MCP1501T-30E/RW [MICROCHIP]
High-Precision Buffered Voltage Reference;
| 型号： | MCP1501T-30E/RW |
| 厂家： | 
MICROCHIP |
| 描述： | High-Precision Buffered Voltage Reference |
| 文件： | 总36页 (文件大小：1094K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MCP1501
High-Precision Buffered Voltage Reference
Features
Introduction
• Maximum Temperature Coefficient: 50 ppm/°C
from -40°C to +125°C
The MCP1501 is a buffered voltage reference capable
of sinking and sourcing 20 mA of current. The voltage
reference is a low-drift bandgap-based reference. The
bandgap uses chopper-based amplifiers, effectively
reducing the drift to zero.
• Initial Accuracy: 0.1%
• Operating Temperature Range: -40 to +125°C
• Low Typical Operating Current: 140 μA
The MCP1501 is available in the following packages:
• Line Regulation: 50 ppm/V maximum
• 6-Lead SOT-23
• Load Regulation: 40 ppm/mA maximum
• 8-Lead SOIC
• 8 Voltage variants available:
• 8-Lead 2 mm x 2 mm WDFN
- 1.024V
- 1.250V
Package Types
- 1.800V
- 2.048V
MCP1501
6-Lead SOT-23
- 2.500V
- 3.000V
V
OUT
GND
GND
1
6
5
4
DD
- 3.300V
- 4.096V
GND
2
3
• Output Noise (10 Hz to 10 kHz): < 0.1 µVP-P
SHDN
Applications
• Precision Data Acquisition Systems
• High-Resolution Data Converters
• Medical Equipment Applications
• Industrial Controls
MCP1501
8-Lead SOIC
V
FEEDBACK
DD
1
8
7
OUT
• Battery-Powered Devices
NC 2
3
4
6 GND
SHDN
GND
GND
5
MCP1501
2x2 WDFN*
V
FEEDBACK
OUT
1
8
7
DD
GND
2
EP
9
SHDN
GND
GND
GND
3
6
5
4
*Includes Exposed Thermal Pad (EP). See Table 3-1
2015-2016 Microchip Technology Inc.
DS20005474C-page 1
MCP1501
BLOCK DIAGRAM
VDD
OUT
Σ
FEEDBACK
SHDN
Shutdown
Circuitry
GND
DS20005474C-page 2
2015-2016 Microchip Technology Inc.
MCP1501
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings(†)
VDD.............................................................................................................................................................................5.5V
Maximum current into VDD pin ............................................................................................................................... 30 mA
Clamp current, IK (VPIN < 0 or VPIN > VDD)...........................................................................................................±20 mA
Maximum output current sunk by OUTPUT pin ......................................................................................................30 mA
Maximum output current sourced by OUTPUT pin .................................................................................................30 mA
(HBM:CDM:MM)................................................................................................................................ (2 kV:±1.5 kV:200V)
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
Electrical Characteristics: Unless otherwise specified, VDD(MIN) VDD 5.5V at -40C TA +125C.
Characteristic
Supply Voltage
Sym.
Min.
Typ.
Max.
Units
Conditions
MCP1501-10
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VPOR
1.65
1.7
—
—
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
—
V
V
V
V
V
V
V
V
V
MCP1501-12
MCP1501-18
MCP1501-20
MCP1501-25
MCP1501-30
MCP1501-33
MCP1501-40
2.0
—
2.25
2.70
3.2
—
—
—
3.5
—
4.3
—
Power-on-Reset
Release Voltage
—
1.45
Power-on-Reset
Rearm Voltage
—
—
0.8
—
V
Output Voltage MCP1501-10
MCP1501-12
VOUT
1.0232 1.024
1.2490 1.250
1.7985 1.800
2.0460 2.048
2.4980 2.500
2.9975 3.000
3.2975 3.300
4.0925 4.096
1.0248
1.2510
1.8015
2.0500
2.5020
3.0025
3.3025
4.0995
50
V
V
MCP1501-18
V
MCP1501-20
V
MCP1501-25
V
MCP1501-30
V
MCP1501-33
V
V
MCP1501-40
Temperature
Coefficient
MCP1501-XX
TC
—
—
—
10
—
—
ppm/C
Line
Regulation
VOUT
VIN
VOUT
IOUT
/
/
50
ppm/V
Load
Regulation
40 ppm– ppm/mA -5 mA < ILOAD < +5 mA
sink
70 ppm–
source
Dropout
Voltage
VDO
—
—
200
mV
-5 mA < ILOAD < +2 mA
Power Supply
Rejection
Ratio
PSRR
94 dB
1.024V option, VIN = 5.5V,
1 kHz at 100 mVP-P
2015-2016 Microchip Technology Inc.
DS20005474C-page 3
MCP1501
TABLE 1-1:
DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise specified, VDD(MIN) VDD 5.5V at -40C TA +125C.
Characteristic
Shutdown
Sym.
Min.
Typ.
Max.
