USB2240II-AEZG [MICROCHIP]
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers;
| 型号： | USB2240II-AEZG |
| 厂家： | 
MICROCHIP |
| 描述： | Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers |
| 文件： | 总43页 (文件大小：795K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
USB224X
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash
Media Controllers
• Media Activity LED
Highlights
• On board 24 MHz crystal driver circuit
• Optional external 24 MHz clock input3
The Microchip USB224x is a USB 2.0 compliant, Hi-
Speed bulk only1 mass storage class peripheral con-
• Internal card power FET
troller intended for reading and writing to popular flash
- 200 mA
- "Fold-back" short circuit protection
• 8051 8-bit microprocessor
- 60 MHz - single cycle execution
- 64 KB ROM | 14 KB RAM
• Supports a single external 3.3 V supply source;
internal regulators provide 1.8 V internal core volt-
age for additional bill of materials and power sav-
ings
• Optimized pinout improves signal routing which
eases implementation for improved signal integ-
rity
media from the xD-Picture CardTM (xD)2, Memory
Stick® (MS), Secure Digital (SD), and MultiMedia-
CardTM (MMC) families.
The USB224x is a fully integrated, single chip solution
capable of ultra high performance operation. Average
sustained transfer rates exceeding 35 MB/s are possi-
ble if the media and host can support those rates. The
USB2244/44i includes provisions to read/write secure
media formats.
General Features
• Low pin count 36-pin QFN (6x6 mm) RoHS com-
pliant package
Flash Media Specification Compliance
• USB2240/40I/41/41I
• Secure Digital 2.0
- HS-SD, SDHC
- TransFlashTM and reduced form factor media
• MultiMediaCard 4.2
- Targeted for applications in which single or
"combo" media sockets are used
• Hardware-controlled data flow architecture for all
self-mapped media
• Pipelined hardware support for access to non-
self-mapped media
• Order number with “I” denote the products that
support the industrial temperature range of -40ºC
to 85ºC
• Support included for secure media format on a
licensed, customized basis
- 1/4/8-bit MMC
• Memory Stick Formats
- MS 1.43, Pro 1.02, Duo 1.10
- Pro-HG Duo 1.01
–MS, MS Duo, HS-MS, MS Pro-HG, MS Pro
• xD-Picture Card 1.2
Software Features
- USB2244/44I: SD Secure
• Customizable vendor specific data
• Optimized for low latency interrupt handling
• Reduced memory footprint
Hardware Features
• Single chip flash media controller with
- USB2240/40I/41/4I: multiplexed interface for
use with “combo” card sockets
- USB2244/44I: SD/MMC flash media reader/
writer
• MMC Streaming Mode support
• Extended configuration options
- xD player mode operation
Applications
• Flash media card reader/writers
• Desktop and mobile PCs
• Printers
• Consumer A/V and media players/viewers
• Compatible with
®
–Microsoft VistaTM and Vista ReadyBoostTM
- Socket switch polarities, etc.
®
–Windows XP, ME, 2K SP4
®
–Apple Mac OSx
–Linux Mass Storage Class Drivers
1.Bulk only is not applicable to USB2240/40i/41/41i.
2.xD-Picture Card is not applicable to USB2241/41i.
3.Only applicable to USB2240/40i/41/41i.
DS00001979A-page 1
2010 - 2015 Microchip Technology Inc.
USB224X
TO OUR VALUED CUSTOMERS
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You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for cur-
rent devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the
revision of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
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•
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When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature number) you are
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DS00001979A-page 2
2010 - 2015 Microchip Technology Inc.
USB224X
1.0
INTRODUCTION
The Microchip USB224x is a flash media card reader solution fully compliant with the USB 2.0 specification. All required
resistors on the USB ports are integrated into the device. This includes all series termination resistors on D+ and D–
pins and all required pull-down and pull-up resistors. The over-current sense inputs for the downstream facing ports
have internal pull-up resistors.
1.1
Hardware Features
• Single chip flash media controller in low pin count 36-pin QFN, RoHS compliant package
• Commercial temperature products support 0°C to +70°C: USB2240/41 and USB2244
• Industrial temperature products support -40°C to +85°C: USB2240I/41I and USB2244I
• 8051 8-bit microprocessor
- 60 MHz - single cycle execution
- 64 KB ROM |14 KB RAM
• Supports a single external 3.3 V supply source; internal regulators provide 1.8 V internal core voltage for addi-
tional bill of materials and power savings
Compliance with the following flash media card specifications:
• Secure Digital 2.0
- HS-SD and SDHC
- TransFlash™ and reduced form factor media
• MultiMediaCard 4.2
- 1/4/8 bit MMC
• Memory Stick 1.43
• Memory Stick Pro Format 1.02
• Memory Stick Pro-HG Duo Format 1.01
- Memory Stick, MS Duo, HS-MS, MS Pro-HG, MS Pro
• Memory Stick Duo 1.10
• xD-Picture Card 1.2
1.2
Software Features
• If the OEM is using an external EEPROM, the following features are available:
- Customizable vendor, product, language, and device ID’s
- 12-hex digits maximum for the serial number string
- 28-character manufacturer ID and product strings for the flash media reader/writer
- LED blink interval or duration
2010 - 2015 Microchip Technology Inc.
DS00001979A-page 3
USB224X
2.0
ACRONYMS
ATA:
Advanced Technology Attachment
FET:
Field Effect Transistor
LUN:
MMC:
MSC:
PLL:
Logical Unit Number
MultiMediaCard
Memory Stick Controller1
Phase-Locked Loop
QFN:
RoHS:
RXD:
SDC:
SIE:
Quad Flat No leads
Restriction of Hazardous Substances Directive
Received eXchange Data
Secure Digital Controller
Serial Interface Engine
Transmit eXchange Data
Universal Asynchronous Receiver-Transmitter
Unsigned Character
TXD:
UART:
UCHAR:
UINT:
Unsigned Integer
1.Not applicable to USB2244/44i.
DS00001979A-page 4
2010 - 2015 Microchip Technology Inc.
USB224X
3.0
BLOCK DIAGRAMS
FIGURE 3-1:
USB2240/40I/41/41I BLOCK DIAGRAM
USB2240/40I
USB2241/41I*
AUTO_CBW
SD/
MMC
PROC
USB
Host
FMI
SIE
CTL
BUS
INTFC
BUS FMDU
INTFC CTL
Multiplexed
Interface
MS
PHY
xD*
3.3 V
EP0 TX
EP0 RX
1.8 V Reg
BUS
RAM
VDD18
4K
total
INTFC
EP1 RX
EP1 TX
EP2 RX
EP2 TX
24 MHz
Crystal
PLL
XDATA BRIDGE
+ BUS ARBITER
VDD18PLL
3.3 V
1.8 V Reg
PWR_FET1
CRD_PWR
RAM
10 KB
ADDR
MAP
SPI
Interface
SPI
Program Memory I/O Bus
ROM
Interface
64 KB
Trace FIFO
Clock
Generation and
Control
SFR
RAM
8051
PROCESSOR
NOTE: xD-Picture Card is not applicable to USB2241/41i.
2010 - 2015 Microchip Technology Inc.
DS00001979A-page 5
USB224X
FIGURE 3-2:
USB2244/44I BLOCK DIAGRAM
USB2244/USB2244I
AUTO_CBW
PROC
USB
Host
FMI
SD/
MMC
Media
Interface
SIE
CTL
BUS
INTFC
BUS FMDU
INTFC CTL
PHY
3.3 V
EP0 TX
EP0 RX
1.8 V Reg
BUS
RAM
VDD18
4K
total
INTFC
EP1 RX
EP1 TX
EP2 RX
EP2 TX
24 MHz
Crystal
PLL
XDATA BRIDGE
+ BUS ARBITER
VDD18PLL
3.3 V
1.8 V Reg
PWR_FET1
CRD_PWR
RAM
10 KB
ADDR
MAP
SPI
Interface
SPI
Interface
ROM
Program Memory I/O Bus
64 KB
Trace FIFO
Clock
Generation and
Control
SFR
RAM
8051
PROCESSOR
DS00001979A-page 6
2010 - 2015 Microchip Technology Inc.
