TC54VN3301EMB713 [MICROCHIP]
1-CHANNEL POWER SUPPLY SUPPORT CKT, PSSO3;型号: | TC54VN3301EMB713 |
厂家: | MICROCHIP |
描述: | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PSSO3 |
文件: | 总16页 (文件大小:340K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TC54
M
Voltage Detector
Features
General Description
• Precise Detection Thresholds: Standard ±2.0%,
The TC54 Series are CMOS voltage detectors that are
especially well suited for battery-powered applications
because of their extremely low 1 µA operating current
and small surface-mount packaging. Each part is
laser-trimmed to the desired threshold voltage, which
can be specified from 1.4V to 7.7V for a 2% tolerance,
and 1.5V to 6.0V for a 1% tolerance.
The device includes a comparator, low-current high-
precision reference, laser-trimmed divider, hysteresis
circuit and output driver. The TC54 is available with
either an open-drain or complementary output stage.
Custom ±1.0%
• Small Packages: 3-Pin SOT-23A, 3-Pin SOT-89,
TO-92 and 5-Pin SOT-23A (7.7V only)
• Low Current Drain: Typ. 1 µA
• Wide Detection Range: 1.1V to 6.0V and 7.7V
• Wide Operating Voltage Range: 0.7V to 10V
Applications
• Battery Voltage Monitoring
• Microprocessor Reset
• System Brown-Out Protection
• Switching Circuit in Battery Backup
• Level Discriminator
In operation, the TC54's output (V
) remains in the
OUT
logic-high state as long as V is greater than the spec-
IN
DET -
ified threshold voltage (V
). When V falls below
IN
V
, the output is driven to a logic-low. V
remains
OUT
DET-
low until V rises above V
by an amount V
,
HYST
IN
DET -
whereupon it resets to a logic-high.
Functional Block Diagram
TC54VC only
Package Types
2
V
IN
3-Pin SOT-23A
3-Pin SOT-89
V
IN
3
V
IN
V
OUT
–
+
1
TC54
TC54
1
2
1
2
V
3
V
V
V
V
V
OUT
SS
OUT IN
SS
REF
V
SS
3
3-Pin TO-92
1 2 3
5-Pin SOT-23A
NC
5
NC
4
TC54VN has open-drain output.
TC54VC has complementary output.
TC54
2
3
1
V
V
V
OUT IN SS
V
V
V
OUT IN
SS
Note:
3-Pin SOT-23A is equivalent to the
EIAJ SC-59
5-Pin SOT-23A is equivalent to the
EIAJ SC-74A. (7.7V ONLY)
2003 Microchip Technology Inc.
DS21434E-page 1
TC54
† Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage ...................................................................+12V
Output Current ..............................................................50 mA
Output Voltage: CMOS................(VSS – 0.3V) to (VIN + 0.3V)
Open-Drain.....................(VSS – 0.3V) to 12V
PIN FUNCTION TABLE
Power Dissipation (TA ≤ 70°C):
Symbol
Description
Digital Output
Analog Input
Ground Terminal
No Connect
3-Pin SOT-23A .......................................................240 mW
3-Pin SOT-89..........................................................500 mW
5-Pin SOT-23A .......................................................240 mW
3-Pin TO-92 ............................................................300 mW
V
OUT
V
IN
V
SS
Operating Temperature Range........................-40°C to +85°C
Storage Temperature Range.........................-65°C to +150°C
NC
NC
No Connect
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, TA = +25°C.
