USB2230 [MICROCHIP]

5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs;
USB2230
型号: USB2230
厂家: MICROCHIP    MICROCHIP
描述:

5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs

文件: 总28页 (文件大小:374K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
USB2229/USB2230  
5th Generation Hi-Speed USB Flash Media  
and IrDA Controller with Integrated Card Power FETs  
- 768 Bytes of internal SRAM for general pur-  
pose scratchpad or program execution while  
re-flashing external ROM  
- Two, Double Buffered Bulk Endpoints  
- Two, Bi-directional 512 Byte Buffers for Bulk  
Endpoints  
- 64 Byte RX Control Endpoint Buffer  
- 64 Byte TX Control Endpoint Buffer  
IrDA Controller  
• IrDA v1.1 FIR and SIR Compliant Controller, with  
9.6K, 19.2K, 38.4K, 57.6K, 115.2K, 0.576Mbps,  
1.152Mpbs and 4Mbps data rate support.  
Flash Media Controller  
• Complete System Solution for interfacing Smart-  
Media(SM) or xD Picture Card(xD)1, Memory  
Stick(MS), High Speed Memory Stick (HSMS),  
Memory Stick PRO (MSPRO), MS Duo, Secure  
Digital (SD), High Speed SD, Mini-Secure Digital  
(Mini-SD), TransFlash (SD), MultiMediaCard™  
(MMC), Reduced Size MultiMediaCard (RS-  
MMC), NAND Flash, Compact Flash(CF) and  
CF UltraI & II, and CF form-factor ATA hard  
drives to Hi-Speed USB  
• Internal or External Program Memory Interface  
- 76K Byte Internal Code Space or Optional  
128K Byte External Code Space using Flash,  
SRAM or EPROM memory.  
• On Board 24Mhz Crystal Driver Circuit  
• Can be clocked by 48MHz external source  
• On-Chip 1.8V Regulator for Low Power Core  
Operation  
- Supports USB Bulk Only Mass Storage Com-  
pliant Bootable BIOS  
• Internal PLL for 480Mhz Hi-Speed USB Sampling,  
Configurable MCU clock  
• Support for simultaneous operation of all above  
devices. (only one at a time of each of the follow-  
ing groups supported: CF or ATA drive, SM or XD  
or NAND, SD or MMC)  
• Supports firmware upgrade via USB bus if “boot  
block” Flash program memory is used  
• 12 GPIOs for special function use: LED indica-  
tors, button inputs, power control to memory  
devices, etc.  
• On-Chip 4-Bit High Speed Memory Stick and MS  
PRO Hardware Circuitry  
- Inputs capable of generating interrupts with  
either edge sensitivity  
• On-Chip firmware reads and writes High Speed  
Memory Stick and MS PRO  
• Attribute bit controlled features:  
• 1-bit ECC correction performed in hardware for  
maximum efficiency  
- Activity LED polarity/operation/blink rate  
- Full or Partial Card compliance checking  
- Bus or Self Powered  
- LUN configuration and assignment  
- Write Protect Polarity  
- SmartDetach - Detach from USB when no  
Card Inserted for Notebook apps  
- Cover Switch operation for xD compliance  
- Inquiry Command operation  
• Hardware support for SD Security Command  
Extensions  
• On-chip power FETs with short circuit protection  
for supplying flash media card power  
• USB Bus Power Certified  
• 3.3 Volt I/O with 5V input tolerance on VBUS/  
GPIO3  
- SD Write Protect operation  
- Older CF card support  
- Force USB 1.1 reporting  
- Internal or External Power FET operation  
• Complete USB Specification 2.0 Compatibility for  
Bus Powered Operation  
- Includes Hi-Speed USB Transceiver  
- A Bi-directional Control and two Bi-directional  
Bulk Endpoints are provided.  
• Compatible with Microsoft WinXP, WinME, Win2K  
SP3, Apple OS10, Softconnex, and Linux Multi-  
LUN Mass Storage Class Drivers  
• 8051 8 bit microprocessor  
- Provides low speed control functions  
- 30 Mhz execution speed at 1 clock per  
instruction cycle average  
- 12K Bytes of internal SRAM for general pur-  
pose scratchpad  
• Win2K, Win98/98SE and Apple OS8.6 and OS9  
Multi-LUN Mass Storage Class Drivers available  
from Microchip  
• 128-Pin TQFP RoHS Compliant package (1.0mm  
height, 14mmx14mm footprint)  
1.xD Picture Card not applicable to USB2229.  
2005-2016 Microchip Technology Inc.  
DS00002252A-page 1  
USB2229/USB2230  
TO OUR VALUED CUSTOMERS  
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip  
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and  
enhanced as new volumes and updates are introduced.  
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via  
E-mail at docerrors@microchip.com. We welcome your feedback.  
Most Current Data Sheet  
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:  
http://www.microchip.com  
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.  
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).  
Errata  
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for cur-  
rent devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the  
revision of silicon and revision of document to which it applies.  
To determine if an errata sheet exists for a particular device, please check with one of the following:  
Microchip’s Worldwide Web site; http://www.microchip.com  
Your local Microchip sales office (see last page)  
When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature number) you are  
using.  
Customer Notification System  
Register on our web site at www.microchip.com to receive the most current information on all of our products.  
DS00002252A-page 2  
2005-2016 Microchip Technology Inc.  
USB2229/USB2230  
Table of Contents  
1.0 General Description ........................................................................................................................................................................ 4  
2.0 Pin Table ......................................................................................................................................................................................... 6  
3.0 Block Diagram ................................................................................................................................................................................. 9  
4.0 Pin Configuration .......................................................................................................................................................................... 10  
5.0 Pin Descriptions ............................................................................................................................................................................ 11  
6.0 DC Parameters ............................................................................................................................................................................. 18  
7.0 Package Information ..................................................................................................................................................................... 22  
8.0 GPIO Usage .................................................................................................................................................................................. 23  
Appendix A: Data Sheet Revision History ........................................................................................................................................... 24  
The Microchip Web Site ...................................................................................................................................................................... 25  
Customer Change Notification Service ............................................................................................................................................... 25  
Customer Support ............................................................................................................................................................................... 25  
