MCP73831T-5ADI/MC [MICROCHIP]
Miniature Single-Cell, Fully Integrated Li-Ion, Li-Polymer Charge Management Controllers; 微型单细胞，完全集成的锂离子电池，锂聚合物充电管理控制器
| 型号： | MCP73831T-5ADI/MC |
| 厂家： | 
MICROCHIP |
| 描述： | Miniature Single-Cell, Fully Integrated Li-Ion, Li-Polymer Charge Management Controllers |
| 文件： | 总24页 (文件大小：679K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MCP73831/2
Miniature Single-Cell, Fully Integrated Li-Ion,
Li-Polymer Charge Management Controllers
Features:
Description:
• Linear Charge Management Controller:
- Integrated Pass Transistor
- Integrated Current Sense
The MCP73831/2 devices are highly advanced linear
charge management controllers for use in space-lim-
ited, cost-sensitive applications. The MCP73831/2 are
available in an 8-Lead, 2 mm x 3 mm DFN package or
a 5-Lead, SOT23 package. Along with their small
physical size, the low number of external components
required make the MCP73831/2 ideally suited for por-
table applications. For applications charging from a
USB port, the MCP73831/2 adhere to all the
specifications governing the USB power bus.
- Reverse Discharge Protection
• High Accuracy Preset Voltage Regulation: + 0.75%
• Four Voltage Regulation Options:
- 4.20V, 4.35V, 4.40V, 4.50V
• Programmable Charge Current
• Selectable Preconditioning
• Selectable End-of-Charge Control
• Charge Status Output
The MCP73831/2 employ a constant-current/constant-
voltage charge algorithm with selectable precondition-
ing and charge termination. The constant voltage
regulation is fixed with four available options: 4.20V,
4.35V, 4.40V or 4.50V, to accommodate new, emerg-
ing battery charging requirements. The constant cur-
rent value is set with one external resistor. The
MCP73831/2 devices limit the charge current based
on die temperature during high power or high ambient
conditions. This thermal regulation optimizes the
charge cycle time while maintaining device reliability.
- Tri-State Output - MCP73831
- Open-Drain Output - MCP73832
• Automatic Power-Down
• Thermal Regulation
• Temperature Range: -40°C to +85°C
• Packaging:
- 8-Lead, 2 mm x 3 mm DFN
- 5-Lead, SOT23
Several options are available for the preconditioning
threshold, preconditioning current value, charge termi-
nation value and automatic recharge threshold. The
preconditioning value and charge termination value
are set as a ratio, or percentage, of the programmed
constant current value. Preconditioning can be dis-
abled. Refer to Section 1.0 “Electrical Characteris-
tics” for available options and the “Product
Identification System” for standard options.
Applications:
• Lithium-Ion/Lithium-Polymer Battery Chargers
• Personal Data Assistants
• Cellular Telephones
• Digital Cameras
• MP3 Players
• Bluetooth Headsets
The MCP73831/2 devices are fully specified over the
ambient temperature range of -40°C to +85°C.
• USB Chargers
Package Types
Typical Application
500 mA Li-Ion Battery Charger
8-Lead DFN
V
IN
(2 mm x 3 mm)
SOT23-5
4
3
V
V
BAT
DD
+
-
Single
Li-Ion
Cell
4.7 μF
V
4.7 μF
PROG
8
7
6
5
1
2
3
4
DD
DD
STAT 1
5 PROG
V
NC
V
2
5
V
SS
PROG
3
4
V
V
V
V
BAT
DD
BAT
BAT
SS
470Ω
2 kΩ
STAT
1
2
V
STAT
SS
MCP73831
© 2006 Microchip Technology Inc.
DS21984B-page 1
MCP73831/2
Functional Block Diagram
VDD
6 mA
DIRECTION
CONTROL
VBAT
G=0.001
6 mA
0.5 mA
PROG
CA
+
-
MCP73831
ONLY
REFERENCE
GENERATOR
43.6 kΩ
V
VREF(1.22V)
361 kΩ
89 kΩ
3.9 kΩ
DD
+
-
PRECONDITION
182.3 kΩ
15 kΩ
111 kΩ
+
-
STAT
TERMINATION
+
-
7 kΩ
CHARGE
VA
+
-
190 kΩ
111 kΩ
+
-
SHDN
0.5 mA
DIRECTION
CONTROL
+
-
VBAT
477 kΩ
255 kΩ
+
-
UVLO
100 kΩ
VSS
DS21984B-page 2
© 2006 Microchip Technology Inc.
MCP73831/2
†
Notice: Stresses above those listed under
1.0
ELECTRICAL
CHARACTERISTICS
“Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only and functional
operation of the device at those or any other
conditions above those indicated in the operational
listings of this specification is not implied. Exposure to
maximum rating conditions for extended periods may
affect device reliability.
Absolute Maximum Ratings†
V
...................................................................................7.0V
DD
All Inputs and Outputs w.r.t. V ............... -0.3 to (V +0.3)V
SS
DD
Maximum Junction Temperature, T ............Internally Limited
J
Storage temperature .....................................-65°C to +150°C
ESD protection on all pins:
Human Body Model (1.5 kΩ in Series with 100 pF).......≥ 4 kV
Machine Model (200 pF, No Series Resistance).............400V
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for V = [V
(typ.) + 0.3V] to 6V, T = -40°C to +85°C.
A
DD
REG
Typical values are at +25°C, V = [V
(typ.) + 1.0V]
DD
REG
Parameters
Supply Input
Sym.
Min.
Typ.
Max.