Parameter
Sym
Min
Typ
Max
Units
Test Conditions
Operating Voltage
Quiescent Current
VIN
ISS
0.7
—
—
0.8
10.0
2.7
V
µA
(VDET -) = 0.8 to 6.0V
VIN = 2.0V
—
0.9
3.0
VIN = 3.0V
—
1.0
3.2
VIN = 4.0V
—
1.1
3.6
VIN = 5.0V
Threshold Voltage
VDET -
VHYST
IOUT
1.37
2.06
2.65
2.84
2.94
4.12
4.21
7.54
28
42
54
58
60
84
86
154
—
—
—
—
—
1.4
2.1
2.7
2.9
3.0
4.2
4.3
7.7
1.43
2.14
2.75
2.96
3.06
4.28
4.39
7.86
112
168
216
232
240
336
344
616
—
V
TC54VX14
TC54VX21
TC54VX27
TC54VX29
TC54VX30
TC54VX42
TC54VX43
TC54VX77 (5-pin SOT-23A only)
VDET = 1.4V (typ)
VDET = 2.1V (typ)
VDET = 2.7V (typ)
VDET = 2.9V (typ)
VDET = 3.0V (typ)
VDET = 4.2V (typ)
VDET = 4.3V (typ)
VDET = 7.7V (typ)
VOL = 0.5V, VIN = 2.1V
VIN = 3.0V
Note 1
Hysteresis Voltage
70
mV
mA
105
135
145
150
210
215
385
7.7
10.1
11.5
13.0
-10.0
Output Current
—
—
—
—
VIN = 4.0V
VIN = 5.0V
TC54VC Only:
VOH = VIN – 2.1V, VIN = 8.0V
Tempco of (VDET -)
Delay Time
TC (VDET -)
tDLY
—
—
±100
—
—
0.2
ppm/°C -40°C ≤ TA ≤ 85°C
ms VDET- → VOUT inversion
Note 1: For other voltage options, please contact your regional Microchip sales office.
DS21434E-page 2
2003 Microchip Technology Inc.
TC54
V
DET-
V
DD
t
DLY
V
OH
OUTPUT
FIGURE 1-1:
Timing Diagram.
2003 Microchip Technology Inc.
DS21434E-page 3
TC54
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
Pin No.
Pin No.
(3-Pin SOT-89)
(3-Pin TO-92)
Symbol
Description
(3-Pin SOT-23A)
(5-Pin SOT-23A)
1
3
2
—
—
1
2
3
—
—
1
2
3
4
5
V
V
V
NC
NC
Digital Output
Analog Input
Ground Terminal
No Connect
OUT
IN
SS
No Connect
2.1
Digital Output (V
)
2.3
Ground Terminal (V
)
OUT
SS
provides the negative reference for the analog
V
goes low when V drops below V
and
See
V
OUT
IN
DET -
SS
returns high when V rises above V
+ V . (
HYST
input voltage. Typically, the circuit ground is used.
IN
DET -
Figure 3-1, “Timing Diagram”.)
2.4
No Connect (NC)
2.2
Analog Input (V )
IN
can be used for power supply monitoring or a
No internal connection.
V
IN
voltage level that requires monitoring.
DS21434E-page 4
2003 Microchip Technology Inc.
TC54
The output (V
) will stay valid until the input voltage
3.0
DETAILED DESCRIPTION
OUT
falls below the minimum operating voltage (V
) of
INMIN
In normal steady-state operation when V > V
,
DET-
0.7V. Below this minimum operating voltage, the output
IN
the output will be at a logic-high (see Figure 3-1). In
the case of the TC54VN, this is an open-drain condi-
is undefined. During power-up (or anytime V has
IN
fallen below V
), V
INMIN
OUT
DET+
will remain undefined until
INMIN
OUT
tion. If and when the input falls below V
, the output
V
rises above V
. Once this occurs, the output
will be in its active-low state,
DET -
IN
will pull down (Logic 0) to V . Generally, V
can
OUT
will become valid. V
SS
SS
pull down to within 0.5V of V at rated output current
while V
+ V
< V < V
(therefore, V
= V
DET+
INMIN
IN
DET+
DET-
, the
and input voltage. (See Section 1.0, “Electrical
Characteristics”).
). If and when the input rises above V
HYST
output will assume its inactive state (high for TC54VC,
open-drain for TC54VN).
V
V
DET+
IN
Release Voltage
or RESET Voltage
V
HYST
Detect Voltage V
-
DET
Minimum Operating
Voltage
Ground Level
V
OUT
Output Voltage
Ground Level
FIGURE 3-1:
Timing Diagram.
