ZL30262LDG1 [MICROCHIP]
1-APLL, 6- or 10-Output Any-to-Any Clock Multiplier and Frequency Synthesizer;型号: | ZL30262LDG1 |
厂家: | MICROCHIP |
描述: | 1-APLL, 6- or 10-Output Any-to-Any Clock Multiplier and Frequency Synthesizer |
文件: | 总94页 (文件大小:2371K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ZL30260-ZL30263
1-APLL, 6- or 10-Output Any-to-Any Clock
Multiplier and Frequency Synthesizer
Data Sheet
June 2021
Register Map: Section 6.2
Features
Ordering Information
• Four Flexible Input Clocks
• One crystal/CMOS input
• Two differential/CMOS inputs
• One single-ended/CMOS input
ZL30260LDG1
ZL30260LDF1
ZL30261LDG1
ZL30261LDF1
ZL30262LDG1
ZL30262LDF1
ZL30263LDG1
ZL30263LDF1
ext. EEPROM
ext. EEPROM
int. EEPROM
int. EEPROM
ext. EEPROM
ext. EEPROM
int. EEPROM
int. EEPROM
6 Outputs
6 Outputs
6 Outputs
6 Outputs
10 Outputs
10 Outputs
10 Outputs
10 Outputs
Trays
Tape and Reel
Trays
Tape and Reel
Trays
Tape and Reel
Trays
Tape and Reel
• Any input frequency from 9.72MHz to 1.25GHz
Matte Tin. Package size: 8 x 8 mm, 56 Pin QFN
(300MHz max for CMOS)
-40 C to +85 C
Create and sample your own custom ZL30260-3 here:
https://clockworks.microchip.com/microchip/design/inputZL
• Activity monitors, automatic or manual switching
• Glitchless clock switching by pin or register
• Per-output enable/disable and glitchless
• 6 or 10 Any-Frequency, Any-Format Outputs
• Any output frequency from 1Hz to 1045MHz
• High-resolution frac-N APLL with 0ppm error
start/stop (stop high or low)
• General Features
• Automatic self-configuration at power-up from
external (ZL30260or 2) or internal (ZL30261or 3)
EEPROM; up to 8 configurations pin-selectable
• The APLL has a fractional divider and an
integer divider to make two independent
frequency families
• External feedback for zero-delay applications
• Numerically controlled oscillator mode
• Spread-spectrum modulation mode
• Output jitter from integer multiply and dividers
as low as 0.17ps RMS (12kHz-20MHz)
• Output jitter from fractional dividers is typically
• Generates PCIe 1, 2, 3, 4, 5 compliant clocks
< 1ps RMS, many frequencies <0.5ps RMS
• Easy-to-configure design requires no external
• Each output has an independent divider
VCXO or loop filter components
• Each output configurable as LVDS, LVPECL,
• SPI or I2C processor Interface
HCSL, 2xCMOS or HSTL
• Core supply voltage options: 2.5V only, 3.3V
• In 2xCMOS mode, the P and N pins can be
only, 1.8V+2.5V or 1.8V+3.3V
different frequencies (e.g. 125MHz and 25MHz)
• Space-saving 8x8mm QFN56 (0.5mm pitch)
• Multiple output supply voltage banks with
CMOS output voltages from 1.5V to 3.3V
Applications
• Precise output alignment circuitry and per-
•
Frequency conversion and frequency synthesis in
a wide variety of equipment types
output phase adjustment
VDDOA
OC1P, OC1N
Int DIV
DIV1
DIV
DIV
DIV
DIV
x2
IC1P, IC1N
IC2P, IC2N
IC3P
APLL
Fractional-N
x2
OC2P, OC2N
VDDOB
OC3P, OC3N
VDDOC
DIV2
XA
XB
xtal
driver
Frac DIV
DIV3
Figure 5
bypass
OC4P, OC4N
DIV4
Path 2
OC5P, OC5N
VDDOD
DIV5
10-output
OC6P, OC6N
devices only
DIV6
DIV7
DIV8
DIV9
DIV10
RSTN
AC0/GPIO0
AC1/GPIO1
AC2/GPIO2
TEST/GPIO3
IF0/CSN
IF1/MISO
SCL/SCLK
SDA/MOSI
OC7P, OC7N
VDDOE
OC8P, OC8N
VDDOF
Microprocessor
Port
(SPI or I2C Serial)
OC9P, OC9N
and GPIO Pins
OC10P, OC10N
Figure 1 - Functional Block Diagram
1
DS20006554A
Copyright 2021. Microchip Technology Inc. All Rights Reserved.
ZL30260-ZL30263
Data Sheet
Table of Contents
1.
2.
APPLICATION EXAMPLE...............................................................................................................5
DETAILED FEATURES ...................................................................................................................5
2.1 INPUT CLOCK FEATURES .................................................................................................................5
2.2 APLL FEATURES.............................................................................................................................5
2.3 OUTPUT CLOCK FEATURES..............................................................................................................5
2.4 GENERAL FEATURES .......................................................................................................................5
2.5 EVALUATION SOFTWARE..................................................................................................................6
3.
4.
5.
PIN DIAGRAM..................................................................................................................................6
PIN DESCRIPTIONS........................................................................................................................7
FUNCTIONAL DESCRIPTION.........................................................................................................9
5.1 DEVICE IDENTIFICATION...................................................................................................................9
5.2 PIN-CONTROLLED AUTOMATIC CONFIGURATION AT RESET ...............................................................9
5.2.1
5.2.2
ZL30260 and ZL30262—Internal ROM, External or No EEPROM...................................................... 10
ZL30261 and ZL30263—Internal EEPROM ........................................................................................ 10
5.3 LOCAL OSCILLATOR OR CRYSTAL ..................................................................................................11
5.3.1
5.3.2
5.3.3
5.3.4
External Oscillator................................................................................................................................ 11
External Crystal and On-Chip Driver Circuit ........................................................................................ 11
Clock Doublers..................................................................................................................................... 12
Ring Oscillator (for Auto-Configuration)............................................................................................... 12
5.4 INPUT SIGNAL FORMAT CONFIGURATION........................................................................................13
5.5 APLL CONFIGURATION..................................................................................................................13
5.5.1
5.5.2
5.5.3
5.5.4
5.5.5
5.5.6
APLL Input Frequency ......................................................................................................................... 13
APLL Input Monitors............................................................................................................................. 13
APLL Input Selection............................................................................................................................ 13
APLL Output Frequency....................................................................................................................... 14
Fractional Output Divider ..................................................................................................................... 15
Numerically Controlled Oscillator (NCO) Mode ................................................................................... 16
5.5.6.1 Using the APLL’s Feedback Divider ................................................................................................ 16
5.5.6.2 Using the Fractional Output Divider................................................................................................. 16
5.5.7
5.5.8
Frequency Increment and Decrement ................................................................................................. 17
Spread-Spectrum Modulation Mode .................................................................................................... 17
5.5.8.1 Using the APLL’s Feedback Divider ................................................................................................ 17
5.5.8.2 Using the Fractional Output Divider................................................................................................. 18
5.5.9
APLL Phase Adjustment...................................................................................................................... 19
5.6 OUTPUT CLOCK CONFIGURATION...................................................................................................19
5.6.1
5.6.2
5.6.3
5.6.4
5.6.5
5.6.6
5.6.7
Output Enable, Signal Format, Voltage and Interfacing ...................................................................... 19
Output Frequency Configuration.......................................................................................................... 20
Output Duty Cycle Adjustment............................................................................................................. 20
Output Phase Adjustment.................................................................................................................... 21
Output-to-Output Phase Alignment...................................................................................................... 21
Output-to-Input Phase Alignment......................................................................................................... 21
Output Clock Start and Stop ................................................................................................................ 21
5.7 MICROPROCESSOR INTERFACE......................................................................................................22
5.7.1
5.7.2
5.7.3
SPI Slave ............................................................................................................................................. 22
SPI Master (ZL30260 and ZL30262 Only)........................................................................................... 24
I2C Slave .............................................................................................................................................. 24
5.8 INTERRUPT LOGIC .........................................................................................................................27
5.9 RESET LOGIC................................................................................................................................28
5.9.1
5.10
5.11
Design Considerations for Using an External RC Reset Circuit .......................................................... 28
POWER-SUPPLY CONSIDERATIONS.............................................................................................28
AUTO-CONFIGURATION FROM EEPROM OR ROM......................................................................28
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© 2021 Microchip Technology Inc.
DS20006554A
ZL30260-ZL30263
Data Sheet
5.11.1 Generating Device Configurations....................................................................................................... 29
5.11.2 Direct EEPROM Write Mode (ZL30261 and ZL30263 Only) ............................................................... 29
5.11.3 Holding Other Devices in Reset During Auto-Configuration................................................................ 29
5.12
CONFIGURATION SEQUENCE ......................................................................................................29
POWER SUPPLY DECOUPLING AND LAYOUT RECOMMENDATIONS ................................................29
CHOOSING AMONG CORE POWER SUPPLY OPTIONS...................................................................29
PATH 2 SIGNAL SELECTION ........................................................................................................30
5.13
5.14
5.15
6.
REGISTER DESCRIPTIONS .........................................................................................................30
6.1 REGISTER TYPES ..........................................................................................................................30
6.1.1
6.1.2
6.1.3
6.1.4
Status Bits............................................................................................................................................ 30
Configuration Fields ............................................................................................................................. 30
Multiregister Fields............................................................................................................................... 31
Bank-Switched Registers (ZL30261 and ZL30263 Only) .................................................................... 31
6.2 REGISTER MAP .............................................................................................................................31
6.3 REGISTER DEFINITIONS .................................................................................................................34
6.3.1
6.3.2
6.3.3
6.3.4
6.3.5
6.3.6
Global Configuration Registers............................................................................................................ 34
Status Registers................................................................................................................................... 42
APLL Configuration Registers.............................................................................................................. 51
Path 2 Configuration Registers............................................................................................................ 65
Output Clock Configuration Registers.................................................................................................. 67
Input Clock Configuration Registers .................................................................................................... 74
7.
8.
9.
ELECTRICAL CHARACTERISTICS..............................................................................................76
PACKAGE AND THERMAL INFORMATION ................................................................................88
MECHANICAL DRAWING .............................................................................................................89
10. ACRONYMS AND ABBREVIATIONS ...........................................................................................90
11. DATA SHEET REVISION HISTORY..............................................................................................91
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© 2021 Microchip Technology Inc.
DS20006554A
ZL30260-ZL30263
Data Sheet
List of Figures
Figure 1 - Functional Block Diagram ........................................................................................................................... 1
Figure 2 - Application Example: PCIe and Ethernet Clocks for Server Application .................................................... 5
Figure 3 - Pin Diagram................................................................................................................................................. 6
Figure 4 - Crystal Equivalent Circuit / Recommended Crystal Circuit....................................................................... 11
Figure 5 - APLL Block Diagram ................................................................................................................................. 14
Figure 6 - SPI Read Transaction Functional Timing.................................................................................................. 23
Figure 7 - SPI Write Enable Transaction Functional Timing (ZL30261 and ZL30263 Only)..................................... 23
Figure 8 - SPI Write Transaction Functional Timing.................................................................................................. 24
Figure 9 - I2C Read Transaction Functional Timing .................................................................................................. 25
Figure 10 - I2C Register Write Transaction Functional Timing .................................................................................. 26
Figure 11 - I2C EEPROM Write Transaction Functional Timing (ZL30261 and ZL30263 Only) ............................... 26
Figure 12 - I2C EEPROM Read Status Transaction Functional Timing (ZL30261 and ZL30263 Only).................... 26
Figure 13 - Interrupt Structure ................................................................................................................................... 27
Figure 14 - Electrical Characteristics: Clock Inputs................................................................................................... 78
Figure 15 - Example External Components for Differential Input Signals ................................................................. 79
Figure 16 - Electrical Characteristics: Differential Clock Outputs.............................................................................. 79
Figure 17 - Example External Components for Output Signals................................................................................. 81
Figure 18 - SPI Slave Interface Timing...................................................................................................................... 84
Figure 19 - SPI Master Interface Timing.................................................................................................................... 86
Figure 20 - I2C Slave Interface Timing....................................................................................................................... 87
List of Tables
Table 1 - Pin Descriptions............................................................................................................................................ 7
Table 2 - Crystal Selection Parameters..................................................................................................................... 12
Table 3 - SPI Commands .......................................................................................................................................... 22
Table 4 - Register Map .............................................................................................................................................. 31
Table 5 - Recommended DC Operating Conditions.................................................................................................. 76
Table 6 - Electrical Characteristics: Supply Currents ................................................................................................ 76
Table 7 - Electrical Characteristics: Non-Clock CMOS Pins ..................................................................................... 77
Table 8 - Electrical Characteristics: XA Clock Input .................................................................................................. 78
Table 9 - Electrical Characteristics: Clock Inputs, ICxP/N......................................................................................... 78
Table 10 - Electrical Characteristics: LVDS Clock Outputs....................................................................................... 79
Table 11 - Electrical Characteristics: LVPECL Clock Outputs .................................................................................. 80
Table 12 - Electrical Characteristics: HCSL Clock Outputs....................................................................................... 80
Table 13 - Electrical Characteristics: CMOS and HSTL (Class I) Clock Outputs...................................................... 80
Table 14 - Electrical Characteristics: APLL Frequencies .......................................................................................... 81
Table 15 - Electrical Characteristics: Jitter and Skew Specifications........................................................................ 81
Table 16 - Electrical Characteristics: Typical Output Phase Jitter from the APLL Integer Divider............................ 82
Table 17 - Electrical Characteristics: Clock Buffer (APLL Bypass Path and Path 2) ................................................ 83
Table 18 - Electrical Characteristics: Typical Input-to-Output Clock Delay Through APLL....................................... 83
Table 19 - Electrical Characteristics: SPI Slave Interface Timing, Device Registers................................................ 84
Table 20 - Electrical Characteristics: SPI Slave Interface Timing, Internal EEPROM .............................................. 85
Table 21 - Electrical Characteristics: SPI Master Interface Timing (ZL30260 and ZL30262 Only)........................... 86
Table 22 - Electrical Characteristics: I2C Slave Interface Timing .............................................................................. 87
Table 23 - 8x8mm QFN Package Thermal Properties .............................................................................................. 88
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© 2021 Microchip Technology Inc.
DS20006554A
ZL30260-ZL30263
Data Sheet
1. Application Example
4x 156.25MHz differential
2x 100MHz differential
100MHz CMOS
ZL30263
XO
2x 25MHz differential
25MHz CMOS
Figure 2 - Application Example: PCIe and Ethernet Clocks for Server Application
2. Detailed Features
2.1 Input Clock Features
•
•
•
•
Four input clocks: one crystal/CMOS, two differential/CMOS, one single-ended/CMOS
Input clocks can be any frequency from 9.72MHz to 1250MHz (differential) or 300MHz (single-ended)
Supported telecom frequencies include PDH, SDH, Synchronous Ethernet, OTN, wireless
Activity monitor and glitchless input switching
2.2 APLL Features
•
•
•
•
•
Very high-resolution fractional (i.e. non-integer) frequency multiplication
Any-to-any frequency conversion with 0ppm error
Two APLL output dividers: one integer divider (4 to 15 plus half divides 4.5 to 7.5) and one fractional
Easy-to-configure, completely encapsulated design requires no external VCXO or loop filter
Bypass mode supports system testing
2.3 Output Clock Features
•
•
•
•
•
Six (ZL30260 or ZL30261) or ten (ZL30262 or ZL30263) low-jitter output clocks
Each output can be one differential output or two CMOS outputs
Output clocks can be any frequency from 1Hz to 1045MHz (250MHz max for HCSL, CMOS and HSTL)
Output jitter from integer multiply and integer dividers as low as 0.17ps RMS (12kHz to 20MHz)
Output jitter from fractional dividers is typically <1ps RMS, many frequencies <0.5ps RMS (12kHz to
20MHz)
•
In CMOS mode, the OCxP and OCxN pins can be different divisors (Example 1: OC3P 125MHz, OC3N
25MHz; Example 2: OC3P 25MHz, OC3N 1Hz/1PPS)
•
•
•
•
•
•
•
•
Outputs directly interface (DC coupled) with LVDS, LVPECL, HSTL, HCSL and CMOS components
Supported telecom frequencies include PDH, SDH, Synchronous Ethernet, OTN
Can produce clock frequencies for microprocessors, ASICs, FPGAs and other components
Can produce PCIe-compliant clocks (PCIe 1, 2, 3, 4 and 5)
Sophisticated output-to-output phase alignment
Per-output phase adjustment
Per-output enable/disable
Per-output glitchless start/stop (stop high or low)
2.4 General Features
•
•
SPI or I2C serial microprocessor interface
Automatic self-configuration at power-up; pin control to specify one of 8 stored configurations
ZL30260 and ZL30262: preset configurations in ROM or user configurations in external EEPROM
ZL30261 and ZL30263: user configurations in internal EEPROM
•
Numerically controlled oscillator (NCO) mode allows system software to steer DPLL frequency with
resolution better than 0.01ppb (1ppt can be achieved with fractional output divider value >14.56)
Spread-spectrum modulation mode (meets PCI Express requirements)
Zero-delay buffer configuration using an external feedback path
Four general-purpose I/O pins each with many possible status and control options
Reference can be fundamental-mode crystal, low-cost XO or clock signal from elsewhere in the system
•
•
•
•
5
© 2021 Microchip Technology Inc.
DS20006554A
ZL30260-ZL30263
Data Sheet
2.5 Evaluation Software
•
•
•
•
•
•
Simple, intuitive Windows-based graphical user interface
Supports all device features and register fields
Makes lab evaluation of the ZL30260/5/6/7 quick and easy
Generates configuration scripts to be stored in external (ZL30260,2) or internal (ZL30261,3) EEPROM
Generates full or partial configuration scripts to be run on a system processor
Works with or without an evaluation board
3. Pin Diagram
The device is packaged in a 8x8mm 56-pin QFN.
56
55
54
53
52
51
50
49
48
47
46
45
44
43
1
2
42
41
40
39
38
37
36
35
34
33
32
31
30
29
VDDOB
OC3P
OC3N
VDDL
OC2N
OC2P
VDDOA
OC1P
OC1N
VDDL
VDDH
XA
VDDH
OC8P
OC8N
VDDL
OC9N
OC9P
VDDOF
OC10P
OC10N
VDDL
VDDH
VDDL
VDDIO
RSTN
3
4
5
6
7
8
9
10
11
12
13
14
GND (E-pad)
XB
VDDL
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Figure 3 - Pin Diagram
6
© 2021 Microchip Technology Inc.
DS20006554A
ZL30260-ZL30263
Data Sheet
4. Pin Descriptions
All device inputs and outputs are LVCMOS unless described otherwise. The Type column uses the following symbols:
I – input, O – output, A – analog, P – power supply pin. All GPIO and SPI/I2C interface pins have Schmitt-trigger
inputs and have output drivers that can be disabled (high impedance).
Table 1 - Pin Descriptions
Pin #
Name
Type
Description
Input Clock Pins
Differential or Single-ended signal format. Programmable frequency.
Differential: See Table 9 for electrical specifications, and see Figure 15 for
recommended external circuitry for interfacing these differential inputs to
LVDS, LVPECL, CML or HSCL output pins on neighboring devices.
Single-ended: For input signal amplitude >2.5V, connect the signal directly to
ICxP pin. For input signal amplitude ≤2.5V, AC-coupling the signal to ICxP
is recommended. Connect the N pin to a capacitor (0.1F or 0.01F) to
VSS. As shown in Figure 15, the ICxP and ICxN pins are internally biased
to approximately 1.3V. Treat the ICxN pin as a sensitive node; minimize
stubs; do not connect to anything else including other ICxN pins.
15, 16
18, 19
20
IC1P, IC1N
IC2P, IC2N
IC3P
I
I
I
Unused: Set ICEN.ICxEN=0. The ICxP and ICxN pins can be left floating.
Note that the IC3N pin is not bonded out. A differential signal can be
connected to IC3P by AC-coupling the POS trace to IC3P and terminating
the signal on the driver side of the coupling cap.
Crystal or Input Clock Pins
Crystal: MCR2.XAB=01. An on-chip crystal driver circuit is designed to work
with an external crystal connected to the XA and XB pins. See section
5.3.2 for crystal characteristics and recommended external components.
12
13
XA
XB
A / I
Input Clock: MCR2.XAB=10. An external local oscillator or clock signal can be
connected to the XA pin. The XB pin must be left unconnected. The signal
on XA can be as large as 3.3V even when VDDH is only 2.5V.
Output Clock Pins
LVDS, programmable differential (which includes LVPECL), HCSL, HSTL or
1 or 2 CMOS. Programmable frequency. Programmable VCM and VOD in
programmable differential mode. Programmable drive strength in CMOS
and HSTL modes. See Figure 17 for example external interface circuitry.
See Table 10, Table 11 and Table 12 for electrical specifications for LVDS,
LVPECL and HCSL, respectively.
8, 9
6, 5
2, 3
55, 56
53, 52
47, 48
45, 44
41, 40
37, 38
35, 34
OC1P, OC1N
OC2P, OC2N
OC3P, OC3N
OC4P, OC4N
OC5P, OC5N
OC6P, OC6N
OC7P, OC7N
OC8P, OC8N
O
See Table 13 for electrical specifications for interfacing to CMOS and HSTL
inputs on neighboring devices.
OC9P, OC9N
OC10P, OC10N
Outputs OC2, OC5, OC7 and OC10 are not present on 6-output products.
Reset (Active Low)
When this global asynchronous reset is pulled low, all internal circuitry is reset
to default values. The device is held in reset as long as RSTN is low.
Minimum low time is 1µs.
29
RSTN
I
Auto-Configure [2:0] / General Purpose I/O 0, 1 and 2
23
22
28
AC0/GPIO0
AC1/GPIO1
AC2/GPIO2
Auto Configure: On the rising edge of RSTN these pins behave as AC[2:0]
and specify one of the configurations stored in ROM or EEPROM. See
section 5.2.
I/O
7
© 2021 Microchip Technology Inc.
DS20006554A
ZL30260-ZL30263
Data Sheet
Pin #
Name
Type
Description
General-Purpose I/O: After reset these pins are GPIO0, GPIO1 and GPIO2.
GPIOCR1 and GPIOCR2.GPIO2C configure these pins. Their states are
indicated in GPIOSR which has both real-time and latched status bits.
Note that when the power supply arrangement for the device has
VDDL=1.8V, during the interval between VDDH ramping and VDDL ramping
these pins can briefly behave as an output driving high.
Factory Test / General Purpose I/O 3
Factory Test: On the rising edge of RSTN the pin behaves as TEST. Factory
test mode is enabled when TEST is high. Typically TEST should be low on
the rising edge of RSTN, but see section 5.2 for some options where TEST
can be high on the rising edge of RSTN.
21
TEST/GPIO3
I/O
General-Purpose I/O: After reset this pin is GPIO3. GPIOCR2.GPIO3C
configures the pin. It state is indicated in GPIOSR which has both real-time
and latched status bits.
Note that when the power supply arrangement for the device has
VDDL=1.8V, during the interval between VDDH ramping and VDDL ramping
this pin can briefly behave as an output driving high.
Interface Mode 0 / SPI Chip Select (Active Low)
Interface Mode: On the rising edge of RSTN the pin behaves as IF0 and,
together with IF1, specifies the interface mode for the device. See section 5.2.
27
IF0/CSN
I/O
SPI Chip Select: After reset this pin is CSN. When the device is configured as
a SPI slave, an external SPI master must assert (low) CSN to access device
registers. When the device is configured as a SPI master (ZL30260, ZL30262
only), the device asserts CSN to access an external SPI EEPROM during
auto-configuration and then changes CSN to an input during normal
operation. CSN should not be allowed to float.
Interface Mode 1 / SPI Master-In-Slave-Out
Interface Mode: On the rising edge of RSTN the pin behaves as IF1 and,
together with IF0, specifies the interface mode for the device. See section 5.2.
26
IF1/MISO
I/O
SPI MISO: After reset this pin is MISO. When the device is configured as a
SPI slave, the device outputs data to an external SPI master on MISO during
SPI read transactions. When the device is configured as a SPI master
(ZL30260, ZL30262 only), the device receives data on MISO from an external
SPI EEPROM during auto-configuration.
I2C Clock / SPI Clock
I2C Clock: When the device is configured as an I2C slave, an external I2C
master must provide the I2C clock signal on the SCL pin. In I2C mode this pin
should be externally pulled high by a 1k to 5k resistor.
24
25
SCL/SCLK
SDA/MOSI
I/O
I/O
SPI Clock: When the device is configured as a SPI slave, an external SPI
master must provide the SPI clock signal on SCLK. When the device is
configured as a SPI master (ZL30260, ZL30262 only), the device drives
SCLK as an output to clock accesses to an external SPI EEPROM during
auto-configuration.
I2C Data / SPI Master-Out-Slave-In
I2C Data: When the device is configured as an I2C slave, SDA is the
bidirectional data line between the device and an external I2C master. In I2C
mode this pin should be externally pulled high by a 1k to 5k resistor.
8
© 2021 Microchip Technology Inc.
DS20006554A
ZL30260-ZL30263
Data Sheet
Pin #
Name
Type
Description
SPI MOSI: When the device is configured as a SPI slave, an external SPI
master sends commands, addresses and data to the device on MOSI. When
the device is configured as a SPI master (ZL30260, ZL30262 only), the
device sends commands, addresses and data on MOSI to an external SPI
EEPROM during auto-configuration.
11,17,
32,42
4,10,
14,31,
33,39,
49,50,
51
Higher Core Power Supply. 2.5V or 3.3V 5%. When VDDH=3.3V the
device has additional internal power supply regulators enabled.
VDDH
VDDL
P
P
Lower Core Power Supply. 1.8V 5% or same voltage as VDDH.
30
7
1
54
46
43
36
E-pad
VDDIO
VDDOA
VDDOB
VDDOC
VDDOD
VDDOE
VDDOF
VSS
P
P
P
P
P
P
P
P
Digital Power Supply for Non-Clock I/O Pins. 1.8V to VDDH.
Power Supply for OC1P/N and OC2P/N. 1.5V to VDDH.
Power Supply for OC3P/N. 1.5V to VDDH.
Power Supply for OC4P/N and OC5P/N. 1.5V to VDDH.
Power Supply for OC6P/N and OC7P/N. 1.5V to VDDH.
Power Supply for OC8P/N. 1.5V to VDDH.
Power Supply for OC9P/N and OC10P/N. 1.5V to VDDH.
Ground. 0 Volts.
Important Note: The voltages on VDDL, VDDIO, and all VDDOx pins must not exceed VDDH. Not complying with
this requirement may damage the device.
5. Functional Description
5.1 Device Identification
The 12-bit read-only ID field and the 4-bit revision field are found in the ID1 and ID2 registers. Contact the factory to
interpret the revision value and determine the latest revision.
5.2 Pin-Controlled Automatic Configuration at Reset
The device configuration is determined at reset (i.e. on the rising edge of RSTN) by the signal levels on these device
pins: TEST/GPIO3, AC2/GPIO2, AC1/GPIO1, AC0/GPIO0, IF1/MISO and IF0/CSN. For these pins, the first name
(TEST, AC2, AC1, AC0, IF1, IF0) indicates their function when they are sampled by the rising edge of the RSTN pin.
The second name refers to their function after reset. The values of these pins are latched into the CFGSR register
when RSTN goes high. To ensure the device properly samples the reset values of these pins, the following guidelines
should be followed:
1. Any pullup or pulldown resistors used to set the value of these pins at reset should be 1k.
2. RSTN must be asserted at least as long as specified in section 5.9.
The hardware configuration pins are grouped into three sets:
1. TEST - Manufacturing test mode
2. IF[1:0] – Microprocessor interface mode and I2C address
3. AC[2:0] – Auto-config configuration number (0 to 7)
The TEST pin selects manufacturing test modes when TEST=1 (the AC[2:0] pins specify the test mode). For ZL30261
and ZL30263 (devices with internal EEPROM), TEST=1, AC[2:0]=000, IF[1:0]=11 configures the part so that
production SPI EEPROM programmers can program the internal EEPROM (see section 5.11.2). TEST=1 and
AC[2:0]=011 causes the part to start normally except it does not auto-configure from EEPROM or ROM. For more
information about auto-configuration from EEPROM or ROM see section 5.11.