Units
Conditions
VIN = 5.5V
VIL
VIH
1.35
3.80
OutputVoltage
Hysteresis
∆VOUT_HYST
300 µV
Refer to Section 1.1.10
“Output Voltage Hysteresis”
for additional details on
testing conditions.
Output Noise MCP1501-10
MCP1501-20
eN
eN
eN
—
—
—
—
—
—
—
0.1
5
—
—
—
—
—
—
—
µVP-P
µVP-P
µVP-P
0.1 Hz to 10 Hz, TA = +25C
10 Hz to 10 kHz, TA = +25C
0.1 Hz to 10 Hz, TA = +25C
10 Hz to 10 kHz, TA = +25C
0.1 Hz to 10 Hz, TA = +25C
10 Hz to 10 kHz, TA = +25C
0.1
10
MCP1501-40
0.1
20
Maximum
Load Current
ILOAD
IDD
±20
mA
µA
TA = +25°C
2.048V option
Supply
Current
—
—
140
—
550
350
No Load
No Load, TA = +25°C
TA = +25°C
Shutdown
Current
MCP1501-10
MCP1501-20
MCP1501-40
ISHDN
205
185
185
nA
TABLE 1-2:
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all parameters apply at AVDD, DVDD = 2.7 to 3.6V.
Parameters
Temperature Ranges
Sym.
Min.
Typ.
Max.
Units
Conditions
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistance
Thermal Resistance for SOT-23-6
Thermal Resistance for SOIC-8
Thermal Resistance for DFN-8
TA
TA
-40
-65
—
—
+125
+150
°C
°C
JA
JA
JA
—
—
—
+190.5
+149.5
+141.3
—
—
—
°C/W
°C/W
°C/W
DS20005474C-page 4
2015-2016 Microchip Technology Inc.
MCP1501
EQUATION 1-3:
1.1
Terminology
V
OUT
1.1.1
OUTPUT VOLTAGE
--------------------
100% = % Line Regulation
V
IN
Output voltage is the reference voltage that is available
on the OUT pin.
Line regulation may also be expressed as %/V or in
ppm/V, as shown in Equation 1-4 and Equation 1-5,
respectively.
1.1.2
INPUT VOLTAGE
The input voltage (VIN) is the range of voltage that can
be applied to the VDD pin and still have the device
produce the designated output voltage on the OUT pin.
EQUATION 1-4:
V
OUT
1.1.3
TEMPERATURE COEFFICIENT
(TC
---------------------------------------
V
OUTNOM
)
%
----
OUT
---------------------------------------------
100% =
Line Regulation
V
V
The output temperature coefficient or voltage drift is a
measure of how much the output voltage will vary from
its initial value with changes in ambient temperature.
The value specified in the electrical specifications is
measured as shown in Equation 1-1.
IN
EQUATION 1-5:
V
OUT
---------------------------------------
V
EQUATION 1-1:
TC
CALCULATION
OUTPUT
OUTNOM
6
ppm
----------
---------------------------------------------
10 =
Line Regulation
V
V
IN
OUT
– OUT
6
MAX
MIN
--------------------------------------------------------
10 ppm/C
TC
=
OUT
As an example, if the MCP1501-20 is implemented in a
design and a 2 µV change in output voltage is mea-
sured from a 250 mV change on the input, then the
error in percent, ppm, percent/volt, and ppm/volt, as
shown in Equation 1-6 – Equation 1-9.
T OUT
NOM
Where:
OUTMAX
=
Maximum output voltage over the
temperature range
EQUATION 1-6:
OUTMIN
OUTNOM
T
=
=
=
Minimum output voltage over the
temperature range
V
OUT
2 V
250 mV
--------------------
------------------
100%
100% = .0008%
Average output voltage over the
temperature range
V
IN
Temperature range over which the
data was collected
EQUATION 1-7:
V
6
6
OUT
2 V
250 mV
1.1.4
DROPOUT VOLTAGE
--------------------
------------------
10
10 = 8 ppm
V
IN
The dropout voltage is defined as the voltage difference
between VDD and VOUT under load. Equation 1-2 is
used to calculate the dropout voltage.
EQUATION 1-8:
2 V
EQUATION 1-2:
-----------------
2.048V
V
OUT
%
--------------------
----------------------
----
100% = 0.000390625
100% =
V
= V – V
IN
| I
OUT OUT
= Constant
V
250 mV
V
DO
IN
1.1.5
LINE REGULATION
EQUATION 1-9:
An ideal voltage reference will maintain a constant out-
put voltage regardless of any changes to the input volt-
age. However, when real devices are considered, a
small error may be measured on the output when an
input voltage change occurs.
2 V
-----------------
V
2.048V
6
6
ppm
-----------
OUT
--------------------
----------------------
10
=
10 = 3.90625
V
250 mV
V
IN
Line regulation is defined as the change in output volt-
age (VOUT) as a function of a change in input voltage
(VIN), and expressed as a percentage, as shown in
Equation 1-3.
2015-2016 Microchip Technology Inc.
