TC1412NEUA713 [MICROCHIP]
2 A BUF OR INV BASED MOSFET DRIVER, PDSO8, PLASTIC, MO-187, MSOP-8;
| 型号： | TC1412NEUA713 |
| 厂家： | 
MICROCHIP |
| 描述： | 2 A BUF OR INV BASED MOSFET DRIVER, PDSO8, PLASTIC, MO-187, MSOP-8 驱动 光电二极管 接口集成电路 驱动器 |
| 文件： | 总24页 (文件大小：951K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC1412/TC1412N
2A High-Speed MOSFET Drivers
Features
General Description
• Latch-Up Protected: Withstands 500 mA Reverse
Current
The TC1412/TC1412N are 2A CMOS buffers/drivers.
They do not latch up under any conditions within their
power and voltage ratings. They are not subject to
damage when up to 5V of noise spiking of either
polarity occurs on the ground pin. They can accept,
without damage or logic upset, up to 500 mA of current
of either polarity being forced back into their output. All
terminals are fully protected against electrostatic
discharge (ESD) up to 2.0 kV (HBM) and 400V (MM).
• Input Withstands Negative Inputs Up to 5V
• Electrostatic Discharge (ESD) Protected: 2.0 kV
(HBM) and 400V (MM)
• High Peak Output Current: 2A
• Wide Input Supply Voltage Operating Range:
- 4.5V to 16V
• High Capacitive Load Drive Capability:
- 1000 pF in 18 ns
As MOSFET drivers, the TC1412/TC1412N can easily
charge a 1000 pF gate capacitance in 18 ns with
matched rise and fall times. To ensure that the
MOSFET’s intended state will not be affected even by
large transients, low enough impedance in both the ‘On’
and ‘Off’ states are provided. The leading and trailing
edge propagation delay times are also matched to allow
driving short-duration inputs with greater accuracy.
• Short Delay Time: 35 ns typical
• Matched Delay Times
• Low Supply Current:
-
-
With Logic ‘1’ Input: 500 µA
With Logic ‘0’ Input: 100 µA
• Low Output Impedance: 4
• Available in Space-Saving 8-pin MSOP Package
• Pinout – same as TC1410/TC1411/TC1413
Package Type
8-Pin MSOP/PDIP/SOIC
V
V
DD
Applications
8
7
1
V
1
8 V
DD
DD
DD
IN 2
OUT
IN 2
7 OUT
6 OUT
5 GND
• Switch Mode Power Supplies
• Pulse Transformer Drive
• Line Drivers
TC1412
TC1412N
NC 3
NC 3
6 OUT
5 GND
GND 4
GND 4
• Relay Driver
6,7
2
2
6,7
Inverting
Non-Inverting
NC = No Internal Connection
Note:
For proper operation, duplicate pins
must be connected together.
2001-2015 Microchip Technology Inc.
DS20001391E-page 1
TC1412/TC1412N
Functional Block Diagram
VDD
TC1412
Inverting
Outputs
300 mV
Output
Non-Inverting
Outputs
Input
TC1412N
Effective
4.7V
Input C = 10 pF
GND
DS20001391E-page 2
2001-2015 Microchip Technology Inc.
TC1412/TC1412N
† Notice: Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only and functional
operation of the device at these or any other conditions
above those indicated in the operation sections of the
specifications is not implied. Exposure to Absolute
Maximum Rating conditions for extended periods may
affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage .....................................................+20V
Input Voltage ......................VDD + 0.3V to GND – 5.0V
Power Dissipation (TA 70°C)
MSOP..........................................................340 mW
PDIP............................................................730 mW
SOIC............................................................470 mW
Storage Temperature Range..............-65°C to +150°C
Maximum Junction Temperature...................... +150ºC
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, TA = +25°C, with 4.5V VDD 16V.
Parameters
Sym.
Min.
Typ.