For all of these pins Microchip recommends that board designs include component sites for both pullup and pulldown
resistors (only one or the other populated per pin).
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Data Sheet
5.2.1 ZL30260 and ZL30262—Internal ROM, External or No EEPROM
For these part numbers the IF[1:0] pins specify the processor interface mode, the I2C slave address and whether the
device should auto-configure from internal ROM or external EEPROM. The AC[2:0] pins specify which device
configuration in the ROM or EEPROM to execute after reset. Descriptions of the standard-product ROM
configurations are available from Microchip.
IF1
0
0
IF0
0
1
Processor Interface
I2C, slave address 11101 00
I2C, slave address 11101 01
SPI Slave
Configuration Memory to Use
Internal ROM
Internal ROM
Internal ROM
1
0
SPI Master during auto-configuration
then SPI Slave
1
1
External SPI EEPROM
To configure the device as specified in the first three rows above but without auto-configuring from internal ROM, wire devices pins as
follows: TEST=1 and AC[2:0]=011, as described in section 5.2.
AC2
0
0
0
0
1
1
1
1
AC1
0
0
1
1
0
0
1
1
AC0
0
1
0
1
0
1
0
1
Auto Configuration
Configuration 0
Configuration 1
Configuration 2
Configuration 3
Configuration 4
Configuration 5
Configuration 6
Configuration 7
Notes about the device auto-configuring from external EEPROM:
1. The device’s CSN pin should have a pull-up resistor to VDD to ensure its processor interface is inactive after
auto-configuration is complete. The SCLK, MISO and MOSI pins should also have pull-up resistors to VDD
to keep them from floating.
2. If a processor or similar device will access device registers after the device has auto-configured from external
EEPROM, the SPI SCLK, MOSI and MISO wires can be connected directly to the processor, the device and
the external EEPROM. The processor and device CSN pins can be wired together also. The EEPROM CSN
signal must be controlled by the device’s CSN pin during device auto-configuration and then held inactive
when the processor accesses device registers.
3. The bits of the I2C address are as shown above by default but can be changed in the I2CA register.
5.2.2 ZL30261 and ZL30263—Internal EEPROM
For these part numbers the IF[1:0] pins specify the processor interface mode and the I2C slave address. The AC[2:0]
pins specify which device configuration in the EEPROM to execute after reset.
IF1
0
0
1
1
IF0
0
1
0
1
Processor Interface
I2C, slave address 11101 00
I2C, slave address 11101 01
I2C, slave address 11101 10
SPI Slave
AC2
0
0
0
0
1
1
1
1
AC1
0
0
1
1
0
0
1
1
AC0
Auto Configuration
Configuration 0
Configuration 1
Configuration 2
Configuration 3
Configuration 4
Configuration 5
Configuration 6
Configuration 7
0
1
0
1
0
1
0
1
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Data Sheet
Note: the bits of the I2C address are as shown above by default but can be changed in the I2CA register. A
device’s I2C slave address can be set to any value during auto-configuration at power-up by writing the I2CA
register as part of the configuration script.
5.3 Local Oscillator or Crystal
Section 5.3.1 describes how to connect an external oscillator and the required characteristics of the oscillator. Section
5.3.2 describes how to connect an external crystal to the on-chip crystal driver circuit and the required characteristics
of the crystal. The device does not require an external oscillator or crystal for operation.
5.3.1 External Oscillator
A signal from an external oscillator can be connected to the XA pin (XB must be left unconnected).
Table 8 specifies the range of possible frequencies for the XA input. To minimize jitter, the signal must be properly
terminated and must have very short trace length. A poorly terminated single-ended signal can greatly increase
output jitter, and long single-ended trace lengths are more susceptible to noise. When MCR2.XAB=10, XA is enabled
as a single-ended input.
While the stability of the external oscillator can be important, its absolute frequency accuracy is less important
because any known frequency inaccuracy of the oscillator can be compensated by adjusting the APLL's fractional
feedback divider value (AFBDIV) by ppb or ppm.
The jitter on output clock signals depends on the phase noise and frequency of the external oscillator. For the device
to operate with the lowest possible output jitter, the external oscillator should have the following characteristics:
•
•
Phase Jitter: less than 0.1ps RMS over the 12kHz to 5MHz integration band
Frequency: The higher the better, all else being equal
5.3.2 External Crystal and On-Chip Driver Circuit
The on-chip crystal driver circuit is designed to work with a fundamental mode, AT-cut crystal resonator. See Table
2 for recommended crystal specifications. To enable the crystal driver, set MCR2.XAB=01.
XTAL
(optioCna1l)
6pF + XACAP*1pF
XA
CO
LS
Crystal
1M
(CL = 10pF)
XB
(optioCna2l)
CS
RS
6pF + XBCAP*1pF
Figure 4 - Crystal Equivalent Circuit / Recommended Crystal Circuit
See Figure 4 for the crystal equivalent circuit and the recommended external component connections. The driver
circuit design includes configurable internal load capacitors. For a 10pF crystal the total capacitance on each of XA
and XB should be 2 x 10pF = 20pF. To achieve these loads without external capacitors, register field XACR3.XACAP
should be set to 20pF minus actual XA external board trace capacitance minus XA’s minimum internal capacitance
of 6pF. For example, if external trace capacitance is 2pF then XACAP should be set to 20pF – 2pF – 6pF = 12pF.
Register field XACR3.XBCAP should be set in a similar manner for XB load capacitance. Crystals with nominal load
capacitance other than 10pF usually can be supported with only internal load capacitance. If the XACAP and XBCAP
fields do not have sufficient range for the application, capacitance can be increased by using external caps C1 and
C2.
Users should also note that on-chip capacitors are not nearly as accurate as discrete capacitors (which can have 1%
accuracy). If tight frequency accuracy is required for the crystal driver circuit then set XACAP and XBCAP both to 0
and choose appropriate C1 and C2 capacitors with 1% tolerance.
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Data Sheet
The crystal, traces, and two external capacitors sites (if included) should be placed on the board as close as possible
to the XA and XB pins to reduce crosstalk of active signals into the oscillator. Also no active signals should be routed
under the crystal circuitry.
Note: Crystals have temperature sensitivies that can cause frequency changes in response to ambient temperature
changes. In applications where significant temperature changes are expected near the crystal, it is recommended
that the crystal be covered with a thermal cap, or an external XO or TCXO should be used instead.
Table 2 - Crystal Selection Parameters
Parameter
Crystal Oscillation Frequency1
Shunt Capacitance
Symbol
fOSC
CO
Min.
25
Typ.
Max.
60
5
16
60
50
Units
MHz
pF
pF
2
10
Load Capacitance3
CL
RS
RS
8
Equivalent Series Resistance
fOSC < 40MHz
fOSC > 40MHz
(ESR)2
Maximum Crystal Drive Level
100
100, 200,
300
W
Note 1: Higher frequencies give lower output jitter, all else being equal.
Note 2: These ESR limits are chosen to constrain crystal drive level to less than 100W. If the crystal can tolerate a drive level greater than
100W then proportionally higher ESR is acceptable.
Note 3: For crystals with 100W max drive level: (a) fOSC>55MHz and CL12pF is not supported, and (b) fOSC>45MHz and CL16pF is not
supported. Crystals with max drive level of 200W or higher do not have these limitations.
Parameter
Symbol
Min.
Typ.
Max.
Units
ppm per
10% in
VDD
Crystal Frequency Stability vs. Power Supply
fFVD
0.2
0.5
Any known frequency inaccuracy of the crystal can be compensated in the APLL by adjusting the APLL's fractional
feedback divider value (AFBDIV) by ppb or ppm to compensate for crystal frequency error.
5.3.3 Clock Doublers
Figure 1 shows an optional clock doubler (“x2” block) following the crystal driver block. The doubler, which is enabled
by setting MCR2.DBL=1, can be used to double the frequency of the internal crystal driver circuit or a 20MHz to
78.125MHz clock signal on the XA pin. For input clock frequencies from 25MHz to 78.125MHz the duty cycle of the
signal can be anywhere in the 40% to 60% range. For input clock frequencies from 20MHz to 25MHz the duty cycle
must be in the 45% to 55% range. Figure 1 also shows an optional doubler at the input of the APLL. This APLL input
doubler, which is enabled by setting ACR1.INDBL=1, can be used to double the frequency of any of the inputs. The
following table shows scenarios when the clock doubler can be used.
Scenario
With Crystal
Yes1
With XO or Clock Signal
APLL, Integer Multiply
APLL, Fractional Multiply
NCO
Maybe1
Yes
Yes
Yes
Yes
Spread-Spectrum
APLL bypass path or Path 2
Yes
Yes
No2
No2
Note 1: For APLL integer multiplication, use of the doubler is application-dependent. On the positive side, use of the doubler
reduces random jitter. On the negative side, the doubler causes a spur at the XA frequency (but this spur may be outside
the band of interest for the application).
Note 2: The signal generated by the doubler has a very narrow and variable pulse width and therefore it is not recommended
to connect the doubler signal directly to the OCx outputs using the APLL bypass path or Path 2. The doubler signal is fine
as an input to the APLL, which filters the duty cycle distortion and produces a 50% duty cycle output.
Note 3: Using both doublers in series to double the XA-doubled signal is not supported.
5.3.4 Ring Oscillator (for Auto-Configuration)
After reset the internal auto-configuration boot controller is clocked by an internal ring oscillator. After auto-
configuration is complete (GLOBISR.BCDONE=1) the ring oscillator can be disabled by setting MCR1.ROSCD=1.
The device’s processor interface is asynchronous and does not require the ring oscillator.
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5.4 Input Signal Format Configuration
Input clocks IC1, IC2 and IC3 are enabled by setting the enable bits in the ICEN register. The power consumed by a
differential receiver is shown in Table 6. The electrical specifications for these inputs are listed in Table 9. Each input
clock can be configured to accept nearly any differential signal format by using the proper set of external components
(see Figure 15). To configure these differential inputs to accept single-ended CMOS signals, connect the single-
ended signal to the ICxP pin, and connect the ICxN pin to a capacitor (0.1F or 0.01F) to VSS. Each ICxP and ICxN
pin is internally biased to approximately 1.3V. If an input is not used, both ICxP and ICxN pins can be left floating.
Note that the IC3N pin is not present. A differential signal can be connected to IC3P by AC-coupling the POS trace
to IC3P and terminating the signal on the driver side of the coupling cap.
5.5 APLL Configuration
5.5.1 APLL Input Frequency
The frequencies of all enabled input clocks (ICx and XA) associated with the APLL must divide to a common APLL
phase-frequency detector (PFD) frequency from 9.72MHz to 156.25MHz. In this mode the input high-speed dividers
(ICxCR1.HSDIV) can be used to divide the ICx frequencies by 1, 2, 4 or 8 and the XA divider (MCR2. XODIV2) can
be used to divide the XA frequency by 1 or 2. The polarity of an ICx input signal can be inverted by setting
ICxCR1.POL.
5.5.2 APLL Input Monitors
Each of the APLL’s four inputs—IC1, IC2, IC3 and XA—have a simple activity monitor. If the monitor counts
approximately four (eight if the input clock is doubled) APLL feedback clock cycles without seeing an input clock
edge, the input is declared invalid and the corresponding ICxSR.ICV bit or XASR.ICV bit is set to 0. The input clock
is declared valid, and the corresponding ICxSR.ICV bit or XASR.ICV bit is set to 1, when the input clock has no
missing edges in an interval specified by the corresponding ICxCR1.VALTIME or XACR1.VALTIME field. The XASR
and ICxSR registers provide real-time and latched status bits indicating the state of each input.
The feedback clock to use for each input monitor is specified by the MCR2.XAMCK and MCR2.ICxMCK bits.
5.5.3 APLL Input Selection
The APLL can lock to any of inputs IC1 through IC3, a clock signal on XA (optionally clock-doubled), or the crystal
driver circuit (optionally clock-doubled) when a crystal is connected to XA and XB.
The input to the APLL can be controlled by a register field, a GPIO pin, or a simple input activity monitor. When
ACR3.EXTSW=0 and ACR3.INMON=0, the ACR3.APLLMUX register field controls the APLL input mux.
When ACR3.EXTSW=1, a GPIO pin controls the APLL input mux. When the GPIO pin is low, the mux selects the
input specified by ACR3.APLLMUX. When the GPIO pin is high, the mux selects the input specified by
ACR3.ALTMUX. ACR1.EXTSS specifies which GPIO pin controls this behavior.
When ACR3.EXTSW=0 and ACR3.INMON=1, an input monitor (see section 5.5.2) controls the APLL input mux.
When the monitor for the input specified by ACR3.APLLMUX says that input is valid (ICxSR.ICV=1 or XASR.ICV=1),
the mux selects the input specified by ACR3.APLLMUX otherwise the mux selects the input specified by
ACR3.ALTMUX.
The APLLSR.SELREF real-time status field indicates the APLL’s selected reference.
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Data Sheet
5.5.4 APLL Output Frequency
APLL
ACR2.INTDIV[3:0]
Phase/
Clock to
Output
Muxes
VCO
~3.7- 4.2
GHz
Loop
Filter
Integer
Divider
(whole ÷ 4-15,
half ÷ 4.5-7.5)
Clock from APLL
Input Mux
Freq
Detector
Feedback
Divider
(fractional)
Clock to
Output
Muxes
Fractional
Divider
Input Frequency Range:
9.72MHz to 156.25MHz
AFBDIV[74:0], AFBREM,
AFBDEN, AFBBP
FDIV, FREM, FDEN, FBP
Figure 5 - APLL Block Diagram
The APLL is enabled when PLLEN.APLLEN=1. The APLL has a fractional-N architecture and therefore can produce
output frequencies that are either integer or non-integer multiples of the input clock frequency. Figure 5 shows a
block diagram of the APLL, which is built around an ultra-low-jitter multi-GHz VCO. Register fields AFBDIV, AFBREM,
AFBDEN and AFBBP configure the frequency multiplication ratio of the APLL. The ACR2.INTDIV field specifies how
the VCO frequency is divided down by the APLL’s integer divider (which can also do some half divides). Dividing by
6 is the typical setting to produce 622.08MHz for SDH/SONET or 625MHz for Ethernet applications. The configuration
registers for the APLL’s fractional divider are described in section 5.5.5.
Internally, the exact APLL feedback divider value is expressed in the form AFBDIV + AFBREM / AFBDEN * 2-(33-AFBBP)
.
This feedback divider value must be chosen such that APLL_input_frequency * feedback_divider_value is in the
operating range of the VCO (as specified in Table 14). The AFBDIV term is a fixed-point number with 9 integer bits
and a configurable number of fractional bits (up to 33, as specified by AFBBP). Typically AFBBP is set to 9 to specify
that AFBDIV has 33 – 9 = 24 fractional bits. Using more than 24 fractional bits does not yield a detectable benefit.
Using less than 12 fractional bits is not recommended.
The following equations show how to calculate the feedback divider values for the situation where the APLL should
multiply the APLL input frequency by integer M and also fractionally scale by the ratio of integers N / D. In other
words, VCO_frequency = input_frequency * M * N / D. An example of this is multiplying 77.76MHz by M=48 and
scaling by N / D = 255 / 237 for forward error correction applications.
afbdiv = trunc(M * N / D * 224)
lsb_fraction = M * N / D * 224 – afbdiv
AFBDEN = D
(1)
(2)
(3)
(4)
(5)
(6)
AFBREM = round(lsb_fraction * AFBDEN)
AFBBP = 33 – 24 = 9
AFBDIV[41:0] = afbdiv * 2AFBBP
The trunc() function returns only the integer portion of the number. The round() function rounds the number to the
nearest integer. In Equation (1), the temporary variable ‘afbdiv’ is set to the full-precision feedback divider value, M
* N / D, truncated after the 24th fractional bit. In Equation (2) the temporary variable 'lsb_fraction' is the fraction that
was truncated in Equation (1) and therefore is not represented in the afbdiv value. In Equation (3), AFBDEN is set to
the denominator of the original M * N / D ratio. In Equation (4), AFBREM is calculated as the integer numerator of a
fraction (with denominator AFBDEN) that equals the 'lsb_fraction' temporary variable. In Equation (5) AFBBP is set
to 33 – 24 = 9 to correspond with AFBDIV having 24 fractional bits. Finally, in equation (6) the afbdiv bits are shifted
into the proper position for the AFBDIV registers.
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When a fractional scaling scenario involves multiplying an integer M times multiple scaling ratios N1 / D1 through
Nn / Dn, the equations above can still be used if the numerators are multiplied together to get N = N1 x N2 x … x Nn
and the denominators are multiplied together to get D = D1 x D2 x … x Dn.
The easiest way to calculate the exact values to write to the APLL registers is to use the ZL3026x evaluation software,
available on the Microchip website. This software can be used even when no evaluation board is attached to the
computer.
Note: After the APLL's feedback divider settings are configured in register fields AFBDIV, AFBREM, AFBDEN and
AFBBP, the APLL enable bit PLLEN.APLLEN should be changed from 0 to 1 to cause the APLL to reacquire lock
with the new settings. The real-time lock/unlock status of the APLL is indicated by APLLSR.ALK.
5.5.5 Fractional Output Divider
As shown in Figure 1 and Figure 5, the APLL has a fractional output divider. This allows the APLL to be the source
of two unrelated frequency families, one from the integer divider, and one from the fractional divider.
Configuration of the fractional output divider is very similar to configuration of the APLL’s feedback divider. The
fractional divider is enabled by setting ACR1.ENFDIV. Internally, the exact divider value is expressed in the form
FDIV + FREM / FDEN * 2-(36-FBP). The input clock to the fractional divider is APLL VCO frequency divided by 2 (fVCO/2).
The FDIV term is a fixed-point number with 4 integer bits and a configurable number of fractional bits (up to 36, as
specified by FBP). Typically FBP is set to 12 to specify that FDIV has 36 – 12 = 24 fractional bits.
The output clock from the fractional divider has good phase noise on rising edges but worse phase noise on falling
edges and can have non-50% duty cycle. Applications that only use clock rising edges can use the fractional divider’s
output clock directly. For applications that care about 50% duty cycle and/or the phase noise of both rising edges
and falling edges, the fractional divider should be followed by an even medium-speed divider value (2, 4, 6, 8…).
The low-speed divider can be used to further divide the output clock if needed.
The maximum output frequency for the fractional divider is fVCO/10. This means the minimum fractional divider value
is 5.0. Including the need for a divide-by-2 in the medium-speed divider, the maximum frequency for a 50% duty-
cycle output clock signal is fVCO/20. The minimum output frequency for the fractional divider is fVCO/32 since the
internal FDIV value has 4 integer bits. The combination FDIV=0, FREM=0, FDEN=1 specifies to divide by 16.0. The
medium-speed and low-speed dividers can be configured to follow the fractional output divider to create output
frequencies down to <1Hz.
The following equations show how to calculate the register values for the situation where the fractional divider should
divide by the integer M and the ratio of integers N / D. In other words,
frac_div_output_freq = (VCO_freq / 2) / (M * N / D)
An example of this is starting with VCO_freq = 3750MHz (to get low-jitter Ethernet frequencies through the APLL’s
integer divider) and using the APLL’s fractional divider to get 155.52MHz for SONET/SDH applications. In this
example, M=12, N=15625, D=15552 are appropriate values to get 155.52MHz.
fdiv = trunc(M * N / D * 224)
lsb_fraction = M * N / D * 224 – fdiv
FDEN = D
(1)
(2)
(3)
(4)
(5)
(6)
FREM = round(lsb_fraction * FDEN)
FBP = 36 – 24 = 12
FDIV[39:0] = fdiv * 2FBP
The trunc() function returns only the integer portion of the number. The round() function rounds the number to the
nearest integer. In Equation (1), the temporary variable ‘fdiv’ is the full-precision feedback divider value, M * N / D,
truncated after the 24th fractional bit. In Equation (2) the temporary variable 'lsb_fraction' is the fraction that was
truncated in Equation (1) and therefore is not represented in the fdiv value. In Equation (3), FDEN is set to the
denominator of the original M * N / D ratio. In Equation (4), FREM is calculated as the integer numerator of a fraction
(with denominator FDEN) that equals the 'lsb_fraction' temporary variable. In Equation (5) FBP is set to 36 – 24 =12
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Data Sheet
to correspond with FDIV having 24 fractional bits. Finally, in equation (6) the fdiv bits are shifted into the proper
position for the FDIV registers.
When a fractional scaling scenario involves multiplying an integer M times multiple scaling ratios N1 / D1 through
Nn / Dn, the equations above can still be used if the numerators are multiplied together to get N = N1 x N2 x … x Nn
and the denominators are multiplied together to get D = D1 x D2 x … x Dn.
The easiest way to calculate the exact values to write to the APLL’s fractional output divider registers is to use the
ZL3026x evaluation software, available on the Microchip website. This software can be used even when no
evaluation board is attached to the computer.
5.5.6 Numerically Controlled Oscillator (NCO) Mode
5.5.6.1 Using the APLL’s Feedback Divider
System software can steer output frequencies with high resolution by manipulating the APLL’s AFBDIV value. The
resolution can be better than 0.01ppb.
The nominal AFBDIV value, hereafter referred to as AFBDIV0, is the 0ppm nominal value for the desired device
configuration.
(Fractional frequency offset (FFO) is defined as (actual_frequency – nominal_frequency) / nominal_frequency. FFO
is a unitless number but is typically expressed in parts per billion (ppb), parts per million (ppm) or percent.)
To control the NCO, system software first reads the AFBDIV0 value from the device. Even though the AFBDIV
register description describes AFBDIV as having 9 integer bits and 33 fractional bits, for the NCO calculations that
follow, AFBDIV values should be treated as 42-bit unsigned integers.
To change the NCO frequency to a specific FFO (in ppm), system software calculates newAFBDIV (a 42-bit unsigned
integer) as follows:
newAFBDIV = round(AFBDIV0 * (1 + FFO/1e6))
System software then writes the newAFBDIV value directly to the AFBDIV registers.
Note that any subsequent frequency changes are calculated using the same equation from the original AFBDIV0
value and are not a function of the previous newAFBDIV value. The value of newAFBDIV should be kept within
±1000ppm of AFBDIV0 and within ±500ppm of the previous newAFBDIV value to avoid causing the APLL to lose
lock. If spread spectrum modulation is also in use, the total frequency change caused by spread spectrum modulation
and NCO control should be kept within ±5000ppm of AFBDIV0 to avoid causing the APLL to lose lock.
During NCO operation using the APLL’s feedback divider, AFBREM should be set to 0, AFBDEN should be set to 1
and AFBBP should be set to 0.
5.5.6.2 Using the Fractional Output Divider
System software can steer output frequencies derived from the fractional output divider with high resolution by
manipulating the divider’s FDIV value. The resolution can be better than 0.01ppb. In the case of fractional output
divider value >14.55192, the resolution is better than 1ppt.
The nominal FDIV value, hereafter referred to as FDIV0, is the 0ppm nominal value for the desired device
configuration.
(Fractional frequency offset (FFO) is defined as (actual_frequency – nominal_frequency) / nominal_frequency. FFO
is a unitless number but is typically expressed in parts per billion (ppb), parts per million (ppm) or percent.)
To control the NCO, system software first reads the FDIV0 value from the device. Even though the FDIV register
description describes FDIV as having 4 integer bits and 36 fractional bits, for the NCO calculations that follow, FDIV
values should be treated as 40-bit unsigned integers.
To change the NCO frequency to a specific FFO (in ppm), system software calculates newFDIV (a 40-bit unsigned
integer) as follows:
newFDIV = round(FDIV0 / (1 + FFO/1e6))
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Data Sheet
System software then writes the newFDIV value directly to the FDIV registers.
Note that any subsequent frequency changes are calculated using the same equation from the original FDIV0 value
and are not a function of the previous newFDIV value.
During NCO operation using the fractional output divider, FREM should be set to 0, FDEN should be set to 1 and
FBP should be set to 0.
5.5.7 Frequency Increment and Decrement
When ACR1.USEFDIV=0 the APLL’s feedback divider value can be incremented or decremented by values ranging
from approximately 1ppb to 500ppm. The value AID[23:0] x 27 is added to the APLL’s feedback divider value each
time the trigger specified by AIDCR.FISS changes state. AID[23:0] x 27 is subtracted from the APLL’s feedback
divider value each time the trigger specified by AIDCR.FDSS changes state. The value to be written to AID[23:0] s
as follows:
AID = round(AFBDIV0 * FFO/1e6 / 27)
where FFO is the desired fractional frequency offset (FFO) per increment or decrement step in ppm
AFBDIV0 is the nominal AFBDIV value, obtained by reading AFBDIV when AFBDL.RDCUR=0
The current APLL feedback divider value (i.e. the value after increments and decrements) can be read from the
AFBDIV registers when AFBDL.RDCUR=1. The original value of the AFBDIV registers before increments and
decrements can be read from the AFBDIV registers when AFBDL.RDCUR=0. Incrementing and decrementing only
occur when the APLL is locked (APLLSR.ALK=1). If the APLL loses lock, when it locks again the APLL sets its
feedback divider value back to the AFBDIV0 value. The system must be designed to ensure the current feedback
divider value stays within ±1000ppm of the AFBDIV0 value to avoid causing the APLL to lose lock. The maximum
increment/decrement is 500ppm. Frequency increment/decrement behavior is mutually exclusive with spread-
spectrum modulation (see section 5.5.8) because both behaviors use the AID registers. Frequency
increment/decrement is enabled when ACR1.ENFID=1. When ENFID is set to 0 the APLL feedback divider instantly
changes to the AFBDIV0 value. Therefore, to avoid a frequency jump on output clocks, system software should
increment or decrement back to the AFBDIV0 value before changing ENFID to 0.
5.5.8 Spread-Spectrum Modulation Mode
For EMI-sensitive applications such as PCI Express, the device can perform spread spectrum modulation (SSM). In
SSM the frequency of the output clock is continually varied over a narrow frequency range to spread the energy of
the signal and thereby reduce EMI. This mode is a special case of NCO mode.
Spread spectrum mode is enabled by the ASCR.ENSS bit or by a GPIO pin as specified by ASCR.SPRDSS.
5.5.8.1 Using the APLL’s Feedback Divider
When ACR1.USEFDIV=0 the device performs frequency modulation by modulating the APLL’s feedback divider
value starting from the nominal value specified in the AFBDIV registers.
For center-spread applications (ASCR.DWNEN=0), the frequency modulation is triangle-wave center-spread of up
to ±0.5% deviation from the center frequency with modulation rate configurable from 25kHz to 55kHz. The spread
deviation and modulation rate are controlled by specifying an increment/decrement step in the AID registers and the
number of APLL input clock cycles to increment and decrement in the ASCNT registers. The values to be written to
the device are calculated as follows:
퐹
퐼ꢀ
퐴푆퐶푁푇 = 푟표푢푛푑 (
) − 2
4 ∗ 퐹푀푂퐷
퐹푉ꢄ푂
푆 ∗ 23ꢅ
퐴ꢁꢂ = 푟표푢푛푑 ꢃ
∗
ꢆ
퐹
퐼ꢀ
퐴푆퐶푁푇 + 2
where FVCO is the APLL”s VCO frequency in Hz,
FIN is the input frequency at the APLL’s PFD in Hz,
FMOD is the spread-spectrum modulation frequency in Hz,
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and S is the peak-to-peak spread percentage expressed as a decimal (example ±0.5% → S=0.01)
For down-spread applications (ASCR.DWNEN=1), such as PCI Express Refclk, the frequency modulation is triangle-
wave down-spread of up to -1% deviation from the nominal frequency with modulation rate configurable from 25kHz
to 55kHz. The spread deviation and modulation rate are controlled by specifying an increment/decrement step in the
AID registers and the number of APLL input clock cycles to increment and decrement in the ASCNT registers. The
values to be written to the device are calculated as follows:
퐹
퐼ꢀ
퐴푆퐶푁푇 = 푟표푢푛푑 (
) − 2
2 ∗ 퐹푀푂퐷
퐹푉ꢄ푂
푆 ∗ 233
퐴ꢁꢂ = 푟표푢푛푑 ꢃ
∗
ꢆ
퐹
퐼ꢀ
퐴푆퐶푁푇 + 2
All of the input parameters are the same as for center spread above. Note the small differences between these down-
spread equations and the center-spread equations above. ASCNT here has 2 in the denominator while it has 4 for
center-spread. AID has 233 in the numerator for down-spread while it has 232 for center-spread.
