TC1223-VCT [MICROCHIP]
50mA and 100mA CMOS LDOs with Shutdown;
| 型号： | TC1223-VCT |
| 厂家： | 
MICROCHIP |
| 描述： | 50mA and 100mA CMOS LDOs with Shutdown |
| 文件： | 总14页 (文件大小：463K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC1223/TC1224
50mA and 100mA CMOS LDOs with Shutdown
General Description
Features
• Extremely Low Ground Current for Longer Battery
Life
The TC1223 and TC1224 are high accuracy (typically
±0.5%) CMOS upgrades for older (bipolar) low dropout
regulators such as the LP2980. Designed specifically
for battery-operated systems, the devices’ CMOS
construction eliminates wasted ground current,
significantly extending battery life. Total supply current
is typically 50µA at full load (20 to 60 times lower than
in bipolar regulators).
• Very Low Dropout Voltage
• Choice of 50mA and 100mA Output (TC1223,
TC1224, Respectively)
• High Output Voltage Accuracy
• Standard or Custom Output Voltages
• Power Saving Shutdown Mode
The devices’ key features include ultra low noise
operation; very low dropout voltage (typically 85mV,
TC1223 and 180mV, TC1224 at full load) and fast
response to step changes in load. Supply current is
• Over Current and Over Temperature Protection
• Space-Saving 5-Pin SOT-23A Package
• Pin Compatible Upgrades for Bipolar Regulators
reduced to 0.5µA (max) and V
the shutdown input is low. The devices incorporate both
over temperature and over current protection.
falls to zero when
OUT
Applications
• Battery Operated Systems
• Portable Computers
• Medical Instruments
• Instrumentation
The TC1223 and TC1224 are stable with an output
capacitor of only 1µF and have a maximum output
current of 50mA and 100mA respectively. For higher
output current versions, please see the TC1107,
• Cellular/GSM/PHS Phones
• Linear Post-Regulators for SMPS
• Pagers
TC1108 and TC1173 (I
= 300mA) data sheets.
OUT
Typical Application
Device Selection Table
1
5
V
V
V
V
OUT
IN
IN
OUT
Junction
Temp. Range
+
Part Number
Package
TC1223
TC1224
1µF
TC1223-xxVCT 5-Pin SOT-23A -40°C to +125°C
TC1224-xxVCT 5-Pin SOT-23A -40°C to +125°C
2
3
GND
NOTE: xx indicates output voltages
Available Output Voltages: 2.5, 2.7, 2.8, 2.85, 3.0, 3.3, 3.6,
4.0, 5.0.
4
SHDN
NC
Other output voltages are available. Please contact Microchip
Technology Inc. for details.
Package Type
5-Pin SOT-23A
V
NC
OUT
Shutdown Control
(from Power Control Logic)
4
5
TC1223
TC1224
1
2
3
V
GND SHDN
IN
NOTE: 5-Pin SOT-23A is equivalent to the EIAJ (SC-74A)
2002 Microchip Technology Inc.
DS21368B-page 1
TC1223/TC1224
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
1.0
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V
Output Voltage........................... (-0.3V) to (V + 0.3V)
IN
Power Dissipation..............................Internally Limited
Maximum Voltage on Any Pin ........V +0.3V to -0.3V
IN
Operating Temperature Range...... -40°C < T < 125°C
J
Storage Temperature..........................-65°C to +150°C
TC1223/TC1224 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VIN = VOUT + 1V, IL = 100µA, CL = 3.3µF, SHDN > VIH, TA = 25°C, unless otherwise noted. Boldface
type specifications apply for junction temperatures of -40°C to +125°C.
