TC624EOA713 [MICROCHIP]
DIGITAL TEMP SENSOR-SINGLE TRIP POINT, 5Cel, RECTANGULAR, SURFACE MOUNT, SOIC-8;
| 型号： | TC624EOA713 |
| 厂家： | 
MICROCHIP |
| 描述： | DIGITAL TEMP SENSOR-SINGLE TRIP POINT, 5Cel, RECTANGULAR, SURFACE MOUNT, SOIC-8 输出元件 传感器 换能器 |
| 文件： | 总16页 (文件大小：189K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC622/TC624
Low Cost Single Trip Point Temperature Sensor
General Description:
Features:
• Temperature Set Point Easily Programs with a
Single External Resistor
The TC622 and TC624 are programmable solid-state
temperature sensors designed to replace mechanical
switches in sensing and control applications. Both
devices integrate the temperature sensor with a
voltage reference and all required detector circuitry.
The desired temperature set point is set by the user
with a single external resistor.
• Operates with 2.7V Power Supply (TC624)
• TO-220 Package for Direct Mounting to Heatsink
(TC622XAT) or Standard 8-Pin PDIP and SOIC
Applications:
Ambient temperature is sensed and compared to the
programmed set point. The OUT and OUT outputs are
driven to their active state when the measured
temperature exceeds the programmed set point.
• Power Supply Over-Temperature Detection
• Consumer Electronics
• Fire/Heat Detection
• UPSs, Amplifiers, Motors
The TC622 has a power supply voltage range of 4.5V
to 18.0V while the TC624 operates over a power supply
range of 2.7V to 4.5V. Both devices are usable over a
temperature range of -40°C to +125°C (TC622VXX,
TC624VXX). Both devices feature low supply current
making them suitable for portable applications.
• CPU Thermal Management in PCs
Eight-pin through-hole and surface mount packages
are available. The TC622 is also offered in a 5-pin
TO-220 package.
The TC622 and TC624 are single point temperature
detectors ideal for use in a wide variety of applications.
Device Selection Table
Part Number
Voltage Operation
Package
Ambient Temperature
TC622COA
TC622CPA
T C 6 2 2 E AT
T C 6 22 E OA
TC622EPA
TC622VAT
TC622VOA
TC622VPA
TC624COA
TC624CPA
T C 6 24 E OA
TC624EPA
TC624VOA
T C 6 24 V PA
4.5V to 18V
4.5V to 18V
4 . 5 V t o 1 8 V
4. 5 V t o 18 V
4.5V to 18V
4. 5V to 18V
4.5V to 18V
4.5V to 18V
2.7V to 4.5V
2.7V to 4.5V
2 . 7V t o 4. 5 V
2.7V to 4.5V
2.7V to 4.5V
2 . 7V t o 4. 5 V
8-Pin SOIC
8-Pin PDIP
5 - P i n T O - 2 2 0
8 -P i n S OI C
8-Pin PDIP
5-Pin TO-220
8-Pin SOIC
8-Pin PDIP
8-Pin SOIC
8-Pin PDIP
8 - P in S OI C
8-Pin PDIP
8-PinSOIC
8 - P i n PD IP
0°C to +70°C
0°C to +70°C
- 4 0 ° C t o + 8 5 ° C
- 4 0° C t o + 8 5 °C
-40°C to +85°C
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
0°C to +70°C
0°C to +70°C
- 4 0° C t o + 8 5 °C
-40°C to +85°C
-40°C to +125°C
- 4 0 ° C t o +1 2 5°
2001-2012 Microchip Technology Inc.
