MCP73863T-I/ML [MICROCHIP]
Advanced Single or Dual Cell, Fully Integrated Li-Ion / Li-Polymer Charge Management Controllers; 先进的单或双电池,完全集成的锂离子/锂聚合物充电管理控制器型号: | MCP73863T-I/ML |
厂家: | MICROCHIP |
描述: | Advanced Single or Dual Cell, Fully Integrated Li-Ion / Li-Polymer Charge Management Controllers |
文件: | 总28页 (文件大小:444K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MCP73861/2/3/4
Advanced Single or Dual Cell, Fully Integrated Li-Ion /
Li-Polymer Charge Management Controllers
Features
Description
The MCP7386X family of devices are highly advanced
linear charge management controllers for use in space-
limited, cost-sensitive applications. The devices com-
bine high-accuracy, constant voltage and current regu-
lation, cell preconditioning, cell temperature monitoring,
advanced safety timers, automatic charge termination,
internal current sensing, reverse-blocking protection,
charge status and fault indication in either a space-
saving 16-pin, 4 x 4 QFN or 16-pin SOIC package. The
MCP7386X provides a complete, fully-functional, stand-
alone charge management solution with a minimum
number of external components.
• Linear Charge Management Controllers
- Integrated Pass Transistor
- Integrated Current Sense
- Reverse-Blocking Protection
• High-Accuracy Preset Voltage Regulation: + 0.5%
• Four Selectable Voltage Regulation Options:
- 4.1V, 4.2V – MCP73861/3
- 8.2V, 8.4V – MCP73862/4
• Programmable Charge Current: 1.2A Maximum
• Programmable Safety Charge Timers
• Preconditioning of Deeply Depleted Cells
• Automatic End-of-Charge Control
• Optional Continuous Cell Temperature Monitoring
• Charge Status Output for Direct LED Drive
• Fault Output for Direct LED Drive
• Automatic Power-Down
The MCP73861/3 is intended for applications utilizing
single-cell Lithium-Ion or Lithium-Polymer battery
packs, while the MCP73862/4 is intended for dual
series cell Lithium-Ion or Lithium-Polymer battery
packs. The MCP73861/3 have two selectable voltage-
regulation options available (4.1V and 4.2V), for use
with either coke or graphite anodes and operate with an
input voltage range of 4.5V to 12V. The MCP73862/4
have two selectable voltage-regulation options avail-
able (8.2V and 8.4V), for use with coke or graphite
anodes, and operate with an input voltage range of
8.7V to 12V.
• Thermal Regulation
• Temperature Range: -40°C to +85°C
• Packaging: 16-Pin, 4 x 4 QFN
16-Pin SOIC
Applications
The only difference between the MCP73861/2 and
MCP73863/4, respectively, is the function of the charge
status output (STAT1) when a charge cycle has been
completed. The MCP73861/2 flash the output, while
the MCP73863/4 turn the output off. Refer to
• Lithium-Ion/Lithium-Polymer Battery Chargers
• Personal Data Assistants (PDAs)
• Cellular Telephones
• Hand-Held Instruments
• Cradle Chargers
Section 5.2.1
“Charge
Status
Outputs
• Digital Cameras
• MP3 Players
(STAT1,STAT2)”.
The MCP7386X family of devices are fully specified
over the ambient temperature range of -40°C to +85°C.
Package Types
16-Pin QFN
16-Pin SOIC
STAT2
STAT1
VSET
1
2
3
4
5
6
7
8
EN
16
15
14
13
12
11
10
9
VSS2
VBAT3
VBAT2
16 15 14 13
VSET
VDD1
VDD2
VSS1
12
11
10
9
1
2
3
4
VBAT3
VBAT2
MCP73861
MCP73862
MCP73863
MCP73864
VDD1
VDD2
VSS1
VBAT1
VSS3
VBAT1
VSS3
PROG
TIMER
5
6
7
8
THREF
THERM
© 2005 Microchip Technology Inc.
DS21893C-page 1
MCP73861/2/3/4
Typical Application
1.2A Lithium-Ion Battery Charger
2, 3
1
12
5V
VDD
VBAT3
4.7 µF
4.7µF
10, 11
6
VSET
EN
VBAT
14
16
15
5
THREF
THERM
TIMER
VSS
6.19 kΩ
7
8
STAT1
STAT2
PROG
Single
Lithium-Ion
Cell
+
–
7.32 kΩ
0.1
µF
4, 9, 13
MCP73861/3
Functional Block Diagram
Direction
Control
VBAT1
VBAT2
VDD1
VDD2
VDD
G = 0.001
4 kΩ
VREF
Charge Current
Control Amplifier
90
kΩ
1 kΩ
PROG
+
Voltage Control
+
Amplifier
–
11 kΩ
–
Charge
Termination
Comparator
VREF
110 kΩ
10 kΩ
VREF
VBAT3
+
–
Precondition
Comp.
Charge_OK
Precon
600 kΩ
(1.65 MΩ)
I
REG/12
Precondition
Control
+
–
10 kΩ
UVLO
COMPARATOR
+
–
148.42 kΩ
Values in ( )
reflect the
MCP73862/4
devices
Constant-Voltage/
Recharge Comp.
VUVLO
+
–
1.58 kΩ
EN
Power-On
Delay
VREF
300.04 kΩ
VUVLO
VREF (1.2V)
Bias and
Reference
Generator
VSET
10.3 kΩ
(8.58 kΩ)
VSS1
VSS2
VSS3
THREF
THERM
Temperature
Comparators
100 kΩ
50 kΩ
50 kΩ
STAT1
+
Drv Stat 1
–
Charge Control,
Charge Timers
And Status Logic
IREG/12
Oscillator
STAT2
+
–
Drv Stat 2
TIMER
Charge_OK
DS21893C-page 2
© 2005 Microchip Technology Inc.
