode) @ 25oC unless otherwise specified  
MAXIMUM  
REVERSE  
RECOVERY TIME  
trr  
MAXIMUM  
FORWARD  
VOLTAGE  
MAXIMUM  
FORWARD  
VOLTAGE  
MAXIMUM  
CAPACITANCE  
(PIN TO PIN)  
MAXIMUM  
FORWARD  
RECOVERY TIME  
MAXIMUM  
REVERSE  
CURRENT  
I = IR = 200 mA  
F
V
V
F1  
F2  
Ct  
t
fr  
i = 20 mA  
rr  
I = 100 mA  
I = 500 mA  
I
VR = 0 V  
F = 1 MHz  
F
F
R1  
I = 500 mA  
F
R = 100 ohms  
L
(Note 1)  
(Note 1)  
VR = 40 V  
PART  
NUMBER  
Vdc  
Vdc  
μAdc  
pF  
ns  
ns  
5772A  
1
1.5  
0.1  
8.0  
40  
20  
NOTE 1: Pulsed: PW = 300 µs +/- 50 µs, duty cycle <2%, 90 µs after leading edge.  
Copyright © 2007  
3-27-2007  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  
5772A  
Isolated Diode Array with  
HiRel MQ, MX, MV, and SP Screening Options  
S C O T T S D A L E D I V I S I O N  
SYMBOLS & DEFINITIONS  
Symbol  
VBR  
DEFINITION  
Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current.  
Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current.  
VF  
Maximum Leakage Current: The maximum leakage current that will flow at the specified voltage and  
temperature.  
IR  
Capacitance: The capacitance of the TVS as defined @ 0 volts at a frequency of 1 MHz and stated in  
picofarads.  
Ct  
SCHEMATIC  
PACKAGE DIMENSIONS  
CIRCUIT  
Supply rail (+VCC)  
I/O Port  
GND (or -VCC)  
Steering Diode Application  
FIGURE 1  
Copyright © 2007  
3-27-2007  
Microsemi  
Page 2  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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