MIC5503 [MICROCHIP]
300 mA Single Output LDO in Small Packages;
| 型号： | MIC5503 |
| 厂家： | 
MICROCHIP |
| 描述： | 300 mA Single Output LDO in Small Packages |
| 文件： | 总22页 (文件大小：1128K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MIC5501/2/3/4
300 mA Single Output LDO in Small Packages
Features
General Description
• Input Voltage Range: 2.5V to 5.5V
The MIC5501/2/3/4 is an advanced general-purpose
LDO ideal for powering general-purpose portable
devices. The MIC5501/2/3/4 family of products
provides a high-performance 300 mA LDO in an
ultra-small 1 mm x 1 mm package. The MIC5502 and
MIC5504 LDOs include an auto-discharge feature on
the output that is activated when the enable pin is low.
The MIC5503 and MIC5504 have an internal pull-down
resistor on the enable pin that disables the output when
the enable pin is left floating. This is ideal for
applications where the control signal is floating during
processor boot up.
• Fixed Output Voltages from 1.0V to 3.3V
• 300 mA Guaranteed Output Current
• High Output Accuracy (±2%)
• Low Quiescent Current: 38 μA
• Stable with 1 μF Ceramic Output Capacitors
• Low Dropout Voltage: 160 mV @ 300 mA
• Output Discharge Circuit: MIC5502, MIC5504
• Internal Enable Pull-Down: MIC5503, MIC5504
• Thermal-Shutdown and Current-Limit Protection
• 4-Lead 1.0 mm x 1.0 mm Thin DFN Package
• MIC5501/4 5-Lead SOT23 Package
Ideal
for
battery-powered
applications,
the
MIC5501/2/3/4 offers 2% initial accuracy, low dropout
voltage (160 mV at 300 mA), and low ground current
(typically 38 μA). The MIC5501/2/3/4 can also be put
into a zero-off-mode current state, drawing virtually no
current when disabled.
Applications
• Smartphones
• DSC, GPS, PMP, and PDAs
• Medical Devices
• Portable Electronics
• 5V Systems
The MIC5501/2/3/4 has an operating junction
temperature range of –40°C to +125°C.
Package Types
MIC5501/2/3/4
4-Lead DFN (MT)
(Top View)
MIC5501/4
SOT23-5 (M5)
(Top View)
VIN
4
EN
3
GND
2
EN
3
VIN
1
EP
4
NC
5
1
2
VOUT
VOUT
GND
2019 Microchip Technology Inc.
DS20006006B-page 1
MIC5501/2/3/4
Typical Application Circuit
MIC5501/2/3/4
MIC550X-xYMT
VOUT
VIN
1μF
1μF
EN
VBAT
GND
DS20006006B-page 2
2019 Microchip Technology Inc.
MIC5501/2/3/4
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (VIN) .................................................................................................................................... –0.3V to +6V
Enable Voltage (VEN) .................................................................................................................................... –0.3V to VIN
Power Dissipation (PD) ............................................................................................................. Internally Limited, Note 1
ESD Rating (Note 2) ..................................................................................................................................................3 kV
Operating Ratings ‡
Supply Voltage (VIN) .................................................................................................................................+2.5V to +5.5V
Enable Voltage (VEN) ......................................................................................................................................... 0V to VIN
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: The maximum allowable power dissipation of any TA (ambient temperature) is PD(max) = (TJ(max) – TA)/θJA
.
Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the reg-
ulator will go into thermal shutdown.
2: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series
with 100 pF.
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VIN = VEN = VOUT + 1V; CIN = COUT = 1 μF; IOUT = 100 μA; TJ = +25°C, bold values
indicate –40°C to +125°C, unless noted.
Parameter
Symbol
Min.
Typ.
Max.
Units Conditions
Variation from nominal VOUT
–2.0
—
2.0
Output Voltage Accuracy
VOUT
%
Variation from nominal VOUT
–40°C to +125°C
;
–3.0
—
3.0
0.3
VIN = VOUT +1V to 5.5V; IOUT
100 μA
=
Line Regulation
—
—
—
0.02
%/V
mV
Load Regulation (Note 1)
—
—
—
—
—
8
80
40
190
380
55
IOUT = 100 μA to 300 mA
IOUT = 150 mA
Dropout Voltage (Note 2)
VDO
mV
160
38
IOUT = 300 mA
IOUT = 0 mA
Ground Pin Current (Note 3)
IGND
μA
μA
42
65
IOUT = 300 mA
Ground Pin Current in
Shutdown
I
—
0.05
1
VEN = 0V
GND(SHDN)
Ripple Rejection
Current Limit
PSRR
ILIM
—
400
—
60
—
900
—
dB
f = 1 kHz; COUT = 1 μF
VOUT = 0V
630
175
mA
Output Voltage Noise
en
μVRMS COUT = 1 μF, 10 Hz to 100 kHz
Auto-Discharge NFET
Resistance
MIC5502, MIC5504 Only;