During spread-spectrum operation using the APLL’s feedback divider, AFBREM should be set to 0, AFBDEN should
be set to 1 and AFBBP should be set to 0. Spread-spectrum modulation only occurs when the APLL is locked
(APLLSR.ALK=1).
5.5.8.2 Using the Fractional Output Divider
When ACR1.USEFDIV=1 the device performs frequency modulation by modulating the fractional output divider value
starting from the nominal value specified in the FDIV registers.
For center-spread applications (ASCR.DWNEN=0), the frequency modulation is triangle-wave center-spread of up
to ±5% deviation from the center frequency with modulation rate configurable from 10kHz to 100kHz. (Values outside
of these ranges are often achievable as well.) The spread deviation and modulation rate are controlled by specifying
an increment/decrement step in the AID registers and the number of APLL input clock cycles to increment and
decrement in the ASCNT registers. The ASCR.CNTEN register field must also be set propertly. The values to be
written to the device are calculated as follows:
CNTEN = 0 for FIN < 50MHz
1 for 50MHz FIN < 100MHz
2 for FIN ≥ 100MHz
퐹
퐼ꢀ
퐴푆퐶푁푇 = 푟표푢푛푑 (
) − 2
4 ∗ 퐹푀푂퐷 ∗ 2ꢄꢀꢇ퐸ꢀ
퐹푉ꢄ푂
푆 ∗ 23ꢈ
퐴ꢁꢂ = 푟표푢푛푑 ꢃ
∗
ꢆ
ꢉ
ꢊ
퐹푂푈ꢇ 퐴푆퐶푁푇 + 2 ∗ ꢉ1 − 0.5푆ꢊ
where FVCO is the APLL”s VCO frequency in Hz,
FIN is the input frequency at the APLL’s PFD in Hz,
FOUT is the fractional output divider block’s output frequency in Hz,
FMOD is the spread-spectrum modulation frequency in Hz,
and S is the peak-to-peak spread percentage expressed as a decimal (example ±0.5% → S=0.01)
For down-spread applications (ASCR.DWNEN=1), such as PCI Express Refclk, the frequency modulation is triangle-
wave down-spread of up to -10% deviation from the nominal frequency with modulation rate configurable from 10kHz
to 100kHz. (Values outside of these ranges are often achievable as well.) The spread deviation and modulation rate
are controlled by specifying an increment/decrement step in the AID registers and the number of APLL input clock
cycles to increment and decrement in the ASCNT registers. The ASCR.CNTEN register field must also be set
propertly. The values to be written to the device are calculated as follows:
CNTEN = 0 for FIN < 50MHz
1 for 50MHz FIN < 100MHz
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2 for FIN ≥ 100MHz
퐹
퐼ꢀ
퐴푆퐶푁푇 = 푟표푢푛푑 (
) − 2
2 ∗ 퐹푀푂퐷 ∗ 2ꢄꢀꢇ퐸ꢀ
퐹푉ꢄ푂
푆 ∗ 23ꢋ
퐴ꢁꢂ = 푟표푢푛푑 ꢃ
∗
ꢆ
ꢉ
ꢊ
퐹푂푈ꢇ 퐴푆퐶푁푇 + 2 ∗ ꢉ1 − 0.5푆ꢊ
All of the input parameters are the same as for center spread above. Note the small differences between these down-
spread equations and the center-spread equations above. ASCNT here has 2 in the denominator while it has 4 for
center-spread. AID has 235 in the numerator for down-spread while it has 234 for center-spread.
During spread-spectrum operation using the fractional output divider, FREM should be set to 0, FDEN should be set
to 1 and FBP should be set to 0. The F1CR1.MODE field must be set to 1 when doing spread-spectrum modulation
with the fractional output divider value. Spread-spectrum modulation only occurs when the APLL is locked
(APLLSR.ALK=1).
5.5.9 APLL Phase Adjustment
The phase of the APLL’s output clock can be incremented or decremented. When the APLL’s AFBDIV value is not
an exact multiple of 0.5 then the phase adjustment step size is 1/8th of a VCO cycle. This phase step size is 30ps at
maximum VCO frequency of 4180MHz and 33.7ps at minimum VCO frequency of 3715MHz. The ACR4.PDSS field
specifies the phase decrement control signal, which can be the ACR4.DECPH bit or any of the four GPIOs. The
ACR4.PISS field specifies the phase increment control signal, which can be the ACR4.INCPH bit or any of the four
GPIOs. Phase is adjusted on every rising edge and every falling edge of the control signal. This phase adjustment
affects the output of the APLL’s output dividers (integer and fractional).
When the APLL’s AFBDIV value is an exact multiple of 0.5 then the phase adjustment step size is one VCO cycle.
5.6 Output Clock Configuration
The ZL30260 and ZL30261 have six output clock signal pairs while the ZL30262 and ZL30263 have ten. Each output
has individual divider, enable and signal format controls. In CMOS mode each signal pair can become two CMOS
outputs, allowing the device to have up to 12 or 20 output clock signals. Also in CMOS mode, the OCxN pin can have
an additional divider allowing the OCxN frequency to be an integer divisor of the OCxP frequency (example: OC3P
125MHz and OC3N 25MHz). The outputs can be aligned relative to each other, and the phases of output signals can
be adjusted dynamically with high resolution.
5.6.1 Output Enable, Signal Format, Voltage and Interfacing
To use an output, the output driver must be enabled by setting OCxCR2.OCSF0, and the per-output dividers must
be enabled by setting the appropriate bit in the OCEN register. The per-output dividers include the medium-speed
divider, the low-speed divider and the associated phase adjustment/alignment circuitry and start/stop logic.
Using the OCxCR2.OCSF register field, each output pair can be disabled or configured as LVDS, LVPECL, HCSL,
HSTL, or one or two CMOS outputs. When an output is disabled it is high impedance, and the output driver is in a
low-power state. In CMOS mode, the OCxN pin can be disabled, in-phase or inverted vs. the OCxP pin. All of these
options are specified by OCxCR2.OCSF. The clock to the output driver can inverted by setting OCxCR2.POL=1. The
CMOS/HSTL output driver can be set to any of four drive strengths using OCxCR2.DRIVE.
When OCxCR2.OCSF=0001 the output driver is in LVDS mode. VOD is forced to 400mV and OCxDIFF.VOD is
ignored. VCM can be configured in OCxDIFF.VCM, but the default value of 0000 is typically used to get VCM=1.23V
for LVDS.
When OCxCR2.OCSF=0010 the output driver is in programmable differential mode. In this mode the output swing
(VOD) can be set in OCxDIFF.VOD and the common-mode voltage can be set in OCxDIFF.VCM. Together these
fields allow the output signal to be customized to meet the requirements of the clock receiver and minimize the need
for external components. By default, when OCSF=0010 the output is configured for LVPECL signal swing with a
1.23V common mode voltage. This gives a signal that can be AC-coupled (after a 100 termination resistor) to
receivers that are LVPECL or that require a larger signal swing than LVDS. The output driver can also be configured
for LVPECL output with standard 2.0V common-mode voltage by seting OCxDIFF.VCM for 2.0V and setting
OCxREG.VREG appropriately.
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In both LVDS mode and programmable differential mode the output driver requires a DC path through a 100 resistor
between OCxP and OCxN for proper operation. This resistor is usually placed as close as possible to the receiver
inputs to terminate the differential signal. If the receiver requires a common-mode voltage that cannot be matched
by the output driver then the POS and NEG signals can be AC-coupled to the receiver after the 100 resistor.
HCSL mode requires a DC path through a 50 resistor to ground on each of OCxP and OCxN. Note that each of the
OCxDIFF.VCM, OCxDIFF.VOD and OCxREG.VREG register fields has a particular setting required for HCSL signal
format. See the descriptions of these fields for details.
Outputs are grouped into six power supply banks, VDDOA through VDDOF to allow CMOS or HSTL signal swing
from 1.5V to 3.3V for glueless interfacing to neighboring components. 10-output products have outputs grouped into
banks in a 2-1-2-2-1-2 arrangement, as shown in Figure 1. 6-output products have one output per bank. If OCSF is
set to HSTL mode then a 1.5V power supply voltage should be used to get a standards-compliant HSTL output. Note
that LVDS, LVPECL and HCSL signal formats must have a power supply of 2.5V or 3.3V. Also note that VDDO
voltage must not exceed VDDH voltage.
5.6.2 Output Frequency Configuration
The frequency of each output is determined by the configuration of the APLL, the APLL’s output dividers, and the
per-output dividers. Each bank of outputs can be connected to the APLL’s integer divider, the APLL’s fractional
divider, or Path 2 (see section 5.15) using the appropriate field in the OCMUX registers.
Each output has two output dividers, a 7-bit medium-speed divider (OCxCR1.MSDIV) and a 24-bit low-speed output
divider (LSDIV field in the OCxDIV registers). These dividers are in series, medium-speed divider first then output
divider. These dividers produce signals with 50% duty cycle for all divider values including odd numbers. The low-
speed divider can only be used if the medium-speed divider is used (i.e. OCxCR1.MSDIV>0). The maxium input
frequency to the medium-speed divider is 750MHz.
Since each output has its own independent dividers, the device can output families of related frequencies that have
an APLL output frequency as a common multiple. For example, for Ethernet clocks, a 625MHz APLL output clock
can be divided by four for one output to get 156.25MHz, divided by five for another output to get 125MHz, and divided
by 25 for another output to get 25MHz. Similarly, for SDH/SONET clocks, a 622.08MHz APLL output clock can be
divided by 4 to get 155.52MHz, by 8 to get 77.76MHz, by 16 to get 38.88MHz or by 32 to get 19.44MHz.
Two Different Frequencies in 2xCMOS Mode
When an output is in 2xCMOS mode it can be configured to have the frequency of the OCxN clock be an integer
divisor of the frequency of the OCxP clock. Examples of where this can be useful:
•
•
•
125MHz on OCxP and 25MHz on OCxN for Ethernet applications
77.76MHz on OCxP and 19.44MHz on OCxN for SONET/SDH applications
25MHz on OCxP and 1Hz (i.e. 1PPS) on OCxN for telecom applications with Synchronous Ethernet and
IEEE1588 timing
An output can be configured to operate like this by setting the LSDIV value in the OCxDIV registers to OCxP_freq /
OCxN_freq - 1 and setting OCxCR3.LSSEL=0 and OCxCR3.NEGLSD=1. Here are some notes about this dual-
frequency configuration option:
•
In this mode only the medium speed divider is used to create the OCxP frequency. The low-speed
divider is then used to divide the OCxP frequency down to the OCxN frequency. This means that
the lowest OCxP frequency is the APLL divider output frequency divided by 128.
•
An additional constraint is that the medium-speed divider must be configured to divide by 2 or more
(i.e. must have OCxCR1.MSDIV1).
5.6.3 Output Duty Cycle Adjustment
For output frequencies less than or equal to 141.666MHz, the duty cycle of the output clock can be modified using
the OCxDC.OCDC register field. This behavior is only available when MSDIV>0 and LSDIV > 1. When OCDC = 0
the output clock is 50%. Otherwise the clock signal is a pulse with a width of OCDC number of MSDIV output clock
periods. The range of OCDC can create pulse widths of 1 to 255 MSDIV output clock periods. When OCxCR2.POL=0,
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the pulse is high and the signal is low the remainder of the cycle. When POL=1, the pulse is low and the signal is
high the remainder of the cycle.
Note that duty cycle adjustment is done in the low-speed divider. Therefore when OCxCR3.LSSEL=0 the duty cycle
of the output is not affected. Also, when a CMOS output is configured with OCxCR3.LSSEL=0 and
OCxCR3.NEGLSD=1, the OCxN pin has duty cycle adjustment but the OCxP pin does not. This allows a higher-
speed 50% duty cycle clock signal to be output on the OCxP pin and a lower-speed frame/phase/time pulse (e.g.
2kHz, 8kHz or 1PPS) to be output on the OCxN pin at the same time.
An output configured for CMOS or HSTL signal format should not be configured to have a duty cycle with high time
shorter than 2ns or low time shorter than 2ns.
5.6.4 Output Phase Adjustment
The phase of an output signal can be shifted by 180 by setting OCxCR2.POL=1. In addition, the phase can be
adjusted using the OCxPH.PHADJ register field. The adjustment is in units of bank source clock cycles. For example,
if the bank source clock is 625MHz (from the APLL for example) then one bank source clock cycle is 1.6ns, the
smallest phase adjustment is 0.8ns, and the adjustment range is ±5.6ns.
5.6.5 Output-to-Output Phase Alignment
A 0-to-1 transition of the ACR1.DALIGN bit causes a simultaneous reset of the medium-speed dividers and low-
speed dividers for all output clocks following the APLL where OCxCR1.PHEN=1. After this reset, all PHEN=1 output
clocks from the same APLL divider (IntDiv or FracDiv) are rising-edge aligned, with the phase of each output clock
signal adjusted as specified by its OCxPH.PHADJ register field. Alignment of clocks from IntDiv with clocks from
FracDiv is not supported. Similarly a 0-to-1 transition of the P2CR1.DALIGN bit aligns all output clocks following Path
2 where OCxCR1.PHEN=1. Alignment is not glitchess; i.e. it may cause a short high time or low time on participating
output clock signals. A glitchless alignment can be accomplished by first stopping the clocks, then aligning them,
then starting them. Output clock start and stop is described in section 5.6.7.
5.6.6 Output-to-Input Phase Alignment
The best approach for achieving output-to-input phase alignment is to use external feedback in which an OCx output
is connected to an ICx input. To enable external feedback, set AFBDL.EXTFB=1, set AFBDL.FBSEL to specify the
external feedback path, and provide the associated output-to-input wiring on the PCB. In this configuration the APLL,
in a closed-loop manner, automatically phase-aligns all OCx outputs from the APLL to the APLL’s selected reference.
Any small error in this alignment due to wire delays can be compensated in the outputs’ phase adjustment registers,
OCxPH.PHADJ.
5.6.7 Output Clock Start and Stop
Output clocks can be stopped high or low or high-impedance. One use for this behavior is to ensure “glitchless”
output clock operation while the output is reconfigured or phase aligned with some other signal.
Each output has an OCxSTOP register with fields to control this behavior. The OCxSTOP.MODE field specifies
whether the output clock signal stops high, low, or high-impedance. The OCxSTOP.SRC field specifies the source
of the stop signal. Options include control bits or one of the GPIO pins. When OCxSTOP.SRC=0001 the output clock
is stopped when the corresponding bit is set in the STOPCR registers OR the MCR1.STOP bit is set.
When the stop mode is Stop High (OCxSTOP.MODE=x1) and the stop signal is asserted, the output clock is stopped
after the next rising edge of the output clock. When the stop mode is Stop Low (OCxSTOP.MODE=x0) and the stop
signal is asserted, the output clock is stopped after the next falling edge of the output clock. When the output is
stopped, the output driver can optionally go high-impedance (OCxSTOP.MODE=1x). Internally the clock signal
continues to toggle while the output is stopped. When the stop signal is deasserted, the output clock resumes on the
opposite edge that it stopped on. Low-speed output clocks can take long intervals before being stopped after the
stop signal goes active. For example, a 1 Hz output could take up to 1 second to stop.
When OCxCR2.POL=1 the output stops on the opposite polarity that is specified by the OCxSTOP.MODE field.
Generally OCxCR1.MSDIV must be > 0 for this function to operate correctly since MSDIV=0 bypasses the start-stop
circuits.
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When MSDIV=0, OCxSTOP.MODE=11 (stop high then go high-impedance) can be used to make outputs high-
impedance, but the action won’t necessarily be glitchless. To use this behavior to get “stop low then go-impedance”
behavior, OCxCR2.POL can be set to 1.
Note that when OCxCR3.NEGLSD=1 the start-stop logic is bypassed for the OCxN pin, and OCxN may not start/stop
without glitches.
Each output has a status register (OCxSR) with several stop/start status bits. The STOPD bit is a real-time status bit
indicating stopped or not stopped. The STOPL bit is a latched status bit that is set when the output clock has stopped.
The STARTL bit is a latched status bit that is set when the output clock has started.
5.7 Microprocessor Interface
The device can communicate over a SPI interface or an I2C interface.
In SPI mode ZL3026x devices without internal EEPROM can be configured at reset to be a SPI slave to a processor
master or a SPI master to an external EEPROM slave. (SPI master operation changes to SPI slave operation after
auto-configuration from the external EEPROM is complete.) The ZL3026x devices with internal EEPROM can only
be configured as a SPI slave to a processor master. All devices are always slaves on the I2C bus.
Section 5.2 describes reset pin settings required to configure the device for these interfaces.
5.7.1 SPI Slave
The device can present a SPI slave port on the CSN, SCLK, MOSI, and MISO pins. SPI is a widely used master/slave
bus protocol that allows a master and one or more slaves to communicate over a serial bus. SPI masters are typically
microprocessors, ASICs or FPGAs. Data transfers are always initiated by the master, which also generates the SCLK
signal. The device receives serial data on the MOSI (Master Out Slave In) pin and transmits serial data on the MISO
(Master In Slave Out) pin. MISO is high impedance except when the device is transmitting data to the bus master.
Bit Order. The register address and all data bytes are transmitted most significant bit first on both MOSI and MISO.
Clock Polarity and Phase. The device latches data on MOSI on the rising edge of SCLK and updates data on
MISO on the falling edge of SCLK. SCLK does not have to toggle between accesses, i.e., when CSN is high.
Device Selection. Each SPI device has its own chip-select line. To select the device, the bus master drives its CSN
pin low.
Command and Address. After driving CSN low, the bus master transmits an 8-bit command followed by a 16-bit
register address. The available commands are shown below.
Table 3 - SPI Commands
Command
Write Enable
Write
Read
Read Status
Hex
Bit Order, Left to Right
0000 0110
0000 0010
0000 0011
0000 0101
0x06
0x02
0x03
0x05
Read Transactions. The device registers are accessible when EESEL=0. On ZL3026x devices with internal
EEPROM, the EEPROM memory is accessible when the EESEL bit is 1. On ZL3026x devices without internal
EEROM, the EESEL bit must be set to 0. After driving CSN low, the bus master transmits the read command followed
by the 16-bit address. The device then responds with the requested data byte on MISO, increments its address
counter, and prefetches the next data byte. If the bus master continues to demand data, the device continues to
provide the data on MISO, increment its address counter, and prefetch the following byte. The read transaction is
completed when the bus master drives CSN high. See Figure 6.
Register Write Transactions. The device registers are accessible when EESEL=0. After driving CSN low, the bus
master transmits the write command followed by the 16-bit register address followed by the first data byte to be
written. The device receives the first data byte on MOSI, writes it to the specified register, increments its internal
address register, and prepares to receive the next data byte. If the master continues to transmit, the device continues
to write the data received and increment its address counter. The write transaction is completed when the bus master
drives CSN high. See Figure 8.
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EEPROM Writes (ZL30261, ZL30263 Only). The internal EEPROM memory is accessible when the EESEL bit is 1.
After driving CSN low, the bus master transmits the write enable command and then drives CSN high to set the
internal write enable latch. The bus master then drives CSN low again and transmits the write command followed by
the 16-bit address followed by the first data byte to be written. The device first copies the page to be written from
EEPROM to its page buffer. The device then receives the first data byte on MOSI, writes it to its page buffer,
increments its internal address register, and prepares to receive the next data byte. If the master continues to
transmit, the device continues to write the data received to its page buffer and continues to increment its address
counter. The address counter rolls over at the 32-byte page boundary (i.e. when the five least-significant address
bits are 11111). When the bus master drives CSN high, the device transfers the data in the page buffer to the
appropriate page in the EEPROM memory. See Figure 7 and Figure 8.
EEPROM Read Status (ZL30261, ZL30263 Only). After the bus master drives CSN high to end an EEPROM write
command, the EEPROM memory is not accessible for up to 5ms while the data is transferred from the page buffer.
To determine when this transfer is complete, the bus master can use the Read Status command. After driving CSN
low, the bus master transmits the Read Status command. The device then responds with the status byte on MISO.
In this byte, the least significant bit is set to 1 if the transfer is still in progress and 0 if the transfer has completed.
Early Termination of Bus Transactions. The bus master can terminate SPI bus transactions at any time by pulling
CSN high. In response to early terminations, the device resets its SPI interface logic and waits for the start of the
next transaction. If a register write transaction is terminated prior to the SCLK edge that latches the least significant
bit of a data byte, the data byte is not written. On devices with internal EEPROM, if an EEPROM write transaction is
terminated prior to the SCLK edge that latches the least significant bit of a data byte, none of the bytes in that write
transaction are written.
Design Option: Wiring MOSI and MISO Together. Because communication between the bus master and the device
is half-duplex, the MOSI and MISO pins can be wired together externally to reduce wire count. To support this option,
the bus master must not drive the MOSI/MISO line when the device is transmitting.
AC Timing. See Table 19 and Figure 18 for AC timing specifications for the SPI interface.
CS
0
1
2
3
4
5
6
7
8
9
10
22 23 24 25 26 27 28 29 30 31
SCLK
Command
16-bit Address
15 14 13
0
0
0
0
0
0
1
1
1
0
MOSI
MISO
Data Byte 1
Data Byte n
High Impedance
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
Figure 6 - SPI Read Transaction Functional Timing
CS
0
1
2
3
4
5
6
7
SCLK
MOSI
Command
0
0
0
0
0
1
1
0
Figure 7 - SPI Write Enable Transaction Functional Timing (ZL30261 and ZL30263 Only)
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CS
0
1
2
3
4
5
6
7
8
9
10
22 23 24 25 26 27 28 29 30 31
SCLK
Command
16-bit Address
15 14 13
Data Byte 1
Data Byte n
0
0
0
0
0
0
1
0
1
0
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
MOSI
Figure 8 - SPI Write Transaction Functional Timing
5.7.2 SPI Master (ZL30260 and ZL30262 Only)
After reset these devices can present a SPI master port on the CSN, SCLK, MOSI, and MISO pins for auto-
configuration using data read from an external SPI EEPROM. During auto-configuration the device is always the SPI
master and generates the CSN and SCLK signals. The device transmits serial data on the the MOSI (Master Out
Slave In) pin and receives serial data on the MISO (Master In Slave Out) pin.
Bit Order. The register address and all data bytes are transmitted most significant bit first on both MOSI and MISO.
Clock Polarity and Phase. The device latches data on MISO on the rising edge of SCLK and updates data on
MOSI on the falling edge of SCLK.
Device Selection. Each SPI device has its own chip-select line. To select the external EEPROM, the device drives
the CSN signal low.
Command and Address. After driving CSN low, the device transmits an 8-bit read command followed by a 16-bit
register address. The read command is shown below.
Command
Hex
Bit Order, Left to Right
Read
0x03
0000 0011
Read Transactions. After driving CSN low, the device transmits the read command followed by the 16-bit register
address. The external EEPROM then responds with the requested data byte on MISO, increments its address
counter, and prefetches the next data byte. If the device continues to demand data, the EEPROM continues to
provide the data on MISO, increment its address counter, and prefetch the following byte. The read transaction is
completed when the device drives CSN high. See Figure 6.
Writing the External EEPROM. Due to the small package size and low pin count of the device, there is no way to
use the ZL30260 or ZL30262 to write the external EEPROM. The auto-configuration data used by the ZL30260 or
ZL30262 must be pre-programmed into the EEPROM by some other method, such as:
1. The EEPROM manufacturer can write the data to the EEPROM during production testing.
This is a service they routinely provide.
2. A contract manufacturer or distributor can write the data to the EEPROM using a production
EEPROM programmer before the EEPROM is mounted to the board.
5.7.3 I2C Slave
The device can present a fast-mode (400kbit/s) I2C slave port on the SCL and SDA pins. I2C is a widely used
master/slave bus protocol that allows one or more masters and one or more slaves to communicate over a two-wire
serial bus. I2C masters are typically microprocessors, ASICs or FPGAs. Data transfers are always initiated by the
master, which also generates the SCL signal. The device is compliant with version 2.1 of the I2C specification.
The I2C interface on the device is a protocol translator from external I2C transactions to internal SPI transactions.
This explains the slightly increased protocol complexity described in the paragraphs that follow.
Read Transactions. The device registers are accessible when the EESEL bit is 0. On ZL30261 and ZL30263 the
internal EEPROM memory is accessible when the EESEL bit is 1. On ZL30260 and ZL30262 the EESEL bit must be
set to 0. The bus master first does an I2C write to the device. In this transaction three bytes are written: the SPI Read
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Data Sheet
command (see Table 3), the upper byte of the register address, and the lower byte of the register address. The bus
master then does an I2C read. During each acknowledge (A) bit the device fetches data from the read address and
then increments the read address. The device then transmits the data to the bus master during the next 8 SCL cycles.
The bus master terminates the read with a not-acknowledge (NA) followed by a STOP condition (P). See Figure 9.
After the I2C write there can be unlimited idle time on the bus before the I2C read, but the device cannot tolerate other
I2C bus traffic between the I2C write and the I2C read. Care must be taken to ensure that the I2C read is the first
command on the bus after the I2C write to ensure the two-part read transaction happens correctly.
Register Write Transactions. The device registers are accessible when the EESEL bit is 0. The bus master does
an I2C write to the device. The first three bytes of this transaction are the SPI Write command (see Table 3), the
upper byte of the register address, and the lower byte of the register address. Subsequent bytes are data bytes to
be written. After each data byte is received, the device writes the byte to the write address and then increments the
write address. The bus master terminates the write with a STOP condition (P). See Figure 10.
EEPROM Writes (ZL30261 and ZL30263 Only). The EEPROM memory is accessible when the EESEL bit is 1. The
bus master first does an I2C write to transmit the SPI Write Enable command (see Table 3) to the device. The bus
master then does an I2C write to transmit data to the device as described in the Register Write Transactions
paragraph above. See Figure 11.
EEPROM Read Status (ZL30261 and ZL30263 Only). The bus master first does an I2C write to transmit the SPI
Read Status command (see Table 3) to the device. The bus master then does an I2C read to get the status byte. In
this byte, the least significant bit is set to 1 if the transfer is still in progress and 0 if the transfer has completed. See
Figure 12. Similar to read transactions described above, the I2C write and the I2C read cannot be separated by other
I2C bus traffic.
I2C Features Not Supported by the Device. The I2C specification has several optional features that are not
supported by the device. These are: 3.4Mbit/s high-speed mode (Hs-mode), 10-bit device addressing, general call
address, software reset, and device ID. The device does not hold SCL low to force the master to wait.
I2C Slave Address. By default the upper 5 bits of the device’s 7-bit slave address are fixed at 11101 and the lower
2 bits can be pin-configured for any of three values as shown in the table in section 5.2. For a device that can auto-
configure from EEPROM at power-up, its I2C slave address can be set to any value during auto-configuration at
power-up by writing the the I2CA register as part of the configuration script.
Bit Order. The I2C specification requires device address, register address and all data bytes to be transmitted most
significant bit first on the SDA signal.
Note: as required by the I2C specification, when power is removed from the device, the SDA and SCL pins are left
floating so they don’t obstruct the bus lines.
S = START condition
P = STOP condition
A = acknowledge (SDA low)
NA = not acknowledge (SDA high)
slave device
address
read
reg. address
upper byte
reg. address
lower byte
S
S
R/W A
A
A
A
A P
command
7 bits
0 (write)
slave device
address
R/W A data byte1
data byteN NA P
7 bits
1 (read)
Figure 9 - I2C Read Transaction Functional Timing
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Data Sheet
slave device
address
write
command
reg. address
upper byte
reg. address
lower byte
S
R/W A
A
A
A
data byte1
A
data byteN A P
7 bits
S = START condition
P = STOP condition
0 (write)
A = acknowledge (SDA low)
NA = not acknowledge (SDA high)
Figure 10 - I2C Register Write Transaction Functional Timing
S = START condition
P = STOP condition
A = acknowledge (SDA low)
slave device
address
write enable
command
S
S
R/W A
A P
7 bits
NA = not acknowledge (SDA high)
0 (write)
slave device
address
write
command
reg. address
reg. address
lower byte
R/W A
A
A
A
data byte1
A
data byteN A P
upper byte
7 bits
0 (write)
Figure 11 - I2C EEPROM Write Transaction Functional Timing (ZL30261 and ZL30263 Only)
S = START condition
P = STOP condition
A = acknowledge (SDA low)
NA = not acknowledge (SDA high)
slave device
address
read status
command
S
S
R/W A
A P
7 bits
0 (write)
slave device
address
R/W A status byte NA
P
7 bits
1 (read)
Figure 12 - I2C EEPROM Read Status Transaction Functional Timing (ZL30261 and ZL30263 Only)
Note: In Figure 9 through Figure 12, a STOP condition (P) immediately followed by a START condition (S) can be
replaced by a repeated START condition (Sr) as described in the I2C specification.