MCP73861/2/3/4
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
V
..............................................................................13.5V
DDN
V
, V , EN, STAT1, STAT2 w.r.t. V
SS
BATN
SET
.................................................................-0.3 to (V + 0.3)V
DD
PROG, THREF, THERM, TIMER w.r.t. V ..............-0.3 to 6V
SS
Maximum Junction Temperature, T ............Internally Limited
J
Storage temperature .....................................-65°C to +150°C
ESD protection on all pins:
Human Body Model (1.5 kΩ in series with 100 pF)....≥ 4 kV
Machine Model (200 pF, No series resistance) ...........300V
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for V = [V
(typ.) + 0.3V] to 12V,
DD
REG
T = -40°C to +85°C. Typical values are at +25°C, V = [V (typ.) + 1.0V]
A
DD
REG
Unit
s
Parameters
Sym
Min
Typ
Max
Conditions
Supply Input
Supply Voltage
V
4.5
8.7
—
—
—
12
12
V
V
MCP73861/3
MCP73862/4
DD
Supply Current
I
0.17
0.53
4.5
8.8
4
µA Disabled
mA Operating
SS
—
4
UVLO Start Threshold
V
4.25
8.45
4.65
9.05
V
V
MCP73861/3
MCP73862/4
Low-to-High
START
V
DD
UVLO Stop Threshold
V
4.20
8.40
4.4
8.7
4.55
8.95
V
V
MCP73861/3
MCP73862/4
STOP
V
High-to-Low
DD
Voltage Regulation (Constant-Voltage Mode)
Regulated Output Voltage
V
4.079
4.179
8.159
8.358
4.1
4.2
8.2
8.4
4.121
4.221
8.241
8.442
V
V
V
V
MCP73861/3, V
MCP73861/3, V
MCP73862/4, V
MCP73862/4, V
= V
= V
= V
= V
REG
SET
SET
SET
SET
SS
DD
SS
DD
V
= [V
(typ.) + 1V],
REG
DD
I
= 10 mA
OUT
T = -5°C to +55°C
A
Line Regulation
|(ΔV
/V
)
—
—
0.025
0.01
0.25
0.25
%/V
%
V
I
= [V
= 10 mA
(typ.)+1V] to 12V
REG
BAT BAT
DD
| /ΔV
DD
OUT
Load Regulation
|ΔV
/V
|
I
= 10 mA to 150 mA
BAT BAT
OUT
V
= [V
(typ.)+1V]
REG
DD
OUT
OUT
Supply Ripple Attenuation
PSRR
—
—
60
42
—
—
dB
dB
I
= 10 mA, 10 Hz to 1 kHz
I
= 10 mA, 10 Hz to
10 kHz
—
—
28
—
1
dB
µA
I
OUT
= 10 mA, 10 Hz to 1 MHz
Output Reverse-Leakage
Current
I
0.23
V
< V
= V
(typ.)
DISCHARGE
DD
BAT
REG
Current Regulation (Fast Charge Constant-Current Mode)
Fast Charge Current
Regulation
I
85
100
1200
500
115
1380
575
mA PROG = OPEN
mA PROG = V
REG
1020
425
SS
mA PROG = 1.6 kΩ
T = -5°C to +55°C
A
© 2005 Microchip Technology Inc.
DS21893C-page 3
MCP73861/2/3/4
DC CHARACTERISTICS (Continued)
Electrical Specifications: Unless otherwise indicated, all limits apply for V = [V
(typ.) + 0.3V] to 12V,
DD
REG
T = -40°C to +85°C. Typical values are at +25°C, V = [V (typ.) + 1.0V]
REG
A
DD
Unit
s
Parameters
Sym
Min
Typ
Max
Conditions
Preconditioning Current Regulation (Trickle Charge Constant-Current Mode)
Precondition Current
Regulation
I
5
10
120
50
15
180
75
mA PROG = OPEN
mA PROG = V
PREG
60
25
SS
mA PROG = 1.6 kΩ
T =-5°C to +55°C
A
Precondition Threshold
Voltage
V
2.70
2.75
5.40
5.50
2.80
2.85
5.60
5.70
2.90
2.95
5.80
5.90
V
V
V
V
MCP73861/3, V
MCP73861/3, V
MCP73862/4, V
MCP73862/4, V
= V
= V
= V
= V
PTH
SET
SET
SET
SET
SS
DD
SS
DD
V
Low-to-High
BAT
Charge Termination
Charge Termination
Current
I
6
8.5
90
41
11
120
50
mA PROG = OPEN
mA PROG = V
TERM
70
32
SS
mA PROG = 1.6 kΩ
T =-5°C to +55°C
A
Automatic Recharge
Recharge Threshold
Voltage
V
V
-
V
-
V
-100 mV
V
V
MCP73861/3
MCP73862/4
RTH
REG
REG
REG
300 mV
200 mV
V
-
V
-
V
-
REG
REG
REG
600 mV
400 mV
200 mV
2.625
V
High-to-Low
BAT
Thermistor Reference
Thermistor Reference
Output Voltage
V
2.475
2.55
V
T = 25°C,
A
THREF
V
= V
(typ.) + 1V,
DD
REG
I
= 0 mA
THREF
Thermistor Reference
Source Current
I
200
—
—
—
µA
THREF
Thermistor Reference Line |(ΔV
/V
0.1
0.25
%/V
V
= [V
(typ.) + 1V] to
REG
THREF
T
DD
Regulation
)|/
12V
HREF
ΔV
DD
Thermistor Reference Load |ΔV
Regulation
/V
0.01
0.10
%
I
= 0 mA to 0.20 mA
THREF
HREF|
T
THREF
Thermistor Comparator
Upper Trip Threshold
V
1.18
—
1.25
-50
0.62
80
1.32
—
V
T1
Upper Trip Point Hysteresis
Lower Trip Threshold
V
mV
V
T1HYS
V
0.59
—
0.66
—
T2
Lower Trip Point Hysteresis
Input Bias Current
V
mV
μA
T2HYS
I
—
—
2
BIAS
Status Indicator – STAT1, STAT2
Sink Current
I
4
8
12
400
1
mA
mV
μA
SINK
Low Output Voltage
Input Leakage Current
Enable Input
V
I
—
—
200
0.01
I
I
= 1 mA
OL
SINK
= 0 mA, V
= 12V
STAT1,2
LK
SINK
Input High Voltage Level
Input Low Voltage Level
Input Leakage Current
V
1.4
—
—
—
—
0.8
1
V
V
IH
V
IL
I
—
0.01
μA
V
= 12V
LK
ENABLE
DS21893C-page 4
© 2005 Microchip Technology Inc.
MCP73861/2/3/4
DC CHARACTERISTICS (Continued)
Electrical Specifications: Unless otherwise indicated, all limits apply for V = [V
(typ.) + 0.3V] to 12V,
DD
REG
T = -40°C to +85°C. Typical values are at +25°C, V = [V (typ.) + 1.0V]
REG
A
DD
Unit
s
Parameters
Sym
Min
Typ
Max
Conditions
Thermal Shutdown
Die Temperature
T
—
—
155
10
—
—
°C
°C
SD
Die Temperature
Hysteresis
T
SDHYS
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for V = [V
(typ.) + 0.3V] to 12V,
REG
DD
T = -40°C to +85°C. Typical values are at +25°C, V = [V (typ.) + 1.0V]
REG
A
DD
Parameters
Sym
Min
Typ
Max
Units
Conditions
Low-to-High
UVLO Start Delay
t
t
—
—
5
ms
V
V
START
DD
Current Regulation
Transition Time Out of
Preconditioning
—
—
—
—
1
1
ms
ms
< V
to V
> V
BAT PTH
DELAY
BAT
PTH
Current Rise Time Out of
Preconditioning
t
I
Rising to 90% of I
OUT REG
RISE
Fast Charge Safety Timer
Period
t
1.1
1.5
1.9
Hours
C
C
C
= 0.1 µF
= 0.1 µF
= 0.1 µF
FAST
TIMER
TIMER
TIMER
Preconditioning Current Regulation
Preconditioning Charge Safety
Timer Period
t
45
60
3
75
Minutes
Hours
PRECON
Charge Termination
Elapsed Time Termination
Period
t
2.2
3.8
TERM
Status Indicators
Status Output turn-off
Status Output turn-on
t
—
—
—
—
200
200
µs
µs
I
I
= 1 mA to 0 mA
= 0 mA to 1 mA
OFF
SINK
SINK
t
ON
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all limits apply for V = [V
(typ.) + 0.3V] to 12V.