Product Identification System ............................................................................................................................................................. 26  
2005-2016 Microchip Technology Inc.  
DS00002252A-page 3  
USB2229/USB2230  
1.0  
GENERAL DESCRIPTION  
The USB2229/USB2230 is a Hi-Speed USB IrDA and Bulk Only Mass Storage Class Peripheral Controller. The Bulk  
Only Mass Storage Class Peripheral Controller supports CompactFlash (CF) in True IDE Mode only, SmartMedia (SM),  
Memory Stick (MS) including both serial and parallel interface and Secure Digital/MultiMediaCard (SD/MMC) flash  
memory devices. It provides a single chip solution for the most popular flash memory cards in the market. In addition,  
the IrDA controller consists of the Microchip IrCC block, which includes a Synchronous Communications Engine (SCE).  
The IrCC SCE supports FIR and SIR IrDA. The IrCC offers flexible signal routing and programmable output control  
through the Raw mode interface, General Purpose Data pins and Output Multiplexer. Chip-level address decoding is  
required to access the IrCC register set.  
The device consists of a USB2.0 PHY and SIE, buffers, Fast 8051 microprocessor with expanded scratchpad, and pro-  
gram SRAM, and IrDA, CF, MS, SM and SD controllers. The SD controller supports both SD and MMC devices.  
Provisions for external Flash Memory up to 128K bytes for program storage is provided (note: when Bank switching is  
enabled the upper 64K will map into the 8051 ROM space, otherwise, only the first 64K bytes is used).  
12K bytes of scratchpad SRAM and 768Bytes of program SRAM are also provided.  
Twelve GPIO pins are provided for indicators, external serial EEPROM for OEM ID and system configuration informa-  
tion, and other special functions.  
Internal power FETs are provided to directly supply power to the xD/SM, MMC/SD and MS/MSPro cards.  
The internal ROM program is capable of implementing any combination of single or multi-LUN CF/SD/MMC/SM/MS  
reader functions with individual card power control and activity indication. Microchip also provides licenses** for Win98  
and Win2K drivers and setup utilities. Note: Please check with Microchip for precise features and capabilities for the  
current ROM code release.  
1.1  
Acronyms  
SM:  
SmartMedia  
SMC:  
FM:  
SmartMedia Controller  
Flash Media  
FMC:  
CF:  
Flash Media Controller  
Compact Flash  
CFC:  
SD:  
CompactFlash Controller  
Secure Digital  
SDC:  
MMC:  
MS:  
Secure Digital Controller  
MultiMediaCard  
Memory Stick  
MSC:  
TPC:  
ECC:  
CRC:  
Memory Stick Controller  
Transport Protocol Code.  
Error Checking and Correcting  
Cyclic Redundancy Checking  
1.2  
Reference Documents  
1. SmartMediaElectrical Specification Version 1.30  
2. SmartMediaPhysical Format Specifications Version 1.30  
3. SmartMediaLogical Format Specifications Version 1.20  
4. SMIL (SmartMedia Interface Library) Software Edition Version 1.00, Toshiba Corporation, 01, July, 2000  
5. SMIL (SmartMedia Interface Library) Hardware Edition Version 1.00, Toshiba Corporation, 01, July, 2000  
6. MultiMediaCard System Specification Version 2.2  
7. SD Memory Card Specifications, Part 1, Physical Layer Specification Version 1.10, April 2003, SD Group  
8. SD Memory Card Specifications, Part 2, File System Specification Version 1.01, April 15th, 2001, SD Group  
9. SD Memory Card Specifications, Part 3, Security Specification Version 1.01, April 15th, 2001, SD Group  
DS00002252A-page 4  
2005-2016 Microchip Technology Inc.  
USB2229/USB2230  
10. SD Card Specification, Part E1, Secure Digital Input/Output (SDIO) card Specification, Version 1.00, October  
2001, SD Group.  
11. Memory Stick Standard Excerption from Format Specification v1.3, July, 2000, Sony Corporation.  
12. Memory Stick Standard Format Specifications ver 2.0 (Memory Stick PRO). Tentative Release 0.81, February,  
2002  
13. CompactFlash Specification Rev 1.4  
14. CF+ & CF Specification Rev. ATA-5 Draft 0.2  
15. Universal Serial Bus Specification Rev 2.0  
16. Samsung K9K2G08Q0M Data Sheet  
17. xD Picture Card, Card Specification Version 1.10 (Jan 31, 2004)  
18. xD Picture Card, Format Specification Version 1.10 (Jan 31, 2004)  
19. xD Picture Card, Host Guideline Version 1.10 (Jan 31, 2004)  
20. xD Picture Card, Compliance Guideline Version 1.10 (Jan 31, 2004)  
2005-2016 Microchip Technology Inc.  
DS00002252A-page 5  
USB2229/USB2230  
2.0  
2.1  
PIN TABLE  
128-Pin Package  
TABLE 2-1:  
USB2229/USB2230 128-PIN PACKAGE  
CompactFlash INTERFACE (28 Pins)  
CF_D0  
CF_D1  
CF_D5  
CF_D2  
CF_D6  
CF_D3  
CF_D7  
CF_D4  
CF_D8  
CF_D9  
CF_D10  
CF_D14  
CF_IRQ  
CF_nCS1  
CF_nCD1  
CF_D11  
CF_D12  
CF_nIOR  
CF_IORDY  
CF_SA1  
CF_D13  
CF_nIOW  
CF_nCS0  
CF_SA2  
CF_D15  
CF_nRESET  
CF_SA0  
CF_nCD2  
SmartMedia INTERFACE (17 Pins)  
SM_D0  
SM_D4  
SM_D1  
SM_D5  
SM_D2  
SM_D3  
SM_D7  
SM_D6  
SM_nRE  
SM_nCE  
SM_ALE  
SM_nWP  
SM_nWPS  
SM_CLE  
SM_nB/R  
SM_nWE  
SM_nCD  
Memory Stick INTERFACE (7 Pins)  
MS_BS  
MS_D1  
MS_SDIO/MS_D0  
MS_D2  
MS_SCLK  
MS_INS  
MS_D3  
SD INTERFACE (7 Pins)  
SD_CMD  
SD_DAT2  
SD_CLK  
SD_DAT0  
SD_nWP  
SD_DAT1  
SD_DAT3  
USB INTERFACE (10 Pins)  
USBDP  
USBDM  
VSSPLL  
XTAL2  
ATEST  
RBIAS  
VSSA  
VDD18PLL  
XTAL1/CLKIN  
VDDA33  
MEMORY/IO INTERFACE (27 Pins)  
MA0/CLK_SEL0  
MA4  
MA1/CLK_SEL1  
MA5  
MA2/SEL_CLKDRV  
MA3/TX_POL  
MA7  
MA6  
MA10  
MA14  
MD2  
MA8  
MA9  
MA11  
MA12  
MA13  
MA15  
MD0  
MD1  
MD3  
MD4  
MD5  
MD6  
MD7  
nMRD  
nMWR  
nMCE  
MISC (15 Pins)  
GPIO1  
GPIO5  
GPIO2  
GPIO3  
GPIO7  
GPIO4  
GPIO6/ROMEN/MA16  
GPIO8/  
CRD_PWR0  
GPIO9  
GPIO10/  
CRD_PWR1  
GPIO11/  
CRD_PWR2  
GPIO12  
nTEST0  
nTEST1  
nRESET  
IrDA (3 PINS)  
IR_RXD/RX  
IR_TXD/TX  
IR_MODE  
DS00002252A-page 6  
2005-2016 Microchip Technology Inc.  
USB2229/USB2230  
TABLE 2-1:  
USB2229/USB2230 128-PIN PACKAGE (CONTINUED)  
DIGITAL, POWER, GROUND & NC (14 Pins)  
(2)VDD18 (7)VSS  
(5)VDD33  
Total 128  
2.2  
128-Pin List Table  
TABLE 2-2:  
USB2229/USB2230 128-PIN TQFP  
Pin #  
Name  
MA Pin #  
Name  
MA Pin #  
Name  
MA Pin #  
Name  
MA  
1
2
3
4
5
6
MA13  
MA14  
VDD33  
MA15  
MD0  
8
8
-
33  
34  
35  
36  
37  
38  
CF_D1  
CF_D2  
CF_D3  
CF_D4  
CF_D5  
CF_D6  
8
8
8
8
8
8
65  
66  
67  
68  
69  
70  
SM_D0  
SM_D1  
SM_D2  
SM_D3  
SM_D4  
SM_D5  
8
8
8
8
8
8
97  
98  
VSS  
RBIAS  
-
-
-
-
-
-
99  
ATEST  
8
8
8
100  
101  
102  
VDD33  
VDD18PLL  
MD1  
XTAL1/  
CLKIN  
7
8
MD2  
MD3  
MD4  
MD5  
8
8
8
8
39  
40  
41  
42  
CF_D7  
CF_D8  
CF_D9  
8
8
8
8
71  
72  
73  
74  
SM_D6  
SM_D7  
8
8
8
8
103  
104  
105  
106  
XTAL2  
VSSPLL  
GPIO9  
VDD18  
-
-
9
SM_ALE  
SM_nWP  
8
-
10  
GPIO8/  
CRD_PWR0  
11  
12  
MD6  
MD7  
8
8
43  
44  
VDD33  
-
75  
76  
SM_CLE  
8
-
107  
108  
GPIO7  
VDD33  
8
-
GPIO11/  
CRD_PWR2  
8
SM_nWPS  
13  
nMRD  
8
45  
CF_D10  
8
77  
SM_nB/R  
-
109  
GPIO6/  
ROMEN/  
MA16  
8
14  
15  
nMWR  
VSS  
8
-
46  
47  
CF_D11  
VSS  
8
-
78  
79  
SM_nCD  
-
110  
111  
GPIO5  
GPIO4  
8
8
GPIO10/  
CRD_PWR1  
8
16  
17  
18  
19  
VSS  
nMCE  
-
8
-
48  
49  
50  
51  
CF_D12  
VDD18  
8
-
80  
81  
82  
83  
VDD33  
SM_nRE  
SM_nWE  
SM_nCE  
-
112  
113  
114  
115  
VSS  
nRESET  
GPIO2  
GPIO1  
-
8
8
-
8
8
8
MS_INS  
CF_D13  
CF_D14  
8
8
MS_D0/  
MS_SDIO  
8
20  
21  
22  
MS_D1  
MS_D2  
MS_D3  
8
8
8
52  
53  
54  
CF_D15  
CF_nCD1  
CF_nCD2  
8
-
84  
85  
86  
VSS  
VSS  
-
-
-
116  
117  
118  
MA0/  
CLK_SEL0  
8
8
8
MA1/  
CLK_SEL1  
-
VSSA  
MA2/  
SEL_  
CLKDRV  
23  
MS_  
SCLK  
8
55  
CF_IRQ  
8
87  
USBDM  
-
119  
MA3/  
TX_POL  
8
24  
25  
26  
27  
28  
MS_BS  