Symbol
VIN
Parameter
Min
2.7
Typ
Max
6.0
Units
Test Conditions
Note 8
Input Operating Voltage
Maximum Output Current
—
V
IOUTMAX
50
100
—
—
—
—
mA
TC1223
TC1224
VOUT
Output Voltage
VR – 2.5% VR ±0.5% VR + 2.5%
V
Note 1
TCVOUT
VOUT Temperature Coefficient
—
—
20
40
—
—
ppm/°C Note 2
∆VOUT/∆VIN
∆VOUT/VOUT
Line Regulation
Load Regulation
—
—
0.05
0.5
0.35
2
%
%
(VR + 1V) ≤ VIN ≤ 6V
IL = 0.1mA to IOUTMAX
(Note 3)
VIN-VOUT
Dropout Voltage
—
—
—
—
2
65
85
180
—
—
120
250
mV
I
I
I
I
L = 100µA
L = 20mA
L = 50mA
L = 100mA (Note 4)
TC1224
Supply Current
IIN
—
—
—
—
—
—
—
—
50
0.05
64
80
0.5
—
µA
µA
SHDN = VIH, IL = 0 (Note 7)
SHDN = 0V
IINSD
Shutdown Supply Current
Power Supply Rejection Ratio
Output Short Circuit Current
Thermal Regulation
PSRR
IOUTSC
∆VOUT/∆PD
TSD
dB
FRE ≤ 1kHz
300
0.04
160
10
450
—
mA
V/W
°C
VOUT = 0V
Notes 5, 6
Thermal Shutdown Die Temperature
Thermal Shutdown Hysteresis
Output Noise
—
∆TSD
—
°C
eN
260
—
nV/√Hz IL = IOUTMAX
SHDN Input
VIH
SHDN Input High Threshold
SHDN Input Low Threshold
45
—
—
—
%VIN
%VIN
VIN = 2.5V to 6.5V
VIN = 2.5V to 6.5V
VIL
—
15
Note 1: VR is the regulator output voltage setting. For example: VR = 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V.
TC VOUT = (VOUTMAX – VOUTMIN) x 106
2:
VOUT x ∆T
3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V
differential.
5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.
7: Apply for Junction Temperatures of -40°C to +85°C.
8: The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1mA to IOUTMAX
.
DS21368B-page 2
2002 Microchip Technology Inc.
TC1223/TC1224
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(5-Pin SOT-23A)
Symbol
Description
1
2
3
VIN
Unregulated supply input.
Ground terminal.
GND
SHDN
Shutdown control input. The regulator is fully enabled when a logic high is applied to this input.
The regulator enters shutdown when a logic low is applied to this input. During shutdown, output
voltage falls to zero and supply current is reduced to 0.5µA (max).
4
5
NC
No connect.
VOUT
Regulated voltage output.
2002 Microchip Technology Inc.
DS21368B-page 3
TC1223/TC1224
3.1
Output Capacitor
3.0
DETAILED DESCRIPTION
A
1µF (min) capacitor from
V
to ground is
The TC1223 and TC1224 are precision fixed output
voltage regulators. Unlike bipolar regulators, the
TC1223 and TC1224’s supply current does not
OUT
recommended. The output capacitor should have an
effective series resistance greater than 0.1Ω and less
than 5.0Ω, and a resonant frequency above 1MHz. A
increase with load current. In addition, V
remains
OUT
1µF capacitor should be connected from V to GND if
stable and within regulation over the entire 0mA to
operating load current range, (an important
IN
there is more than 10 inches of wire between the
regulator and the AC filter capacitor, or if a battery is
used as the power source. Aluminum electrolytic or
tantalum capacitor types can be used. (Since many
aluminum electrolytic capacitors freeze at approxi-
mately -30°C, solid tantalums are recommended for
applications operating below -25°C.) When operating
from sources other than batteries, supply-noise
rejection and transient response can be improved by
increasing the value of the input and output capacitors
and employing passive filtering techniques.
I
OUTMAX
consideration in RTC and CMOS RAM battery back-up
applications).
Figure 3-1 shows a typical application circuit. The
regulator is enabled any time the shutdown input
(SHDN) is at or above V , and shutdown (disabled)
IH
when SHDN is at or below V . SHDN may be
IL
controlled by a CMOS logic gate, or I/O port of a micro-
controller. If the SHDN input is not required, it should be
connected directly to the input supply. While in
shutdown, supply current decreases to 0.05µA (typical)
and V
falls to zero volts.
