TC1224-3.3VCTTR [MICROCHIP]
3.3 V FIXED POSITIVE LDO REGULATOR, 0.25 V DROPOUT, PDSO5, SC-74A, SOT-23A, 5 PIN;
| 型号： | TC1224-3.3VCTTR |
| 厂家： | 
MICROCHIP |
| 描述： | 3.3 V FIXED POSITIVE LDO REGULATOR, 0.25 V DROPOUT, PDSO5, SC-74A, SOT-23A, 5 PIN 光电二极管 输出元件 调节器 |
| 文件： | 总16页 (文件大小：172K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC1223/TC1224
50mA and 100mA CMOS LDOs with Shutdown
General Description
Features
• Extremely Low Ground Current for Longer Battery
Life
The TC1223 and TC1224 are high accuracy (typically
±0.5%) CMOS upgrades for older (bipolar) low dropout
regulators such as the LP2980. Designed specifically
for battery-operated systems, the devices’ CMOS
construction eliminates wasted ground current,
significantly extending battery life. Total supply current
is typically 50A at full load (20 to 60 times lower than
in bipolar regulators).
• Very Low Dropout Voltage
• Choice of 50mA and 100mA Output (TC1223,
TC1224, Respectively)
• High Output Voltage Accuracy
• Standard or Custom Output Voltages
• Power Saving Shutdown Mode
The devices’ key features include ultra low noise
operation; very low dropout voltage (typically 85mV,
TC1223 and 180mV, TC1224 at full load) and fast
response to step changes in load. Supply current is
reduced to 0.5A (max) and VOUT falls to zero when
the shutdown input is low. The devices incorporate both
over temperature and over current protection.
• Over Current and Over Temperature Protection
• Space-Saving 5-Pin SOT-23A Package
• Pin Compatible Upgrades for Bipolar Regulators
Applications
• Battery Operated Systems
• Portable Computers
• Medical Instruments
• Instrumentation
The TC1223 and TC1224 are stable with an output
capacitor of only 1F and have a maximum output
current of 50mA and 100mA respectively. For higher
output current versions, please see the TC1107,
TC1108 and TC1173 (IOUT = 300mA) data sheets.
• Cellular/GSM/PHS Phones
• Linear Post-Regulators for SMPS
• Pagers
Typical Application
Device Selection Table
1
5
V
V
V
V
OUT
IN
IN
OUT
Junction
Temp. Range
+
Part Number
Package
TC1223
TC1224
1μF
TC1223-xxVCT 5-Pin SOT-23A -40°C to +125°C
TC1224-xxVCT 5-Pin SOT-23A -40°C to +125°C
2
3
GND
NOTE: xx indicates output voltages
Available Output Voltages: 2.5, 2.7, 2.8, 2.85, 3.0, 3.3, 3.6,
4.0, 5.0.
4
SHDN
NC
Other output voltages are available. Please contact Microchip
Technology Inc. for details.
Package Type
5-Pin SOT-23A
V
NC
OUT
Shutdown Control
(from Power Control Logic)
4
5
TC1223
TC1224
1
2
3
V
GND SHDN
IN
NOTE: 5-Pin SOT-23A is equivalent to the EIAJ (SC-74A)
2002-2012 Microchip Technology Inc.
DS21368C-page 1
TC1223/TC1224
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
1.0
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V
Output Voltage........................... (-0.3V) to (VIN + 0.3V)
Power Dissipation..............................Internally Limited
Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V
Operating Temperature Range......-40°C < TJ < 125°C
Storage Temperature..........................-65°C to +150°C
TC1223/TC1224 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: V = V
+ 1V, I = 100A, C = 3.3F, SHDN > V , T = 25°C, unless otherwise noted. Boldface
IN
OUT
L
L
IH
A
type specifications apply for junction temperatures of -40°C to +125°C.