SD_nWP  
SD_DAT0  
SD_DAT1  
SD_DAT2  
8
-
56  
57  
58  
59  
60  
CF_IORDY  
CF_nIOR  
8
8
8
8
8
88  
89  
90  
91  
92  
USBDP  
VDDA33  
-
-
120  
121  
122  
123  
124  
MA4  
MA5  
MA6  
MA7  
MA8  
8
8
8
8
8
8
8
8
CF_nIOW  
CF_nRESET  
CF_nCS0  
IR_MODE  
IR_RXD/RX  
IR_TXD/TX  
8
8
8
2005-2016 Microchip Technology Inc.  
DS00002252A-page 7  
USB2229/USB2230  
TABLE 2-2:  
USB2229/USB2230 128-PIN TQFP (CONTINUED)  
Pin #  
Name  
MA Pin #  
Name  
MA Pin #  
Name  
MA Pin #  
Name  
MA  
29  
30  
31  
32  
SD_DAT3  
SD_CMD  
SD_CLK  
CF_D0  
8
8
-
61  
62  
63  
64  
CF_nCS1  
CF_SA0  
CF_SA1  
CF_SA2  
8
8
8
-
93  
94  
95  
96  
GPIO12  
GPIO3  
8
8
-
125  
126  
127  
128  
MA9  
MA10  
MA11  
MA12  
8
8
8
8
nTEST1  
nTEST0  
8
-
DS00002252A-page 8  
2005-2016 Microchip Technology Inc.  
3.0  
BLOCK DIAGRAM  
2.25KB  
SRAM  
Flash Media  
Controllers  
(FMC)  
512 Bytes EP3 TX/RX Buffer B  
512 Bytes EP3 TX/RX Buffer A  
512 Bytes EP2 TX/RX Buffer B  
Memory  
Cards  
Auto address generators  
Flash Media DMA Unit  
DATA  
Address  
512 Bytes EP2 TX/RX Buffer A  
64 Bytes EP1RX  
CF  
Controller  
EP0TX_BC  
EP0RX_BC  
EP1TX_BC  
EP1RX_BC  
RAMWR_A/B  
RAMRD_A/B  
RAMWR_C/D  
RAMRD_C/D  
Address  
Address  
Address  
Address  
Address  
Address  
Address  
Address  
Control/  
64 Bytes EP1TX  
CF  
Status  
64 Bytes EP0RX  
DATA  
64 Bytes EP0TX  
SM  
Controller  
Control/  
Status  
ECC  
Control/  
Status  
D
a
SM/SSFDC  
t
a
Data @ 32 bit  
15MHz  
32 Bit  
B
60MHz  
u
s
s
DATA  
DATA  
MS  
MS/HS MS/MS PRO  
SD/MMC  
CRC  
CRC  
Latch phase 3  
8051  
Latch phase 0, 2  
SIE  
Controller  
Control/  
Status  
SD  
Controller  
Control/  
Status  
12K Byte  
Scratchpad  
SRAM  
#LOCKED BY0HASE ꢀ#LOCK  
IR  
Transceiver  
IrDA + 128Byte FIFO  
SIE  
32 bit 15MHz Data Bus  
( Serial Interface Engine )  
SIE Control Regs  
USB 2.0 PHY  
( Transciever )  
Configuration and Control  
PWR_FET0  
GPIO8/CRD_PWR0  
PWR_FET1  
PWR_FET2  
GPIO10/CRD_PWR1  
GPIO11/CRD_PWR2  
Clock Generation  
Osc  
Interrupt Controller  
GPIO  
12 pins  
Scratchpad  
SRAM (768 Byte)  
ROMEN  
76K ROM  
FAST 8051  
CPU CORE  
CLOCKOUT  
24 MHz  
Program Memory/ IO  
Bus  
MEM/IO Bus  
29pins  
#LOCKED BY 0HASE ꢃ #LOCK  
USB2229/USB2230  
4.0  
PIN CONFIGURATION  
FIGURE 4-1:  
USB2229/USB2230 128-PIN TQFP  
1
96  
MA13  
MA14  
VDD33  
MA15  
MD0  
nTEST0  
nTEST1  
GPIO3  
GPIO12  
IR_TXD/TX  
IR_RXD/RX  
IR_MODE  
VDDA33  
USBDP  
USBDM  
VSSA  
VSS  
VSS  
SM_nCE  
SM_nWE  
SM_nRE  
VDD33  
MD1  
MD2  
MD3  
MD4  
MD5  
MD6  
MD7  
nMRD  
nMWR  
VSS  
VSS  
nMCE  
MS_INS  
USB2230  
GPIO10/CRD_PWR1  
SM_nCD  
SM_nB/R  
SM_nWPS  
SM_CLE  
SM_nWP  
SM_ALE  
SM_D7  
MS_D0/MS_SDIO  
MS_D1  
MS_D2  
MS_D3  
MS_SCLK  
MS_BS  
SD_nWP  
SD_DAT0  
SD_DAT1  
SD_DAT2  
SD_DAT3  
SD_CMD  
SD_CLK  
CF_D0  
SM_D6  
SM_D5  
SM_D4  
SM_D3  
SM_D2  
SM_D1  
32  
SM_D0  
64  
DS00002252A-page 10  
2005-2016 Microchip Technology Inc.  
USB2229/USB2230  
5.0  
PIN DESCRIPTIONS  
This section provides a detailed description of each signal. The signals are arranged in functional groups according to  
their associated interface.  
The “n” symbol in the signal name indicates that the active, or asserted state occurs when the signal is at a low voltage  
level. When “n” is not present before the signal name, the signal is asserted when at the high voltage level.  
The terms assertion and negation are used exclusively. This is done to avoid confusion when working with a mixture of  
“active low” and “active high” signal. The term assert, or assertion indicates that a signal is active, independent of  
whether that level is represented by a high or low voltage. The term negate, or negation indicates that a signal is inactive.  
5.1  
Pin Descriptions  
TABLE 5-1:  
Name  
USB2229/USB2230 PIN DESCRIPTIONS  
Symbol Buffer Type  
CompactFlash (In True IDE Mode) INTERFACE  
Description  
CF Chip Select 1  
CF_nCS1  
O8PU  
O8PU  
O8  
This pin is the active low chip select 1 signal for the CF  
ATA device  
CF Chip Select 0  
CF_nCS0  
CF_SA2  
CF_SA1  
CF_SA0  
CF_IRQ  
This pin is the active low chip select 0 signal for the task  
file registers of CF ATA device in the True IDE mode.  
CF Register Address  
2
This pin is the register select address bit 2 for the CF ATA  
device.  
CF Register Address  
1
O8  
This pin is the register select address bit 1 for the CF ATA  
device  
CF Register Address  
0
O8  
This pin is the register select address bit 0 for the CF ATA  
device.  
CF Interrupt  
IPD  
This is the active high interrupt request signal from the CF  
device.  
CF  
Data 15-8  
CF_D[15:8]  
I/O8PD  
The bi-directional data signals CF_D15-CF_D8 in True  
IDE mode data transfer.  
In the True IDE Mode, all of task file register operation  
occur on the CF_D[7:0], while the data transfer is on  
CF_D[15:0].  
The bi-directional data signal has an internal weak pull-  
down resistor.  
CF  
Data7-0  
CF_D[7:0]  
I/O8PD  
The bi-directional data signals CF_D7-CF_D0 in the True  
IDE mode data transfer.  
In the True IDE Mode, all of task file register operation  
occur on the CF_D[7:0], while the data transfer is on  
CF_D[15:0].  
The bi-directional data signal has an internal weak pull-  
down resistor.  
IO Ready  
CF_IORDY  
CF_nCD2  
IPU  
IPU  
This pin is active high input signal.  
This pin has an internally controlled weak pull-up resistor.  
CF  
This card detection pin is connected to the ground on the  
CF device, when the CF device is inserted.  
Card Detection2  
This pin has an internally controlled weak pull-up resistor.  
CF  
CF_nCD1  
IPU  
This card detection pin is connected to ground on the CF  
device, when the CF device is inserted.  
Card Detection1  
This pin has an internally controlled weak pull-up resistor.  
CF  
CF_nRESET  
CF_nIOR  
O8  
O8  
This pin is an active low hardware reset signal to CF  
device.  
Hardware Reset  
CF  
This pin is an active low read strobe signal for CF device.  
IO Read  
2005-2016 Microchip Technology Inc.  
DS00002252A-page 11  
USB2229/USB2230  
TABLE 5-1:  
Name  
USB2229/USB2230 PIN DESCRIPTIONS (CONTINUED)  
Symbol  
Buffer Type  
Description  
CF  
CF_nIOW  
O8  
This pin is an active low write strobe signal for CF device.  
IO Write Strobe  
SmartMedia INTERFACE  
SM  
Write Protect  
SM_nWP  
SM_ALE  
SM_CLE  
SM_D[7:0]  
SM_nRE  
O8PD  
O8PD  
O8PD  
I/O8PD  
08PU  
This pin is an active low write protect signal for the SM  
device.  
This pin has a weak pull-down resistor that is  
permanently enabled  
SM  
This pin is an active high Address Latch Enable signal for  
the SM device.  
Address Strobe  
This pin has a weak pull-down resistor that is  
permanently enabled  
SM  
This pin is an active high Command Latch Enable signal  
for the SM device.  
Command Strobe  
This pin has a weak pull-down resistor that is  
permanently enabled  
SM  
Data7-0  
These pins are the bi-directional data signal SM_D7-  
SM_D0.  
The bi-directional data signal has an internal weak pull-  
down resistor.  
SM  
This pin is an active low read strobe signal for SM device.  
Read Enable  
When using the internal FET, this pin has an internal  
weak pull-up resistor that is tied to the output of the  
internal Power FET.  
08  
If an external FET is used (Internal FET is disabled), then  
the internal pull-up is not available (external pull-ups must  
be used, and should be connected to the applicable Card  
Power Supply).  
SM  
SM_nWE  
O8PU  
This pin is an active low write strobe signal for SM device.  
Write Enable  
When using the internal FET, this pin has an internal  
weak pull-up resistor that is tied to the output of the  
