MIC2025-1YM-TR [MICROCHIP]
1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO8;
| 型号： | MIC2025-1YM-TR |
| 厂家： | 
MICROCHIP |
| 描述： | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO8 光电二极管 |
| 文件： | 总14页 (文件大小：926K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MIC2025/2075
Single-Channel Power Distribution Switch MM8®
General Description
Features
TheMIC2025andMIC2075arehigh-sideMOSFETswitches
optimized for general-purpose power distribution requiring
circuit protection.
• 140mΩ maximum on-resistance
• 2.7V to 5.5V operating range
• 500mA minimum continuous output current
• Short-circuit protection with thermal shutdown
• Fault status flag with 3ms filter eliminates false asser-
tions
The MIC2025/75 are internally current limited and have
thermal shutdown that protects the device and load. The
MIC2075 offers “smart” thermal shutdown that reduces cur-
rent consumption in fault modes. When a thermal shutdown
fault occurs, the output is latched off until the faulty load is
removed. Removing the load or toggling the enable input will
reset the device output.
• Undervoltage lockout
• Reverse current flow blocking (no “body diode”)
• Circuit breaker mode (MIC2075) reduces power
consumption
• Logic-compatible input
• Soft-start circuit
• Low quiescent current
• Pin-compatible with MIC2525
• UL File # E179633
Both devices employ soft-start circuitry that minimizes inrush
current in applications where highly capacitive loads are em-
ployed. A fault status output flag is provided that is asserted
during overcurrent and thermal shutdown conditions.
The MIC2025/75 is available in the MM8® 8-lead MSOP
and 8-lead SOP.
Applications
• USB peripherals
• General purpose power switching
• ACPI power distribution
• Notebook PCs
• PDAs
• PC card hot swap
Typical Application
VCC
2.7V to 5.5V
10k
Logic Controller
MIC2025/75
VIN
ON/OFF
EN
OUT
IN
Load
OVERCURRENT
GND
FLG
GND
NC
1µF
OUT
NC
0.1µF
UL Recognized Component
MM8 is a registered trademark of Micrel, Inc.
Micrel, Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel + 1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
June 2010
1
MIC2025/2075
MIC2025/2075
Micrel, Inc.
Ordering Information
Part Number
Enable
Temperature Range
Package
Standard
Pb-Free
MIC2025-1BM
MIC2025-2BM
MIC2025-1YM
MIC2025-2YM
Active High
Active Low
Active High
Active Low
Active High
Active Low
Active High
Active Low
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
8-Lead SOIC
8-Lead SOIC
8-Pin MSOP
8-Pin MSOP
8-Lead SOIC
8-Lead SOIC
8-Pin MSOP
8-Pin MSOP
MIC2025-1BMM MIC2025-1YMM
MIC2025-2BMM MIC2025-2YMM
MIC2075-1BM
MIC2075-2BM
MIC2075-1YM
MIC2075-2YM
MIC2075-1BMM MIC2075-1YMM
MIC2075-2BMM MIC2075-2YMM
Pin Configuration
MIC2025/75
EN
FLG
GND
NC
OUT
IN
1
2
3
4
8
7
6
5
OUT
NC
8-Lead SOIC (BM)
8-Lead MSOP (BMM)
Pin Description
Pin Number
Pin Name
EN
Pin Function
Switch Enable (Input): Active-high (-1) or active-low (-2).
1
2
FLG
Fault Flag (Output): Active-low, open-drain output. Indicates overcurrent or
thermal shutdown conditions. Overcurrent condition must exceed tD in order
to assert FLG.
3
4
GND
NC
Ground
not internally connected
not internally connected
Supply (Output): Pins must be connected together.
Supply Voltage (Input).
5
NC
6, 8
7
OUT
IN
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MIC2025/2075
Micrel, Inc.