USB224X
4.0
PIN CONFIGURATIONS
FIGURE 4-1:
USB2240/USB2240I 36-PIN QFN DIAGRAM
28
29
30
31
32
33
34
35
36
18
17
16
15
14
13
12
11
10
TEST
NC
RESET_N
xD_nB/R
xD_nRE
xD_nCE
VDD33
xD_D4 / (SD_WP) / MS_SCLK
TXD / SCK / MS_SKT_SEL
XTAL2
USB2240/2240I
(Top View QFN-36)
VDD18
XTAL1 (CLKIN)
VDD18PLL
xD_nWE
Ground Pad
(must be connected to VSS)
RBIAS
xD_CLE / SD_CMD / MS_D0
xD_ALE / SD_D5 / MS_D1
VDDA33
Indicates pins on the bottom of the device.
2010 - 2015 Microchip Technology Inc.
DS00001979A-page 7
USB224X
FIGURE 4-2:
USB2241/USB2241I 36-PIN QFN DIAGRAM
28
29
30
31
32
33
34
35
36
18
17
16
15
14
13
12
11
10
TEST
NC
RESET_N
NC
SD_WP / MS_SCLK
TXD / SCK / MS_SKT_SEL
XTAL2
NC
NC
USB2241/2241I
(Top View QFN-36)
VDD33
VDD18
NC
XTAL1 (CLKIN)
VDD18PLL
Ground Pad
(must be connected to VSS)
RBIAS
SD_CMD / MS_D0
SD_D5 / MS_D1
VDDA33
Indicates pins on the bottom of the device.
DS00001979A-page 8
2010 - 2015 Microchip Technology Inc.
USB224X
FIGURE 4-3:
USB2244/USB2244I 36-PIN QFN DIAGRAM
28
29
30
31
32
33
34
35
36
18
17
16
15
14
13
12
11
10
RESET_N
NC
TEST
NC
NC
SD_WP
NC
TXD / SCK
XTAL2
USB2244/2244I
(Top View QFN-36)
VDD33
VDD18
NC
XTAL1 (CLKIN)
VDD18PLL
RBIAS
Ground Pad
(must be connected to VSS)
SD_CMD
SD_D5
VDDA33
Indicates pins on the bottom of the device.
2010 - 2015 Microchip Technology Inc.
DS00001979A-page 9
USB224X
5.0
PIN TABLES
TABLE 5-1:
USB2240/2240I 36-PIN QFN PACKAGE
xD/SD/MS INTERFACE (18 PINS)
xD_D3 /
SD_D1 /
MS_D5
xD_D2 /
SD_D0 /
MS_D4
xD_D1 /
SD_D7 /
MS_D6
xD_D0 /
SD_D6 /
MS_D7
xD_nWP /
SD_CLK /
MS_BS
xD_ALE /
SD_D5 /
MS_D1
xD_CLE /
SD_CMD /
MS_D0
xD_D7 /
SD_D4 /
MS_D2
xD_D6 /
SD_D3 /
MS_D3
xD_D5 / SD_D2
xD_nB/R
xD_nRE
xD_nCE
xD_nWE
MS_INS
xD_D4 /
SD_WP /
MS_SCLK
xD_nCD
SD_nCD
USB INTERFACE (5 PINS)
USB+
USB-
XTAL1 (CLKIN)
XTAL2
RBIAS
MISC (7 Pins)
TXD /
SCK /
MS_SKT_SEL
RXD /
SDA
LED
NC
CRD_PWR
TEST
RESET_N
DIGITAL, POWER (6 PINS)
(3) VDD33
VDDA33
VDD18
VDD18PLL
TOTAL 36
DS00001979A-page 10
2010 - 2015 Microchip Technology Inc.
USB224X
TABLE 5-2:
USB2241/2241I 36-PIN QFN PACKAGE
SD/MS INTERFACE (14 PINS)
SD_D1 /
MS_D5
SD_D0 /
MS_D4
SD_D7 /
MS_D6
SD_D6 /
MS_D7
SD_CLK /
MS_BS
SD_D5 /
MS_D1
SD_CMD /
MS_D0
SD_D4 /
MS_D2
SD_D3 /
MS_D3
SD_WP /
MS_SCLK
SD_D2
MS_INS
NC
SD_nCD
USB INTERFACE (5 PINS)
USB+
USB-
XTAL1 (CLKIN)
XTAL2
RBIAS
MISC (11 Pins)
TXD /
SCK /
MS_SKT_SEL
RXD /
SDA
LED
NC
CRD_PWR
TEST
RESET_N
(4) NC
DIGITAL, POWER (6 PINS)
(3) VDD33
VDDA33
VDD18
VDD18PLL
TOTAL 36
2010 - 2015 Microchip Technology Inc.
DS00001979A-page 11
USB224X
TABLE 5-3:
USB2244/2244I 36-PIN QFN PACKAGE
SD/MMC INTERFACE (12 Pins)
SD_D0
SD_D1
SD_D5
SD_D2
SD_D3
SD_D7
SD_D4
SD_D6
SD_CLK
SD_CMD
SD_WP
SD_nCD
USB INTERFACE (5 PINS)
USB+
USB-
XTAL1 (CLKIN)
XTAL2
RBIAS
MISC (13 PINS)
RXD /
SDA
TXD /
SCK
LED
NC
NC
CRD_PWR
NC
(4) NC
TEST
RESET_N
DIGITAL, POWER (6 PINS)
(3)VDD33
VDDA33
VDD18
VDD18PLL
TOTAL 36
DS00001979A-page 12
2010 - 2015 Microchip Technology Inc.
USB224X
6.0
PIN DESCRIPTIONS
This section provides a detailed description of each signal. The signals are arranged in functional groups according to
their associated interface. The pin descriptions are applied when using the internal default firmware and can be refer-
enced in Section 7.0, "Pin Configurations," on page 18. Please reference Section 2.0, "Acronyms," on page 4 for a list
of the acronyms used.
The “n” symbol in the signal name indicates that the active, or asserted, state occurs when the signal is at a low voltage
level. When “n” is not present in the signal name, the signal is asserted at the high voltage level.
The terms assertion and negation are used exclusively. This is done to avoid confusion when working with a mixture of
“active low” and “active high” signals. The term assert, or assertion, indicates that a signal is active, independent of
whether that level is represented by a high or low voltage. The term negate, or negation, indicates that a signal is inac-
tive.
6.1
USB224x 36-Pin QFN Pin Descriptions
TABLE 6-1:
USB224X 36-PIN QFN PIN DESCRIPTIONS
Buffer
Type
Symbol
Description
xD-PICTURE CARD (xD) INTERFACE (APPLIES ONLY TO USB2240/USB2240I)
xD_D[7:0]
20
23
25
30
4
I/O12PD
xD Data
These bi-directional data signals have weak internal pull-
down resistors.
5
7
8
xD_nWP
xD_ALE
xD_CLE
xD_nRE
9
O12PD
O12PD
O12PD
O12PU
xD Write Protect
This pin is an active low write protect signal for the xD
device and has a weak pull-down resistor that is
permanently enabled.
10
11
16
xD Address Strobe
This pin is an active high Address Latch Enable signal for
the xD device and has a weak pull-down resistor that is
permanently enabled.
xD Command Strobe
This pin is an active high Command Latch Enable signal
for the xD device and has a weak pull-down resistor that
is permanently enabled.
xD Read Enable
This pin is an active low read strobe signal for the xD
device.
When using the internal FET, this pin has a weak internal
pull-up resistor that is tied to the output of the internal
power FET.
If an external FET is used (Internal FET is disabled), then
the internal pull-up is not available (external pull-ups must
be used).
2010 - 2015 Microchip Technology Inc.
DS00001979A-page 13
USB224X
TABLE 6-1:
USB224X 36-PIN QFN PIN DESCRIPTIONS (CONTINUED)
Buffer
Type
Symbol
Description
xD_nWE
12
O12PU
xD Write Enable
This pin is an active low write strobe signal for the xD
device.
When using the internal FET, this pin has a weak internal
pull-up resistor that is tied to the output of the internal
power FET.