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5.8 Interrupt Logic
Any of the GPIO pins can be configured as an interrupt-request output by setting the appropriate GPIOxC field in the
GPIOCR registers to one of the status output options (01xx) and configuring the appropriate GPIOxSS register to
follow the INTSR.INT bit. If system software is written to poll rather than receive interrupt requests, then software
can read the INTSR.INT bit first to determine if any interrupt requests are active in the device.
Many of the latched status bits in the device can be the source of an interrupt request if their corresponding interrupt
enable bits are set. The device’s interrupt logic is shown in Figure 13. See the register map (Table 4) and the status
register descriptions in section 6.3.2 for descriptions of the register bits shown in the figure.
OC1SR.STOPL
OC1SR.STOPIE
OC1SR.STARTL
OCISR.OC1
OC1SR.STARTIE
OC1SR.LSCLKL
OC1SR.LSCLKIE
OC2SR.STOPL
OC2SR.STOPIE
OC2SR.STARTL
INTSR.OC
OCISR.OC2
OC2SR.STARTIE
OC2SR.LSCLKL
OC2SR.LSCLKIE
OC10SR.STOPL
OC10SR.STOPIE
OC10SR.STARTL
OC10SR.STARTIE
OC10SR.LSCLKL
OC10SR.LSCLKIE
GPIOn
OCISR.OC10
ICISR.IC1
INTSR.INT
INTSR.INTIE
GPIOnSS
GPIOCRx.GPIOnC
IC1SR.ICVL
IC1SR.ICVIE
IC2SR.ICVL
IC2SR.ICVIE
IC3SR.ICVL
IC3SR.ICVIE
ICISR.IC2
ICISR.IC3
INTSR.IC
APLLSR.ALKL
APLLIE.ALKIE
APLLSR.AIFHL
APLLIE.AIFHIE
APLLSR.AIFLL
APLLIE.AIFLIE
APLLISR.APLL
INTSR.APLL
GPIOSR.GPIOxL
x4
GLOBISR.GPIOxIE
Figure 13 - Interrupt Structure
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Data Sheet
5.9 Reset Logic
The device has three reset controls: the RSTN pin, and the hard reset (HRST) and soft reset (SRST) bits in MCR1.
The RSTN pin asynchronously resets the entire device. When the RSTN pin is low all internal registers are reset to
their default values. When RSTN returns high the device’s auto-configuration boot controller is started. The RSTN
pin must be asserted once after power-up. Reset should be asserted for at least 1µs. See section 5.9.1 below for
important details about using an external RC reset circuit with the RSTN pin.
Asserting the MCR1.HRST (hard reset) bit is functionally similar to asserting the RSTN pin. The HRST bit resets the
entire device except for the microprocessor interface, the HRST bit itself, the I2CA register, and CFGSR.IF[1:0].
While HRST=1 the device accepts register writes so that HRST can be set back to 0, but register reads are not
allowed. When HRST is set back to 0, the TEST and AC[2:0] pins are sampled as described in section 5.2, but, unlike
when RSTN is deasserted, the IF[1:0] pins are not sampled so that the device remains in the same interface mode
(SPI or I2C) and maintains the same slave address when in I2C mode. When HRST is set back to 0, the device’s
auto-configuration boot controller is started after a 1 to 3s delay.
The MCR1.SRST (soft reset) bit resets the entire device except for the microprocessor interface, the SRST bit itself,
the MCR1.HRST bit, the I2CA register, and the CFGSR register. When the SRST bit is asserted the device’s auto-
configuration boot controller is not started.
Microchip recommends holding RSTN low while the internal ring oscillator starts up and stabilizes. An incorrect reset
condition could result if RSTN is released before the oscillator has started up completely.
Important: System software must wait at least 100µs after RSTN is deasserted and wait for GLOBISR.BCDONE=1
before configuring the device.
5.9.1 Design Considerations for Using an External RC Reset Circuit
When the power supply arrangement for the device has VDDH=VDDL (3.3V or 2.5V) an external RC reset circuit
can be used to reset the device during power-up with no additional considerations.
When the power supply arrangement for the device has VDDL=1.8V then the board designer should choose one of
two options: (a) a power-on-reset (POR) chip such as a Texas Instruments TPS3839 should be used instead of an
external RC reset circuit, or (b) the device’s VDDIO pin must be wired to VDDL. In option (a) during the interval
between VDDH ramping and VDDL ramping the RSTN pin can briefly behave as an output driving high. Therefore a
current-limiting series resistor should be used between the POR chip and the device RSTN pin.
The possible disadvantage of option (b) is that VDDIO, the power supply for all SPI/I2C pins and all GPIO pins, could
be too low if neighboring devices operate at power supply voltages higher than VDDL. One exception to this
disadvantage would be the I2C interface. Since I2C’s logic-high voltage is set by pull-up resistors, those resistors
can be externally wired to a voltage higher than VDDIO up to 3.3V. The SCL/SCLK and SDA/MOSI pins are 3.3V
tolerant.
5.10 Power-Supply Considerations
Due to the multi-power-supply nature of the device, some I/Os have parasitic diodes between a lower-voltage supply
and a higher-voltage supply. When ramping power supplies up or down, care must be taken to avoid forward-biasing
these diodes because it could cause latchup. Two methods are available to prevent this. The first method is to place
a Schottky diode external to the device between the lower-voltage supply and the higher-voltage supply to force the
higher-voltage supply to be within one parasitic diode drop of the lower-voltage supply. The second method is to
ramp up the higher-voltage supply first and then ramp up the lower-voltge supply.
Important Note: The voltages on VDDL, VDDIO, and all VDDOx pins must not exceed VDDH. Not complying with
this requirement may damage the device.
5.11 Auto-Configuration from EEPROM or ROM
For ZL30260 and ZL30262, the device optionally can configure itself at reset from an internal ROM. The ROM stores
eight configurations, known as configurations 0 through 7. As described in section 5.2.1, IF[1:0] must be 00, 01 or
10 at reset, and the device configuration to be used is specified by the values of the AC[2:0] pins at reset (0 through
7). Descriptions of the standard-product ROM configurations are available from Microchip.
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For ZL30260 and ZL30262, the device optionally can configure itself at reset from an external EEPROM connected
to its SPI interface. The EEPROM can store up to eight configurations, known as configurations 0 through 7. As
described in section 5.2.1, IF[1:0] must be 11 at reset, and the device configuration to be used is specified by the
values of the AC[2:0] pins at reset (0 through 7).
For ZL30261 and ZL30263, the internal EEPROM memory can store up to eight device configurations, known as
configurations 0 through 7. As described in section 5.2.2, the device configuration to be used is specified by the
values of the AC[2:0] pins at reset.
5.11.1 Generating Device Configurations
Device configurations are most easily generated using the evaluation software. This is true for auto-configurations
stored in internal or external EEPROM and for configurations that are written to the device by a system processor.
See section 5.12 for guidance if device configurations must be developed without using the evaluation software.
5.11.2 Direct EEPROM Write Mode (ZL30261 and ZL30263 Only)
To simplify writing the device’s internal EEPROM during manufacturing, the device has a test mode known as direct
EEPROM write mode. The device enters this mode when TEST=1, AC[2:0]=000 and IF[1:0]=11 on the rising edge
of RSTN. In this mode the EEPROM memory is mapped into the address map and can be written as needed to store
configuration scripts in the device. Device registers are not accessible in this mode. The device exits this mode on
the rising edge of RSTN. Note: the device drives the MISO pin continually during this mode. Therefore this mode
cannot be used when MOSI and MISO are tied together as described in the Design Option: Wiring MOSI and MISO
Together paragraph in section 5.7.1.
5.11.3 Holding Other Devices in Reset During Auto-Configuration
Using the appropriate GPIOCR and GPIO0SS registers, a GPIO pin can be configured to follow the
GLOBISR.BCDONE status bit. This GPIO can then be used as a reset signal to hold other devices (device that use
clocks from this device) in reset while the device configures itself. As an example, to configure GPIO0 to follow
BCDONE with 0=reset add the following writes at the beginning of the configuration file: write 0x1F to GPIO0SS and
write 0x04 to GPIOCR1.
5.12 Configuration Sequence
Device configurations are most easily generated using the evaluation software, which automatically generates
configurations that follow Microchip’s suggested sequence. To develop device configurations manually (i.e. from
device documentation rather than the evaluation software) see Application Note ZLAN-590 for Microchip’s suggested
device configuration sequence.
5.13 Power Supply Decoupling and Layout Recommendations
Application Note ZLAN-592 describes recommended power supply decoupling and layout practices.
5.14 Choosing Among Core Power Supply Options
The device supports the following core supply voltage options:
VDDH
3.3V
3.3V
2.5V
2.5V
VDDL
3.3V
1.8V
2.5V
1.8V
Choosing the best option depends on several factors including supply voltages available on the board, willingness
to use low-dropout (LDO) linear regulators to make local power supplies for the device, board power supply noise
and mitigation strategies, target jitter performance, and how many device resources are enabled.
Starting with the VDDH=VDDL=3.3V option, the advantages of this option are (1) the device only requires a single
power supply voltage (assuming all output driver VDDOx supplies are also 3.3V), and (2) internal regulation is used
for the APLL, maximizing power supply noise rejection. The disadvantage is that power consumption is higher than
other options.
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Data Sheet
The VDDH=3.3V, VDDL=1.8V option does require two core power supply voltages, but internal regulation is used for
the APLL, maximizing power supply noise rejection. Also this option does not have either of the two disadvantages
of the VDDH=VDDL=3.3V option. If the application can provide 3.3V and 1.8V supplies to the device, this option is
highly recommended as a good balance of lower power consumption and better power supply noise rejection.
The VDDH=VDDL=2.5 option is for applications that do not have a 3.3V power supply and do not want to provide an
LDO to make a 3.3V supply. The advantages of this option are (1) the device only requires a single power supply
voltage (assuming all output driver VDDOx supplies are also 2.5V), and (2) lower power consumption than the
VDDH=VDDL=3.3V option. The disadvantage is that internal APLL regulators are bypassed and the APLL runs
directly from the VDDH supply, which leaves the device more susceptible to power supply noise. This susceptibility
can be mitigated using good power supply noise filtering and further mitigated with a dedicated LDO for the device.
The VDDH=2.5V, VDDL=1.8V option provides even lower power consumption than the VDDH=VDDL=2.5V option.
The disadvantages are (1) it requires two core power supply voltages, and (2) just like the VDDH=VDDL=2.5V case,
internal APLL regulators are bypassed and the APLL runs directly from the VDDH supply, which leaves the device
more susceptible to power supply noise. This susceptibility can be mitigated using good power supply noise filtering
and further mitigated with a dedicated LDO for the device.
See application note ZLAN-630 for power supply noise rejection performance.
5.15 Path 2 Signal Selection
In addition to the APLL, the device also provides a non-PLL path through the device called Path 2. See the block
diagram in Figure 1. Path 2 is essentially a built-in fanout buffer with its own input mux. Each bank of outputs can
be connected to the APLL’s integer divider, the APLL’s fractional divider, or Path 2 using the appropriate field in the
OCMUX registers.
The Path 2 input mux can select any of inputs IC1 through IC3, a clock signal on XA, or the crystal driver circuit when
a crystal is connected to XA and XB.
The input to Path 2 can be controlled by a register field or a GPIO pin. When P2CR3.EXTSW=0, the P2CR3.MUX
register field controls the Path 2 input mux.
When P2CR3.EXTSW=1, a GPIO pin controls the Path 2 input mux. When the GPIO pin is low, the mux selects the
input specified by P2CR3.MUX. When the GPIO pin is high, the mux selects the input specified by P2CR3.ALTMUX.
P2CR1.EXTSS specifies which GPIO pin controls this behavior.
The P2SR.SELREF real-time status field indicates Path 2’s selected reference.
6. Register Descriptions
Table 4 shows the register map. In each register, bit 7 is the MSb and bit 0 is the LSb. Register addresses not listed
are reserved. Bits marked “—“ are reserved and must be written with 0. Writing other values to these registers may
put the device in a factory test mode resulting in undefined operation. Bits labeled “0” or “1” must be written with that
value for proper operation. Register fields with underlined names are read-only fields; writes to these fields have no
effect. All other fields are read-write. Register fields are described in detail in the register descriptions that follow
Table 4.
6.1 Register Types
6.1.1 Status Bits
The device has two types of status bits. Real-time status bits are read-only and indicate the state of a signal at the
time it is read. Latched status bits are set when a signal changes state (low-to-high, high-to-low, or both, depending
on the bit) and cleared when written with a logic 1 value. Writing a 0 has no effect. When set, some latched status
bits can cause an interrupt request if enabled to do so by corresponding interrupt enable bits. Status bits marked “—
“ are reserved and must be ignored.
6.1.2 Configuration Fields
Configuration fields are read-write. During reset, each configuration field reverts to the default value shown in the
register definition. Configuration register bits marked “—“ are reserved and must be written with 0.
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Data Sheet
6.1.3 Multiregister Fields
Multiregister fields—such as AFBDIV[41:0] in registers AFBDIV1 through AFBDIV6—must be handled carefully to
ensure that the bytes of the field remain consistent during writes. A write access to a multiregister field is
accomplished by writing all the registers of the field in order from smallest address to largest. Writes to registers other
than the last register in the field (i.e. the register with the largest address) are stored in a transfer register. When the
last register of the field is written, the entire multiregister field is updated simultaneously from the transfer register. If
the last register of the field is not written, the field is not updated.
Read accesses from multiregister fields are the same as normal registers since the multiregister fields are not
modified by the device.
An exception for AFBDIV happens when AFBDL.RDCUR=1. In this case reads come directly from the internal logic
and don’t affect the transfer register. Writes behave the same as above.
The multiregister fields are:
Field
Registers
Type
AFBDIV[41:0]
FDIV[39:0]
AFBDIV1 to AFBDIV6
F1DIV1 to F1DIV5
Read/Write
Read/Write
6.1.4 Bank-Switched Registers (ZL30261 and ZL30263 Only)
The EESEL register is a bank-select control field that maps the device registers into the memory map at address 0x1
and above when the EESEL bit is 0 and maps the EEPROM memory into the memory map at address 0x1 and above
when the EESEL bit is 1. The EESEL register itself is always in the memory map at address 0x0.
6.2 Register Map
Table 4 - Register Map
ADDR
REGISTER
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
Global Configuration Registers
00h
01
02
03
04
05
06
07
08
09
0A
0B
0C
0D
0E
0F
10
11
EESEL
MCR1
MCR2
PLLEN
ICEN
EESEL
SRST
—
HRST
—
STOP
—
—
—
—
—
—
—
ROSCD AINCDIS ODMISO
XAMCK IC3MCK IC2MCK IC1MCK
—
—
—
DBL
—
IC3EN
OC3EN
—
XAB[1:0]
—
—
OC8EN
—
—
—
OC8
—
—
—
OC7EN
—
—
—
OC6EN
—
OCMUXC[1:0]
OCMUXF[1:0]
OC6
—
IC2EN
OC2EN
OC10EN OC9EN
OCMUXA[1:0]
OCMUXD[1:0]
OC2
OC10
APLLEN
IC1EN
OC1EN
—
—
OC5EN
—
OC4EN
—
OCMUXB[1:0]
OCMUXE[1:0]
OC4
OCEN1
OCEN2
—
—
OCMUX1
OCMUX2
STOPCR1
STOPCR2
GPIOCR1
GPIOCR2
GPIO0SS
GPIO1SS
GPIO2SS
GPIO3SS
I2CA
OC7
—
GPIO1C[3:0]
GPIO3C[3:0]
OC5
—
OC3
—
GPIO0C[3:0]
GPIO2C[3:0]
BIT[2:0]
OC1
OC9
—
—
REG[4:0]
REG[4:0]
REG[4:0]
REG[4:0]
BIT[2:0]
BIT[2:0]
BIT[2:0]
—
I2CA[6:0]
Status Registers
30
31
40
ID1
ID2
CFGSR
IDU[7:0]
TEST
IDL[3:0]
REV[3:0]
AC[2:0]
CFGD
—
IF[1:0]
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Data Sheet
ADDR
41
42
43
44
45
46
47
48
49
4A
4C
4D
4E
4F
50
51
52
53
54
55
56
57
58
59
REGISTER
GPIOSR
INTSR
BIT 7
BIT 6
BIT 5
BIT 4
GPIO0L
IC
—
—
OC5
—
—
AIFH
—
—
—
—
BIT 3
GPIO3
—
BIT 2
GPIO2
APLL
BIT 1
BIT 0
GPIO3L GPIO2L GPIO1L
GPIO1
INTIE
GPIO0
INT
—
—
—
—
OC7
—
—
AIFL
—
—
—
—
OC
—
—
OC6
—
—
AIFHL
—
AIFHIE
—
GLOBISR BCDONE
GPIO3IE GPIO2IE GPIO1IE GPIO0IE
ICISR
OCISR1
OCISR2
APLLISR
APLLSR
P2SR
APLLIE
XASR
IC1SR
—
OC8
—
—
AIFLL
—
XA
OC4
—
—
ALKL
—
ALKIE
XAIE
ICVIE
ICVIE
ICVIE
IC3
OC3
—
—
ALK
—
—
XAVL
ICVL
ICVL
IC2
OC2
OC10
—
—
—
—
XAV
ICV
ICV
IC1
OC1
OC9
APLL
SELREF
SELREF
—
AIFLIE
—
—
—
—
—
—
—
—
—
—
—
IC2SR
IC3SR
—
—
—
—
ICVL
ICV
OC1SR
OC2SR
OC3SR
OC4SR
OC5SR
OC6SR
OC7SR
OC8SR
OC9SR
LSCLKIE LSCLKL
LSCLKIE LSCLKL
LSCLKIE LSCLKL
LSCLKIE LSCLKL
LSCLKIE LSCLKL
LSCLKIE LSCLKL
LSCLKIE LSCLKL
LSCLKIE LSCLKL
LSCLKIE LSCLKL
LSCLK STARTIE STARTL
LSCLK STARTIE STARTL
LSCLK STARTIE STARTL
LSCLK STARTIE STARTL
LSCLK STARTIE STARTL
LSCLK STARTIE STARTL
LSCLK STARTIE STARTL
LSCLK STARTIE STARTL
LSCLK STARTIE STARTL
LSCLK STARTIE STARTL
STOPIE
STOPIE
STOPIE
STOPIE
STOPIE
STOPIE
STOPIE
STOPIE
STOPIE
STOPIE
STOPL
STOPL
STOPL
STOPL
STOPL
STOPL
STOPL
STOPL
STOPL
STOPL
STOPD
STOPD
STOPD
STOPD
STOPD
STOPD
STOPD
STOPD
STOPD
STOPD
OC10SR LSCLKIE LSCLKL
APLL Configuration Registers
100
101
102
103
105
106
107
108
109
10A
10B
ACR1
ACR2
ACR3
ACR4
AFBDL
AFBDIV1
AFBDIV2
AFBDIV3
AFBDIV4
AFBDIV5
AFBDIV6
ENFID
—
DALIGN
—
EXTSS[1:0]
USEFDIV ENFDIV
BYPASS
INDBL
—
—
INTDIV[3:0]
INMON
DECPH
EXTFB
EXTSW
ALTMUX[2:0]
PDSS[2:0]
APLLMUX[2:0]
PISS[2:0]
AFBDL[2:0]
INCPH
FBSEL[1:0]
RDCUR
—
AFBDIV[7:0]
AFBDIV[15:8]
AFBDIV[23:16]
AFBDIV[31:24]
AFBDIV[39:32]
—
—
—
—
—
—
AFBDIV[41:40]
10C AFBDEN1
10D AFBDEN2
AFBDEN[7:0]
AFBDEN[15:8]
AFBDEN[23:16]
AFBDEN[31:24]
AFBREM[7:0]
AFBREM[15:8]
AFBREM[23:16]
AFBREM[31:24]
AFBBP[7:0]
10E
10F
110
111
112
113
114
115
116
117
118
AFBDEN3
AFBDEN4
AFBREM1
AFBREM2
AFBREM3
AFBREM4
AFBBP
AIDCR
ASCR
ASCNT1
ASCNT2
DECF
—
FDSS[2:0]
CNTEN[1:0]
INCF
FISS[2:0]
SPRDSS[2:0]
DWNEN
ASCNT[7:0]
ASCNT[15:8]
ENSS
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Data Sheet
ADDR
119
REGISTER
AID1
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
AID[7:0]
11A
11B
11C
AID2
AID3
AID4
AID[15:8]
AID[23:16]
AID[31:24]
APLL Fractional Divider Registers
140
141
142
143
144
145
146
147
148
149
14A
14B
14C
14D
14E
F1CR1
F1DIV1
F1DIV2
F1DIV3
F1DIV4
F1DIV5
F1DEN1
F1DEN2
F1DEN3
F1DEN4
F1REM1
F1REM2
F1REM3
F1REM4
F1BP
MODE[3:0]
—
FDL[2:0]
FDIV[7:0]
FDIV[15:8]
FDIV[23:16]
FDIV[31:24]
FDIV[39:32]
FDEN[7:0]
FDEN[15:8]
FDEN[23:16]
FDEN[31:24]
FREM[7:0]
FREM[15:8]
FREM[23:16]
FREM[31:24]
—
—
FBP[5:0]
Path 2 Configuration Registers
180
182
P2CR1
P2CR3
—
—
DALIGN
EXTSW
EXTSS[1:0]
ALTMUX[2:0]
—
—
1
—
MUX[2:0]
Output Clock Configuration Registers
OC1 Registers
200
201
202
203
204
205
206
207
208
209
OC1CR1
OC1CR2
OC1DIFF
OC1REG
OC1CR3 SRLSEN
OC1DIV1
OC1DIV2
OC1DIV3
OC1DC
OC1PH
PHEN
—
MSDIV[6:0]
POL
VCM[3:0]
DRIVE[1:0]
OCSF[3:0]
VOD[3:0]
VREG[3:0]
—
—
—
—
—
LSSEL
NEGLSD
—
ASQUEL
—
LSDIV[24]
LSDIV[7:0]
LSDIV[15:8]
LSDIV[23:16]
OCDC[7:0]
—
—
—
—
—
PHADJ[3:0]
NEGLSD MODE[1:0]
20A OC1STOP
OC2 Registers
OC2CR1
SRC[3:0]
210
…
…
same as OC1 registers
same as OC1 registers
same as OC1 registers
21A OC2STOP
OC3 Registers
OC3CR1
220
…
…
22A OC3STOP
OC4 Registers
OC4CR1
230
…
…
23A OC4STOP
OC5 Registers
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© 2021 Microchip Technology Inc.
DS20006554A
ZL30260-ZL30263
Data Sheet
ADDR
240
…
REGISTER
OC5CR1
…
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
same as OC1 registers
same as OC1 registers
same as OC1 registers
same as OC1 registers
same as OC1 registers
same as OC1 registers
24A OC5STOP
OC6 Registers
OC6CR1
250
…
…
25A OC6STOP
OC7 Registers
OC7CR1
260
…
…
26A OC7STOP
OC8 Registers
OC8CR1
270
…
…
27A OC8STOP
OC9 Registers
OC9CR1
280
…
…
28A OC9STOP
OC10 Registers
OC10CR1
290
…
…
29A OC10STOP
Input Clock Configuration
300
301
302
303
304
305
XACR1
XACR2
XACR3
IC1CR1
IC2CR1
IC3CR1
—
POL
DISMON
VALTIME[2:0]
XOAMP[7:0]
HSDIV[1:0]
XBCAP[3:0]
XACAP[3:0]
—
—
—
POL
POL
POL
DISMON
DISMON
DISMON
VALTIME[2:0]
VALTIME[2:0]
VALTIME[2:0]
HSDIV[1:0]
HSDIV[1:0]
HSDIV[1:0]
6.3
Register Definitions
6.3.1 Global Configuration Registers
Register Name:
EESEL
Register Description:
Register Address:
EEPROM Memory Selection Register
00h
Bit 7
EESEL
0
Bit 6
—
0
Bit 5
—
0
Bit 4
—
0
Bit 3
—
0
Bit 2
—
0
Bit 1
—
0
Bit 0
—
0
Name
Default
Bit 7: EEPROM Memory Select (EESEL). This bit is a bank-select that specfies whether device register space or
EEPROM memory is mapped into addresses 0x1 and above. This applies only to the ZL30261 and ZL30263. The
ZL30260 and ZL30262 do not have internal EEPROM memory. Note that ROMSEL has priority over EESEL. See
sections 5.7 and 6.1.4.
0 = Device registers
1= EEPROM memory
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Data Sheet
Register Name:
MCR1
Register Description:
Register Address:
Master Configuration Register 1
01h
Bit 7
SRST
0
Bit 6
HRST
0
Bit 5
STOP
0
Bit 4
—
0
Bit 3
ROSCD
0
Bit 2
AINCDIS
0
Bit 1
ODMISO
0
Bit 0
—
0
Name
Default
Bit 7: Soft Reset (SRST). This bit resets the entire device except for the microprocessor interface, the SRST bit
itself, the MCR1.HRST bit, the I2CA register, and CFGSR bits 5:0. When SRST is active, the register fields with pin-
programmed defaults do not latch their values from the corresponding input pins. When the SRST bit is asserted the
device’s auto-configuration boot controller is not started. See section 5.9.
0 = Normal operation
1 = Reset
Bit 6: Hard Reset (HRST). Asserting this bit is functionally equivalent to asserting the RSTN pin. The HRST bit
resets the entire device except for the microprocessor interface and the HRST bit itself. Register fields with pin-
programmed defaults latch their values from the corresponding input pins, and the device’s auto-configuration boot
controller is started. See section 5.9.
0 = Normal operation
1 = Reset
Bit 5: Output Clock Stop (STOP). Asserting this bit stops all output clocks that are configured with
OCxSTOP.SRC=0001. Note that this signal is ORed with the per-output stop control bit in the STOPCR registers to
make each output’s internal stop control signal. See section 5.6.7.
Bit 3: Ring Oscillator Disable (ROSCD). This bit disables the ring oscillator. It can be set to 1 when auto-
configuration is complete. See section 5.3.4.
0 = Enable
1 = Disable (power-down)
Bit 1: Open Drain MISO Enable (ODMISO). This bit configures the MISO pin to be open-drain. When this bit is set,
the MISO pin only drives low and must have an external pullup resistor.
0 = Disable (MISO drives 0 and 1, high-impedance when not driven)
1 = Enable (MISO drives 0 only, high-impedance all other times)
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Data Sheet
Register Name:
MCR2
Register Description:
Register Address:
Master Configuration Register 2
02h
Bit 7
XAMCK
0
Bit 6
IC3MCK
0
Bit 5
IC2MCK
0
Bit 4
IC1MCK
0
Bit 3
—
0
Bit 2
DBL
0
Bit 1
Bit 0
Name
Default
XAB[1:0]
0
0
Bit 7: XA Monitor Clock (XAMCK). Leave this bit set to 0.
Bit 6: IC3 Monitor Clock (IC3MCK). Leave this bit set to 0.
Bit 5: IC2 Monitor Clock (IC2MCK). Leave this bit set to 0.
Bit 4: IC1 Monitor Clock (IC1MCK). Leave this bit set to 0.
Bit 2: Clock Doubler Enable (DBL). This bit enables the clock doubler for either the output of the crystal driver
circuitry or the signal on the XA pin. During power-up, system software must wait at least 5ms for the crystal driver
circuit to stabilize before enabling the clock doubler. See section 5.3.3.
0 = Disable (power down)
1 = Enable
Bits 1 to 0: XA/XB Pin Mode (XAB[1:0]). This field specifies the behavior of the XA and XB pins. See section 5.3.
00 = Crystal driver and input disabled / powered down
01 = Crystal driver and input enabled on XA/XB
10 = XA enabled as single-ended input for external oscillator signal; XB must be left floating
11 = {unused value}
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Data Sheet
Register Name:
PLLEN
Register Description:
Register Address:
APLL Enable Register
03h
Bit 7
—
0
Bit 6
—
0
Bit 5
—
0
Bit 4
—
0
Bit 3
—
0
Bit 2
—
0
Bit 1
—
0
Bit 0
APLLEN
0
Name
Default
Bit 0: APLL Enable (APLLEN). This bit enables or disables the APLL. See section 5.5.4.