Max. Units
Conditions
Input
Logic ‘1’, High Input Voltage
Logic ‘0’, Low Input Voltage
Input Current
VIH
VIL
IIN
2.0
—
—
—
—
—
—
0.8
1.0
10
V
V
-1.0
-10
µA 0V VIN VDD, TA = +25°C
-40°C TA +85°C
Output
High Output Voltage
Low Output Voltage
Output Resistance
VOH
VOL
RO
VDD – 0.025
—
—
4
—
0.025
6
V
V
DC Test
DC Test
—
—
VDD = 16V, IO = 10 mA,
TA = +25°C
—
—
—
—
5
7
7
0°C TA +70°C
-40°C TA +85°C
VDD = 16V
5
Peak Output Current
IPK
2.0
0.5
—
—
A
A
Latch-Up Protection
IREV
Duty cycle 2%, t 300 µs,
Withstand Reverse Current
VDD = 16V
Switching Time (Note 1)
Rise Time
tR
—
—
—
—
—
—
—
—
—
—
—
—
18
20
22
18
20
22
35
40
40
35
40
40
26
31
31
26
31
31
45
50
50
45
50
50
ns
ns
ns
ns
TA = +25°C
0°C TA +70°C
-40°C TA +85°C, Figure 4-1
TA = +25°C
Fall Time
tF
0°C TA +70°C
-40°C TA +85°C, Figure 4-1
TA = +25°C
Delay Time
Delay Time
tD1
0°C TA +70°C
-40°C TA +85°C, Figure 4-1
TA = +25°C
tD2
0°C TA +70°C
-40°C TA +85°C, Figure 4-1
Note 1:Switching times ensured by design.
2001-2015 Microchip Technology Inc.
DS20001391E-page 3
TC1412/TC1412N
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, TA = +25°C, with 4.5V VDD 16V.
Parameters
Power Supply
Power Supply Current
Sym.
Min.
Typ.
Max. Units
Conditions
IS
—
—
0.5
0.1
1.0
mA VIN = 3V, VDD = 16V
IN = 0V
0.15
V
Note 1:Switching times ensured by design.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V VDD 18V.
Parameters
Temperature Ranges
Sym.
Min.
Typ.
Max.
Units
Conditions
Specified Temperature Range (C)
Specified Temperature Range (E)
Maximum Junction Temperature
Storage Temperature Range
TA
TA
TJ
TA
0
—
—
—
—
+70
+85
ºC
ºC
ºC
ºC
-40
—
+150
+150
-65
Package Thermal Resistances
Thermal Resistance, 8L-MSOP
Thermal Resistance, 8L-PDIP
Thermal Resistance, 8L-SOIC
JA
JA
JA
—
—
—
211
89.3
—
—
—
ºC/W
ºC/W
ºC/W
149.5
DS20001391E-page 4
2001-2015 Microchip Technology Inc.
TC1412/TC1412N
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, over operating temperature range with 4.5V VDD 16V.
500
400
300
200
100
0
500
400
300
200
100
0
V
= 16V
T
= +25°C
SUPPLY
A
V
= 3V
IN
V
IN
= 3V
V
= 0V
IN
V
= 0V
IN
4
6
8
10
(V)
12
14
16
-40
-20
0
20
40
60
80
V
TEMPERATURE (°C)
DD
FIGURE 2-1:
Quiescent Supply Current
FIGURE 2-4:
Quiescent Supply Current
vs. Supply Voltage.
vs. Temperature.
1.6
1.6
V
= 16V
T
= +25°C
SUPPLY
A
1.5
1.4
1.3
1.5
1.4
1.3
1.2
1.1
V
IH
V
IH
1.2
1.1
V
V
IL
IL
4
6
8
10
(V)
12
14
16
-40
-20
0
20
40
60
80
V
TEMPERATURE (°C)
DD
FIGURE 2-2:
Input Threshold vs. Supply
FIGURE 2-5:
Input Threshold vs.