If an external FET is used (Internal FET is disabled), then
the internal pull-up is not available (external pull-ups must
be used).
xD_nB/R
17
IPU
xD Busy or Data Ready
This pin is connected to the BSY/RDY pin of the xD
device.
When using the internal FET, this pin has a weak internal
pull-up resistor that is tied to the output of the internal
power FET.
If an external FET is used (Internal FET is disabled), then
the internal pull-up is not available (external pull-ups must
be used).
xD_nCD
xD_nCE
19
15
I/O12
xD Card Detection
This is designated by the default firmware as the xD-
Picture card detection pin.
Note: This pin can be left unconnected if the socket is
not used.
O12PU
xD Chip Enable
This pin is the active low chip enable signal to the xD
device.
When using the internal FET, this pin has a weak internal
pull-up resistor that is tied to the output of the internal
power FET.
If an external FET is used (Internal FET is disabled), then
the internal pull-up is not available (external pull-ups must
be used).
MEMORY STICK (MS) INTERFACE
MS_D[7:0]
8
7
I/O12PD
MS System Data In/Out
4
5
23
20
10
11
These pins are the bi-directional data signals for the MS
device. MS_D0, MS_D2, and MS_D3 have weak pull-
down resistors.
In serial mode, the most significant bit (MSB) of each byte
is transmitted first by either MSC or MS device on
MS_D0.
In parallel mode, MS_D1 has a pull-down resistor,
otherwise it is disabled.
In 4- or 8-bit parallel mode, there is a weak pull-down
resistor on all MS_D7 - 0 signals.
DS00001979A-page 14
2010 - 2015 Microchip Technology Inc.
USB224X
TABLE 6-1:
USB224X 36-PIN QFN PIN DESCRIPTIONS (CONTINUED)
Buffer
Symbol
Description
Type
MS_BS
9
O12
MS Bus State
This pin is connected to the bus state (BS) pin of the MS
device. It is used to control the bus states 0, 1, 2 and 3
(BS0, BS1, BS2 and BS3) of the MS device.
MS_SCLK
MS_INS
30
24
O12
IPU
MS System CLK
This pin is an output clock signal to the MS device.
The clock frequency is software configurable.
MS Card Insertion
This is designated by the default firmware as the Memory
Stick card detection pin.
Note: This pin can be left unconnected if the socket is
not used.
SECURE DIGITAL (SD) / MULTIMEDIACARD (MMC) INTERFACE
SD_D[7:0]
7
8
7
8
I/O12PU
SD Data
The pins are bi-directional data signals SD_D0 - SD_D7
and have weak pull-up resistors.
10
20
23
25
4
10
20
23
25
4
5
5
SD_CLK
SD_CMD
9
9
O12
SD Clock
This is an output clock signal to SD/MMC device.
The clock frequency is software configurable.
11
11 I/O12PU
SD Command
This is a bi-directional signal that connects to the CMD
signal of the SD/MMC device and has a weak internal
pull-up resistor.
SD_WP
SD Write Protect Detection
SD Card Detect
SD_nCD
USB INTERFACE
USB+
USB-
2
3
I/O-U
USB Bus Data
These pins connect to the USB bus data signals.
USB Transceiver Bias
RBIAS
35
I-R
A 12.0 kΩ, ± 1.0% resistor is attached from VSS to this
pin in order to set the transceiver's internal bias currents.
XTAL1 (CLKIN)
33
ICLKx
24 MHz Crystal (External clock input)
This pin can be connected to one terminal of the crystal
or can be connected to an external 24 MHz clock when a
crystal is not used.
XTAL2
32
36
OCLKx
24 MHz Crystal
This is the other terminal of the crystal, or it is left open
when an external clock source is used to drive
XTAL1(CLKIN).
VDDA33
3.3 V Analog Power
2010 - 2015 Microchip Technology Inc.
DS00001979A-page 15
USB224X
TABLE 6-1:
USB224X 36-PIN QFN PIN DESCRIPTIONS (CONTINUED)
Buffer
Type
Symbol
Description
VDD18PLL
34
1
1.8 V PLL Power
+1.8 V Filtered analog power for internal PLL. This pin
must have a 1.0 μF ± 20% (ESR < 0.1 Ω) capacitor to
VSS.
MISC
LED
I/O12
LED: Can be used as an LED output.
RXD /
I
RXD: This signal can be used as input to the RXD of
UART in the device. Custom firmware is required to
activate this function.
I/O12
O12
SDA: This is the data pin when used with an external
serial EEPROM.
SDA
TXD /
31
TXD: This signal can be used as an output TXD of UART
in the device. Custom firmware is required to activate this
function.
O12
I
SCK: This is the clock output when used with an external
EEPROM.
SCK /
MS_SKT_SEL: On the positive edge of RESET_N, this
pin is sampled to determined the Memory Stick socket
size.
MS_SKT_SEL
1 = 8-bit
0 = 4-bit
CRD_PWR
RESET_N
21
18
28
I/O200
CRD_PWR: Card power drive of 3.3 V at either 100 mA
or 200 mA.
IS
I
RESET Input: This active low signal is used by the
system to reset the chip. The active low pulse should be
at least 1 μs wide.
TEST
NC
TEST Input: Tie this pin to ground for normal operation.
12
15
16
17
12
15
16
17
No Connect. No trace or signal should be routed/attached
to these pins.
DIGITAL / POWER
VDD18
VDD33
13
+1.8 V core power. This pin must have a 1.0 μF ± 20%
(ESR <0.1 Ω) capacitor to VSS.
6
14
22
3.3 V Power and Regulator Input
VSS
ePad
Ground Pad/ePad: the package slug is the only VSS for
the device and must be tied to ground with an array of
3x3 vias.
DS00001979A-page 16
2010 - 2015 Microchip Technology Inc.
USB224X
6.2
Buffer Type Descriptions
TABLE 6-2:
Buffer
BUFFER TYPE DESCRIPTIONS
Description
I
Input
IPU
Input with internal weak pull-up resistor
Input with Schmitt trigger
IS
I/O12
I/O200
Input/output buffer with 12 mA sink and 12 mA source
Input/Output buffer 12 mA with FET disabled, 100/200 mA source only when the FET is
enabled
I/O12PD
Input/output buffer with 12 mA sink and 12 mA source with an internal weak pull-down
resistor
I/O12PU
O12
Input/output buffer with 12 mA sink and 12 mA source with a pull-up resistor
Output buffer with 12 mA source
O12PU
O12PD
ICLKx
OCLKx
I/O-U
Output buffer with 12 mA sink and 12 mA source, with a pull-up resistor
Output buffer with 12 mA sink and 12 mA source, with a pull-down resistor
XTAL clock input
XTAL clock output
Analog input/output as defined in the USB 2.0 Specification
RBIAS
I-R
Note:
The DC characteristics are outlined in Section 9.3, on page 32.
2010 - 2015 Microchip Technology Inc.
DS00001979A-page 17
USB224X
7.0
7.1
PIN CONFIGURATIONS
Card Reader
The Microchip USB224x is fully compliant with the following flash media card reader specifications:
• Secure Digital 2.0
- HS-SD and SDHC
- TransFlash™ and reduced form factor media
• MultiMediaCard 4.2
- 1/4/8 bit MMC
• Memory Stick 1.43
• Memory Stick Pro Format 1.02
• Memory Stick Pro-HG Duo Format 1.01
- Memory Stick, MS Duo, HS-MS, MS Pro-HG, MS Pro
• Memory Stick Duo 1.10
• xD-Picture Card 1.2
7.2
System Configurations
7.2.1
EEPROM
The USB224x can be configured via a 2-wire (I2C) EEPROM (512x8) flash device containing the options for the
USB224x. If an external configuration device does not exist the internal default values will be used. If one of the external
devices is used for configuration, the OEM can update the values through the USB interface. The device will then
“attach” to the upstream USB host.
