TC6320 [MICROCHIP]

N-Channel and P-Channel Enhancement-Mode MOSFET Pair;
TC6320
型号: TC6320
厂家: MICROCHIP    MICROCHIP
描述:

N-Channel and P-Channel Enhancement-Mode MOSFET Pair

文件: 总14页 (文件大小:596K)
中文:  中文翻译
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TC6320  
N-Channel and P-Channel Enhancement-Mode MOSFET Pair  
Features  
General Description  
• Integrated Gate-to-source Resistor  
• Integrated Gate-to-source Zener Diode  
• Low Threshold  
The TC6320 consists of high-voltage, low-threshold  
N-channel and P-channel MOSFETs in 8-lead SOIC  
and DFN packages. Both MOSFETs have integrated  
gate-to-source resistors and gate-to-source Zener  
diode clamps which are desired for high-voltage pulser  
• Low On-resistance  
• Low Input Capacitance  
applications. It is  
a complimentary, high-speed,  
• Fast Switching Speeds  
high-voltage, gate-clamped N-channel and P-channel  
MOSFET pair, which utilizes an advanced vertical  
DMOS structure and a well-proven silicon gate  
manufacturing process. This combination produces a  
device with the power handling capabilities of bipolar  
transistors and with the high input impedance and  
positive temperature coefficient inherent in MOS  
devices. Characteristic of all MOS structures, this  
device is free from thermal runaway and thermally  
induced secondary breakdown.  
• Free from Secondary Breakdown  
• Low Input and Output Leakage  
• Independent Electrically Isolated N-channel and  
P-channel  
Applications  
• High-voltage Pulsers  
• Amplifiers  
Microchip’s vertical DMOS FETs are ideally suited to a  
wide range of switching and amplifying applications  
where very low threshold voltage, high breakdown  
voltage, high input impedance, low input capacitance  
and fast switching speeds are desired.  
• Buffers  
• Piezoelectric Transducer Drivers  
• General Purpose Line Drivers  
• Logic-level Interfaces  
Package Types  
8-lead SOIC  
5-lead DFN  
(Top view)  
(Top view)  
SN  
GN  
SP  
GP  
1
2
3
4
8
7
6
5
DN  
DN  
DP  
DP  
1
2
3
4
8
7
6
5
SN  
GN  
GP  
SP  
DN  
DN  
DP  
DP  
DN  
DP  
See Table 2-1 and Table 2-2 for pin information.  
2017 Microchip Technology Inc.  
DS20005697A-page 1  
TC6320  
Functional Block Diagram  
SN  
GN  
DN  
DN  
N-Channel  
P-Channel  
GP  
SP  
DP  
DP  
DS20005697A-page 2  
2017 Microchip Technology Inc.  
TC6320  
Typical Application Circuit  
+100V  
VH  
VDD  
OE  
10nF  
10nF  
INA  
INB  
-100V  
VL  
VSS  
MD12xx, MD17xx, or MD18xx  
TC6320  
2017 Microchip Technology Inc.  
DS20005697A-page 3  
TC6320  
1.0  
ELECTRICAL CHARACTERISTICS  
Absolute Maximum Ratings†  
Drain-to-source Voltage ........................................................................................................................................ BVDSS  
Drain-to-gate Voltage ........................................................................................................................................... BVDGS  
Operating Ambient Temperature, TA ................................................................................................... –55°C to +150°C  
Storage Temperature, TS ..................................................................................................................... –55°C to +150°C  
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the  
device. This is a stress rating only, and functional operation of the device at those or any other conditions above those  
indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for  
extended periods may affect device reliability.  
N-CHANNEL ELECTRICAL CHARACTERISTICS  
Electrical Specifications: TA = TJ = 25°C unless otherwise specified.  
Parameter  
Sym.  
Min. Typ. Max.  