VEN = 0V; VIN = 3.6V; IOUT = –3 mA
—
—
25
—
Ω
Enable Input
For MIC5503 and MIC5504 use
only
Enable Pull-Down Resistor
—
—
4
—
MΩ
—
—
—
0.2
Logic-Low
Enable Input Voltage
VEN
V
1.2
—
Logic-High
2019 Microchip Technology Inc.
DS20006006B-page 3
MIC5501/2/3/4
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VIN = VEN = VOUT + 1V; CIN = COUT = 1 μF; IOUT = 100 μA; TJ = +25°C, bold values
indicate –40°C to +125°C, unless noted.
Parameter
Symbol
Min.
Typ.
Max.
Units Conditions
—
—
—
—
—
0.01
0.01
0.01
1.4
1
1
VEN = 0V
μA
Enable Input Current
MIC5501, MIC5502
IEN
VEN = 5.5V
1
VEN = 0V
μA
Enable Input Current
MIC5503, MIC5504
IEN
tON
2
VEN = 5.5V
Turn-On Time
50
125
μs
COUT = 1 μF; IOUT = 150 mA
Note 1: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Changes in
output voltage due to heating effects are covered by the thermal regulation specification.
2: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its
nominal value measured at 1V differential. For outputs below 2.5V, dropout voltage is the input-to-output
differential with the minimum input voltage 2.5V.
3: Ground pin current is the regulator quiescent current. The total current drawn from the source is the sum
of the load current plus the ground pin current.
DS20006006B-page 4
2019 Microchip Technology Inc.
MIC5501/2/3/4
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Temperature Ranges
Symbol Min.
Typ.
Max.
Units
Conditions
Storage Temperature Range
TS
TJ
TJ
—
–65
–40
–40
—
—
—
—
—
+150
+150
+125
+260
°C
°C
°C
°C
—
—
—
Maximum Junction Temperature Range
Operating Junction Temperature Range
Lead Temperature
Soldering, 10s
Package Thermal Resistances
Thermal Resistance 1 mm x 1 mm Thin DFN-4
Thermal Resistance SOT23-5
JA
JA
—
—
250
253
—
—
°C/W
°C/W
—
—
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2019 Microchip Technology Inc.
DS20006006B-page 5
MIC5501/2/3/4
2.0
TYPICAL PERFORMANCE CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
FIGURE 2-1:
Ratio.
Power Supply Rejection
Dropout Voltage vs. Output
Dropout Voltage vs.
FIGURE 2-4:
Voltage.
Ground Current vs. Supply
FIGURE 2-2:
Current.
FIGURE 2-5:
Current.
Ground Current vs. Load
FIGURE 2-6:
Ground Current vs.
FIGURE 2-3:
Temperature.
Temperature.
DS20006006B-page 6
2019 Microchip Technology Inc.
MIC5501/2/3/4
FIGURE 2-7:
Current.
Output Voltage vs. Output
Output Voltage vs. Supply
Output Voltage vs.
FIGURE 2-10:
Voltage.
Current Limit vs. Supply
V
= 3V
VIN = 1.8V
COINUT= COUT = 1μF
VEN
(500mV/div)
VOUT
(500mV/div)
Time (10μs/div)
FIGURE 2-8:
Voltage.
FIGURE 2-11:
Enable Turn-On.
V
= 4.3V
VIN = 3.3V
VEN
(1V/div)
COINUT= COUT = 1μF
VOUT
(1V/div)
Time (20μs/div)
FIGURE 2-12:
Enable Turn-On.
FIGURE 2-9:
Temperature.
2019 Microchip Technology Inc.
DS20006006B-page 7
MIC5501/2/3/4
VOUT = 3.3V
CIN = COUT = 1μF
V
= 3.8V
VIN = 2.8V
COINUT= COUT = 1μF
VEN
(1V/div)
IOUT
(100mA/div)
VOUT
(AC-COUPLED)
(100mV/div)
VOUT
(1V/div)
Time (100μs/div)
Time (20μs/div)
FIGURE 2-16:
Auto-Discharge (No Load).
FIGURE 2-13:
Load Transient.
