MCP6002IST [MICROCHIP]
1 MHz Bandwidth Low Power Op Amp; 1 MHz带宽低功耗运算放大器
| 型号： | MCP6002IST |
| 厂家： | 
MICROCHIP |
| 描述： | 1 MHz Bandwidth Low Power Op Amp |
| 文件： | 总24页 (文件大小：540K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MCP6001/2/4
M
1 MHz Bandwidth Low Power Op Amp
Features
Description
• Available in SC-70-5 and SOT-23-5 packages
• 1 MHz Gain Bandwidth Product (typ.)
• Rail-to-Rail Input/Output
The Microchip Technology Inc. MCP6001/2/4 family of
operational amplifiers (op amps) is specifically
designed for general-purpose applications. This family
has a 1 MHz gain bandwidth product and 90° phase
margin (typ.). It also maintains 45° phase margin (typ.)
with 500 pF capacitive load. This family operates from
a single supply voltage as low as 1.8V, while drawing
100 µA (typ.) quiescent current. Additionally, the
MCP6001/2/4 supports rail-to-rail input and output
swing, with a common mode input voltage range of
• Supply Voltage: 1.8V to 5.5V
• Supply Current: I = 100 µA (typ.)
Q
• 90° Phase Margin (typ.)
• Temperature Range:
- Industrial: -40°C to +85°C
- Extended: -40°C to +125°C
• Available in Single, Dual and Quad Packages
V
+ 300 mV to V - 300 mV. This family of opera-
SS
DD
tional amplifiers is designed with Microchip’s
advanced CMOS process.
Applications
• Automotive
• Portable Equipment
• Photodiode Pre-amps
• Analog Filters
The MCP6001/2/4 family is available in the industrial
and extended temperature ranges. It also has a power
supply range of 1.8V to 5.5V.
Package Types
• Notebooks and PDAs
• Battery-Powered Systems
MCP6001
SC-70-5, SOT-23-5
MCP6002
PDIP, SOIC, MSOP
VDD
VOUT
VOUTA
VDD
5
8
7
6
5
1
2
3
1
2
3
4
Available Tools
A
VSS
VIN
VINA
–
+
-
VOUTB
+
-
Spice Macro Models (at www.microchip.com)
B
+
VIN–
VINA
4
+
-
VINB
VINB
–
+
®
FilterLab Software (at www.microchip.com)
VSS
MCP6001R
Typical Application
SOT-23-5
MCP6004
PDIP, SOIC, TSSOP
VOUTA
VSS
VOUT
VDD
1
5
4
V
DD
2
3
-
V
V
V
V
14
13
12
11
1
2
3
4
IN
+
OUTD
VIN+
VIN–
A
D
VINA
–
+
–
V
+
- +
-
IND
MCP6001
OUT
MCP6001U
VINA
+
-
IND
SOT-23-5
VDD
VSS
V
SS
VDD
5
VIN+
1
VINB
+
–
VINC
+
–
10
9
5
6
7
+
VSS
-
-
+
+
2
3
VINB
VINC
B
C
-
R
1
VIN
–
VOUT
4
VOUTB
VOUTC
8
R
2
R1
-----
Gain = 1 +
R2
V
REF
Non-Inverting Amplifier
2003 Microchip Technology Inc.
DS21733D-page 1
MCP6001/2/4
1.0
ELECTRICAL
PIN FUNCTION TABLE
CHARACTERISTICS
Name
Function
V +, V +, V +, V +, Non-inverting Inputs
IND
IN
INA
INB
INC
Absolute Maximum Ratings †
VDD - VSS .........................................................................7.0V
All Inputs and Outputs ...................... VSS -0.3V to VDD +0.3V
Difference Input Voltage ....................................... |VDD - VSS
Output Short Circuit Current ..................................continuous
Current at Input Pins ....................................................±2 mA
Current at Output and Supply Pins ............................±30 mA
Storage Temperature ....................................-65°C to +150°C
Maximum Junction Temperature (TJ)..........................+150°C
ESD Protection On All Pins (HBM;MM) ............... ≥ 4 kV; 200V
V
+
V –, V –, V –, V –, Inverting Inputs
IN
IND
INA
INB
INC
V
V
V
–
|
Positive Power Supply
Negative Power Supply
Outputs
DD
SS
V
V
, V
OUTC
, V
OUTD
,
OUTB
OUT OUTA
, V
† Notice: Stresses above those listed under “Maximum Rat-
ings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Expo-
sure to maximum rating conditions for extended periods may
affect device reliability.
DC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/2, RL = 10 kΩ
to VDD/2, and VOUT ~ VDD/2.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input Offset
Input Offset Voltage
Input Offset Drift with Temperature
VOS
∆VOS/∆TA
-7.0
—
—
±2.0
+7.0
—
mV
VCM = VSS
µV/°C TA= -40°C to +125°C,
CM = VSS
V
Power Supply Rejection
Input Bias Current and Impedance
Input Bias Current:
Industrial Temperature
Extended Temperature
Input Offset Current
Common Mode Input Impedance
Differential Input Impedance
Common Mode
PSRR
—
86
—
dB
VCM = VSS
IB
IB
IB
IOS
ZCM
ZDIFF
—
—
—
—
—
—
±1.0
19
1100
±1.0
1013||6
1013||3
—
—
—
—
—
—
pA
pA
pA
pA
Ω||pF
Ω||pF
TA = +85°C
TA = +125°C
Common Mode Input Range
Common Mode Rejection Ratio
Open-Loop Gain
VCMR
CMRR
V
SS − 0.3
60
—
76
V
DD + 0.3
—
V
dB
VCM = -0.3V to 5.3V, VDD = 5V
VOUT = 0.3V to VDD - 0.3V,
DC Open-Loop Gain (large signal)