Unit  
Conditions  
DC PARAMETER (Note 1 unless otherwise specified)  
Drain-to-source Breakdown Voltage  
Gate Threshold Voltage  
BVDSS  
VGS(th)  
VGS(th)  
RGS  
200  
1
2
V
V
VGS = 0V, ID = 2 mA  
VGS = VDS, ID = 1 mA  
Change in VGS(th) with Temperature  
Gate-to-source Shunt Resistor  
Gate-to-Source Zener Voltage  
–4.5 mV/°C VGS = VDS, ID = 1 mA (Note 2)  
10  
50  
25  
kΩ  
IGS = 100 µA  
IGS = 2 mA  
VZGS  
13.2  
V
V
DS = Maximum rating,  
10  
1
µA  
VGS = 0V  
Zero-gate Voltage Drain Current  
On-state Drain Current  
IDSS  
VDS = 0.8 Maximum rating,  
VGS = 0V, TA = 125°C (Note 2)  
mA  
1
8
VGS = 4.5V, VDS = 25V  
ID(ON)  
A
2
V
GS = 10V, VDS = 25V  
VGS = 4.5V, ID = 150 mA  
GS = 10V, ID = 1A  
Static Drain-to-source On-state   
Resistance  
RDS(ON)  
7
V
Change in RDS(ON) with Temperature RDS(ON)  
1
%/°C VGS = 4.5V, ID = 150 mA (Note 2)  
AC PARAMETER (Note 2)  
Forward Transconductance  
Input Capacitance  
GFS  
CISS  
COSS  
CRSS  
td(ON)  
tr  
400  
110  
60  
23  
10  
15  
20  
15  
mmho VDS = 25V, ID = 500 mA  
pF  
VGS = 0V,  
pF  
pF  
Common Source Output Capacitance  
Reverse Transfer Capacitance  
Turn-on Delay Time  
VDS = 25V,  
f = 1 MHz  
ns  
ns  
ns  
ns  
V
DD = 25V,  
Rise Time  
ID = 1A,  
RGEN = 25ꢀ  
Turn-off Delay Time  
td(OFF)  
tf  
Fall Time  
DIODE PARAMETER  
Diode Forward Voltage Drop  
Reverse Recovery Time  
VSD  
trr  
1.8  
V
VGS = 0V, ISD = 500 mA (Note 1)  
VGS = 0V, ISD = 500 mA (Note 2)  
300  
ns  
Note 1: All DC parameters are 100% tested at 25°C unless otherwise stated. Pulse test: 300 µs pulse, 2% duty  
cycle.  
2: Specification is obtained by characterization and is not 100% tested.  
DS20005697A-page 4  
2017 Microchip Technology Inc.  
TC6320  
P-CHANNEL ELECTRICAL CHARACTERISTICS  
Electrical Specifications: TA = TJ = 25°C unless otherwise specified.  
Parameter  
Sym.  
Min. Typ. Max.  
Unit  
Conditions  
DC PARAMETER (Note 1 unless otherwise specified)  
Drain-to-source Breakdown Voltage  
Gate Threshold Voltage  
BVDSS –200  
V
V
VGS = 0V, ID = –2 mA  
VGS = VDS, ID = –1 mA  
VGS(th)  
VGS(th)  
RGS  
–1  
–2.4  
Change in VGS(th) with Temperature  
Gate-to-source Shunt Resistor  
Gate-to-Source Zener Voltage  
4.5 mV/°C VGS = VDS, ID = –1 mA (Note 2)  
10  
50  
25  
kꢀ  
IGS = 100 µA  
IGS = –2 mA  
VZGS  
13.2  
V
VDS = Maximum rating,   
VGS = 0V  
–10  
–1  
µA  
Zero-gate Voltage Drain Current  
On-state Drain Current  
IDSS  
VDS = 0.8 Maximum rating,  
mA  
VGS = 0V, TA = 125°C (Note 2)  
VGS = –4.5V, VDS = –25V  
VGS = –10V, VDS = –25V  
VGS = –4.5V, ID = –150 mA  
–1  
–2  
10  
8
ID(ON)  
A
Static Drain-to-source On-state   
Resistance  
RDS(ON)  
VGS = –10V, ID = –1A  
Change in RDS(ON) with Temperature RDS(ON)  
1
%/°C VGS = –10V, ID = –200 mA (Note 2)  
AC PARAMETER (Note 2)  
Forward Transconductance  
Input Capacitance  
GFS  
400  
mmho VDS = –25V, ID = –500 mA  
pF  
CISS  
200  
VGS = 0V,  
Common Source Output  
Capacitance  
pF  
pF  
COSS  
55  
VDS = –25V,  
f = 1 MHz  
Reverse Transfer Capacitance  
Turn-on Delay Time  
Rise Time  
CRSS  
td(ON)  
tr  
30  
10  
15  
20  
15  
ns  
ns  
ns  
ns  
V
DD = –25V,  
ID = –1A,  
RGEN = 25ꢀ  
Turn-off Delay Time  
Fall Time  
td(OFF)  
tf  
DIODE PARAMETER  
Diode Forward Voltage Drop  
Reverse Recovery Time  
VSD  
trr  
–1.8  
V
VGS = 0V, ISD = –500 mA (Note 1)  
VGS = 0V, ISD = –500 mA (Note 2)  
300  
ns  
Note 1: All DC parameters are 100% tested at 25°C unless otherwise stated. Pulse test: 300 µs pulse, 2% duty  
cycle.  