REG
DD
Typical values are at +25°C, V = [V
(typ.) + 1.0V]
DD
REG
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Specified Temperature Range
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistances
T
-40
-40
-65
—
—
—
+85
+125
+150
°C
°C
°C
A
T
J
T
A
Thermal Resistance, 16-lead,
4 mm x 4 mm QFN
θ
θ
—
—
37
74
—
—
°C/W
°C/W
4-Layer JC51-7 Standard Board,
Natural Convection
JA
JA
Thermal Resistance, 16-lead SOIC
4-Layer JC51-7 Standard Board,
Natural Convection
© 2005 Microchip Technology Inc.
DS21893C-page 5
MCP73861/2/3/4
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
NOTE: Unless otherwise indicated, VDD = [VREG(typ.) + 1V], IOUT = 10 mA and TA= +25°C, Constant-voltage mode.
4.207
4.205
4.203
4.201
4.199
4.197
4.195
4.193
1.00
0.90
0.80
0.70
0.60
0.50
0.40
MCP73861/3
VSET = VDD
VDD = 5.2V
MCP73861/3
VSET = VDD
VDD = 5.2V
10
100
1000
10
100
1000
Charge Current (mA)
Charge Current (mA)
FIGURE 2-1:
Battery Regulation Voltage
FIGURE 2-4:
Supply Current (ISS) vs.
(VBAT) vs. Charge Current (IOUT).
Charge Current (IOUT).
4.40
4.30
4.20
4.10
4.00
3.90
3.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
MCP73861/3
SET = VDD
IOUT = 1000 mA
MCP73861/3
VSET = VDD
IOUT = 1000 mA
V
4.5
6.0
7.5
9.0
10.5
12.0
4.5
6.0
7.5
9.0
10.5
12.0
Supply Voltage (V)
Supply Voltage (V)
FIGURE 2-2:
Battery Regulation Voltage
FIGURE 2-5:
Supply Current (ISS) vs.
(VBAT) vs. Supply Voltage (VDD).
Supply Voltage (VDD).
4.207
1.00
0.90
0.80
0.70
0.60
0.50
0.40
MCP73861/3
MCP73861/3
SET = VDD
IOUT = 10 mA
V
SET = VDD
V
4.205
4.203
4.201
4.199
4.197
4.195
4.193
IOUT = 10 mA
4.5
6.0
7.5
9.0
10.5
12.0
4.5
6.0
7.5
9.0
10.5
12.0
Supply Voltage (V)
Supply Voltage (V)
FIGURE 2-3:
Battery Regulation Voltage
FIGURE 2-6:
Supply Current (ISS) vs.
(VBAT) vs. Supply Voltage (VDD).
Supply Voltage (VDD).
DS21893C-page 6
© 2005 Microchip Technology Inc.
MCP73861/2/3/4
TYPICAL PERFORMANCE CURVES (CONTINUED)
NOTE: Unless otherwise indicated, VDD = [VREG(typ.) + 1V], IOUT = 10 mA and TA= +25°C, Constant-voltage mode.
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
1.60
1.40
1.20
1.00
0.80
0.60
0.40
MCP73861/3
SET = VDD
VDD = VSS
MCP73861/3
VSET = VDD
IOUT = 10 mA
V
+85°C
+25°C
-40°C
2.0
2.4
2.8
3.2
3.6
4.0
4.4
Ambient Temperature (°C)
Battery Regulation Voltage (V)
FIGURE 2-7:
Output Leakage Current
FIGURE 2-10:
Supply Current (ISS) vs.
(IDISCHARGE) vs. Battery Regulation Voltage
(VBAT).
Ambient Temperature (TA).
4.207
2.550
MCP73861/3
VSET = VDD
IOUT = 10 mA
MCP73861/3
VSET = VDD
ITHREF = 100 µA
4.205
4.203
4.201
4.199
4.197
4.195
4.193
2.540
2.530
2.520
2.510
2.500
4.5
6.0
7.5
9.0
10.5
12.0
Ambient Temperature (°C)
Supply Voltage (V)
FIGURE 2-11:
Battery Regulation Voltage
FIGURE 2-8:
Thermistor Reference
(VBAT) vs. Ambient Temperature (TA).
Voltage (VTHREF) vs. Supply Voltage (VDD).
2.520
2.520
MCP73861/3
VSET = VDD
ITHREF = 100 µA
MCP73861/3
VSET = VDD
2.515
2.515
2.510
2.505
2.500
2.510
2.505
2.500
0
25 50 75 100 125 150 175 200
Therm. Bias Current (µA)
Ambient Temperature (°C)
FIGURE 2-12:
Thermistor Reference
FIGURE 2-9:
Thermistor Reference
Voltage (VTHREF) vs. Ambient Temperature (TA).
Voltage (VTHREF) vs. Thermistor Bias Current
(ITHREF).
© 2005 Microchip Technology Inc.
DS21893C-page 7
MCP73861/2/3/4
TYPICAL PERFORMANCE CURVES (CONTINUED)
NOTE: Unless otherwise indicated, VDD = [VREG(typ.) + 1V], IOUT = 10 mA and TA= +25°C, Constant-voltage mode.
8.407
8.405
8.403
8.401
8.399
8.397
8.395
8.393
1.00
0.90
0.80
0.70
0.60
0.50
0.40
MCP73862/4
VSET = VDD
VDD = 9.4V
MCP73862/4
VSET = VDD
VDD = 9.4V
10
100
1000
10
100
1000
Charge Current (mA)
Charge Current (mA)
FIGURE 2-13:
Battery Regulation Voltage
FIGURE 2-16:
Supply Current (ISS) vs.
(VBAT) vs. Charge Current (IOUT).
Charge Current (IOUT).
8.407
1.60
MCP73862/4
VSET = VDD
8.405
1.40
MCP73862/4
VSET = VDD
IOUT = 1000 mA
IOUT = 1000 mA
1.20
8.403
8.401
8.399
8.397
8.395
8.393
1.00
0.80
0.60
0.40
10.0
10.4
10.8
11.2
11.6
12.0
9.0
9.5
10.0
10.5
11.0
11.5
12.0
Supply Voltage (V)
Supply Voltage (V)
FIGURE 2-14:
Battery Regulation Voltage
FIGURE 2-17:
Supply Current (ISS) vs.
(VBAT) vs. Supply Voltage (VDD).
Supply Voltage (VDD).
