HV9919BK7-G
更新时间:2024-09-18 22:15:47
品牌:MICROCHIP
描述:Hysteretic, Buck, High Brightness LED Driver with High-Side Current Sensing
HV9919BK7-G 概述
Hysteretic, Buck, High Brightness LED Driver with High-Side Current Sensing LED驱动器 显示驱动器
HV9919BK7-G 规格参数
是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | HVSON, SOLCC8,.12,25 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
Factory Lead Time: | 7 weeks | 风险等级: | 1.19 |
接口集成电路类型: | LED DISPLAY DRIVER | JESD-30 代码: | S-PDSO-N8 |
JESD-609代码: | e3 | 长度: | 3 mm |
复用显示功能: | NO | 功能数量: | 1 |
区段数: | 1 | 端子数量: | 8 |
最高工作温度: | 125 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | HVSON |
封装等效代码: | SOLCC8,.12,25 | 封装形状: | SQUARE |
封装形式: | SMALL OUTLINE | 峰值回流温度(摄氏度): | 260 |
电源: | 12 V | 认证状态: | Not Qualified |
座面最大高度: | 0.8 mm | 子类别: | Display Drivers |
最大供电电压: | 40 V | 最小供电电压: | 4.5 V |
标称供电电压: | 12 V | 表面贴装: | YES |
温度等级: | AUTOMOTIVE | 端子面层: | Matte Tin (Sn) - annealed |
端子形式: | NO LEAD | 端子节距: | 0.65 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 3 mm | Base Number Matches: | 1 |
HV9919BK7-G 数据手册
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PDF下载HV9919B
Hysteretic, Buck, High Brightness LED Driver
with High-Side Current Sensing
Features
Description
• Hysteretic control with high-side current sensing
• Wide input-voltage range: 4.5 to 40V
• >90% Efficiency
HV9919B is a Pulse-Width Modulation (PWM) control-
ler IC designed to drive high-brightness LEDs using a
buck topology. It operates from an input voltage of 4.5
to 40VDC and employs hysteretic control, with a high-
side current sense resistor, to set the constant output
current.
• Typical ±5% LED current accuracy
• Up to 2.0MHz switching frequency
• Adjustable constant LED current
• Analog or PWM control signal for PWM dimming
• Over-temperature protection
Set the operating frequency range by selecting the
proper inductor. Operation at high switching frequency
is possible since the hysteretic control maintains accu-
racy even at high frequencies. This permits the use of
small inductors and capacitors, minimizing space and
cost in the overall system.
• -40ºC to +125ºC operating temperature range
Applications
• Low-voltage industrial and architectural lighting
• General purpose constant current source
• Signage and decorative LED lighting
• Indicator and emergency lighting
LED brightness control is achieved with PWM dimming
from an analog or PWM input signal. Unique PWM cir-
cuitry allows true constant color with a high dimming
range. The dimming frequency is programmed using a
single external capacitor.
HV9919B comes in a small, 8-Lead DFN package and
is ideal for industrial and general lighting applications.
Package Type
1
2
3
4
8
7
6
5
CS
VIN
GATE
GND
VDD
DIM
GND
RAMP
ADIM
8-Lead DFN
See Table 2-1 for pin information
2015 Microchip Technology Inc.
20005462B-page 1
HV9919B
Block Diagram
REGULATOR
VIN
CS
VDD
+
-
GATE
DRIVER
CURRENT
SENSE
COMPARATOR
GATE
DIM
+
-
BANDGAP
REF
UVLO
COMPARATOR
GND
PWM RAMP
0.1~1.9V
RAMP
ADIM
-
+
HV9919B
Typical Application Circuit
RSENSE
L
CIN
VIN
CS
VDD
GATE
GND
RAMP
ADIM
DIM
0 - 2.0V
HV9919B
20005462B-page 2
2015 Microchip Technology Inc.
HV9919B
1.0
ELECTRICAL CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS†
VIN to GND.................................................................................................................................................-0.3V to +45V
DD to GND...............................................................................................................................................-0.3V to +6.0V
V
GATE, RAMP, DIM, ADIM to GND.............................................................................................................-0.3V to +VDD
CS to VIN...................................................................................................................................................-1.0V to +0.3V
Continuous total power dissipation (TA = 25.°C)..................................................................................................... 1.6W
Operating temperature range................................................................................................................ -40°C to +125°C
Junction temperature ...........................................................................................................................................+150°C
Storage temperature range................................................................................................................... -65°C to +150°C
† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at those or any other conditions above those indicated in the
operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.