The USBDM tool set is available in the USB224x/USB225x Card Reader software release package. To download the
software package from Microchip's website, please visit:
http://www.microchip.com/SWLibraryWeb/product.aspx?product=OBJ Card Reader
to go to the OBJ Card Reader Software Download Agreement. Review the license, and if you agree, check the "I agree"
box and then select “Confirm”. You will then be able to download the USB224x/USB225x Card reader combo release
package zip file containing the USBDM tool set. Please note that the following applies to the system values and descrip-
tions when used:
• N/A = Not applicable to this part
• Reserved = For internal use
7.2.2
EEPROM DATA DESCRIPTOR
INTERNAL FLASH MEDIA CONTROLLER CONFIGURATIONS
TABLE 7-1:
Address
00h
Register Name
Description
Internal Default Value
USB_SER_LEN
USB Serial String
Descriptor Length
1Ah
01h
USB_SER_TYP
USB_SER_NUM
USB Serial String
Descriptor Type
03h
02h-19h
USB Serial Number
"000000225001"
(See Note 7-1)
1Ah-1Bh
1Ch-1Dh
1Eh
USB_VID
USB_PID
USB Vendor Identifier
USB Product Identifier
0424
2240
04h
USB_LANG_LEN
USB Language String Descriptor
Length
1Fh
20h
USB_LANG_TYP
USB Language String Descriptor
Type
03h
USB_LANG_ID_LSB
USB Language Identifier
Least Significant Byte
09h
(See Note 7-2)
DS00001979A-page 18
2010 - 2015 Microchip Technology Inc.
USB224X
TABLE 7-1:
Address
21h
INTERNAL FLASH MEDIA CONTROLLER CONFIGURATIONS (CONTINUED)
Register Name
Description
Internal Default Value
USB_LANG_ID_MSB
USB Language Identifier
Most Significant Byte
04h
(See Note 7-2)
22h
23h
USB_MFR_STR_LEN
USB_MFR_STR_TYP
USB_MFR_STR
USB Manufacturer String
Descriptor Length
10h
03h
USB Manufacturer String
Descriptor Type
24h-31h
USB Manufacturer String
“Generic”
(See Note 7-1)
32h-5Dh
5Eh
Reserved
-
00h
24h
USB_PRD_STR_LEN
USB Product String
Descriptor Length
5Fh
USB_PRD_STR_TYP
USB_PRD_STR
USB Product String
Descriptor Type
03h
60h-99h
USB Product String
“Ultra Fast Media Reader"
(See Note 7-1)
9Ah
9Bh
9Ch
9Dh
9Eh
9Fh
A0h
USB_BM_ATT
USB_MAX_PWR
ATT_LB
USB BmAttribute
USB Max Power
Attribute Lo byte
Attribute Hi Lo byte
Attribute Lo Hi byte
Attribute Hi byte
80h
30h (96 mA)
40h (Reverse SD_WP only)
ATT_HLB
00h
00h
00h
08h
ATT_LHB
ATT_HB
MS_PWR_LB
Memory Stick Device
Power Lo byte
A1h
MS_PWR_HB
Memory Stick Device
Power Hi byte
00h
A2h
A3h
A4h
Reserved
Reserved
-
-
80h
00h
00h
xD_PWR_LB
xD-Picture Card Device
Power Lo byte
A5h
A6h
A7h
xD_PWR_HB
SD_PWR_LB
SD_PWR_HB
xD-Picture Card Device
Power Hi byte
08h
00h
80h
Secure Digital Device
Power Lo byte
Secure Digital Device
Power Hi byte
A8h
LED_BLK_INT
LED_BLK_DUR
DEV0_ID_STR
DEV1_ID_STR
DEV2_ID_STR
LED Blink Interval
02h
28h
A9h
LED Blink After Access
Device 0 Identifier String
Device 1 Identifier String
Device 2 Identifier String
AAh - B0h
B1h - B7h
B8h - BEh
“COMBO”
“MS”
“SM”
(See Note 7-3)
BFh - C5h
C6h - CDh
CEh-D2h
D3h
DEV3_ID_STR
INQ_VEN_STR
INQ_PRD_STR
DYN_NUM_LUN
DEV_LUN_MAP
Reserved
Device 3 Identifier String
Inquiry Vendor String
Inquiry Product String
Dynamic Number of LUNs
Device to LUN Mapping
-
“SD/MMC”
“Generic”
2240
FFh
D4h - D7h
D8h - DAh
DBh - DDh
FFh, FFh, FFh, FFh
00h, 03h, 07h
5Ch, 56h, 97h
Reserved
-
2010 - 2015 Microchip Technology Inc.
DS00001979A-page 19
USB224X
TABLE 7-1:
Address
INTERNAL FLASH MEDIA CONTROLLER CONFIGURATIONS (CONTINUED)
Register Name
Description
Internal Default Value
DEh-FBh
FCh-FFh
Note 7-1
Not Applicable
NVSTORE_SIG
-
00h
Non-Volatile Storage Signature
“ATA2”
This value is a UNICODE UTF-16LE encoded string value that meets the USB 2.0 specification
(Revision 2.0, 2000). Values in double quotations without this note are ASCII values.
Note 7-2
For a list of the most current 16-bit language ID’s defined by the USB-IF, please visit
http://www.unicode.org or consult The Unicode Standard, Worldwide Character Encoding, (Version
4.0), The Unicode Consortium, Addison-Wesley Publishing Company, Reading, Massachusetts.
Note 7-3
The “SM” value will be overridden with “xD” once an xD-Picture Card has been identified.
7.2.3
EEPROM DATA DESCRIPTOR REGISTER DESCRIPTIONS
00h: USB Serial String Descriptor Length
7.2.3.1
Byte
Name
Description
0
USB_SER_LEN
USB serial string descriptor length as defined by Section 9.6.7 “String” of the
USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength” which
describes the size of the string descriptor (in bytes).
7.2.3.2
01h: USB Serial String Descriptor Type
Byte
Name
Description
1
USB_SER_TYP
USB serial string descriptor type as defined by Section 9.6.7 “String” of the
USB 2.0 Specification (Revision 2.0, 2000). This field is the “bDescriptorType”
which is a constant value associated with a string descriptor type.
7.2.3.3
02h-19h: USB Serial Number Option
Byte
25:2
Name
Description
Maximum string length is 12 hex digits. Must be unique to each device.
USB_SER_NUM
7.2.3.4
1Ah-1Bh: USB Vendor ID Option
Byte
Name
Description
1:0
USB_VID
This ID is unique for every vendor. The vendor ID is assigned by the USB
Implementer’s Forum.
7.2.3.5
1Ch-1Dh: USB Product ID Option
Byte
Name
Description
This ID is unique for every product. The product ID is assigned by the vendor.
1:0
USB_PID
7.2.3.6
1Eh: USB Language Identifier Descriptor Length
Byte
Name
Description
0
USB_LANG_LEN USB language ID string descriptor length as defined by Section 9.6.7 “String”
of the USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength”
which describes the size of the string descriptor (in bytes).
DS00001979A-page 20
2010 - 2015 Microchip Technology Inc.
USB224X
7.2.3.7
Byte
1Fh: USB Language Identifier Descriptor Type
Name
Description
1
USB_LANG_TYP USB language ID string descriptor type as defined by Section 9.6.7 “String” of
the USB 2.0 Specification (Revision 2.0, 2000). This field is the
“bDescriptorType” which is a constant value associated with a string descriptor
type.
7.2.3.8
20h: USB Language Identifier Least Significant Byte
Byte
Name
Description
2
USB_LANG_ID
_LSB
English language code = ‘0409’. See Note 7-2 to reference additional language
ID’s defined by the USB-IF.
7.2.3.9
21h: USB Language Identifier Most Significant Byte
Byte
Name
Description
3
USB_LANG_ID
_MSB
English language code = ‘0409’. See Note 7-2 to reference additional language
ID’s defined by the USB-IF.
7.2.3.10
22h: USB Manufacturer String Descriptor Length
Byte
Name
Description
0
USB_MFR_STR
_LEN
USB manufacturer string descriptor length as defined by Section 9.6.7 “String”
of the USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength”
which describes the size of the string descriptor (in bytes).
7.2.3.11
23h: USB Manufacturer String Descriptor Type
Byte
Name
Description
1
USB_MFR_STR
_TYP
USB manufacturer string descriptor type as defined by Section 9.6.7 “String” of
the USB 2.0 Specification (Revision 2.0, 2000). This field is the
“bDescriptorType” which is a constant value associated with a string descriptor
type.