Units
Conditions
Supply Voltage
Supply Current
V
I
3.75
—
—
510
53
6
V
DD
1500
200
μA
μA
Charging
SS
—
Charge Complete,
No Battery
—
—
25
1
50
5
μA
μA
μA
V
PROG Floating
V
V
V
V
< (V
- 50 mV)
BAT
DD
DD
DD
DD
—
0.1
3.45
3.38
70
2
< V
STOP
UVLO Start Threshold
UVLO Stop Threshold
UVLO Hysteresis
V
3.3
3.2
—
3.6
3.5
—
Low-to-High
High-to-Low
START
V
V
STOP
V
mV
HYS
Voltage Regulation (Constant-Voltage Mode)
Regulated Output Voltage
V
4.168
4.317
4.367
4.466
4.20
4.35
4.40
4.50
4.232
4.383
4.433
4.534
V
V
V
V
MCP7383X-2
MCP7383X-3
MCP7383X-4
MCP7383X-5
REG
V
= [V
(Typ)+1V]
REG
DD
I
= 10 mA
OUT
T
= -5°C to +55°C
A
Line Regulation
|(ΔV
)/ΔV
/V
—
—
0.09
0.05
0.30
0.30
%/V
%
V
I
= [V
= 10 mA
(Typ)+1V] to 6V
REG
BAT BAT
DD
|
DD
OUT
Load Regulation
|ΔV
/V
|
I
= 10 mA to 50 mA
BAT BAT
OUT
V
= [V
(Typ)+1V]
DD
OUT
OUT
OUT
REG
Supply Ripple Attenuation
PSRR
—
—
—
52
47
22
—-
—
dB
dB
dB
I
I
I
=10 mA, 10Hz to 1 kHz
=10 mA, 10Hz to 10 kHz
=10 mA, 10Hz to 1 MHz
—
Current Regulation (Fast Charge Constant-Current Mode)
Fast Charge Current
Regulation
I
90
100
505
110
550
mA PROG = 10 kΩ
REG
450
mA PROG = 2.0 kΩ, Note 1
T
= -5°C to +55°C
A
Note 1: Not production tested. Ensured by design.
© 2006 Microchip Technology Inc.
DS21984B-page 3
MCP73831/2
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits apply for V = [V
(typ.) + 0.3V] to 6V, T = -40°C to +85°C.
A
DD
REG
Typical values are at +25°C, V = [V
(typ.) + 1.0V]
DD
REG
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Preconditioning Current Regulation (Trickle Charge Constant-Current Mode)
Precondition Current
Ratio
I
/ I
7.5
15
30
—
10
20
12.5
25
%
%
%
%
PROG = 2.0 kΩ to 10 kΩ
PROG = 2.0 kΩ to 10 kΩ
PROG = 2.0 kΩ to 10 kΩ
No Preconditioning
PREG REG
40
50
100
—
T
= -5°C to +55°C
A
Precondition Voltage
Threshold Ratio
V
I
/ V
64
69
—
66.5
71.5
110
69
74
—
%
%
V
V
V
Low-to-High
Low-to-High
High-to-Low
PTH
REG
BAT
BAT
BAT
Precondition Hysteresis
V
mV
PHYS
Charge Termination
Charge Termination
Current Ratio
/ I
3.75
5.6
7.5
15
5
6.25
9.4
%
%
%
%
PROG = 2.0 kΩ to 10 kΩ
PROG = 2.0 kΩ to 10 kΩ
PROG = 2.0 kΩ to 10 kΩ
PROG = 2.0 kΩ to 10 kΩ
TERM REG
7.5
10
20
12.5
25
T
= -5°C to +55°C
A
Automatic Recharge
Recharge Voltage
Threshold Ratio
V
/ V
91.5
94
94.0
96.5
96.5
99
%
%
V
V
High-to-Low
High-to-Low
RTH
REG
BAT
BAT
Pass Transistor ON-Resistance
ON-Resistance
R
—
350
—
mΩ
V
= 3.75V, T = 105°C
DSON
DD
J
Battery Discharge Current
Output Reverse Leakage
Current
I
—
—
—
—
0.15
0.25
0.15
-5.5
2
2
μA
μA
μA
μA
PROG Floating
DISCHARGE
V
V
Floating
DD
DD
2
< V
STOP
-15
Charge Complete
Status Indicator – STAT
Sink Current
I
—
—
—
—
—
—
0.4
—
25
1
mA
V
SINK
Low Output Voltage
Source Current
V
I
I
= 4 mA
SINK
OL
SOURCE
I
35
mA
V
High Output Voltage
Input Leakage Current
PROG Input
V
I
V
-0.4
V
- 1
= 4 mA (MCP73831)
SOURCE
OH
DD
DD
0.03
1
μA
High-Impedance
LK
Charge Impedance
Range
R
R
2
—
—
20
kΩ
kΩ
PROG
PROG
Minimum Shutdown
Impedance
70
200
Automatic Power Down
Automatic Power Down
Entry Threshold
V
V
<(V
+20mV)
V
V
<(V
+50mV)
—
3.5V ≤ V
≤ V
≤ V
PDENTER
DD
BAT
DD
BAT
BAT
REG
V
Falling
DD
Automatic Power Down
Exit Threshold
V
—
<(V
V
<(V
+200mV)
3.5V ≤ V
BAT
PDEXIT
DD
BAT
DD
BAT
REG
+150mV)
V
Rising
DD
Thermal Shutdown
Die Temperature
T
—
—
150
10
—
—
°C
°C
SD
Die Temperature
Hysteresis
T
SDHYS
Note 1: Not production tested. Ensured by design.
DS21984B-page 4
© 2006 Microchip Technology Inc.