internal Power FET.  
08  
If an external FET is used (Internal FET is disabled), then  
the internal pull-up is not available (external pull-ups must  
be used, and should be connected to the applicable Card  
Power Supply).  
SM  
SM_nWPS  
SM_nB/R  
IPU  
I
A write-protect seal is detected, when this pin is low.  
Write Protect Switch  
This pin has an internally controlled weak pull-up resistor.  
SM  
This pin is connected to the BSY/RDY pin of the SM  
device.  
Busy or Data Ready  
An external pull-up resistor is required on this signal. The  
pull-up resistor must be pulled up to the same power  
source that powers the SM/NAND flash device.  
SM  
Chip Enable  
SM_nCE  
O8PU  
08  
This pin is the active low chip enable signal to the SM  
device.  
When using the internal FET, this pin has an internal  
weak pull-up resistor that is tied to the output of the  
internal Power FET.  
If an external FET is used (Internal FET is disabled), then  
the internal pull-up is not available (external pull-ups must  
be used, and should be connected to the applicable Card  
Power Supply).  
DS00002252A-page 12  
2005-2016 Microchip Technology Inc.  
USB2229/USB2230  
TABLE 5-1:  
Name  
USB2229/USB2230 PIN DESCRIPTIONS (CONTINUED)  
Symbol  
Buffer Type  
Description  
SM  
SM_nCD  
IPU  
This is the card detection signal from SM device to  
indicate if the device is inserted.  
Card Detection  
This pin has an internally controlled weak pull-up resistor.  
MEMORY STICK INTERFACE  
MS  
MS_BS  
O8  
This pin is connected to the BS pin of the MS device.  
Bus State  
It is used to control the Bus States 0, 1, 2 and 3 (BS0,  
BS1, BS2 and BS3) of the MS device.  
MS  
System  
Data In/Out  
MS_SDIO/MS_D  
0
I/O8PD  
This pin is a bi-directional data signal for the MS device.  
Most significant bit (MSB) of each byte is transmitted first  
by either MSC or MS device.  
The bi-directional data signal has an internal weak pull-  
down resistor.  
MS  
System  
Data In/Out  
MS_D[3:1]  
MS_INS  
I/O8PD  
IPU  
This pin is a bi-directional data signal for the MS device.  
The bi-directional data signals have internal weak pull-  
down resistors.  
MS  
This pin is the card detection signal from the MS device  
to indicate, if the device is inserted.  
Card Insertion  
This pin has an internally controlled weak pull-up resistor.  
This pin is an output clock signal to the MS device.  
MS  
System CLK  
MS_SCLK  
O8  
The clock frequency is software configurable.  
SD INTERFACE  
SD  
SD_DAT[3:0]  
I/O8PU  
These are bi-directional data signals.  
Data3-0  
These pins have internally controlled weak pull-up  
resistors.  
SD Clock  
SD_CLK  
SD_CMD  
O8  
This is an output clock signal to SD/MMC device.  
The clock frequency is software configurable.  
SD Command  
I/O8PU  
This is a bi-directional signal that connects to the CMD  
signal of SD/MMC device.  
This pin has an internally controlled weak pull-up resistor.  
SD  
SD_nWP  
IPD  
This pin is an input signal with an internal weak pull-  
down.  
Write Protected  
This pin has an internally controlled weak pull-down  
resistor.  
USB INTERFACE  
USB Bus Data  
USB Transceiver Bias  
Analog Test  
USBDM  
USBDP  
IO-U  
These pins connect to the USB bus data signals.  
RBIAS  
I
A 12.0k, 1.0% resistor is attached from VSSA to this  
pin, in order to set the transceiver’s internal bias currents.  
ATEST  
AIO  
This signal is used for testing the analog section of the  
chip and should be connected to VDDA33 for normal  
operation.  
1.8v PLL Power  
VDD18PLL  
VSSPLL  
1.8v Power for the PLL  
PLL Ground  
Reference  
Ground Reference for 1.8v PLL power  
3.3v Analog Power  
VDDA33  
VSSA  
3.3v Analog Power  
Analog Ground  
Reference  
Analog Ground Reference for 3.3v Analog Power.  
2005-2016 Microchip Technology Inc.  
DS00002252A-page 13  
USB2229/USB2230  
TABLE 5-1:  
Name  
USB2229/USB2230 PIN DESCRIPTIONS (CONTINUED)  
Symbol  
Buffer Type  
Description  
Crystal Input/External  
Clock Input  
XTAL1/  
CLKIN  
ICLKx  
24Mhz Crystal or external 24/48 MHz clock input.  
This pin can be connected to one terminal of the crystal  
or can be connected to an external 24/48Mhz clock when  
a crystal is not used.  
Note:  
The ‘MA[2:0] pins will be sampled while nRE-  
SET is asserted, and the value will be latched  
upon nRESET negation. This will determine  
the clock source and value.  
Crystal Output  
XTAL2  
OCLKx  
24Mhz Crystal  
This is the other terminal of the crystal, or left open when  
an external clock source is used to drive XTAL1/CLKIN.  
It may not be used to drive any external circuitry other  
than the crystal circuit.  
MEMORY/IO INTERFACE  
Memory Data Bus  
MD[7:0]  
IO8  
When ROMEN bit of GPIO_IN1 register = 0, these  
signals are used to transfer data between the internal  
CPU and the external program memory.  
These pins have internally controlled weak pull-up  
resistors.  
Memory Address Bus  
Memory Address Bus  
MA[15:3]  
O8  
These signals address memory locations within the  
external memory.  
MA3/  
TX_POL  
I/O8PU  
MA3 Addresses memory locations within the external  
memory.  
During nRESET assertion, TX_POL will select the  
operating polarity of the IR LED (active high or active low)  
and the weak pull-up resistor will be enabled. When  
nRESET is negated, the value on this pin will be internally  
latched and this pin will revert to MA3 functionality, the  
internal pull-up will be disabled.  
Memory Address Bus  
MA2/  
SEL_CLKDRV  
I/O8PD  
MA2 Addresses memory locations within the external  
memory.  
SEL_CLKDRV. During nRESET assertion, this pins will  
select the operating clock mode (crystal or externally  
driven clock source), and a weak pull-down resistor is  
enabled. When nRESET is negated, the value will be  
internally latched and this pin will revert to MA2  
functionality, the internal pull-down will be disabled.  
‘0’ = Crystal operation (24MHz only)  
‘1’ = Externally driven clock source (24MHz or 48MHz)  
Note:  
If the latched value is ‘1’, then the MA2 pin is  
tri-stated when the following conditions are  
true:  
1. IDLE bit (PCON.0) is 1.  
2. INT2 is negated  
3. SLEEP bit of CLOCK_SEL is 1.  
If the latched value is ‘0’, then the MA2 pin will function  
identically to the MA[15:3] pins at all times (other than  
during nRESET assertion).  
DS00002252A-page 14  
2005-2016 Microchip Technology Inc.  
USB2229/USB2230  
TABLE 5-1:  
Name  
USB2229/USB2230 PIN DESCRIPTIONS (CONTINUED)  
Symbol  
Buffer Type  
Description  
Memory Address Bus MA[1:0]/CLK_SE  
L[1:0]  
I/O8PD  
MA[1:0], These signals address memory locations within  
the external memory.  
SEL[1:0]. During nRESET assertion, these pins will select  
the operating frequency of the external clock, and the  
corresponding weak pull-down resistors are enabled.  
When nRESET is negated, the value on these pins will  
be internal latched and these pins will revert to MA[1:0]  
functionality, the internal pull-downs will be disabled.  
SEL[1:0] = ‘00’. 24MHz  
SEL[1:0] = ‘01’. RESERVED  
SEL[1:0] = ‘10’. RESERVED  
SEL[1:0] = ‘11’. 48MHz  
Note:  
If the latched value is ‘1’, then the correspond-  
ing MA pin is tri-stated when the following con-  
ditions are true:  
1. IDLE bit (PCON.0) is 1.  
2. INT2 is negated  
3. SLEEP bit of CLOCK_SEL is 1.  
If the latched value is ‘0’, then the corresponding MA pin  
will function identically to the MA[15:3] pins at all times  
(other than during nRESET assertion).  
Memory Write Strobe  
Memory Read Strobe  
Memory Chip Enable  
nMWR  
nMRD  
nMCE  
O8  
O8  
O8  
Program Memory Write; active low  
Program Memory Read; active low  