DS20005474C-page 5
MCP1501
1.1.6
LOAD REGULATION
An ideal voltage reference will maintain the specified
output voltage regardless of the load's current demand.
However, real devices experience a small error voltage
that deviates from the specified output voltage when a
load is present.
Load regulation is defined as the voltage difference
when under no load (VOUT @ IOUT|0) and under maxi-
mum load (VOUT @ IOUT|MAX), and is expressed as a
percentage, as shown in Equation 1-10.
EQUATION 1-10:
V
@ I
– V
@ I
OUT
OUT|0
@ I
OUT
OUT|MAX
--------------------------------------------------------------------------------------------------------------
100% = % Load Regulation
V
OUT
OUT|MAX
Similar to line regulation, load regulation may also be
expressed as %/mA or in ppm/mA as shown in
Equation 1-11 and Equation 1-12, respectively.
EQUATION 1-16:
V
OUT
10 V
----------------------------------
-----------------
V
2.048V
OUTMAX
6
6
ppm
----------
10 = 0.2441
----------------------------------------
----------------------
10
=
I
2 mA
mA
EQUATION 1-11:
OUT
V
OUT
---------------------------------------
V
OUTNOM
%
mA
---------------------------------------------
-------
100% =
Line Regulation
I
OUT
EQUATION 1-12:
V
OUT
---------------------------------------
V
OUTNOM
6
ppm
----------
---------------------------------------------
10 =
Load Regulation
I
mA
OUT
As an example, if the MCP1501-20 is implemented in a
design and a 10 µV change in output voltage is mea-
sured from a 2 mA change on the input, then the error
in percent, ppm, percent/volt, ppm/volt, as shown in
Equation 1-13 – Equation 1-16.
EQUATION 1-13:
2.048V – 2.04799V
----------------------------------------------
100% = .0004882%
2.04799V
EQUATION 1-14:
6
6
2.048V – 2.04799V
2.048V – 2.04799V
----------------------------------------------
----------------------------------------------
10 =
10 = 4.882 ppm
2.04799V
2.04799V
EQUATION 1-15:
V
OUT
10 V
-----------------------------------
-----------------
V
2.048V
OUTNOM
%
mA
-----------------------------------------
----------------------
-------
100% =
100% = 0.2441
I
2 mA
OUT
DS20005474C-page 6
2015-2016 Microchip Technology Inc.
MCP1501
1.1.7
INPUT CURRENT
The input current (operating current) is the current that
sinks from VIN to GND without a load current on the
output pin. This current is affected by temperature,
input voltage, output voltage, and the load current.
1.1.8
POWER SUPPLY REJECTION
RATIO
Power supply rejection ratio (PSRR) is a measure of
the change in output voltage (∆VOUT) relative to the
change in input voltage (∆VIN) over frequency.
1.1.9
LONG-TERM DRIFT
The long-term output stability is measured by exposing
the devices to an ambient temperature of +125°C, as
shown in Figure 2-18 while configured in the circuit
shown in Figure 1-1. In this test, all electrical specifica-
tions of the devices are measured periodically at
+25°C.
Power
VIN
FB
GND
GND
GND
VOUT
GND
GND
Signal In
FIGURE 1-1:
Long-Term Drift Test Circuit.
1.1.10 OUTPUT VOLTAGE HYSTERESIS
The output voltage hysteresis is a measure of the out-
put voltage error after the powered devices are cycled
over the entire operating temperature range. The
amount of hysteresis can be quantified by measuring
the change in the +25°C output voltage after tempera-
ture excursions from +25°C to +125°C to +25°C, and
also from +25°C to -40°C to +25°C.
2015-2016 Microchip Technology Inc.
DS20005474C-page 7
MCP1501
NOTES:
DS20005474C-page 8
2015-2016 Microchip Technology Inc.
MCP1501
2.0
TYPICAL OPERATING CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise specified, maximum values
are: VDD(MIN) VDD 5.5V at -40C TA +125C.
40
35
30
25
20
15
10
5
1.024V
1.8V
1.25V
2.048V
3V
2.5V
3.3V
4.096V
4.098
4.097
4.096
4.095
4.094
4.093
4.092
0
-40
25
125
Temperature (°C)
-40
5
25
85
125
Temperature (°C)
FIGURE 2-4:
Temperature, I
Load Regulation vs.
5mA Sink.
LOAD
FIGURE 2-1:
V
vs. Temperature, No
OUT
Load, 4.096V Option.
40
35
30
25
20
15
10
5
1.024V
2.5V
1.25V
3V
1.8V
3.3V
2.048V
4.096V
2.0485
2.048
2.0475
2.047
0
2.0465
2.046
-40
25
Temperature (°C)
125
-40
5
25
Temperature (°C)
85
125
FIGURE 2-5:
Temperature, I
Load Regulation vs.
5mA Source.
LOAD
FIGURE 2-2:
V
vs. Temperature, No
OUT
Load, 2.048V Option.
