TC1305R-DVUN
更新时间：2024-09-18 01:49:59
品牌：MICROCHIP
描述：Dual 150mA CMOS LDO With Select Mode⑩ Operation, Shutdown and Independent RESET Output
概述
规格参数
数据手册TC1305R-DVUN 概述
Dual 150mA CMOS LDO With Select Mode⑩ Operation, Shutdown and Independent RESET Output 双150毫安CMOS LDO，具有选择Mode⑩运行，停机和独立RESET输出 线性稳压器IC
TC1305R-DVUN 规格参数
| 是否Rohs认证： | 符合 | 生命周期： | Obsolete |
| 零件包装代码： | MSOP | 包装说明： | MSOP-10 |
| 针数： | 10 | Reach Compliance Code： | unknown |
| ECCN代码： | EAR99 | HTS代码： | 8542.39.00.01 |
| 风险等级： | 5.84 | Is Samacsys： | N |
| 最大回动电压 1： | 0.36 V | 最大回动电压 2： | 0.36 V |
| 最大输入电压： | 6 V | 最小输入电压： | 2.7 V |
| JESD-30 代码： | S-PDSO-G10 | JESD-609代码： | e3 |
| 长度： | 3 mm | 湿度敏感等级： | 1 |
| 功能数量： | 1 | 输出次数： | 2 |
| 端子数量： | 10 | 工作温度TJ-Max： | 125 °C |
| 工作温度TJ-Min： | -40 °C | 最大输出电流 1： | 0.15 A |
| 最大输出电流 2： | 0.15 A | 最大输出电压 1： | 2.5625 V |
| 最小输出电压 1： | 2.4375 V | 标称输出电压 1： | 2.5 V |
| 最大输出电压 2： | 2.87 V | 最小输出电压 2： | 2.73 V |
| 标称输出电压 2： | 2.8 V | 封装主体材料： | PLASTIC/EPOXY |
| 封装代码： | TSSOP | 封装形状： | SQUARE |
| 封装形式： | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 峰值回流温度（摄氏度）： | 260 |
| 认证状态： | Not Qualified | 调节器类型： | FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR |
| 座面最大高度： | 1.1 mm | 表面贴装： | YES |
| 技术： | CMOS | 端子面层： | Matte Tin (Sn) |
| 端子形式： | GULL WING | 端子节距： | 0.5 mm |
| 端子位置： | DUAL | 处于峰值回流温度下的最长时间： | 40 |
| 宽度： | 3 mm | Base Number Matches： | 1 |
TC1305R-DVUN 数据手册
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PDF下载TC1305
™
Dual 150mA CMOS LDO With Select Mode Operation,
Shutdown and Independent RESET Output
Features
General Description
• Extremely Low Supply Current for Longer Battery
Life
The TC1305 combines two CMOS Low Dropout Regu-
lators and a Microprocessor Monitor in a space saving
10-Pin MSOP package. Designed specifically for
battery operated systems, total supply current is
typically 120µA at full load, 20 to 60 times lower than in
bipolar regulators.
™
• Select Mode Operation: Selectable Output
Voltages for High Design Flexibility
• Very Low Dropout Voltage
• 29µV
Typical Output Noise
RMS
The TC1305 features selectable output voltages for
higher design flexibility. The tri-state SELECT input pin
• 10µsec (Typ.) Wake-Up Time from SHDN
• 150mA Output Current per Output
• High Output Voltage Accuracy
allows the user to select V
and V
from 3
OUT1
OUT2
different values (2.5V, 2.8V and 3.0V).
An active low RESET is asserted when the detected
voltage (V ) falls below the 2.63V reset voltage
• Power-Saving Shutdown Mode
• RESET Output Can Be Used as a Low Battery
Detector or Processor Reset Generator
DET
threshold. The RESET output remains low for 300msec
(typical) after V rises above reset threshold. When
• Over Current Protection and Over Temperature
Shutdown
DET
the shutdown controls (SHDN1 and SHDN2) are low,
the regulator output voltages fall to zero, RESET output
remains valid and supply current is reduced to 20µA
(typ.)
• Space Saving 10-Pin MSOP Package
Applications
• Load Partitioning
Other key features for the device include ultra low noise
operation, fast response to step changes in load and
very low dropout voltage (typically 150mV at full load).