Absolute Maximum Ratings (Note 1)
Operating Ratings (Note 2)
Supply Voltage (V )..........................................–0.3V to 6V
Supply Voltage (V ) ................................... +2.7V to +5.5V
IN
IN
Fault Flag Voltage (V
Fault Flag Current (I
)..............................................+6V
Ambient Temperature (T ).......................... –40°C to +85°C
FLG
A
)............................................. 25mA
)...................................................+6V
Junction Temperature (T )........................ Internally Limited
FLG
J
Output Voltage (V
Output Current (I
Thermal Resistance
OUT
SOP (θ ) ..........................................................160°C/W
) ............................... Internally Limited
JA
OUT
MSOP(θ ) ........................................................206°C/W
JA
Enable Input (I )..................................... –0.3V to V +3V
EN
IN
Storage Temperature (T ) ........................ –65°C to +150°C
S
ESD Rating, Note 3
Electrical Characteristics
VIN = +5V; TA = 25°C, bold values indicate –40°C ≤ TA ≤ +85°C; unless noted
Symbol
Parameter
Condition
Min
Typ
Max
Units
IDD
Supply Current
MIC20x5-1, VEN ≤ 0.8V, (switch off),
OUT = open
0.75
5
µA
MIC20x5-2, VEN ≥ 2.4V, (switch off),
OUT = open
0.75
5
µA
µA
µA
MIC20x5-1, VEN ≥ 2.4V, (switch on),
OUT = open
160
160
2.4
MIC20x5-2, VEN ≤ 0.8V, (switch on),
OUT = open
VEN
Enable Input Voltage
low-to-high transition
high-to-low transition
2.1
1.9
200
0.01
1
V
0.8
V
Enable Input Hysteresis
Enable Input Current
Control Input Capacitance
Switch Resistance
mV
µA
pF
mΩ
mΩ
µA
µA
IEN
VEN = 0V to 5.5V
–1
1
RDS(on)
VIN = 5V, IOUT = 500mA
VIN = 3.3V, IOUT = 500mA
MIC2025/2075 (output off)
90
140
160
10
100
Output Leakage Current
OFF Current in Latched
Thermal Shutdown
MIC2075
50
(during thermal shutdown state)
tON
tR
tOFF
tF
Output Turn-On Delay
RL = 10Ω, CL = 1µF, see “Timing Diagrams”
RL = 10Ω, CL = 1µF, see “Timing Diagrams”
RL = 10Ω, CL = 1µF, see “Timing Diagrams”
RL = 10Ω, CL = 1µF, see “Timing Diagrams”
VOUT = 0V, enabled into short-circuit.
1
2.5
2.3
50
6
ms
ms
µs
µs
A
Output Turn-On Rise Time
Output Turnoff Delay
0.5
5.9
100
100
1.25
1.25
Output Turnoff Fall Time
Short-Circuit Output Current
Current-Limit Threshold
Short-Circuit Response Time
50
ILIMIT
0.5
0.7
0.85
24
ramped load applied to output, Note 4
0.60
A
VOUT = 0V to IOUT = ILIMIT
µs
(Short applied to output)
tD
Overcurrent Flag Response
Delay
VIN = 5V, apply VOUT = 0V until FLG low
VIN = 3.3V, apply VOUT = 0V until FLG low
VIN rising
1.5
1.5
2.2
2.0
3
7
ms
ms
V
3
8
Undervoltage Lockout
Threshold
2.5
2.3
2.7
2.5
VIN falling
V
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Micrel, Inc.
Symbol
Parameter
Condition
Min
Typ
8
Max
Units
Ω
Error Flag Output
Resistance
IL = 10mA, VIN = 5V
IL = 10mA, VIN = 3.3V
VFLAG = 5V
25
40
10
11
Ω
Error Flag Off Current
µA
°C
Overtemperature Threshold
TJ increasing
140
120
TJ decreasing
°C
Note 1. Exceeding the absolute maximum rating may damage the device.
Note 2. The device is not guaranteed to function outside its operating rating.
Note 3. Devices are ESD sensitive. Handling precautions recommended.
Note 4. See “Functional Characteristics: Current-Limit Response” graph.
Test Circuit
VOUT
IOUT
Device
Under
Test
OUT
RL
CL
Timing Diagrams
tR
tF
90%
10%
90%
VOUT
10%
Output Rise and Fall Times
50%
VEN
tOFF
tON
90%
VOUT
10%
Active-Low Switch Delay Times (MIC20x5-2)
50%
VEN
tOFF
tON
90%
VOUT
10%
Active-High Switch Delay Times (MIC20x5-1)
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Micrel, Inc.