300
275
250
225
200
175
V287 = 4.096Vꢀ
V287ꢀ= 2.048Vꢀ
V287ꢀ= 1.024V
1.0244
1.0242
1.024
1.0238
1.0236
1.0234
1.0232
1.023
150
-40
5
25
85
125
Temperature (°C)
-40
5
25
85
125
Temperature (°C)
FIGURE 2-6:
I
vs. Temperature, All
DD
Options.
FIGURE 2-3:
V
vs. Temperature, No
OUT
Load, 1.024V Option.
2015-2016 Microchip Technology Inc.
DS20005474C-page 9
MCP1501
450
400
350
300
250
200
150
100
50
260
240
220
200
180
160
140
120
100
Average
-3 Sigma
+3 Sigma
Average
+3 Sigma
-3 Sigma
0
-40
5
25
85
125
Temperature (°C)
VDD (V)
FIGURE 2-7:
I
vs. Temperature for
FIGURE 2-10:
I
vs. V , V
= 1.024V,
DD
DD
DD OUT
V
, 50 Units, No Load, 4.096V Option.
50 Units, No Load.
OUT
5
4.5
4
3.5
3
2.5
2
1.5
1
300
V287
V287
V287ꢀ
=
=
=
1.024Vꢀ
2.048Vꢀ
3.3V
V287
V287
V287
=
=
=
1.25Vꢀ
2.5Vꢀ
V287
V287
=
=
1.8V
3.0V
4.096V
250
200
150
100
50
Average
+3 Sigma
-3 Sigma
0.5
0
0
-40
5
25
85
125
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (°C)
Temperature (°C)
FIGURE 2-8:
I
vs. Temperature for
FIGURE 2-11:
Line Regulation vs.
DD
V
, 50 Units, No Load, 1.024V Option.
Temperature.
OUT
10000
1000
100
10
350
300
250
200
150
100
50
V287 = 1.024V, ꢀV'' = 1.65Vꢀ
V287 = 1.024V, V'' = 5.5Vꢀ
V287 = 4.096V, V'' = 4.3Vꢀ
V287 = 4.096V, ꢀꢀꢀV'' = 5.5V
1
Average
+3 Sigma
-3 Sigma
0.1
0.01
1
100
10000
1000000
0
4.3 4.45 4.6 4.75 4.9 5.05 5.2
VDD (V)
5.5
Frequency
FIGURE 2-9:
I
vs. V , V
= 4.096V,
FIGURE 2-12:
Noise vs. Frequency, No
DD
DD OUT
50 Units, No Load.
Load, T = +25°C.
A
DS20005474C-page 10
2015-2016 Microchip Technology Inc.
MCP1501
120
100
80
60
40
20
0
0.18
0.16
0.14
0.12
0.1
0.08
0.06
0.04
0.02
0
V287 = 1.024, V,1 = 1.65Vꢀ
V287 = 1.024V, V,1 = 5.5Vꢀ
V287 = 4.096V, V,1 = 4.3Vꢀ
V287 = 4.096V, V,1 = 5.5V
1
10
100
1000
10000
100000
1
3
5
7
9
11 13 15 17 19 21 23 25 27 29
Frequency (Hz)
Temperature Coefficient (ppm/&)
FIGURE 2-13:
PSRR vs. Frequency, No
FIGURE 2-16:
Tempco Distribution, No
Load, T = +25°C.
Load, T = +25°C, V = 2.7V, 50 Units.
A
A
DD
120
100
80
0.16
0.14
0.12
0.1
0.08
0.06
0.04
0.02
0
60
40
V287 = 1.024V, V,1 = 1.65V
V287 = 1.024V, V,1 = 5.5Vꢀ
V287 = 4.096V, V,1 = 4.3Vꢀ
V287 = 4.096V, V,1 = 5.5V
20
0
1
3
5
7
9
11 13 15 17 19 21 23 25 27 29
1
10
100
1000
10000
100000
Frequency (Hz)
Temperature Coefficient (ppm/&)
FIGURE 2-14:
PSRR vs. Frequency, 1 kΩ
FIGURE 2-17:
Tempco Distribution, No
Load, T = +25°C.
Load, T = +25°C, V = 5.5V, 50 Units.
A
A
DD
160
140
120
100
80
1.2
1
Average
+3 Sigma
-3 Sigma
0.8
0.6
0.4
0.2
0
60
-0.2
-0.4
-0.6
40
20
0
0
48
Time (Hrs)
1008
-5
-2
0
2
5
Load (mA)
FIGURE 2-15:
Dropout Voltage vs. Load,
FIGURE 2-18:
V
Drift vs. Time,
OUT
T = +25°C, 2.048V Option.
T = +25°C, No Load, 800 Units.
A
A
2015-2016 Microchip Technology Inc.
DS20005474C-page 11
MCP1501
2.0485
2.0484
2.0483
2.0482
2.0481
2.048
2.0479
2.0478
2.0477
2.0476
2.0475
-30
-20
-10
0
10
20
30
Load (mA)
FIGURE 2-19:
V
vs. Load, T = +25°C,
FIGURE 2-22:
Noise vs. Time, VDD = 5.5V,
OUT
A
2.048V Option.