The device also incorporates both over temperature
and over current protection. Each regulator is stable
with an output capacitor of only 1µF and has a
maximum output current of 150mA. The TC1305 is
featured in a 10-Pin MSOP package with selective
output voltages.
• Battery Operated Systems
• Portable Computers
• Medical Instruments
• Instrumentation
• Pagers and Cellular/PHS Phones
• Linear Post-Regulator for SMPS
Device Selection Table
Typical Application
Junction
Part Number
Package
Temperature
Range
1
10
9
V
DET
RESET
2
3
TC1305R-DVUN 10-Pin MSOP -40°C to +85°C
V
V
IN
OUT2
3.3µF
3.3µF
NOTE: “R” denotes the suffix for the 2.63V VDET threshold.
TC1305
8
7
6
V
“D” indicates VOUT1 = VOUT2 = 2.5, 2.8, 3.0 (selectable).
GND
SELECT
SHDN1
OUT1
Other output voltages are available. Please contact Microchip
Technology Inc. for details.
4
5
470pF Bypass
(Optional)
Package Type
SHDN2
10-Pin MSOP
V
1
2
3
10
9
RESET
DET
V
V
IN
OUT2
V
GND
SELECT
SHDN1
8
OUT1
TC1305
4
5
7
6
Bypass
SHDN2
2002 Microchip Technology Inc.
DS21526A-page 1
TC1305
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS*
Input Voltage .........................................................6.5V
Output Voltage...........................(-0.3V) to (V + 0.3V)
IN
Power Dissipation................Internally Limited (Note 7)
Maximum Voltage on Any Pin ......... V +0.3V to -0.3V
IN
Operating Temperature Range.... -40°C < T < +125°C
J
Storage Temperature Range ..............-55°C to +150°C
TC1305 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VIN = VR + 1V, IL = 100µA, CL = 3.3µF, SHDN1 > VIH, SHDN2 > VIH, TA = 25°C, unless otherwise
noted. Boldface type specifications apply for junction temperature of -40°C to +125°C. Applies to both VOUT1 and VOUT2
.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
VIN
Input Operating Voltage
2.7
—
—
6.0
V
mA
V
Note 1
IOUTMAX
VOUT
Maximum Output Current
150
—
Per Channel
Output Voltage (VOUT1 and VOUT2
VOUT Temperature Coefficient
)
VR – 2.5% VR ± 0.5% VR + 2.5%
Note 2
TCVOUT
—
20
—
ppm/°C Note 3
—
40
—
∆VOUT/∆VIN Line Regulation
∆VOUT/VOUT Load Regulation
—
—
0.05
0.5
0.35
2
%
%
(VR + 1V) < VIN < 6V
IL = 0.1mA to IOUTMAX
(Note 4)
VIN – VOUT
Dropout Voltage
—
2
50
100
150
—
mV
IL = 100µA
IL = 50mA
IL = 100mA
IL = 150mA
(Note 5)
120
240
360
IIN
Supply Current
—
—
—
—
—
—
120
0.05
64
160
0.5
—
µA
µA
SHDN1, SHDN2 = VIH, IL = 0
SHDN1, SHDN2 = 0V
FRE ≤ 120Hz
IINSD
PSRR
Shutdown Supply Current
Power Supply Rejection Ratio
Output Short Circuit Current
Thermal Regulation
dB
IOUT
600
0.04
10
—
mA
V/W
VOUT = 0V
SC
∆VOUT∆PD
—
Notes 6, 7
tWK
Wake Up Time
—
µsec VIN = 5V
C
IN = 1µF, COUT = 4.7µF
(from Shutdown Mode)
Settling Time
IL = 30mA, (See Figure 4-1)
ts
—
40
—
µsec VIN = 5V
IN = 1µF, COUT = 4.7µF
IL = 30mA, (See Figure 4-1)
C
(from Shutdown Mode)
Note 1: The minimum VIN has to meet two conditions: VIN ≥ 2.7 and VIN ≥ VR + VDROPOUT
.
2:
3:
VR is the regulator output voltage setting. For example: VR = 2.5V, 2.8V, 3.0V.
TC VOUT = (VOUTMAX – VOUTMIN) x 106
VOUT x ∆T
4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from
0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation
specification.
5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V
differential.
6: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 5.0 Thermal Considerations section of this data sheet for more details.