0 = Disabled
1 = Enabled
Register Name:
ICEN
Register Description:
Register Address:
Input Clock Enable Register
04h
Bit 7
—
0
Bit 6
—
0
Bit 5
—
0
Bit 4
—
0
Bit 3
—
0
Bit 2
IC3EN
0
Bit 1
IC2EN
0
Bit 0
IC1EN
0
Name
Default
Bit 2: Input Clock 3 Enable (IC3EN). This bit enables and disables the input clock 3 differential receiver and input
dividers. See section 5.4.
0 = Disabled
1 = Enabled
Bit 1: Input Clock 2 Enable (IC2EN). This bit enables and disables the input clock 2 differential receiver and input
dividers. See section 5.4.
0 = Disabled
1 = Enabled
Bit 0: Input Clock 1 Enable (IC1EN). This bit enables and disables the input clock 1 differential receiver and input
dividers. See section 5.4.
0 = Disabled
1 = Enabled
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Data Sheet
Register Name:
OCEN1
Register Description:
Register Address:
Output Clock Enable Register 1
05h
Bit 7
OC8EN
0
Bit 6
OC7EN
0
Bit 5
OC6EN
0
Bit 4
OC5EN
0
Bit 3
OC4EN
0
Bit 2
OC3EN
0
Bit 1
OC2EN
0
Bit 0
OC1EN
0
Name
Default
Bits 7 to 0: Output Clock x Enable (OCxEN). Each of these bits enables and disables the corresponding output
dividers, phase adjustment/alignment circuitry and start/stop circuitry. See section 5.6.1.
0 = Disabled
1 = Enabled
Note: On Rev A devices at least one OCxEN bit must be set for each of the six output banks for proper operation.
These bits should be set at or near the beginning of the configuration sequence.
Register Name:
OCEN2
Register Description:
Register Address:
Output Clock Enable Register 2
06h
Bit 7
—
0
Bit 6
—
0
Bit 5
—
0
Bit 4
—
0
Bit 3
—
0
Bit 2
—
0
Bit 1
OC10EN
0
Bit 0
OC9EN
0
Name
Default
See the OCEN1 register description above.
Register Name:
OCMUX1
Register Description:
Register Address:
Output Clock Mux Register 1
07h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
-
-
OCMUXC
OCMUXB
OCMUXA
Default
0
0
0
0
0
0
0
0
Bits 5 to 4: Output Clock Mux C (OCMUXC[1:0]). Controls the high speed output mux for output group C (OC4
and OC5).
00 = APLL Integer divider
01 = APLL Fractional divider or bypass path (specified by ACR1.BYPASS)
10 = {unused value}
11 = Path 2 (see block diagram in Figure 1)
Bits 3 to 2: Output Clock Mux B (OCMUXB[1:0]). Controls the high speed output mux for output group B (OC3).
00 = APLL Integer divider
01 = APLL Fractional divider or bypass path (specified by ACR1.BYPASS)
10 = {unused value}
11 = Path 2 (see block diagram in Figure 1)
Bits 1 to 0: Output Clock Mux A (OCMUXA[1:0]). Controls the high speed output mux for output group A (OC1
and OC2).
00 = APLL Integer divider
01 = APLL Fractional divider or bypass path (specified by ACR1.BYPASS)
10 = {unused value}
11 = Path 2 (see block diagram in Figure 1)
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© 2021 Microchip Technology Inc.
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Data Sheet
Register Name:
OCMUX2
Register Description:
Register Address:
Output Clock Mux Register 2
08h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
-
-
OCMUXF
OCMUXE
OCMUXD
Default
0
0
0
0
0
0
0
0
Bits 5 to 4: Output Clock Mux F (OCMUXF[1:0]). Controls the high speed output mux for output group F (OC9 and
OC10).
00 = APLL Integer divider
01 = APLL Fractional divider or bypass path (specified by ACR1.BYPASS)
10 = {unused value}
11 = Path 2 (see block diagram in Figure 1)
Bits 3 to 2: Output Clock Mux E (OCMUXE[1:0]). Controls the high speed output mux for output group E (OC8).
00 = APLL Integer divider
01 = APLL Fractional divider or bypass path (specified by ACR1.BYPASS)
10 = {unused value}
11 = Path 2 (see block diagram in Figure 1)
Bits 1 to 0: Output Clock Mux D (OCMUXD[1:0]). Controls the high speed output mux for output group D (OC6
and OC7).
00 = APLL Integer divider
01 = APLL Fractional divider or bypass path (specified by ACR1.BYPASS)
10 = {unused value}
11 = Path 2 (see block diagram in Figure 1)
Register Name:
STOPCR1
Register Description:
Register Address:
Output Clock Stop Control Register 1
09h
Bit 7
OC8STP
0
Bit 6
OC7STP
0
Bit 5
OC6STP
0
Bit 4
OC5STP
0
Bit 3
OC4STP
0
Bit 2
OC3STP
0
Bit 1
OC2STP
0
Bit 0
OC1STP
0
Name
Default
Bit 7: OC8 Stop Control (OC8STP). When SRC=0001 in the OC8STOP register, setting this bit to 1 causes OC8
to stop. Note that this signal is ORed with MCR1.STOP to make OC8’s internal stop control signal. See section 5.6.7.
Bits 6 to 0: These bits are similar to OC8STP above but for OC7 through OC1.
Register Name:
STOPCR2
Register Description:
Register Address:
Output Clock Stop Control Register 2
0Ah
Bit 7
—
Bit 6
—
Bit 5
—
Bit 4
—
Bit 3
—
Bit 2
—
Bit 1
Bit 0
Name
OC10STP OC9STP
Default
0
0
0
0
0
0
0
0
Bits 1 to 0: These bits are similar to STOPCR1.OC8STP but for OC10 and OC9.
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© 2021 Microchip Technology Inc.
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Data Sheet
Register Name:
GPIOCR1
Register Description:
Register Address:
GPIO Configuration Register 1
0Bh
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
GPIO1C[3:0]
GPIO0C[3:0]
Default
0
0
0
0
0
0
0
0
Bits 7 to 4: GPIO1 Configuration (GPIO1C[3:0]). This field configures the GPIO1 pin as a general-purpose input,
a general-purpose output driving low or high, or a status output. The current state of the pin can be read from
GPIOSR.GPIO1. When GPIO1 is a status output, the GPIO1SS register specifies which status bit is output.
0000 = General-purpose input
0001 = General-purpose input - inverted polarity
0010 = General-purpose output driving low
0011 = General-purpose output driving high
0100 = Status output – non-inverted polarity
0101 = Status output - inverted polarity of the status bit it follows
0110 = Status output – 0 drives low, 1 high impedance
0111 = Status output – 0 high impedance, 1 drives low
1000 to 1111 = {unused values}
Bits 3 to 0: GPIO0 Configuration (GPIO0C[3:0]). This field configures the GPIO0 pin as a general-purpose input,
a general-purpose output driving low or high, or a status output. The current state of the pin can be read from
GPIOSR.GPIO0. When GPIO0 is a status output, the GPIO0SS register specifies which status bit is output.
0000 = General-purpose input
0001 = General-purpose input - inverted polarity
0010 = General-purpose output driving low
0011 = General-purpose output driving high
0100 = Status output – non-inverted polarity
0101 = Status output - inverted polarity of the status bit it follows
0110 = Status output – 0 drives low, 1 high impedance
0111 = Status output – 0 high impedance, 1 drives low
1000 to 1111 = {unused values}
Note that the bits of the following registers cannot be internally connected to a GPIO configured as a status output:
GPIOSR, APLLIE.
Register Name:
GPIOCR2
Register Description:
Register Address:
GPIO Configuration Register 2
0Ch
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
GPIO3C[3:0]
GPIO2C[3:0]
Default
0
0
0
0
0
0
0
0
These fields are identical to those in GPIOCR1 except they control GPIO2 and GPIO3.
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Data Sheet
Register Name:
GPIO0SS
Register Description:
Register Address:
GPIO0 Status Select Register
0Dh
Bit 7
Bit 6
Bit 5
REG[4:0]
0
Bit 4
Bit 3
Bit 2
Bit 1
BIT[2:0]
0
Bit 0
Name
Default
0
0
0
0
0
0
Bits 7 to 3: Status Register (REG[4:0]). When GPIOCR1.GPIO0C=01xx, this field specifies the register of the
status bit that GPIO0 will follow while the BIT field below specifies the status bit within the register. Setting the
combination of this field and the BIT field below to point to a bit that isn’t implemented as a real-time or latched status
register bit results in GPIO0 being driven low. The address of the status bit that GPIO0 follows is 0x40 + REG[4:0]
Bits 2 to 0: Status Bit (BIT[2:0]). When GPIOCR1.GPIO0C=01xx, the REG field above specifies the register of the
status bit that GPIO0 will follow while this field specifies the status bit within the register. Setting the combination of
the REG field and this field to point to a bit that isn’t implemented as a real-time or latched status register bit results
in GPIO1 being driven low. 000=bit 0 of the register. 111=bit 7 of the register.
Note: The device does not allow the GPIO status register bits in GPIOSR to be followed by a GPIO.
Register Name:
GPIO1SS
Register Description:
Register Address:
GPIO1 Status Select Register
0Eh
Bit 7
Bit 6
Bit 5
REG[4:0]
0
Bit 4
Bit 3
Bit 2
Bit 1
BIT[2:0]
0
Bit 0
Name
Default
0
0
0
0
0
0
These fields are identical to those in GPIO0SS except they control GPIO1.
Register Name:
GPIO2SS
Register Description:
Register Address:
GPIO2 Status Select Register
0Fh
Bit 7
Bit 6
Bit 5
REG[4:0]
0
Bit 4
Bit 3
Bit 2
Bit 1
BIT[2:0]
0
Bit 0
Name
Default
0
0
0
0
0
0
These fields are identical to those in GPIO0SS except they control GPIO2.
Register Name:
GPIO3SS
Register Description:
Register Address:
GPIO3 Status Select Register
10h
Bit 7
Bit 6
Bit 5
REG[4:0]
0
Bit 4
Bit 3
Bit 2
Bit 1
BIT[2:0]
0
Bit 0
Name
Default
0
0
0
0
0
0
These fields are identical to those in GPIO0SS except they control GPIO3.
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Data Sheet
Register Name:
I2CA
Register Description:
Register Address:
I2C Address register 1
11h
Bit 7
0
0
Bit 6
Bit 5
Bit 4
Bit 3
I2CA[6:0]
0
Bit 2
Bit 1
Bit 0
Name
Default
1
1
1
1
See below
Bits 6 to 0: I2C Address (I2CA[6:0]). This field specifies the device’s address on the I2C bus. At the assertion of the
RSTN pin, bits 6:2 are set to the default values shown above, and bits 1:0 are set to the states of the IF1 and IF0
pins. The MCR1.HRST and MCR1.SRST bits have no effect on these bits. After reset these bits can be written by
system software to change the device’s I2C address as needed. Note: the value I2CA=0 is invalid.
6.3.2 Status Registers
Register Name:
ID1
Register Description:
Register Address:
Device Identification Register, MSB
30h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
IDU[7:0]
Bit 2
Bit 1
Bit 0
Name
Default
0
0
0
1
1
1
see below
Bits 7 to 0: Device ID Upper (IDU[7:0]). This field is the upper eight bits of the device ID.
Register Name:
ID2
Register Description:
Register Address:
Device Identification Register, LSB and Revision
31h
Bit 7
Name
Default
Bit 6
IDL[3:0]
see below
Bit 5
Bit 4
Bit 3
Bit 2
REV[3:0]
contract factory
Bit 1
Bit 0
Bits 7 to 4: Device ID Lower (IDL[3:0]). This field is the lower four bits of the device ID.
ZL30260 = 0x1D0
ZL30261 = 0x1F0
ZL30262 = 0x1D1
ZL30263 = 0x1F1
Bits 3 to 0: Device Revision (REV[3:0]). These bits are the device hardware revision starting at 0.
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Data Sheet
Register Name:
CFGSR
Register Description:
Register Address:
Configuration Status Register
40h
Bit 7
CFGD
0
Bit 6
—
0
Bit 5
Bit 4
Bit 3
TEST
see below
Bit 2
Bit 1
AC[2:0]
see below
Bit 0
Name
Default
IF[1:0]
see below
`
Bit 7: Configured (CFGD). This read-only bit is cleared by assertion of RSTN, MCR1.HRST or MCR1.SRST and
set when any register is written (by auto-configuration or through the processor interface). CFGD=1 indicates that
the device register set is no longer in factory-default state, and, therefore, the device must be reset before a GUI-
generated configuration script is executed.
Bits 5 to 4: Interface Mode (IF[1:0]). These read-only bits are the latched state of the IF1/MISO and IF0/CSN pins
when the RSTN pin transitions high. See section 5.2.
Bit 3: Test Mode (TEST). This read-only bit is the latched state of the TEST/GPIO3 pin when the RSTN pin
transitions high or the MCR1.HRST bit is deasserted. For proper operation it should be 0. See section 5.2.
Bits 2 to 0: Auto-Configuration (AC[2:0]). These bits are the latched state of the AC2/GPIO2, AC1/GPIO1 and
AC0/GPIO0 pins when the RSTN pin transitions high or the MCR1.HRST bit is deasserted. See section 5.2.
Register Name:
GPIOSR
Register Description:
Register Address:
GPIO Status Register
41h
Bit 7
GPIO3L
0
Bit 6
GPIO2L
0
Bit 5
GPIO1L
0
Bit 4
GPIO0L
0
Bit 3
GPIO3
pin state pin state
Bit 2
GPIO2
Bit 1
GPIO1
pin state
Bit 0
GPIO0
pin state
Name
Default
Bit 7: GPIO3 Change Latched Status (GPIO3L). This latched status bit is set to 1 when the GPIO3 status bit
changes state, low-to-high or high-to-low. GPIO3L is cleared when written with a 1. When GPIO3L is set it can cause
an interrupt request if the GPIO3IE interrupt enable bit is set.
Bit 6: GPIO2 Change Latched Status (GPIO2L). This latched status bit is set to 1 when the GPIO2 status bit
changes state, low-to-high or high-to-low. GPIO2L is cleared when written with a 1. When GPIO2L is set it can cause
an interrupt request if the GPIO2IE interrupt enable bit is set.
Bit 5: GPIO1 Change Latched Status (GPIO1L). This latched status bit is set to 1 when the GPIO1 status bit
changes state, low-to-high or high-to-low. GPIO1L is cleared when written with a 1. When GPIO1L is set it can cause
an interrupt request if the GPIO1IE interrupt enable bit is set.
Bit 4: GPIO0 Change Latched Status (GPIO0L). This latched status bit is set to 1 when the GPIO0 status bit
changes state, low-to-high or high-to-low. GPIO0L is cleared when written with a 1. When GPIO0L is set it can cause
an interrupt request if the GPIO0IE interrupt enable bit is set.
Bit 3: GPIO3 State (GPIO3). This real-time status bit indicates the current state of the GPIO3 pin, not influenced by
any inversion that may be specified by GPIOCR2.GPIO3C.
0 = low
1 = high
Bit 2: GPIO2 State (GPIO2). This real-time status bit indicates the current state of the GPIO2 pin, not influenced by
inversion that may be specified by GPIOCR2.GPIO2C.
0 = low
1 = high
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Bit 1: GPIO1 State (GPIO1). This real-time status bit indicates the current state of the GPIO1 pin, not influenced by
inversion that may be specified by GPIOCR1.GPIO1C.
0 = low
1 = high
Bit 0: GPIO0 State (GPIO0). This real-time status bit indicates the current state of the GPIO0 pin, not influenced by
inversion that may be specified by GPIOCR1.GPIO0C.
0 = low
1 = high
Register Name:
INTSR
Register Description:
Register Address:
Interrupt Status Register
42h
Bit 7
—
0
Bit 6
—
0
Bit 5
OC
0
Bit 4
IC
0
Bit 3
—
0
Bit 2
APLL
0
Bit 1
INTIE
0
Bit 0
INT
0
Name
Default
Bit 5: Output Clock Interrupt Status (OC). This read-only bit is set if any of the output clock interrupt status bits
are set in the OCISR1 register. See section 5.8.
Bit 4: Input Clock Interrupt Status (IC). This read-only bit is set if any of the input clock interrupt status bits are set
in the ICISR register. See section 5.8.
Bit 2: APLL Interrupt Status (APLL). This read-only bit is set if any of the APLL interrupt status bits are set in the
APLLISR register. See section 5.8.
Bit 1: Interrupt Enable Bit (INTIE). This is the global interrupt enable bit. When this bit is 0 all interrupt sources are
prevented from setting the INT global interrupt status bit (below). See section 5.8.
0 = Interrupts are disabled at the global level
1 = Interrupts are enabled at the global level
Bit 0: Interrupt Status (INT). This read-only bit is set when any of the IC, OC or APLL bits in this INTSR register are
set and the INTIE bit is set. It is also set by GPIO latched status bits that have their corresponding interrupt enable
bits set. This bit can cause an interrupt request when set by configuring one of the GPIO pins to follow it. See section
5.8.
0 = No interrupt
1 = An unmasked interrupt source is active
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Register Name:
GLOBISR
Register Description:
Register Address:
Global Functions Interrupt Status Register
43h
Bit 7
BCDONE
see below
Bit 6
—
0
Bit 5
—
0
Bit 4
—
0
Bit 3
Bit 2
Bit 1
GPIO1IE
0
Bit 0
GPIO0IE
0
Name
Default
GPIO3IE GPIO2IE
0
0
Bit 7: Boot Controller Done (BCDONE). This bit indicates the status of the on-chip boot controller, which performs
auto-configuration from ROM or EEPROM. It is cleared when the device is reset and set after the boot controller
finishes auto-configuration of the device. See section 5.11.
Note that BCDONE cannot be polled while the device is auto-configuring because the internal register bus is in use.
The BCDONE bit was designed to be followed by a GPIO pin configured as a status output. To cause GPIO0, for
example, to follow BCDONE, include the following settings at the beginning of the auto-configuration script:
GPIOCR1=0x04 (configures GPIO0 as a non-inverted status output) and GPIO0SS=00011 111b (causes GPIO0 to
follow the bit at register 0x43, bit 7, which is BCDONE).
Alternately, there is a way to poll the device to determine whether auto-configuration is complete. This involves
choosing a writeable bit that (a) has a harmless effect, such as GLOBISR.GPIO3IE, and (b) is not set during auto-
configuration. System software can then poll the device by writing the register to set the bit then reading the register
to see if the bit is set. The bit cannot be set by system software while the device is auto-configuring. Therefore when
it is found to be set auto-configuration must be complete.
Bit 3: GPIO3 Change Interrupt Enable (GPIO3IE). This bit enables the GPIOSR.GPIO3L latched status bit to send
an interrupt request into the device’s interrupt logic.
0 = Interrupt is disabled
1 = Interrupt is enabled
Bit 2: GPIO2 Change Interrupt Enable (GPIO2IE). This bit enables the GPIOSR.GPIO2L latched status bit to send
an interrupt request into the device’s interrupt logic.
0 = Interrupt is disabled
1 = Interrupt is enabled
Bit 1: GPIO1 Change Interrupt Enable (GPIO1IE). This bit enables the GPIOSR.GPIO1L latched status bit to send
an interrupt request into the device’s interrupt logic.
0 = Interrupt is disabled
1 = Interrupt is enabled
Bit 0: GPIO0 Change Interrupt Enable (GPIO0IE). This bit enables the GPIOSR.GPIO0L latched status bit to send
an interrupt request into the device’s interrupt logic.
0 = Interrupt is disabled
1 = Interrupt is enabled
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Register Name:
ICISR
Register Description:
Register Address:
Input Clock Interrupt Status Register
44h
Bit 7
—
0
Bit 6
—
0
Bit 5
—
0
Bit 4
—
0
Bit 3
XA
0
Bit 2
IC3
0
Bit 1
IC2
0
Bit 0
IC1
0
Name
Default
Bit 3: XA Input Interrupt Status (XA). This bit indicates the current status of the interrupt sources for XA. This bit
is set when latched status XASR.XAL is set and the associated interrupt enable bit is also set. See section 5.8.
Bit 2 to 0: Input Clock x Interrupt Status (IC[3:1]). Each bit indicates the current status of the interrupt sources for
the corresponding input. It is set when latched status ICxSR.ICVL is set and the associated interrupt enable bit is
also set. See section 5.8.
Register Name:
OCISR1
Register Description:
Register Address:
Output Clock Interrupt Status Register 1
45h
Bit 7
OC8
0
Bit 6
OC7
0
Bit 5
OC6
0
Bit 4
OC5
0
Bit 3
OC4
0
Bit 2
OC3
0
Bit 1
OC2
0
Bit 0
OC1
0
Name
Default
Bits 7 to 0: Output Clock x Interrupt Status (OC[8:1]). Each bit indicates the current status of the interrupt sources
for the corresponding output. It is set when any latched status bit in the OCxSR register is set and the associated
interrupt enable bit is also set. See section 5.8.
Register Name:
OCISR2
Register Description:
Register Address:
Output Clock Interrupt Status Register 2
46h
Bit 7
—
0
Bit 6
—
0
Bit 5
—
0
Bit 4
—
0
Bit 3
—
0
Bit 2
—
0
Bit 1
OC10
0
Bit 0
OC9
0
Name
Default
See the OCISR1 register description above.
Register Name:
APLLISR
Register Description:
Register Address:
APLL Interrupt Status Register
47h
Bit 7
—
0
Bit 6
—
0
Bit 5
—
0
Bit 4
—
0
Bit 3
—
0
Bit 2
—
0
Bit 1
—
0
Bit 0
APLL
0
Name
Default
Bit 0: APLL Interrupt Status (APLL). This bit indicates the current status of the interrupt sources for the APLL. It is
set when any latched status bit in the APLLSR register is set and the associated interrupt enable bit is also set. See
section 5.8.
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Register Name:
APLLSR
Register Description:
Register Address:
APLL Status Register
48h
Bit 7
AIFLL
0
Bit 6
AIFL
0
Bit 5
AIFHL
0
Bit 4
AIFH
0
Bit 3
ALKL
0
Bit 2
ALK
0
Bit 1
—
0
Bit 0
SELREF
0
Name
Default
Bit 7: APLL Input Frequency Low Latched Status (AIFLL). This latched status bit is set to 1 when the AIFL status
bit is set. AIFLL is cleared when written with a 1. When AIFLL is set it can cause an interrupt request if the AIFLIE
interrupt enable bit is set.
Bit 6: APLL Input Frequency Low Status (AIFL). This real-time status bit indicates that the input frequency to the
APLL is lower that expected.
0 = Input frequency ok
1 = Input frequency low
Bit 5: APLL Input Frequency High Latched Status (AIFHL). This latched status bit is set to 1 when the AIFH status
bit is set. AIFHL is cleared when written with a 1. When AIFHL is set it can cause an interrupt request if the AIFHIE
interrupt enable bit is set.
Bit 4: APLL Input Frequency High Status (AIFH). This real-time status bit indicates that the input frequency to the
APLL is higher that expected.
0 = Input frequency ok
1 = Input frequency high
Bit 3: APLL Lock Latched Status (ALKL). This latched status bit is set to 1 when the ALK status bit changes state
(set or cleared). ALKL is cleared when written with a 1. When ALKL is set it can cause an interrupt request if the
ALKIE interrupt enable bit is set.
Bit 2: APLL Lock Status (ALK). This real-time status bit indicates the lock status of the APLL. See section 5.5.
0 = Not locked
1 = Locked
Bit 0: Selected Reference (SELREF). This real-time status field indicates the APLL’s selected reference. See
section 5.5.3.
0 = The input specified by ACR3.APLLMUX
1 = The input specified by ACR3.ALTMUX
Register Name:
P2SR
Register Description:
Register Address:
Path 2 Status Register
49h
Bit 7
—
0
Bit 6
—
0
Bit 5
—
0
Bit 4
—
0
Bit 3
—
0
Bit 2
—
0
Bit 1
—
0
Bit 0
SELREF
0
Name
Default
Bit 0: Selected Reference (SELREF). This real-time status field indicates Path 2’s selected reference. See section
5.15.
0 = The input specified by P2CR3.MUX
1 = The input specified by P2CR3.ALTMUX
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Register Name:
APLLIE
Register Description:
Register Address:
APLL Interrupt Enable Register
4Ah
Bit 7
AIFLIE
0
Bit 6
—
0
Bit 5
AIFHIE
0
Bit 4
—
0
Bit 3
ALKIE
0
Bit 2
—
0
Bit 1
—
0
Bit 0
—
0
Name
Default
Bit 7: APLL Input Frequency Low Interrupt Enable (AIFLIE). This bit enables the AIFLL latched status bit to send
an interrupt request into the device’s interrupt logic.
0 = Interrupt is disabled
1 = Interrupt is enabled
Bit 5: APLL Input Frequency High Interrupt Enable (AIFHIE). This bit enables the AIFHL latched status bit to send
an interrupt request into the device’s interrupt logic.
0 = Interrupt is disabled
1 = Interrupt is enabled
Bit 3: APLL Lock Interrupt Enable (ALKIE). This bit enables the ALKL latched status bit to send an interrupt request
into the device’s interrupt logic.
0 = Interrupt is disabled
1 = Interrupt is enabled
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Register Name:
XASR
Register Description:
Register Address:
XA Input Status Register
4Ch
Bit 7
—
0
Bit 6
—
0
Bit 5
—
0
Bit 4
—
0
Bit 3
XAVIE
0
Bit 2
XAVL
0
Bit 1
XAV
0
Bit 0
—
0
Name
Default
The fields in the register are the same as the fields in the ICxSR registers except they apply to the XA input.
Register Name:
ICxSR
Register Description:
Register Address:
Input Clock Status Register
IC1: 4Dh, IC2: 4Eh, IC3: 4Fh
Bit 7
—
0
Bit 6
—
0
Bit 5
—
0
Bit 4
—
0
Bit 3
ICVIE
0
Bit 2
ICVL
0
Bit 1
ICV
0
Bit 0
—
0
Name
Default
Bit 3: Input Clock Valid Interrupt Enable (ICVIE). This bit enables the ICxSR.ICVL latched status bit to send an
interrupt request into device’s interrupt logic.
0 = Interrupt is disabled
1 = Interrupt is enabled
Bit 2: Input Clock Valid Latched (ICVL). This latched status bit is set to 1 when the ICxSR.ICV status bit changes
state (set or cleared). This bit is cleared when written with a 1 and not set again until the ICxSR.ICV bit changes state
again. This bit can be the source of an interrupt request. See section 5.5.2.
0 = ICxSR.ICV bit has not changed state since last cleared
1 = ICxSR.ICV bit has changed state since last cleared
Bit 1: Input Clock Valid (ICV). This real-time status bit is high when the input clock monitor indicates the input is
valid. See section 5.5.2.
0 = The input clock is not valid
1 = The input clock is valid
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Register Name:
OCxSR
Register Description:
Register Address:
Output Clock x Status Register
OC1: 50h, OC2: 51h, OC3: 52h, OC4: 53h, OC5: 54h
OC6: 55h, OC7: 56h, OC8: 57h, OC9: 58h, OC10: 59h
Bit 7
LSCLKIE
0
Bit 6
LSCLKL
0
Bit 5
LSCLK
0
Bit 4
STARTIE
0
Bit 3
STARTL
0
Bit 2
STOPIE
0
Bit 1
STOPL
0
Bit 0
STOPD
0
Name
Default
Bit 7: (LSCLKIE). This bit enables the LSCLKL latched status bit to send an interrupt request into device’s interrupt
logic.
0 = Interrupt is disabled
1 = Interrupt is enabled
Bit 6: (LSCLKL). This latched status bit is set when the low-speed divider output clock transitions low-to-high.
Writing a 1 to this bit clears it.
0 = Low speed output clock has not transitioned low to high
1 = Low speed output clock has transitioned low to high
Bit 5: (LSCLK). This real-time status bit follows the level of the low-speed divider output clock when the
OCxCR3.SRLSEN bit is set.