MCP73831/2
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (typ.) + 0.3V] to 12V,
TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG (typ.) + 1.0V]
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
VDD Low-to-High
UVLO Start Delay
tSTART
—
—
5
ms
Constant-Current Regulation
Transition Time Out of
Preconditioning
tDELAY
tRISE
—
—
—
—
1
ms
ms
ms
ms
VBAT < VPTH to VBAT > VPTH
IOUT Rising to 90% of IREG
Average IOUT Falling
Average VBAT
Current Rise Time Out of
Preconditioning
1
Termination Comparator
Filter
tTERM
0.4
0.4
1.3
1.3
3.2
3.2
Charge Comparator Filter
Status Indicator
tCHARGE
Status Output turn-off
Status Output turn-on
tOFF
tON
—
—
—
—
200
200
μs
μs
ISINK = 1 mA to 0 mA
ISINK = 0 mA to 1 mA
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (typ.) + 0.3V] to 12V.
Typical values are at +25°C, VDD = [VREG (typ.) + 1.0V]
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Temperature Ranges
Specified Temperature Range
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistances
5-Lead, SOT23
TA
TJ
TA
-40
-40
-65
—
—
—
+85
+125
+150
°C
°C
°C
θJA
θJA
—
—
230
76
—
—
°C/W 4-Layer JC51-7 Standard
Board, Natural Convection
8-Lead, 2 mm x 3 mm, DFN
°C/W 4-Layer JC51-7 Standard
Board, Natural Convection
© 2006 Microchip Technology Inc.
DS21984B-page 5
MCP73831/2
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
NOTE: Unless otherwise indicated, VDD = [VREG(typ.) + 1V], IOUT = 10 mA and TA= +25°C, Constant-Voltage mode.
550
500
450
400
350
300
250
200
150
100
50
4.210
4.205
4.200
4.195
4.190
4.185
4.180
4.175
4.170
MCP73831-2
IOUT = 10 mA
IOUT = 100 mA
IOUT = 450 mA
0
2
4
6
8
10 12 14 16 18 20
4.50
4.75 5.00 5.25
5.50
5.75 6.00
Programming Resistor (kΩ)
Supply Voltage (V)
FIGURE 2-1:
Battery Regulation Voltage
FIGURE 2-4:
Charge Current (IOUT) vs.
(VBAT) vs. Supply Voltage (VDD).
Programming Resistor (RPROG).
4.210
104
103
102
101
100
99
RPROG = 10 kΩ
MCP73831-2
4.205
IOUT = 10 mA
4.200
4.195
4.190
4.185
4.180
4.175
4.170
IOUT = 100 mA
IOUT = 450 mA
98
97
96
4.50
4.75
5.00
5.25
5.50
5.75
6.00
Supply Voltage (V)
Ambient Temperature (°C)
FIGURE 2-2:
Battery Regulation Voltage
FIGURE 2-5:
Charge Current (IOUT) vs.
(VBAT) vs. Ambient Temperature (TA).
Supply Voltage (VDD).
516
514
512
510
508
506
504
502
500
0.40
RPROG = 2 kΩ
0.35
+85°C
0.30
-40°C
0.25
0.20
+25°C
0.15
0.10
0.05
0.00
4.50
4.75
5.00
5.25
5.50
5.75
6.00
3.00
3.20
3.40
3.60
3.80
4.00
4.20
Battery Regulation Voltage (V)
Supply Voltage (V)
FIGURE 2-3:
Output Leakage Current
FIGURE 2-6:
Charge Current (IOUT) vs.
(IDISCHARGE) vs. Battery Regulation Voltage
Supply Voltage (VDD).
(VBAT).
DS21984B-page 6
© 2006 Microchip Technology Inc.
MCP73831/2
TYPICAL PERFORMANCE CURVES (CONTINUED)
NOTE: Unless otherwise indicated, VDD = [VREG(typ.) + 1V], IOUT = 10 mA and TA= +25°C, Constant-Voltage mode.
104
103
102
101
100
99
525
450
375
300
225
150
75
RPROG = 10 kΩ
RPROG = 2 kΩ
98
97
0
96
Ambient Temperature (°C)
Junction Temperature (°C)
FIGURE 2-7:
Charge Current (IOUT) vs.
FIGURE 2-10:
Charge Current (IOUT) vs.
Ambient Temperature (TA).
Junction Temperature (TJ).
516
514
512
510
508
506
504
502
500
0
VAC = 100 mVp-p
IOUT = 10 mA
RPROG = 2 kΩ
-10
COUT = 4.7 µF, X7R Ceramic
-20
-30
-40
-50
-60
0.01
0.1
1
10
100
1000
Ambient Temperature (°C)
Frequency (kHz)
FIGURE 2-8:
Charge Current (IOUT) vs.
FIGURE 2-11:
Power Supply Ripple
Ambient Temperature (TA).
Rejection (PSRR).
120
105
90
75
60
45
30
15
0
0
VAC = 100 mVp-p
IOUT = 100 mA
COUT = 4.7 µF, X7R Ceramic
RPROG = 10 kΩ
-10
-20
-30
-40
-50
-60
0.01
0.1
1
10
100
1000
Junction Temperature (°C)
Frequency (kHz)
FIGURE 2-9:
Junction Temperature (TJ).
Charge Current (IOUT) vs.
FIGURE 2-12:
Rejection (PSRR).
Power Supply Ripple
© 2006 Microchip Technology Inc.
DS21984B-page 7
MCP73831/2
TYPICAL PERFORMANCE CURVES (CONTINUED)
NOTE: Unless otherwise indicated, VDD = [VREG(typ.) + 1V], IOUT = 10 mA and TA= +25°C, Constant-Voltage mode.