DS21526A-page 2
2002 Microchip Technology Inc.
TC1305
TC1305 ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: VIN = VR + 1V, IL = 100µA, CL = 3.3µF, SHDN1 > VIH, SHDN2 > VIH, TA = 25°C, unless otherwise noted.
Boldface type specifications apply for junction temperature of -40°C to +125°C. Applies to both VOUT1 and VOUT2
.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
TSD
Thermal Shutdown Die
Temperature
—
160
—
°C
∆TSD
Thermal Shutdown Hysteresis
Output Noise
—
—
15
—
—
°C
eN
200
nV√Hz IL = 100µA, F = 1kHz,
C
C
OUT1 = COUT2 = 4.7µF,
BYPASS = 0.01µF
—
29
—
µVRMS F = 10Hz to 100kHz
SHDN Input
VIH
SHDN Input High Threshold
SHDN Input Low Threshold
65
—
—
—
%VIN VIN = 2.7V to 6.0V
%VIN VIN = 2.7V to 6.0V
VIL
—
15
SELECT Input
VSELH
SELECT Input HIgh Threshold
SELECT Input Low Threshold
VIN – 0.2
—
—
—
V
V
VIN = 2.7V to 6.0V
VIN = 2.7V to 6.0V
VSELL
0.2
RESET Output
VDET VDET Voltage Range
1.0
1.2
—
—
6.0
6.0
V
V
TA = 0°C to +70°C
TA = -40°C to +125°C
VTH
Reset Threshold
2.59
2.55
2.63
—
2.66
2.70
TA = +25°C
TA = -40°C to +125°C
IVDET
Reset Circuit Supply Current
Reset Threshold Tempco
VDET to Reset Delay
—
—
20
30
40
—
µA
RESET = Open
ppm/°C
—
100
300
—
µsec VDET = VTH to (VTH – 100mV)
Reset Active Time-out Period
RESET Output Voltage Low
140
560
msec
VOL
—
—
—
—
—
—
0.3
0.4
0.3
V
V
V
V
DET = VTHMIN, ISINK = 1.2mA
DET = VTHMIN, ISINK = 3.2mA
DET > 1.0V, ISINK = 50µA
VOH
RESET Output Voltage High
0.8 VDET
VDET – 1.5
—
—
—
V
VDET > VTHMAX, ISOURCE = 500µA
VDET > VTHMAX, ISOURCE = 800µA
Note 1: The minimum VIN has to meet two conditions: VIN ≥ 2.7 and VIN ≥ VR + VDROPOUT
.
2:
3:
VR is the regulator output voltage setting. For example: VR = 2.5V, 2.8V, 3.0V.
TC VOUT = (VOUTMAX – VOUTMIN) x 106
VOUT x ∆T
4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from
0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation
specification.
5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V
differential.
6: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 5.0 Thermal Considerations section of this data sheet for more details.
2002 Microchip Technology Inc.
DS21526A-page 3
TC1305
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(10-Pin MSOP)
Symbol
Description
1
2
3
4
VDET
VIN
Detected input voltage. VDET and VIN can be connected together.
Power supply input.
Ground terminal.
GND
SELECT
Tri-state input for setting VOUT1 and VOUT2. SELECT = GND for VOUT1 = VOUT2 = 2.5V,
SELECT = VIN for VOUT1 = VOUT2 = 3.0V and SELECT = No connect for VOUT1 = VOUT2 = 2.8V.
5
6
SHDN1
SHDN2
Shutdown control input for VOUT1. Regulator 1 is fully enabled when a logic high is applied to
this input. Regulator 1 enters shutdown when a logic low is applied to this input. During
shutdown, regulator output voltage falls to zero, RESET output remains valid.
Shutdown control input for VOUT2. Regulator 2 is fully enabled when a logic high is applied to
this input. Regulator 2 enters shutdown when a logic low is applied to this input. During
shutdown, regulator output voltage falls to zero, RESET output remains valid.
7
8
Bypass
VOUT1
VOUT2
RESET
Reference bypass input. Connecting a 0.01µF to this input further reduces output noise.
Regulated voltage output 1.
9
Regulated voltage output 2.
10
RESET Output. RESET = Low when VDET is below the Reset Threshold Voltage.
RESET = High when VDET is above the Reset Threshold Voltage.