DS21440D-page 1
TC622/TC624
Package Type
SOIC
SOT-220
PDIP
NC
V
NC
1
2
3
4
8
7
6
5
8
1
NC
V
NC
OUT
OUT
GND
TC622COA
TC622EOA
TC622VOA
DD
2
DD
7
6
5
OUT
TC622CPA
TC622EPA
TC622VPA
NC
T
TC622EAT
TC622VAT
NC
T
3
4
OUT
GND
SET
SET
1 2 3 4 5
NC
V
1
2
3
4
8
7
6
5
NC
8
NC
1
2
3
4
NC
VDD
NC
TC624COA
TC624EOA
TC624VOA
DD
OUT
OUT
GND
7
6
5
OUT
OUT
GND
TC624CPA
TC624EPA
TC624VPA
NC
T
SET
T
SET
Note: For TO-220 Package, Pin 3 is connected to case heatsink.
Functional Block Diagram
+9V
9V
Battery
R
SET
Horn
7
8
V
1
DD
NC
T
Microcontrollers
5
NC
SET
TC622
TC624
3
2
OUT
OUT
6
4
NC
GND
ALARM
DS21440D-page 2
2001-2012 Microchip Technology Inc.
TC622/TC624
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
These are stress ratings only and functional operation
of the device at these or any other conditions above
those indicated in the operation sections of the specifi-
cations is not implied. Exposure to Absolute Maximum
Rating conditions for extended periods may affect
device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Supply Voltage (TC622).........................................20V
(TC624)........................................5.5V
Input Voltage Any Input.. (GND – 0.3V) to (VDD +0.3V)
Operating Temperature......................-40°C to +125°C
C Version .............................. 0°C to +70°C
E Version ...........................-40°C to +85°C
V Version .........................-40°C to +125°C
Storage Temperature .........................-65°C to +150°C
.
TC622/TC624 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Over operating temperature range, unless otherwise specified.
Sym
Parameter
Device
Min
Typ
Max
Unit
Test Conditions
VDD Supply Voltage
Range
TC622
TC624
4.5
2.7
—
—
18
4.5
V
IDD
Supply Current
TC622
TC624
—
—
200
170
600
300
A 5.0V VDD 18V
2.7V VDD 4.5V
VOH Output Voltage
(High)
TC622 0.90 x VDD
—
—
V
5.0V VDD 18V, -40°C TA +125°C,
IOH = 250 A
0.80 x VDD
—
—
IOH = 500 A
VOL Output Voltage
(Low)
TC622
TC624
TC624
—
—
—
—
—
—
0.15 x VDD
0.30 x VDD
0.35 x VDD
V
-40°C TA +85°C, IOL = 500 A
IOL = 1 mA
-40°C TA +125°C, IOL = 1 mA
VOH Output Voltage
(High)
—
2.7V VDD 4.5V
-40°C TA +125°C, IOH = 250 A
IOH = 500 A
0.90 x VDD
0.80 x VDD
—
—
—
—
V
V
VOL Output Voltage
(Low)
—
—
—
—
—
—
0.1 x VDD
0.2 x VDD
0.25 x VDD
-40°C TA +85°C, IOL = 500 A
IOL = 1 mA
-40°C TA +125°C, IOL = 1 mA
TSET Absolute Accuracy TC622
TC624
T - 5
T - 5
T ± 1
T ± 1
T + 5
T + 5
°C TSET = Programmed Temperature
TSET = Programmed Temperature
OUT Trip Point
Hysteresis
TC622
TC624
—
—
2
2
—
—
°C
2001-2012 Microchip Technology Inc.
DS21440D-page 3
TC622/TC624
2.0
PIN DESCRIPTION
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Symbol
Pin No.
(8-Pin SOIC)
(8-Pin PDIP)
Description
1
2
3
4
5
NC
No Internal Connection.
OUT
OUT
GND
TSET
Active low output.
Active high output.
Ground Terminal.
Temperature set point. Connect an external 1% resistor from TSET to VCC to set
trip point.
6
7
8
NC
VDD
NC
No Internal Connection.
Power supply input.
No Internal Connection.
Pin No.
(5-Pin SOT-220)
Symbol
Description
1
2
3
4
5
OUT
OUT
VDD
Active low output.