V
= 4.3V
VIN = 3.3V
COINUT= COUT = 1μF
IOUT
(100mA/div)
VOUT
(AC-COUPLED)
(100mV/div)
Time (100μs/div)
FIGURE 2-14:
Load Transient.
VOUT = 2.8V
CIN = C =1μF
I
OUT = 3O0U0TmA
5.5V
3.8V
VIN
(2mV/div)
VOUT
(AC-COUPLED
(50mV/div)
Time (100μs/div)
FIGURE 2-15:
Line Transient.
DS20006006B-page 8
2019 Microchip Technology Inc.
MIC5501/2/3/4
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
SOT23-5
4-Lead TDFN
Pin Number
Pin Name
Description
Pin Number
1
5
VOUT
Output Voltage. When disabled the MIC5502 and MIC5504
switches on an internal 25ꢀ load to discharge the external
capacitors.
2
3
2
3
GND
EN
Ground.
Enable Input: Active-High. High = ON; Low = OFF. For MIC5501
and MIC5502 do not leave floating. MIC5503 and MIC5504 have
an internal pull-down and this pin may be left floating.
4
1
4
VIN
NC
Supply Input.
—
EP
No Connection. Pin is not internally connected.
—
ePAD
Exposed Heatsink Pad. Connect to GND for best thermal
performance.
2019 Microchip Technology Inc.
DS20006006B-page 9
MIC5501/2/3/4
4.4
Enable/Shutdown
4.0
APPLICATION INFORMATION
The MIC5501/2/3/4 each come with an active-high
enable pin that allows the regulator to be disabled.
Forcing the EN pin low disables the regulator and
sends it into an off mode current state drawing virtually
zero current. When disabled, the MIC5502 and
MIC5504 switches an internal 25ꢀ load on the
regulator output to discharge the external capacitor.
MIC5501/2/3/4 are low-noise 300 mA LDOs. The
MIC5502 and MIC5504 include an auto-discharge
circuit that is switched on when the regulator is
disabled through the enable (EN) pin. The MIC5503
and MIC5504 have an internal pull-down resistor on the
EN pin to ensure the output is disabled if the control
signal is tri-stated. The MIC5501/2/3/4 regulators are
fully protected from damage due to fault conditions,
offering linear current limiting and thermal shutdown.
The MIC5501/2/3/4 is not suitable for RF transmitter
systems.
Forcing the EN pin high enables the output voltage.
The MIC5501 and MIC5502 enable pin uses CMOS
technology and the EN pin cannot be left floating; a
floating EN pin may cause an indeterminate state on
the output. The MIC5503 and MIC5504 have an
internal pull-down resistor on the enable pin to disable
the output when the enable pin is floating.
4.1
Input Capacitor
The MIC5501/2/3/4 are high performance, high
bandwidth devices. An input capacitor of 1 μF is
required from the input to ground to provide stability.
Low-ESR ceramic capacitors provide optimal
performance at a minimum of space. Additional high
frequency capacitors, such as small-valued NPO
dielectric-type capacitors, help filter out high frequency
noise and are good practice in any RF-based circuit.
X5R or X7R dielectrics are recommended for the input
capacitor. Y5V dielectrics lose most of their
capacitance over temperature and are therefore, not
recommended.
4.5
Thermal Considerations
The MIC5501/2/3/4 are designed to provide 300 mA of
continuous current in a very small package. Maximum
ambient operating temperature can be calculated
based on the output current and the voltage drop
across the part. For example if the input voltage is 3.6V,
the output voltage is 2.8V, and the output current is
300 mA. The actual power dissipation of the regulator
circuit can be determined using Equation 4-1:
EQUATION 4-1:
4.2
Output Capacitor
PD = V IN – V OUT 1 IOUT + V IN IGND
The MIC5501/2/3/4 require an output capacitor of 1 μF
or greater to maintain stability. The design is optimized
for use with low-ESR ceramic chip capacitors. High
ESR capacitors are not recommended because they
may cause high frequency oscillation. The output
capacitor can be increased, but performance has been
optimized for a 1 μF ceramic output capacitor and does
not improve significantly with larger capacitance.
Because this device is CMOS and the ground current
is typically <100 μA over the load range, the power
dissipation contributed by the ground current is < 1%
and can be ignored for this calculation:
EQUATION 4-2:
X7R/X5R dielectric-type ceramic capacitors are
recommended because of their temperature
performance. X7R-type capacitors change capacitance
by 15% over their operating temperature range and are
the most stable type of ceramic capacitors. Z5U and
Y5V dielectric capacitors change value by as much as
50% and 60%, respectively, over their operating
temperature ranges. To use a ceramic chip capacitor
with Y5V dielectric, the value must be much higher than
an X7R ceramic capacitor to ensure the same
minimum capacitance over the equivalent operating
temperature range.