AOL
88
112
—
dB
VCM = VSS
Output
Maximum Output Voltage Swing
Output Short-Circuit Current
VOL, VOH VSS + 25
—
±6
±23
V
DD − 25
—
—
mV
mA
mA
VDD = 5.5V
VDD = 1.8V
VDD = 5.5V
ISC
—
—
Power Supply
Supply Voltage
Quiescent Current per Amplifier
VDD
IQ
1.8
50
—
100
5.5
170
V
µA
IO = 0, VDD = 5.5V, VCM = 5V
DS21733D-page 2
2003 Microchip Technology Inc.
MCP6001/2/4
AC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, T = +25°C, V = +1.8 to 5.5V, V = GND, V
= V /2,
DD
A
DD
SS
CM
V
≈ V /2, R = 10 kΩ to V /2, and C = 60 pF.
OUT
DD
L
DD
L
Parameters
Sym
Min
Typ
Max
Units
Conditions
AC Response
Gain Bandwidth Product
Phase Margin
Slew Rate
GBWP
PM
SR
—
—
—
1.0
90
0.6
—
—
—
MHz
°
V/µs
G = +1
Noise
Input Noise Voltage
Input Noise Voltage Density
Input Noise Current Density
E
e
—
—
—
6.1
28
0.6
—
—
—
µVp-p f = 0.1 Hz to 10 Hz
nV/√Hz f = 1 kHz
fA/√Hz f = 1 kHz
ni
ni
i
ni
TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, V = +1.8V to +5.5V, and V = GND.
DD
SS
Parameters
Temperature Ranges
Sym
Min
Typ
Max
Units
Conditions
Industrial Temperature Range
Extended Temperature Range
Operating Temperature Range
Storage Temperature Range
T
-40
-40
-40
-65
—
—
—
—
+85
°C
°C
°C
°C
A
T
+125
+125
+150
A
T
(Note)
A
T
A
Thermal Package Resistances
Thermal Resistance, 5L-SC70
Thermal Resistance, 5L-SOT-23
Thermal Resistance, 8L-PDIP
Thermal Resistance, 8L-SOIC (150 mil)
Thermal Resistance, 8L-SOIC (208 mil)
Thermal Resistance, 8L-MSOP
Thermal Resistance, 14L-PDIP
Thermal Resistance, 14L-SOIC
Thermal Resistance, 14L-TSSOP
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
θ
θ
θ
θ
θ
θ
θ
θ
θ
331
256
85
163
118
206
70
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
JA
JA
JA
JA
JA
JA
JA
120
100
JA
JA
Note:
The industrial temperature devices operate over this extended temperature range, but with reduced perfor-
mance. In any case, the internal Junction Temperature (T ) must not exceed the Absolute Maximum
J
specification of +150°C.
2003 Microchip Technology Inc.
DS21733D-page 3
MCP6001/2/4
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, T = +25°C, V = +1.8V to +5.5V, V = GND, V
= V /2, V
≈ V /2,
OUT DD
A
DD
SS
CM
DD
R = 10 kΩ to V /2, and C = 60 pF.
L
DD
L
100
90
22%
20%
18%
16%
14%
12%
10%
8%
1225 Samples
VCM = VSS
PSRR (VCM = VSS
)
80
6%
CMRR (VCM = -0.3V to +5.3V)
4%
2%
0%
70
-50
-25
0
25
50
75
100
125
Input Offset Voltage (mV)
Ambient Temperature (°C)
FIGURE 2-1:
Input Offset Voltage
FIGURE 2-4:
CMRR, PSRR vs. Ambient
Histogram.
Temperature.
100
90
80
70
60
50
40
30
120
100
80
60
40
20
0
0
VCM = VSS
-30
-60
PSRR-
PSRR+
Phase
-90
-120
CMRR
-150
Gain
-180
VCM = VSS
20 1.E+0
1
1.E+0
2
1.E+03
1.E+0
4
1.E+05
-20 1.E-0
1
1.E+00
1.E+0
1
1.E+0
2
1.E+03
1.E+04
1.E+05
1.E+06
1.E+07
-210
10
100
1k
10k
100k
0.1
1
10
100
1k 10k 100k 1M 10M
Frequency (Hz)
Frequency (Hz)
FIGURE 2-2:
PSRR, CMRR vs.
FIGURE 2-5:
Open-Loop Gain, Phase vs.
Frequency.
Frequency.
14%
55%
1230 Samples
605 Samples
50%
45%
40%
35%
30%
25%
20%
15%
10%
5%
V
DD = 5.5 V
V
DD = 5.5 V
12%
10%
8%
VCM = VDD
TA = +85°C
VCM = VDD
TA = +125°C
6%
4%
2%
0%
0%
Input Bias Current (pA)
Input Bias Current (pA)
FIGURE 2-3:
Input Bias Current at +85°C
FIGURE 2-6:
Input Bias Current at +125°C
Histogram.
Histogram.
DS21733D-page 4
2003 Microchip Technology Inc.
MCP6001/2/4
Note: Unless otherwise indicated, T = +25°C, V = +1.8V to +5.5V, V = GND, V
= V /2, V
≈ V /2,
OUT DD
A
DD
SS
CM
DD
R = 10 kΩ to V /2, and C = 60 pF.