S upply On-C urrent
vs . Temperature
On-R es is tance
vs . Temperature
Turn-On R is e Time
vs . Temperature
5
4
3
2
1
180
160
140
120
100
80
160
140
120
100
80
VIN = 3.3V
3.3V
5V
5V
VIN = 5V
60
3.3V
60
40
IOUT = 500mA
40
R L=10Ω
C L=1µF
20
20
0
0
0
-40 -20
0
20 40 60 80 100
-40 -20
0
20 40 60 80 100
-40 -20
0
20 40 60 80 100
TEMPERATURE (°C)
TEMPERATURE (°C)
TEMPERATURE (°C)
S upply On-C urrent
vs . Input Voltage
On-R es is tance
vs . Input Voltage
Turn-On R is e Time
vs . Input Voltage
200
150
100
50
200
150
100
50
5.0
4.0
3.0
+85°C
+25°C
-40°C
+85°C
+25°C
-40°C
2.0
1.0
0
+25°C
+85°C
-40°C
R L=10Ω
C L=1µF
IOUT = 500mA
0
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5
INPUT VOLTAGE (V)
2.5 3.0 3.5 4.0 4.5 5.0 5.5
INPUT VOLTAGE (V)
2.5 3.0 3.5 4.0 4.5 5.0 5.5
INPUT VOLTAGE (V)
S hort-C ircuit C urrent-L imit
vs . Temperature
C urrent-L imit Thres hold
vs . Temperature
E nable Thres hold
vs . Temperature
1200
1000
2.5
1000
800
600
400
200
0
VIN = 3.3V
VIN = 5V
VIN = 3.3V
VIN = 5V
800
600
400
200
0
2.0
1.5
1.0
0.5
0
VE N R IS ING
VE N F ALLING
VIN = 5V
20 40 60 80 100
-40 -20
0
20 40 60 80 100
-40 -20
0
20 40 60 80 100
-40 -20
0
TEMPERATURE (°C)
TEMPERATURE (°C)
TEMPERATURE (°C)
S hort-C ircuit C urrent-L imit
vs . Input Voltage
C urrent-L imit Thres hold
vs . Input Voltage
E nable Thres hold
vs . Input Voltage
800
700
600
500
400
300
200
100
0
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
2.5
2.0
1.5
1.0
0.5
0
+25°C
VE N R IS ING
+85°C
-40°C
+85°C
+25°C
-40°C
VE N F ALLING
TA = 25°C
2.5 3.0 3.5 4.0 4.5 5.0 5.5
INPUT VOLTAGE (V)
2.5 3.0 3.5 4.0 4.5 5.0 5.5
INPUT VOLTAGE (V)
2.5 3.0 3.5 4.0 4.5 5.0 5.5
INPUT VOLTAGE (V)
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MIC2025/2075
Micrel, Inc.
F lag Delay
vs . Temperature
F lag Delay
vs . Input Voltage
UVL O Thres hold
vs . Temperature
5
4
3
2
1
0
5
4
3
2
1
3.0
2.5
2.0
1.5
1.0
0.5
0
VIN R IS ING
VIN = 3.3V
+85°C
+25°C
VIN = 5V
VIN F ALLING
-40°C
0
-40 -20
0
20 40 60 80 100
2.5 3.0 3.5 4.0 4.5 5.0 5.5
INPUT VOLTAGE (V)
-40 -20
0
20 40 60 80 100
TEMPERATURE (°C)
TEMPERATURE (°C)
MIC2025/2075
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June 2010
MIC2025/2075
Micrel, Inc.
Functional Characteristics
June 2010
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MIC2025/2075
MIC2025/2075
Micrel, Inc.
MIC2025/2075
8
June 2010
MIC2025/2075
Micrel, Inc.
Block Diagram
EN
THERMAL
SHUTDOWN
1.2V
REFERENCE
IN
OSC.
UVLO
CHARGE
PUMP
CURRENT
LIMIT
GATE
CONTROL
FLAG
RESPONSE
DELAY
OUT
FLG
GND
Power Dissipation
Functional Description
The device’s junction temperature depends on several fac-
tors such as the load, PCB layout, ambient temperature
and package type. Equations that can be used to calculate
power dissipation of each channel and junction temperature
are found below.
Input and Output
IN is the power supply connection to the logic circuitry and
the drain of the output MOSFET. OUT is the source of the
output MOSFET. In a typical circuit, current flows from IN to
OUT toward the load. If V
is greater than V , current will
OUT
IN
2
P = R
× I
OUT
flow from OUT to IN since the switch is bidirectional when
enabled. The output MOSFET and driver circuitry are also
designedtoallowtheMOSFETsourcetobeexternallyforced
D
DS(on)
Total power dissipation of the device will be the summation of
P for both channels. To relate this to junction temperature,
D
to a higher voltage than the drain (V
> V ) when the
the following equation can be used:
OUT
IN
switch is disabled. In this situation, the MIC2025/75 avoids
undesirable current flow from OUT to IN.