OUT
FIGURE 3-1:
TYPICAL APPLICATION
CIRCUIT
V
V
V
OUT
IN
OUT
+
1µF
+
+
TC1223
TC1224
1µF
Battery
GND
SHDN
NC
Shutdown Control
(to CMOS Logic or Tie
to V if unused)
IN
DS21368B-page 4
2002 Microchip Technology Inc.
TC1223/TC1224
Equation 4-1 can be used in conjunction with Equation
4-2 to ensure regulator thermal operation is within
limits. For example:
4.0
4.1
THERMAL CONSIDERATIONS
Thermal Shutdown
Given:
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 160°C.
The regulator remains off until the die temperature
drops to approximately 150°C.
V
= 3.0V ±10%
= 2.7V – 2.5%
= 40mA
INMAX
V
OUTMIN
I
LOADMAX
T
= 125°C
JMAX
4.2
Power Dissipation
T
= 55°C
AMAX
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
P
≈ (VINMAX – VOUTMIN)I
LOADMAX
D
EQUATION 4-1:
–3
= [(3.0 x 1.1) – (2.7 x .975)]40 x 10
= 26.7mW
P
≈ (VINMAX – VOUT )ILOAD
MIN MAX
D
Where:
Maximum allowable power dissipation:
= Worst case actual power dissipation
= Maximum voltage on VIN
= Minimum regulator output voltage
= Maximum output (load) current
P
D
P
DMAX = (TJMAX – T
)
AMAX
VIN
MAX
θ
JA
VOUT
MIN
= (125 – 55)
ILOAD
MAX
220
= 318mW
The maximum allowable power dissipation (Equation
4-2) is a function of the maximum ambient temperature
(TAMAX), the maximum allowable die temperature
(TJMAX) and the thermal resistance from junction-to-air
In this example, the TC1223 dissipates a maximum of
26.7mW; below the allowable limit of 318mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits.
(θ ). The 5-Pin SOT-23A package has a θ
of
JA
JA
approximately 220°C/Watt.
EQUATION 4-2:
4.3
Layout Considerations
P
DMAX = (TJMAX – T
)
AMAX
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
θ
JA
Where all terms are previously defined.
supply bus lines combine to lower θ and therefore
JA
increase the maximum allowable power dissipation
limit.
2002 Microchip Technology Inc.
DS21368B-page 5
TC1223/TC1224
5.0
TYPICAL CHARACTERISTICS
(Unless Otherwise Specified, All Parts Are Measured At Temperature = 25°C)
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Dropout Voltage vs. Temperature (V
= 10mA
= 3.3V)
Dropout Voltage vs. Temperature (V
= 3.3V)
OUT
OUT
0.020
0.018
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0.000
0.100
0.090
0.080
0.070
0.060
0.050
0.040
0.030
0.020
0.010
0.000
I
I
= 50mA
LOAD
LOAD
C
C
= 1µF
IN
OUT
C
OUT
= 1µF
= 1µF
IN
C
= 1µF
-40
-20
0
20
50
70
125
-40
-20
0
20
50
70
125
TEMPERATURE (°C)
TEMPERATURE (°C)
Dropout Voltage vs. Temperature (V
= 3.3V)
OUT
0.200
0.180
0.160
0.140
0.120
0.100
0.080
0.060
0.040
0.020
0.000
Ground Current vs. V (V
IN OUT
= 3.3V)
90
80
70
60
50
40
30
20
10
0
I
= 100mA
LOAD
I
= 10mA
LOAD
C
C
= 1µF
= 1µF
IN
OUT
C
C
= 1µF
IN
OUT
= 1µF
0 0.5 1 1.5
2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5
-40
-20
0
20
50
70
125
V
(V)
IN
TEMPERATURE (°C)
V
vs.
V
(V = 3.3V)
IN OUT
OUT
Ground Current vs. V (V
IN OUT
= 3.3V)
3.5
3
90
80
70
60
50
40
30
20
10
0
I
= 0
LOAD
I
= 100mA
LOAD
2.5
2
1.5
1
0.5
0
C
C
= 1µF
C
C
= 1µF
IN
OUT
IN
OUT
= 1µF
= 1µF
0
0.5 1 1.5
2
2.5
3
3.5
(V)
4
4.5
5
5.5
6
6.5 7
0
0.5 1 1.5
2
2.5
3
3.5 4 4.5
(V)
5
5.5 6 6.5
7
7.5
V
IN
V
IN
DS21368B-page 6
2002 Microchip Technology Inc.
TC1223/TC1224
5.0
TYPICAL CHARACTERISTICS (CONTINUED)
(Unless Otherwise Specified, All Parts Are Measured At Temperature = 25°C)
V
vs.