14
12
10
8
0.10
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
-0.20
0.10
0.05
0.05
0.00
0.00
-0.05
-0.10
-0.15
-0.20
-0.25
-0.30
-0.05
-0.10
-0.15
-0.20
-0.25
-0.30
6
4
2
IOUT = 10 mA
COUT = 4.7 µF, X7R Ceramic
0
COUT = 4.7 µF, X7R Ceramic
Time (µs)
-2
Time (µs)
FIGURE 2-13:
Line Transient Response.
FIGURE 2-16:
Load Transient Response.
14
12
10
8
0.10
6.0
5.0
4.0
3.0
2.0
120
100
80
0.05
0.00
-0.05
-0.10
-0.15
-0.20
6
60
4
40
MCP73831-2AC/IOT
DD = 5.2V
RPROG = 10 kΩ
2
IOUT = 100 mA
COUT = 4.7 µF, X7R Ceramic
V
1.0
0.0
20
0
-0.25
-0.30
0
-2
Time (minutes)
Time (µs)
FIGURE 2-14:
Line Transient Response.
FIGURE 2-17:
Complete Charge Cycle
(180 mAh Li-Ion Battery).
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
-0.05
0.04
6.0
5.0
4.0
3.0
600
500
400
300
200
100
0
0.02
0.00
-0.02
-0.04
-0.06
-0.08
-0.10
2.0
MCP73831-2AC/IOT
VDD = 5.2V
1.0
0.0
COUT = 4.7 µF, X7R Ceramic
RPROG = 2 kΩ
-0.12
Time (µs)
Time (minutes)
FIGURE 2-15:
Load Transient Response.
FIGURE 2-18:
Complete Charge Cycle
(1000 mAh Li-Ion Battery).
DS21984B-page 8
© 2006 Microchip Technology Inc.
MCP73831/2
3.0
PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLES
Pin No.
Symbol
Function
DFN
SOT23-5
1
2
3
4
5
6
7
8
4
—
3
V
V
Battery Management Input Supply
Battery Management Input Supply
Battery Charge Control Output
Battery Charge Control Output
Charge Status Output
DD
DD
V
V
BAT
BAT
—
1
STAT
2
V
Battery Management 0V Reference
No Connection
SS
—
5
NC
PROG
Current Regulation Set and Charge Control Enable
3.1
Battery Management Input Supply
(V
3.4
Battery Management 0V Reference
(V
)
)
SS
DD
A supply voltage of [VREG (typ.) + 0.3V] to 6V is
recommended. Bypass to VSS with a minimum of
4.7 μF.
Connect to negative terminal of battery and input
supply.
3.5
Current Regulation Set (PROG)
3.2
Battery Charge Control Output
(V
Preconditioning, fast charge and termination currents
are scaled by placing a resistor from PROG to VSS
)
BAT
.
Connect to positive terminal of battery. Drain terminal
of internal P-channel MOSFET pass transistor. Bypass
to VSS with a minimum of 4.7 μF to ensure loop
stability when the battery is disconnected.
The charge management controller can be disabled by
allowing the PROG input to float.
3.3
Charge Status Output (STAT)
STAT is an output for connection to an LED for charge
status indication. Alternatively, a pull-up resistor can
be applied for interfacing to a host microcontroller.
STAT is a tri-state logic output on the MCP73831 and
an open-drain output on the MCP73832.
© 2006 Microchip Technology Inc.
DS21984B-page 9
MCP73831/2
4.0
DEVICE OVERVIEW
The MCP73831/2 are highly advanced linear charge
management controllers. Figure 4-1 depicts the
operational flow algorithm from charge initiation to
completion and automatic recharge.
The UVLO circuit places the device in Shutdown mode
if the input supply falls to within +50 mV of the battery
voltage. Again, the input supply must rise to a level
150 mV above the battery voltage before the
MCP73831/2 become operational.
The UVLO circuit is always active. At any time the
input supply is below the UVLO threshold or within
+50 mV of the voltage at the VBAT pin, the
MCP73831/2 are placed in a Shutdown mode.
SHUTDOWN MODE
V
< V
DD
UVLO
V
< V
or
DD
BAT
PROG > 200 kΩ
STAT = Hi-Z
During any UVLO condition, the battery reverse
discharge current shall be less than 2 μA.
V
< V
PTH
BAT
4.2
Charge Qualification
PRECONDITIONING
MODE
For a charge cycle to begin, all UVLO conditions must
be met and a battery or output load must be present. A
charge current programming resistor must be
connected from PROG to VSS. If the PROG pin is
open or floating, the MCP73831/2 are disabled and
the battery reverse discharge current is less than 2 μA.
In this manner, the PROG pin acts as a charge enable
and can be used as a manual shutdown.
Charge Current = I
PREG
STAT = LOW
V
> V
PTH
BAT
V
> V
< V
BAT
PTH
RTH
FAST CHARGE
MODE
V
Charge Current = I
BAT
REG
STAT = LOW
4.3
Preconditioning
If the voltage at the VBAT pin is less than the precondi-
tioning threshold, the MCP73831/2 enter a precondi-
tioning or Trickle Charge mode. The preconditioning
threshold is factory set. Refer to Section 1.0 “Electri-
cal Characteristics” for preconditioning threshold
options and the Product Identification System for
standard options.
V
= V
REG
BAT
CONSTANT VOLTAGE
MODE
Charge Voltage = V
REG
STAT = LOW
I
< I
TERM
In this mode, the MCP73831/2 supply a percentage of
the charge current (established with the value of the
resistor connected to the PROG pin) to the battery.
The percentage or ratio of the current is factory set.
Refer to Section 1.0 “Electrical Characteristics” for
preconditioning current options and the Product
Identification System for standard options.