T = +25°C, 2.048V Option, No Load, 2 µV/div,
A
100 ms/div.
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
QC +25°C
QC -40°C
QC +125°C
VOUT
2V/div
500 µs/div
VIN
2V/div
500 µs/div
C
VOUT
FIGURE 2-20:
V
at V
,
FIGURE 2-23:
Turn On Transient,
OUT
DDMIN
V
= 2.7V, 800 Units, 2.5V Option, No Load.
V
= 5/5V, V = 2.048V Option, No Load.
DD
DD
IN
0.45
QC +25°C
QC -40°C
QC +125°C
VIN
0.40
1V/div
5 ms/div
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
VOUT
/div
10 mV
5 ms/div
C
VOUT
FIGURE 2-21:
V
Distribution at
OUT
FIGURE 2-24:
Line Transient, V = 5.5V,
DD
V
, V = 5.5V, 800 Units, 2.5V Option, No
V
= 500 mV @ 5V , 2.048V Option, No
DDMAX
DD
IN
PP DC
Load.
Load.
DS20005474C-page 12
2015-2016 Microchip Technology Inc.
MCP1501
IOUT
10 mA/div
VOUT
500 mV/div
200 µs/div
FIGURE 2-25:
Load Transient, V = 5.5,
DD
V
= 2.5, 2.048V Option.
IN
1.E-3
100.E-6
10.E-6
1.E-6
100.E-9
10.E-9
1.E-9
R,62 = 1Ω
100.E-12
10.E-12
1.E-12
R,62 = 10Ω
R,62 = 100Ω
R,62 = 1kΩ
0
45
Phase Margin (°)
90
135
FIGURE 2-26:
R
vs. C
, 4.096V
LOAD
ISO
Option Unloaded.
1.E-3
100.E-6
10.E-6
1.E-6
100.E-9
10.E-9
1.E-9
100.E-12
10.E-12
1.E-12
R
ISO = 1Ω
R
= 10Ω
ISO
ISO
ISO
R
R
= 100Ω
= 1kΩ
0
45
90
135
Phase Margin (°)
FIGURE 2-27:
Option Loaded.
R
vs. C
, 4.096V
LOAD
ISO
2015-2016 Microchip Technology Inc.
DS20005474C-page 13
MCP1501
NOTES:
DS20005474C-page 14
2015-2016 Microchip Technology Inc.
MCP1501
3.0
PIN FUNCTION TABLE
The pin functions are described in Table 3-1.
TABLE 3-1:
SOT-23
PIN FUNCTION TABLE
SOIC
2 x 2 WDFN
Symbol
OUT
Function
1
—
8
8
Buffered VREF Output
7
7
FEEDBACK
GND
Buffered VREF Feedback
System Ground
2,3,5
4
2,4,5,6
2,4,5,6
3
1
3
1
9
SHDN
VDD
Shutdown Pin Active Low
Power Supply Input
6
—
—
EP
Exposed Thermal Pad
3.1
Buffered VREF Output (OUT)
This is the Buffered Reference Output. On the WDFN
and SOIC package, this should be connected to the
FEEDBACK pin at the device. The output driver is
tristated when in shutdown.
3.2
Buffered VREF Feedback
(FEEDBACK)
This is the buffer amplifier feedback pin. On the WDFN
and SOIC package, this should be connected to the
OUT pin at the device. This connection is internal on
the SOT-23 package. Note that if there is routing
impedance or IR-drop between the OUT and
FEEDBACK pins, it is the FEEDBACK pin which accu-
rately holds the output voltage. This can be used in an
application to remove IR-drop effects on output voltage
caused by the Printed Circuit Board (PCB) or
interconnect resistance with a high-current load.
3.3
System Ground (GND)
This is the power supply return and should be
connected to system ground.
3.4
Shutdown Pin (SHDN)
This is a digital input that will place the device in
Shutdown. This pin is active low.
3.5
Power Supply Input (VDD)
This power pin also serves as the input voltage for the
voltage reference. Refer to the Electrical Tables to
determine minimum voltage, based on the device.
3.6
Exposed Thermal Pad (EP)
Not internally connected, but recommend grounding.
2015-2016 Microchip Technology Inc.
DS20005474C-page 15
MCP1501
NOTES:
DS20005474C-page 16
2015-2016 Microchip Technology Inc.
MCP1501
4.0
THEORY OF OPERATION
The MCP1501 is a buffered voltage reference that is
capable of operating over a wide input supply range
while providing a stable output across the input supply
range. The fundamental building block (see Block Dia-
gram) of the MCP1501 is an internal bandgap refer-
ence circuit. As with all bandgap circuits, the internal
reference sums together two voltages having an oppo-
site temperature coefficient which allows a voltage ref-
erence that is practically independent from
temperature.