TABLE 1-1:
ELECTRICAL CHARACTERISTICS (SHEET 1 OF 2)
Electrical Specifications: VIN=12V, VDIM = VDD, VRAMP = GND, CVDD = 1.0 µF, RCS = 0.5Ω,
TA= TJ= -40°C to +125°C, unless otherwise noted. (Note 1)
Parameter
Symbol
Min
Typ
Max
Units Conditions
Input DC supply voltage range
Internally regulated voltage
Supply current
VIN
VDD
4.5
-
-
40
5.5
1.5
900
-
V
V
DC input voltage
VIN= 6.0 to 40V
4.5
IIN
-
-
-
-
-
-
mA GATE open
Shutdown supply current
IIN, SDN
-
µA
mA
MHz
V
DIM< 0.7V
11
5.5
-
VIN= 4.5V, VDD= 0V
VIN= 4.5V, VDD= 4.0V
–
Current limit
IIN, LIM
fSW
-
Switching frequency
2.0
VDD Undervoltage lockout thresh-
old
UVLO
∆UVLO
-
-
-
4.5
-
VDD rising
V
Undervoltage lockout hysteresis
500
mV VDD falling
DD
Sense Comparator
Sense voltage threshold high
Sense voltage threshold low
Average sense voltage
VCS(HI)
VCS(LO)
VCS(AVG)
-
-
230
170
200
-
-
mV (VIN- VCS) rising
mV (VIN- VCS) falling
186
214
mV VCS(AVG) = 0.5(VCS(HI) + VCS(LO))
Falling edge of
ns
Propagation delay to output high
tDPDH
-
-
70
70
-
-
(VIN- VCS) = VRS(LO)- 70mV
Rising edge of
ns
Propagation delay to output low
Current-sense input current
tDPDL
ICS
(VIN- VCS) = VRS(HI)+ 70mV
-
-
1.0
98
µA
(VIN- VCS) = 200mV
Current-sense threshold hysteresis VCS(HYS)
15
56
mV VCS(HYS) = VCS(HI) - VCS(LO)
DIM Input
Pin DIM input high voltage
Pin DIM input low voltage
VIH
VIL
2.2
-
-
-
-
V
V
–
–
0.7
DIM rising edge to
VGATE= 0.5 x VDD, CGATE= 2.0nF
Turn-on time
Turn-off time
tON
-
-
100
100
-
-
ns
ns
DIM falling edge to
VGATE= 0.5 x VDD, CGATE=2.0nF
tOFF
2015 Microchip Technology Inc.
20005462B-page 3
HV9919B
TABLE 1-1:
ELECTRICAL CHARACTERISTICS (SHEET 2 OF 2)
Electrical Specifications: VIN=12V, VDIM = VDD, VRAMP = GND, CVDD = 1.0 µF, RCS = 0.5Ω,
TA= TJ= -40°C to +125°C, unless otherwise noted. (Note 1)
Parameter
Symbol
Min
Typ
Max
Units Conditions
GATE Driver
GATE current, source
0.3
0.7
-
0.5
1.0
40
17
-
-
-
A
A
VGATE= GND, (Note 2)
IGATE
GATE current, sink
VGATE= VDD, (Note 2)
CGATE= 2.0nF
CGATE= 2.0nF
IGATE= 10mA
GATE output rise time
GATE output fall time
TRISE
TFALL
55
25
-
ns
ns
V
-
GATE high output voltage
GATE low output voltage
Over-Temperature Protection
Over temperature trip limit
Temperature hysteresis
Analog Control of PWM Dimming
VGATE(HI) VDD-0.5
VGATE(LO)
-
-
0.5
V
IGATE= -10mA
TOT
128
-
140
60
-
-
ºC
ºC
(Note 2)
(Note 2)
ꢀTHYST
114
529
-
-
308
1380
-
CRAMP= 47nF
Dimming frequency
fRAMP
Hz
-
0.1
-
CRAMP= 10nF
RAMP threshold, Low
RAMP threshold, High
ADIM offset voltage
VLOW
VHIGH
VOS
V
V
–
–
–
1.8
-35
2.1
+35
-
mV
Note 1: Specification is obtained by characterization and is 100% tested at TA = 25°C.