BAT
CHARGE COMPLETE
MODE
No Charge Current
STAT = HIGH (MCP73831)
STAT = Hi-Z (MCP73832)
When the voltage at the VBAT pin rises above the
preconditioning threshold, the MCP73831/2 enter the
Constant-Current or Fast Charge mode.
FIGURE 4-1:
Flowchart.
4.1 Under Voltage Lockout (UVLO)
4.4
Fast Charge Constant-Current
Mode
An internal UVLO circuit monitors the input voltage
and keeps the charger in Shutdown mode until the
input supply rises above the UVLO threshold. The
UVLO circuitry has a built in hysteresis of 100 mV.
During the Constant-Current mode, the programmed
charge current is supplied to the battery or load. The
charge current is established using a single resistor
from PROG to VSS
maintained until the voltage at the VBAT pin reaches
the regulation voltage, VREG
In the event a battery is present when the input power
is applied, the input supply must rise 150 mV above
the battery voltage before the MCP73831/2 becomes
operational.
. Constant-Current mode is
.
DS21984B-page 10
© 2006 Microchip Technology Inc.
MCP73831/2
4.5
Constant-Voltage Mode
4.8
Thermal Regulation
When the voltage at the VBAT pin reaches the regula-
tion voltage, VREG, constant voltage regulation begins.
The regulation voltage is factory set to 4.2V, 4.35V,
4.40V, or 4.50V with a tolerance of 0.75%.
The MCP73831/2 limit the charge current based on
the die temperature. The thermal regulation optimizes
the charge cycle time while maintaining device
reliability. Figure 4-2 depicts the thermal regulation for
the MCP73831/2.
4.6
Charge Termination
525
The charge cycle is terminated when, during Constant-
Voltage mode, the average charge current diminishes
below a percentage of the programmed charge current
(established with the value of the resistor connected to
the PROG pin). A 1 ms filter time on the termination
comparator ensures that transient load conditions do
not result in premature charge cycle termination. The
percentage or ratio of the current is factory set. Refer
to Section 1.0 “Electrical Characteristics” for
charge termination current options and the “Product
Identification System” for standard options.
Ω
RPROG = 2 k
450
375
300
225
150
75
0
Junction Temperature (°C)
The charge current is latched off and the MCP73831/2
enter a Charge Complete mode.
FIGURE 4-2:
Thermal Regulation.
4.7
Automatic Recharge
4.9
Thermal Shutdown
The MCP73831/2 continuously monitor the voltage at
the VBAT pin in the Charge Complete mode. If the volt-
age drops below the recharge threshold, another
charge cycle begins and current is once again
supplied to the battery or load. The recharge threshold
is factory set. Refer to Section 1.0 “Electrical Char-
acteristics” for recharge threshold options and the
Product Identification System for standard options.
The MCP73831/2 suspend charge if the die tempera-
ture exceeds 150°C. Charging will resume when the
die temperature has cooled by approximately 10°C.
© 2006 Microchip Technology Inc.
DS21984B-page 11
MCP73831/2
5.2
Digital Circuitry
5.0
DETAILED DESCRIPTION
5.2.1
STATUS INDICATOR (STAT)
5.1
Analog Circuitry
The charge status output of the MCP73831 has three
different states: High (H), Low (L), and High-Imped-
ance (Hi-Z). The charge status output of the
MCP73832 is open-drain, and, as such, has two differ-
ent states: Low (L), and High-Impedance (Hi-Z). The
charge charge status output can be used to illuminate
1, 2, or tri-color LEDs. Optionally, the charge status
output can be used as an interface to a host
microcontroller.
5.1.1
BATTERY MANAGEMENT INPUT
SUPPLY (VDD
)
The VDD input is the input supply to the MCP73831/2.
The MCP73831/2 automatically enter a Power-Down
mode if the voltage on the VDD input falls below the
UVLO voltage (VSTOP). This feature prevents draining
the battery pack when the VDD supply is not present.
5.1.2
CURRENT REGULATION SET
(PROG)
Table 5-1 summarize the state of the status output
during a charge cycle..
Fast charge current regulation can be scaled by plac-
ing a programming resistor (RPROG) from the PROG
input to VSS. The program resistor and the charge
current are calculated using the following equation:
TABLE 5-1:
STATUS OUTPUT
STAT1
MCP73831 MCP73832
Charge Cycle State
Shutdown
Hi-Z
Hi-Z
L
Hi-Z
Hi-Z
L
1000V
RPROG
----------------
=
IREG
No Battery Present
Preconditioning
Where:
Constant-Current Fast
Charge
L
L
RPROG
IREG
=
=
kOhms
milliampere
Constant Voltage
L
L
Charge Complete –
Standby
H
Hi-Z
The preconditioning trickle charge current and the
charge termination current are ratiometric to the fast
charge current based on the selected device options.
5.2.2
DEVICE DISABLE (PROG)
The current regulation set input pin (PROG) can be
used to terminate a charge at any time during the
charge cycle, as well as to initiate a charge cycle or
initiate a recharge cycle.
5.1.3
BATTERY CHARGE CONTROL
OUTPUT (VBAT
)
The battery charge control output is the drain terminal
of an internal P-channel MOSFET. The MCP73831/2
provide constant current and voltage regulation to the
battery pack by controlling this MOSFET in the linear
region. The battery charge control output should be
connected to the positive terminal of the battery pack.
Placing a programming resistor from the PROG input
to VSS enables the device. Allowing the PROG input to
float or by applying a logic-high input signal, disables
the device and terminates a charge cycle. When
disabled, the device’s supply current is reduced to
25 μA, typically.
DS21984B-page 12
© 2006 Microchip Technology Inc.