7.2.3.12
24h-31h: USB Manufacturer String Option
Byte
Name
Description
15:2
USB_MFR_STR
The maximum string length is 29 characters.
7.2.3.13
32h-5Dh: Reserved
Byte
Name
Description
59:16
Reserved
Reserved.
7.2.3.14
5Eh: USB Product String Descriptor Length
Byte
Name
Description
0
USB_PRD_STR
_LEN
USB product string descriptor length as defined by Section 9.6.7 “String” of the
USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength” which
describes the size of the string descriptor (in bytes). Maximum string length is
29 characters
2010 - 2015 Microchip Technology Inc.
DS00001979A-page 21
USB224X
7.2.3.15
5Fh: USB Product String Descriptor Type
Byte
Name
Description
1
USB_PRD_STR
_TYP
USB product string descriptor type as defined by Section 9.6.7 “String” of the
USB 2.0 Specification (Revision 2.0, 2000). This field is the “bDescriptorType”
which is a constant value associated with a string descriptor type.
7.2.3.16
60h-99h: USB Product String Option
Byte
Name
Description
59:2
USB_PRD_STR
This string will be used during the USB enumeration process in the Windows®
operating system. Maximum string length is 29 characters.
7.2.3.17
9Ah: USB BmAttribute (1 byte)
Bit
Name
Description
7:0
USB_BM_ATT
Self- or Bus-Power: Selects between self- and bus-powered operation.
The hub is either self-powered (draws less than 2 mA of upstream bus power)
or bus-powered (limited to a 100 mA maximum of upstream power prior to
being configured by the host controller).
When configured as a bus-powered device, the Microchip device consumes
less than 100 mA of current prior to being configured. After configuration, the
bus-powered Microchip device (along with all associated device circuitry, any
embedded devices if part of a compound device, and 100 mA per externally
available downstream port) must consume no more than 500 mA of upstream
VBUS current. The current consumption is system dependent, and the OEM
must ensure that the USB 2.0 Specification is not violated.
When configured as a self-powered device, <1 mA of upstream VBUS current
is consumed and all ports are available, with each port being capable of
sourcing 500 mA of current.
80 = Bus-powered operation (default)
C0 = Self-powered operation
A0 = Bus-powered operation with remote wake-up
E0 = Self-powered operation with remote wake-up
7.2.3.18
9Bh: USB MaxPower (1 byte)
Bit
Name
Description
7:0
USB_MAX_PWR
USB Max Power per the USB 2.0 Specification. Do NOT set this value greater
than 100 mA.
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2010 - 2015 Microchip Technology Inc.
USB224X
7.2.3.19
9Ch-9Fh: Attribute Byte Descriptions
Byte
Byte Name
Bit
Description
0
ATT_LB
3:0
4
Always reads ‘0’.
Inquire Manufacturer and Product ID Strings
‘1’ - Use the Inquiry Manufacturer and Product ID Strings.
‘0’ (default) - Use the USB Descriptor Manufacturer and Product ID Strings.
Always reads ‘0’.
5
6
Reverse SD Card Write Protect Sense
‘1’ (default) - SD cards will be write protected when SW_nWP is high, and
writable when SW_nWP is low.
‘0’ - SD cards will be write protected when SW_nWP is low, and writable
when SW_nWP is high.
7
3:0
4
Reserved.
1
ATT_HLB
Always reads ‘0’.
Activity LED True Polarity
‘1’ - Activity LED to Low True.
‘0’ (default) - Activity LED polarity to High True.
Common Media Insert / Media Activity LED
5
‘1’ - The activity LED will function as a common media inserted/media
access LED.
‘0’ (default) - The activity LED will remain in its idle state until media is
accessed.
6
7
0
Always reads ‘0’.
Reserved.
2
ATT_LHB
Attach on Card Insert / Detach on Card Removal
‘1’ - Attach on Insert is enabled.
‘0’ (default) - Attach on Insert is disabled.
Always reads ‘0’.
1
2
Enable Device Power Configuration
‘1’ - Custom Device Power Configuration stored in the NVSTORE is used.
‘0’ (default) - Default Device Power Configuration is used.
7:3
6:0
7
Always reads ‘0’.
Always reads ‘0’.
xD Player Mode
3
ATT_HB
7.2.4
A0H-A7H: DEVICE POWER CONFIGURATION
The USB224x has one internal FET which can be utilized for card power. This section describes the default internal
configuration. The settings are stored in NVSTORE and provide the following features:
1. A card can be powered by an external FET or by an internal FET.
2. The power limit can be set to 100 mA or 200 mA (Default) for the internal FET.
Each media uses two bytes to store its device power configuration. Bit 3 selects between internal or external card power
FET options. For internal FET card power control, bits 0 through 2 are used to set the power limit. The “Device Power
Configuration” bits are ignored unless the “Enable Device Power Configuration” bit is set. See Section 7.2.3.19, "9Ch-
9Fh: Attribute Byte Descriptions," on page 23.
2010 - 2015 Microchip Technology Inc.
DS00001979A-page 23
USB224X
7.2.4.1
A0h-A1h: Memory Stick Device Power Configuration
FET
Type
Bits
Bit Type
Low Nibble
Description
0
1
2
FET Lo Byte
MS_PWR_LB
3:0
7:4
3:0
0000b Disabled
0000b Disabled
High Nibble
FET Hi Byte
MS_PWR_HB
Low Nibble
0001b External FET enabled
1000b Internal FET with 100 mA power limit
1010b Internal FET with 200 mA power limit
3
7:4
High Nibble
0000b Disabled
7.2.4.2
A2h-A3h: Not Applicable
Byte
1:0
Name
Description
Not Applicable
Not applicable.
7.2.4.3
A4h-A5h: xD-Picture Card Device Power Configuration
When applicable, the "SM" value will be overridden with “xD” once an xD-Picture Card has been identified.
FET
Type
Bits
Bit Type
Low Nibble
Description
0
1
2
FET Lo Byte
xD_PWR_LB
3:0
7:4
3:0
0000b Disabled
0000b Disabled
High Nibble
FET Hi Byte
xD_PWR_HB
Low Nibble
0001b External FET enabled
1000b Internal FET with 100 mA power limit
1010b Internal FET with 200 mA power limit
3
7:4
High Nibble
0000b Disabled
7.2.4.4
A6h-A7h: Secure Digital Device Power Configuration
FET
Type
Bits
Bit Type
Low Nibble
Description
0
1
2
FET Lo Byte
SD_PWR_LB
3:0
7:4
3:0
0000b Disabled
0000b Disabled
High Nibble
FET Hi Byte
SD_PWR_HB
Low Nibble
0001b External FET enabled
1000b Internal FET with 100 mA power limit
1010b Internal FET with 200 mA power limit
3
7:4
High Nibble
0000b Disabled
7.2.4.5
A8h: LED Blink Interval
Byte
Name
Description
0
LED_BLK_INT
The blink rate is programmable in 50 ms intervals. The high bit (7) indicates
an idle state:
‘0’ - Off
‘1’ - On
The remaining bits (6:0) are used to determine the blink interval up to a max
of 128 x 50 ms.
DS00001979A-page 24
2010 - 2015 Microchip Technology Inc.
USB224X
7.2.4.6
Byte
A9h: LED Blink Duration
Name
Description
1
LED_BLK_DUR
LED Blink After Access. This byte is used to designate the number of seconds
that the LED will continue to blink after a drive access. Setting this byte to "05"
will cause the LED to blink for 5 seconds after a drive access.
7.2.5
DEVICE ID STRINGS
These bytes are used to specify the LUN descriptor returned by the device. These bytes are used in combination with
the device to LUN mapping bytes in applications where the OEM wishes to reorder and rename the LUNs. If multiple
devices are mapped to the same LUN (a COMBO LUN), then the CLUN#_ID_STR will be used to name the COMBO
LUN instead of the individual device strings. When applicable, the "SM" value will be overridden with xD once an xD-
Picture Card has been identified.