Program Memory Chip Enable; active low.  
This signal is asserted, when any of the following  
conditions are no longer met:  
1. IDLE bit (PCON.0) is 1.  
2. INT2 is negated  
3. SLEEP bit of CLOCK_SEL is 1.  
Note:  
This signal is held to a logic ‘high’ while nRE-  
SET is asserted.  
MISC  
General Purpose I/O  
General Purpose I/O  
General Purpose I/O  
General Purpose I/O  
General Purpose I/O  
GPIO1  
GPIO2  
GPIO3  
GPIO4  
GPIO5  
I/O8  
I/O8  
I/O8  
I/O8  
I/O8  
This pin may be used either as input, edge sensitive  
interrupt input, or output.  
This pin may be used either as input, edge sensitive  
interrupt input, or output.  
This pin may be used either as input, edge sensitive  
interrupt input, or output.  
This pin may be used either as input, edge sensitive  
interrupt input, or output.  
This pin may be used either as input, edge sensitive  
interrupt input, or output.  
2005-2016 Microchip Technology Inc.  
DS00002252A-page 15  
USB2229/USB2230  
TABLE 5-1:  
Name  
USB2229/USB2230 PIN DESCRIPTIONS (CONTINUED)  
Symbol  
Buffer Type  
Description  
GPIO6, ROMEN,  
Memory Address 16  
GPIO6/ROMEN/  
MA16  
IPU  
This pin has an internal weak pull-up resistor that is  
enabled or disabled by the state of nRESET.  
The pull-up is enabled when nRESET is active.  
The pull-up is disabled, when the nRESET is inactive  
(some clock cycles later, after the rising edge of  
nRESET).  
The state of this pin is latched internally on the rising  
edge of nRESET to determine if internal or external  
program memory is used.  
The state latched is stored in ROMEN bit of GPIO_IN1  
register.  
I/O8  
After the rising edge of nRESET, this pin may be used as  
GPIO6 or RXD.  
When pulled low via an external weak pull-down resistor,  
an external program memory should be connected to the  
memory data bus. The USB2229/USB2230 uses this  
external bus for program execution.  
When this pin is left unconnected or pulled high by a  
weak pull-up resistor, the USB2229/USB2230 uses the  
internal ROM for program execution.  
I/O8  
For Bank Switching support, MA16 addresses the  
external 128k memory above the standard 64k range (the  
upper 64k is mapped into the 64k addressable ROM  
space)  
General Purpose I/O  
GPIO7  
I/O8  
I/O8  
This pin may be used either as input, edge sensitive  
interrupt input, or output.  
General Purpose I/O  
Or  
GPIO8/  
CRD_PWR0  
GPIO: This pin may be used either as input, edge  
sensitive interrupt input, or output.  
Card Power  
CRD_PWR: Card Power drive of 3.3V @ 100mA.  
General Purpose I/O  
GPIO9  
I/O8  
I/O8  
This pin may be used either as input, edge sensitive  
interrupt input, or output.  
General Purpose I/O  
Or  
GPIO10/  
CRD_PWR1  
GPIO: This pin may be used either as input, edge  
sensitive interrupt input, or output.  
Card Power  
CRD_PWR: Card Power drive of 3.3V @ 100mA.  
General Purpose I/O  
Or  
GPIO11/  
CRD_PWR2  
I/O8  
GPIO: This pin may be used either as input, edge  
sensitive interrupt input, or output.  
Card Power  
CRD_PWR: Card Power drive of 3.3V @ 200mA.  
These pins may be used either as input, or output.  
General Purpose I/O  
RESET input  
GPIO12  
nRESET  
I/O8  
IS  
This active low signal is used by the system to reset the  
chip. The active low pulse should be at least 1s wide.  
TEST Input  
nTEST[1:0]  
I
These signals are used for testing the chip. User should  
normally tie them high externally, if the test function is not  
used.  
IrDA  
IR MODE  
IR_MODE  
O8  
I
IR_MODE, declares the operating speed of the IR link.  
IR Receive Data or  
UART RX  
IR_RXD/RX  
IR_RXD, can be used as IR receiver or as the UART RX  
line.  
IR Transmit Data or  
UART TX  
IR_TXD/TX  
O8  
IR_TXD, can be used as IR transmitter or as the UART  
TX line.  
DIGITAL POWER, GROUNDS, and NO CONNECTS  
1.8v Digital Core  
Power  
VDD18  
+1.8V Core power  
All VDD18 pins must be connected together on the circuit  
board.  
DS00002252A-page 16  
2005-2016 Microchip Technology Inc.  
USB2229/USB2230  
TABLE 5-1:  
Name  
USB2229/USB2230 PIN DESCRIPTIONS (CONTINUED)  
Symbol  
Buffer Type  
Description  
3.3V Power & Regulator Input.  
3.3v Power & &  
Voltage Regulator  
Input  
VDD33  
Pins 100 & 108 supply 3.3V power to the internal 1.8V  
regulators.  
Ground  
VSS  
Ground Reference  
Note 1: Hot-insertion capable card connectors are required for all flash media. It is required for SD connector to have  
Write Protect switch. This allows the chip to detect MMC card.  
2: nMCE is normally asserted except when the 8051 is in standby mode.  
5.2  
Buffer Type Descriptions  
TABLE 5-2:  
USB2229/USB2230 BUFFER TYPE DESCRIPTIONS  
Description  
Buffer  
I
IPU  
Input  
Input with internal weak pull-up resistor.  
Input with internal weak pull-down resistor.  
Input with Schmitt trigger  
IPD  
IS  
I/O8  
I/O8PU  
Input/Output buffer with 8mA sink and 8mA source.  
Input/Output buffer with 8mA sink and 8mA source, with an internal  
weak pull-up resistor.  
I/O8PD  
Input/Output buffer with 8mA sink and 8mA source, with an internal  
weak pull-down resistor.  
O8  
Output buffer with 8mA sink and 8mA source.  
O8PU  
Output buffer with 8mA sink and 8mA source, with an internal weak  
pull-up resistor.  
O8PD  
Output buffer with 8mA sink and 8mA source, with an internal weak  
pull-down resistor.  
ICLKx  
OCLKx  
I/O-U  
AIO  
XTAL clock input  
XTAL clock output  
Analog Input/Output Defined in USB specification  
Analog Input/Output  
2005-2016 Microchip Technology Inc.  
DS00002252A-page 17  
USB2229/USB2230  
6.0  
DC PARAMETERS  
6.1  
Maximum Ratings  
Operating Temperature Range.....................................................................................................................0oC to +70oC  
Storage Temperature Range.....................................................................................................................-55o to +150oC  
Lead Temperature Range (soldering, 10 seconds) ...............................................................................................+325oC  
Positive Voltage on GPIO3, with respect to Ground...................................................................................................5.5V  
Positive Voltage on any signal pin, with respect to Ground........................................................................................4.6V  
Positive Voltage on XTAL1, with respect to Ground...................................................................................................4.0V  
Positive Voltage on XTAL2, with respect to Ground...................................................................................................2.5V  
Negative Voltage on GPIO8, 10 & 11, with respect to Ground (see Note 6-2)......................................................... -0.5V  
Negative Voltage on any pin, with respect to Ground .............................................................................................. -0.5V  
Maximum VDD18, VDD18PLL ......................................................................................................................................+2.5V  
Maximum VDD33, VDDA33..........................................................................................................................................+4.6V  
* Stresses above the specified parameters could cause permanent damage to the device. This is a stress rating only  
and functional operation of the device at any other condition above those indicated in the operation sections of this  
specification is not implied.  
Note 6-1  