T = P × θ + T
A
J
D
JA
where:
Thermal Shutdown
T = junction temperature
J
Thermal shutdown is employed to protect the device from
damage should the die temperature exceed safe margins
due mainly to short circuit faults. Each channel employs its
own thermal sensor. Thermal shutdown shuts off the output
MOSFET and asserts the FLG output if the die temperature
reaches140°C.TheMIC2025willautomaticallyresetitsoutput
shouldthedietemperaturecooldownto120°C.TheMIC2025
output and FLG signal will continue to cycle on and off until
thedeviceisdisabledorthefaultisremoved. Figure2depicts
typical timing. If the MIC2075 goes into thermal shutdown, its
output will latch off and a pull-up current source is activated.
This allows the output latch to automatically reset when the
load (such as a USB device) is removed. The output can also
be reset by toggling EN. Refer to Figure 1 for details.
T = ambient temperature
A
θ
= is the thermal resistance of the package
JA
Current Sensing and Limiting
The current-limit threshold is preset internally. The preset
level prevents damage to the device and external load but
still allows a minimum current of 500mA to be delivered to
the load.
Thecurrent-limitcircuitsensesaportionoftheoutputMOSFET
switch current. The current-sense resistor shown in the block
diagram is virtual and has no voltage drop. The reaction to
an overcurrent condition varies with three scenarios:
Switch Enabled into Short-Circuit
If a switch is enabled into a heavy load or short-circuit, the
switch immediately enters into a constant-current mode,
reducing the output voltage. The FLG signal is asserted
indicating an overcurrent condition. See the Short-Circuit
Response graph under Functional Characteristics.
Depending on PCB layout, package, ambient temperature,
etc., it may take several hundred milliseconds from the in-
cidence of the fault to the output MOSFET being shut off.
The worst-case scenario of thermal shutdown is that of a
short-circuit fault and is shown in the in the “Function Char-
acteristics: Thermal Shutdown Response” graph.
June 2010
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MIC2025/2075
Micrel, Inc.
Short-Circuit Applied to Enabled Output
Fault Flag
Whenaheavyloadorshort-circuitisapplied,alargetransient
currentmayflowuntilthecurrent-limitcircuitryresponds.Once
this occurs the device limits current to less than the short-cir-
cuitcurrentlimitspecification.SeetheShort-CircuitTransient
Response graph under Functional Characteristics.
The FLG signal is an N-channel open-drain MOSFEToutput.
FLG is asserted (active-low) when either an overcurrent
or thermal shutdown condition occurs. In the case where
an overcurrent condition occurs, FLG will be asserted only
after the flag response delay time, t , has elapsed. This
D
ensures that FLG is asserted only upon valid overcurrent
conditions and that erroneous error reporting is eliminated.
For example, false overcurrent conditions can occur during
hot-plug events when a highly capacitive load is connected
and causes a high transient inrush current that exceeds the
Current-Limit Response—Ramped Load
TheMIC2025/75current-limitprofileexhibitsasmallfoldback
effect of about 200mA. Once this current-limit threshold is
exceeded the device switches into a constant current mode.
It is important to note that the device will supply current until
thecurrent-limitthresholdisexceeded. SeetheCurrent-Limit
Response graph under Functional Characteristics.
current-limit threshold. The FLG response delay time t is
D
typically 3ms.
Undervoltage Lockout
Undervoltage lockout (UVLO) prevents the output MOS-
FET from turning on until V exceeds approximately 2.5V.
IN
Undervoltage detection functions only when the switch is
enabled.
Load Removed
(Output Reset)
Short-Circuit Fautl
V
EN
V
OUT
I
LIMIT
I
DC
Thermal Shutdown
Reached
I
OUT
V
FLG
t
D
Figure 1. MIC2075-2 Timing: Output Reset by Removing Load
Short-Circuit Fautl
V
EN
Load/Fault
Removed
V
OUT
I
LIMIT
I
DC
Thermal Shutdown
Reached
I
OUT
V
FLG
t
D
Figure 2. MIC2025-2 Timing
MIC2025/2075
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MIC2025/2075
Micrel, Inc.
Universal Serial Bus (USB) Power Distribution
Applications Information
The MIC2025/75 is ideally suited for USB (Universal Serial
Bus) power distribution applications. The USB specification
defines power distribution for USB host systems such as
PCs and USB hubs. Hubs can either be self-powered or
bus-powered (that is, powered from the bus). Figure 5 below
shows a typical USB Host application that may be suited for
mobile PC applications employing USB. The requirements
for USB host systems is that the port must supply a minimum
of 500mA at an output voltage of 5V ±5%. In addition, the
output power delivered must be limited to below 25VA. Upon
an overcurrent condition, the host must also be notified. To
support hot-plug events, the hub must have a minimum of
120µF of bulk capacitance, preferably low-ESR electrolytic
or tantulum. Refer to Application Note 17 for more details on
designing compliant USB hub and host systems.