8.412
1.00
MCP73862/4
MCP73862/4
VSET = VDD
IOUT = 10 mA
8.408
VSET = VDD
8.410
0.90
IOUT = 10 mA
0.80
8.406
8.404
8.402
8.400
8.398
0.70
0.60
0.50
0.40
9.0
9.5
10.0
10.5
11.0
11.5
12.0
9.0
9.5
10.0
10.5 11.0
11.5
12.0
Supply Voltage (V)
Supply Voltage (V)
FIGURE 2-15:
Battery Regulation Voltage
FIGURE 2-18:
Supply Current (ISS) vs.
(VBAT) vs. Supply Voltage (VDD).
Supply Voltage (VDD).
DS21893C-page 8
© 2005 Microchip Technology Inc.
MCP73861/2/3/4
TYPICAL PERFORMANCE CURVES (CONTINUED)
NOTE: Unless otherwise indicated, VDD = [VREG(typ.) + 1V], IOUT = 10 mA and TA= +25°C, Constant-voltage mode.
0.45
0.40
1.60
1.40
1.20
1.00
0.80
0.60
0.40
MCP73862/4
VSET = VDD
IOUT = 10 mA
MCP73862/4
VSET = VDD
+85°C
0.35 VDD = VSS
0.30
+25°C
-40°C
0.25
0.20
0.15
0.10
0.05
0.00
4.0
4.8
5.6
6.4
7.2
8.0
8.8
Ambient Temperature (°C)
Battery Regulation Voltage (V)
FIGURE 2-19:
Output Leakage Current
FIGURE 2-22:
Supply Current (ISS) vs.
(IDISCHARGE) vs. Battery Regulation Voltage
(VBAT).
Ambient Temperature (TA).
8.414
8.410
8.406
8.402
8.398
8.394
8.390
8.386
2.570
MCP73862/4
VSET = VDD
IOUT = 10 mA
MCP73862/4
VSET = VDD
ITHREF = 100 µA
2.560
2.550
2.540
2.530
9.0
9.5
10.0
10.5
11.0
11.5
12.0
Ambient Temperature (°C)
Supply Voltage (V)
FIGURE 2-23:
Battery Regulation Voltage
FIGURE 2-20:
Thermistor Reference
(VBAT) vs. Ambient Temperature (TA).
Voltage (VTHREF) vs. Supply Voltage (VDD).
2.550
2.550
MCP73862/4
MCP73862/4
VSET = VDD
ITHREF = 100 µA
VSET = VDD
2.548
2.546
2.542
2.538
2.534
2.530
2.546
2.544
2.542
2.540
0
25
50
75 100 125 150 175 200
Thermistor Bias Current (µA)
Ambient Temperature (°C)
FIGURE 2-24:
Thermistor Reference
FIGURE 2-21:
Thermistor Reference
Voltage (VTHREF) vs. Ambient Temperature (TA).
Voltage (VTHREF) vs. Thermistor Bias Current
(ITHREF).
© 2005 Microchip Technology Inc.
DS21893C-page 9
MCP73861/2/3/4
TYPICAL PERFORMANCE CURVES (CONTINUED)
NOTE: Unless otherwise indicated, VDD = [VREG(typ.) + 1V], IOUT = 10 mA and TA= +25°C, Constant-voltage mode.
VDD
VDD
VBAT
VBAT
MCP73861
MCP73861
V
I
Stepped from 5.2V to 6.2V
= 500 mA
V
I
Stepped from 5.2V to 6.2V
= 10 mA
DD
DD
OUT
OUT
C
= 10 µF, X7R, Ceramic
C
= 10 µF, X7R, Ceramic
OUT
OUT
FIGURE 2-25:
Line Transient Response.
FIGURE 2-28:
Line Transient Response.
MCP73861
MCP73861
V
5.2V
V
5.2V
DD
DD
C
= 10 µF, X7R, Ceramic
C
= 10 µF, X7R, Ceramic
VBAT
OUT
OUT
VBAT
100 mA
10 mA
500 mA
10 mA
IOUT
IOUT
FIGURE 2-26:
Load Transient Response.
FIGURE 2-29:
Load Transient Response.
0
-10
-20
-30
-40
-50
-60
-70
0
MCP73861
-10 VDD = 5.2V
V
AC = 100 mVp-p
-20
IOUT = 10 mA
-30 COUT = 10 μF, Ceramic
-40
-50
-60
-70
-80
MCP73861
VDD = 5.2V
VAC = 100 mVp-p
IOUT = 100 mA
COUT = 10 μF, X7R, Ceramic
-80
0.01
0.1
1
10
100
1000
0.01
0.1
1
10
100
1000
Frequency (kHz)
Frequency (kHz)
FIGURE 2-27:
Power Supply Ripple
FIGURE 2-30:
Power Supply Ripple
Rejection.
Rejection.
DS21893C-page 10
© 2005 Microchip Technology Inc.
MCP73861/2/3/4
TYPICAL PERFORMANCE CURVES (CONTINUED)
NOTE: Unless otherwise indicated, VDD = [VREG(typ.) + 1V], IOUT = 10 mA and TA= +25°C, Constant-voltage mode.
1200
1000
800
600
400
200
0
505
503
501
499
497
495
493
MCP73861/2/3/4
SET = VDD
MCP73861/2/3/4
VSET = VDD
V
RPROG = 1.6 k:
OPEN
4.8k
1.6k
536
0
Ambient Temperature (°C)
Programming Resistor (: )
FIGURE 2-31:
Charge Current (IOUT) vs.
FIGURE 2-32:
Charge Current (IOUT) vs.
Programming Resistor (RPROG).
Ambient Temperature (TA).
© 2005 Microchip Technology Inc.
DS21893C-page 11
MCP73861/2/3/4
3.0
PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin No.
PIN FUNCTION TABLES
Symbol
Function
QFN
SOIC
1
2
3
4
V
V
V
V
Voltage Regulation Selection
Battery Management Input Supply
Battery Management Input Supply
Battery Management 0V Reference
Current Regulation Set
SET
DD1
DD2
SS1
3
5
4
6
5
7
PROG
THREF
THERM
TIMER
6
8
Cell Temperature Sensor Bias
Cell Temperature Sensor Input
Timer Set
7
9
8
10
11
12
13
14
15
16
1
9
V
Battery Management 0V Reference
Battery Charge Control Output
Battery Charge Control Output
Battery Voltage Sense
SS3
10
11
12
13
14
15
16
V
V
V
BAT1
BAT2
BAT3
V
Battery Management 0V Reference
Logic Enable
SS2
EN
STAT2
STAT1
Fault Status Output
2
Charge Status Output
3.1
Voltage Regulation Selection
(V
3.7
Timer Set
)
All safety timers are scaled by CTIMER/0.1 µF.
SET
MCP73861/3: Connect VSET to VSS for 4.1V regulation
voltage, connect to VDD for 4.2V regulation voltage.
MCP73862/4: Connect VSET to VSS for 8.2V regulation
voltage, connect to VDD for 8.4V regulation voltage.