DS21526A-page 4
2002 Microchip Technology Inc.
TC1305
3.0
DETAILED DESCRIPTION
4.0
4.1
TYPICAL APPLICATIONS
The TC1305 is a precision fixed output voltage
regulator that contains two fully independent 150mA
regulator outputs. The device features separate
shutdown modes for low-power operation, and a
common bypass pin that can be used to further reduce
output noise. The Select Mode operation allows the
user to select V
values (2.5V, 2.8V, 3.0V), therefore providing high
design flexibility. The CMOS construction of the
TC1305 results to a very low supply current, which
Input and Output Capacitor
The TC1305 is stable with a wide range of capacitor
values and types. A capacitor with a minimum value of
1µF from V
to Ground is required. The output
OUT
™
capacitor should have an effective series resistance
(ESR) of 0.1Ω to 10Ω for a 1µF capacitor and 0.01Ω to
10Ω for a 10µF capacitor. A 1µF capacitor should be
and V
from three different
OUT1
OUT2
connected from the V to GND if there is more than 10
IN
inches of wire between the regulator and the AC filter
capacitor, or if a battery is used as the power source.
Aluminum electrolytic or tantalum capacitor types can
be used. (Since many aluminum electrolytic capacitors
freeze at approximately -30°C, solid tantalums are
recommended for applications operating below -20°C).
When operating from sources other than batteries,
supply-noise rejection and transient response can be
improved by increasing the value of the input and
output capacitors and employing passive filtering
techniques.
does not increase with load changes. In addition, V
remains stable and within regulation at no load
currents.
OUT
The TC1305 also features an integrated microproces-
sor supervisor that monitors power-up, power-down,
and brown-out conditions. The active low RESET
signal is asserted when the detected voltage V
below the reset voltage threshold (2.63V). The RESET
output remains low for 300msec (typical) after V
rises above the reset threshold. The RESET output of
the TC1305 is ensured valid down to V = 1V and is
optimized to reject fast transient glitches on the
monitored power supply line.
falls
DET
DET
DET
4.2
Bypass Capacitor
A 0.01µF capacitor connected from the bypass input to
ground reduces noise present on the internal
reference, which in turn significantly reduces output
noise. If output noise is not a concern, this input may be
left unconnected.
Larger capacitor values may be used, but result in a
longer time period to rated output voltage when power
is initially applied.
4.3
Shutdown Mode
Applying a logic high to each of the shutdown pins turns
on the corresponding output. Each regulator enters
shutdown mode when a logic low is applied in the
corresponding input. During shutdown mode, the out-
put voltage falls to zero, and regulator supply current is
reduced to 0.5µA (max). If shutdown mode is not
necessary, the pins should be connected to V
.
IN
2002 Microchip Technology Inc.
DS21526A-page 5
TC1305
4.4
Select Mode™ Operation
4.6
Turn On Response
™
The Select Mode operation is a tri-state input that
allows the user to select V and V from three
The turn on response is defined as two separate
response categories, Wake Up Time (t ) and Settling
OUT1
OUT2
WK
different values. By connecting the SELECT pin to
GND, both output voltages (V , V ) supply
Time (t ).
S
OUT1
OUT2
The TC1305 has a fast Wake Up Time (10µsec typical)
when released from shutdown. See Figure 4-1 for the
2.5V. Connecting the SELECT pin to V results in both
IN
output channels supplying a fixed 3.0V output. Last but
not least, leaving the SELECT pin floating sets both
voltages to 2.8V. This output voltage functionality
provides high design flexibility and minimizes costs
associated with inventory, time-to-market and new
device qualifications.
Wake Up Time designated as t . The Wake Up Time
is defined as the time it takes for the output to rise to 2%
WK
of the V
value after being released from shutdown.
OUT
The total turn on response is defined as the Settling
Time (t ), see Figure 4-1. Settling Time (inclusive with
S
t
) is defined as the condition when the output is
WK
within 2% of its fully enabled value (40µsec typical)
when released from shutdown. The settling time of the
output voltage is dependent on load conditions and
4.5
RESET Output
The microprocessor supervisor of theTC1305 provides
accurate supply voltage monitoring and reset timing
during power-up, power-down and brown-out condi-
output capacitance on V
(RC response).
