2N3251AUBE3 [MICROSEMI]
Small Signal Bipolar Transistor, 0.2A I(C), 60V V(BR)CEO, 1-Element, PNP, Silicon, CERAMIC PACKAGE-3;型号: | 2N3251AUBE3 |
厂家: | Microsemi |
描述: | Small Signal Bipolar Transistor, 0.2A I(C), 60V V(BR)CEO, 1-Element, PNP, Silicon, CERAMIC PACKAGE-3 CD 晶体管 |
文件: | 总4页 (文件大小:129K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http://www.microsemi.com
Gort Road Business Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298
PNP SILICON
LOW POWER TRANSISTOR
Qualified per MIL-PRF-19500/323
DEVICES
LEVELS
2N3250A
2N3251A
JAN
2N3250AUB
2N3251AUB
JANTX
JANTXV
ABSOLUTE MAXIMUM RATINGS (TC = +25°C unless otherwise noted)
Parameters / Test Conditions
Collector-Emitter Voltage
Symbol
VCEO
VCBO
VEBO
IC
Value
60
Unit
Vdc
Collector-Base Voltage
Emitter-Base Voltage
60
Vdc
5.0
Vdc
Collector Current
200
mAdc
Total Power Dissipation
@ TA = +25°C (1)
@ TC = +25°C (1)
0.36
1.2
PT
W
Operating & Storage Junction Temperature Range
TJ, Tstg
-65 to +200
°C
TO-39 (TO-205AD)
THERMAL CHARACTERISTICS
Parameters / Test Conditions
Symbol
Max.
Unit
(1)
Thermal Resistance, Junction-to-Case
150
°C/W
RθJC
Note:
1/ Consult 19500/323 for thermal curves
ELECTRICAL CHARACTERISTICS (TA = +25°C, unless otherwise noted)
Parameters / Test Conditions
OFF CHARACTERTICS
Collector-Emitter Breakdown Voltage
IC = 10mAdc
Symbol
V(BR)CEO
ICEX
Min.
Max.
Unit
60
Vdc
Collector-Emitter Cutoff Voltage
V
BE = 3.0Vdc, VCE = 40Vdc
20
20
ηAdc
μAdc
UB Package
VBE = 3.0Vdc, VCE = 40Vdc
TA = 150°C
Collector-Base Cutoff Current
10
20
μAdc
ηAdc
V
CB = 60Vdc
ICBO
VCB = 40Vdc
Emitter-Base Cutoff Current
IEBO
10
50
μAdc
ηAdc
V
EB = 5.0Vdc
Collector-Emitter Cutoff Voltage
IBEX
V
BE = 3.0Vdc, VCE = 40Vdc
T4-LDS-0093 Rev. 2 (101243)
Page 1 of 4
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http://www.microsemi.com
Gort Road Business Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298
ELECTRICAL CHARACTERISTICS (TA = +25°C, unless otherwise noted) (CONT.)
Parameters / Test Conditions
ON CHARACTERTICS (2)
Symbol
Min.
Max.
Unit
Forward-Current Transfer Ratio
IC = 0.1mAdc, VCE = 1.0Vdc
2N3250A, AUB
2N3251A, AUB
40
80
IC = 1.0mAdc, VCE = 1.0Vdc
IC = 10mAdc, VCE = 1.0Vdc
IC = 50mAdc, VCE = 1.0Vdc
2N3250A, AUB
2N3251A, AUB
45
90
2N3250A, AUB
2N3251A, AUB
50
100
150
300
hFE
2N3250A, AUB
2N3251A, AUB
15
30
IC = 1.0mAdc, VCE = 1.0Vdc
TA = -55°C
2N3250A, AUB
2N3251A, AUB
20
40
Collector-Emitter Saturation Voltage
IC = 10mAdc, IB = 1.0mAdc
IC = 50mAdc, IB = 5.0mAdc
0.25
0.50
VCE(sat)
Vdc
Vdc
Base-Emitter Saturation Voltage
IC = 10mA, IB = 1.0mAdc
IC = 50mA, IB = 5.0mAdc
0.60
0.90
1.20
VBE(sat)
DYNAMIC CHARACTERISTICS
Parameters / Test Conditions
Symbol
Min.
Max.