2003 Microchip Technology Inc.
DS21434E-page 5
TC54
4.2
Other Applications
4.0
APPLICATIONS INFORMATION
Low operating power and small physical size make the
TC54 Series ideal for many voltage detector applica-
tions, such as those shown in Figures 4-2, 4-3 and 4-4.
Figure 4-2 shows a low-voltage gate drive protection
circuit that prevents overheating of the logic-level
MOSFET due to insufficient gate voltage. When the
input signal is below the threshold of the TC54VN, its
output grounds the gate of the MOSFET. Figure 4-3
and Figure 4-4 show the TC54 in conventional voltage
monitoring applications.
4.1
Modifying The Trip Point, V
-
DET
Although the TC54 has a pre-programmed V
-, it is
DET
sometimes necessary to make adjustments during pro-
totyping. This can be accomplished by connecting an
external resistor divider to a TC54, which has a V
-
DET
lower than that of V
(Figure 4-1).
SOURCE
To maintain detector accuracy, the bleeder current
through the divider should be significantly higher than
the 1 µA operating current required by the TC54. A rea-
sonable value for this bleeder current is 100 µA (100
times the 1 µA required by the TC54). For example, if
4.3V
V
- = 2V and the desired trip point is 2.5V, the value
DET
270Ω
V
CC
of R + R is 25 kΩ (2.5V/100 µA). The value of R +
1
2
1
R can be rounded to the nearest standard value and
2
V
IN
plugged into the equation of Figure 4-1 to calculate val-
R
L
ues for R and R . 1% tolerance resistors are
1
2
V
OUT
recommended.
TC54VX
MTP3055EL
V
R
SOURCE
2
V
SS
FIGURE 4-2:
MOSFET Low Drive
V
V
IN
OUT
Protection.
TC54
R
1
+
–
V
SS
V
IN
TC54VX
BATLOW
V
R
OUT
1
-------------------
V
=
= V
-
SOURCE
DET
R
+ R
1
2
V
SS
Where:
VSOURCE = Voltage to be monitored
(VDET-) = Threshold Voltage Setting of TC54
FIGURE 4-3:
Battery Voltage Monitor.
Note:
In this example, V
must be
SOURCE
greater than (V
)
DET-
V
FIGURE 4-1:
Modify trip-point of the TC54
IN
+
using external resistor divider.
V
OUT
Pwr
TC54VX
Power Good
Sply
–
V
SS
FIGURE 4-4:
Power Good Monitor.
DS21434E-page 6
2003 Microchip Technology Inc.
TC54
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
5-Pin SOT-23A
3-Pin SOT-23A
3-Pin SOT-89
2
1
4
3
1
2
3
4
1
2
3
4
1
1
2
represents output configuration (CMOS or Nch)
and first integer of voltage
represents output configuration and first integer
of voltage
D
Ex: CMOS 3.x =
Symbol
Output
Voltage
T
Nch
7.
Symbol
Output
Voltage
represents first decimal of output voltage
B
C
D
E
F
H
I
CMOS
CMOS
CMOS
CMOS
CMOS
CMOS
CMOS
1.
2.
3.
4.
5.
6.
7.
Symbol
Voltage
0
1
2
3
4
5
6
7
8
9
.0
.1
.2
.3
.4
.5
.6
.7
.8
.9
Symbol
Output
Voltage
L
M
N
P
R
S
T
Nch
Nch
Nch
Nch
Nch
Nch
Nch
1.
2.
3.
4.
5.
6.
7.
3
4
represents assembly lot code
&
2
represents first decimal of output voltage (0-9)
D
4
Ex: CMOS 3.x =
Symbol
Voltage
Symbol
Voltage
0
1
2
3
4
5
.0
.1
.2
.3
.4
.5
6
7
8
9
.6
.7
.8
.9
3
4
represents assembly lot code
&
2003 Microchip Technology Inc.
DS21434E-page 7
TC54
Package Marking Information (Continued)
3-Pin TO-92
1 2 3 4
5 6 7 8
1 , 2 , &
4
3
= 54X (fixed)
represents output configuration (CMOS or Nch)
C
Ex: CMOS 3.x =
Symbol
Output
C
N
CMOS
N-Channel
5
represents first integer of detect voltage
Symbol
Voltage
2
3
4
5
6
2.