V
(V = 3.3V)
IN OUT
Output Voltage vs. Temperature (V
= 3.3V)
OUT
OUT
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
3.320
3.315
3.310
3.305
3.300
3.295
3.290
3.285
3.280
3.275
I
= 100mA
I
= 10mA
LOAD
LOAD
C
OUT
IN
= 1µF
IN
C
V
= 1µF
C
C
= 1µF
IN
OUT
= 4.3V
= 1µF
0
0.5
1
1.5
2
2.5
3
3.5
(V)
4
4.5
5
5.5
6
6.5
7
-40
-20
-10
0
20
40
85
125
V
IN
TEMPERATURE (°C)
Output Voltage vs. Temperature (V
= 5V)
OUT
Temperature vs. Quiescent Current (V
OUT
= 5V)
5.025
5.020
5.015
5.010
5.005
5.000
4.995
4.990
4.985
70
60
50
40
30
20
10
0
I
= 10mA
LOAD
I
= 10mA
LOAD
V
C
C
= 6V
IN
= 1µF
IN
OUT
= 1µF
V
= 6V
IN
-40
-20
-10
0
20
40
85
125
C
C
= 1µF
IN
OUT
TEMPERATURE (°C)
= 1µF
-40
-20
-10
0
20
40
85
125
TEMPERATURE (°C)
Output Noise vs. Frequency
Stability Region vs. Load Current
= 1µF
Power Supply Rejection Ratio
= 10mA
1000
-30
10.0
1.0
C
I
OUT
to 10µF
OUT
R
C
C
= 50Ω
LOAD
= 1µF
IN
-35
-40
-45
V
V
V
= 4V
IN
IN
OUT
IN
OUT
DC
AC
OUT
= 100mV
= 3V
p-p
= 1µF
100
10
1
C
C
= 0
= 1µF
-50
-55
Stable Region
-60
-65
-70
-75
-80
0.1
0.0
0.1
0.01
0.1K
1K
10K
1000K
100K
0.01K
0.01K 0.1K
10
1K
10K 100K 1000K
0
20 30 40 50 60 70 80 90 100
LOAD CURRENT (mA)
FREQUENCY (Hz)
FREQUENCY (Hz)
2002 Microchip Technology Inc.
DS21368B-page 7
TC1223/TC1224
5.0
TYPICAL CHARACTERISTICS (CONTINUED)
Measure Fall Time of 3.3V LDO
Measure Rise Time of 3.3V LDO
Conditions: C = 1µF, C
IN OUT
= 1µF, I
LOAD
= 100mA, V = 4.3V,
IN
Conditions: C = 1µF, C
IN OUT
= 1µF, I
LOAD
= 100mA, V = 4.3V,
IN
Temp = 25°C, Fall Time = 52µS
Temp = 25°C, Fall Time = 184µS
V
SHDN
V
SHDN
V
OUT
V
OUT
Measure Fall Time of 5.0V LDO
Measure Rise Time of 5.0V LDO
Conditions: C = 1µF, C
IN OUT
= 1µF, I = 100mA, V = 6V,
LOAD IN
Conditions: C = 1µF, C
IN OUT
= 1µF, I
LOAD
= 100mA, V = 6V,
IN
Temp = 25
°
C, Fall Time = 88µS
Temp = 25°C, Fall Time = 192µS
V
V
SHDN
SHDN
V
V
OUT
OUT
Thermal Shutdown Response of 5.0V LDO
Conditions: V = 6V, C = 0µF, C
IN IN
= 1µF
OUT
V
OUT
I
was increased until temperature of die reached about 160°C, at
LOAD
which time integrated thermal protection circuitry shuts the regulator
off when die temperature exceeds approximately 160°C. The regulator
remains off until die temperature drops to approximately 150°C.