The bandgap of the MCP1501 is based on a second
order temperature coefficient (TC) compensated band-
gap circuit that allows the MCP1501 to achieve high ini-
tial accuracy and low temperature coefficient operation
across supply and ambient temperature. The bandgap
curvature compensation is determined during device
characterization and is trimmed for optimal accuracy.
The MCP1501 also includes a chopper-based amplifier
architecture that ensures excellent low-noise opera-
tion, further reduces temperature dependent offsets
that would otherwise increase the temperature coeffi-
cient of the MCP1501, and significantly improves
long-term drift performance. Additional circuitry is
included to eliminate the chopping frequency from the
output of the device.
After the bandgap voltage is compensated, it is ampli-
fied, buffered, and provided to the output drive circuit
which has excellent performance when sinking or
sourcing load currents (±5 mA).
2015-2016 Microchip Technology Inc.
DS20005474C-page 17
MCP1501
NOTES:
DS20005474C-page 18
2015-2016 Microchip Technology Inc.
MCP1501
5.0
APPLICATION CIRCUITS
5.1
Application Tips
5.1.1
BASIC APPLICATION CIRCUIT
Figure 5-1 illustrates a basic circuit configuration of the
MCP1501.
1.65 – 5.5V
OUT
)(('%$&.
1
2
3
4
VDD
8
7
6
5
1 kΩ
OUT
GND
SHDN
GND
0.1 – 2.2 µF
GND
GND
SOIC-8/DFN-8
FIGURE 5-1:
Basic Circuit Configuration.
An output capacitor is not required for stability of the
voltage reference, but may be optionally added to pro-
vide noise filtering or act as a charge-reservoir for
switching loads, e.g., successive approximation regis-
ter (SAR) analog-to-digital converter (ADC). As shown,
the input voltage is connected to the device at the VIN
input, with an optional 2.2 μf ceramic capacitor. This
capacitor would be required if the input voltage has
excessive noise. A 2.2 μf capacitor would reject input
voltage noise at approximately 1 to 2 MHz. Noise
below this frequency will be amply rejected by the input
voltage rejection of the voltage reference. Noise at fre-
quencies above 2 MHz will be beyond the bandwidth of
the voltage reference and, consequently, not transmit-
ted from the input pin through the device to the output.
R
FIL
Output
of V
REF
C
FIL
FIGURE 5-2:
Filter.
Output Noise-Reducing
If the noise at the output of these voltage references is
too high for the particular application, it can be easily fil-
tered with an external RC filter and op-amp buffer (see
Figure 5-2).
2015-2016 Microchip Technology Inc.
DS20005474C-page 19
MCP1501
The RC filter values are selected for a desired cutoff
frequency, as shown in Equation 5-1.
EQUATION 5-1:
1
f
= ---------------------------------------
C
2R
C
FIL FIL
The values that are shown in Figure 5-2 (10 kΩand
1 μF) will create a first-order, low-pass filter at the out-
put of the amplifier. The cutoff frequency of this filter is
15.9 Hz, and the attenuation slope is 20 dB/decade.
The MCP6021 amplifier isolates the loading of this low-
pass filter from the remainder of the application circuit.
This amplifier also provides additional drive, with a
faster response time than the voltage reference.
5.1.2
LOAD CAPACITOR
The output capacitor from OUT to GND acts as a
low-pass noise filter for the references and should not
be omitted. The maximum capacitive load is 300 pF,
however, larger capacitors may be implemented if a
resistor is used in series with a larger load capacitor.
Figure 5-1 illustrates a 1 kΩ resistor in series with a
2.2 µF capacitor.
5.1.3
PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATIONS
Mechanical stress due to Printed Circuit Board (PCB)
mounting can cause the output voltage to shift from its
initial value. Devices in the SOT-23-6 package are gen-
erally more prone to assembly stress than devices in
the WDFN package. To reduce stress-related output
voltage shifts, mount the reference on low-stress areas
of the PCB (i.e., away from PCB edges, screw holes
and large components).
DS20005474C-page 20
2015-2016 Microchip Technology Inc.
MCP1501
Since the non-inverting input of the amplifier is biased
to ground, the inverting input will also be close to
ground potential. The second 10 kΩresistor is placed
around the feedback loop of the amplifier. Since the
inverting input of the amplifier is high-impedance, the
current generated through R1 will also flow through R2.
As a consequence, the output voltage of the amplifier
is equal to -2.5V for the MCP1501-25 and -4.096V for
the MCP1501-40.
5.2
Typical Applications Circuits
5.2.1
NEGATIVE VOLTAGE REFERENCE
A negative voltage reference can be generated using
any of the devices in the MCP1501 family. A typical
application is shown in Figure 5-3. In this circuit, the
voltage inversion is implemented using the MCP6061
and two equal resistors. The voltage at the output of the
MCP1501 voltage reference drives R1, which is con-
nected to the inverting input of the MCP6061 amplifier.
MCP1501-25
10 kΩ
0.1%
10 kΩ
0.1%
2.7 – 5.5V
-2.500V
)(('%$&.