3.
4.
5.
6.
6 represents first decimal of detect voltage
Symbol
Voltage
Symbol
Voltage
0
1
2
3
4
.0
.1
.2
.3
.4
5
6
7
8
9
.5
.6
.7
.8
.9
7 represents the output Delay Time
Symbol
Delay Time
No Delay
0
8 respresents the device accuracy
Symbol
Accuracy
±1.0% (custom)
±2.0% (standard)
1
2
DS21434E-page 8
2003 Microchip Technology Inc.
TC54
3-Lead Plastic Small Outline Transistor (CB) (SOT23)
E
E1
2
B
p1
D
n
p
1
α
c
A
A2
A1
φ
β
L
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
3
MAX
n
p
p1
A
A2
A1
E
E1
D
L
φ
Number of Pins
Pitch
3
.038
.076
.040
.037
.002
.093
.051
.115
.018
5
0.96
1.92
Outside lead pitch (basic)
Overall Height
Molded Package Thickness
.035
.044
0.89
0.88
1.01
0.95
0.06
2.37
1.30
2.92
0.45
5
1.12
1.02
0.10
2.64
1.40
3.04
0.55
10
.035
.000
.083
.047
.110
.014
0
.040
.004
.104
.055
.120
.022
10
Standoff
§
0.01
2.10
1.20
2.80
0.35
0
Overall Width
Molded Package Width
Overall Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
c
.004
.015
0
.006
.017
5
.007
.020
10
0.09
0.37
0
0.14
0.44
5
0.18
0.51
10
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
0
5
10
0
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-236
Drawing No. C04-104
2003 Microchip Technology Inc.
DS21434E-page 9
TC54
3-Lead Plastic Small Outline Transistor (MB) (SOT89)
H
E
B1
3
B
D1
D
p1
2
1
p
B1
L
E1
A
C
Units
INCHES
MILLIMETERS*
MIN MAX
1.50 BSC
Dimension Limits
p
MIN
MAX
Pitch
.059 BSC
.118 BSC
.055
p1
A
Outside lead pitch (basic)
Overall Height
3.00 BSC
1.40
.063
.167
.102
.090
.181
.072
.047
.017
.022
.019
1.60
4.25
2.60
2.29
4.60
1.83
1.20
0.44
0.56
0.48
Overall Width
H
.155
3.94
Molded Package Width at Base
Molded Package Width at Top
Overall Length
E
E1
D
.090
2.29
.084
2.13
.173
4.40
Tab Length
D1
L
.064
1.62
Foot Length
.035
0.89
c
Lead Thickness
.014
0.35
Lead 2 Width
B
.017
0.44
Leads 1 & 3 Width
B1
.014
0.36
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .005" (0.127mm) per side.
JEDEC Equivalent: TO-243
Drawing No. C04-29
DS21434E-page 10
2003 Microchip Technology Inc.
TC54
5-Lead Plastic Small Outline Transistor (CT) (SOT23)
E
E1
p
B
p1
D
n
1
α
c
A
A2
φ
A1
L
β
Units
Dimension Limits
INCHES*
NOM
MILLIMETERS
MIN
MAX
MIN
NOM
5
MAX
n
p
p1
A
A2
A1
E
E1
D
L
φ
c
B
α
β
Number of Pins
Pitch
Outside lead pitch (basic)