When powering this device from laboratory or system power supplies, it is important that the Absolute  
Maximum Ratings not be exceeded or device failure can result. Some power supplies exhibit voltage  
spikes on their outputs when the AC power is switched on or off. In addition, voltage transients on  
the AC power line may appear on the DC output. When this possibility exists, it is suggested that a  
clamp circuit be used.  
Note 6-2  
When internal power FET operation of these pins is enabled, these pins may be simultaneously  
shorted to ground or any voltage up to 3.63V indefinitely, without damage to the device as long as  
VDD33 and VDDA33 are less than 3.63V and TA is less than 70°C.  
6.2  
DC Electrical Characteristics  
(TA = 0°C - 70°C, VDD33, VDDA33 = +3.3 V ± 0.3 V, VDD18, VDD18PLL = +1.8 V ± 10%,)  
Parameter  
Symbol  
MIN  
TYP  
MAX  
Units  
Comments  
I,IPU & IPD Type Input Buffer  
Low Input Level  
High Input Level  
Pull Down  
VILI  
VIHI  
PD  
PU  
0.8  
V
V
TTL Levels  
2.0  
72  
58  
A  
A  
Pull Up  
IS Type Input Buffer  
Low Input Level  
High Input Level  
VILI  
VIHI  
0.8  
0.4  
V
V
TTL Levels  
2.0  
2.2  
Hysteresis  
VHYSI  
500  
mV  
ICLK Input Buffer  
Low Input Level  
High Input Level  
VILCK  
VIHCK  
V
V
DS00002252A-page 18  
2005-2016 Microchip Technology Inc.  
USB2229/USB2230  
Parameter  
Input Leakage  
Symbol  
MIN  
TYP  
MAX  
Units  
Comments  
(All I and IS buffers)  
Low Input Leakage  
IIL  
-10  
-10  
+10  
+10  
A  
VIN = 0  
High Input Leakage  
IIH  
mA  
VIN = VDD33  
O8. O8PU & 08PD Type Buffer  
Low Output Level  
High Output Level  
VOL  
0.4  
V
V
IOL = 8 mA @ VDD33  
3.3V  
=
VOH  
VDD33  
- 0.4  
IOH = -8mA @ VDD33  
3.3V  
=
Output Leakage  
Pull Down  
Pull Up  
IOL  
PD  
PU  
-10  
+10  
A  
A  
A  
VIN = 0 to VDD33  
(Note 6-3)  
72  
58  
I/O8, I/O8PU & I/O8PD Type  
Buffer  
Low Output Level  
High Output Level  
VOL  
0.4  
V
V
IOL = 8 mA @ VDD33  
3.3V  
=
VOH  
VDD33 –  
0.4  
IOH = -8 mA @ VDD33  
3.3V  
=
Output Leakage  
Pull Down  
Pull Up  
IOL  
PD  
PU  
-10  
+10  
µA  
µA  
µA  
VIN = 0 to VDD33  
(Note 6-3)  
72  
58  
IO-U  
(Note 6-4)  
2005-2016 Microchip Technology Inc.  
DS00002252A-page 19  
USB2229/USB2230  
Parameter  
Symbol  
MIN  
TYP  
MAX  
Units  
Comments  
Integrated Power FET for  
GPIO8 & GPIO10  
Output Current  
IOUT  
100  
mA  
mA  
GPIO8 or 10;  
VdropFET = 0.23V  
Short Circuit Current Limit  
On Resistance  
ISC  
140  
2.1  
GPIO8 or 10; VoutFET  
= 0V  
RDSON  
GPIO8 or 10;  
IFET = 70mA  
Output Voltage Rise Time  
tDSON  
800  
s  
GPIO8 or 10;  
CLOAD = 10F  
Integrated Power FET for  
GPIO11)  
Output Current  
IOUT  
200  
mA  
mA  
GPIO11;  
VdropFET = 0.46V  
Short Circuit Current Limit  
On Resistance  
ISC  
181  
2.1  
GPIO11;  
VoutFET = 0V  
RDSON  
GPIO11;  
IFET = 70mA  
Output Voltage Rise Time  
tDSON  
800  
60  
s  
GPIO11;  
CLOAD = 10F  
Supply Current Unconfigured  
ICCINIT  
45  
mA  
@ VDD18, VDD18PLL  
1.8V  
=
=
=
=
@ VDD33, VDDA33  
3.3V  
=
10  
35  
20  
60  
mA  
mA  
Supply Current Active  
(Full Speed)  
ICC  
@ VDD18, VDD18PLL  
1.8V  
@ VDD33, VDDA33  
3.3V  
=
15  
45  
30  
70  
mA  
mA  
Supply Current Active  
(High Speed)  
ICC  
@ VDD18, VDD18PLL  
1.8V  
@ VDD33, VDDA33  
3.3V  
=
15  
30  
mA  
µA  
Supply Current Standby  
ICSBY  
160  
180  
@ VDD18, VDD18PLL  
1.8V  
@ VDD33, VDDA33  
3.3V  
=
215  
240  
µA  
Note 6-3  
Note 6-4  
Note 6-5  
Note 6-6  
Output leakage is measured with the current pins in high impedance.  
See Appendix A for USB DC electrical characteristics.  
The Maximum power dissipation parameters of the package should not be exceeded.  
The assignment of each Integrated Card Power FET to a designated Card Connector is controlled  
by both firmware and the specific board implementation. Firmware will default to the settings listed in  
Table 8-1, “GPIO Usage (ROM Rev -11),” on page 23.  
DS00002252A-page 20  
2005-2016 Microchip Technology Inc.  
USB2229/USB2230  
6.3  
Capacitance  
TA = 25°C; fc = 1MHz; VDD18, VDD18PLL = 1.8V  
Limits  
TYP  
Parameter  
Symbol  
MIN  
MAX  
Units  
Test Condition  
Clock Input Capacitance  
CIN  
20  
pF  
All pins except USB pins (and  
pins under test tied to AC  
ground)  
Input Capacitance  
Output Capacitance  
CIN  
10  
20  
pF  
pF  
COUT  
2005-2016 Microchip Technology Inc.  
DS00002252A-page 21  
USB2229/USB2230  
7.0  
PACKAGE INFORMATION  
FIGURE 7-1:  
USB2229/USB2230 128-PIN TQFP PACKAGE, 14X14X1.0MM BODY, 0.4MM  
PITCH  
DS00002252A-page 22  
2005-2016 Microchip Technology Inc.  
USB2229/USB2230  
8.0  
GPIO USAGE  
TABLE 8-1:  
Name  
GPIO USAGE (ROM REV -11)  
Active Level  
Symbol  
Description and Note  
GPIO1  
H
Flash Media Activity LED/  
xD_Door  
Indicates media activity. Media or USB  
cable must not be removed with LED lit.  
Also may be used for xD Door  
functionality  
GPIO2  
GPIO3  
GPIO4  
H
H
H
EE_CS  
Serial EE PROM chip select  
USB V bus detect  
V_BUS  
EE_DIN/EE_DOUT/xDID  
Serial EE PROM input/output and xD  
Identify  
GPIO5  
GPIO6  
GPIO7  
GPIO8  
L
H
H
L
HS_IND/SD_CD  
A16/ROMEN  
HS Indicator LED or SD Card Detect  
Switch input  
A16 address line connect for DFU or  
debug LED indicator optional.  
EE_CLK/  
UNCONF_LED  
Serial EE PROM clock output or  
Unconfigured LED.  
MS_PWR_CTRL/  
CRD_PWR0  
Memory Stick Card Power Control, or  
Internal Power FET0.  
GPIO9  
L
L
CF_PWR_CTRL  
CompactFlash Card Power Control  
GPIO10  
SM_PWR_CTRL/  
CRD_PWR1  
SmartMedia Card Power Control, or  
Internal Power FET1.  
GPIO11  
GPIO12  
L
SD/MMC_PWR_CTRL/  
CRD_PWR2  
SD/MMC Card Power Control, or Internal  
Power FET2.  
H
MS_ACT_IND/  
Media Activity  
Memory Stick Activity Indicator, or Media  
Activity LED.  
2005-2016 Microchip Technology Inc.  
DS00002252A-page 23  
USB2229/USB2230  
APPENDIX A: DATA SHEET REVISION HISTORY  
TABLE A-1:  
Revision  
DS00002252A (07-28-16)  
REVISION HISTORY  
Section/Figure/Entry  
Replaces previous SMSC version Rev. 1.4 (09-14-07)  
Correction  
DS00002252A-page 24  
2005-2016 Microchip Technology Inc.  
USB2229/USB2230  
THE MICROCHIP WEB SITE  
Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make  
files and information easily available to customers. Accessible by using your favorite Internet browser, the web site con-  
tains the following information:  
Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s  
guides and hardware support documents, latest software releases and archived software  
General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion  
groups, Microchip consultant program member listing  
Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of semi-  
nars and events, listings of Microchip sales offices, distributors and factory representatives  
CUSTOMER CHANGE NOTIFICATION SERVICE  
Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive  
e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or  
development tool of interest.  
To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notifi-  
cation” and follow the registration instructions.  
CUSTOMER SUPPORT  
Users of Microchip products can receive assistance through several channels:  
• Distributor or Representative  
• Local Sales Office  
• Field Application Engineer (FAE)  
Technical Support  
Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales  
offices are also available to help customers. A listing of sales offices and locations is included in the back of this docu-  
ment.  
Technical support is available through the web site at: http://www.microchip.com/support  
2005-2016 Microchip Technology Inc.  
DS00002252A-page 25  
USB2229/USB2230  
PRODUCT IDENTIFICATION SYSTEM  