OUT
tions. The RESET output is valid to V
= 1.0V (below
DET
FIGURE 4-1:
WAKE-UP RESPONSE
TIME
this point it becomes an open circuit and does not sink
current) and is able to reject negative going transients
(glitches) on the power supply line. Transient immunity
can further be improved by adding a capacitor close to
V
IH
V
t
IL
S
the V
pin of the TC1305.
SHDN
DET
98%
2%
V
OUT
t
WK
DS21526A-page 6
2002 Microchip Technology Inc.
TC1305
Equation 5-1 can be used in conjunction with
Equation 5-2 to ensure regulator thermal operation is
within limits. For example:
5.0
5.1
THERMAL CONSIDERATIONS
Thermal Shutdown
Given:
Integrated thermal protection circuitry shuts the
regulator off when die exceeds approximately 160°C.
The regulator remains off until the die temperature
drops to approximately 145°C.
V
= 3.8V ± 5%
INMAX
V
= 3.0V ± 2.5%
= 3.0V ± 2.5%
OUT1MIN
V
OUT2MIN
Thermal shutdown is intended to protect the device
under transient accidental (fault) overload conditions.
Thermal Shutdown may not protect the LDO while
operating above junction temperatures of 125°C
continuously. Sufficient thermal evaluation of the
design needs to be conducted to ensure that the
junction temperature does not exceed 125°C.
I
LOAD1MAX = 120mA
LOAD2MAX = 120mA
I
T
= 125°C
= 55°C
JMAX
T
AMAX
JA
θ
= 113°C/W
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
5.2
Power Dissipation
Actual power dissipation:
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation.
P
≈ [(VINMAX – VOUT1MIN)] x I
D
LOAD1MAX
+ [(VINMAX – VOUT2MIN)] x I
LOAD2MAX
-3
-3
[(3.8 x 1.05) – (3.0 x .975)] x 120 x 10
+ [(3.8 x 1.05) – (3.0 x .975)] x 120 x 10
= 256mW
EQUATION 5-1:
P
≈ (VINMAX – VOUT1MIN)I
+
D
LOAD1MAX
LOAD2MAX
(VINMAX – VOUT2MIN)I
Maximum allowable power dissipation:
P
= (TJMAX – T
)
Where:
D
AMAX
θ
JA
P
= Worst case actual power dissipation
D
= (125 – 55)
113
V
= Maximum voltage on V
= Minimum regulator output voltage1
= Maximum output (load) current1
INMAX
IN
V
OUT1MIN
I
= 620mW
V
LOAD1MAX = Minimum regulator output voltage2
OUT2MIN
In this example, the TC1305 dissipates a maximum of
256mW; below the allowable limit of 620mW. In a
similar manner, Equation 5-1 and Equation 5-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
I
= Maximum output (load) current2
LOAD2MAX
The
maximum
allowable
power
dissipation
(Equation 5-2) is a function of the maximum ambient
temperature (TAMAX), the maximum allowable die
temperature (125°C), and the thermal resistance from
junction-to-air (θ ). The MSOP-10 package has a θ
of approximately 113°C/W when mounted on a four
layer FR4 dielectric copper clad PC board.
V
is found by substituting the maximum allowable
IN
power dissipation of 620mW into Equation 5-1, from
which VINMAX = 5.6V.
JA
JA
5.3
Layout Considerations
EQUATION 5-2:
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
P
DMAX = (TJMAX – T
)
AMAX
θ
JA
supply bus lines combine to lower θ and therefore
JA
Where all terms are previously defined.
increase the maximum allowable power dissipation
limit.
2002 Microchip Technology Inc.
DS21526A-page 7
TC1305
6.0
TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Dropout Voltage1 vs. Load Current
Dropout Voltage2 vs. Load Current
(SELECT = V
Dropout Voltage1 vs. Load Current
(SELECT = NC)
(SELECT = V
)
)
DD
DD
0.25
0.20
0.15
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
130°C
130°C
130°C
25°C
25°C
25°C
0.10
0.05
0.00
-45°C
-45°C
-45°C
0
25
50
75
100 125 150
0
25
50
75
100 125 150
0
25
50
75
100 125 150
LOAD CURRENT (mA)
LOAD CURRENT (mA)
LOAD CURRENT (mA)
Dropout Voltage2 vs. Load Current
Load Regulation
vs. Temperature
I
vs. V
DD DD
(SELECT = V
)
(SELECT = GND)
DD
0.25
0.20
0.15
0.600
0.500
150
140
120
100
80
130°C
-45°C
0.400
0.300
0.200
I
= 0.1 to 150mA
L
25°C
25°C
130°C
-45°C
0.10
0.05
0.00
60
40
20
0
0.100
0.000
0
25
50
75
100 125 150
-45 -20
5
30 55 80 105 130
3
3.5
4
4.5
(V)
5
5.5
6
V
LOAD CURRENT (mA)
DD
TEMPERATURE (°C)
I
vs. Temperature
Reset Active Time vs.