Overall Height
Molded Package Thickness
5
.038
.075
.046
.043
.003
.110
.064
.116
.018
5
0.95
1.90
.035
.035
.000
.102
.059
.110
.014
0
.057
0.90
0.90
1.18
1.10
0.08
2.80
1.63
2.95
0.45
5
1.45
.051
.006
.118
.069
.122
.022
10
.008
.020
10
1.30
0.15
3.00
1.75
3.10
0.55
10
0.20
0.50
10
Standoff
§
0.00
2.60
1.50
2.80
0.35
0
Overall Width
Molded Package Width
Overall Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
.004
.014
0
.006
.017
5
0.09
0.35
0
0.15
0.43
5
Mold Draft Angle Top
Mold Draft Angle Bottom
0
5
10
0
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-178
Drawing No. C04-091
2003 Microchip Technology Inc.
DS21434E-page 11
TC54
3-Lead Plastic Transistor Outline (ZB) (TO-92)
E1
D
n
1
L
1
2
3
α
B
p
c
A
R
β
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
3
MAX
n
p
Number of Pins
Pitch
Bottom to Package Flat
Overall Width
Overall Length
Molded Package Radius
Tip to Seating Plane
Lead Thickness
Lead Width
3
.050
.143
.186
.183
.090
.555
.017
.019
5
1.27
A
E1
D
R
L
.130
.155
.195
.195
.095
.610
.020
.022
6
3.30
4.45
3.62
4.71
4.64
2.29
14.10
0.43
0.48
5
3.94
.175
.170
.085
.500
.014
.016
4
4.95
4.95
2.41
15.49
0.51
0.56
6
4.32
2.16
12.70
0.36
0.41
4
c
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
2
3
4
2
3
4
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-92
Drawing No. C04-101
DS21434E-page 12
2003 Microchip Technology Inc.
TC54
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
XX
X
X
X
XX
XX
Examples:
a) TC54VC1402ECB713: 1.4V Voltage
Detector, 2% Tol., SOT-23A-3-TR.
Device
Output Detected Extra Tolerance Temp. Pkg Taping
Config. Voltage Feature
Code
Direction
b) TC54VC1402EMB713: 1.4V Voltage
Detector, 2% Tol., SOT-89-3-TR.
c) TC54VC1402EZB: 1.4V Voltage Detec-
tor, 2% Tol., TO-92.
Device:
TC54V:
Voltage Detector
d) TC54VC2102ECB713: 2.1V Voltage
Detector, 2% Tolerance, SOT-23A-3-TR.
e) TC54VC2102EMB713: 2.1V Voltage
Detector, 2% Tolerance, SOT-89-3-TR.
Output Configuration:
N
C
=
=
Nch Open-Drain
CMOS Output
Detected Voltage:
14
21
27
29
30
42
43
=
=
=
=
=
=
=
1.4V
2.1V
2.7V
2.9V
3.0V
4.2V
4.3V
f)
TC54VC2102EZB: 2.1V Voltage Detec-
tor, 2% Tolerance, TO-92.
g) TC54VC2702ECB713: 2.7V Voltage
Detector, 2% Tolerance, SOT-23A-3-TR.
h) TC54VC3002ECB713: 3.0V Voltage
Detector, 2% Tolerance, SOT-23A-3-TR.
i)
TC54VN4202ECB713: 4.2V Voltage
Detector, 2% Tolerance, SOT-23A-3-TR.
TC54VN7702ECT713: 7.7V Voltage
Detector, 2% Tolerance, SOT-23A-3-TR.
Extra Feature Code:
Tolerance:
0
=
Fixed
j)
1
2
=
=
1% (custom)
2% (standard)
Temperature:
Package:
E
=
-40°C to +85°C
CB
MB
CT
=
=
=
3-Pin SOT-23A (equivalent to EIAJ SC-59)
3-Pin SOT-89
5-Pin SOT-23A (equivalent to EIAJ SC-74A)
(7.7V ONLY)
ZB
=
Transistor Outline (TO-92), 3-lead
Taping Direction:
713 = Standard Taping
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2003 Microchip Technology Inc.
DS21434E-page 13
TC54
NOTES:
DS21434E-page 14
2003 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.