L
DD
L
1,000
18%
1225 Samples
VCM = VSS
TA = -40°C to +125°C
16%
14%
12%
10%
8%
100
6%
4%
2%
Eni = 6.1 µVP-P
,
f = 0.1 to 10 Hz
0%
10 1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
1.E+05
0.1
1
10
100
1k
10k
100k
Frequency (Hz)
Input Offset Voltage Drift (µV/°C)
FIGURE 2-7:
Input Noise Voltage Density
FIGURE 2-10:
Input Offset Voltage Drift
vs. Frequency.
Histogram.
0
200
150
100
50
VDD = 1.8V
-100
-200
-300
-400
-500
-600
-700
VDD = 5.5V
0
VDD = 1.8V
TA
TA
TA
=
=
=
-40°C
+25°C
+85°C
-50
-100
-150
-200
TA = +125°C
VCM = VSS
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Output Voltage (V)
Common Mode Input Voltage (V)
FIGURE 2-8:
Input Offset Voltage vs.
FIGURE 2-11:
Input Offset Voltage vs.
Common Mode Input Voltage at V = 1.8V.
Output Voltage.
DD
0
35
30
25
20
15
VDD = 5.5V
-100
-200
-300
+ISC, VDD = 5.5V
-ISC, VDD = 5.5V
TA
TA
TA
=
=
=
-40°C
+25°C
+85°C
-400
-500
-600
-700
-ISC, VDD = 1.8V
10
5
TA = +125°C
+ISC, VDD = 1.8V
-25
0
-0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
-50
0
25
50
75
100
125
Common Mode Input Voltage (V)
Ambient Temperature (°C)
FIGURE 2-9:
Input Offset Voltage vs.
FIGURE 2-12:
Output Short-Circuit Current
Common Mode Input Voltage at V = 5.5V.
vs. Ambient Temperature.
DD
2003 Microchip Technology Inc.
DS21733D-page 5
MCP6001/2/4
Note: Unless otherwise indicated, T = +25°C, V = +1.8V to +5.5V, V = GND, V
= V /2, V
≈ V /2,
OUT DD
A
DD
SS
CM
DD
R = 10 kΩ to V /2, and C = 60 pF.
L
DD
L
0.08
0.06
0.04
0.02
0.00
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
G = +1 V/V
Falling Edge, VDD = 5.5V
Falling Edge, VDD = 1.8V
Rising Edge, VDD = 5.5V
Rising Edge, VDD = 1.8V
-0.02
-0.04
-0.06
-50
-25
0
25
50
75
100
125
-0.08
0.E+0
0
1.E-06
2.E-06
3.E-06
4.E-06
5.E-06
6.E-06
7.E-06
8.E-06
9.E-06
1.E-05
Ambient Temperature (°C)
Time (1 µs/div)
FIGURE 2-13:
Slew Rate vs. Ambient
FIGURE 2-16:
Small Signal Non-Inverting
Temperature.
Pulse Response.
1,000
100
10
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
G = +1 V/V
V
DD = 5.0V
VDD - VOH
VOL - VSS
1
1.E-05
1.E-0
4
1.E-03
1.E-02
10µ
100µ
1m
10m
0.0 0.E+0
0
1.E-05
2.E-05
3.E-05
4.E-0
5
5.E-0
5
6.E-0
5
7.E-05
8.E-0
5
9.E-05
1.E-04
Output Current Magnitude (A)
Time (10 µs/div)
FIGURE 2-14:
Output Voltage Headroom
FIGURE 2-17:
Large Signal Non-Inverting
vs. Output Current Magnitude.
Pulse Response.
160
140
120
100
80
10
TA = +125°C
VDD = 5.5V
TA = 85°C
TA = 25°C
TA = -40°C
VDD = 1.8V
1
60
40
20
VCM = VDD - 0.5V
0
0.1 1.E+0
3
1.E+0
4
1.E+0
5
1.E+06
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Power Supply Voltage (V)
1k
10k
100k
1M
Frequency (Hz)
FIGURE 2-15:
Output Voltage Swing vs.
FIGURE 2-18:
Quiescent Current vs.
Frequency.
Power Supply Voltage.
DS21733D-page 6
2003 Microchip Technology Inc.
MCP6001/2/4
3.0
APPLICATION INFORMATION
–
The MCP6001/2/4 family of op amps is manufactured
using Microchip’s state-of-the-art CMOS process and
is specifically designed for low cost, low power and
general-purpose applications. The low supply voltage,
low quiescent current and wide bandwidth makes the
MCP6001/2/4 ideal for battery-powered applications.
This device has high phase margin, which makes it
stable for larger capacitive load applications.
V
R
MCP600X
+
OUT
IN
V
IN
(Maximum expected VIN) – VDD
IN ≥ ------------------------------------------------------------------------------
2 mA
R
V
SS – (Minimum expected VIN)
3.1
Rail-to-Rail Input
R
IN ≥ ---------------------------------------------------------------------------
2 mA
The MCP6001/2/4 op amp is designed to prevent
phase reversal when the input pins exceed the supply
voltages. Figure 3-1 shows the input voltage exceeding
the supply voltage without any phase reversal.
FIGURE 3-2:
Input Current Limiting
Resistor (R ).
IN
3.2
Rail-to-Rail Output
6
The output voltage range of the MCP6001/2/4 op amp
VIN
VDD = 5.0V
G = +2 V/V
5
4
3
2
1
0
is V - 25 mV (min.) and V + 25 mV (max.) when
DD
SS
DD
VOUT
R = 10 kΩ is connected to V /2 and V = 5.5V.