Unit
Small-Signal Short-Circuit Forward Current Transfer Ratio
IC = 1.0mAdc, VCE = 10Vdc, f = 1.0kHz 2N3250A, AUB
2N3251A, AUB
50
100
200
400
hfe
Magnitude of Common Emitter Small-Signal Short-Circuit Forward
Current Transfer Ratio
|hfe|
IC = 10mAdc, VCE = 20Vdc, f = 100kHz
2N3250A, AUB
2N3251A, AUB
2.5
3.0
9.0
9.0
Output Capacitance
Cobo
pF
pF
6.0
8.0
VCB = 10Vdc, IE = 0, 100 kHz ≤ f ≤ 1.0MHz
Input Capacitance
VEB = 1.0Vdc, IC = 0, 100 kHz ≤ f ≤ 1.0MHz
Cibo
SWITCHING CHARACTERISTICS
Parameters / Test Conditions
Turn-On Time
VCC = 3.0Vdc; IC = 10mAdc; IB1 = 1.0mAdc
Symbol
Min.
Max.
Unit
ηs
ton
70
Turn-Off Time
VCC = 3.0Vdc; IC = 10mAdc; IB1 = IB2
1.0mAdc
=
2N3250A, AUB
2N3251A, AUB
250
300
toff
ηs
(2) Pulse Test: Pulse Width = 300μs, Duty Cycle ≤ 2.0%
T4-LDS-0093 Rev. 2 (101243)
Page 2 of 4
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http://www.microsemi.com
Gort Road Business Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298
PACKAGE DIMENSIONS
Dimensions
Inches Millimeters
Symbol
Notes
Min Max Min
.178 .195 4.52
.170 .210 4.32
.209 .230 5.31
Max
4.95
5.33
5.74
CD
CH
HD
LC
LD
LL
LU
L1
L2
P
.100TP
2.54 TP
6
.016 .021 0.41
0.53
7, 8
7, 8
7, 8
7, 8
7, 8
.500 .750 12.70 19.05
.016 .019 0.41
.050
0.48
1.27
.250
.100
6.35
2.54
Q
.040
1.02
1.22
1.17
0.25
5
3, 4
3
TL
TW
r
.028 .048 0.71
.036 .046 0.91
.010
10
6
α
45° TP
45° TP
NOTES:
1. Dimension are in inches.
2. Millimeters are given for general information only.
3. Beyond r (radius) maximum, TH shall be held for a minimum length of .011 inch (0.28 mm).
4. Dimension TL measured from maximum HD.
5. Body contour optional within zone defined by HD, CD, and Q.
6. Leads at gauge plane .054 +.001 -.000 inch (1.37 +0.03 -0.00 mm) below seating plane shall be within .007 inch (0.18 mm)
radius of true position (TP) at maximum material condition (MMC) relative to tab at MMC. The device may be measured by
direct methods or by the gauge and gauging procedure shown in figure 2.
7. Dimension LU applies between L1 and L2. Dimension LD applies between L2 and LL minimum. Diameter is uncontrolled
in L1 and beyond LL minimum.
8. All three leads.
9. The collector shall be internally connected to the case.
10. Dimension r (radius) applies to both inside corners of tab.
11. In accordance with ASME Y14.5M, diameters are equivalent to φx symbology.
12. Lead 1 = emitter, lead 2 = base, lead 3 = collector.
FIGURE 1. Physical dimensions (similar to TO-18).
T4-LDS-0093 Rev. 2 (101243)
Page 3 of 4
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http://www.microsemi.com
Gort Road Business Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298
Dimensions
Dimensions
Ltr.
Inches
Millimeters
Note
Ltr.
Inches
Min
.035
0.71
.016
Millimeters
Note
Min Max Min Max
.046 .056 1.17 1.42
.115 .128 2.92 3.25
.085 .108 2.16 2.74
Max
.039
.079
.024
.008
.012
.022
Min
Max
0.99
2.01
0.61
0.20
0.31
0.56
BH
BL
BW
CL
CW
LL1
LL2
LS1
LS2
LW
r
r1
r2
0.89
1.80
0.41
.128
.108
3.25
2.74
.022 .038 0.56 0.96
.017 .035 0.43 0.89
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Hatched areas on package denote metallized areas
4. Pad 1 = Base, Pad 2 = Emitter, Pad 3 = Collector, Pad 4 = Shielding connected to the lid.
5. In accordance with ASME Y14.5M, diameters are equivalent to φx symbology.
FIGURE 2. Physical dimensions, surface mount (UB version).
T4-LDS-0093 Rev. 2 (101243)
Page 4 of 4
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