2: Specification is obtained by characterization and not 100% tested
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise specified, for all specifications TA =TJ = +25°C
Parameter
Symbol
Min
Typ
Max Units Conditions
Temperature Ranges
Operating Temperature
Storage Temperature
-40
-65
125
150
°C
°C
–
Package Thermal Resistances
Mounted on FR-4 board,
25 mm x 25 mm x 1.57 mm
Thermal Resistance, DFN
θja
–
60
–
°C/W
20005462B-page 4
2015 Microchip Technology Inc.
HV9919B
2.0
PIN DESCRIPTION
The locations of the pins are listed in Features.
TABLE 2-1:
PIN DESCRIPTION
Pin #
Symbol
Description
Current sense input. Senses LED
string current.
1
CS
2
3
VIN
Input voltage 4.5 to 40V DC.
RAMP
Analog PWM dimming ramp output.
Analog 0~2.0V signal input for analog
control of PWM dimming.
4
5
ADIM
DIM
PWM signal input.
Internally regulated supply voltage.
Connect a capacitor from VDD to
ground.
6
VDD
7
8
GND
GATE
GND
Device ground.
Drives gate of external MOSFET.
Must be wired to pin 7 on PCB.
TAB
2015 Microchip Technology Inc.
20005462B-page 5
HV9919B
When the analog control of PWM dimming feature is
not used, RAMP must be wired to GND, and ADIM
3.0
APPLICATION INFORMATION
should be connected to VDD
.
HV9919B is a step-down, constant current, High-
Brightness LED (HB LED) driver. The device operates
from a 4.5 to 40V input voltage range and provides the
gate drive output to an external N-channel MOSFET.
One possible application of the ADIM feature of
HV9919B may include protection of the LED load from
over-temperature by connecting an NTC thermistor at
ADIM, as shown in Figure 3-1
A high-side, current-sense resistor sets the output cur-
rent and a dedicated PWM Dimming Input (DIM) allows
for a wide range of dimming duty ratios. The PWM dim-
ming could also be achieved by applying a DC voltage
between 0 and 2.0V to the Analog Dimming Input
(ADIM). In this case, the dimming frequency can be
programmed using a single capacitor at the RAMP pin.
VDD
HV9919B
The high-side current setting and sensing scheme min-
imizes the number of external components while deliv-
ering LED current with a ±8% accuracy, using a 1%
sense resistor.
ADIM
NTC
GND
3.1
Undervoltage Lockout (UVLO)
HV9919B includes a 3.7V Under-Voltage lockout
(UVLO) with 500mV hysteresis. When VDD falls below
3.7V, GATE goes low, turning off the external N-channel
MOSFET. GATE goes high once VDD is 4.5V or higher.
FIGURE 3-1:
NTC Thermistor at ADIM
3.5
Setting LED Current with External
Resistor RSENSE
3.2
5.0V Regulator
The output current in the LED is determined by the
external current sense resistor (RSENSE) connected
between VIN and CS. Disregarding the effect of the
propagation delays, the sense resistor can be calcu-
lated as:
VDD is the output of a 5.0V regulator capable of sourc-
ing 5.0 mA. Bypass VDD to GND with a 1.0μF capacitor.
3.3
DIM Input
VCSHI + VCSLO
1
2
200mV
ILED
HV9919B allows dimming with a PWM signal at the
DIM input. A logic level below 0.7V at DIM forces the
GATE output low, turning off the LED current. To turn
the LED current on, the logic level at DIM must be at
least 2.2V.