7.2.5.1
AAh-B0h: Device 0 Identifier String
Byte
6:0
Name
Description
DEV0_ID_STR
Not applicable.
7.2.5.2
B1h-B7h: Device 1 Identifier String
Byte
Name
Description
6:0
DEV1_ID_STR
This ID string is associated with the Memory Stick device.
7.2.5.3
B8h-BEh: Device 2 Identifier String
Byte
Name
Description
This ID string is associated with the xD-Picture Card device.
6:0
DEV2_ID_STR
7.2.5.4
BFh-C5h: Device 3 Identifier String
Byte
Name
Description
This ID string is associated with the Secure Digital / MultiMediaCard device.
6:0
DEV3_ID_STR
7.2.5.5
C6h-CDh: Inquiry Vendor String
Byte
Name
Description
7:0
INQ_VEN_STR
If bit 4 of the 1st attribute byte is set, the device will use these strings in
response to a USB inquiry command, instead of the USB descriptor
manufacturer and product ID strings.
7.2.5.6
CEh-D2h: Inquiry Product String
Byte
Name
Description
4:0
INQ_PRD_STR
If bit 4 of the 1st attribute byte is set, the device will use these strings in
response to a USB inquiry command, instead of the USB descriptor
manufacturer and product ID strings.
2010 - 2015 Microchip Technology Inc.
DS00001979A-page 25
USB224X
7.2.5.7
D3h: Dynamic Number of LUNs
Bit
7:0
Name
Description
DYN_NUM_LUN
These bytes are used to specify the number of LUNs the device exposes to
the host. These bytes are also used for icon sharing by assigning more than
one LUN to a single icon. This is used in applications where the device utilizes
a combo socket and the OEM wishes to have only a single icon displayed for
one or more interfaces.
If this field is set to "FF", the program assumes that you are using the default
value and icons will be configured per the default configuration.
7.2.5.8
D4h-D7h: Device to LUN Mapping
Byte
Name
Description
3:0
DEV_LUN_MAP
These registers map a device controller (SD/MMC, SM, and MS) to a Logical
Unit Number (LUN). The device reports the mapped LUNs to the USB host in
the USB descriptor during enumeration. The icon installer associates custom
icons with the LUNs specified in these fields.
Setting a register to "FF" indicates that the device is not mapped. Setting all
of the DEV_LUN_MAP registers for all devices to "FF" forces the use of the
default mapping configuration. Not all configurations are valid. Valid
configurations depend on the hardware, packaging, and OEM board layout.
The number of unique LUNs mapped must match the value in the Section
7.2.5.7, "D3h: Dynamic Number of LUNs," on page 26.
7.2.5.9
D8h-FBh: Not Applicable
Byte
Name
Description
35:0
Not Applicable
Not Applicable.
7.2.5.10
FCh-FFh: Non-Volatile Storage Signature
Byte
Name
Description
3:0
NVSTORE_SIG
This signature is used to verify the validity of the data in the first 256 bytes of
the configuration area. The signature must be set to ‘ATA2’ for USB224x.
7.3
Default Configuration Option
The Microchip device can be configured via its internal default configuration. Please see Section 7.2.2, "EEPROM Data
Descriptor" for specific details on how to enable default configuration. Please refer to Table 7-1 for the internal default
values that are loaded when this option is selected.
7.3.1
EXTERNAL HARDWARE RESET_N
A valid hardware reset is defined as assertion of RESET_N for a minimum of 1 μs after all power supplies are within
operating range. While reset is asserted, the device (and its associated external circuitry) consumes less than 500 μA
of current from the upstream USB power source.
Assertion of RESET_N (external pin) causes the following:
1. The PHY is disabled and the differential pair will be in a high-impedance state.
2. All transactions immediately terminate; no states are saved.
3. All internal registers return to the default state.
4. The external crystal oscillator is halted.
5. The PLL is halted.
6. The processor is reset.
7. All media interfaces are reset.
DS00001979A-page 26
2010 - 2015 Microchip Technology Inc.
USB224X
7.3.1.1
RESET_N for EEPROM Configuration
FIGURE 7-1:
RESET_N TIMING FOR EEPROM MODE
Start
completion
request
response
Hardware
reset
asserted
Device
Recovery/
Stabilization
8051 Sets
Configuration
Registers
Attach
USB
Upstream
USB Reset
recovery
Idle
t4
t6
t7
t1
t5
t2
t3
RESET_N
VSS
TABLE 7-2:
Name
RESET_N TIMING FOR EEPROM MODE
Description
MIN
TYP
MAX
Units
t1
t2
t3
t4
t5
t6
t7
RESET_N asserted
1
μsec
μsec
msec
msec
msec
msec
msec
Device recovery/stabilization
8051 programs device configuration
USB attach
500
50
20
100
Host acknowledges attach and signals USB reset
USB idle
100
Undefined
Ready to handle requests (with or without data)
5
Note:
All power supplies must have reached the operating levels mandated in Section 9.0, "DC Parameters," on
page 31, prior to (or coincident with) the assertion of RESET_N.
7.3.2
USB BUS RESET
In response to the upstream port signaling a reset to the device, the device does the following:
1. Sets default address to ‘0’.
2. Sets configuration to: Unconfigured.
3. All transactions are stopped.
4. Processor reinitializes and restarts.
5. All media interfaces are disabled.
2010 - 2015 Microchip Technology Inc.
DS00001979A-page 27
USB224X
8.0
PIN RESET STATES
FIGURE 8-1:
PIN RESET STATES
Hardware
Firmware
Initialization
Operational
Voltage
Signal
RESET
(v)
RESET
VDD33
Time
(t)
VSS
TABLE 8-1:
Symbol
LEGEND FOR PIN RESET STATES TABLE
Description
0
1
Output driven low
Output driven high
IP
PU
PD
--
Input enabled
Hardware enables pull-up
Hardware enables pull-down
Hardware disables function
Z
Hardware disables pad. Both output driver
and input buffers are disabled.
8.1
USB2240/40I/41/41I Pin Reset States
TABLE 8-2:
USB2240/40I/41/41I 36-PIN RESET STATES
Reset State
Input/
Output
Pin
8
Pin Name
xD_D0 / SD_D6 / MS_D7
xD_D1 / SD_D7 / MS_D6
xD_D2 / SD_D0 / MS_D4
xD_D3 / SD_D1 / MS_D5
xD_D4 / SD_WP / MS_SCLK
xD_D5 / SD_D2
Function
none
PU/PD
z
z
--
--
7
none
5
none
z
--
4
none
z
--
30
25
26
24
SD_WP
none
0
--
z
--
SD_nCD
none
IP
IP
pu
pu
MS_INS
none
DS00001979A-page 28
2010 - 2015 Microchip Technology Inc.
USB224X
TABLE 8-2:
USB2240/40I/41/41I 36-PIN RESET STATES (CONTINUED)
Reset State
Input/
Output
Pin
23
20
9
Pin Name
xD_D6 / SD_D3 / MS_D3
xD_D7 / SD_D4 / MS_D2
xD_nWP / SD_CLK / MS_BS
xD_ALE / SD_D5 / MS_D1
xD_CLE / SD_CMD / MS_D0
xD_nCD
Function
none
PU/PD
--
z
z
none
--
none
z
--
10
11
19
1
none
z
--
none
z
--
none
IP
0
z
pu
--
LED
none
16
27
29
31
21
28
18
12
17
15
2
xD_nRE
none
--
RXD / SDA
none
0
0
0
z
--
none
--
TXD / SCK / MS_SKT_SEL
CRD_PWR
TEST
none
--
none
--
TEST
RESET_N
none
IP
IP
z
--
RESET_N
xD_nWE
--
--
xD_nB/R
none
z
--
xD_nCE
none
z
--
USB+
USB+
USB-
z
--
3
USB-
z
--
Note:
xD signals only apply to USB2240/USB2240I.
2010 - 2015 Microchip Technology Inc.