3.8
Battery Charge Control Output
(V , V
)
BAT2
BAT1
Connect to positive terminal of battery. Drain terminal
of internal P-channel MOSFET pass transistor. Bypass
to VSS with a minimum of 4.7 µF to ensure loop stability
when the battery is disconnected.
3.2
Battery Management Input Supply
(V , V
)
DD1
DD2
A supply voltage of [VREG (typ.) + 0.3V] to 12V is
recommended. Bypass to VSS with a minimum of
4.7 µF.
3.9
Battery Voltage Sense (V
)
BAT3
VBAT3 is a voltage sense input. Connect to positive
terminal of battery. A precision internal resistor divider
regulates the final voltage on this pin to VREG
3.3
Battery Management 0V Reference
(V , V , V
.
)
SS3
SS1
SS2
3.10 Logic Enable (EN)
Connect to negative terminal of battery and input
supply.
EN is an input to force charge termination, initiate
charge, clear faults or disable automatic recharge.
3.4
Current Regulation Set (PROG)
3.11 Fault Status Output (STAT2)
Preconditioning, fast and termination currents are
scaled by placing a resistor from PROG to VSS
STAT2 is a current-limited, open-drain drive for direct
connection to a LED for charge status indication.
Alternatively, a pull-up resistor can be applied for
interfacing to a host microcontroller.
.
3.5
Cell Temperature Sensor Bias
(THREF)
THREF is a voltage reference to bias external
thermistor for continuous cell temperature monitoring
and prequalification.
3.12 Charge Status Output (STAT1)
STAT1 is a current-limited, open-drain drive for direct
connection to a LED for charge status indication.
Alternatively, a pull-up resistor can be applied for
interfacing to a host microcontroller.
3.6
Cell Temperature Sensor Input
(THERM)
THERM is an input for an external thermistor for contin-
uous cell-temperature monitoring and prequalification.
Connect to THREF/3 to disable temperature sensing.
DS21893C-page 12
© 2005 Microchip Technology Inc.
MCP73861/2/3/4
4.0
DEVICE OVERVIEW
The MCP7386X family of devices are highly advanced
linear charge management controllers. Refer to the
functional block diagram. Figure 4-2 depicts the
operational flow algorithm from charge initiation to
completion and automatic recharge.
MCP73862/4 regulate to 4.1V and 8.2V, respectively.
With VSET tied to VDD
, the MCP73861/3 and
MCP73862/4 regulate to 4.2V and 8.4V, respectively.
4.4
Charge Cycle Completion and
Automatic Re-Charge
4.1
Charge Qualification and
Preconditioning
The MCP7386X monitors the charging current during
the Constant-voltage regulation mode. The charge
cycle is considered complete when the charge current
has diminished below approximately 8% of the
regulation current (IREG), or the elapsed timer has
expired.
Upon insertion of a battery, or application of an external
supply, the MCP7386X family of devices automatically
performs a series of safety checks to qualify the
charge. The input source voltage must be above the
Undervoltage Lockout (UVLO) threshold, the enable
pin must be above the logic-high level and the cell
temperature must be within the upper and lower
thresholds. The qualification parameters are
continuously monitored. Deviation beyond the limits
automatically suspends or terminates the charge cycle.
The input voltage must deviate below the UVLO stop
threshold for at least one clock period to be considered
valid.
The MCP7386X automatically begins a new charge
cycle when the battery voltage falls below the recharge
threshold (VRTH), assuming all the qualification
parameters are met.
4.5
Thermal Regulation
The MCP7386X family limits the charge current based
on the die temperature. Thermal regulation optimizes
the charge cycle time while maintaining device reliabil-
ity. If thermal regulation is entered, the timer is automat-
ically slowed down to ensure that a charge cycle will
not terminate prematurely. Figure 4-1 depicts the
thermal regulation profile.
Once the qualification parameters have been met, the
MCP7386X initiates a charge cycle. The charge status
output is pulled low throughout the charge cycle (see
Table 5-1 for charge status outputs). If the battery
voltage is below the preconditioning threshold (VPTH),
the MCP7386X preconditions the battery with a trickle-
charge. The preconditioning current is set to approxi-
mately 10% of the fast charge regulation current. The
preconditioning trickle-charge safely replenishes
deeply depleted cells and minimizes heat dissipation
during the initial charge cycle. If the battery voltage has
not exceeded the preconditioning threshold before the
preconditioning timer has expired, a fault is indicated
and the charge cycle is terminated.
1400
1200
1000
800
Maximum
Minimum
600
400
200
0
4.2
Constant Current Regulation –
Fast Charge
0
20
40
60
80
100
120
140
Die Temperature (° C)
Preconditioning ends, and fast charging begins, when
the battery voltage exceeds the preconditioning thresh-
old. Fast charge regulates to a constant current (IREG),
which is set via an external resistor connected to the
PROG pin. Fast charge continues until the battery
voltage reaches the regulation voltage (VREG), or the
fast charge timer expires; in which case, a fault is
indicated and the charge cycle is terminated.
FIGURE 4-1:
Current vs. Die Temperature.
Typical Maximum Charge
4.6
Thermal Shutdown
The MCP7386X family suspends charge if the die
temperature exceeds 155°C. Charging will resume
when the die temperature has cooled by approximately
10°C. The thermal shutdown is a secondary safety
feature in the event that there is a failure within the
thermal regulation circuitry.
4.3
Constant Voltage Regulation
When the battery voltage reaches the regulation
voltage (VREG), constant voltage regulation begins.
The MCP7386X monitors the battery voltage at the
VBAT pin. This input is tied directly to the positive
terminal of the battery. The MCP7386X selects the
voltage regulation value based on the state of VSET
.
With VSET tied to VSS the MCP73861/3 and
,
© 2005 Microchip Technology Inc.
DS21893C-page 13
MCP73861/2/3/4
FIGURE 4-2:
Operational Flow Algorithm.
DS21893C-page 14
© 2005 Microchip Technology Inc.
MCP73861/2/3/4
Figure 6-1 depicts a typical application circuit with
connection of the THERM input. The resistor values of
RT1 and RT2 are calculated with the following
equations.
5.0
DETAILED DESCRIPTION
5.1
Analog Circuitry
For NTC thermistors:
5.1.1
BATTERY MANAGEMENT INPUT
SUPPLY (VDD1, VDD2
)
2 × RCOLD × RHOT
----------------------------------------------
RT1
=
=
The VDD input is the input supply to the MCP7386X.
The MCP7386X automatically enters a Power-down
mode if the voltage on the VDD input falls below the
UVLO voltage (VSTOP). This feature prevents draining
the battery pack when the VDD supply is not present.