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.  
Examples:  
PART NO.  
Device  
[X]  
XXX  
[X]  
-
-
a)  
b)  
USB2229-NU-02  
128-pin TQFP RoHS Compliant package, Com-  
mercial Temp, Tray  
Temperature  
Range  
Package  
Internal Microchip  
Code  
USB2230-NU-02  
128-pin TQFP RoHS Compliant package, Com-  
mercial Temp, Tray  
Device:  
USB2229, USB2230  
Temperature Range:  
Package:  
Blank  
NU  
= 0C to +70C  
= 128-pin TQFP  
DS00002252A-page 26  
2005-2016 Microchip Technology Inc.  
USB2229/USB2230  
Note the following details of the code protection feature on Microchip devices:  
Microchip products meet the specification contained in their particular Microchip Data Sheet.  
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the  
intended manner and under normal conditions.  
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our  
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data  
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.  
Microchip is willing to work with the customer who is concerned about the integrity of their code.  
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not  
mean that we are guaranteeing the product as “unbreakable.”  
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our  
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts  
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.  
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be super-  
seded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REP-  
RESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR  
OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,  
MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Micro-  
chip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold  
harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or  
otherwise, under any Microchip intellectual property rights unless otherwise stated.  
Trademarks  
The Microchip name and logo, the Microchip logo, AnyRate, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo, Kleer,  
LANCheck, LINK MD, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST  
Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.  
ClockWorks, The Embedded Control Solutions Company, ETHERSYNCH, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch,  
Precision Edge, and QUIET-WIRE are registered trademarks of Microchip Technology Incorporated in the U.S.A.  
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,  
Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,  
KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,  
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker, Serial  
Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless  
DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.  
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.  
Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.  
GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in  
other countries.  
All other trademarks mentioned herein are property of their respective companies.  
© 2005-2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.  
ISBN: 9781522408284  
Microchip received ISO/TS-16949:2009 certification for its worldwide  
headquarters, design and wafer fabrication facilities in Chandler and  
Tempe, Arizona; Gresham, Oregon and design centers in California  
QUALITYMANAGEMENTꢀꢀSYSTEMꢀ  
and India. The Company’s quality system processes and procedures  
CERTIFIEDBYDNVꢀ  
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping  
devices, Serial EEPROMs, microperipherals, nonvolatile memory and  
analog products. In addition, Microchip’s quality system for the design  
and manufacture of development systems is ISO 9001:2000 certified.  
== ISO/TS16949==ꢀ  
2005-2016 Microchip Technology Inc.  
DS00002252A-page 27  
Worldwide Sales and Service  
AMERICAS  
ASIA/PACIFIC  
ASIA/PACIFIC  
EUROPE  
Corporate Office  
2355 West Chandler Blvd.  
Chandler, AZ 85224-6199  
Tel: 480-792-7200  
Fax: 480-792-7277  
Technical Support:  
http://www.microchip.com/  
support  
Asia Pacific Office  
China - Xiamen  
Tel: 86-592-2388138  
Fax: 86-592-2388130  
Austria - Wels  
Tel: 43-7242-2244-39  
Fax: 43-7242-2244-393  
Suites 3707-14, 37th Floor  
Tower 6, The Gateway  
Harbour City, Kowloon  
China - Zhuhai  
Tel: 86-756-3210040  
Fax: 86-756-3210049  
Denmark - Copenhagen  
Tel: 45-4450-2828  
Fax: 45-4485-2829  
Hong Kong  
Tel: 852-2943-5100  
Fax: 852-2401-3431  
India - Bangalore  
Tel: 91-80-3090-4444  
Fax: 91-80-3090-4123  
France - Paris  
Tel: 33-1-69-53-63-20  
Fax: 33-1-69-30-90-79  
Australia - Sydney  
Tel: 61-2-9868-6733  
Fax: 61-2-9868-6755  
Web Address:  
www.microchip.com  
India - New Delhi  
Tel: 91-11-4160-8631  
Fax: 91-11-4160-8632  
Germany - Dusseldorf  
Tel: 49-2129-3766400  
Atlanta  
Duluth, GA  
Tel: 678-957-9614  
Fax: 678-957-1455  
China - Beijing  
Tel: 86-10-8569-7000  
Fax: 86-10-8528-2104  
Germany - Karlsruhe  
Tel: 49-721-625370  
India - Pune  
Tel: 91-20-3019-1500  
China - Chengdu  
Tel: 86-28-8665-5511  
Fax: 86-28-8665-7889  
Germany - Munich  
Tel: 49-89-627-144-0  
Fax: 49-89-627-144-44  
Austin, TX  
Tel: 512-257-3370  
Japan - Osaka  
Tel: 81-6-6152-7160  
Fax: 81-6-6152-9310  
Boston  
China - Chongqing  
Tel: 86-23-8980-9588  
Fax: 86-23-8980-9500  
Italy - Milan  
Tel: 39-0331-742611  
Fax: 39-0331-466781  
Westborough, MA  
Tel: 774-760-0087  
Fax: 774-760-0088  
Japan - Tokyo  
Tel: 81-3-6880- 3770  
Fax: 81-3-6880-3771  
China - Dongguan  
Tel: 86-769-8702-9880  
Italy - Venice  
Tel: 39-049-7625286  
Chicago  
Itasca, IL  
Tel: 630-285-0071  
Fax: 630-285-0075  
Korea - Daegu  
Tel: 82-53-744-4301  
Fax: 82-53-744-4302  
China - Guangzhou  
Tel: 86-20-8755-8029  
Netherlands - Drunen  
Tel: 31-416-690399  
Fax: 31-416-690340  
China - Hangzhou  
Tel: 86-571-8792-8115  
Fax: 86-571-8792-8116  
Korea - Seoul  
Cleveland  
Tel: 82-2-554-7200  
Fax: 82-2-558-5932 or  
82-2-558-5934  
Poland - Warsaw  
Tel: 48-22-3325737  
Independence, OH  
Tel: 216-447-0464  
Fax: 216-447-0643  
China - Hong Kong SAR  
Tel: 852-2943-5100  
Fax: 852-2401-3431  
Spain - Madrid  
Tel: 34-91-708-08-90  
Fax: 34-91-708-08-91  
Malaysia - Kuala Lumpur  
Tel: 60-3-6201-9857  
Fax: 60-3-6201-9859  
Dallas  
Addison, TX  
Tel: 972-818-7423  
Fax: 972-818-2924  
China - Nanjing  
Tel: 86-25-8473-2460  
Fax: 86-25-8473-2470  
Sweden - Stockholm  
Tel: 46-8-5090-4654  
Malaysia - Penang  
Tel: 60-4-227-8870  
Fax: 60-4-227-4068  
Detroit  
Novi, MI  
Tel: 248-848-4000  
UK - Wokingham  
Tel: 44-118-921-5800  
Fax: 44-118-921-5820  
China - Qingdao  
Tel: 86-532-8502-7355  
Fax: 86-532-8502-7205  
Philippines - Manila  
Tel: 63-2-634-9065  
Fax: 63-2-634-9069  
Houston, TX  
Tel: 281-894-5983  
China - Shanghai  
Tel: 86-21-5407-5533  
Fax: 86-21-5407-5066  
Singapore  
Tel: 65-6334-8870  
Fax: 65-6334-8850  
Indianapolis  
Noblesville, IN  
Tel: 317-773-8323  
Fax: 317-773-5453  
China - Shenyang  
Tel: 86-24-2334-2829  
Fax: 86-24-2334-2393  
Taiwan - Hsin Chu  
Tel: 886-3-5778-366  
Fax: 886-3-5770-955  
Los Angeles  
China - Shenzhen  
Tel: 86-755-8864-2200  
Fax: 86-755-8203-1760  
Mission Viejo, CA  
Tel: 949-462-9523  
Fax: 949-462-9608  
Taiwan - Kaohsiung  
Tel: 886-7-213-7828  
China - Wuhan  
Tel: 86-27-5980-5300  
Fax: 86-27-5980-5118  
Taiwan - Taipei  
Tel: 886-2-2508-8600  
Fax: 886-2-2508-0102  
New York, NY  
Tel: 631-435-6000  
San Jose, CA  
Tel: 408-735-9110  
China - Xian  
Tel: 86-29-8833-7252  
Fax: 86-29-8833-7256  
Thailand - Bangkok  
Tel: 66-2-694-1351  
Fax: 66-2-694-1350  
Canada - Toronto  
Tel: 905-695-1980  
Fax: 905-695-2078  
06/23/16  
DS00002252A-page 28  
2005-2016 Microchip Technology Inc.  