DS21368B-page 8
2002 Microchip Technology Inc.
TC1223/TC1224
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
“1” & “2” = part number code + temperature range and
voltage
TC1223
Code
TC1224
Code
(V)
2.5
2.7
2.8
2.85
3.0
3.3
3.6
4.0
5.0
L1
L2
LZ
L8
L3
L5
L9
L0
L7
M1
M2
MZ
M8
M3
M5
M9
M0
M7
“3” represents year and quarter code
“4” represents lot ID number
6.2
Taping Form
Component Taping Orientation for 5-Pin SOT-23A (EIAJ SC-74A) Devices
User Direction of Feed
Device
Marking
W
PIN 1
P
Standard Reel Component Orientation
TR Suffix Device
(Mark Right Side Up)
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
5-Pin SOT-23A
8 mm
4 mm
3000
7 in
2002 Microchip Technology Inc.
DS21368B-page 9
TC1223/TC1224
6.3
Package Dimensions
SOT-23A-5
.075 (1.90)
REF.
.071 (1.80)
.059 (1.50)
.122 (3.10)
.098 (2.50)
.020 (0.50)
.012 (0.30)
PIN 1
.037 (0.95)
REF.
.122 (3.10)
.106 (2.70)
.057 (1.45)
.035 (0.90)
.010 (0.25)
.004 (0.09)
10° MAX.
.006 (0.15)
.000 (0.00)
.024 (0.60)
.004 (0.10)
Dimensions: inches (mm)
DS21368B-page 10
2002 Microchip Technology Inc.
TC1223/TC1224
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002 Microchip Technology Inc.
DS21368B-page 11
TC1223/TC1224
NOTES:
DS21368B-page 12
2002 Microchip Technology Inc.
TC1223/TC1224
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.
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2002 Microchip Technology Inc.
DS21368B-page 13
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Epping 2121, NSW
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Australia
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Korea
Rocky Mountain
China - Beijing
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-7456
Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
Bei Hai Wan Tai Bldg.
Atlanta
500 Sugar Mill Road, Suite 200B
Atlanta, GA 30350
Tel: 770-640-0034 Fax: 770-640-0307
Boston
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848 Fax: 978-692-3821
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Singapore
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100 Fax: 86-10-85282104
China - Chengdu
Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Microchip Technology Taiwan
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Chicago
333 Pierce Road, Suite 180
Itasca, IL 60143
Chengdu 610016, China
Tel: 86-28-86766200 Fax: 86-28-86766599
Tel: 630-285-0071 Fax: 630-285-0075
China - Fuzhou
Dallas
Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
4570 Westgrove Drive, Suite 160
Addison, TX 75001
EUROPE
Denmark
Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45 4420 9895 Fax: 45 4420 9910
Tel: 972-818-7423 Fax: 972-818-2924
Detroit
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250 Fax: 248-538-2260
Tel: 86-591-7503506 Fax: 86-591-7503521
China - Shanghai
Microchip Technology Consulting (Shanghai)
Co., Ltd.
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
Kokomo
France
2767 S. Albright Road
Kokomo, Indiana 46902
Tel: 765-864-8360 Fax: 765-864-8387
Los Angeles
Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH
Gustav-Heinemann Ring 125
D-81739 Munich, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888 Fax: 949-263-1338
China - Shenzhen
Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Rm. 1315, 13/F, Shenzhen Kerry Centre,
Renminnan Lu
Shenzhen 518001, China
Tel: 86-755-2350361 Fax: 86-755-2366086
New York
150 Motor Parkway, Suite 202
Hauppauge, NY 11788
Tel: 631-273-5305 Fax: 631-273-5335
San Jose
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950 Fax: 408-436-7955
Toronto
China - Hong Kong SAR
Italy
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200 Fax: 852-2401-3431
Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509
India
Tel: 39-039-65791-1 Fax: 39-039-6899883
Microchip Technology Inc.
India Liaison Office
United Kingdom
Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
05/01/02
DS21368B-page 14
2002 Microchip Technology Inc.
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