DD
L
Refer to Figure 2-14 for more information.
3.3
Capacitive Loads
Driving large capacitive loads can cause stability prob-
lems for voltage feedback op amps. As the load capac-
itance increases, the feedback loop’s phase margin
decreases, and the closed loop bandwidth is reduced.
This produces gain peaking in the frequency response,
with overshoot and ringing in the step response. A unity
gain buffer (G = +1) is the most sensitive to capacitive
loads, but all gains show the same general behavior.
-1 0.E+0
0
1.E-05
2.E-05
3.E-0
5
4.E-05
5.E-05
6.E-05
7.E-05
8.E-0
5
9.E-05
1.E-04
Time (10 µs/div)
FIGURE 3-1:
No Phase Reversal.
The MCP6001/2/4 Shows
When driving large capacitive loads with these op
amps (e.g., > 100 pF when G = +1), a small series
The input stage of the MCP6001/2/4 op amp uses two
differential input stages in parallel; one operates at low
resistor at the output (R
in Figure 3-3) improves the
common mode input voltage (V ) and the other at
ISO
CM
feedback loop’s phase margin (stability) by making the
output load resistive at higher frequencies. It does not,
however, improve the bandwidth.
high V . With this topology, the device operates with
CM
V
up to 300 mV above V and 300 mV below V
.
SS
CM
DD
The Input Offset Voltage is measured at
= V - 300 mV and V + 300 mV to ensure
V
CM
SS
DD
proper operation.
Input voltages that exceed the input voltage range
(V - 0.3V to V + 0.3V at 25°C) can cause exces-
sive current to flow into or out of the input pins. Current
beyond ±2 mA can cause reliability problems. Applica-
tions that exceed this rating must be externally limited
with a resistor, as shown in Figure 3-2.
–
SS
DD
R
ISO
V
MCP600X
+
OUT
V
IN
C
L
FIGURE 3-3:
Output resistor, R
ISO
stabilizes large capacitive loads.
To select R , check the frequency response peaking
ISO
(or step response overshoot) on the bench (or with the
MCP6001/2/4 Spice macro model). If the response is
reasonable, you do not need R . Otherwise, start
ISO
R
at 1 kΩ and modify its value until the response is
ISO
reasonable.
2003 Microchip Technology Inc.
DS21733D-page 7
MCP6001/2/4
3.4
Supply Bypass
3.6
Application Circuits
With this family of operation amplifiers, the power sup-
3.6.1
UNITY GAIN BUFFER
ply pin (V for single supply) should have a local
DD
The rail-to-rail input and output capability of the
MCP6001/2/4 op amp is ideal for unity-gain buffer
applications. The low quiescent current and wide band-
width makes the device suitable for a buffer configura-
tion in an instrumentation amplifier circuit, as shown in
Figure 3-5.
bypass capacitor (i.e., 0.01 µF to 0.1 µF) within 2 mm
for good high frequency performance. It also needs a
bulk capacitor (i.e., 1 µF or larger) within 100 mm to
provide large, slow currents. This bulk capacitor can be
shared with other parts.
3.5
PCB Surface Leakage
In applications where low input bias current is critical,
PCB (printed circuit board) surface leakage effects
need to be considered. Surface leakage is caused by
humidity, dust or other contamination on the board.
Under low humidity conditions, a typical resistance
-
R1
R2
MCP6002
+
1/2
VIN1
-
VOUT
MCP6001
12
between nearby traces is 10 Ω. A 5V difference would
+
cause 5 pA, if current-to-flow; this is greater than the
MCP6001/2/4 family’s bias current at 25°C (1 pA, typ).
The easiest way to reduce surface leakage is to use a
guard ring around sensitive pins (or traces). The guard
ring is biased at the same voltage as the sensitive pin.
An example of this type of layout is shown in
Figure 3-4.
-
R2
MCP6002
+
1/2
VIN2
R1 = 20 kΩ
R2 = 10 kΩ
R1
VREF
R1
VOUT = (VIN2 – VIN1) • ----- + VREF
R2
V -
V +
IN
IN
VSS
FIGURE 3-5:
Instrumentation Amplifier
with Unity Gain Buffer Inputs.
3.6.2
ACTIVE LOW-PASS FILTER
The MCP6001/2/4 op amp’s low input bias current
makes it possible for the designer to use larger resis-
tors and smaller capacitors for active low-pass filter
applications. However, as the resistance increases, the
noise generated also increases. Parasitic capacitances
and the large value resistors could also modify the fre-
quency response. These trade-offs need to be
considered when selecting circuit elements.
It is possible to have a filter cutoff frequency as high as
1/10th of the op amp bandwidth (100 kHz). Figure 3-6
shows a second-order butterworth filter with 100 kHz
cutoff frequency and a gain of +1V/V.
Guard Ring
Example Guard Ring Layout
FIGURE 3-4:
for Inverting Gain.
1. Non-inverting Gain and Unity Gain Buffer:
a. Connect the non-inverting pin (V +) to the
IN
input with a wire that does not touch the pcb
surface.
b. Connect the guard ring to the inverting input
pin (V –). This biases the guard ring to the
IN
The component values were selected using
common mode input voltage.
®
Microchip’s FilterLab software.
2. Inverting and Transimpedance Gain Amplifiers
(convert current to voltage, such as photo detec-
tors):
100 pF
a. Connect the guard ring to the non-inverting
14.3 kΩ 53.6 kΩ
VIN
input pin (V +). This biases the guard ring
IN
+
to the same reference voltage as the op
MCP6002
-
amp (e.g., V /2 or ground).