R
COLD – RHOT
2 × RCOLD × RHOT
----------------------------------------------
COLD – 3 × RHOT
RT2
R
For PTC thermistors:
5.1.2
PROG INPUT
2 × RCOLD × RHOT
----------------------------------------------
Fast charge current regulation can be scaled by placing
a programming resistor (RPROG) from the PROG input
to VSS. Connecting the PROG input to VSS allows for a
maximum fast charge current of 1.2A, typically. The
minimum fast charge current is 100 mA, set by letting
the PROG input float. The following formula calculates
RT1
=
=
R
HOT – RCOLD
2 × RCOLD × RHOT
----------------------------------------------
HOT – 3 × RCOLD
RT2
R
Where:
the value for RPROG
:
RCOLD and RHOT are the thermistor
resistance values at the temperature window
of interest.
13.2 – 11 × IREG
----------------------------------------
12 × IREG – 1.2
RPROG
=
Applying a voltage equal to VTHREF/3 to the THERM
input disables temperature monitoring.
where:
IREG = the desired fast charge current in amps.
5.1.5
TIMER SET INPUT (TIMER)
RPROG = measured in kΩ.
The TIMER input programs the period of the safety
timers by placing a timing capacitor (CTIMER) between
the TIMER input pin and VSS. Three safety timers are
programmed via the timing capacitor.
The preconditioning trickle-charge current and the
charge termination current are scaled to approximately
10% and 8% of IREG, respectively.
The preconditioning safety timer period:
5.1.3
CELL TEMPERATURE SENSOR
BIAS (THREF)
CTIMER
------------------
× 1.0Hours
tPRECON
=
0.1μF
A 2.5V voltage reference is provided to bias an external
thermistor for continuous cell temperature monitoring
and prequalification. A ratio metric window comparison
is performed at threshold levels of VTHREF/2 and
The fast charge safety timer period:
CTIMER
------------------
× 1.5Hours
tFAST
=
VTHREF/4.
0.1μF
5.1.4
CELL TEMPERATURE SENSOR
INPUT (THERM)
The elapsed time termination period:
CTIMER
------------------
× 3.0Hours
tTERM
=
The MCP73861/2/3/4 continuously monitors tempera-
ture by comparing the voltage between the THERM
input and VSS with the upper and lower temperature
0.1μF
The preconditioning timer starts after qualification and
resets when the charge cycle transitions to the fast
charge, Constant-current mode. The fast charge timer
and the elapsed timer start once the MCP7386X
transitions from preconditioning. The fast charge timer
resets when the charge cycle transitions to the
Constant-voltage mode. The elapsed timer will expire
and terminate the charge if the sensed current does not
diminish below the termination threshold.
thresholds.
A
negative or positive temperature
coefficient, NTC or PTC thermistor and an external
voltage-divider typically develop this voltage. The
temperature sensing circuit has its own reference to
which it performs a ratio metric comparison. Therefore,
it is immune to fluctuations in the supply input (VDD).
The temperature-sensing circuit is removed from the
system when VDD is not applied, eliminating additional
discharge of the battery pack.
During thermal regulation, the timer is slowed down
proportional to the charge current.
© 2005 Microchip Technology Inc.
DS21893C-page 15
MCP73861/2/3/4
The flashing rate (1 Hz) is based off a timer capacitor
(CTIMER) of 0.1 µF. The rate will vary based on the
value of the timer capacitor.
5.1.6
BATTERY VOLTAGE SENSE (VBAT3)
The MCP7386X monitors the battery voltage at the
VBAT3 pin. This input is tied directly to the positive
terminal of the battery pack.
During a fault condition, the STAT1 status output will be
off and the STAT2 status output will be on. To recover
from a fault condition, the input voltage must be
removed and then reapplied, or the enable input (EN)
must be de-asserted to a logic-low, then asserted to a
logic-high.
5.1.7
BATTERY CHARGE CONTROL
OUTPUT (VBAT1, VBAT2
)
The battery charge control output is the drain terminal
of an internal P-channel MOSFET. The MCP7386X
provides constant current and voltage regulation to the
battery pack by controlling this MOSFET in the linear
region. The battery charge control output should be
connected to the positive terminal of the battery pack.
When the voltage on the THERM input is outside the
preset window, the charge cycle will not start, or will be
suspended. The charge cycle is not terminated and
recovery is automatic. The charge cycle will resume (or
start) once the THERM input is valid and all other
qualification parameters are met. During an invalid
THERM condition, the STAT1 status output will be off
and the STAT2 status output will flash.
5.2
Digital Circuitry
5.2.1
CHARGE STATUS OUTPUTS
(STAT1,STAT2)
5.2.2
The VSET input selects the regulated output voltage of
the MCP7386X. With VSET tied to VSS the
MCP73861/3 and MCP73862/4 regulate to 4.1V and
8.2V, respectively. With VSET tied to VDD the
VSET INPUT
Two status outputs provide information on the state of
charge. The current-limited, open-drain outputs can be
used to illuminate external LEDs. Optionally, a pull-up
resistor can be used on the output for communication
with a host microcontroller. Table 5-1 summarizes the
state of the status outputs during a charge cycle.
,
,
MCP73861/3 and MCP73862/4 regulate to 4.2V and
8.4V, respectively.
TABLE 5-1:
STATUS OUTPUTS (NOTE)
5.2.3
LOGIC ENABLE (EN)
CHARGE
CYCLE STAT1
STAT1
STAT2
The logic enable input pin (EN) can be used to
terminate a charge at any time during the charge cycle,
as well as to initiate a charge cycle or initiate a recharge
cycle.
Qualification
Off
On
On
Off
Off
Off
Preconditioning
Constant-
Current Fast
Charge
Applying a logic-high input signal to the EN pin, or tying
it to the input source, enables the device. Applying a
logic-low input signal disables the device and termi-
nates a charge cycle. When disabled, the device’s
supply current is reduced to 0.17 µA, typically.
Constant-
Voltage
On
Off
Charge
Complete
Flashing (1 Hz,
50% duty cycle)
(MCP73861/2)
Off
(All Devices)
Off
(MCP73863/4)
Fault
Off
Off
On
THERM Invalid
Flashing (1 Hz,
50% duty cycle)
Disabled –
Sleep mode
Off
Off
Off
Input Voltage
Disconnected
Off
Note:
Off state: Open-drain is high-impedance
On state: Open-drain can sink current
typically 7 mA
Flashing: Toggles between off state and
on state
DS21893C-page 16
© 2005 Microchip Technology Inc.
MCP73861/2/3/4
Constant-current followed by Constant-voltage.
Figure 6-1 depicts a typical stand-alone application
circuit, while Figures 6-2 and 6-3 depict the
accompanying charge profile.
6.0
APPLICATIONS
The MCP7386X is designed to operate in conjunction
with a host microcontroller or in stand-alone applica-
tions. The MCP7386X provides the preferred charge
algorithm for Lithium-Ion and Lithium-Polymer cells
Unregulated
STAT1
EN VSS2
Wall Cube
16 15 14 13
VSET
1
VBAT3
VBAT2
VBAT1
VSS3
12
11
10
9
+
–
Single
Lithium-Ion
Cell
VDD1
2
MCP73861
VDD2
3
4
VSS1
5
6
7
8
PROG
RPROG
TIMER
CTIMER
RT1
RT2
FIGURE 6-1:
Typical Application Circuit.