Voltage.
Temperature.
13
11
9
13
11
T
= +85°C
A
T
= +85°C
A
9
7
5
3
1
T
= +25°C
7
A
T
= +25°C
A
5
T
= -40°C
A
3
T
= -40°C
A
1
4
4
6
8
10
12
14
16
6
8
10
12
14
16
V
(V)
V
(V)
DD
DD
FIGURE 2-3:
High State Output
FIGURE 2-6:
Low State Output
Resistance vs. Supply Voltage.
Resistance vs. Supply Voltage.
2001-2015 Microchip Technology Inc.
DS20001391E-page 5
TC1412/TC1412N
Note: Unless otherwise indicated, over operating temperature range with 4.5V VDD 16V.
70
60
50
40
30
20
10
70
60
50
40
30
20
10
C
= 1000 pF
C
= 1000 pF
LOAD
LOAD
T
= +85°C
= -40°C
A
T
T
= +85°C
A
T
= +25°C
A
T
= +25°C
A
T
= -40°C
A
A
4
6
8
10
12
14
16
4
6
8
10
12
14
16
V
(V)
V
(V)
DD
DD
FIGURE 2-7:
Rise Time vs. Supply
FIGURE 2-10:
Fall Time vs. Supply
Voltage.
Voltage.
100
100
C
= 1000 pF
C
= 1000 pF
LOAD
LOAD
90
80
70
60
50
40
30
20
90
80
70
60
50
40
30
20
T
= +85°C
A
T
= +85°C
A
T
= +25°C
T
= +25°C
A
A
T
= -40°C
A
T
= -40°C
A
4
6
8
10
12
14
16
4
6
8
10
12
14
16
V
(V)
V
(V)
DD
DD
FIGURE 2-8:
Propagation Delay vs.
FIGURE 2-11:
Propagation Delay vs.
Supply Voltage.
Supply Voltage.
39
60
T
V
= +25°C
DD
A
T
V
= +25°C
DD
A
= 16V
t
RISE
38
37
36
35
34
33
32
= 16V
50
40
30
20
10
0
t
D2
t
FALL
t
D1
0
1000
2000
C
3000
(pF)
4000
5000
0
1000
3000
(pF)
4000
5000
2000
C
LOAD
LOAD
FIGURE 2-9:
Capacitive Load.
Rise and Fall Times vs.
FIGURE 2-12:
Capacitive Load.
Propagation Delays vs.
DS20001391E-page 6
2001-2015 Microchip Technology Inc.
TC1412/TC1412N
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin
PIN FUNCTION TABLE
TC1412
TC1412N
Description
No.
MSOP, PDIP, SOIC
MSOP, PDIP, SOIC
1
2
3
4
5
VDD
IN
VDD
IN
Supply input, 4.5V to 16V
Control input
No connection
Ground
NC
NC
GND
GND
GND
GND
Ground
6
OUT
OUT
CMOS push-pull output, common to pin 7
7
8
OUT
VDD
OUT
VDD
CMOS push-pull output, common to pin 6
Supply input, 4.5V to 16V
3.1
Supply Input (V
)
3.3
CMOS Push-Pull Output
(OUT, OUT)
DD
The VDD input is the bias supply for the MOSFET driver
and is rated for 4.5V to 16V with respect to the ground
pin. The VDD input should be bypassed to ground with
a local ceramic capacitor. The value of the capacitor is
chosen based on the capacitive load that is being
driven. A value of 1.0 µF is suggested.
The MOSFET driver output is a low-impedance, CMOS
push-pull style output, capable of driving a capacitive
load with 2A peak currents.
3.4
Ground (GND)
The ground pins are the return path for the bias current
and for the high peak currents that discharge the load
capacitor. The ground pins should be tied into a ground
plane or have very short traces to the bias supply
source return.