DD
VOUT
33 pF
b. Connect the inverting pin (V –) to the input
IN
with a wire that does not touch the PCB
surface.
FIGURE 3-6:
Active Second-Order Low-
Pass Filter.
DS21733D-page 8
2003 Microchip Technology Inc.
MCP6001/2/4
can be determined. For example, with op amp short-cir-
3.6.3
PEAK DETECTOR
cuit current of I
= 25 mA and load capacitor of
SC
The MCP6001/2/4 op amp has a high input impedance,
rail-to-rail input and output and low input bias current,
which makes this device suitable for a peak detector
applications. Figure 3-7 shows a peak detector circuit
with clear and sample switches. The peak-detection
cycle uses a clock (CLK), as shown in Figure 3-7.
C = 0.1 µF, then:
1
EQUATION
dVC1
ISC = C1 × ------------
dt
At the rising edge of CLK, Sample Switch closes to
dVC1
dt
ISC
-------
C1
------------
=
=
=
begin sampling. The peak voltage stored on C is sam-
1
pled to C for a sample time defined by t
. At the
SAMP
2
25mA
--------------
end of the sample time (falling edge of Sample Signal),
0.1µF
Clear Signal goes high and closes the Clear Switch.
dVC1
------------
dt
250mV
When the Clear Switch closes, C discharges through
1
-----------------
µs
R for a time defined by t
. At the end of the clear
CLEAR
1
time (falling edge of Clear Signal), op amp A begins to
This voltage change rate is less than the MCP6001/2/4
slew rate of 600 mV/µs. When the input voltage swings
store the peak value of V on C for a time defined by
IN
1
t
.
DETECT
below the voltage across C , D becomes reverse-
1
1
In order to define the t
and t
, it is necessary
SAMP
CLEAR
biased, which opens the feedback loop and rails the
amplifier. When the input voltage increases, the ampli-
fier recovers at its slew rate. Based on the rate of volt-
age change shown in the above equation, it takes an
extended period of time to charge a 0.1 µF capacitor.
The capacitors need to be selected so that the circuit is
not limited by the amplifier slew rate. Therefore, the
capacitors should be less than 40 µF and a stabilizing
to determine the capacitor charging and discharging
period. The capacitor charging time is limited by the
amplifier source current, while the discharging time (τ)
is defined using R (τ = R *C ). t
is the time that
1
1
1
DETECT
the input signal is sampled on C , and is dependent on
1
the input voltage change frequency.
The op amp output current limit, and the size of the
resistor (R ) needs to be properly selected. Refer to
storage capacitors (both C and C ), could create slew-
ISO
1
2
Section 3.3, “Capacitive Load and Stability”, for op amp
stability.
ing limitations as the input voltage (V ) increases. Cur-
IN
rent through a capacitor is dependent on the size of the
capacitor and the rate of voltage change. From this
relationship, the rate of voltage change or the slew rate
V
IN
D
+
1
R
ISO
V
C1
R
V
+
MCP6002
ISO
C2
1/2
–
V
+
MCP6002
OUT
C
1
R
1
A
– 1/2
MCP6001
B
C
2
–
C
Sample
Switch
Clear
Switch
tSAMP
Sample Signal
tCLEAR
Clear Signal
CLK
tDETECT
FIGURE 3-7:
Peak Detector with Clear and Sample CMOS Analog Switches.
2003 Microchip Technology Inc.
DS21733D-page 9
MCP6001/2/4
4.0
DESIGN TOOLS
Microchip provides the basic design tools needed for
the MCP6001/2/4 family of op amps.
4.1
SPICE Macro Model
The latest Spice macro model for the MCP6001/2/4
operational amplifiers (op amps) is available on our
website at www.microchip.com. This model is intended
as an initial design tool that works well in the op amp’s
linear region of operation at room temperature. See the
model file for information on its capabilities.
Bench testing is a very important part of any design and
cannot be replaced with simulations. Also, simulation
results using this macro model need to be validated by
comparing them to the data sheet specifications and
characteristic curves.
®
4.2
FilterLab Software
FilterLab is an innovative software tool that simplifies
analog active filter (using op amps) design. Available at
no cost from our website at www.microchip.com, the
FilterLab software active filter software design tool pro-
vides full schematic diagrams of the filter circuit with
component values. It also outputs the filter circuit in
SPICE format, which can be used with the macro
model to simulate actual filter performance.
DS21733D-page 10
2003 Microchip Technology Inc.
MCP6001/2/4
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
5-Lead SC-70 (MCP6001)
Example:
XNN
YWW
A57
307
Example:(MCP6001 I-Temp Pinout)
5-Lead SOT-23 (MCP6001)
5
4
5
4
Industrial
Extended
Device
Temp Code Temp Code
MCP6001
MCP6001R
MCP6001U
Note:
AANN
ADNN
AFNN
CDNN
CENN
CFNN
AA07
XXNN
1
2
3
1
2
3
Applies to 5-Lead SOT-23.
8-Lead PDIP (300 mil)
Example:
XXXXXXXX
XXXXXNNN
MCP6002
I/P057
0307
YYWW
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
XXXXYYWW
MCP6002
I/SN0307
NNN
057
Example:
8-Lead MSOP
XXXXXX
YWWNNN
6002
307057
Legend: XX...X Customer specific information*
YY
WW
NNN
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
*
Standard marking consists of Microchip part number, year code, week code, traceability code (facility
code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please
check with your Microchip Sales Office.