Active high output.
Power supply input.
Ground Terminal.
GND
TSET
Temperature set point. Connect an external 1% resistor from TSET to VCC to set
trip point.
DS21440D-page 4
2001-2012 Microchip Technology Inc.
TC622/TC624
3.2
Hysteresis
3.0
3.1
DETAILED DESCRIPTION
Trip Point Programming
To prevent output “chattering” at the trip point tempera-
ture, the temperature detector in the TC622/TC624 has
2°C hysteresis (see Figure 3-2). The outputs are driven
active when the temperature crosses the set point
determined by the external resistor. As temperature
declines below the set point, the hysteresis action will
hold the outputs true until the temperature drops 2°C
below the threshold.
When the temperature of the device exceeds the pro-
grammed temperature trip point, TSET, the OUT and
OUT outputs are driven into their active states. The
desired trip point temperature is programmed with a
single external resistor connected between the TSET
input and VCC. The relationship between the resistor
value and the trip point temperature is given by
Equation 3-1.
Temperature
EQUATION 3-1:
Set Point
RTRIP = 0.5997 x T 2.1312
(Set Point – 2 Degrees C)
OUT
Where:
RTRIP = Programming resistor value in Ohms
T = Desired trip temperature in degrees Kelvin.
For example, as shown in Figure 3-1, to program the
device to trip at 50°C, the programming resistor is:
OUT
FIGURE 3-2:
TC622/TC624 Hysteresis
RTRIP = 0.5997 x ((50 + 273.15)2.1312) = 133.65 k
250
200
150
100
50
-55
-35
-15
5
25
45
65
85
105
125
TEMPERATURE (°C)
FIGURE 3-1:
Programming Resistor
Values vs. Temperature
2001-2012 Microchip Technology Inc.
DS21440D-page 5
TC622/TC624
4.2
Cooling and Heating Applications
4.0
4.1
TYPICAL APPLICATIONS
The TC622/TC624 can be used to control a DC fan as
shown in Figure 4-2. The fan turns on when the sensed
temperature rises above TSET and remains on until the
temperature falls below TSET - 2°C.
Over-Temperature Shutdown
The TC622 can be used to create a simple over-tem-
perature shutdown circuit. In this circuit, temperature is
sensed within the system enclosure (internal system
ambient) or at the heatsink itself. When measured
temperature exceeds a preset limit, a fault is indicated
and the system shuts down.
Figure 4-3 shows the TC622 acting as a heater
thermostat. Circuit operation is identical to that of the
cooling fan application.
Figure 4-1 illustrates an over-temperature shutdown
circuit using the TC622 sensor in a single TO-220
package, allowing direct attachment to the heatsink
surface. As shown, the TC622 outputs are driven active
when the heatsink temperature equals the trip point
temperature set by RTRIP. When this happens, the
crowbar circuit is activated, causing the supply output
to fold back to zero. The TC622 outputs remain active
until the heatsink temperature falls a minimum of 2°C
(built-in hysteresis) below the trip point temperature, at
which time the device again allows normal supply
operation.
Heatsink
Output
Device
V
CC
TC622
Output Device
V
OUT
Circuit Board
Power Good
Signal
R
TRIP
TC622 Heatsink Mounting
TC622
V
T
SET
DD
Crowbar
Circuit
OVERTEMP
OUT
OUT
GND
Heatsink Surface
FIGURE 4-1:
TC622 Power Supply Over-Temperature Shutdown
DS21440D-page 6
2001-2012 Microchip Technology Inc.