MCP73831/2
cells constant current followed by constant voltage.
Figure 6-1 depicts a typical stand-alone application
circuit, while Figures 6-2 and 6-3 depict the
accompanying charge profile.
6.0
APPLICATIONS
The MCP73831/2 are designed to operate in conjunc-
tion with a host microcontroller or in a stand-alone
application. The MCP73831/2 provide the preferred
charge algorithm for Lithium-Ion and Lithium-Polymer
Li-Ion Battery Charger
4
3
5
2
VDD
VBAT
+
-
Single
Li-Ion
Cell
CIN
RLED
LED
COUT
STAT PROG
REGULATED
WALL CUBE
RPROG
1
VSS
MCP73831
FIGURE 6-1:
Typical Application Circuit.
6.0
5.0
4.0
3.0
2.0
120
100
80
6.0
5.0
4.0
3.0
2.0
1.0
0.0
600
500
400
300
200
100
0
60
40
MCP73831-2AC/IOT
VDD = 5.2V
RPROG = 10 kΩ
MCP73831-2AC/IOT
VDD = 5.2V
RPROG = 2 kΩ
1.0
0.0
20
0
Time (minutes)
Time (minutes)
FIGURE 6-2:
Typical Charge Profile
FIGURE 6-3:
Typical Charge Profile in
(180 mAh Battery).
Thermal Regulation (1000 mAh Battery).
6.1
Application Circuit Design
Due to the low efficiency of linear charging, the most
important factors are thermal design and cost, which
are a direct function of the input voltage, output current
and thermal impedance between the battery charger
and the ambient cooling air. The worst-case situation
is when the device has transitioned from the
Preconditioning mode to the Constant-Current mode.
In this situation, the battery charger has to dissipate
the maximum power. A trade-off must be made
between the charge current, cost and thermal
requirements of the charger.
6.1.1.1
Current Programming Resistor
(RPROG
)
The preferred fast charge current for Lithium-Ion cells
is at the 1C rate, with an absolute maximum current at
the 2C rate. For example, a 500 mAh battery pack has
a preferred fast charge current of 500 mA. Charging at
this rate provides the shortest charge cycle times
without degradation to the battery pack performance
or life.
6.1.1
COMPONENT SELECTION
Selection of the external components in Figure 6-1 is
crucial to the integrity and reliability of the charging
system. The following discussion is intended as a
guide for the component selection process.
© 2006 Microchip Technology Inc.
DS21984B-page 13
MCP73831/2
6.1.1.2
Thermal Considerations
6.1.1.5
Charge Inhibit
The worst-case power dissipation in the battery
charger occurs when the input voltage is at the
maximum and the device has transitioned from the
Preconditioning mode to the Constant-Current mode.
In this case, the power dissipation is:
The current regulation set input pin (PROG) can be
used to terminate a charge at any time during the
charge cycle, as well as to initiate a charge cycle or
initiate a recharge cycle.
Placing a programming resistor from the PROG input
to VSS enables the device. Allowing the PROG input to
float or by applying a logic-high input signal, disables
the device and terminates a charge cycle. When
disabled, the device’s supply current is reduced to
25 μA, typically.
PowerDissipation = (V
– V
) × I
PTHMIN REGMAX
DDMAX
Where:
VDDMAX
IREGMAX
VPTHMIN
=
=
=
the maximum input voltage
the maximum fast charge current
6.1.1.6
Charge Status Interface
the minimum transition threshold
voltage
A status output provides information on the state of
charge. The output can be used to illuminate external
LEDs or interface to a host microcontroller. Refer to
Table 5-1 for a summary of the state of the status
output during a charge cycle.
Power dissipation with a 5V, 10% input voltage
source is:
PowerDissipation = (5.5V – 2.7V) × 550mA = 1.54W
6.2
PCB Layout Issues
This power dissipation with the battery charger in the
SOT23-5 package will cause thermal regulation to be
entered as depicted in Figure 6-3. Alternatively, the
2mm x 3mm DFN package could be utilized to reduce
charge cycle times.
For optimum voltage regulation, place the battery pack
as close as possible to the device’s VBAT and VSS
pins. This is recommended to minimize voltage drops
along the high current-carrying PCB traces.
If the PCB layout is used as a heatsink, adding many
vias in the heatsink pad can help conduct more heat to
the backplane of the PCB, thus reducing the maximum
junction temperature. Figures 6-4 and 6-5 depict a
typical layout with PCB heatsinking.
6.1.1.3
External Capacitors
The MCP73831/2 are stable with or without a battery
load. In order to maintain good AC stability in the Con-
stant-Voltage mode, a minimum capacitance of 4.7 μF
is recommended to bypass the VBAT pin to VSS. This
capacitance provides compensation when there is no
battery load. In addition, the battery and interconnec-
tions appear inductive at high frequencies. These
elements are in the control feedback loop during
Constant-Voltage mode. Therefore, the bypass capac-
itance may be necessary to compensate for the
inductive nature of the battery pack.
R
LED
LED
R
PROG
V
V
SS
C
MCP73831 C
V
DD
OUT
BAT
IN
Virtually any good quality output filter capacitor can be
used, independent of the capacitor’s minimum
Effective Series Resistance (ESR) value. The actual
value of the capacitor (and its associated ESR)
depends on the output load current. A 4.7 μF ceramic,
tantalum or aluminum electrolytic capacitor at the
output is usually sufficient to ensure stability for output
currents up to a 500 mA.
FIGURE 6-4:
Typical Layout (Top).
V
SS
V
V
6.1.1.4
Reverse-Blocking Protection
BAT
DD
The MCP73831/2 provide protection from a faulted or
shorted input. Without the protection, a faulted or
shorted input would discharge the battery pack
through the body diode of the internal pass transistor.