PD = 3.6V – 2.8V 300mA = 0.240W
To determine the maximum ambient operating
temperature
of
the
package,
use
the
junction-to-ambient thermal resistance of the device
and Equation 4-3:
EQUATION 4-3:
4.3
No-Load Stability
T
J MAX – T A
PDMAX = ----------------------------------
JA
Unlike many other voltage regulators, the
MIC5501/2/3/4 remain stable and in regulation with no
load. This is especially important in CMOS RAM
keep-alive applications.
Where:
TJ(MAX) = 125°C, the max. junction temp. of the die.
θJA = Thermal resistance of 250°C/W for the DFN
package.
DS20006006B-page 10
2019 Microchip Technology Inc.
MIC5501/2/3/4
Substituting PD for PD(MAX) and solving for the ambient
operating temperature will give the maximum operating
conditions
for
the
regulator
circuit.
The
junction-to-ambient thermal resistance for the
minimum footprint is 250°C/W.
The maximum power dissipation must not be exceeded
for proper operation.
For example, when operating the MIC5501-YMT at an
input voltage of 3.6V and 300 mA load with a minimum
footprint layout, the maximum ambient operating
temperature TA can be determined as follows:
EQUATION 4-4:
0.240W = 125C – T A 250C/W
T A = 65C
Therefore, the maximum ambient operating
temperature allowed in a 1 mm × 1 mm DFN package
is 65°C. For a full discussion of heat sinking and
thermal effects on voltage regulators, refer to the
“Regulator Thermals” section of Microchip’s Designing
with Low-Dropout Voltage Regulators handbook.
2019 Microchip Technology Inc.
DS20006006B-page 11
MIC5501/2/3/4
5.0
TYPICAL APPLICATION SCHEMATICS
FIGURE 5-1:
MIC550x.xYMT Typical Application Schematic.
TABLE 5-1:
Item
BILL OF MATERIALS
Part Number
Manufacturer
Description
Qty.
C1, C2
GRM155R61A105KE15D
MIC5501-x.xYMT
MIC5501-x.xYMT
MIC5501-x.xYMT
MIC5501-x.xYMT
Murata
Capacitor, 1 μF Ceramic, 10V, X5R, Size 0402
2
300 mA Single Output LDO in Small
Packages
U1
Microchip
1
DS20006006B-page 12
2019 Microchip Technology Inc.
MIC5501/2/3/4
6.0
PCB LAYOUT RECOMMENDATIONS
FIGURE 6-1:
Top Layer.
FIGURE 6-2:
Bottom Layer.
2019 Microchip Technology Inc.
DS20006006B-page 13
MIC5501/2/3/4
7.0
7.1
PACKAGING INFORMATION
Package Marking Information
4-Lead TDFN*
Example
XX
ZX
5-Lead SOT23*
Example
XX
VX
TABLE 7-1:
Device
ABBREVIATED TOP MARK
Output Voltage
1.0V 1.2V 1.8V 2.2V 2.5V 2.8V 3.0V 3.1V 3.3V
Package
Feature
MIC5501 4L TDFN (MT)
MIC5501 5L SOT23 (M5)
MIC5502 4L TDFN (MT)
MIC5502 5L SOT23 (M5)
MIC5503 4L TDFN (MT)
MIC5503 5L SOT23 (M5)
General Purpose
General Purpose
Auto-Discharge
Auto-Discharge
EN Pull-Down
—
—
—
—
—
—
—
—
—
—
XV
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
VP
VX
XP
—
—
—
—
—
—
—
—
—
—
—
—
—
XG
—
XM
—
YV
—
—
—
EN Pull-Down
—
—
Auto-Discharge &
EN Pull-Down
MIC5504 4L TDFN (MT)
MIC5504 5L SOT23 (M5)
CX
—
ZX
GX
UW
—
UX
MX
PX
TX
—
SX
Auto-Discharge &
EN Pull-Down
WX4 WXG
WXJ WXM WXP
WXS
Legend: XX...X Product code or customer-specific information
Y
YY
WW
NNN
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC® designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
e
3
)
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
DS20006006B-page 14
2019 Microchip Technology Inc.
MIC5501/2/3/4
4-Lead TDFN 1 mm x 1 mm Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2019 Microchip Technology Inc.