2003 Microchip Technology Inc.
DS21733D-page 11
MCP6001/2/4
Package Marking Information (Continued)
14-Lead PDIP (300 mil) (MCP6004)
Example:
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
MCP6004-I/P
0307057
YYWWNNN
14-Lead SOIC (150 mil) (MCP6004)
Example:
XXXXXXXXXX
XXXXXXXXXX
MCP6004ISL
0307057
YYWWNNN
Example:
14-Lead TSSOP (MCP6004)
XXXXXX
YYWW
6004ST
0307
NNN
057
DS21733D-page 12
2003 Microchip Technology Inc.
MCP6001/2/4
5-Lead Plastic Package (SC-70)
E
E1
D
p
B
n
1
Q1
A2
A
c
A1
L
Units
INCHES
NOM
5
MILLIMETERS*
Dimension Limits
MIN
MAX
MIN
NOM
5
MAX
n
p
Number of Pins
Pitch
.026 (BSC)
0.65 (BSC)
Overall Height
A
.031
.031
.000
.071
.045
.071
.004
.004
.004
.006
.043
0.80
1.10
Molded Package Thickness
Standoff
A2
A1
E
.039
.004
.094
.053
.087
.012
.016
.007
.012
0.80
0.00
1.80
1.15
1.80
0.10
0.10
0.10
0.15
1.00
0.10
2.40
1.35
2.20
0.30
0.40
0.18
0.30
Overall Width
Molded Package Width
Overall Length
E1
D
Foot Length
L
Q1
c
Top of Molded Pkg to Lead Shoulder
Lead Thickness
Lead Width
B
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .005" (0.127mm) per side.
JEITA (EIAJ) Standard: SC-70
Drawing No. C04-061
2003 Microchip Technology Inc.
DS21733D-page 13
MCP6001/2/4
5-Lead Plastic Small Outline Transistor (OT) (SOT23)
E
E1
p
B
p1
D
n
1
α
c
A
A2
φ
A1
L
β
Units
Dimension Limits
INCHES*
NOM
MILLIMETERS
MIN
MAX
MIN
NOM
5
MAX
n
p
p1
A
A2
A1
E
E1
D
L
φ
c
B
α
β
Number of Pins
Pitch
Outside lead pitch (basic)
Overall Height
Molded Package Thickness
5
.038
.075
.046
.043
.003
.110
.064
.116
.018
5
0.95
1.90
.035
.035
.000
.102
.059
.110
.014
0
.057
0.90
0.90
1.18
1.10
0.08
2.80
1.63
2.95
0.45
5
1.45
.051
.006
.118
.069
.122
.022
10
.008
.020
10
1.30
0.15
3.00
1.75
3.10
0.55
10
0.20
0.50
10
Standoff
§
0.00
2.60
1.50
2.80
0.35
0
Overall Width
Molded Package Width
Overall Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
.004
.014
0
.006
.017
5
0.09
0.35
0
0.15
0.43
5
Mold Draft Angle Top
Mold Draft Angle Bottom
0
5
10
0
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-178
Drawing No. C04-091
DS21733D-page 14
2003 Microchip Technology Inc.
MCP6001/2/4
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
B
p
eB
Units
Dimension Limits
INCHES*
NOM
MILLIMETERS
MIN
MAX
MIN
NOM
MAX
n
p
A
A2
A1
E
E1
D
L
c
B1
B
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
8
8
.100
.155
.130
2.54
3.94
3.30
.140
.170
.145
3.56
4.32
3.68
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
2.92
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
.313
.250
.373
.130
.012
.058
.018
.370
10
.325
.260
.385
.135
.015
.070
.022
.430
15
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
§
eB
α
β
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
2003 Microchip Technology Inc.
DS21733D-page 15
MCP6001/2/4
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
h
α
45°
c
A2
A
φ
β
L
A1
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
A
A2
A1
E
E1
D
Number of Pins
Pitch
Overall Height
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
1.27
.053
.069
1.35
1.32
1.55
1.42
0.18
6.02
3.91
4.90
0.38
0.62
4
1.75
Molded Package Thickness
Standoff
.052
.004
.228
.146
.189
.010
.019
0
.061
.010
.244
.157
.197
.020
.030
8
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
§
0.10
5.79
3.71
4.80
0.25
0.48
0
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
h
L
φ
c
Lead Thickness
Lead Width
.008
.013
0
.009
.017
12
.010
.020
15
0.20
0.33
0
0.23
0.42
12
0.25
0.51
15
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
DS21733D-page 16
2003 Microchip Technology Inc.
MCP6001/2/4
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
E
E1
p
D
2
B
n
1
α
A2
A
c
φ
A1
(F)
L
β
Units
Dimension Limits
INCHES
NOM
MILLIMETERS*
MIN
MAX
MIN
NOM
MAX
n
p
Number of Pins
Pitch
8
8
.026 BSC
0.65 BSC
Overall Height
A
A2
A1
E
-
-
.043
-
-
1.10
Molded Package Thickness
Standoff
.030
.000
.033
-
.037
.006
0.75
0.00
0.85
-
0.95
0.15
Overall Width
.193 TYP.