0 = LSCLK is high
1 = LSCLK is low
Bit 4: (STARTIE). This bit enables the STARTL latched status bit to send an interrupt request into device’s interrupt
logic.
0 = Interrupt is disabled
1 = Interrupt is enabled
Bit 3: (STARTL). This latched status bit is set when the output clock signal has been started after being stopped.
Writing a 1 to this bit clears it. See section 5.6.6.
0 = Output clock signal has not resumed from being stopped
1 = Output clock signal has resumed from being stopped
Bit 2: (STOPIE). This bit enables the STOPL latched status bit to send an interrupt request into device’s interrupt
logic.
0 = Interrupt is disabled
1 = Interrupt is enabled
Bit 1: (STOPL). This latched status bit is set when the output clock signal has been stopped. Writing a 1 to this bit
clears it. See section 5.6.6.
0 = Output clock signal has not stopped
1 = Output clock signal has stopped
Bit 0: (STOPD). This real-time status bit is high when the output clock signal is stopped and low when the output
clock is not stopped. See section 5.6.6.
0 = Output clock signal is not stopped
1 = Output clock signal is stopped
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6.3.3 APLL Configuration Registers
Register Name:
ACR1
Register Description:
Register Address:
APLL Configuration Register 1
100h
Bit 7
ENFID
0
Bit 6
DALIGN
0
Bit 5
EXTSS[1:0]
0
Bit 4
Bit 3
USEFDIV
0
Bit 2
ENFDIV
0
Bit 1
BYPASS
0
Bit 0
INDBL
0
Name
Default
0
Bit 7: Enable Frequency Increment/Decrement (ENFID). This bit enables frequency increment/decrement
behavior as described in section 5.5.7.
Bit 6: Align Output Dividers (DALIGN). A 0-to-1 transition on this bit causes a simultaneous reset of the medium-
speed dividers and the low-speed dividers for all output clocks where OCxCR1.PHEN=1. After this reset all PHEN=1
output clocks with frequencies that are exactly integer multiples of one another will be rising-edge aligned as specified
by their OCxPH registers. This bit should be set then cleared once during system startup. Setting this bit during
normal system operation can cause phase jumps in the output clock signals.
Bits 5 to 4: External Switch Source Select (EXTSS[1:0]). This field selects the GPIO source for the external switch
control signal. It is only valid when ACR3.EXTSW=1. See section 5.5.1.
00 = GPIO0
01 = GPIO1
10 = GPIO2
11 = GPIO3
Bit 3: Use Fractional Divider (USEFDIV). This bit controls which resource the spread spectrum logic controls. See
section 5.5.8.2.
0 = APLL feedback divider
1 = fractional output divider
Bit 2: Enable Fractional Divider (ENFDIV). This bit is an enable/disable control for the APLL’s fractional divider.
When the fractional divider is disabled, device power consumption is reduced as shown in Table 6. The fractional
divider is enabled when PLLEN.APLLEN=1, ENFDIV=1 and ACR1.BYPASS=0.
0 = Disable
1 = Enable
Bit 1: Bypass APLL and Fractional Divider (BYPASS). This bit controls selection between the APLL’s fractional
divider and the APLL’s bypass path as shown in Figure 1. The mux that provides the bypass signal to this mux is
controlled by APLLMUX and related fields in ACR3.
0 = No bypass
1 = Bypass
Bit 0: APLL Input Doubler Enable (INDBL). This bit enables a simple clock doubler at the input to the APLL. This
feature allows signals from IC1, IC2 or IC3 to be doubled which often can result in lower output jitter. See section
5.3.3.
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Register Name:
ACR2
Register Description:
Register Address:
APLL Configuration Register 2
101h
Bit 7
—
Bit 6
—
Bit 5
—
Bit 4
—
Bit 3
Bit 2
Bit 1
Bit 0
Name
INTDIV[3:0]
Default
0
0
0
0
0
1
0
0
Bits 3 to 0: APLL Integer Divider (INTDIV[3:0]). This field controls the APLL’s integer divider (see Figure 5). See
section 5.5.4.
0000 = Divide by 4
0001 = Divide by 4.5
0010 = Divide by 5
0011 = Divide by 5.5
0100 = Divide by 6 (default)
0101 = Divide by 6.5
0110 = Divide by 7
1000 = Divide by 8
1001 = Divide by 9
1010 = Divide by 10
1011 = Divide by 11
1100 = Divide by 12
1101 = Divide by 13
1110 = Divide by 14
1111 = Divide by 15
0111 = Divide by 7.5
Register Name:
ACR3
Register Description:
Register Address:
APLL Configuration Register 3
102h
Bit 7
INMON
0
Bit 6
EXTSW
0
Bit 5
Bit 4
ALTMUX[2:0]
0
Bit 3
Bit 2
Bit 1
APLLMUX[2:0]
1
Bit 0
Name
Default
0
0
0
1
Bit 7: APLL Input Monitor Switching Mode (INMON). This bit enables the APLL input monitor loss of signal
reference switching mode. In this mode, if the input specified by the APLLMUX field satisfies the loss-of-signal
condition, the APLL input mux will switch to the input specified by the ALTMUX field. See section 5.5.3.
Bit 6: APLL External Switching Mode (EXTSW). This bit enables APLL external reference switching mode. In this
mode, if the selected GPIO signal is low the APLL input mux is controlled by ACR3.APLLMUX. If the selected GPIO
signal is high the APLL input mux is controlled by ACR3.ALTMUX. ACR1.EXTSS specifies which GPIO pin controls
this behavior. See section 5.5.3.
Bits 5 to 3: APLL Alternate Mux Control (ALTMUX[2:0]). This field specifies the alternate APLL clock source for
external switching (when EXTSW=1) and for automatic switching based on monitor status (when EXTSW=0 an
INMON=1). See section 5.5.3.
000 = IC1 input (default)
001 = IC2 input
010 = IC3 input
011 = XA not doubled
100 = XA doubled (must have MCR2.DBL =1)
101-111 = {reserved values}
Bits 2 to 0: APLL Mux Control (APLLMUX[2:0]). By default this field controls the APLL input mux. It also specifies
the primary APLL clock source for external switching (when EXTSW=1) and for automatic switching based on monitor
status (when EXTSW=0 and INMON=1). See section 5.5.3.
000 = IC1 input
001 = IC2 input
010 = IC3 input
011 = XA not doubled (default)
100 = XA doubled (must have MCR2.DBL =1)
101-111 = {reserved values}
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Register Name:
ACR4
Register Description:
Register Address:
APLL Configuration Register 4
103h
Bit 7
DECPH
0
Bit 6
Bit 5
PDSS[2:0]
0
Bit 4
Bit 3
INCPH
0
Bit 2
Bit 1
PISS[2:0]
0
Bit 0
Name
Default
0
0
0
0
Bit 7: Decrement Phase (DECPH). When PDSS=000, this bit is the APLL phase decrement control signal. See
section 5.5.9.
Bits 6 to 4: Phase Decrement Source Select (PDSS[2:0]). This field specifies the APLL phase decrement control
signal. Every low-to-high transition and every high-to-low transition of the signal decrements the APLL’s output
phase. See section 5.5.9.
000 = DECPH bit
001 = GPIO0
010 = GPIO1
011 = GPIO2
100 = GPIO3
101 to 111 = {unused values}
Bit 3: Increment Phase (INCPH). When PISS=000, this bit is the APLL phase increment control signal. See section
5.5.9.
Bits 2 to 0: Phase Increment Source Select (PISS[2:0]). This field specifies the APLL phase increment control
signal. Every low-to-high transition and every high-to-low transition of the signal increments the APLL’s output phase.
See section 5.5.9.
000 = INCPH bit
001 = GPIO0
010 = GPIO1
011 = GPIO2
100 = GPIO3
101 to 111 = {unused values}
Register Name:
AFBDL
Register Description:
Register Address:
APLL Feedback Divider Write Length
105h
Bit 7
EXTFB
0
Bit 6
Bit 5
Bit 4
RDCUR
0
Bit 3
—
0
Bit 2
Bit 1
AFBDL[2:0]
0
Bit 0
Name
Default
FBSEL[1:0]
0
0
1
1
Bit 7: External Feedback Enable (EXTFB).
0 = Internal feedback through the APLL’s fractional feedback divider
1 = External feedback (typically for output vs. input phase alignment)
Bits 6 to 5: External Feedback Select (FBSEL[1:0]). When EXTFB=1, this field specifies the external feedback
path.
00 = from any OCx output through external path to IC1 input to APLL’s feedback input
01 = from any OCx output through external path to IC2 input to APLL’s feedback input
10 = from any OCx output through external path to IC3 input to APLL’s feedback input
11 = from OC1 output through internal (on-die) path to APLL’s feedback input
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Bit 4: Read Current AFBDIV Value (RDCUR). See section 5.5.7. The system must not cause any frequency
increments or decrements during the read of the current APLL feedback divider value; otherwise the bytes of the
value read may not be coherent.
0 = Read the original APLL feedback divider value written to the AFBDIV registers by system software
1 = Read the current APLL feedback divider value after increments and decrements
Bits 2 to 0: APLL Feedback Divider Write Length (AFBDL[2:0]). This field indicates the last register to write of
the AFBDIV multiregister field where “last register” is as described in section 6.1.3. The number of the last register
to write is AFBDL+1. The default of 5 specifies AFBDIV6 as described in section 6.1.3. Changing this field from its
default value can be useful in NCO mode to reduce SPI or I2C bus usage when NCO changes only affect the least
significant bytes of AFBDIV.
Register Name:
AFBDIV1
Register Description:
Register Address:
APLL Feedback Divider Register 1
106h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
AFBDIV[7:0]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: APLL Feedback Divider Register (AFBDIV[7:0]). The full 42-bit AFBDIV[41:0] field spans the AFBDIV1
through AFBDIV6 registers. AFBDIV is an unsigned number with 9 integer bits (AFBDIV[41:33]) and up to 33
fractional bits. AFBDIV specifies the fixed-point term of the APLL's fractional feedback divide value. The value
AFBDIV=0 is undefined. Unused least significant bits must be written with 0. See section 5.5.4.
Register Name:
AFBDIV2
Register Description:
Register Address:
APLL Feedback Divider Register 2
107h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
AFBDIV[15:8]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: APLL Feedback Divider Register (AFBDIV[15:8]). See the AFBDIV1 register description.
Register Name:
AFBDIV3
Register Description:
Register Address:
APLL Feedback Divider Register 3
108h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
AFBDIV[23:16]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: APLL Feedback Divider Register (AFBDIV[23:16]). See the AFBDIV1 register description.
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Register Name:
AFBDIV4
Register Description:
Register Address:
APLL Feedback Divider Register 4
109h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
AFBDIV[31:24]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: APLL Feedback Divider Register (AFBDIV[31:24]). See the AFBDIV1 register description.
Register Name:
AFBDIV5
Register Description:
APLL Feedback Divider Register 5
Register Address:
10Ah
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
AFBDIV[39:32]
Default
1
0
0
1
0
1
1
0
Bits 7 to 0: APLL Feedback Divider Register (AFBDIV[39:32]). See the AFBDIV1 register description.
Register Name:
AFBDIV6
Register Description:
Register Address:
APLL Feedback Divider Register 6
10Bh
Bit 7
—
Bit 6
—
Bit 5
—
Bit 4
—
Bit 3
—
Bit 2
—
Bit 1
AFBDIV[41:40]
Bit 0
Name
Default
0
0
0
0
0
0
0
0
Bits 1 to 0: APLL Feedback Divider Register (AFBDIV[41:40]). See the AFBDIV1 register description.
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Register Name:
AFBDEN1
Register Description:
Register Address:
APLL Feedback Divider Denominator Register 1
10Ch
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
AFBDEN[7:0]
Default
0
0
0
0
0
0
0
1
Bits 7 to 0: APLL Feedback Divider Denominator Register (AFBDEN[7:0]). The full 32-bit AFBDEN[31:0] field
spans AFBDEN1 through AFBDEN4 registers. AFBDEN is an unsigned integer that specifies the denominator of the
APLL's fractional feedback divide value. The value AFBDEN=0 is undefined. When AFBBP=0, AFBDEN must be set
to 1. See section 5.5.4.
Register Name:
AFBDEN2
Register Description:
Register Address:
APLL Feedback Divider Denominator Register 2
10Dh
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
AFBDEN[15:8]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: APLL Feedback Divider Denominator Register (AFBDEN[15:8]). See the AFBDEN1 register
description.
Register Name:
AFBDEN3
Register Description:
Register Address:
APLL Feedback Divider Denominator Register 3
10Eh
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
AFBDEN[23:16]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: APLL Feedback Divider Denominator Register (AFBDEN[23:16]). See the AFBDEN1 register
description.
Register Name:
AFBDEN4
Register Description:
Register Address:
APLL Feedback Divider Denominator Register 4
10Fh
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
AFBDEN[31:24]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: APLL Feedback Divider Denominator Register (AFBDEN[31:24]). See the AFBDEN1 register
description.
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Register Name:
AFBREM1
Register Description:
Register Address:
APLL Feedback Divider Remainder Register 1
110h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
AFBREM[7:0]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: APLL Feedback Divider Remainder Register (AFBREM[7:0]). The full 32-bit AFBDEN[31:0] field
spans AFBREM1 through AFBREM4 registers. AFBREM is an unsigned integer that specifies the remainder of the
APLL's fractional feedback divider value. See section 5.5.4.
Register Name:
AFBREM2
Register Description:
Register Address:
APLL Feedback Divider Remainder Register 2
111h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
AFBREM[15:8]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: APLL Feedback Divider Remainder Register (AFBREM[15:8]). See the AFBREM1 register
description.
Register Name:
AFBREM3
Register Description:
Register Address:
APLL Feedback Divider Remainder Register 3
112h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
AFBREM[23:16]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: APLL Feedback Divider Remainder Register (AFBREM[23:16]). See the AFBREM1 register
description.
Register Name:
AFBREM4
Register Description:
Register Address:
APLL Feedback Divider Remainder Register 4
113h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
AFBREM[31:24]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: APLL Feedback Divider Remainder Register (AFBREM[31:24]). See the AFBREM1 register
description.
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Register Name:
AFBBP
Register Description:
Register Address:
APLL Feedback Divider Truncate Bit Position
114h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
AFBBP[7:0]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: APLL Feedback Divider Truncate Bit Position (AFBBP[7:0]). This unsigned integer specifies the
number of fractional bits that are valid in the AFBDIV value. There are 33 fractional bits in AFBDIV. The value in this
AFBBP field specifies 33 – number_of_valid_AFBDIV_fractional_bits. When AFBBP=0 all 33 AFBDIV fractional bits
are valid. When AFBBP=9, the most significant 24 AFBDIV fractional bits are valid and the least significant 9 bits
must be set to 0. This register field is only used when the feedback divider value is expressed in the form AFBDIV +
AFBREM / AFBDEN. AFBBP values greater than 33 are invalid. See section 5.5.4.
Register Name:
AIDCR
Register Description:
Register Address:
APLL Frequency Increment-Decrement Configuration Register
115h
Bit 7
DECF
0
Bit 6
Bit 5
FDSS[2:0]
0
Bit 4
Bit 3
INCF
0
Bit 2
Bit 1
FISS[2:0]
0
Bit 0
Name
Default
0
0
0
0
Bit 7: Decrement Frequency (DECF). When FDSS=000, this bit is the APLL frequency decrement control signal.
See section 5.5.7.
Bits 6 to 4: Frequency Decrement Source Select (FDSS[2:0]). This field specifies the APLL frequency decrement
control signal. Every low-to-high transition and every high-to-low transition of the signal decrements the APLL’s
output frequency by the amount specified by AID[23:0] x 27. See section 5.5.7.
000 = DECF bit
001 = GPIO0
010 = GPIO1
011 = GPIO2
100 = GPIO3
101 to 111 = {unused values}
Bit 3: Increment Frequency (INCF). When FISS=000, this bit is the APLL frequency increment control signal. See
section 5.5.7.
Bits 2 to 0: Frequency Increment Source Select (FISS[2:0]). This field specifies the APLL frequency increment
control signal. Every low-to-high transition and every high-to-low transition of the signal increments the APLL’s output
frequency by the amount specified by AID[23:0] x 27. See section 5.5.7.
000 = INCF bit
001 = GPIO0
010 = GPIO1
011 = GPIO2
100 = GPIO3
101 to 111 = {unused values}
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Register Name:
ASCR
Register Description:
Register Address:
APLL Spread Spectrum Configuration Register 1
116h
Bit 7
—
0
Bit 6
CNTEN[1:0]
0
Bit 5
Bit 4
DWNEN
0
Bit 3
SSEN
0
Bit 2
Bit 1
SPRDSS[2:0]
0
Bit 0
Name
Default
0
0
0
Bits 6 to 5: Count Enable (CNTEN[1:0]). This field can be used to specify a count, or divide, value to divide the
APLL feedback divider clock down as needed for clocking the spread-spectrum logic when doing spread-spectrum
modulation in the fractional output divider. See section 5.5.8.2.
Bit 4: Spread Spectrum Down Only (DWNEN). Spread spectrum frequency modulation can be either center-spread
or down-spread. See section 5.5.8.
0 = Center-spread
1 = Down-spread
Bit 3: Spread Spectrum Enable (SSEN). When SPRDSS (see below) is set to 000, this bit enables spread spectrum
modulation in the APLL. See section 5.5.8.
Bits 2 to 0: Spread Spectrum Enable Source Select (SPRDSS[2:0]). This field specifies the APLL spread
spectrum enable control signal. See section 5.5.8.
000 = SSEN bit
001 = GPIO0
010 = GPIO1
011 = GPIO2
100 = GPIO3
101 to 111 = {unused values}
Register Name:
ASCNT1
Register Description:
Register Address:
APLL Spread Spectrum Count Register 1
117h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
ASCNT[7:0]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: APLL Spread-Spectrum Count (ASCNT[7:0]). The full 16-bit ASCNT[15:0] register spans this register
and ASCNT2. ASCNT is an unsigned integer that specifies the number of cycles of the APLL’s input clock that the
device increments the output frequency and then the number of cycles that the device decrements the output
frequency. See section 5.5.8.
Register Name:
ASCNT2
Register Description:
Register Address:
APLL Spread Spectrum Count Register 1
118h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
ASCNT[15:8]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: APLL Spread-Spectrum Count (ASCNT[15:8]). See the ASCNT1 register description.
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Register Name:
AID1
Register Description:
Register Address:
APLL Increment/Decrement Register 1
119h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
AID[7:0]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: APLL Increment/Decrement (AID[7:0]). The full 32-bit AID[31:0] register spans this register through
AID4. It is an unsigned integer. There are two uses for this field: frequency increment/decrement, and spread
spectrum modulation. The two uses are mutually-exclusive, i.e. only one can be in use at a time.
For frequency increment/decrement, AID[23:0] x 27 is added to the APLL’s feedback divider value each time the
trigger specified by AIDCR.FISS changes state. AID[23:0] x 27 is subtracted from the APLL’s feedback divider value
each time the trigger specified by AIDCR.FDSS changes state. AID[31:24] is ignored for frequency
increment/decrement. ACR1.USEFDIV must be set to 0 for this behavior. See section 5.5.7.
For spread spectrum modulation, the full 32-bit AID[31:0] value is subtracted (decremented) and added
(incremented) to the zero PPM value every APLL input clock cycle for the number of clock cycles specified by the
ASCNT registers. The zero PPM value is the nominal AFBDIV register value (when ACR1.USEFDIV=0) or the
nominal fractional output divider value (when ACR1.USEFDIV=1). See section 5.5.8.
Register Name:
AID2
Register Description:
Register Address:
APLL Increment/Decrement Register 2
11Ah
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
AID[15:8]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: APLL Increment/Decrement (AID[15:8]). See the AID1 register description.
Register Name:
AID3
Register Description:
Register Address:
APLL Increment/Decrement Register 3
11Bh
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
AID[23:16]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: APLL Increment/Decrement (AID[23:16]). See the AID1 register description.
Register Name:
AID4
Register Description:
Register Address:
APLL Increment/Decrement Register 4
11Ch
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
AID[31:24]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: APLL Increment/Decrement (AID[31:24]). See the AID1 register description.
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Register Name:
F1CR1
Register Description:
Register Address:
APLL Fractional Output Divider Control Register 1
140h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
—
0
Bit 2
Bit 1
FDL[2:0]
0
Bit 0
Name
Default
MODE[3:0]
0
0
0
0
1
0
Bits 7 to 4: APLL Fractional Output Divider Mode (MODE[3:0]).
0000 = Normal, divider-only operation
0001 = NCO or spread-spectrum operation
Other values reserved
Bits 2 to 0: APLL Fractional Output Divider Write Length (FDL[2:0]). This field indicates the last register to write
of the FDIV multiregister field where “last register” is as described in section 6.1.3. The number of the last register to
write is FDL+1. Changing this field from its default value can be useful in NCO mode to reduce SPI or I2C bus usage
when NCO changes only affect the least significant bytes of FDIV.
Register Name:
F1DIV1
Register Description:
Register Address:
APLL Fractional Output Divider Register 1
141h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
FDIV[7:0]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: Fractional Output Divider Value (FDIV[7:0]). The full 40-bit FDIV[39:0] field spans the F1DIV1 through
F1DIV5 registers. FDIV is an unsigned number with 4 integer bits (FDIV[39:36]) and up to 36 fractional bits. FDIV
specifies the fixed-point term of the fractional output divider value. The value FDIV=0 is undefined. Unused least
significant bits must be written with 0. See section 5.5.5.
Register Name:
F1DIV2
Register Description:
Register Address:
APLL Fractional Output Divider Register 2
142h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
FDIV[15:8]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: Fractional Output Divider Value (FDIV[15:8]). See the F1DIV1 register description.
Register Name:
F1DIV3
Register Description:
Register Address:
APLL Fractional Output Divider Register 3
143h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
FDIV[23:16]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: Fractional Output Divider Value (FDIV[23:16]). See the F1DIV1 register description.
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Register Name:
F1DIV4
Register Description:
Register Address:
APLL Fractional Output Divider Register 4
144h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
FDIV[31:24]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: Fractional Output Divider Value (FDIV[31:24]). See the F1DIV1 register description.
Register Name:
F1DIV5
Register Description:
Register Address:
APLL Fractional Output Divider Register 2
145h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
FDIV[39:32]
Default
1
0
0
1
0
1
1
0
Bits 7 to 0: Fractional Output Divider Value (FDIV[39:32]). See the F1DIV1 register description.
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Register Name:
F1DEN1
Register Description:
Register Address:
APLL Fractional Output Divider Denominator Register 1
146h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
FDEN[7:0]
Default
0
0
0
0
0
0
0
1
Bits 7 to 0: Fractional Output Divider Denominator (FDEN[7:0]). The full 32-bit FDEN[31:0] field spans F1DEN1
through F1DEN4 registers. FDEN is an unsigned integer that specifies the denominator of the fractional output divider
value. The value FDEN=0 is undefined. See section 5.5.5.
Register Name:
F1DEN2
Register Description:
Register Address:
APLL Fractional Output Divider Denominator Register 2
147h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
FDEN[15:8]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: Fractional Output Divider Denominator (FDEN [15:8]). See the F1DEN1 register description.
Register Name:
F1DEN3
Register Description:
Register Address:
APLL Fractional Output Divider Denominator Register 3
148h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
FDEN[23:16]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: Fractional Output Divider Denominator (FDEN [23:16]). See the F1DEN1 register description.
Register Name:
F1DEN4
Register Description:
Register Address:
APLL Fractional Output Divider Denominator Register 4
149h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
FDEN[31:24]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: Fractional Output Divider Denominator (FDEN [31:24]). See the F1DEN1 register description.
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Register Name:
F1REM1
Register Description:
Register Address:
APLL Fractional Output Divider Remainder Register 1
14Ah
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
FREM[7:0]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: Fractional Output Divider Remainder (FREM[7:0]). The full 32-bit FREM[31:0] field spans F1REM1
through F1REM4 registers. FREM is an unsigned integer that specifies the remainder of the fractional output divider
value. See section 5.5.5.
Register Name:
F1REM2
Register Description:
Register Address:
APLL Fractional Output Divider Remainder Register 2
14Bh
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
FREM[15:8]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: Fractional Output Divider Remainder (FREM [15:8]). See the F1REM1 register description.
Register Name:
F1REM3
Register Description:
Register Address:
APLL Fractional Output Divider Remainder Register 3
14Ch
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
FREM[23:16]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: Fractional Output Divider Remainder (FREM [23:16]). See the F1REM1 register description.
Register Name:
F1REM4
Register Description:
Register Address:
APLL Fractional Output Divider Remainder Register 4
14Dh
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
FREM[31:24]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: Fractional Output Divider Remainder (FREM [31:24]). See the F1REM1 register description.
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Register Name:
F1BP
Register Description:
Register Address:
APLL Fractional Output Divider Truncate Bit Position
14Eh
Bit 7
—
Bit 6
—
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
FBP[5:0]
Default
0
0
0
0
0
0
0
0
Bits 5 to 0: APLL Fractional Output Divider Truncate Bit Position (FBP[5:0]). This unsigned integer specifies
the number of fractional bits that are valid in the fractional output divider value (FDIV). There are 36 fractional bits in
FDIV. The value in this FBP field specifies 36 – number_of_valid_FDIV_fractional_bits. When FBP=0 all 36 FDIV
fractional bits are valid. When FBP=12, the most significant 24 FDIV fractional bits are valid and the least significant
12 bits must be set to 0. This register field is only used when the feedback divider value is expressed in the form
FDIV + FREM / FDEN. FBP values greater than 36 are invalid. See section 5.5.5.
6.3.4 Path 2 Configuration Registers
Register Name:
P2CR1
Register Description:
Register Address:
Path 2 Configuration Register 1
180h
Bit 7
—
0
Bit 6
DALIGN
0
Bit 5
EXTSS[1:0]
0
Bit 4
Bit 3
—
0
Bit 2
—
0
Bit 1
1
1
Bit 0
—
0
Name
Default
0
Bit 6: Align Output Dividers (DALIGN). A 0-to-1 transition on this bit causes a simultaneous reset of the medium-
speed dividers and the low-speed dividers for all output clocks where OCxCR1.PHEN=1. After this reset all PHEN=1
output clocks with frequencies that are exactly integer multiples of one another will be rising-edge aligned as specified
by their OCxPH registers. This bit should be set then cleared once during system startup. Setting this bit during
normal system operation can cause phase jumps in the output clock signals.
Bits 5 to 4: External Switch Source Select (EXTSS[1:0]). This field selects the GPIO source for the external switch
control signal. It is only valid when P2CR3.EXTSW=1. See section 5.5.1.
00 = GPIO0
01 = GPIO1
10 = GPIO2
11 = GPIO3
Register Name:
P2CR3
Register Description:
Register Address:
Path 2 Configuration Register 3
182h
Bit 7
—
0
Bit 6
EXTSW
0
Bit 5
Bit 4
ALTMUX[2:0]
0
Bit 3
Bit 2
Bit 1
MUX[2:0]
1
Bit 0
Name
Default
0
0
0
1
Bit 6: Path 2 External Switching Mode (EXTSW). This bit enables Path 2 external reference switching mode. In
this mode, if the selected GPIO signal is low the Path 2 input mux is controlled by P2CR1.MUX. If the selected GPIO
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signal is high the Path 2 input mux is controlled by P2CR1.ALTMUX. P2CR1.EXTSS specifies which GPIO pin
controls this behavior. See section 5.15.
Bits 5 to 3: Path 2 Alternate Mux Control (ALTMUX[2:0]). This field specifies the alternate Path 2 clock source for
external switching (when EXTSW=1). See section 5.15.
000 = IC1 input (default)
001 = IC2 input
010 = IC3 input
011 = XA input (not doubled)
100-111 = {reserved values}
Bits 2 to 0: Path 2 Mux Control (MUX[2:0]). By default this field controls the Path 2 input mux. It also specifies the
primary Path 2 clock source for external switching (when EXTSW=1). See section 5.15.
000 = IC1 input
001 = IC2 input
010 = IC3 input
011 = XA input (not doubled) (default)
100-111 = {reserved values}
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6.3.5 Output Clock Configuration Registers
Register Name:
OCxCR1
Register Description:
Register Address:
Output Clock x Configuration Register 1
OC1: 200h, OC2: 210h, OC3: 220h, OC4: 230h, OC5: 240h
OC6: 250h, OC7: 260h, OC8: 270h, OC9: 280h, OC10: 290h
Bit 7
PHEN
0
Bit 6
Bit 5
Bit 4
Bit 3
MSDIV[6:0]
0
Bit 2
Bit 1
Bit 0
Name
Default
0
0
0
0
0
0
Bit 7: Phase Alignment Enable (PHEN). This bit enables this output to participate in phase alignment. See section
5.6.5.