DS00001979A-page 29
USB224X
8.2
USB2244/44I Pin Reset States
TABLE 8-3:
USB2244/USB2244I 36-PIN RESET STATES
Post-Reset State
SD Mode
Reset State
Input/
Output
PU/
PD
PU/
PD
Pin
Pin Name
Function
Function
Output
Input
8
7
SD_D6
SD_D7
SD_D0
SD_D1
SD_WP
SD_D2
SD_D3
SD_D4
SD_CLK
SD_D5
SD_CMD
none
none
z
z
--
--
--
--
--
--
--
--
--
--
--
pu
pu
pu
--
--
--
--
--
--
--
--
--
--
--
SD_D6
SD_D7
SD_D0
SD_D1
SD_WP
SD_D2
SD_D3
SD_D4
SD_CLK
SD_D5
SD_CMD
hw
hw
hw
hw
(fw)
hw
hw
hw
hw
hw
hw
pu
pu
pu
pu
(fw)
pu
pu
pu
--
yes
yes
yes
yes
(fw)
yes
yes
yes
yes
yes
yes
5
none
z
4
none
z
30
25
23
20
9
SD_WP
none
0
z
none
z
none
z
none
z
10
11
19
26
24
27
29
31
21
28
18
1
none
z
pu
pu
none
z
none
IP
IP
IP
0
0
0
z
SD_nCD
none
none
RXD / SDA
none
RXD
z
pu
yes
none
TXD / SCK
CRD_PWR
TEST
none
TXD
hw
--
--
--
--
none
PWR
VDD
TEST
RESET_N
none
IP
IP
0
z
RESET_N
LED
17:15
12
2
NC
none
none
none
z
z
--
--
--
--
NC
none
z
USB+
USB+
USB-
z
3
USB-
z
35
33
32
RBIAS
XTAL1 (CLKIN)
XTAL2
DS00001979A-page 30
2010 - 2015 Microchip Technology Inc.
USB224X
9.0
9.1
DC PARAMETERS
Maximum Ratings
Parameter
Symbol
TA
MIN
MAX
Units
°C
Comments
Storage
Temperature
-55
150
4.0
Lead
Temperature
°C
V
Please refer to JEDEC
specification J-STD-020D.
3.3 V supply
voltage
VDD33
-0.5
-0.5
Voltage on
USB+ and USB-
pins
(3.3 V supply voltage + 2) ≤ 6
V
Voltage on
CRD_PWR
-0.5
VDD33 + 0.3
V
When internal power FET
operation of this pin is enabled,
this pin may be simultaneously
shorted to ground or any voltage
up to 3.63 V indefinitely, without
damage to the device as long as
VDD33 and VDDA33 are less than
3.63 V and TA is less than 70oC.
Voltage on any
signal pin
-0.5
-0.5
-0.5
VDD33 + 0.3
3.6
V
V
V
Voltage on
XTAL1
Voltage on
XTAL2
VDD18 + 0.3
Note 9-1
Stresses above the specified parameters may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at any condition above those indicated in the
operation sections of this specification is not implied.
Note 9-2
When powering this device from laboratory or system power supplies, it is important that the absolute
maximum ratings not be exceeded or device failure can result. Some power supplies exhibit voltage
spikes on their outputs when the AC power is switched on or off. In addition, voltage transients on
the AC power line may appear on the DC output. When this possibility exists, it is suggested that a
clamp circuit be used.
FIGURE 9-1:
SUPPLY RISE TIME MODEL
Voltage
tRT
VDD33
3.3 V
100%
90%
10%
VSS
t90%
Time
t10%
2010 - 2015 Microchip Technology Inc.
DS00001979A-page 31
USB224X
9.2
Operating Conditions
Parameter
Symbol
TA
MIN
MAX
Units
°C
Comments
Commercial Part
0
70
Operating Temperature
Industrial Part
TA
-40
3.0
0
85
°C
V
Ambient temperature in still air.
(Note 9-3)
3.3 V supply voltage
VDD33
3.6
400
5.5
3.3 V supply rise time tRT
μs
V
Voltage on
USB+ and USB- pins
-0.3
If any 3.3 V supply voltage drops
below 3.0 V, then the MAX
becomes:
(3.3 V supply voltage) + 0.5 ≤ 5.5
Voltage on any signal
pin
-0.3
VDD33
V
Voltage on XTAL1
Voltage on XTAL2
-0.3
-0.3
VDD33
VDD18
V
V
Note 9-3
A 3.3 V regulator with an output tolerance of 1% must be used if the output of the internal power
FETs must support a 5% tolerance.
9.3
DC Electrical Characteristics
Parameter
Symbol
MIN
TYP
MAX
Units
Comments
I, IPU, IPD Type Input Buffer
Low Input Level
VILI
VIHI
PD
PU
0.8
V
V
TTL Levels
High Input Level
2.0
Pull Down
72
58
μA
μA
Pull Up
IS Type Input Buffer
Low Input Level
High Input Level
VILI
VIHI
0.8
V
V
TTL Levels
2.0
Hysteresis
VHYSI
420
mV
ICLK Input Buffer
Low Input Level
High Input Level
Input Leakage
VILCK
VIHCK
IIL
0.5
V
V
1.4
-10
+10
μA
VIN = 0 to VDD33
Input Leakage
(All I and IS buffers)
Low Input Leakage
High Input Leakage
IIL
-10
-10
+10
+10
μA
μA
VIN = 0
IIH
VIN = VDD33
DS00001979A-page 32
2010 - 2015 Microchip Technology Inc.
USB224X
Parameter
O12 Type Buffer
Symbol
MIN
TYP
MAX
Units
Comments
Low Output Level
High Output Level
Output Leakage
VOL
0.4
V
IOL = 12 mA @
VDD33= 3.3 V
VOH
VDD33
- 0.4
V
IOH = -12 mA @
VDD33= 3.3 V
IOL
-10
+10
0.4
μA
VIN = 0 to VDD33
(Note 9-4)
I/O12, I/O12PU & I/O12PD Type
Buffer
Low Output Level
High Output Level
Output Leakage
VOL
VOH
IOL
V
V
IOL = 12 mA @
VDD33= 3.3 V
VDD33
- 0.4
IOH = -12 mA @
VDD33= 3.3 V
-10
+10
μA
VIN = 0 to VDD33
(Note 9-4)
Pull Down
Pull Up
PD
PU
72
58
μA
μA
IO-U
(Note 9-5)
I-R
(Note 9-6)
I/O200
Integrated Power FET for
CRD_PWR
High Output Current Mode
IOUT
IOUT
200
100
mA
mA
VdropFET = 0.46 V
VdropFET = 0.23 V
Low Output Current Mode
(Note 9-7)
On Resistance
(Note 9-7)
RDSON
2.1
Ω
IFET = 70 mA
Output Voltage Rise Time
Supply Current Unconfigured
Supply Current Active
tDSON
800
90
μs
CLOAD = 10 μF
ICCINIT
80
mA
ICC
ICC
110
135
140
165
mA
mA
Full Speed
High Speed
Supply Current Suspend
Industrial Temperature Suspend
ICSBY
ICSBYI
350
350
700
900
µA
µA
2010 - 2015 Microchip Technology Inc.
DS00001979A-page 33
USB224X
Note 9-4
Note 9-5
Note 9-6
Note 9-7
Output leakage is measured with the current pins in high impedance.
See The USB 2.0 Specification, Chapter 7, for USB DC electrical characteristics
RBIAS is a 3.3 V tolerant analog pin.
Output current range is controlled by program software, software disables FET during short circuit
condition.
Note 9-8
Note 9-9
The assignment of each Integrated Card Power FET to a designated Card Connector is controlled
by both firmware and the specific board implementation.
The 3.3 V supply should be at least at 75% of its operating condition before the 1.8 V supply is
allowed to ramp up.
9.4
Capacitance
TA = 25°C; fc = 1 MHz; VDD, VDDP = 1.8 V
TABLE 9-1: PIN CAPACITANCE
Parameter
Limits
TYP
Symbol
Unit
Test Condition
MIN
MAX
Clock Input Capacitance
CXTAL
2
pF
All pins (except USB pins and
pins under test) are tied to AC
ground.