V
Trip Point vs.
DD
(SELECT = NC)
CC
Temperature (°C)
Temperature (°C)
2.70
140
130
400
350
300
250
2.68
2.66
2.64
2.62
2.60
2.58
2.56
2.54
2.52
2.50
120
110
100
V
= 6.0V
= 3.0V
DD
200
150
V
DD
100
50
90
80
0
-40 -20
5
30 55
80 105 125
-40 -20
5
30 55 80 105 125
-40 -20
5
30 55 80 105 125
TEMPERATURE (°C)
TEMPERATURE (°C)
TEMPERATURE (°C)
DS21526A-page 8
2002 Microchip Technology Inc.
TC1305
6.0
TYPICAL CHARACTERISTICS (CONTINUED)
V
vs. Temperature
V
vs. Temperature
V vs. Temperature
OUT1
OUT1
(SELECT = V
OUT2
(SELECT = V
)
)
(SELECT = NC)
DD
DD
3.00
2.99
2.98
2.97
2.96
2.95
2.94
2.93
2.92
2.81
3.01
3.00
2.99
2.98
2.97
2.96
2.95
2.94
2.93
2.92
V
= 6.0V & I = 100µA
DD
L
V
= 6.0V & I = 100µA
L
DD
2.80
2.79
2.78
2.77
2.76
2.75
V
= 3.8V & I = 100mA
L
V
= 4.0V & I = 100µA
L
DD
V
= 3.8V & I = 150mA
L
DD
DD
V
= 3.8V & I = 100mA
V
= 3.8V & I = 150mA
L
DD
L
DD
V
= 6.0V & I = 100µA
L
DD
V
= 4.0V & I = 100µA
L
DD
2.74
2.73
-45 -20
5
30 55
80 105 130
-45 -20
5
30 55
80 105 130
-45 -20
5
30 55
80 105 130
TEMPERATURE (°C)
TEMPERATURE (°C)
TEMPERATURE (°C)
V vs. Temperature
OUT2
(SELECT = NC)
V
vs. Temperature
OUT1
(SELECT = GND)
V
vs. Temperature
OUT2
(SELECT = GND)
2.81
2.80
2.79
2.78
2.77
2.76
2.75
2.74
2.73
2.51
2.50
2.49
2.48
2.47
2.46
2.45
2.44
2.43
2.51
2.50
2.49
2.48
2.47
2.46
2.45
2.44
2.43
V
= 6.0V & I = 100µA
L
DD
V
= 6.0V & I = 100µA
L
DD
V
= 3.5V & I = 100µA
V
= 3.5V & I = 100µA
L
DD
L
DD
V
= 6.0V & I = 100µA
L
DD
= 3.8V & I = 150mA
V
= 3.5V & I = 150mA
V
= 3.5V & I = 150mA
DD
L
DD
L
V
DD
L
V
= 6.0V & I = 100µA
L
DD
-45 -20
5
30 55
80 105
130
-45 -20
5
30 55
80 105
130
-45 -20
5
30 55
80 105
130
TEMPERATURE (°C)
TEMPERATURE (°C)
TEMPERATURE (°C)