3.2
Control Input (IN)
The MOSFET driver input is a high-impedance,
TTL/CMOS-compatible input. The input has 300 mV of
hysteresis between the high and low thresholds which
prevents output glitching even when the rise and fall
time of the input signal is very slow.
3.5
No Connect (NC)
No internal connection.
2001-2015 Microchip Technology Inc.
DS20001391E-page 7
TC1412/TC1412N
4.0
APPLICATION INFORMATION
+5V
90%
Input
V
= 16V
DD
10%
0V
t
D1
t
D2
t
t
F
R
0.1 µF
1.0 µF
V
DD
90%
90%
1, 8
Output
0V
2
6, 7
10%
10%
Input
Output
C = 1000 pF
L
Inverting Driver
TC1412
TC1412
TC1412N
+5V
90%
Input
4, 5
10%
0V
V
Input: 100 kHz,
square wave,
DD
90%
D2
90%
t
D1
t
t
t
R
Output
0V
F
t
= t
10 ns
FALL
RISE
10%
10%
Non-Inverting Driver
TC1412N
FIGURE 4-1:
Switching Time Test Circuit.
DS20001391E-page 8
2001-2015 Microchip Technology Inc.
TC1412/TC1412N
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
8-Lead PDIP (300 mil)
Example
XXXXXXXX
XXXXXNNN
TC1412
CPA256
1317
YYWW
OR
TC1412
e
3
CPA256
1317
Legend: XX...X Customer-specific information
Y
Year code (last digit of calendar year)
YY
WW
NNN
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
RoHS Compliant JEDEC® designator for Matte Tin (Sn)
e
3
*
This package is RoHS Compliant. The RoHS Compliant JEDEC designator (
can be found on the outer packaging for this package.
)
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over
to the next line, thus limiting the number of available characters for customer-specific
information.
2001-2015 Microchip Technology Inc.
DS20001391E-page 9
TC1412/TC1412N
8-Lead SOIC (3.90 mm)
Example
TC1412
COA1317
256
NNN
OR
TC1412C
e
3
OA^1317
256
8-Lead MSOP (3x3 mm)
Example
1412E
317256
DS20001391E-page 10
2001-2015 Microchip Technology Inc.
TC1412/TC1412N
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1RWHꢀ For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
N
B
E1
NOTE 1
1
2
TOP VIEW
E
A2
A
C
3/$1(
L
c
A1
e
eB
8X b1
8X b
.010
C
SIDE VIEW
END VIEW
Microchip Technology Drawing No. C04-018D Sheet 1 of 2
2001-2015 Microchip Technology Inc.
DS20001391E-page 11
TC1412/TC1412N
ꢁꢂ/HDGꢃ3ODVWLFꢃ'XDOꢃ,Qꢂ/LQHꢃꢄ3$ꢅꢃꢂꢃꢆꢇꢇꢃPLOꢃ%RG\ꢃ>3',3@
1RWHꢀ For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
ALTERNATE LEAD DESIGN
(VENDOR DEPENDENT)
DATUM A
DATUM A
b
b
e
2
e
2
e
e
Units
Dimension Limits
INCHES
NOM
8
.100 BSC
-
MIN
MAX
Number of Pins
Pitch
N
e
A
Top to Seating Plane
-
.210
.195
-
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
A2
A1
E
E1
D
L
c
b1
b
eB
.115
.015
.290
.240
.348
.115
.008
.040
.014
-
.130
-
.310
.250
.365
.130
.010
.060
.018
-
.325
.280
.400
.150
.015
.070
.022
.430
Lower Lead Width
Overall Row Spacing
§
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-018D Sheet 2 of 2
DS20001391E-page 12
2001-2015 Microchip Technology Inc.
TC1412/TC1412N
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2001-2015 Microchip Technology Inc.
DS20001391E-page 13
TC1412/TC1412N
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001391E-page 14
2001-2015 Microchip Technology Inc.