Input Capacitance
Output Capacitance
CIN
10
20
pF
pF
COUT
9.5
Package Thermal Specification
TABLE 9-2:
36-PIN QFN PACKAGE THERMAL PARAMETERS
Velocity
Parameter
Symbol
Value
Unit
(Meters/Sec)
Thermal Resistance
0
1
2
0
1
2
33.2
29
ΘJA
°C/W
26
Junction-to-Top-of-Package
2.6
2.6
2.6
ΨJT
°C/W
Note 9-10
Thermal parameters are measured or estimated for devices with the exposed pad soldered to thermal
vias in a multilayer 2S2P PCB per JESD51. Thermal resistance is measured from the die to the
ambient air.
DS00001979A-page 34
2010 - 2015 Microchip Technology Inc.
USB224X
10.0 AC SPECIFICATIONS
10.1 Oscillator/Crystal
Parallel Resonant, Fundamental Mode, 24 MHz 350 ppm.
FIGURE 10-1:
TYPICAL CRYSTAL CIRCUIT
XTAL1
(CS1 = CB1 + CXTAL1
)
C1
1 M
Crystal
CL
C0
C2
XTAL2
(CS2 = CB2 + CXTAL2
)
TABLE 10-1: CRYSTAL CIRCUIT LEGEND
SYMBOL
C0
DESCRIPTION
IN ACCORDANCE WITH
Crystal shunt capacitance
Crystal load capacitance
Total board or trace capacitance
Stray capacitance
Crystal manufacturer’s specification (See Note 10-1)
CL
CB
OEM board design
MCHP IC and OEM board design
MCHP IC
CS
CXTAL
C1
XTAL pin input capacitance
Load capacitors installed on OEM
board
Calculated values based on Figure 10-2, "Capacitance
Formulas" (See Note 10-2)
C2
FIGURE 10-2:
CAPACITANCE FORMULAS
C1 = 2 x (CL – C0) – CS1
C2 = 2 x (CL – C0) – CS2
Note 10-1
Note 10-2
C0 is usually included (subtracted by the crystal manufacturer) in the specification for CL and should
be set to ‘0’ for use in the calculation of the capacitance formulas in Figure 10-2, "Capacitance
Formulas". However, the OEM PCB itself may present a parasitic capacitance between XTAL1 and
XTAL2. For an accurate calculation of C1 and C2, take the parasitic capacitance between traces
XTAL1 and XTAL2 into account.
Each of these capacitance values is typically approximately 18 pF.
2010 - 2015 Microchip Technology Inc.
DS00001979A-page 35
USB224X
10.2 Ceramic Resonator
24 MHz 350 ppm
FIGURE 10-3:
CERAMIC RESONATOR USAGE WITH MCHP IC
XTAL1
24 MHz
Ceramic
Resonator
1 M
XTAL2
10.3 External Clock
50% Duty cycle 10%, 24 MHz 350 ppm, Jitter < 100 ps rms.
The external clock is recommended to conform to the signaling level designated in the JESD76-2 specification on 1.8
V CMOS Logic. XTAL2 should be treated as a no connect or drive only a CMOS-like buffer.
DS00001979A-page 36
2010 - 2015 Microchip Technology Inc.
USB224X
11.0 PACKAGE OUTLINE
TABLE 11-1: USB224X 36-QFN, 6X6 MM BODY, 0.5 MM PITCH
2010 - 2015 Microchip Technology Inc.
DS00001979A-page 37
USB224X
TABLE 11-1: USB224X 36-QFN, 6X6 MM BODY, 0.5 MM PITCH (CONTINUED)
DS00001979A-page 38
2010 - 2015 Microchip Technology Inc.
USB224X
APPENDIX A: DATA SHEET REVISION HISTORY
TABLE A-1:
REVISION HISTORY
SECTION/FIGURE/ENTRY
REVISION
CORRECTION
DS00001979A (07-13-15)
Replaces previous SMSC version Rev. 2.1 (02-07-13)
GPIOs and SDIO support removed
USB2242 removed
Rev. 2.1
(02-07-13)
Document co-branded: Microchip logo added to cover; company disclaimer
modified.
Added the following to the ordering information: “Please contact your SMSC sales
representative for additional documentation related to this product such as
application notes, anomaly sheets, and design guidelines.”
Rev 2.1
(12-22-10)
Chapter 3, Figure 3.1, 3.2,
and 3.3
Upgraded to put the mux for the multiplexed
interface inside the part, put in a SPI interface for
outside access to the Program Memory I/O bus.
Rev 2.1
(11-23-10)
Chapter 6, Table 6.1
Removed “ It may not be used to drive any
external circuitry other than the crystal circuit” from
the XTAL2 description.
Rev. 2.1
Chapter 11, Table 11.3
Changed the active level from L to H for GPIO6.
(10-21-10)
2010 - 2015 Microchip Technology Inc.
DS00001979A-page 39
USB224X
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make
files and information easily available to customers. Accessible by using your favorite Internet browser, the web site con-
tains the following information:
• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s
guides and hardware support documents, latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion
groups, Microchip consultant program member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of semi-
nars and events, listings of Microchip sales offices, distributors and factory representatives
CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive
e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or
development tool of interest.
To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notifi-
cation” and follow the registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales
offices are also available to help customers. A listing of sales offices and locations is included in the back of this docu-
ment.
Technical support is available through the web site at: http://www.microchip.com/support
DS00001979A-page 40
2010 - 2015 Microchip Technology Inc.
USB224X
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
[X]
XXX
[X]
-
[X]
-
-
a)
b)
c)
d)
e)
f)
USB2240-AEZG-06 36-pin QFN RoHS Compli-
ant pkg, Commercial Temp, Tray
USB2240-AEZG-05 36-pin QFN RoHS Compli-
ant pkg, Commercial Temp, Tray
USB2241-AEZG-06 36-pin QFN RoHS Compli-
ant pkg, Commercial Temp, Tray
USB2241-AEZG-05 36-pin QFN RoHS Compli-
ant pkg, Commercial Temp, Tray
USB2244-AEZG-06 36-pin QFN RoHS Compli-
ant pkg, Commercial Temp, Tray
USB2244-AEZG-06-CA1 36-pin QFN RoHS
Compliant pkg, Commercial Temp, Tray
USB2240I-AEZG-06 36-pin QFN RoHS Compli-
ant pkg, Industrial Temp, Tray
Temperature
Range
Package
Internal Microchip Tape & Reel
Code Option
Device:
USB2240, USB2240I, USB2241, USB2241I,
USB2244, USB2244I
Temperature
Range:
Blank
I
= 0°C to +70°C (Extended Commercial)
= -40°C to +85°C (Industrial)
g)
h)
i)
USB2241I-AEZG-06 36-pin QFN RoHS Compli-
ant pkg, Industrial Temp, Tray
Package:
AEZG
= 36-pin QFN
USB2241I-AEZG-06 36-pin QFN RoHS Compli-
ant pkg, Industrial Temp, Tray
Tape and Reel
Option:
Blank
TR
= Standard packaging (tray)
= Tape and Reel (1)
j)
USB2240-AEZG-06-TR 36-pin QFN RoHS
Compliant pkg, Commercial Temp, Tape & Reel
USB2244I-AEZG-06-TR 36-pin QFN RoHS
Compliant pkg, Industrial Temp, Tape & Reel
k)
Note 1: Tape and Reel identifier only appears in the catalog part number descrip-
tion. This identifier is used for ordering purposes and is not printed on the
device package. Check with your Microchip Sales Office for package
availability with the Tape and Reel option. Reel size is 3,000.
2010 - 2015 Microchip Technology Inc.
DS00001979A-page 41
USB224X
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be
superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO
REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Micro-
chip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold
harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or
otherwise, under any Microchip intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck,
MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and
UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK,
MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial
Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their respective companies.
© 2010 - 2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
ISBN: 9781632775665
QUALITY MANAGEMENT SYSTEM
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
CERTIFIED BY DNV
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
== ISO/TS 16949 ==
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS00001979A-page 42
2010 - 2015 Microchip Technology Inc.
Worldwide Sales and Service
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Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
New York, NY
Tel: 631-435-6000
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
San Jose, CA
Tel: 408-735-9110
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
01/27/15
2010 - 2015 Microchip Technology Inc.
DS00001979A-page 43
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