2002 Microchip Technology Inc.
DS21526A-page 9
TC1305
6.0
TYPICAL CHARACTERISTICS (CONTINUED)
Power Supply Rejection Ratio vs. Frequency
Power Supply Rejection Ratio vs. Frequency
0
-20
0
I
C
C
= 150mA
OUT
V
V
V
= 4V
= 100mV
INDC
INAC
I
= 150mA
OUT
OUT
V
V
V
= 4V
INDC
INAC
= 10µF Tantalum
OUT
C
= 10µF Tantalum
P-P
= 100mV
P-P
= 0.01µF Ceramic
BYPASS
= 3V
OUTDC
= 3V
OUTDC
-20
-40
-40
-60
-60
-80
-80
-100
-100
10
100
1k
10k
100k
1M
10
100
1k
10k
100k
1M
f (Hz)
f (Hz)
Line Transient Response
Output Noise
10
1
V
OUT2
V
OUT1
0.1
6V
4V
C
C
= C
= 4.7µF,
OUT2
OUT1
= 0.01µF, I
= 100µA,
0.01
BYPASS
LOAD
= 3.0V
OUT2
C
C
C
= 10µF Ceramic
OUT
IN
BYP
LOAD
V
IN
= 4.0V, V
= V
OUT1
= 0
= 0.01µF
= 100µA
= 3V
I
0.001
0.01
V
OUT
0.1
1
10
100
1000
Frequency (kHz)
Time (2µs / div)
Load Transient Response
150mA
100µA
V
V
C
C
= 4V
IN
OUT
= 3V
= 10µF Ceramic
OUT
BYP
= 0.01µF
Time (100ms / div)
DS21526A-page 10
2002 Microchip Technology Inc.
TC1305
6.0
TYPICAL CHARACTERISTICS (CONTINUED)
Line Transient Response
Line Transient Response
V
V
OUT2
OUT2
V
V
V
OUT1
OUT1
V
4.6V
IN
IN
4.6V
3.6V
3.6V
C
OUT1
R
LOAD
= C
OUT2
= 30kΩ
= 10µF Ceramic
C
OUT1
R
LOAD
= C
OUT2
= 30kΩ
= 1µF Tantalum
Load Transient Response
Load Transient Response
V
V
OUT2
V
V
OUT2
OUT1
OUT1
C
= C
OUT2
= 1µF Tantalum
C
=
C
= 10µF Ceramic
OUT1
OUT1
OUT2
100mA
100mA
V
= 5.5V
V
= 5.5V
IN
IN
R
R
= 30kΩ
R
R
= 30kΩ
= 30kΩ
LOAD
L
LOAD
L
= 30kΩ
100µA
100µA
Load Transient Response
Load Transient Response
V
V
V
V
OUT2
OUT2
OUT1
OUT1
C
=
C
= 1µF Tantalum
OUT1
OUT2
C
=
C
= 10µF Ceramic
OUT1
OUT2
100mA
100mA
V
= 5.5V
IN
V
R
R
= 5.5V
IN
R
R
= 30kΩ
LOAD
L
= 30kΩ
LOAD
= 30kΩ
= 30kΩ
L
100µA
100µA
2002 Microchip Technology Inc.
DS21526A-page 11
TC1305
6.0
TYPICAL CHARACTERISTICS (CONTINUED)
Thermal Shutdown Response
Thermal Shutdown Response
V
OUT
V
OUT
V
V
C
C
C
= 6.0V
V
V
C
C
C
= 6.0V
IN
OUT
IN
IN
OUT
IN
= 2.8V
= 2.5V
= 1µF
= 1µF
= 1µF
= 1µF
OUT
OUT
= 470pF
BYPASS
= 470pF
BYPASS
Time (500ms / div)
Time (500ms / div)
Shutdown Response
3.0V
Thermal Shutdown Response
V
OUT
V
OUT2
3.0V
V
OUT1
V
= 6.0V
IN
V
= 3.0V
OUT
C
C
C
= 1µF
IN
= 1µF
OUT
/Shdn1 = /Shdn2
= 470pF
BYPASS
C
= C
OUT2
= 1µF Tantalum
OUT1
= 5.5V
V
IN
R
= 30kΩ
LOAD
Time (500ms / div)
Time (10ms / div)
DS21526A-page 12
2002 Microchip Technology Inc.
TC1305
7.0
7.1
PACKAGING INFORMATION
Package Marking Information
Package marking data not available at this time.
7.2
Taping Form
Component Taping Orientation for 10-Pin MSOP Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
10-Pin MSOP
12 mm
8 mm
2500
13 in
7.3
Package Dimensions
10-Pin MSOP
PIN 1
.122 (3.10)
.114 (2.90)
.201 (5.10)
.183 (4.65)
.012 (0.30)
.006 (0.15)
.122 (3.10)
.114 (2.90)
.043 (1.10)
MAX.