TC1412/TC1412N
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2001-2015 Microchip Technology Inc.
DS20001391E-page 15
TC1412/TC1412N
8$
1RWHꢀ For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001391E-page 16
2001-2015 Microchip Technology Inc.
TC1412/TC1412N
UA
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2001-2015 Microchip Technology Inc.
DS20001391E-page 17
TC1412/TC1412N
8-Lead Plastic Micro Small Outline Package (UA) [MSOP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001391E-page 18
2001-2015 Microchip Technology Inc.
TC1412/TC1412N
APPENDIX A: REVISION HISTORY
Revision E (February 2015)
The following is the list of modifications:
• Updated the values for electrostatic discharge
(ESD) in the Features and General Description
columns.
• Updated the Pin Description table in Section 3.0,
Pin Descriptions.
• Updated package marking information and draw-
ings in Section 5.0, Packaging Information.
• Minor grammatical and spelling corrections.
Revision D (December 2012)
• Added a note to each package outline drawing.
Revision C (March 2003)
• Undocumented changes.
Revision B (May 2002)
• Undocumented changes.
Revision A (March 2001)
• Original Release of this Document.
2001-2015 Microchip Technology Inc.
DS20001391E-page 19
TC1412/TC1412N
NOTES:
DS20001391E-page 20
2001-2015 Microchip Technology Inc.
TC1412/TC1412N
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X
/XX
a) TC1412COA:
2A Single MOSFET
driver, SOIC package,
0°C to +70°C.
Temperature Package
Range
b) TC1412CPA:
2A Single MOSFET
driver, PDIP package,
0°C to +70°C.
Device:
TC1412: 2 A Single MOSFET Driver, Inverting
TC1412N: 2 A Single MOSFET Driver, Non-Inverting
c) TC1412EUA713: Tape and Reel, 2A
Single MOSFET
Temperature Range:
Package:
C
E
=
=
0°C to +70°C
-40°C to +85°C
driver, MSOP
package,
-40°C to +85°C.
OA
=
Plastic SOIC, (150 mil Body), 8-lead
OA713 = Plastic SOIC, (150 mil Body), 8-lead
(Tape and Reel)
a) TC1412NCPA:
b) TC1412NEPA:
c) TC1412NEUA:
2A Single MOSFET
driver, PDIP package,
0°C to +70°C.
UA
= Plastic Micro Small Outline (MSOP), 8-lead *
UA713 = Plastic Micro Small Outline (MSOP), 8-lead *
(Tape and Reel)
PA
= Plastic DIP (300 mil Body), 8-lead
2A Single MOSFET
driver, PDIP package,
-40°C to +85°C.
* MSOP package is only available in E-Temp.
2A Single MOSFET
driver, MSOP
package,
-40°C to +85°C.
2001-2015 Microchip Technology Inc.
DS20001391E-page 21
TC1412/TC1412N
NOTES:
DS20001391E-page 22
2001-2015 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
32
OptoLyzer, PIC, PICSTART, PIC logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2001-2015, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-63277-092-9
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
== ISO/TS 16949 ==
2001-2015 Microchip Technology Inc.
DS20001391E-page 23
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
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Technical Support:
http://www.microchip.com/
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Tel: 86-592-2388138
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Tel: 86-756-3210040
Fax: 86-756-3210049
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
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Tel: 852-2943-5100
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
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Tel: 33-1-69-53-63-20
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Tel: 86-10-8569-7000
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Tel: 49-89-627-144-0
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Tel: 86-28-8665-5511
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Korea - Seoul
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Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
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Tel: 46-8-5090-4654
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Tel: 86-532-8502-7355
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Detroit
Novi, MI
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Tel: 44-118-921-5800
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China - Shenzhen
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Los Angeles
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China - Wuhan
Tel: 86-27-5980-5300
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Tel: 905-673-0699
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01/27/15
DS20001391E-page 24
2001-2015 Microchip Technology Inc.
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