Symbol
Parameter
Min
2.7
Typ
Max
6.0
Units
Test Conditions
Note 8
V
Input Operating Voltage
Maximum Output Current
—
V
IN
I
50
100
—
—
—
—
mA
TC1223
TC1224
OUTMAX
V
Output Voltage
V – 2.5%
V
±0.5%
V + 2.5%
R
V
Note 1
OUT
R
R
TCV
V
Temperature Coefficient
—
—
20
40
—
—
ppm/°C Note 2
OUT
OUT
V
/V
Line Regulation
Load Regulation
—
—
0.05
0.5
0.35
2
%
%
(V + 1V) V 6V
R IN
OUT
IN
V
/V
I = 0.1mA to I
OUT OUT
L
OUTMAX
(Note 3)
V
-V
Dropout Voltage
—
—
—
—
2
65
85
180
—
—
120
250
mV
I = 100A
IN OUT
L
I = 20mA
L
I = 50mA
L
TC1224
I = 100mA (Note 4)
L
I
I
Supply Current
—
—
—
—
—
—
—
—
50
0.05
64
80
0.5
—
A
A
SHDN = V , I = 0 (Note 7)
IN
IH
L
Shutdown Supply Current
Power Supply Rejection Ratio
Output Short Circuit Current
Thermal Regulation
SHDN = 0V
F 1kHz
RE
INSD
PSRR
dB
I
300
0.04
160
10
450
—
mA
V/W
°C
V
= 0V
OUTSC
OUT
V
/P
Notes 5, 6
OUT
D
T
Thermal Shutdown Die Temperature
Thermal Shutdown Hysteresis
Output Noise
—
SD
T
—
°C
SD
eN
SHDN Input
260
—
nV/Hz I = I
L OUTMAX
V
V
SHDN Input High Threshold
SHDN Input Low Threshold
45
—
—
—
%V
%V
V
V
= 2.5V to 6.5V
= 2.5V to 6.5V
IH
IL
IN
IN
—
15
IN
IN
Note 1: VR is the regulator output voltage setting. For example: VR = 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V.
TC VOUT = (VOUTMAX – VOUTMIN) x 106
2:
VOUT x T
3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V
differential.
5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.
7: Apply for Junction Temperatures of -40°C to +85°C.
8: The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1mA to IOUTMAX
.
DS21368C-page 2
2002-2012 Microchip Technology Inc.
TC1223/TC1224
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(5-Pin SOT-23A)
Symbol
Description
1
2
3
V
Unregulated supply input.
Ground terminal.
IN
GND
SHDN
Shutdown control input. The regulator is fully enabled when a logic high is applied to this input.
The regulator enters shutdown when a logic low is applied to this input. During shutdown, output
voltage falls to zero and supply current is reduced to 0.5A (max).
4
5
NC
No connect.
V
Regulated voltage output.
OUT
2002-2012 Microchip Technology Inc.
DS21368C-page 3
TC1223/TC1224
3.1
Output Capacitor
3.0
DETAILED DESCRIPTION
A 1F (min) capacitor from VOUT to ground is
recommended. The output capacitor should have an
effective series resistance greater than 0.1 and less
than 5.0, and a resonant frequency above 1MHz. A
1F capacitor should be connected from VIN to GND if
there is more than 10 inches of wire between the
regulator and the AC filter capacitor, or if a battery is
used as the power source. Aluminum electrolytic or
tantalum capacitor types can be used. (Since many
aluminum electrolytic capacitors freeze at approxi-
mately -30°C, solid tantalums are recommended for
applications operating below -25°C.) When operating
from sources other than batteries, supply-noise
rejection and transient response can be improved by
increasing the value of the input and output capacitors
and employing passive filtering techniques.
The TC1223 and TC1224 are precision fixed output
voltage regulators. Unlike bipolar regulators, the
TC1223 and TC1224’s supply current does not
increase with load current. In addition, VOUT remains
stable and within regulation over the entire 0mA to
IOUTMAX operating load current range, (an important
consideration in RTC and CMOS RAM battery back-up
applications).
Figure 3-1 shows a typical application circuit. The
regulator is enabled any time the shutdown input
(SHDN) is at or above VIH, and shutdown (disabled)
when SHDN is at or below VIL. SHDN may be
controlled by a CMOS logic gate, or I/O port of a micro-
controller. If the SHDN input is not required, it should be
connected directly to the input supply. While in
shutdown, supply current decreases to 0.05A (typical)
and VOUT falls to zero volts.
FIGURE 3-1:
TYPICAL APPLICATION
CIRCUIT
V
V
V
OUT
IN
OUT
+
1μF
+
+
TC1223
TC1224
1μF
Battery
GND
SHDN
NC
Shutdown Control
(to CMOS Logic or Tie
to V if unused)
IN
DS21368C-page 4
2002-2012 Microchip Technology Inc.
TC1223/TC1224
Equation 4-1 can be used in conjunction with Equation
4-2 to ensure regulator thermal operation is within
limits. For example:
4.0
4.1
THERMAL CONSIDERATIONS
Thermal Shutdown
Given:
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 160°C.
The regulator remains off until the die temperature
drops to approximately 150°C.
VINMAX
= 3.0V ±10%
VOUTMIN = 2.7V – 2.5%
ILOADMAX = 40mA
TJMAX
TAMAX
= 125°C
= 55°C
4.2
Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
PD (VINMAX – VOUTMIN)ILOADMAX
= [(3.0 x 1.1) – (2.7 x .975)]40 x 10–3
= 26.7mW
EQUATION 4-1:
PD (VINMAX – VOUT )ILOAD
MIN
MAX
Where:
Maximum allowable power dissipation:
PD = Worst case actual power dissipation
PDMAX = (TJMAX – TAMAX
)
= Maximum voltage on VIN
= Minimum regulator output voltage
= Maximum output (load) current
VIN
MAX
JA
= (125 – 55)
220
VOUT
MIN
ILOAD
MAX
= 318mW
The maximum allowable power dissipation (Equation
4-2) is a function of the maximum ambient temperature
(TAMAX), the maximum allowable die temperature
(TJMAX) and the thermal resistance from junction-to-air
(JA). The 5-Pin SOT-23A package has a JA of
approximately 220°C/Watt.