1
2
3
4
VDD
8
7
6
5
1 kΩ
OUT
GND
SHDN
2.2 µF
-
+
GND
GND
2.2 µF
GND
-5V
MCP6061
FIGURE 5-3:
Negative Voltage Reference.
5.2.2 A/D CONVERTER REFERENCE
The MCP1501 product family was carefully designed to
provide a precision, low noise voltage reference for the
Microchip families of ADCs. The circuit shown in
Figure 5-4 shows a MCP1501-25 configured to provide
the reference to the MCP3201, a 12-bit ADC.
MCP1501-25
5.0V
)(('%$&.
1
2
3
4
VDD
8
7
6
5
OUT
GND
SHDN
2.2 µF
GND
GND
2.2 µF
GND
5.0V
VREF
IN+
IN-
VIN
MCP3201
10 µF
0.1 µF
FIGURE 5-4:
ADC Example Circuit.
2015-2016 Microchip Technology Inc.
DS20005474C-page 21
MCP1501
6.0
6.1
PACKAGE INFORMATION
Package Markings
Example
6-Lead SOT-23
Device
Code
MCP1501T-10E/CHY
MCP1501T-12E/CHY
MCP1501T-18E/CHY
MCP1501T-20E/CHY
MCP1501T-25E/CHY
MCP1501T-30E/CHY
MCP1501T-33E/CHY
MCP1501T-40E/CHY
AABTY
AABUY
AABVY
AABWY
AABXY
AABYY
AABZY
AACAY
AABTY
50256
XXXXY
WWNNN
XXNN
8-Lead SOIC
Example
Device
Code
MCP1501T-10E/SN
MCP1501T-12E/SN
MCP1501-18E/SN
MCP1501-20E/SN
MCP1501T-25E/SN
MCP1501T-30E/SN
MCP1501T-33E/SN
MCP1501T-40E/SN
150110
150112
150118
150120
150125
150130
150133
150140
150110
SN1550
e
3
256
NNN
8-Lead WDFN (2 x2 mm)
Example
Device
Code
MCP1501T-10E/RW
MCP1501T-12E/RW
MCP1501-18E/RW
MCP1501-20E/RW
MCP1501T-25E/RW
MCP1501T-30E/RW
MCP1501T-33E/RW
MCP1501T-40E/RW
AAQ
AAR
AAS
AAT
AAU
AAV
AAW
AAX
AAQ
256
Legend: XX...X Customer-specific information
Y
YY
WW
NNN
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
e
3
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
DS20005474C-page 22
2015-2016 Microchip Technology Inc.
MCP1501
6-Lead Plastic Small Outline Transistor (CHY) [SOT-23]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
b
4
N
E
E1
PIN 1 ID BY
LASER MARK
1
2
3
e
e1
D
c
A
φ
A2
L
A1
L1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
Pitch
N
e
6
0.95 BSC
Outside Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
e1
A
A2
A1
E
E1
D
L
1.90 BSC
0.90
0.89
0.00
2.20
1.30
2.70
0.10
0.35
0°
–
–
–
–
–
–
–
–
–
–
–
1.45
1.30
0.15
3.20
1.80
3.10
0.60
0.80
30°
L1
I
c
b
0.08
0.20
0.26
0.51
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-028B
2015-2016 Microchip Technology Inc.
DS20005474C-page 23
MCP1501
6-Lead Plastic Small Outline Transistor (CHY) [SOT-23]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20005474C-page 24
2015-2016 Microchip Technology Inc.
MCP1501
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2015-2016 Microchip Technology Inc.
DS20005474C-page 25
MCP1501
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20005474C-page 26
2015-2016 Microchip Technology Inc.
MCP1501
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ꢃ""ꢇ;<<(((ꢎ#ꢊꢅꢁꢀꢅꢃꢊꢇꢎꢅꢀ#<ꢇꢈꢅ&ꢈꢉꢊꢆꢉ
2015-2016 Microchip Technology Inc.
DS20005474C-page 27
MCP1501
8-Lead Very, Very Thin Plastic Dual Flat, No Lead Package (RW) - 2x2 mm Body [WDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.05 C
2X
1
2
TOP VIEW
0.05 C
0.05 C
(A3)
A
C
SEATING
PLANE
0.05 C
SIDE VIEW
A1
D2
2X CH
2
1
NOTE 1
0.05
C A B
E2
(K)
L
N
8X b
0.10
0.05
C A B
C
e
BOTTOM VIEW
Microchip Technology Drawing C04-261A Sheet 1 of 2
DS20005474C-page 28
2015-2016 Microchip Technology Inc.
MCP1501
8-Lead Very, Very Thin Plastic Dual Flat, No Lead Package (RW) - 2x2 mm Body [WDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Pitch
Overall Height
Standoff
Terminal Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Exposed Pad Chamfer
Terminal Width
N
e
A
A1
8
0.50 BSC
0.75
0.02
0.10 REF
2.00 BSC
0.80
2.00 BSC
1.20
0.25
0.25
0.30
-
0.70
0.00
0.80
0.05
(A3)
E
E2
D
D2
CH
b
0.70
0.90
1.10
-
0.20
0.25
0.30
1.30
-
0.30
0.35
-
Terminal Length
Terminal-to-Exposed-Pad
L
(K)
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-261A Sheet 2 of 2
2015-2016 Microchip Technology Inc.