4.90 BSC
Molded Package Width
Overall Length
Foot Length
E1
D
.118 BSC
.118 BSC
3.00 BSC
3.00 BSC
L
.016
.024
.037 REF
.031
0.40
0.60
0.95 REF
0.80
Footprint (Reference)
Foot Angle
F
φ
c
0°
.003
.009
5°
-
8°
.009
.016
15°
0°
0.08
0.22
5°
-
-
-
-
-
8°
0.23
0.40
15°
Lead Thickness
Lead Width
.006
B
α
β
.012
Mold Draft Angle Top
Mold Draft Angle Bottom
*Controlling Parameter
Notes:
-
-
5°
15°
5°
15°
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC Equivalent: MO-187
Drawing No. C04-111
2003 Microchip Technology Inc.
DS21733D-page 17
MCP6001/2/4
14-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
B1
β
eB
p
B
Units
Dimension Limits
INCHES*
NOM
MILLIMETERS
MIN
MAX
MIN
NOM
14
MAX
n
p
A
A2
A1
E
E1
D
L
c
B1
B
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
14
.100
.155
.130
2.54
3.94
3.30
.140
.170
.145
3.56
2.92
0.38
7.62
6.10
18.80
3.18
0.20
1.14
0.36
7.87
5
4.32
3.68
.115
.015
.300
.240
.740
.125
.008
.045
.014
.310
5
.313
.250
.750
.130
.012
.058
.018
.370
10
.325
.260
.760
.135
.015
.070
.022
.430
15
7.94
6.35
19.05
3.30
0.29
1.46
0.46
9.40
10
8.26
6.60
19.30
3.43
0.38
1.78
0.56
10.92
15
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
§
eB
α
β
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-005
DS21733D-page 18
2003 Microchip Technology Inc.
MCP6001/2/4
14-Lead Plastic Small Outline (SL) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
α
h
45°
c
A2
A
φ
A1
L
β
Units
Dimension Limits
INCHES*
NOM
MILLIMETERS
MIN
MAX
MIN
NOM
MAX
n
p
A
A2
A1
E
E1
D
Number of Pins
Pitch
Overall Height
14
14
.050
.061
.056
.007
.236
.154
.342
.015
.033
4
1.27
1.55
1.42
0.18
5.99
3.90
8.69
0.38
0.84
4
.053
.069
1.35
1.75
Molded Package Thickness
.052
.004
.228
.150
.337
.010
.016
0
.061
.010
.244
.157
.347
.020
.050
8
1.32
0.10
5.79
3.81
8.56
0.25
0.41
0
1.55
0.25
6.20
3.99
8.81
0.51
1.27
8
Standoff
§
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
h
L
φ
c
.008
.014
0
.009
.017
12
.010
.020
15
0.20
0.36
0
0.23
0.42
12
0.25
0.51
15
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
0
12
15
0
12
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-065
2003 Microchip Technology Inc.
DS21733D-page 19
MCP6001/2/4
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
E
E1
p
D
2
1
n
B
α
A
c
φ
A1
A2
β
L
Units
INCHES
NOM
MILLIMETERS*
Dimension Limits
MIN
MAX
MIN
NOM
14
MAX
n
p
Number of Pins
Pitch
Overall Height
14
.026
0.65
A
.043
1.10
0.95
0.15
6.50
4.50
5.10
0.70
8
Molded Package Thickness
A2
A1
E
E1
D
L
φ
c
.033
.002
.246
.169
.193
.020
0
.004
.007
0
.035
.004
.251
.173
.197
.024
4
.006
.010
5
.037
.006
.256
.177
.201
.028
8
.008
.012
10
0.85
0.05
6.25
4.30
4.90
0.50
0
0.09
0.19
0
0.90
0.10
6.38
4.40
5.00
0.60
4
0.15
0.25
5
Standoff
§
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
0.20
0.30
10
B1
α
β
0
5
10
0
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-087
DS21733D-page 20
2003 Microchip Technology Inc.
MCP6001/2/4
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X
/XX
a)
b)
c)
d)
e)
MCP6001T-I/LT: TapeandReel, Industrial
Temperature Package
Range
Temperature, 5LD SC-70 package
MCP6001T-I/OT: Tape and Reel, Industrial
Temperature, 5LD SOT-23 package.
MCP6001RT-I/OT: Tape and Reel, Industrial
Temperature, 5LD SOT-23 package.
MCP6001UT-E/OT:Tape and Reel, Extended
Temperature, 5LD SOT-23 package.
MCP6001UT-I/OT:Tape and Reel, Industrial
Temperature, 5LD SOT-23 package.
Device:
MCP6001T:
1 MHz Bandwidth, Low Power Op Amp
(Tape and Reel) (SC-70, SOT-23)
1 MHz Bandwidth, Low Power Op Amp
(Tape and Reel) (SOT-23)
MCP6001RT:
MCP6001UT: 1 MHz Bandwidth, Low Power Op Amp
(Tape and Reel) (SOT-23)
MCP6002:
1 MHz Bandwidth, Low Power Op Amp
1 MHz Bandwidth, Low Power Op Amp
(Tape and Reel) (SOIC, MSOP)
MCP6002T:
a)
b)
c)
d)
e)
f)
MCP6002-I/MS: Industrial Temperature,
8LD MSOP package.
MCP6002-I/P:
8LD PDIP package.
MCP6002-E/P:
8LD PDIP package.
MCP6002-I/SN: Industrial Temperature,
8LD SOIC package.
MCP6002T-I/MS: TapeandReel, Industrial
Temperature, 8LD MSOP package.
MCP6002T-I/SN: TapeandReel, Industrial
Temperature, 8LD SOIC package.