In this example, the TC1223 dissipates a maximum of
26.7mW; below the allowable limit of 318mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits.
EQUATION 4-2:
4.3
Layout Considerations
PDMAX = (TJMAX – TAMAX
)
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
supply bus lines combine to lower JA and therefore
increase the maximum allowable power dissipation
limit.
JA
Where all terms are previously defined.
2002-2012 Microchip Technology Inc.
DS21368C-page 5
TC1223/TC1224
5.0
TYPICAL CHARACTERISTICS
(Unless Otherwise Specified, All Parts Are Measured At Temperature = 25°C)
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Dropout Voltage vs. Temperature (V
= 10mA
= 3.3V)
Dropout Voltage vs. Temperature (V
= 3.3V)
OUT
OUT
0.020
0.018
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0.000
0.100
0.090
0.080
0.070
0.060
0.050
0.040
0.030
0.020
0.010
0.000
I
I
= 50mA
LOAD
LOAD
C
C
= 1μF
IN
OUT
C
OUT
= 1μF
= 1μF
IN
C
= 1μF
-40
-20
0
20
50
70
125
-40
-20
0
20
50
70
125
TEMPERATURE (°C)
TEMPERATURE (°C)
Dropout Voltage vs. Temperature (V
= 3.3V)
OUT
0.200
0.180
0.160
0.140
0.120
0.100
0.080
0.060
0.040
0.020
0.000
Ground Current vs. V (V
IN OUT
= 3.3V)
90
80
70
60
50
40
30
20
10
0
I
= 100mA
LOAD
I
= 10mA
LOAD
C
C
= 1μF
= 1μF
IN
OUT
C
C
= 1μF
IN
OUT
= 1μF
0 0.5 1 1.5
2
2.5
3
3.5 4 4.5
(V)
5 5.5 6 6.5 7 7.5
-40
-20
0
20
50
70
125
V
IN
TEMPERATURE (°C)
V
vs.
V
(V = 3.3V)
IN OUT
OUT
Ground Current vs. V (V
IN OUT
= 3.3V)
3.5
3
90
80
70
60
50
40
30
20
10
0
I
= 0
LOAD
I
= 100mA
LOAD
2.5
2
1.5
1
0.5
0
C
C
= 1μF
C
C
= 1μF
IN
OUT
IN
OUT
= 1μF
= 1μF
0
0.5 1 1.5
2
2.5
3
3.5
(V)
4
4.5
5
5.5
6
6.5 7
0
0.5 1 1.5
2
2.5
3
3.5 4 4.5
(V)
5
5.5 6 6.5
7
7.5
V
IN
V
IN
DS21368C-page 6
2002-2012 Microchip Technology Inc.
TC1223/TC1224
5.0
TYPICAL CHARACTERISTICS (CONTINUED)
(Unless Otherwise Specified, All Parts Are Measured At Temperature = 25°C)
V
vs.
V
(V = 3.3V)
IN OUT
Output Voltage vs. Temperature (V
= 3.3V)
OUT
OUT
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
3.320
3.315
3.310
3.305
3.300
3.295
3.290
3.285
3.280
3.275
I
= 100mA
I
= 10mA
LOAD
LOAD
C
OUT
IN
= 1μF
IN
C
V
= 1μF
C
C
= 1μF
IN
OUT
= 4.3V
= 1μF
0
0.5
1
1.5
2
2.5
3
3.5
(V)
4
4.5
5
5.5
6
6.5
7
-40
-20
-10
0
20
40
85
125
V
IN
TEMPERATURE (°C)
Output Voltage vs. Temperature (V
= 5V)
OUT
Temperature vs. Quiescent Current (V
OUT
= 5V)
5.025
5.020
5.015
5.010
5.005
5.000
4.995
4.990
4.985
70
60
50
40
30
20
10
0
I
= 10mA
LOAD
I
= 10mA
LOAD
V
C
C
= 6V
IN
= 1μF
IN
OUT
= 1μF
V
= 6V
IN
-40
-20
-10
0
20
40
85
125
C
C
= 1μF
IN
OUT
TEMPERATURE (°C)
= 1μF
-40
-20
-10
0
20
40
85
125
TEMPERATURE (°C)
Output Noise vs. Frequency
Stability Region vs. Load Current
= 1μF
Power Supply Rejection Ratio
= 10mA
1000
-30
10.0
1.0
C
I
OUT
to 10μF
OUT
R
C
C
= 50Ω
LOAD
= 1μF
IN
-35
-40
-45
V
V
V
= 4V
IN
IN
OUT
IN
OUT
DC
AC
OUT
= 100mV
= 3V
p-p
= 1μF
100
10
1
C
C
= 0
= 1μF
-50
-55
Stable Region
-60
-65
-70
-75
-80
0.1
0.0
0.1
0.01
0.1K
1K
10K
1000K
100K
0.01K
0.01K 0.1K
10
1K
10K 100K 1000K
0
20 30 40 50 60 70 80 90 100
LOAD CURRENT (mA)
FREQUENCY (Hz)
FREQUENCY (Hz)
2002-2012 Microchip Technology Inc.