DS20005474C-page 29
MCP1501
8-Lead Very, Very Thin Plastic Dual Flat, No Lead Package (RW) - 2x2 mm Body [WDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
C
2X CH
ØV
8
1
2
E
X2
X1
G
SILK SCREEN
(G2)
Y2
Y1
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
MILLIMETERS
NOM
0.50 BSC
MIN
MAX
Contact Pitch
Optional Center Pad Width
Optional Center Pad Length
Contact Pad Spacing
Y2
X2
C
CH
X1
Y1
G1
G1
V
0.90
1.30
2.10
0.28
Center Pad Chamfer
Contact Pad Width (X8)
Contact Pad Length (X8)
Contact Pad to Contact Pad (X6)
Contact Pad to Center Pad (X8)
Thermal Via Diameter
0.30
0.70
0.20
0.25 REF
0.30
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerances, for reference only.
Microchip Technology Drawing C04-2261A
DS20005474C-page 30
2015-2016 Microchip Technology Inc.
MCP1501
APPENDIX A: REVISION HISTORY
Revision C (May 2016)
The following is the list of modifications:
1. Updated Section 1.0, Electrical Characteristics,
Section 4.0, Theory of Operation, Section 5.0,
Application Circuits.
2. Updated Features section, Introduction section,
Section 3.1, Buffered VREF Output (OUT).
3. Updated“Product Identification System” section.
4. Updated Figure 2-12, Figure 2-20,
Figure 2-21, Figure 5-1 and Figure 5-4.
5. Updated Equation 1-10 and Equation 1-16.
6. Various typographical edits.
Revision B (January 2016)
The following is the list of modifications:
1. Updated Section 6.0, Package Information.
2. Updated “Product Identification System”
section.
3. Minor typographical errors.
Revision A (December 2015)
Original Release of this Document.
2015-2016 Microchip Technology Inc.
DS20005474C-page 31
MCP1501
NOTES:
DS20005474C-page 32
2015-2016 Microchip Technology Inc.
MCP1501
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
[X](1)
PART NO.-
Device
X
/XX
Examples:
Output Voltage Package
Option
Tape and
Reel
a)
MCP1501T-10E/CHY: 1.024V, 6-lead SOT-23
package, Tape and Reel
b)
c)
MCP1501-12E/SN:
MCP1501T-18E/SN:
1.2V, 8-lead SOIC package
1.8V, 8-lead SOIC package,
Tape and Reel
Device:
MCP1501 – 50 ppm typical thermal drift buffered reference
d)
MCP1501T-20E/RW: 2.048V, 8-lead WDFN
package, Tape and Reel
Tape and Reel
Option:
Blank
T
=
=
Standard packaging (tube or tray)
(1)
Tape and Reel
Output Voltage
Option:
10
12
18
20
25
30
33
40
=
1.024V
1.200V
1.800V
2.048V
2.500V
3.000V
3.300V
4.096V
=
=
=
=
=
=
=
Note 1: Tape and Reel identifier only appears in
the catalog part number description.
This identifier is used for ordering pur-
poses and is not printed on the device
package. Check with your Microchip
sales office for package availability for
the Tape and Reel option.
Package:
CHY*
SN
=
=
6-Lead Plastic Small Outline Transistor (SOT-23)
8-Lead Plastic Small Outline – Narrow, 3.90 mm
Body (SOIC)
RW
*Y
=
=
8-Lead Very, Very Thin Plastic Dual Flat, No Lead
Package – 2 x 2 mm Body (WDFN)
Nickel palladium gold manufacturing designator.
Only available on the SOT-23 package.
2015-2016 Microchip Technology Inc.
DS20005474C-page 33
MCP1501
NOTES:
DS20005474C-page 34
2015-2016 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,
KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,
MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,
RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O
are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
ETHERSYNCH, Hyper Speed Control, HyperLight Load,
IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,
Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
QUALITYꢀMANAGEMENTꢀꢀSYSTEMꢀ
CERTIFIEDꢀBYꢀDNVꢀ
© 2016, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0559-7
== ISO/TSꢀ16949ꢀ==ꢀ
2016 Microchip Technology Inc.
DS20005474C-page 35
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
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Tel: 86-592-2388138
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Austria - Wels
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Suites 3707-14, 37th Floor
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Denmark - Copenhagen
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Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
India - Bangalore
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Web Address:
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Tel: 46-8-5090-4654
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Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Indianapolis
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Tel: 317-773-8323
Fax: 317-773-5453
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Los Angeles
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Tel: 949-462-9523
Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
New York, NY
Tel: 631-435-6000
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
San Jose, CA
Tel: 408-735-9110
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
07/14/15
DS20005474C-page 36
2015-2016 Microchip Technology Inc.
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