2: Specification is obtained by characterization and is not 100% tested.  
TEMPERATURE SPECIFICATIONS  
Electrical Characteristics: Unless otherwise specified, for all specifications TA =TJ = +25°C.  
Parameter  
Sym.  
Min.  
Typ.  
Max.  
Unit  
Conditions  
TEMPERATURE RANGE  
Operating Ambient Temperature  
Storage Temperature  
TA  
TS  
–55°C  
–55°C  
+150  
+150  
°C  
°C  
PACKAGE THERMAL RESISTANCE  
8-lead DFN  
JA  
JA  
44  
°C/W Note 1  
°C/W Note 1  
8-lead SOIC  
101  
Note 1: 1 oz., four-layer, 3” x 4” PCB  
2017 Microchip Technology Inc.  
DS20005697A-page 5  
TC6320  
2.0  
PIN DESCRIPTION  
Table 2-1 and Table 2-2 show the description of pins in  
TC6320 8-lead DFN and 8-lead SOIC, respectively.  
Refer to Package Types for the location of pins.  
TABLE 2-1:  
Pin Number  
8-LEAD DFN PIN FUNCTION TABLE  
Pin Name  
Description  
1
2
3
4
5
6
7
8
SN  
GN  
GP  
SP  
DP  
DP  
DN  
DN  
Source N-channel  
Gate N-channel  
Gate P-channel  
Source P-channel  
Drain P-channel  
Drain P-channel  
Drain N-channel  
Drain N-channel  
TABLE 2-2:  
Pin Number  
8-LEAD SOIC FUNCTION TABLE  
Pin Name  
Description  
1
2
3
4
5
6
7
8
SN  
GN  
SP  
GP  
DP  
DP  
DN  
DN  
Source N-channel  
Gate N-channel  
Source P-channel  
Gate P-channel  
Drain P-channel  
Drain P-channel  
Drain N-channel  
Drain N-channel  
DS20005697A-page 6  
2017 Microchip Technology Inc.  
TC6320  
3.0  
FUNCTIONAL DESCRIPTION  
Figure 3-1 and Figure 3-2 illustrate the switching  
waveforms and test circuits for TC6320.  
10V  
90%  
VDD  
Input  
RL  
10%  
0V  
Pulse  
OUTPUT  
Generator  
t(ON)  
td(ON)  
t(OFF)  
td(OFF)  
RGEN  
tr  
tf  
D.U.T  
VDD  
Output  
10%  
90%  
10%  
90%  
Input  
0V  
FIGURE 3-1:  
N-Channel Switching Waveforms and Test Circuit.  
0V  
10%  
Pulse  
Generator  
Input  
90%  
RGEN  
-10V  
D.U.T  
t(ON)  
td(ON)  
t(OFF)  
Input  
tr  
tf  
td(OFF)  
90%  
10%  
OUTPUT  
RL  
0V  
Output  
VDD  
90%  
10%  
VDD  
FIGURE 3-2:  
P-Channel Switching Waveforms and Test Circuit.  
PRODUCT SUMMARY  
RDS(ON)  
(Maximum)  
()  
BVDSS/BVDGS  
(V)  
N-Channel  
P-Channel  
N-Channel  
P-Channel  
200  
–200  
7
8
2017 Microchip Technology Inc.  
DS20005697A-page 7  
TC6320  
4.0  
4.1  
PACKAGING INFORMATION  
Package Marking Information  
Example  
8-lead DFN  
TC6320  
XXXXXXX  
XXXXXXX  
K6  
e3  
e3  
1715  
YYWW  
222  
NNN  
Example  
8-lead SOIC  
TC6320TG  
XXXXXXX  
e3  
e3  
1727  
YYWW  
NNN  
555  
Legend: XX...X Product Code or Customer-specific information  
Y
Year code (last digit of calendar year)  
YY  
WW  
NNN  
Year code (last 2 digits of calendar year)  
Week code (week of January 1 is week ‘01’)  
Alphanumeric traceability code  
Pb-free JEDEC® designator for Matte Tin (Sn)  
This package is Pb-free. The Pb-free JEDEC designator ( )  
e
3
*
e
3
can be found on the outer packaging for this package.  
Note: In the event the full Microchip part number cannot be marked on one line, it will  
be carried over to the next line, thus limiting the number of available  
characters for product code or customer-specific information. Package may or  
not include the corporate logo.  
DS20005697A-page 8  
2017 Microchip Technology Inc.  
TC6320  
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.  
2017 Microchip Technology Inc.  
DS20005697A-page 9  
TC6320  
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.  