DS21368C-page 7
TC1223/TC1224
5.0
TYPICAL CHARACTERISTICS (CONTINUED)
Measure Fall Time of 3.3V LDO
Measure Rise Time of 3.3V LDO
Conditions: C = 1μF, C
IN OUT
= 1μF, I
LOAD
= 100mA, V = 4.3V,
IN
Conditions: C = 1μF, C
IN OUT
= 1μF, I
LOAD
= 100mA, V = 4.3V,
IN
Temp = 25°C, Fall Time = 52μS
Temp = 25 C, Fall Time = 184μS
°
V
SHDN
V
SHDN
V
OUT
V
OUT
Measure Fall Time of 5.0V LDO
Measure Rise Time of 5.0V LDO
Conditions: C = 1μF, C
IN OUT
= 1μF, I = 100mA, V = 6V,
LOAD IN
Conditions: C = 1μF, C
IN OUT
= 1μF, I
= 100mA, V = 6V,
IN
LOAD
Temp = 25 C, Fall Time = 88μS
°
Temp = 25 C, Fall Time = 192μS
°
V
V
SHDN
SHDN
V
V
OUT
OUT
Thermal Shutdown Response of 5.0V LDO
Conditions: V = 6V, C = 0μF, C
IN IN OUT
= 1μF
V
OUT
I
was increased until temperature of die reached about 160°C, at
LOAD
which time integrated thermal protection circuitry shuts the regulator
off when die temperature exceeds approximately 160°C. The regulator
remains off until die temperature drops to approximately 150°C.
DS21368C-page 8
2002-2012 Microchip Technology Inc.
TC1223/TC1224
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
“1” & “2” = part number code + temperature range and
voltage
TC1223
Code
TC1224
Code
(V)
2.5
2.7
2.8
2.85
3.0
3.3
3.6
4.0
5.0
L1
L2
LZ
L8
L3
L5
L9
L0
L7
M1
M2
MZ
M8
M3
M5
M9
M0
M7
“3” represents year and quarter code
“4” represents lot ID number
6.2
Taping Form
Component Taping Orientation for 5-Pin SOT-23A (EIAJ SC-74A) Devices
User Direction of Feed
Device
Marking
W
PIN 1
P
Standard Reel Component Orientation
TR Suffix Device
(Mark Right Side Up)
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
5-Pin SOT-23A
8 mm
4 mm
3000
7 in
2002-2012 Microchip Technology Inc.
DS21368C-page 9
TC1223/TC1224
6.3
Package Dimensions
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
SOT-23A-5
.075 (1.90)
REF.
.071 (1.80)
.059 (1.50)
.122 (3.10)
.098 (2.50)
.020 (0.50)
.012 (0.30)
PIN 1
.037 (0.95)
REF.
.122 (3.10)
.106 (2.70)
.057 (1.45)
.035 (0.90)
.010 (0.25)
.004 (0.09)
10° MAX.
.006 (0.15)
.000 (0.00)
.024 (0.60)
.004 (0.10)
Dimensions: inches (mm)
DS21368C-page 10
2002-2012 Microchip Technology Inc.
TC1223/TC1224
7.0
REVISION HISTORY
Revision C (November 2012)
Added a note to each package outline drawing.
2002-2012 Microchip Technology Inc.
DS21368C-page 11
TC1223/TC1224
NOTES:
DS21368C-page 12
2002-2012 Microchip Technology Inc.
TC1223/TC1224
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002-2012 Microchip Technology Inc.
DS21368C-page11
TC1223/TC1224
NOTES:
DS21368C-page12
2002-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
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OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
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conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
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PICSTART, PIC logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
32
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2002-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620767382
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
== ISO/TS 16949 ==
2002-2012 Microchip Technology Inc.
DS21368C-page 13
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
www.microchip.com
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Osaka
Tel: 81-66-152-7160
Fax: 81-66-152-9310
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Korea - Seoul
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Los Angeles
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
China - Xiamen
Tel: 905-673-0699
Fax: 905-673-6509
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
10/26/12
DS21368C-page 14
2002-2012 Microchip Technology Inc.
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