0 = Phase alignment disabled for this output
1 = Phase alignment enabled for this output
Bits 6 to 0: Medium-Speed Divider Value (MSDIV[6:0]). This field specifies the setting for the output clock's
medium-speed divider. The divisor is MSDIV+1. Note that if MSDIV is not set to 0 (bypass) then the maximum input
clock frequency to the medium-speed divider is 750MHz and the maximum output clock frequency from the medium-
speed divider is 375MHz. When MSDIV=0, the medium-speed divider, phase adjust, low-speed divider, start/stop
and output duty cycle adjustment circuits are bypassed and the high-frequency clock signal is sent to the directly
output driver. See section 5.6.2.
Register Name:
OCxCR2
Register Description:
Register Address:
Output Clock x Configuration Register 2
OC1: 201h, OC2: 211h, OC3: 221h, OC4: 231h, OC5: 241h
OC6: 251h, OC7: 261h, OC8: 271h, OC9: 281h, OC10: 291h
Bit 7
—
0
Bit 6
POL
0
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
Default
DRIVE[1:0]
OCSF[3:0]
0
0
0
0
0
0
Bit 6: Clock Path Polarity (POL). The clock path to the output driver is inverted when this bit set. This does not
invert the LSDIV path to the CMOS OCxN pin if that path is enabled. See section 5.6.1.
Bits 5 to 4: CMOS/HSTL Output Drive Strength (DRIVE[1:0]). The CMOS/HSTL output drivers have four equal
sections that can be enabled or disabled to achieve four different drive strengths from 1x to 4x. When the output
power supply VDDOx is 3.3V or 2.5V, the user should start with 1x and only increase drive strength if the output is
highly loaded and signal transition time is unacceptable. When VDDOx is 1.8V or 1.5V the user should start with 4x
and only decrease drive strength if the output signal has unacceptable overshoot. See section 5.6.1.
00 = 1x
01 = 2x
10 = 3x
11 = 4x
Bits 3 to 0: Output Clock Signal Format (OCSF[3:0]). See section 5.6.1.
0000 = Disabled (high-impedance, low power mode)
0001 = LVDS
0010 = Differential (default is LVPECL with VCM=1.2V, programmable using OCxDIFF fields)
0011 = HSTL (set OCxCR2.DRIVE=11 (4x) to meet JESD8-6)
(VOD is forced to 400mV and OCxDIFF.VOD is ignored)
0100 = Two CMOS: OCxN in phase with OCxP
0101 = One CMOS: OCxP enabled, OCxN high impedance
0110 = One CMOS: OCxP high impedance, OCxN enabled
0111 = Two CMOS: OCxN inverted vs. OCxP
1010 = HCSL
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Register Name:
OCxDIFF
Register Description:
Register Address:
Output Clock x Start Stop Register
OC1: 202h, OC2: 212h, OC3: 222h, OC4: 232h, OC5: 242h
OC6: 252h, OC7: 262h, OC8: 272h, OC9: 282h, OC10: 292h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
VCM[3:0]
VOD[3:0]
Default
0
0
0
0
0
1
0
1
Bits 7 to 4: Differential Common-Mode Voltage (VCM[3:0]). This field specifies the common-mode voltage for the
differential output driver. See section 5.6.1.
0000 = 1.23V (default) – typical for LVDS and AC-coupled LVPECL
0011 = 1.0V
0100 = 1.1V
0101 = 1.3V
0110 = 1.4V
0111 = 1.5V
1000 = 1.6V
1001 = 1.7V
1010 = 1.8V
1011 = 1.9V
1100 = 2.0V – typical for DC-coupled LVPECL
1101 = 2.1V
1111 = Use this setting for HCSL signal format
All other values reserved
Bits 3 to 0: Differential Swing Voltage (VOD[3:0]). This field specifies the differential output voltage (VOD) for the
differential output driver. In the device this field actually controls driver output current. When the specified current is
driven into the required external 100 termination resistor, the voltage across the termination resistor is the desired
VOD. See Figure 16 for the definition of VOD. VOD is equivalent to the single-ended voltage swing of the OCxP pin or
the OCxN pin. This field is ignored and VOD is set to 400mV when OCxCR2.OCSF=0001 (LVDS). See section 5.6.1.
0000 = 300mV (3mA driver current)
0001 = 400mV – typical for LVDS
0010 = 500mV
0011 = 600mV
0100 = 700mV
0101 = 800mV – default value, typical for LVPECL
0110 = 900mV (9mA driver current)
1010 = Use this setting for HCSL signal format
All other values reserved
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Register Name:
OCxREG
Register Description:
Register Address:
Output Clock x Regulator Control Register
OC1: 203h, OC2: 213h, OC3: 223h, OC4: 233h, OC5: 243h
OC6: 253h, OC7: 263h, OC8: 273h, OC9: 283h, OC10: 293h
Bit 7
—
Bit 6
—
Bit 5
—
Bit 4
—
Bit 3
Bit 2
Bit 1
Bit 0
Name
VREG[3:0]
Default
0
0
0
0
0
0
0
0
Bits 3 to 0: Regulator Voltage (VREG[3:0]). This field specifies the power supply regulator voltage for the differential
output driver. Set this to at least VCM+VOD/2+0.5V. Max value is 2.2V when VDDOx is 2.5V, and max value is 2.9V
when VDDOx is 3.3V. See section 5.6.1.
0000 = 2.2V (default) – typical for LVDS and AC-coupled LVPECL
0010 = 2.0V
0011 = 2.2V
0100 = 2.25V
0101 = 2.4V
0111 = 2.5V
1000 = 2.7V
1001 = 2.75V
1010 = 2.8V
1011 = 2.9V – typical for DC-coupled LVPECL
1100 = 3.0V
1111 = Use this setting for HCSL signal format
All other values reserved
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Register Name:
OCxCR3
Register Description:
Register Address:
Output Clock x Configuration Register 3
OC1: 204h, OC2: 214h, OC3: 224h, OC4: 234h, OC5: 244h
OC6: 254h, OC7: 264h, OC8: 274h, OC9: 284h, OC10: 294h
Bit 7
SRLSEN
0
Bit 6
—
0
Bit 5
NEGLSD
0
Bit 4
LSSEL
0
Bit 3
—
0
Bit 2
ASQUEL
0
Bit 1
—
0
Bit 0
LSDIV[24]
0
Name
Default
Bit 7: Enable LSDIV Statuses (SRLSEN). This bit enables the OCxSR.LSCLK real-time status bit and its associated
latched status bit OCxSR.LSCLKL.
0 = LSCLK status bit is not enabled (low)
1 = LSCLK status bit is enabled
Bit 5: OCxN Low Speed Divider (NEGLSD). This bit selects the source of the clock on the OCxN pin in CMOS
mode. See section 5.6.2.
0 = Same as OCxP
1 = Output of the LSDIV divider
Note: NEGLSD should only be set to one in two-CMOS mode (OCxCR2.OCSF=100 or 111), when
OCxCR2.POL=0, and when OCxCR3.LSSEL=0.
Bit 4: LSDIV Select (LSSEL). This bit selects the source of the output clock. When the MSDIV divider is selected
(LSSEL=0) the LSDIV divider output can be independently selected as the source for the OCxN pin (in CMOS output
mode) or monitored by the OCxSR.LSCLK status bit. This bit is only valid when OCxCR1.MSDIV > 0. See section
5.6.2.
0 = The output clock is sourced from the MSDIV divider.
1 = The output clock is sourced from the LSDIV divider.
Bit 2: Auto-Squelch Enable (ASQUEL). This bit enables automatic squelching of the output clock whenever (a)
automatic input switching is enabled for the APLL, and (b) the input monitors indicate that the inputs specified by the
APLL’s APLLMUX and ALTMUX fields are both invalid. OCxSTOP.MODE specifies the type of stop (high, low, high-
impedance) and the output clock edge on which to stop. When a differential output or a CMOS complementary output
is squelched, its OCxN pin is opposite polarity of its OCxP pin.
0 = Auto-squelch disabled
1 = Auto-squelch enabled
Bit 0: Low-Speed Divider Value (LSDIV[24]). See the OCxDIV1 register description.
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Register Name:
OCxDIV1
Register Description:
Register Address:
Output Clock x Divider Register 1
OC1: 205h, OC2: 215h, OC3: 225h, OC4: 235h, OC5: 245h
OC6: 255h, OC7: 265h, OC8: 275h, OC9: 285h, OC10: 295h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
LSDIV[7:0]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: Low-Speed Divider Value (LSDIV[7:0]). The full 25-bit LSDIV[24:0] field spans this register, OCxDIV2,
OCxDIV3. and bit 0 of OCxCR3. LSDIV is an unsigned integer. The frequency of the clock from the medium-speed
divider is divided by LSDIV+1. The OCxCR3.LSSEL and NEGLSD bits control when the output of the low-speed
divider is present on the OCxP and OCxN output pins. OCxCR1.MSDIV must be > 0 for the low-speed divider to
operate. See section 5.6.2.
Register Name:
OCxDIV2
Register Description:
Register Address:
Output Clock x Divider Register 2
OC1: 206h, OC2: 216h, OC3: 226h, OC4: 236h, OC5: 246h
OC6: 256h, OC7: 266h, OC8: 276h, OC9: 286h, OC10: 296h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
LSDIV[15:8]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: Low-Speed Divider Value (LSDIV[15:8]). See the OCxDIV1 register description.
Register Name:
OCxDIV3
Register Description:
Register Address:
Output Clock x Divider Register 3
OC1: 207h, OC2: 217h, OC3: 227h, OC4: 237h, OC5: 247h
OC6: 257h, OC7: 267h, OC8: 277h, OC9: 287h, OC10: 297h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
LSDIV[23:16]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: Low-Speed Divider Value (LSDIV[23:16]). See the OCxDIV1 register description.
Register Name:
OCxDC
Register Description:
Register Address:
Output Clock x Duty Cycle Register
OC1: 208h, OC2: 218h, OC3: 228h, OC4: 238h, OC5: 248h
OC6: 258h, OC7: 268h, OC8: 278h, OC9: 288h, OC10: 298h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
OCDC[7:0]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: Output Clock Duty Cycle (OCDC[7:0]). This field controls the output clock signal duty cycle when
MSDIV>0 and LSDIV>1. When OCDC = 0 the output clock is 50%. Otherwise the clock signal is a pulse with a width
of OCDC number of MSDIV output clock periods. The range of OCDC can create pulse widths from 1 to 255 MSDIV
output clock periods. When OCxCR2.POL=0, the pulse is high and the signal is low the remainder of the cycle. When
POL=1, the pulse is low and the signal is high the remainder of the cycle. See section 5.6.3.
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Register Name:
OCxPH
Register Description:
Register Address:
Output Clock x Phase Adjust Register
OC1: 209h, OC2: 219h, OC3: 229h, OC4: 239h, OC5: 249h
OC6: 259h, OC7: 269h, OC8: 279h, OC9: 289h, OC10: 299h
Bit 7
—
Bit 6
—
Bit 5
—
Bit 4
—
Bit 3
Bit 2
Bit 1
Bit 0
Name
PHADJ[3:0]
Default
0
0
0
0
0
0
0
0
Bits 3 to 0: Phase Adjust Value (PHADJ[3:0]). This field can be used to adjust the phase of an output clock vs. the
phase of other clock outputs. The adjustment is in units of bank source clock cycles. For example, if the bank source
clock is 625MHz (from the APLL for example) then one bank source clock cycle is 1.6ns, the smallest phase
adjustment is 0.8ns, and the adjustment range is ±5.6ns. Negative values mean earlier in time (leading) and positive
values mean later in time (lagging). See section 5.6.4.
0000 = 0 bank source clock cycles
0001 = 0.5
1000 = -1.0 bank source clock cycles
1001 = -0.5
0010 = 1.0
1010 = -2.0
0011 = 1.5
1011 = -1.5
0100 = 2.0
1100 = -3.0
0101 = 2.5
1101 = -2.5
0110 = 3.0
1110 = -4.0
0111 = 3.5
1111 = -3.5
Register Name:
OCxSTOP
Register Description:
Register Address:
Output Clock x Start Stop Register
OC1: 20Ah, OC2: 21Ah, OC3: 22Ah, OC4: 23Ah, OC5: 24Ah
OC6: 25Ah, OC7: 26Ah, OC8: 27Ah, OC9: 28Ah, OC10: 29Ah
Bit 7
—
0
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
NEGLSD
1
Bit 1
Bit 0
Name
Default
SRC[3:0]
MODE[1:0]
0
0
0
1
0
0
Bits 6 to 3: Output Clock Stop Source (SRC[3:0]). This field specifies the source of the stop signal. See section
5.6.7.
0000 = Never stop
0001 = Logical OR of (the global MCR1.STOP bit) or (the OCx stop bit in the STOPCR registers)
0010 to 0111 = {unused values}
1000 = GPIO0
1001 = GPIO1
1010 = GPIO2
1011 = GPIO3
1100 to 1111 = {unused values}
Bit 2: NEGLSD Stop Behavior (NEGLSD). When an output pair is configured for two different frequencies in
2xCMOS mode (see section 5.6.2) this bit specifies the stop behavior for the pair. This field allows the user to trade
off stop reaction time vs. possible short pulse on the NEG pin.
0 = Stop when higher-speed POS signal has the appropriate edge (see MODE field below)
1 = Stop when lower-speed NEG signal has the appropriate edge.
Setting this bit to 1 guarantees no short high/low time for the POS signal and for the NEG signal, but stopping can
take a long time when the NEG pin is very low frequency, such as 2kHz or even 1Hz.
Setting this bit to 0 allows stopping to happen faster because it depends only on the frequency of the POS signal,
but the NEG signal may have a short high or low time when it stops. For some applications, such as when NEG is a
1 pulse per second (PPS) signal, a short high or low time when NEG stops may not matter because NEG is essentially
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a data signal (phase alignment or time alignment signal that is latched by a POS signal edge) rather than a true clock
signal.
Bits 1 to 0: Output Clock Stop Mode (MODE[1:0]). This field selects the mode of the start-stop function. See
section 5.6.6.
00 = Stop Low: stop after falling edge of output clock, start after rising edge of output clock
01 = Stop High: stop after rising edge of output clock, start after falling edge of output clock
10 = Stop Low then go high-impedance: stop after falling edge, start after rising edge
11 = Stop High then go high-impedance: stop after rising edge, start after falling edge
The following table shows which pin(s) stop high or low as specified above for each output signal format:
Signal Format
OCxCR2.OCSF Pin that Stops As Specified
LVDS, LVPECL, Programmable Differential
HSTL
001 or 010
011
OCxP
OCxP
Two CMOS, OCxP in phase with OCxN
One CMOS, OCxN enabled
One CMOS, OCxP enabled
Two CMOS, OCxN inverted vs. OCxP
100
101
110
111
OCxP and OCxN
OCxN
OCxP
OCxP
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6.3.6 Input Clock Configuration Registers
Register Name:
XACR1
Register Description:
Register Address:
XA Input Clock Configuration Register 1
300h
Bit 7
—
0
Bit 6
POL
0
Bit 5
DISMON
0
Bit 4
Bit 3
VALTIME[2:0]
0
Bit 2
Bit 1
Bit 0
Name
Default
HSDIV[1:0]
0
0
0
0
Bit 6: Input Polarity (POL). This field specifies which input clock edge the APLL will lock to. See section 5.5.1.
0 = Rising edge
1 = Falling edge
Bit 5: Disable Signal Going to the Monitor (DISMON).
0 = XA signal is provided to the XA monitor
1 = XA signal is not provided to the XA monitor
Bits 4 to 2: Input Validation Time (VALTIME[2:0]). The input clock monitor only declares the XA input clock valid
if it has no missing edges in the interval specified by this field. See section 5.5.2.
000 = 1 cycle
001 = 4 cycles
010 = 16 cycles
011 = 64 cycles
100 = 256 cycles
101 = 1024 cycles
110 - 111 = {unused values}
Bits 1 to 0: Input Clock High-Speed Divider (HSDIV[1:0]). This field specifies the divide value for the XA input
clock divider. This field should not be set to 01 at the same time MCR2.DBL=1. See section 5.5.1.
00 = Divide by 1
01 = Divide by 2
10, 11 = {unused values}
Register Name:
XACR2
Register Description:
Register Address:
XA Input Clock Configuration Register 2
301h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
XOAMP[7:0]
Default
0
0
0
0
0
0
0
0
Bits 7 to 0: XO Amplifier Control (XOAMP[7:0]). Set this value as follows for the recommended 10pF crystal
(values in decimal). Contact Microchip apps support for XOAMP values for crystals with other load capacitances.
Crystal
Max Crystal Drive
Frequency (MHz)
100W
200W
80
72
72
80
80
88
88
96
300W
152
136
136
136
136
136
136
136
25
30
35
40
45
50
55
60
0
0
0
8
8
16
16
24
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Register Name:
XACR3
Register Description:
Register Address:
XA Input Clock Configuration Register 3
302h
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Name
XBCAP[3:0]
XACAP[3:0]
Default
0
0
0
0
0
0
0
0
Bits 7 to 4: XB Internal Capacitor Selection (XBCAP[3:0]). Actual internal capacitance on the XB pin in pF is
approximately 6 + XBCAP. See section 5.3.2.
Bits 3 to 0: XA Internal Capacitor Selection (XACAP[3:0]). Actual internal capacitance on the XA pin in pF is
approximately 6 + XACAP. See section 5.3.2.
Register Name:
ICxCR1
Register Description:
Register Address:
Input Clock x Configuration Register 1
IC1: 303h, IC2: 304h, IC3: 305h
Bit 7
—
0
Bit 6
POL
0
Bit 5
DISMON
0
Bit 4
Bit 3
VALTIME[2:0]
0
Bit 2
Bit 1
Bit 0
Name
Default
HSDIV[1:0]
0
0
0
0
Bit 6: Input Polarity (POL). This field specifies which input clock edge the APLL will lock to. See section 5.5.1.
0 = Rising edge
1 = Falling edge
Bit 5: Disable Signal Going to the Monitor (DISMON).
0 = ICx signal is provided to the ICx monitor
1 = ICx signal is not provided to the ICx monitor
Bits 4 to 2: Input Validation Time (VALTIME[2:0]). The input clock monitor only declares the input clock valid if it
has no missing edges in the interval specified by this field. See section 5.5.2.
000 = 1 cycle
001 = 4 cycles
010 = 16 cycles
011 = 64 cycles
100 = 256 cycles
101 = 1024 cycles
110 - 111 = {unused values}
Bits 1 to 0: Input Clock High-Speed Divider (HSDIV[1:0]). This field specifies the divide value for the input clock
high-speed divider. See section 5.5.1.
00 = Divide by 1
01 = Divide by 2
10 = Divide by 4
11 = Divide by 8
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7. Electrical Characteristics
Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
Units
Supply voltage, nominal 1.5V
VDD15
-0.3
1.65
V
Supply voltage, nominal 1.8V
Supply voltage, nominal 2.5V
Supply voltage, nominal 3.3V
Voltage on XA, any ICxP/N, any OCxP/N pin
Voltage on any digital I/O pin
Storage Temperature Range
VDD18
VDD25
VDD33
VANAPIN
VDIGPIN
TST
-0.3
-0.3
-0.3
-0.3
-0.3
-55
1.98
2.75
3.63
3.63
3.63
+125
V
V
V
V
V
°C
* Exceeding these values may cause permanent damage. Functional operation under these conditions is not implied.
* Voltages are with respect to ground (VSS) unless otherwise stated.
Note 1: The typical values listed in the tables of Section 7 are not production tested.
Note 2: Specifications to -40C and 85C are guaranteed by design or characterization and not production tested.
Table 5 - Recommended DC Operating Conditions
Parameter
Symbol
Min.
Typ.
Max.
Units
2.375
2.5
2.625
3.465
1.89
Supply voltage, Higher Core
VDDH
V
(choose 1 row)
3.135
1.71
3.3
1.8
Supply voltage, Lower Core
(choose 1 row)
VDDL
V
V
same as VDDH
1.71
2.375
1.8
2.5
1.89
2.625
Supply voltage, Non-Clock I/O Pins
(choose 1 row)
VDDIO
same as VDDH
1.425
1.71
2.375
1.5
1.8
2.5
1.575
1.89
2.625
Supply voltage, OCx Outputs (x=A,B,C,D,E or F)
(choose 1 row)
VDDOx
TA
V
same as VDDH
Operating temperature
-40
+85
°C
Table 6 - Electrical Characteristics: Supply Currents
Characteristics
Total power, one input and one LVDS output
enabled, 1.8V+3.3V operation
Symbol
Min.
Typ.1
Max
Units
Notes
PDISS
IDD33
IDD25
0.67
428
415
W
3.3V single-supply operation
682
673
mA
mA
Note 2
Note 2
Total current on 3.3V supply
2.5V single-supply operation
Total current on 2.5V supply
1.8V+3.3V operation
Total current on 3.3V supply
Total current on 1.8V supply
1.8V+2.5V operation
IDD33
IDD18
143
217
259
380
mA
mA
Note 2
Note 2
Total current on 2.5V supply
Total current on 1.8V supply
IDD25
IDD18
138
217
256
380
VDDH supply current change from enabling or
disabling the crystal driver circuit
VDDL supply current change from enabling or
disabling an input clock
VDDH supply current change from enabling or
disabling the APLL’s fractional output divider
VDDL supply current from enabling/disabling
output divider for one OCx using OCEN.OCxEN
VDDL supply current change from enabling or
disabling an output for LVDS, LVPECL or HCSL
13
12
38
13
13
mA
mA
mA
mA
mA
IDDXO
IDDLIN
IDDLHSD
IDDLDIV
IDDLD
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Characteristics
VDDL supply current change from enabling or
disabling an output for CMOS or HSTL
VDDOx supply current change from enabling or
disabling an LVDS output
VDDOx supply current change from enabling or
disabling an LVPECL output
VDDOx supply current change from enabling or
disabling an HCSL output
VDDOx supply current change from enabling or
disabling a CMOS output
VDDOx supply current change from enabling or
disabling an HSTL output
Symbol
Min.
Typ.1
Max
Units
Notes
16
mA
IDDLC
9
15
15
6
mA
mA
mA
mA
mA
IDDOD
IDDOP
IDDOHC
IDDOC
IDDOHS
Note 5
Note 3
Note 4
6
Note 1:
Note 2:
Typical values measured at nominal supply voltages and 25C ambient temperature.
Max IDD measurements made with all blocks enabled, 650MHz signals on IC1 and IC2 inputs, 187.5MHz signal on IC3, Crystal driver
and doubler off , VCO frequency of 3750MHz, APLL output dividers dividing by 6, all MSDIV dividing by 2, all LSDIV dividing by 2,
all outputs enabled as LVPECL outputs driving 156.25MHz signals, and all VDDO at same voltage as VDDH. Typical IDD
measurements made with same setup as max IDD but APLL fractional dividers disabled and only six outputs enabled with LVDS
signal format.
Note 3:
Note 4:
Note 5:
VDDOx=3.3V, 1x drive strength, fO=250MHz, 2pF load
VDDOx=1.8V, 2x drive strength, fO=100MHz, 100 differential termination.
50 to ground each on OCxP and OCxN.
Table 7 - Electrical Characteristics: Non-Clock CMOS Pins
Characteristics
Symbol
Min.
0.7 x
VDDIO
Typ.
Max.
Units
Notes
VIH
Input high voltage
V
0.3 x
VDDIO
VIL
Input low voltage
V
IIL
Input leakage current, all digital inputs
Input capacitance
-10
10
10
11
Note 1
A
pF
pF
CIN
CIN
3
3
Input capacitance, SCL/SCLK, SDA/MOSI
0.05 x
VDDIO
Input hysteresis, SCL and SDA in I2C Bus Mode
Output leakage (when high impedance)
Output high voltage
mV
A
V
ILO
-10
10
Note 1
0.8 x
VDDIO
VOH
IO = -3.0mA
0.2 x
VDDIO
VOL
fOUT
Output low voltage
V
IO = 3.0mA
Note 3
Clock output on GPIO pin, frequency
VDDIO=1.8V
Clock output on GPIO pin,
rise/fall time
50
MHz
2.3
1.5
1.2
ns
ns
ns
Notes 3, 4
Notes 3, 4
Notes 3, 4
VDDIO=2.5V
tR, tF
VDDIO=3.3V
Note 1:
0V < VIN < VDDIO for all other non-clock inputs.
VOH does not apply for SCL and SDA in I2C interface mode since they are open drain.
Note 2:
Note 3:
To output a clock on a GPIO pin, an OCx output must be configured with NEGLSD=1 and SRLSEN=1 in OCxCR3 and the GPIO
must be configured to as a status output following OCxSR.LSCLK (see the GPIOCR and GPIOxSS registers). Output jitter is not
guaranteed for clock signals on GPIO pins but is typically 1 to 5ps rms 12kHz to 20MHz.
Note 4:
20%-80%, 15pF load.
77
© 2021 Microchip Technology Inc.
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Data Sheet
Table 8 - Electrical Characteristics: XA Clock Input
This table covers the case when there is no external crystal connected and an external oscillator or clock signal is connected to the XA pin.
Characteristics
Input high voltage, XA
Symbol
Min.
1.2
Typ.
Max.
VDDH
0.8
Units
V
Notes
VDDH=2.5 or 3.3V
VIH
VIL
fIN
fIN
IIL
VDDH=2.5 or 3.3V
Input low voltage, XA
V
Input frequency, XA pin to APLL mux
9.72
156.25
156.25
10
MHz
MHz
A
Input frequency, XA pin to bypass mux
Input leakage current
-10
40
Input duty cycle
60
%
Note 1
Note 1:
1.0V threshold. See section 5.3.3 for duty cycle restrictions when using the XA doubler with low input frequencies.
Table 9 - Electrical Characteristics: Clock Inputs, ICxP/N
Characteristics
Input voltage tolerance (each pin, single-ended)
Input differential voltage
Symbol
VTOL
Min.
0
Typ.
Max.
VDDH
1.4
Units
Notes
Note 1
V
V
V
VID
0.1
Note 2
VCMI
Input DC bias voltage (internally biased)
1.35
9.72
9.72
1250
300
MHz
MHz
Differential
fIN
Input frequency, ICx pins
Single-ended
smaller of
3ns or 0.3 x 1
/ fIN
Minimum input clock high, low time,
tH, tL
ns
ns
ns
fIN 250MHz
Minimum input clock high, low time,
tH, tL
tH, tL
0.4*1 / fIN
250MHz fIN 750MHz
Minimum input clock high, low time,
0.45*1 / fIN
fIN 750MHz
Input resistance, single-ended to 1.8V, ICxP or ICxN
Input resistance, single-ended to VSS, ICxP or ICxN
RIN18
50
80
k
k
RINVSS
Note 1:
The device can tolerate voltages as specified in VTOL w.r.t. VSS on its ICxP and ICxN pins without being damaged.
For differential input signals, proper operation of the input circuitry is only guaranteed when the other specifications in this table,
including VID, are met.
Note 2:
Note 3:
For inputs IC1P/N and IC2P/N VID=|VICxP – VICxN . For input IC3P, V =|V
– VCMI . The max VID spec only applies when a
|
|
ID
IC3P
differential signal is applied on ICxP/N; it does not apply when a single-ended signal is applied on ICxP.
Differential signals. The differential inputs can easily be interfaced to neighboring ICs driving LVDS, LVPECL, CML, HCSL, HSTL
or other differential signal formats using a few external passive components. In general, Microchip recommends terminating the
signal with the termination/load recommended in the neighboring component’s data sheet and then AC-coupling the signal into the
ICxP/ICxN pins. See Figure 15 for details. To connect a differential signal to IC3, AC-couple one side of the signal to IC3P and AC-
couple the other side to VSS. For DC-coupling, treat the input as 1.8V CML.
Note 4:
Single-ended signals can be connected to the ICxP pins. Signals with amplitude greater than 2.5V must be DC-coupled. For signals
with amplitudes less than 2.5V Microchip recommends AC-coupling but DC-coupling can also be used. When a single-ended signal
is connected to ICxP, ICxN should be connected to a capacitor (0.1F or 0.01F) to VSS.