相关型号:

USB2230-NE-03

5TH GENERATION HI-SPEED USB FLASH MEDIA & IrDA CONTROLLER WITH INTEGRATED CARD POWER FETs
SMSC

USB2230-NE-XX

5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
SMSC

USB2230-NU-02

5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
MICROCHIP

USB2230-NU-03

5TH GENERATION HI-SPEED USB FLASH MEDIA & IrDA CONTROLLER WITH INTEGRATED CARD POWER FETs
SMSC

USB2230-NU-XX

5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
SMSC

USB2231

5th GENERATION HI-SPEED USB FLASH MEDIA AND CIR CONTROLLER WITH INTEGRATED CARD POWER FETs
SMSC

USB2231-NE-03

5th GENERATION HI-SPEED USB FLASH MEDIA AND CIR CONTROLLER WITH INTEGRATED CARD POWER FETs
SMSC

USB2231-NU-03

5th GENERATION HI-SPEED USB FLASH MEDIA AND CIR CONTROLLER WITH INTEGRATED CARD POWER FETs
SMSC

USB2231-NU-XX

Flash Memory Drive, CMOS, PQFP128, 14 X 14 MM, 1 MM HEIGHT, GREEN, TQFP-128
SMSC

USB2232

5th GENERATION HI-SPEED USB FLASH MEDIA AND CIR CONTROLLER WITH INTEGRATED CARD POWER FETs
SMSC

USB2232-NE-03

5th GENERATION HI-SPEED USB FLASH MEDIA AND CIR CONTROLLER WITH INTEGRATED CARD POWER FETs
SMSC

USB2232-NE-XX

暂无描述
SMSC