DS20005697A-page 10  
2017 Microchip Technology Inc.  
TC6320  
APPENDIX A: REVISION HISTORY  
Revision A (October 2017)  
• Converted Supertex Doc# DSFP-TC6320 to  
Microchip DS20005697A  
• Changed the package marking format  
• Changed the quantity of the  
8-lead DFN K6 package from 3000/Reel  
to 3300/Reel  
• Changed the quantity of the 8-lead SOIC TG  
package from 2000/Reel to 3300/Reel  
• Made minor text changes throughout the docu-  
ment  
2017 Microchip Technology Inc.  
DS20005697A-page 11  
TC6320  
PRODUCT IDENTIFICATION SYSTEM  
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.  
Examples:  
XX  
PART NO.  
Device  
-
X
-
X
Package  
Options  
Environmental  
Media Type  
a) TC6320K6-G:  
b) TC6320TG-G:  
N-Channel and P-Channel  
Enhancement-ModeMOSFETPair,  
8lead (4x4) VDFN, 3300/Reel  
Device:  
TC6320  
=
N-Channel and P-Channel Enhancement-  
Mode MOSFET Pair  
N-Channel and P-Channel  
Enhancement-ModeMOSFETPair,  
8-lead SOIC, 3300/Reel  
Packages:  
K6  
=
=
8-lead (4x4) VDFN  
8-lead SOIC  
TG  
Environmental:  
Media Type:  
G
=
Lead (Pb)-free/RoHS-compliant Package  
(blank)  
=
=
3300/Reel for a K6 Package  
3300/Reel for a TG Package  
DS20005697A-page 12  
2017 Microchip Technology Inc.  
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QUALITYMANAGEMENTꢀꢀSYSTEMꢀ  
CERTIFIEDBYDNVꢀ  
© 2017, Microchip Technology Incorporated, All Rights Reserved.  
ISBN: 978-1-5224-2207-5  
== ISO/TS16949==ꢀ  
2017 Microchip Technology Inc.  
DS20005697A-page 13  
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Fax: 86-25-8473-2470  
Malaysia - Penang  
Tel: 60-4-227-8870  
Fax: 60-4-227-4068  
Houston, TX  
Tel: 281-894-5983  
Italy - Padova  
Tel: 39-049-7625286  
China - Qingdao  
Tel: 86-532-8502-7355  
Fax: 86-532-8502-7205  
Indianapolis  
Noblesville, IN  
Tel: 317-773-8323  
Fax: 317-773-5453  
Tel: 317-536-2380  
Philippines - Manila  
Tel: 63-2-634-9065  
Fax: 63-2-634-9069  
Netherlands - Drunen  
Tel: 31-416-690399  
Fax: 31-416-690340  
China - Shanghai  
Tel: 86-21-3326-8000  
Fax: 86-21-3326-8021  
Singapore  
Tel: 65-6334-8870  
Fax: 65-6334-8850  
Norway - Trondheim  
Tel: 47-7289-7561  
Los Angeles  
China - Shenyang  
Tel: 86-24-2334-2829  
Fax: 86-24-2334-2393  
Mission Viejo, CA  
Tel: 949-462-9523  
Fax: 949-462-9608  
Tel: 951-273-7800  
Poland - Warsaw  
Tel: 48-22-3325737  
Taiwan - Hsin Chu  
Tel: 886-3-5778-366  
Fax: 886-3-5770-955  
Romania - Bucharest  
Tel: 40-21-407-87-50  
China - Shenzhen  
Tel: 86-755-8864-2200  
Fax: 86-755-8203-1760  
Taiwan - Kaohsiung  
Tel: 886-7-213-7830  
Raleigh, NC  
Tel: 919-844-7510  
Spain - Madrid  
Tel: 34-91-708-08-90  
Fax: 34-91-708-08-91  
China - Wuhan  
Tel: 86-27-5980-5300  
Fax: 86-27-5980-5118  
Taiwan - Taipei  
Tel: 886-2-2508-8600  
Fax: 886-2-2508-0102  
New York, NY  
Tel: 631-435-6000  
Sweden - Gothenberg  
Tel: 46-31-704-60-40  
San Jose, CA  
Tel: 408-735-9110  
Tel: 408-436-4270  
China - Xian  
Tel: 86-29-8833-7252  
Fax: 86-29-8833-7256  
Thailand - Bangkok  
Tel: 66-2-694-1351  
Fax: 66-2-694-1350  
Sweden - Stockholm  
Tel: 46-8-5090-4654  
Canada - Toronto  
Tel: 905-695-1980  
Fax: 905-695-2078  
UK - Wokingham  
Tel: 44-118-921-5800  
Fax: 44-118-921-5820  
DS20005697A-page 14  
2017 Microchip Technology Inc.  
11/07/16  

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