VDD33
1/fIN
tH, tL
VICxP
VICxN
VSS
VID
VTOL
VCMI
Figure 14 - Electrical Characteristics: Clock Inputs
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© 2021 Microchip Technology Inc.
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Data Sheet
Example termination networks:
VDD_driver
LVDS
LVPECL
CML
HCSL
Microchip
VDD_driver
VDD_driver
50
Driver-
specified
termination
network
+
R1
R1 50
50
Signal
Driver
DC
Receiver
bias
100
50
-
R2
R2
50
50
VDD_driver=3.3V: R1=127, R2=82
VDD_driver=2.5V: R1=250, R2=62.5
VDD_driver
Place the 100 termination resistor as close as possible
to the device pins.
Microchip
50
50
Consult the signal driver’s data sheet for any required
DC network for this arrangement where the termination
resistor is on the receiver side of the AC coupling caps.
Driver-
specified
DC
+
Signal
Driver
DC
100
Receiver
bias
-
network
LVPECL drivers often need resistors (typically <200) to
ground in the DC network.
Figure 15 - Example External Components for Differential Input Signals
1/fOCD
VOCxP
VOH
VCM
VOL
VOD
VOCxN
VOCxP - VOCxN
0
VOD,PP
Figure 16 - Electrical Characteristics: Differential Clock Outputs
Table 10 - Electrical Characteristics: LVDS Clock Outputs
VDDOx=VDDH=3.3V±5% or VDDOx=VDDH=2.5V±5% for LVDS operation.
Characteristics
Output frequency
Symbol
fOCD
Min. Typ. Max. Units
Notes
1045
1.37
530
MHz
VCM
Output common-mode voltage
Output differential voltage
Output differential swing, peak-to-peak
Output rise/fall time
1.13
310
620
1.2
420
840
150
50
V
Note 1. See Figure 16
Note 1. See Figure 16
Note 1. See Figure 16
20%-80%
VOD
mV
mVPP
ps
VOD,PP
tR, tF
1060
Output duty cycle
45
55
%
Note 1:
OCxCR2.OCSF=0001 (LVDS). Output must have 100 DC path between OUTxP and OUTxN to meet these VOD specs. See Figure
17 parts a) and b) for examples where this DC path is a 100 termination resistor at the receiver.
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Data Sheet
Table 11 - Electrical Characteristics: LVPECL Clock Outputs
VDDOx=VDDH=3.3V±5% or VDDOx=VDDH=2.5V±5% for LVPECL operation.
Characteristics
Symbol
Min. Typ. Max. Units
Notes
fOCD
Output frequency
1045
MHz
Output common-mode voltage,
VDDOx=3.3V
Output common-Mode voltage,
VDDOx=2.5V
VCM
VCM
1.85
1.13
1.95
1.23
2.05
V
Note 1. See Figure 16
Note 1. See Figure 16
1.33
V
VOD
VOD
Output differential voltage
Output differential swing, peak-to-peak
Output rise/fall time
650
820
1640
150
50
1050
2100
mV
mVPP
ps
Note 1. See Figure 16
Note 1. See Figure 16
20%-80%
1300
tR, tF
Output duty cycle
45
55
%
Note 1:
OCxCR2.OCSF=0010, OCxDIFF.VCM=1100, OCxDIFF.VOD=0101. Output must have 100 DC path between OUTxP and OUTxN
to meet these VOD specs. See Figure 17 parts a) and b) for examples where this DC path is a 100 termination resistor at the
receiver.
Table 12 - Electrical Characteristics: HCSL Clock Outputs
VDDOx=VDDH=3.3V±5% or VDDOx=VDDH=2.5V±5% for HCSL operation.
Characteristics
Output frequency
Symbol
fOCHC
VCM
Min.
Typ. Max. Units
Notes
250
0.95
55
MHz
V
Output common-mode voltage
Output differential voltage
Output rise/fall time
V
Note 1. See Figure 16
Note 1. See Figure 16
20%-80%
OD / 2
VOD
0.6
45
0.75
250
50
V
tR, tF
ps
%
Output duty cycle
Note 1:
Each of OCxP and OCxN with 50 termination resistor to ground.
Table 13 - Electrical Characteristics: CMOS and HSTL (Class I) Clock Outputs
Characteristics
Symbol
Min.
Typ.
Max.
Units
Notes
fOCMOS
Output frequency
250
MHz
Note 1
<<1Hz
VDDOx
VOH
VOL
VDDOx
0.4
Output high voltage
Output low voltage
Output rise/fall time, VDDOx=1.8V,
OCxCR2.DRIVE=4x
Output rise/fall time, VDDOx=1.8V,
OCxCR2.DRIVE=4x
Output rise/fall time, VDDOx=3.3V,
OCxCR2.DRIVE=1x
V
V
Notes 2, 3
Notes 2, 3
2pF load
–0.4
0
0.4
1.2
0.7
2.2
ns
ns
ns
ns
15pF load
2pF load
15pF load
tR, tF
Output rise/fall time, VDDOx=3.3V,
OCxCR2.DRIVE=1x
Output duty cycle
45
42
50
50
55
58
%
%
Note 4, 6
Output duty cycle
Notes 5, 6
Output duty cycle, OCxNEG single-ended
Output duty cycle, OCxPOS single-ended
Output current when output disabled
50
%
50
%
OCxCR2.OCSF=0
IOH
300
A
Note 1:
Note 2:
Minimum output frequency is a function of VCO frequency and output divider values and is guaranteed by design.
For HSTL Class I, VOH and VOL apply for both unterminated loads and for symmetrically terminated loads, i.e. 50 to VDDOx/2.
For VDDOx=3.3V and OCxCR2.DRIVE=1x, IO=4mA. For VDDOx=1.5V and OCxCR2.DRIVE=4x, IO=8mA.
Note 3:
Note 4:
Note 5:
Note 6:
Output clock frequency ≤ 160MHz or VDDOx ≥ 1.8V.
Output clock frequency > 160MHz and VDDOx < 1.8V.
Measured differentially.
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© 2021 Microchip Technology Inc.
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Data Sheet
Microsemi
LVDS,
Microsemi
HCSL
LVPECL,
Receiver
LVDS or Prog.
Diff mode
or generic
HCSL mode
differential
receiver with
1-2.1V Vcm
50
50
50
50
a)
d)
+
+
Tx
-
100
Tx
-
Microsemi
CML
Microsemi
Receiver
Prog. Diff
mode
+
CMOS mode
50
50
20
50
CMOS
Receiver
b)
e)
Tx
-
100
source-series termination
Internal or external
termination on receiver
side of AC-coupling caps.
Microsemi
Differential
Receiver
Prog. Diff
mode
+
50
c)
200
50
Tx
-
100
Driver requires DC path between + and – pins. 200 recommended.
Figure 17 - Example External Components for Output Signals
Figure 17 part c) covers the case where an existing receiver has AC coupling caps followed by an internal or external 100 termination resistor.
The driver requires a DC path between its POS and NEG pins even in this case. A 200 resistor is recommended. Since this arrangement
attenuates the signal by one third, The OCxDIFF.VOD field should be set 50% higher to compensate.
Table 14 - Electrical Characteristics: APLL Frequencies
Characteristics
APLL VCO frequency range
APLL PFD input frequency
Symbol
Min.
3715
9.72
Typ.
Max.
4180
Units
MHz
Notes
fVCO
tPFD
156.25
MHz
Table 15 - Electrical Characteristics: Jitter and Skew Specifications
Test Conditions
Characteristics
APLL Jitter Transfer Bandwidth
Output to Output Skew
Input-to-Output Delay Variation, APLL external
feedback, OC1 internal path
Min
Typ
600
Max
Units
kHz
ps
Note 4
100
160
Note 12
110
ps
APLL, Integer Output Divider
Notes 1, 3
0.23
0.155
5
0.275
0.175
25
ps RMS
ps RMS
ps pk-pk
ps RMS
ps RMS
ps RMS
ps RMS
ps RMS
Phase Jitter, 156.25MHz
Notes 2, 3
PCI Express 1.1, Common Refclk Jitter
PCI Express 2.1, Common Refclk Jitter
Total Jitter, Notes 6, 11
10kHz to 1.5MHz, Note 6
1.5MHz to 50MHz, Note 6
Note 6
0.1
0.3
1.6
2.1
PCI Express 3.0, Common Refclk Jitter
PCI Express 4.0, Common Refclk Jitter
PCI Express 5.0, Common Refclk Jitter
APLL, Fractional Output Divider
0.08
0.08
0.068
0.10
0.10
0.077
Note 6
Note 6, 13
Integer divisor, Notes 1, 8
Frac. divisor, Note 1, 8
Total Jitter, Notes 9, 11
0.26
0.35
16
0.3
0.425
27
ps RMS
ps RMS
ps pk-pk
Phase Jitter, 156.25MHz
PCI Express 1.1, Common Refclk Jitter
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Data Sheet
Test Conditions
Characteristics
Min
Typ
0.12
1.7
Max
Units
ps RMS
ps RMS
ps RMS
ps RMS
ps RMS
ps pk-pk
ps
10kHz to 1.5MHz, Notes 9
1.5MHz to 50MHz, Notes 9
Note 8
0.3
3.1
0.12
0.12
0.09
27
PCI Express 2.1, Common Refclk Jitter
PCI Express 3.0, Common Refclk Jitter
PCI Express 4.0, Common Refclk Jitter
PCI Express 5.0, Common Refclk Jitter
Period Jitter, 100MHz
0.09
0.09
0.08
9-20
8-18
0.26
0.3
Note 8
Note 6, 13
Notes 10, 11
Notes 10, 11
Notes 1, 7
Cycle-to-Cycle Jitter, 100MHz
26
Random Jitter, fractional output divider
Deterministic Jitter, fractional output divider
0.3
6
ps RMS
ps pk-pk
Note 7
Total Jitter, fractional output divider
12kHz-20MHz
Note 5, 7
3-5
10.25
ps pk-pk
Note 1:
Jitter calculated from integrated phase noise from 12kHz to 20MHz. Phase jitter includes spurs (if present). Random jitter does
not include spurs.
Note 2:
Note 3:
Jitter calculated from integrated phase noise from 1.875MHz to 20MHz.
With 50MHz crystal doubled as APLL input, APLL VCO frequency 3750MHz, divide by 6 using APLL integer divider, then divide
by 4 in output medium-speed divider..
Note 4:
Requires phase alignment capability described in section 5.6.5. Only applies for outputs that have the same signal format, VDDO
voltage. drive strength and loading/termination. Also, this skew spec doesn’t apply to OCxN when an output pair is configured
with OCxCR3.NEGLSD=1; in this configuration OCxN lags OCxP by up to 1ns.
Note 5:
Note 6:
Total Jitter = Deterministic Jitter + 14 x Random Jitter.
With 50MHz crystal doubled as APLL input. All output clocks 100MHz HCSL format. Jitter is from the PCIe jitter filter combination
that produces the highest jitter.
Note 7:
Note 8:
Output frequencies 25MHz. Tested at 156.25MHz.
With 50MHz crystal doubled as APLL input. Integer divisor case tested with APLL VCO frequency 3750MHz. Fractional divisor
case tested with VCO frequency 3993.6MHz. PCI Express 3.0 and 4.0 case tested with APLL VCO frequency 3750MHz.
Note 9:
With 50MHz crystal doubled as APLL input and APLL VCO frequency 3993.6MHz. All output clocks 100MHz HCSL format. Jitter
is from the PCIe jitter filter combination that produces the highest jitter. Applies (a) when spread spectrum modulation is disabled
and (b) when spread spectrum modulation in the fractional output divider is 0.25% downspread modulated at 31.5kHz.
Note 10:
Measured using Tektronix MSO71604C, Mixed Signal Oscilloscope with DPOJET software. Measured with 3750MHz VCO
frequency, 200MHz out of the fractional divider, and 100MHz out of the medium-speed divider.
N=10000
Note 11:
Note 12:
AFBDL.FBSEL=11. Tested with 125MHz into IC1, APLL VCO frequency of 3750MHz, APLL integer divider set to 5, OCx medium-
speed dividers set to 6, OCx 125MHz output frequency. Only applies for outputs that have the same signal format, output divider
usage, VDDO voltage, drive strength and load/termination. Also, this delay spec doesn’t apply to OCxN when an output pair is
configured with OCxCR3.NEGLSD=1; in this configuration OCxN lags OCxP by up to 1ns.
Note 13:
With frequency extended to 200MHz per PCI Express Base 5.0 version 1.0 specification, section 8.6.7 note 2.
Table 16 - Electrical Characteristics: Typical Output Phase Jitter from the APLL Integer Divider
Output Jitter, ps RMS
Output Jitter, ps RMS
Output Frequency
625MHz
156.25MHz
125MHz
25MHz CMOS
622.08MHz
625MHz * 66/64
156.25MHz * 66/64
614.4MHz
125MHz XO Reference1
50MHz Crystal Reference2
0.180
0.227
0.228
0.275
0.25
0.255
0.27
0.26
0.185
0.23
0.23
0.29
0.26
0.26
0.28
0.27
0.28
153.6MHz
0.275
Note 1:
Note 2:
Note 3:
APLL locked to external 125MHz XO (Vectron VCC1-1535-125M000).
APLL locked to external 50MHz crystal (TXC 7M50070021), internal doubler enabled when multiplication is fractional.
All signals are differential unless otherwise stated. Jitter is integrated 12kHz to 5MHz for 25MHz output frequency and 12kHz to
20MHz for all other output frequencies.
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© 2021 Microchip Technology Inc.
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Data Sheet
Table 17 - Electrical Characteristics: Clock Buffer (APLL Bypass Path and Path 2)
Characteristics
Min.
Typ.
0.198
0.174
0.155
0.141
0.115
0.094
2.3
Max.
Units
Notes
100MHz
125MHz
156.25MHz
200MHz
400MHz
800MHz
0.175
Additive Jitter (Note 7)
ps RMS
Notes 1, 5
2
2.6
3.8
2.6
3.8
3.7
4.9
100
ns
ns
Note 3
Input-to-Output Propagation Delay, from IC1 or IC2 input
Input-to-Output Propagation Delay, from IC3 input
Input-to-Output Propagation Delay, from XA input
3
3.4
Note 4
1.9
2.9
2.9
3.9
2.3
ns
Note 3
3.4
ns
Note 4
3.3
ns
Note 3
4.4
ns
Note 4
Output-to-Output Skew
60
ps
Note 2
Output Phase Jitter, 50MHz crystal, 50MHz output
Output Period Jitter, 50MHz crystal, 50MHz output
Output Cycle-to-Cycle Jitter, 50MHz crystal, 50MHz output
0.29
11
ps RMS
ps pk-pk
ps pk
Notes 5, 6
N=10000, Note 6
N=10000, Note 6
11
Note 1:
Note 2:
APLL bypass enabled, input frequency = output frequency, LVPECL output signal format.
Only applies for outputs that have the same signal format, VDDO voltage, drive strength and load/termination. Also, this skew
spec doesn’t apply to OCxN when an output pair is configured with OCxCR3NEGLSD=1; in this configuration OCxN lags OCxP by
up to 1ns.
Note 3:
Note 4:
Note 5:
Note 6:
Note 7:
Differential outputs with 100 differential termination (LVDS, LVPECL, Programmable Differential).
CMOS/HSTL outputs, 5pF load.
Jitter calculated from integrated phase noise from 12kHz to 20MHz.
Tested with 50MHz crystal TXC 7M50070021.
Additive jitter contributes in a root-of-sum-of-squares manner. For example, a 156.25MHz input signal with 220fs of jitter will
experience typical additive jitter of 155fs in the device, and the resulting output jitter will be sqrt(2202+1552)=269fs.
Table 18 - Electrical Characteristics: Typical Input-to-Output Clock Delay Through APLL
Mode
Delay, Input Clock Edge to Output Clock Edge
All Modes
Non-deterministic but constant as long as the APLL remains locked
and output clock phases are not adjusted as described in section 5.6.4.
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© 2021 Microchip Technology Inc.
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Data Sheet
Table 19 - Electrical Characteristics: SPI Slave Interface Timing, Device Registers
VDDIO = 3.3V±5% or 2.5V±5% or 1.8V±5%
VDDIO 3.3V or 2.5V
VDDIO 1.8V
Characteristics (Notes 1 to 3)
Symbol
Units
Notes
Min. Typ. Max. Min. Typ. Max.
fBUS
tCYC
tSUC
tHDC
tCSH
tCLKH
tCLKL
tSUI
SCLK frequency
23
15
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
SCLK cycle time
43.5
10
10
25
10
21.75
2
66
10
10
25
33
33
10
10
0
CSN setup to first SCLK edge
CSN hold time after last SCLK edge
CSN high time
SCLK high time
SCLK low time
MOSI data setup time
tHDI
MOSI data hold time
2
tEN
MISO enable time from SCLK edge
MISO disable time from CSN high
MISO data valid time
0
tDIS
80
80
32
tDV
20.5
tHDO
MISO data hold time from SCLK edge
CSN, MOSI input rise time, fall time
0
0
tR
,
t
F
10
10
Note 1:
Note 2:
Note 3:
All timing is specified with 100pF load on all SPI pins.
All parameters in this table are guaranteed by design or characterization.
See timing diagram in Figure 18.
CSN
tSUC
tCYC
tHDC
tCSH
tCLKL
SCLK
tCLKH
tSUI tHDI
MOSI
MISO
tDV
tDIS
tEN
tHDO
Figure 18 - SPI Slave Interface Timing
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© 2021 Microchip Technology Inc.
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Data Sheet
Table 20 - Electrical Characteristics: SPI Slave Interface Timing, Internal EEPROM
(ZL30261 and ZL30263 Only)
VDDIO = 3.3V±5% or 2.5V±5% or 1.8V±5%
VDDIO 3.3V
VDDIO 2.5V
VDDIO 1.8V
Min Max
Characteristics (Notes 1 to 4)
Symb
Min
Max
Min
Max
Units
fBUS
SCLK frequency
7.7
4.5
4
MHz
tCYC
tSUC
tHDC
tCSH
tCLKH
tCLKL
tSUI
SCLK cycle time
130
50
53
50
40
63
11
11
0
220
100
103
100
80
240
100
105
100
80
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
CSN setup to first SCLK edge
CSN hold time after last SCLK edge
CSN high time
SCLK high time
SCLK low time
107
21
120
25
MOSI data setup time
tHDI
MOSI data hold time
21
25
tEN
MISO enable time from SCLK edge
MISO disable time from CSN high
MISO data valid time
0
0
tDIS
22
63
22
25
tDV
107
119
tHDO
MISO data hold time from SCLK edge
CSN, MOSI input rise time, fall time
0
0
0
tR
,
t
F
10
10
10
Note 1:
Note 2:
Note 3:
Note 4:
This timing applies (a) when EESEL=1 and (b) in direct EEPROM write mode (see section 5.11.2).
All timing is specified with 100pF load on all SPI pins.
All parameters in this table are guaranteed by design or characterization.
See timing diagram in Figure 18.
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Data Sheet
Table 21 - Electrical Characteristics: SPI Master Interface Timing (ZL30260 and ZL30262 Only)
VDDIO = 3.3V±5% or 2.5V±5% or 1.8V±5%
Characteristics (Notes 1 to 3)
SCLK output frequency
Symbol
Min.
Typ.
Max.
Units
MHz
ns
Notes
fBUS
5
tCYC
tCLKH/ tCYC
tSUC
SCLK output cycle time
200
45
SCLK output duty cycle
50
55
%
CSN output setup to first SCLK rising edge
CSN output hold after last SCLK falling edge
CSN output high time
200
200
200
15
ns
tHDC
ns
tCSH
ns
MISO input setup time to SCLK rising edge
MISO input hold time from SCLK rising edge
MOSI output valid from SCLK falling edge
SCLK, CSN, MOSI output rise time, fall time
MISO input rise time, fall time
tSU
ns
tHD
5
ns
tDV
10
15
10
ns
tR
t
t
ns
,
,
F
F
tR
ns
Note 1:
Note 2:
Note 3:
All timing is specified with 100pF load on all SPI pins.
All parameters in this table are guaranteed by design or characterization.
See timing diagram in Figure 19.
CSN
tSUC
tCYC
tHDC
tCSH
tCLKL
SCLK
tCLKH
tDV
MOSI
MISO
tSU tHD
Figure 19 - SPI Master Interface Timing
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Data Sheet
Table 22 - Electrical Characteristics: I2C Slave Interface Timing
VDDIO = 3.3V±5% or 2.5V±5% or 1.8V±5%
Characteristics
Symbol
Min.
Typ.
Max.
Units
Notes
fSCL
SCL clock frequency
400
kHz
Note 1
tHD:STA
tLOW
Hold time, START condition
Low time, SCL
0.6
1.3
0.6
0.6
0
µs
µs
µs
µs
µs
ns
ns
tHIGH
High time, SCL
tSU:STA
tHD:DAT
tSU:DAT
tR
Setup time, START condition
Data hold time
0.9
Notes 2 and 3
Note 4
Data setup time
100
Rise time
20 +
0.1Cb
Cb is cap. of
one bus line
tF
Fall time
300
ns
tSU:STO
tBUF
Setup time, STOP condition
0.6
1.3
µs
µs
Bus free time between STOP/START
Pulse width of spikes which must be
suppressed by the input filter
tSP
0
50
ns
Note 1:
The timing parameters in this table are specifically for 400kbps Fast Mode. Fast Mode devices are downward-compatible with
100kbps Standard Mode I2C bus timing. All parameters in this table are guaranteed by design or characterization. All values
referred to VIHmin and VILmax levels (see Table 7).
Note 2:
The device internally provides a hold time of at least 300ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge
the undefined region of the falling edge of SCL. Other devices must provide this hold time as well per the I2C specification.
Note 3:
Note 4:
The I2C specification indicates that the maximum tHD:DAT spec only has to be met if the device does not stretch the low period
(tLOW) of the SCL signal. The device does not stretch the low period of the SCL signal.
Determined by choice of pull-up resistor.
tSU:DAT
tHD:STA
tBUF
SDA
SCL
tF
tR
tLOW
tF
tSP
tHD:STA
tHIGH
tSU:STA
tSU:STO
tHD:DAT
S
Sr
P
S
Figure 20 - I2C Slave Interface Timing
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8. Package and Thermal Information
Data Sheet
Table 23 - 8x8mm QFN Package Thermal Properties
PARAMETER
Maximum Ambient Temperature
Maximum Junction Temperature
SYMBOL
TA
TJMAX
CONDITIONS
VALUE
85
125
UNITS
C
C
still air
1m/s airflow
2.5m/s airflow
15.1
12.4
10.6
3.2
Junction to Ambient Thermal Resistance
(Note 1)
JA
C/W
Junction to Board Thermal Resistance
Junction to Case Thermal Resistance
Junction to Pad Thermal Resistance
(Note 2)
Junction to Top-Center Thermal
Characterization Parameter
JB
JC
C/W
C/W
7.3
Still air
Still air
0.9
0.1
JP
C/W
JT
C/W
Note 1:
Theta-JA (JA) is the thermal resistance from junction to ambient when the package is mounted on an 8-layer JEDEC standard test
board and dissipating maximum power.
Note 2:
Note 3:
Theta-JP (JP) is the thermal resistance from junction to the center exposed pad on the bottom of the package.
For all numbers in the table, the exposed pad is connected to the ground plane with a 9x9 array of thermal vias; via diameter
0.33mm; via pitch 0.76mm.
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Data Sheet
9. Mechanical Drawing
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Data Sheet
10.Acronyms and Abbreviations
APLL
CML
GbE
analog phase locked loop
current mode logic
gigabit Ethernet
HCSL
HSTL
I/O
high-speed current steering logic
high-speed transceiver logic
input/output
LOS
loss of signal
LVDS
LVPECL
PFD
low-voltage differential signal
low-voltage positive emitter-coupled logic
phase/frequency detector
phase locked loop
PLL
ppb
parts per billion
ppm
parts per million
pk-pk
RMS
RO
peak-to-peak
root-mean-square
read-only
R/W
read/write
SS or SSM
TCXO
UI
spread spectrum modulation
temperature-compensated crystal oscillator
unit interval
UIPP or UIP-P
XO
unit interval, peak to peak
crystal oscillator
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Data Sheet
11. Data Sheet Revision History
Revision
Description
26-Sep-2016 First general release
On page 1 added PCIe bullet.
In Table 1, OCx pin description, clarified what is programmable for each mode.
Added new Figure 17.
In Table 15 added max Input-to-Output Delay Variation numbers for external feedback using
on-die path.
08-Dec-2016
In Table 17 added min, typ and max values for buffer Input-to-Output Propagation Delay. In
footnotes 3 and 4 added “Measured at 125MHz”.
In Figure 17 added CMOS diagram.
In section 2.4 and section 5.5.6.2 added note that NCO resolution of 1ppt is possible.
Corrected references to MCR1.XAB to MCR2.XAB.
Corrected four occurrences of VCCOx to VDDOx.
Added pullup recommendations to SCL/SCLK and SDA/MOSI pin descriptions.
Change ID2.REV default value to “contact factory”.
12-Jun-2017
17-Jul-2017
In OCxCR2.OCSF HCSL decode, deleted “VCM and VOD are ignored”.
In Figure 17 removed the 50ohm to ground termination option from the CMOS diagram.
In Table 1 TEST/GPIO3 pin description, changed “TEST must be low on the rising edge of
RSTN” to “Typically TEST should be low on the rising edge of RSTN, but see section 5.2 for
some options.”
In section 5.6.2 added the statement that maximum input frequency to the medium-speed
divider is 750MHz.
In section 5.6.5 clarified that signals from the same IntDiv or FracDiv are aligned and that
aligning clocks from IntDiv with clocks from FracDiv is not supported.
05-Sep-2017
In section 5.9 added new subsection 5.9.1 to guide users in the use of external RC reset
circuits.
In the F1REM1 register description deleted “The value FREM=0 is undefined. When FBP=0,
FREM must be set to 0.”
In the F1DEN1 register description deleted “When FBP=0, FDEN must be set to 1.”
In the F1BP register description deleted “When FBP=0, FREM must be set to 0 and FDEN
must be set to 1.”
In the AFBREM1 register description deleted “When AFBBP=0, AFBREM must be set to 0.”
IIn the AFBBP register description deleted “When AFBBP=0, AFBREM must be set to 0 and
AFBDEN must be set to 1.”
19-Jan-2018
29-May-2018
On page 1 and in section 2.3 changed wording to indicate PCIe 1-4 compliance.
In OCxCR3.NEGLSD description added to note that OCxCR3.LSSEL must be 0 to set
NEGLSD=1.
In Table 17, corrected typo for "Input-to-Output Propagation Delay, from IC3 input" in the Note
4 row where the max of 2.8 was less than typical of 3.4. Corrected the max to 3.8.
In the OCxCR2.OCSF description, deleted "(must have VDDOx=VDDH=3.3V)" from the HCSL
decode.
14-Sep-2018 Updated Table 10 Note 1 and Table 11 Note 1 and added cross reference to Figure 17 parts a)
and b).
Updated Figure 17 to include new part c) and added noted about part c) below the figure.
In section 5.9.1 second paragraph added need for current-limiting series resistor between
source of reset signal and device RSTN pin.
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Data Sheet
Revision
Description
In Table 1 pin descriptions for AC0/GPIO0, AC1/GPIO1, AC2/GPIO2 and TEST/GPIO3 added
note.
In Table 15:
• Reduced integer output divider PCIe 3.0 jitter to 0.08 typical, 0.10 max (ps RMS) and added
new row for PCIe 4.0 jitter.
01-Oct-2018
29-Sep-2020
• Reduced fractional output divider PCIe 3.0 jitter to 0.09 typical, 0.12 max (ps RMS) and
added new row for PCIe 4.0 jitter.
• Added PCIe sentence to Note 8 and deleted second sentence of Note 6.
In Table 12 changed max VOD from 0.86V to 0.95V, changed min V
OD from 0.62V to 0.6V
and
changed VCM spec to V
OD / 2.
On pages 1 and 5 added PCIe 5 to the lists of PCIe versions.
In Table 15 added new rows for PCIe 5 jitter.
18-Dec-2020
17-Jun-2021
Updated Microsemi wording and branding to Microchip throughout.
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ISBN: 978-1-5224-8392-2
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
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