Trademarks
The Microchip name and logo, the Microchip logo, KEELOQ,
MPLAB, PIC, PICmicro, PICSTART, PRO MATE and
PowerSmart are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL
and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Accuron, Application Maestro, dsPIC, dsPICDEM,
dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM,
fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC,
microPort, Migratable Memory, MPASM, MPLIB, MPLINK,
MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal,
PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select
Mode, SmartSensor, SmartShunt, SmartTel and Total
Endurance are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2003, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
®
PICmicro 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
DS21434E-page 15
2003 Microchip Technology Inc.
M
WORLDWIDE SALES AND SERVICE
Japan
AMERICAS
ASIA/PACIFIC
Microchip Technology Japan K.K.
Benex S-1 6F
Corporate Office
Australia
2355 West Chandler Blvd.
Microchip Technology Australia Pty Ltd
Marketing Support Division
Suite 22, 41 Rawson Street
Epping 2121, NSW
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Australia
Korea
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Atlanta
Microchip Technology Korea
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Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
China - Beijing
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Alpharetta, GA 30022
Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
Tel: 770-640-0034 Fax: 770-640-0307
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Boston
Bei Hai Wan Tai Bldg.
Singapore
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Tel: 978-692-3848 Fax: 978-692-3821
No. 6 Chaoyangmen Beidajie
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Tel: 86-10-85282100 Fax: 86-10-85282104
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Chicago
China - Chengdu
Singapore, 188980
333 Pierce Road, Suite 180
Itasca, IL 60143
Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401-2402, 24th Floor,
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Tel: 630-285-0071 Fax: 630-285-0075
Microchip Technology (Barbados) Inc.,
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Ming Xing Financial Tower
Dallas
No. 88 TIDU Street
4570 Westgrove Drive, Suite 160
Addison, TX 75001
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Tung Hua North Road
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Tel: 86-28-86766200 Fax: 86-28-86766599
Tel: 972-818-7423 Fax: 972-818-2924
China - Fuzhou
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Detroit
Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
Tri-Atria Office Building
EUROPE
Austria
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250 Fax: 248-538-2260
No. 71 Wusi Road
Microchip Technology Austria GmbH
Durisolstrasse 2
Fuzhou 350001, China
Kokomo
Tel: 86-591-7503506 Fax: 86-591-7503521
A-4600 Wels
2767 S. Albright Road
Kokomo, IN 46902
China - Hong Kong SAR
Austria
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark
Tel: 765-864-8360 Fax: 765-864-8387
Los Angeles
Kwai Fong, N.T., Hong Kong
18201 Von Karman, Suite 1090
Irvine, CA 92612
Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Tel: 852-2401-1200 Fax: 852-2401-3431
China - Shanghai
Tel: 949-263-1888 Fax: 949-263-1338
Microchip Technology Consulting (Shanghai)
Co., Ltd.
Ballerup DK-2750 Denmark
Phoenix
Tel: 45-4420-9895 Fax: 45-4420-9910
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-4338
Room 701, Bldg. B
France
Far East International Plaza
No. 317 Xian Xia Road
Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
San Jose
Shanghai, 200051
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
Batiment A - ler Etage
China - Shenzhen
91300 Massy, France
Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Tel: 408-436-7950 Fax: 408-436-7955
Germany
Rm. 1812, 18/F, Building A, United Plaza
No. 5022 Binhe Road, Futian District
Shenzhen 518033, China
Toronto
Microchip Technology GmbH
Steinheilstrasse 10
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509
D-85737 Ismaning, Germany
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Tel: 86-755-82901380 Fax: 86-755-82966626
China - Qingdao
Rm. B505A, Fullhope Plaza,
Italy
No. 12 Hong Kong Central Rd.
Qingdao 266071, China
Microchip Technology SRL
Via Quasimodo, 12
20025 Legnano (MI)
Milan, Italy
Tel: 86-532-5027355 Fax: 86-532-5027205
India
Tel: 39-0331-742611 Fax: 39-0331-466781
Microchip Technology Inc.
India Liaison Office
United Kingdom
Marketing Support Division
Divyasree Chambers
Microchip Ltd.
505 Eskdale Road
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44-118-921-5869 Fax: 44-118-921-5820
03/25/03
DS21434E-page 16
2003 Microchip Technology Inc.
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