TC622/TC624
+2.7 to 4.5V +12V
+12V
+4.5 to 18.0V
R
SET
1
R
SET
+
7
8
V
7
DD
V
DD
NC
T
1
DC Fan
NC
Heater
5
NC
5
6
4
8
SET
NC
T
SET
TC624
TC622
3
2
N-Channel
Level Logic
MOSFET
OUT
OUT
6
4
NC
OUT
OUT
NC
N-Channel
Logic Level
MOSFET
GND
2
GND
T
SET
T
SET
T
SET
– 2 C
T
SET
– 2 C
OUT
OUT
Fan "On"
Heater "On"
FIGURE 4-2:
TC624 As A Fan Controller
for Notebook PC
FIGURE 4-3:
TC622 As A Heater
Thermostat
2001-2012 Microchip Technology Inc.
DS21440D-page 7
TC622/TC624
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
Package marking data not available at this time.
5.2
Taping Form
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
User Direction of Feed
Pin 1
W
P
Standard Reel Component Orientation
for 713 Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
8-Pin SOIC (N)
12 mm
8 mm
2500
13 in
DS21440D-page 8
2001-2012 Microchip Technology Inc.
TC622/TC624
5.3
Package Dimensions
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
8-Pin Plastic DIP
Pin 1
.260 (6.60)
.240 (6.10)
.045 (1.14)
.030 (0.76)
.070 (1.78)
.040 (1.02)
.310 (7.87)
.290 (7.37)
.400 (10.16)
.348 (8.84)
.200 (5.08)
.140 (3.56)
.040 (1.02)
.020 (0.51)
.015 (0.38)
.008 (0.20)
3° Min.
.150 (3.81)
.115 (2.92)
.400 (10.16)
.310 (7.87)
.110 (2.79)
.090 (2.29)
.022 (0.56)
.015 (0.38)
Dimensions: inches (mm)
5.4
Package Dimensions (Continued)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
8-Pin SOIC
Pin 1
.157 (3.99)
.150 (3.81)
.244 (6.20)
.228 (5.79)
.050 (1.27) Typ.
.197 (5.00)
.189 (4.80)
.069 (1.75)
.053 (1.35)
.010 (0.25)
.007 (0.18)
8° Max.
.020 (0.51)
.013 (0.33)
.010 (0.25)
.004 (0.10)
.050 (1.27)
.016 (0.40)
Dimensions: inches (mm)
2001-2012 Microchip Technology Inc.
DS21440D-page 9
TC622/TC624
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
5-Pin TO-220
.185 (4.70)
.165 (4.19)
.415 (10.54)
.390 (9.91)
.117 (2.97)
.103 (2.62)
.055 (1.40)
.045 (1.14)
.156 (3.96)
.140 (3.56)
Dia.
.293 (7.44)
.204 (5.18)
3° - 7.5°
5 PLCS.
.613 (15.57)
.569 (14.45)
.037 (0.95)
.025 (0.64)
.590 (14.99)
.482 (12.24)
.025 (0.64)
.012 (0.30)
.072 (1.83)
.062 (1.57)
Pin 1
.115 (2.92)
.087 (2.21)
.273 (6.93)
.263 (6.68)
Dimensions: inches (mm)
DS21440D-page 10
2001-2012 Microchip Technology Inc.
TC622/TC624
6.0
REVISION HISTORY
Revision D (December 2012)
Added a note to each package outline drawing.
2001-2012 Microchip Technology Inc.
DS21440D-page 11
TC622/TC624
NOTES:
DS21440D-page 12
2001-2012 Microchip Technology Inc.
TC622/TC624
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2001-2012 Microchip Technology Inc.
DS21440D-page 13
TC622/TC624
NOTES:
DS21440D-page 14
2001-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
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OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
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conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
32
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2001-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620768242
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CERTIFIED BY DNV
Microchip received ISO/TS-16949:2009 certification for its worldwide
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Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
== ISO/TS 16949 ==
2001-2012 Microchip Technology Inc.
DS21440D-page 15
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Fax: 886-3-5770-955
Los Angeles
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
China - Xiamen
Tel: 905-673-0699
Fax: 905-673-6509
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
11/29/12
DS21440D-page 16
2001-2012 Microchip Technology Inc.
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