MCP6004:
1 MHz Bandwidth, Low Power Op Amp
1 MHz ,Bandwidth Low Power Op Amp
(Tape and Reel) (SOIC, MSOP)
Industrial Temperature,
MCP6004T:
Extended Temperature,
Temperature Range:
Package:
I
=
=
-40°C to +85°C
E
-40°C to +125°C
LT
=
=
Plastic Package (SC-70), 5-lead (MCP6001 only)
Plastic Small Outline Transistor (SOT-23), 5-lead
(MCP6001, MCP6001R, MCP6001U)
Plastic MSOP, 8-lead
OT
MS
P
=
=
=
=
=
Plastic DIP (300 mil Body), 8-lead, 14-lead
Plastic SOIC, (150 mil Body), 8-lead
Plastic SOIC (150 mil Body), 14-lead
Plastic TSSOP (4.4mm Body), 14-lead
a)
b)
c)
d)
e)
f)
MCP6004-I/P:
Industrial Temperature,
SN
SL
ST
14LD PDIP package.
MCP6004-I/SL:
14LD SOIC package.
Industrial Temperature,,
MCP6004-E/SL: Extended Temperature,,
14LD SOIC package.
MCP6004-I/ST:
Industrial Temperature,
14LD TSSOP package.
MCP6004T-I/SL: TapeandReel, Industrial
Temperature, 14LD SOIC package.
MCP6004T-I/ST: TapeandReel, Industrial
Temperature, 14LD TSSOP package.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2003 Microchip Technology Inc.
DS21733D-page 21
MCP6001/2/4
NOTES:
DS21733D-page 22
2003 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.
Trademarks
The Microchip name and logo, the Microchip logo, KEELOQ,
MPLAB, PIC, PICmicro, PICSTART, PRO MATE and
PowerSmart are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL
and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Accuron, Application Maestro, dsPIC, dsPICDEM,
dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM,
fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC,
microPort, Migratable Memory, MPASM, MPLIB, MPLINK,
MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal,
PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select
Mode, SmartSensor, SmartShunt, SmartTel and Total
Endurance are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2003, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
®
PICmicro 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
2003 Microchip Technology Inc.
DS21733D-page 23
M
WORLDWIDE SALES AND SERVICE
Japan
AMERICAS
ASIA/PACIFIC
Microchip Technology Japan K.K.
Benex S-1 6F
Corporate Office
Australia
2355 West Chandler Blvd.
Microchip Technology Australia Pty Ltd
Marketing Support Division
Suite 22, 41 Rawson Street
Epping 2121, NSW
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Australia
Korea
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Atlanta
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
China - Beijing
3780 Mansell Road, Suite 130
Alpharetta, GA 30022
Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
Tel: 770-640-0034 Fax: 770-640-0307
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Boston
Bei Hai Wan Tai Bldg.
Singapore
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848 Fax: 978-692-3821
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100 Fax: 86-10-85282104
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Chicago
China - Chengdu
Singapore, 188980
333 Pierce Road, Suite 180
Itasca, IL 60143
Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401-2402, 24th Floor,
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Tel: 630-285-0071 Fax: 630-285-0075
Microchip Technology (Barbados) Inc.,
Taiwan Branch
Ming Xing Financial Tower
Dallas
No. 88 TIDU Street
4570 Westgrove Drive, Suite 160
Addison, TX 75001
11F-3, No. 207
Chengdu 610016, China
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 86-28-86766200 Fax: 86-28-86766599
Tel: 972-818-7423 Fax: 972-818-2924
China - Fuzhou
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Detroit
Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
Tri-Atria Office Building
EUROPE
Austria
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250 Fax: 248-538-2260
No. 71 Wusi Road
Microchip Technology Austria GmbH
Durisolstrasse 2
Fuzhou 350001, China
Kokomo
Tel: 86-591-7503506 Fax: 86-591-7503521
A-4600 Wels
2767 S. Albright Road
Kokomo, IN 46902
China - Hong Kong SAR
Austria
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark
Tel: 765-864-8360 Fax: 765-864-8387
Los Angeles
Kwai Fong, N.T., Hong Kong
18201 Von Karman, Suite 1090
Irvine, CA 92612
Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Tel: 852-2401-1200 Fax: 852-2401-3431
China - Shanghai
Tel: 949-263-1888 Fax: 949-263-1338
Microchip Technology Consulting (Shanghai)
Co., Ltd.
Ballerup DK-2750 Denmark
Phoenix
Tel: 45-4420-9895 Fax: 45-4420-9910
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-4338
Room 701, Bldg. B
France
Far East International Plaza
No. 317 Xian Xia Road
Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
San Jose
Shanghai, 200051
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
Batiment A - ler Etage
China - Shenzhen
91300 Massy, France
Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Tel: 408-436-7950 Fax: 408-436-7955
Germany
Rm. 1812, 18/F, Building A, United Plaza
No. 5022 Binhe Road, Futian District
Shenzhen 518033, China
Toronto
Microchip Technology GmbH
Steinheilstrasse 10
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509
D-85737 Ismaning, Germany
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Tel: 86-755-82901380 Fax: 86-755-8295-1393
China - Qingdao
Rm. B505A, Fullhope Plaza,
Italy
No. 12 Hong Kong Central Rd.
Qingdao 266071, China
Microchip Technology SRL
Via Quasimodo, 12
20025 Legnano (MI)
Milan, Italy
Tel: 86-532-5027355 Fax: 86-532-5027205
India
Tel: 39-0331-742611 Fax: 39-0331-466781
Microchip Technology Inc.
India Liaison Office
United Kingdom
Marketing Support Division
Divyasree Chambers
Microchip Ltd.
505 Eskdale Road
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44-118-921-5869 Fax: 44-118-921-5820
05/30/03
DS21733D-page 24
2003 Microchip Technology Inc.
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