DS20006006B-page 15
MIC5501/2/3/4
5-Lead SOT23 Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20006006B-page 16
2019 Microchip Technology Inc.
MIC5501/2/3/4
APPENDIX A: REVISION HISTORY
Revision A (April 2018)
• Converted Micrel document MIC5501/2/3/4 to
Microchip data sheet DS20006006B.
• Minor text changes throughout.
Revision B (October 2019)
• Updated Section 4.0 “Application Information”
with adding this new sentence - The MIC5501/2/
3/4 is not suitable for RF transmitter systems.
• Added on the Section 5.0 “Typical Application
Schematics” and Section 6.0 “PCB Layout
Recommendations” due to non availability of
Evaluation Board document.
2019 Microchip Technology Inc.
DS20006006B-page 17
MIC5501/2/3/4
NOTES:
DS20006006B-page 18
2019 Microchip Technology Inc.
MIC5501/2/3/4
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
Device
-X.X
X
XX
-XX
a) MIC5501-1.8YMT-T5:
MIC5501, 1.8V Fixed Output
Voltage, –40°C to +125°C
Temperature Range, 4-Lead
TDFN, 500/Reel
Part No.
Output
Voltage
Junction
Temp. Range
Package
Media Type
MIC5501:
MIC5502:
MIC5503:
Single 300 mA LDO, General Purpose
Single 300 mA LDO, Auto-Discharge
Single 300 mA LDO, Internal EN Pull-
Down
Single 300 mA LDO, Auto-Discharge and
Internal EN Pull-Down
b) MIC5501-3.0YMT-TR: MIC5501, 3.0V Fixed Output
Voltage, –40°C to +125°C
Temperature Range, 4-Lead
TDFN, 5,000/Reel
Device:
MIC5504:
c) MIC5501-3.0YM5-TR:
MIC5501, 3.0V Fixed Output
Voltage, –40°C to +125°C
Temperature Range, 5-Lead
SOT23, 3,000/Reel
1.0
1.2
1.8
2.2
=
=
=
=
=
=
=
=
=
1.0V (MIC5504/MT)
1.2V (MIC5503/4)
1.8V (MIC5501/2/3/4)
2.2V (MIC5504/MT)
2.5V (MIC5504)
d) MIC5502-2.8YMT-TR: MIC5502, 2.8V Fixed Output
Voltage, –40°C to +125°C
Temperature Range, 4-Lead
TDFN, 5,000/Reel
Output Voltage: 2.5
2.8
3.0
3.1
3.3
2.8V (MIC5502/4)
3.0V (MIC5501/2/4)
3.1V (MIC5504/MT)
3.3V (MIC5504)
e) MIC5503-1.2YMT-TR: MIC5503, 1.2V Fixed Output
Voltage, –40°C to +125°C
Temperature Range, 4-Lead
TDFN, 5,000/Reel
f) MIC5504-1.0YMT-T5:
MIC5504, 1.0V Fixed Output
Voltage, –40°C to +125°C
Temperature Range, 4-Lead
TDFN, 500/Reel
Junction
Temperature
Range:
Y
=
–40°C to +125°C, RoHS-Compliant
g) MIC5504-2.2YMT-TR: MIC5504, 2.2V Fixed Output
Voltage, –40°C to +125°C
MT
M5
=
=
4-Lead 1 mm x 1 mm TDFN
5-Lead SOT23
Package:
Temperature Range, 4-Lead
TDFN, 5,000/Reel
T5
TR
TR
TZ
=
=
=
=
500/Reel
h) MIC5504-3.1YMT-TZ:
MIC5504, 3.1V Fixed Output
Voltage, –40°C to +125°C
Temperature Range, 4-Lead
TDFN, 10,000/Reel
3,000/Reel (SOT23)
5,000/Reel (TDFN)
10,000/Reel (TDFN)
Media Type:
Note: Other voltage options available. Contact your Microchip sales office.
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
2019 Microchip Technology Inc.
DS20006006B-page 19
MIC5501/2/3/4
NOTES:
DS20006006B-page 20
2019 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT,
chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex,
flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck,
LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi,
Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer,
PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire,
Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST,
SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,
TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA
are registered trademarks of Microchip Technology Incorporated in
the U.S.A. and other countries.
APT, ClockWorks, The Embedded Control Solutions Company,
EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load,
IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision
Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire,
SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, Vite, WinPath, and ZL are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, and Symmcom are registered trademarks of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2019, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-5154-9
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2019 Microchip Technology Inc.
DS20006006B-page 21
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DS20006006B-page 22
2019 Microchip Technology Inc.
05/14/19
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