.009 (0.23)
.005 (0.13)
6° MAX.
.006 (0.15)
.002 (0.05)
.028 (0.70)
.016 (0.40)
.020 (0.50)
Dimensions: inches (mm)
2002 Microchip Technology Inc.
DS21526A-page 13
TC1305
NOTES:
DS21526A-page 14
2002 Microchip Technology Inc.
TC1305
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002 Microchip Technology Inc.
DS21526A-page15
TC1305
NOTES:
DS21526A-page16
2002 Microchip Technology Inc.
TC1305
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, FilterLab,
KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER,
PICSTART, PRO MATE, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip Tech-
nology Incorporated in the U.S.A. and other countries.
dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode
and Total Endurance are trademarks of Microchip Technology
Incorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
2002 Microchip Technology Inc.
DS21526A-page 17
WORLDWIDE SALES AND SERVICE
Japan
AMERICAS
ASIA/PACIFIC
Microchip Technology Japan K.K.
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Corporate Office
Australia
2355 West Chandler Blvd.
Microchip Technology Australia Pty Ltd
Suite 22, 41 Rawson Street
Epping 2121, NSW
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Australia
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Korea
Rocky Mountain
China - Beijing
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-7456
Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
Bei Hai Wan Tai Bldg.
Atlanta
500 Sugar Mill Road, Suite 200B
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Tel: 770-640-0034 Fax: 770-640-0307
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Tel: 978-692-3848 Fax: 978-692-3821
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Singapore
Microchip Technology Singapore Pte Ltd.
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#07-02 Prime Centre
No. 6 Chaoyangmen Beidajie
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Tel: 86-10-85282100 Fax: 86-10-85282104
China - Chengdu
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Co., Ltd., Chengdu Liaison Office
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Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
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Tel: 630-285-0071 Fax: 630-285-0075
China - Fuzhou
Dallas
Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
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4570 Westgrove Drive, Suite 160
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Denmark
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Co., Ltd.
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Tel: 86-755-2350361 Fax: 86-755-2366086
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Toronto
Hong Kong
Italy
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Microchip Technology SRL
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Tel: 905-673-0699 Fax: 905-673-6509
India
Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Arizona Microchip Technology Ltd.
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Tel: 44 118 921 5869 Fax: 44-118 921-5820
Microchip Technology Inc.
India Liaison Office
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
03/01/02
DS21526A-page 18
2002 Microchip Technology Inc.
TC1305R-DVUN CAD模型
引脚图
封装焊盘图
TC1305R-DVUN 相关器件
| 型号 | 制造商 | 描述 | 价格 | 文档 |
| TC1305R-DVUNRT | MICROCHIP | DUAL OUTPUT, FIXED POSITIVE LDO REGULATOR, PDSO10, MSOP-10 | 获取价格 |
|
| TC1305R-DVUNTR | MICROCHIP | DUAL OUTPUT, FIXED POSITIVE LDO REGULATOR, PDSO10, MSOP-10 | 获取价格 |
|
| TC1306 | MICROCHIP | Dual 150mA CMOS LDOWith Select Mode⑩ Operation, Shutdown and RESET Output | 获取价格 |
|
| TC1306D-560M | PRODUCTWELL | TOROID INDUCTORS | 获取价格 |
|
| TC1306R-BDVUA | MICROCHIP | Dual 150mA CMOS LDOWith Select Mode⑩ Operation, Shutdown and RESET Output | 获取价格 |
|
| TC1306R-BDVUART | MICROCHIP | DUAL OUTPUT, FIXED POSITIVE LDO REGULATOR, PDSO8, MSOP-8 | 获取价格 |
|
| TC1306R-BDVUATR | MICROCHIP | DUAL OUTPUT, FIXED POSITIVE LDO REGULATOR, PDSO8, MSOP-8 | 获取价格 |
|
| TC1306_07 | MICROCHIP | Dual 150mA CMOS LDO With Select Mode⑩ Operation, Shutdown and RESET Output | 获取价格 |
|
| TC1307 | MICROCHIP | Four-Channel CMOS LDO with Select Mode, Shutdown and Independent Reset | 获取价格 |
|
| TC1307D-241M | PRODUCTWELL | TOROID INDUCTORS | 获取价格 |
|
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