Supply Filtering
A 0.1µF to 1µF bypass capacitor positioned close to V and
IN
GND of the device is strongly recommended to control sup-
ply transients. Without a bypass capacitor, an output short
may cause sufficient ringing on the input (from supply lead
inductance) to damage internal control circuitry.
Printed Circuit Board Hot-Plug
The MIC2025/75 are ideal inrush current-limiters suitable for
hot-plug applications. Due to the integrated charge pump,
the MIC2025/75 presents a high impedance when off and
slowly becomes a low impedance as it turns on. This “soft-
start” feature effectively isolates power supplies from highly
capacitive loads by reducing inrush current during hot-plug
events. Figure 3 shows how the MIC2075 may be used in a
hot-plug application.
For bus-powered hubs, USB requires that each downstream
port be switched on or off under control by the host. Up to four
downstream ports each capable of supplying 100mAat 4.4V
minimum are allowed. In addition, to reduce voltage droop on
In cases of extremely large capacitive loads (>400µF), the
length of the transient due to inrush current may exceed the
delay provided by the integrated filter. Since this inrush cur-
rent exceeds the current-limit delay specification, FLG will
be asserted during this time. To prevent the logic controller
from responding to FLG being asserted, an external RC filter,
as shown in Figure 4, can be used to filter out transient FLG
assertion. The value of the RC time constant will be selected
to match the length of the transient.
the upstream V
, soft-start is necessary. Although the hub
BUS
can consume up to 500mA from the upstream bus the hub
must consume only 100mA max at start-up, until it enumer-
ates with the host prior to requesting more power. The same
requirementsapplyforbus-poweredperipheralsthathaveno
downstream ports. Figure 6 shows a bus-powered hub.
MIC2025-2
1
2
3
4
8
VCC
EN
OUT
IN
7
6
5
FLG
GND
NC
0.1
Backend
Function
µF
to "Hot"
OUT
NC
Receptacle
CBULK
GND
Adaptor Card
Figure 3. Hot Plug Application
V+
MIC2025
10k
R
Logic Controller
1
2
3
4
8
7
6
5
EN
OUT
IN
OVERCURRENT
FLG
GND
NC
C
OUT
NC
Figure 4. Transient Filter
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MIC2025/2075
Micrel, Inc.
VCC
5.0V
10k
4.50V to 5.25V
UpstreamVBUS
100mA max.
3.3V
Ferrite
Beads
MIC5203-3.3
IN OUT
3.3V USB Controller
MIC2025/75
EN OUT
VBUS
VBUS
D+
VIN
ON/OFF
D+
OVERCURRENT
GND
FLG
GND
NC
IN
OUT
NC
1µF
USB
Port
1µF
0.01µF
D–
D–
GND
120µF
GND
GND
0.1µF
Data
Data
Figure 5 USB Host Application
1.5k
3.3V
Ferrite
Beads
USB Upstream
Connector
MIC5203-3.3
(LDO)
MIC2025/75
EN OUT
USB Logic Controller
VBUS
D+
VBUS
VIN
IN
OUT
GND
ON/OFF
D+
USB Downstream
Connector
FLG
GND
NC
IN
OUT
NC
OVERCURRENT
GND
120µF
0.01µF
D–
D–
(Up to four
GND
GND
0.1µF
0.1µF
ganaged ports)
1.5K
0.1µF
Data
Data
Figure 6. USB Bus-Powered Hub
MIC2025/2075
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June 2010
MIC2025/2075
Micrel, Inc.
Package Information
8-Lead SOIC (M)
MM8™ 8-Pin MSOP (MM)
June 2010
13
MIC2025/2075
MIC2025/2075
Micrel, Inc.
MICREL INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
tel + 1 (408) 944-0800 fax + 1 (408) 474-1000 web http://www.micrel.com
This information furnished by Micrel in this data sheet is believed to be accurate and reliable. However no responsibility is assumed by Micrel for its use.
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser's
use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser's own risk and Purchaser agrees to fully indemnify
Micrel for any damages resulting from such use or sale.
© 2004 Micrel Incorporated
MIC2025/2075
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