FIGURE 6-5:
Typical Layout (Bottom).
DS21984B-page 14
© 2006 Microchip Technology Inc.
MCP73831/2
7.0
7.1
PACKAGING INFORMATION
Package Marking Information
8-Lead DFN (2 mm x 3 mm)
Example:
Device
Code
XXX
YWW
NN
AAE
610
25
MCP73831T-2ACI/MC
MCP73831T-2ATI/MC
MCP73831T-2DCI/MC
MCP73831T-3ACI/MC
MCP73831T-4ADI/MC
MCP73831T-5ACI/MC
MCP73832T-2ACI/MC
MCP73832T-2ATI/MC
MCP73832T-2DCI/MC
MCP73832T-3ACI/MC
MCP73832T-4ADI/MC
MCP73832T-5ACI/MC
AAE
AAF
AAG
AAH
AAJ
AAK
AAL
AAM
AAP
AAQ
AAR
AAS
Note: Applies to 8-Lead DFN
Example:
5-Lead SOT-23
Device
Code
MCP73831T-2ACI/OT
MCP73831T-2ATI/OT
MCP73831T-2DCI/OT
MCP73831T-3ACI/OT
MCP73831T-4ADI/OT
MCP73831T-5ACI/OT
MCP73832T-2ACI/OT
MCP73832T-2ATI/OT
MCP73832T-2DCI/OT
MCP73832T-3ACI/OT
MCP73832T-4ADI/OT
MCP73832T-5ACI/OT
KDNN
KENN
KFNN
KGNN
KHNN
KJNN
KKNN
KLNN
KMNN
KPNN
KQNN
KRNN
XXNN
KD25
Note: Applies to 5-Lead SOT-23
Legend: XX...X Customer-specific information
Y
YY
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
WW
NNN
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2006 Microchip Technology Inc.
DS21984B-page 15
MCP73831/2
8-Lead Plastic Dual-Flat, No-Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated
D
b
p
n
L
K
E
E2
EXPOSED
METAL
PAD
(NOTE 2)
2
1
PIN 1
ID INDEX
AREA
DETAIL
D2
ALTERNATE
CONTACT
(
NOTE 1)
BOTTOM VIEW
CONFIGURATION
TOP VIEW
EXPOSED
TIE BAR
A
A1
(
NOTE 3)
A3
Units
Dimension Limits
INCHES
NOM
MILLIMETERS*
MIN
MAX
MIN
NOM
MAX
n
e
Number of Pins
Pitch
8
8
.020 BSC
.035
0.50 BSC
Overall Height
Standoff
A
A1
A3
D
.031
.000
.039
0.80
0.90
0.02
0.20 REF.
1.00
.001
.008 REF.
.002
0.00
0.05
Contact Thickness
Overall Length
Overall Width
.079 BSC
.118 BSC
2.00 BSC
3.00 BSC
E
Exposed Pad Length
Exposed Pad Width
Contact Length §
D2
E2
L
.051
.059
.012
.008
.008
–
–
.069
.075
.020
1.30**
1.50**
0.30
–
–
1.75
1.90
0.50
.016
0.40
Contact-to-Exposed Pad
Contact Width
§
K
–
–
0.20
–
–
b
.010
.012
0.20
0.25
0.30
*
Controlling Parameter
** Not within JEDEC parameters
Significant Characteristic
Notes:
§
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Exposed pad may vary according to die attach paddle size.
3. Package may have one or more exposed tie bars at ends.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC Equivalent MO-229 VCED-2
Revised 09-12-05
DWG No. C04-123
DS21984B-page 16
© 2006 Microchip Technology Inc.
MCP73831/2
5-Lead Plastic Small Outline Transistor (OT) (SOT-23)
E
E1
p
B
p1
D
n
1
α
c
A
A2
φ
L
A1
β
Units
INCHES
*
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
n
p
Number of Pins
Pitch
5
5
.038
0.95
p1
A
Outside lead pitch (basic)
Overall Height
.075
.046
.043
.003
.110
.064
.116
.018
1.90
1.18
1.10
0.08
2.80
1.63
2.95
0.45
.035
.057
0.90
1.45
Molded Package Thickness
Standoff
A2
A1
E
.035
.000
.102
.059
.110
.014
.051
.006
.118
.069
.122
.022
10
0.90
0.00
2.60
1.50
2.80
0.35
1.30
0.15
3.00
1.75
3.10
0.55
Overall Width
Molded Package Width
Overall Length
E1
D
Foot Length
L
f
Foot Angle
0
5
0
5
10
c
Lead Thickness
Lead Width
.004
.014
.006
.017
.008
.020
10
0.09
0.35
0.15
0.43
0.20
0.50
B
a
b
Mold Draft Angle Top
Mold Draft Angle Bottom
0
0
5
5
0
5
5
10
10
10
0
*
Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
EIAJ Equivalent: SC-74A
Revised 09-12-05
Drawing No. C04-091
© 2006 Microchip Technology Inc.
DS21984B-page 17
MCP73831/2
NOTES:
DS21984B-page 18
© 2006 Microchip Technology Inc.
MCP73831/2
APPENDIX A: REVISION HISTORY
Revision B (March 2006)
• Added MCP73832 through document.
Revision A (November 2005)
• Original Release of this Document.
© 2006 Microchip Technology Inc.
DS21984B-page 19
MCP73831/2
NOTES:
DS21984B-page 20
© 2006 Microchip Technology Inc.
MCP73831/2
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples: *
PART NO.