Preconditioning
Mode
Constant-Current
Mode
Constant-Voltage
Mode
Regulation
Voltage
(V
)
REG
Regulation
Current
(I
)
REG
Charge
Voltage
Transition
Threshold
(V
)
PTH
Precondition
Current
Charge
Current
(I
)
PREG
Termination
Current
(I
)
TERM
Precondition
Safety Timer
Fast Charge
Safety Timer
Elapsed Time
Termination Timer
FIGURE 6-2:
Typical Charge Profile.
© 2005 Microchip Technology Inc.
DS21893C-page 17
MCP73861/2/3/4
Preconditioning
Mode
Constant-Current
Mode
Constant-Voltage
Mode
Regulation
Voltage
(V
)
REG
Regulation
Current
(I
)
REG
Charge
Voltage
Transition
Threshold
(V
)
PTH
Precondition
Current
Charge
Current
(I
)
PREG
Termination
Current
(I
)
TERM
Precondition
Safety Timer
Fast Charge
Safety Timer
Elapsed Time
Termination Timer
FIGURE 6-3:
Typical Charge Profile in Thermal Regulation.
1200 mA is the maximum charge current obtainable
from the MCP7386X. For this situation, the PROG input
6.1 Application Circuit Design
Due to the low efficiency of linear charging, the most
important factors are thermal design and cost, which
are a direct function of the input voltage, output current
and thermal impedance between the battery charger
and the ambient cooling air. The worst-case situation is
when the device has transitioned from the
Preconditioning mode to the Constant-current mode. In
this situation, the battery charger has to dissipate the
maximum power. A trade-off must be made between
the charge current, cost and thermal requirements of
the charger.
should be connected directly to VSS
.
6.1.1.2 Thermal Considerations
The worst-case power dissipation in the battery
charger occurs when the input voltage is at the
maximum and the device has transitioned from the
Preconditioning mode to the Constant-current mode. In
this case, the power dissipation is:
PowerDissipation = (V
– V
) × I
PTHMIN REGMAX
DDMAX
Where:
VDDMAX
IREGMAX
VPTHMIN
6.1.1
COMPONENT SELECTION
=
=
=
the maximum input voltage
Selection of the external components in Figure 6-1 is
crucial to the integrity and reliability of the charging
system. The following discussion is intended as a guide
for the component selection process.
the maximum fast charge current
the minimum transition threshold
voltage
6.1.1.1
Current Programming Resistor
(RPROG
)
The preferred fast charge current for Lithium-Ion cells
is at the 1C rate, with an absolute maximum current at
the 2C rate. For example, a 500 mAh battery pack has
a preferred fast charge current of 500 mA. Charging at
this rate provides the shortest charge cycle times with-
out degradation to the battery pack performance or life.
DS21893C-page 18
© 2005 Microchip Technology Inc.
MCP73861/2/3/4
Power dissipation with a 5V, ±10% input voltage source
is:
6.2
PCB Layout Issues
For optimum voltage regulation, place the battery pack
as close as possible to the device’s VBAT and VSS pins,
recommended to minimize voltage drops along the
high current-carrying PCB traces.
PowerDissipation = (5.5V – 2.7V) × 575mA = 1.61W
With the battery charger mounted on a 1 in2 pad of
1 oz. copper, the junction temperature rise is 60°C,
approximately. This would allow for a maximum operat-
ing ambient temperature of 50°C before thermal
regulation is entered.
If the PCB layout is used as a heatsink, adding many
vias in the heatsink pad can help conduct more heat to
the backplane of the PCB, thus reducing the maximum
junction temperature.
6.1.1.3
External Capacitors
The MCP7386X is stable with or without a battery load.
In order to maintain good AC stability in the Constant-
voltage mode, a minimum capacitance of 4.7 µF is
recommended to bypass the VBAT pin to VSS. This
capacitance provides compensation when there is no
battery load. In addition, the battery and interconnec-
tions appear inductive at high frequencies. These
elements are in the control feedback loop during
Constant-voltage mode. Therefore, the bypass capaci-
tance may be necessary to compensate for the
inductive nature of the battery pack.
Virtually any good quality output filter capacitor can be
used, independent of the capacitor’s minimum
Effective Series Resistance (ESR) value. The actual
value of the capacitor (and its associated ESR)
depends on the output load current. A 4.7 µF ceramic,
tantalum or aluminum electrolytic capacitor at the
output is usually sufficient to ensure stability for up to a
1A output current.
6.1.1.4
Reverse-Blocking Protection
The MCP7386X provides protection from a faulted or
shorted input, or from a reversed-polarity input source.
Without the protection, a faulted or shorted input would
discharge the battery pack through the body diode of
the internal pass transistor.
6.1.1.5
Enable Interface
In the stand-alone configuration, the enable pin is
generally tied to the input voltage. The MCP7386X
automatically enters a Low-power mode when voltage
on the VDD input falls below the UVLO voltage (VSTOP),
reducing the battery drain current to 0.23 µA, typically.
6.1.1.6
Charge Status Interface
Two status outputs provide information on the state of
charge. The current-limited, open-drain outputs can be
used to illuminate external LEDs. Refer to Table 5-1 for
a summary of the state of the status outputs during a
charge cycle.
© 2005 Microchip Technology Inc.
DS21893C-page 19
MCP73861/2/3/4
7.0
7.1
PACKAGING INFORMATION
Package Marking Information
Example:
16-Lead QFN*
16
15
14
13
16
15
14
13
1
2
3
4
12
11
10
9
1
2
3
4
12
11
10
9
XXXXXXXX
XXXXXXXX
YYWW
73861
I/ML
0532
256
NNN
5
6
7
8
5
6
7
8
16-Lead SOIC (150 mil)
Example:
MCP73861
XXXXXXXXXXXXX
XXXXXXXXXXXXX
e
3
I/SL^
YYWWNNN
0532256
Legend: XX...X Customer-specific information
Y
YY
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
WW
NNN
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e
3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
DS21893C-page 20
© 2005 Microchip Technology Inc.
MCP73861/2/3/4
16-Lead Plastic Quad Flat No-Lead Package (ML) 4x4x0.9 mm Body (QFN) – Saw Singulated
D
D2
EXPOSED
METAL
PAD
(NOTE 2)
e
b
E2
E
2
1
n
OPTIONAL
L
TOP VIEW
BOTTOM VIEW
INDEX
AREA
(NOTE 1)
A3
A
A1
Units
Dimension Limits
INCHES
NOM
MILLIMETERS
*
MIN
MAX
MIN
NOM
MAX
n
e
Number of Pins
Pitch
16
16
.026 BSC
.035
.001
.008 REF
0.65 BSC
0.90
0.02
0.20 REF
Overall Height
Standoff
A
A1
A3
E
.031
.039
0.80
1.00
.000
.002
0.00
0.05
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
.152
.090
.152
.090
.010
.012
.157
.104
.157
.104
.012
.016
.163
.106
.163
.106
.014
.020
3.85
2.29
3.85
2.29
0.25
0.30
4.00
2.64
4.00
2.64
0.30
0.40
4.15
2.69
4.15
2.69
0.35
0.50
E2
D
D2
b
L
*
Controlling Parameter
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2.
Exposed pad varies according to die attach paddle size.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC equivalent: M0-220
Drawing No. C04-127
Revised 07-21-05
© 2005 Microchip Technology Inc.
DS21893C-page 21
MCP73861/2/3/4
16-Lead Plastic Small Outline (SL) – Narrow 150 mil Body (SOIC)
E
E1
p
D
2
B
n
1
α
h
45°
c
A2
A
φ
L
A1
β
Units
INCHES*
NOM
16
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
16
MAX
n
p
Number of Pins
Pitch
.050
1.27
Overall Height
A
.053
.061
.057
.007
.237
.154
.390
.015
.033
4
.069
1.35
1.55
1.44
0.18
6.02
3.90
9.91
0.38
0.84
4
1.75
1.55
0.25
6.20
3.99
10.01
0.51
1.27
8
Molded Package Thickness
A2
A1
E
.052
.004
.228
.150
.386
.010
.016
0
.061
.010
.244
.157
.394
.020
.050
8
1.32
0.10
5.79
3.81
9.80
0.25
0.41
0
Standoff
§
Overall Width
Molded Package Width
Overall Length
E1
D
Chamfer Distance
Foot Length
h
L
φ
Foot Angle
c
Lead Thickness
Lead Width
.008
.013
0
.009
.017
12
.010
.020
15
0.20
0.33
0
0.23
0.42
12
0.25
0.51
15
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
0
12
15
0
12
15
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-108
DS21893C-page 22
© 2005 Microchip Technology Inc.
MCP73861/2/3/4
APPENDIX A: REVISION HISTORY
Revision C (August 2005)
The following is the list of modifications:
1. Added MCP73863 and MCP73864 devices
throughout data sheet.
2. Added Appendix A: Revision History.
3. Updated QFN and SOIC package diagrams.
Revision B (December 2004)
• Added SOIC package throughout data sheet.
Revision A (June 2004)
• Original Release of this Document.
© 2005 Microchip Technology Inc.
DS21893C-page 23
MCP73861/2/3/4
NOTES:
DS21893C-page 24
© 2005 Microchip Technology Inc.
MCP73861/2/3/4
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X
XX
a)
b)
MCP73861-I/ML: Single-Cell Controller
16LD-QFN package.
MCP73861T-I/ML: Tape and Reel,
Temperature Package
Range
Single-Cell Controller
16LD-QFN package.
Single-Cell Controller
16LD-SOIC package.
c)
d)
MCP73861-I/SL:
Device
MCP73861:
Single-Cell Charge Controller with
Temperature Monitor
MCP73861T-I/SL: Tape and Reel,
Single-Cell Controller
MCP73861T: Single-Cell Charge Controller with
Temperature Monitor, Tape and Reel
MCP73862:
16LD-SOIC package.
Dual Series Cells Charge Controller with
Temperature Monitor
MCP73862T: Dual Series Cells Charge Controller with
Temperature Monitor, Tape and Reel
a)
b)
MCP73862-I/ML: Dual-Cell Controller
16LD-QFN package.
MCP73862T-I/ML: Tape and Reel,
Dual-Cell Controller
MCP73863:
Single-cell Charge Controller with
Temperature Monitor
MCP73863T: Single-Cell Charge Controller with
Temperature Monitor, Tape and Reel
16LD-QFN package.
c)
d)
MCP73862-I/SL:
Dual-Cell Controller
16LD-SOIC package.
MCP73864:
Dual Series Cells Charge Controller with
Temperature Monitor
MCP73862T-I/SL: Tape and Reel,
Dual-Cell Controller
MCP73864T: Dual Series Cells Charge Controller with
Temperature Monitor, Tape and Reel
16LD-SOIC package.
Temperature Range
Packages
I
= -40°C to +85°C (Industrial)
a)
b)
MCP73863-I/ML: Single-Cell Controller
16LD-QFN package.
MCP73863T-I/ML: Tape and Reel,
Single-Cell Controller
ML
SL
=
Plastic Quad Flat No Lead, 4x4 mm Body (QFN),
16-lead
16LD-QFN package.
=
Plastic Small Outline, 150 mm Body (SOIC),
16-lead
c)
d)
MCP73863-I/SL:
Single-Cell Controller
16LD-SOIC package.
MCP73863T-I/SL: Tape and Reel,
Single-Cell Controller
16LD-SOIC package.
a)
b)
MCP73864-I/ML: Dual-Cell Controller
16LD-QFN package.
MCP73864T-I/ML: Tape and Reel,
Dual-Cell Controller
16LD-QFN package.
c)
d)
MCP73864-I/SL:
Dual-Cell Controller
16LD-SOIC package.
MCP73864T-I/SL: Tape and Reel,
Dual-Cell Controller
16LD-SOIC package.
© 2005 Microchip Technology Inc.
DS21893C-page 25
MCP73861/2/3/4
NOTES:
DS21893C-page 26
© 2005 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR WAR-
RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION, INCLUDING BUT NOT
LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and
its use. Use of Microchip’s products as critical components in
life support systems is not authorized except with express
written approval by Microchip. No licenses are conveyed,
implicitly or otherwise, under any Microchip intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro,
PICSTART, PRO MATE, PowerSmart, rfPIC, and
SmartShunt are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
PICMASTER, SEEVAL, SmartSensor and The Embedded
Control Solutions Company are registered trademarks of
Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Linear Active Thermistor,
MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM,
PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo,
PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode,
Smart Serial, SmartTel, Total Endurance and WiperLock are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2005, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2005 Microchip Technology Inc.
DS21893C-page 27
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
India - Bangalore
Tel: 91-80-2229-0061
Fax: 91-80-2229-0062
Austria - Weis
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-5160-8631
Fax: 91-11-5160-8632
China - Chengdu
Tel: 86-28-8676-6200
Fax: 86-28-8676-6599
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Atlanta
China - Fuzhou
Tel: 86-591-8750-3506
Fax: 86-591-8750-3521
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Alpharetta, GA
Tel: 770-640-0034
Fax: 770-640-0307
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Korea - Gumi
Tel: 82-54-473-4301
Fax: 82-54-473-4302
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-352-30-52
Fax: 34-91-352-11-47
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Malaysia - Penang
Tel: 604-646-8870
Fax: 604-646-5086
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Philippines - Manila
Tel: 632-634-9065
Fax: 632-634-9069
China - Shenzhen
Detroit
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
San Jose
Mountain View, CA
Tel: 650-215-1444
Fax: 650-961-0286
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
08/24/05
DS21893C-page 28
© 2005 Microchip Technology Inc.
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