X
/XX
–
XX
X
a)
b)
c)
d)
MCP73831-2ACI/OT: 4.20V VREG,
Options AC, 5LD SOT23 Pkg
MCP73831T-2ACI/OT: Tape and Reel,
4.20V VREG, Options AC, 5LD SOT23 Pkg
MCP73832-2ACI/MC: 4.20V VREG
Options AC, 8LD DFN Package
MCP73832T-2ACI/MC: Tape and Reel,
4.20V VREG, Options AC, 8LD DFN Package
Device
VREG
Package
Options Temperature
Range
,
Device:
MCP73831:
Single-Cell Charge Controller
MCP73831T: Single-Cell Charge Controller
(Tape and Reel)
MCP73832
MCP73832T: Single-Cell Charge Controller
(Tape and Reel)
Single-Cell Charge Controller
a)
b)
c)
d)
MCP73831-2ATI/OT: 4.20V VREG,
Options AT, 5LD SOT23 Pkg
MCP73831T-2ATI/OT: Tape and Reel,
4.20V VREG, Options AT, 5LD SOT23 Pkg
MCP73832-2ATI/MC: 4.20V VREG
,
Regulation
Voltage:
Code
VREG
Options AT, 8LD DFN Package
MCP73832T-2ATI/MC: Tape and Reel,
4.20V VREG, Options AT, 8LD DFN Package
2
3
4
5
=
=
=
=
4.20V
4.35V
4.40V
4.50V
a)
b)
c)
d)
MCP73831-2DCI/OT: 4.20V VREG,
Options DC, 5LD SOT23 Pkg
MCP73831T-2DCI/OT: Tape and Reel,
4.20V VREG, Options DC, 5LD SOT23 Pkg
Options: *
Code
IPREG/IREG VPTH/VREG ITERM/IREG VRTH/VREG
MCP73832-2DCI/MC: 4.20V VREG
,
Options DC, 8LD DFN Package
AC
AD
AT
10
10
66.5
66.5
71.5
x
7.5
7.5
20
96.5
94
94
MCP73832T-2DCI/MC: Tape and Reel,
4.20V VREG, Options DC, 8LD DFN Package
10
100
DC
7.5
96.5
a)
b)
c)
d)
MCP73831-3ACI/OT: 4.35V VREG,
Options AC, 5LD SOT23 Pkg
MCP73831T-3ACI/OT: Tape and Reel,
4.35V VREG, Options AC, 5LD SOT23 Pkg
* Consult Factory for Alternative Device Options
Temperature
Range:
I
=
-40°C to +85°C (Industrial)
MCP73832-3ACI/MC: 4.35V VREG
,
Options AC, 8LD DFN Package
MCP73832T-3ACI/MC: Tape and Reel,
4.35V VREG, Options AC, 8LD DFN Package
Package:
MC
OT
=
=
Dual-Flat, No-Lead (2x3 mm body), 8-Lead
Small Outline Transistor (SOT23), 5-Lead
a)
b)
c)
d)
MCP73831-4ADI/OT: 4.40V VREG,
Options AD, 5LD SOT23 Pkg
MCP73831T-4ADI/OT: Tape and Reel,
4.40V VREG, Options AD, 5LD SOT23 Pkg
MCP73832-4ADI/MC: 4.40V VREG
,
Options AD, 8LD DFN Package
MCP73832T-4ADI/MC: Tape and Reel,
4.40V VREG, Options AD, 8LD DFN Package
a)
b)
c)
d)
MCP73831-5ACI/OT: 4.50V VREG,
Options AC, 5LD SOT23 Pkg
MCP73831T-5ACI/OT: Tape and Reel,
4.50V VREG, Options AC, 5LD SOT23 Pkg
MCP73832-5ACI/MC: 4.50V VREG
,
Options AC, 8LD DFN Package
MCP73832T-5ACI/MC: Tape and Reel,
4.50V VREG, Options AC, 8LD DFN Package
* Consult Factory for Alternate Device Options
© 2006 Microchip Technology Inc.
DS21984B-page 21
MCP73831/2
NOTES:
DS21984B-page 22
© 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR WAR-
RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION, INCLUDING BUT NOT
LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and
its use. Use of Microchip devices in life support and/or safety
applications is entirely at the buyer’s risk, and the buyer agrees
to defend, indemnify and hold harmless Microchip from any and
all damages, claims, suits, or expenses resulting from such
use. No licenses are conveyed, implicitly or otherwise, under
any Microchip intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Linear Active Thermistor,
MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM,
PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo,
PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select
Mode, Smart Serial, SmartTel, Total Endurance, UNI/O,
WiperLock and Zena are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2006, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2006 Microchip Technology Inc.
DS21984B-page 23
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
ASIA/PACIFIC
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
ASIA/PACIFIC
India - Bangalore
Tel: 91-80-4182-8400
Fax: 91-80-4182-8422
EUROPE
Austria - Wels
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
India - New Delhi
Tel: 91-11-5160-8631
Fax: 91-11-5160-8632
Fax: 45-4485-2829
China - Chengdu
Tel: 86-28-8676-6200
Fax: 86-28-8676-6599
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Atlanta
China - Fuzhou
Tel: 86-591-8750-3506
Fax: 86-591-8750-3521
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Alpharetta, GA
Tel: 770-640-0034
Fax: 770-640-0307
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Korea - Gumi
Tel: 82-54-473-4301
Fax: 82-54-473-4302
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Malaysia - Penang
Tel: 60-4-646-8870
Fax: 60-4-646-5086
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Detroit
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
San Jose
Mountain View, CA
Tel: 650-215-1444
Fax: 650-961-0286
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
02/16/06
DS21984B-page 24
© 2006 Microchip Technology Inc.
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