-- ----------------------------------------------------
RSENSE
= ------------------
ILED
3.6
Selecting Buck Inductor L
HV9919B regulates the LED output current using a
comparator with hysteresis, see Figure 3-2. As the cur-
rent through the inductor ramps up and the voltage
across the sense resistor reaches the upper threshold,
the voltage at GATE goes low, turning off the external
MOSFET. The MOSFET turns on again when the
inductor current ramps down through the freewheeling
diode, until the voltage across the sense resistor
equals the lower threshold. Use the following equation
to determine the inductor value for a desired value of
operating frequency fS:
3.4
ADIM and RAMP Inputs
The PWM dimming scheme can be also implemented
by applying an analog control signal to ADIM pin. If an
analog control signal of 0 – 2.0V is applied to ADIM, the
device compares this analog input to a voltage ramp to
pulse-width-modulate the LED current. Connecting an
external capacitor to RAMP programs the PWM dim-
ming ramp frequency.
1
fPWM = ------------------------------------------
CRAMP 120K
VIN – VOUTVOUT
L = -------------------------------------------------- – ---------------------------------------------
fSVINIO IO
VIN – VOUTtDPDL
DIM and ADIM inputs can be used simultaneously. In
such a case, fPWM(MAX) must be selected lower than
the frequency of the dimming signal at DIM. The
smaller dimming duty cycle of ADIM and DIM will deter-
mine the GATE signal.
VOUT DPDH
------------------------------
IO
t
–
20005462B-page 6
2015 Microchip Technology Inc.
HV9919B
Where:
This ripple can be calculated from the following equa-
tion:
V
CSHI – VCSLO
IO = ----------------------------------------------
RSENSE
VIN – VOUTtDPDL
VOUTtDPDH
I = IO + -------------------------------------------------- + ------------------------------
L
L
and tDPDL, tDPDH are the propagation delays. The cur-
rent ripple ꢀI in the inductor L is greater than ꢀIO.
For the purpose of the proper inductor selection, note
that the maximum switching frequency occurs at the
highest VINand VOUT= VIN/2.
TS = 1/fS
tDPDL
ILED
VRS(HI)
RSENSE
VRS(LO)
RSENSE
tDPDH
ΔIO
ΔI
t
VDIM
t
FIGURE 3-2:
Regulating LED output
3.7
MOSFET Selection
3.10 PCB Layout Guidelines
MOSFET selection is based on the maximum input
operating voltage VIN, output current ILED, and operat-
ing switching frequency. Choose a logic-level MOSFET
that has a higher breakdown voltage than the maxi-
mum operation voltage, low RDS(ON), and low total gate
charge for better efficiency.
Careful PCB layout is critical to achieve low switching
losses and stable operation. Use a multilayer board
whenever possible for better noise immunity. Minimize
ground noise by connecting high-current ground
returns, the input bypass capacitor ground lead, and
the output filter ground lead to a single point (star
ground configuration). The fast di/dt loop is formed by
the input capacitor CIN, the free-wheeling diode and the
MOSFET. To minimize noise interaction, this loop area
should be as small as possible. Place RSENSE as close
as possible to the input filter and VIN. For better noise
immunity, a Kelvin connection is strongly recom-
mended between CS and RSENSE. Connect the
exposed tab of the IC to a large-area ground plane for
improved power dissipation.
3.8
Freewheeling Diode Selection
The forward voltage of the freewheeling diode should
be as low as possible for better efficiency. A Schottky
diode is a good choice as long as the breakdown volt-
age is high enough to withstand the maximum operat-
ing voltage. The forward-current rating of the diode
must be at least equal to the maximum LED current.
3.9
LED Current Ripple
The LED current ripple is equal to the inductor-current
ripple. In cases when a lower LED current ripple is
needed, a capacitor can be placed across the LED ter-
minals.
2015 Microchip Technology Inc.
20005462B-page 7
HV9919B
4.0
4.1
PACKAGING INFORMATION
Package Marking Information
8-lead DFN
Example
XXXX
YYWW
NNN
9919
1542
343
Legend: XX...X Product Code or Customer-specific information
Y
Year code (last digit of calendar year)
YY
WW
NNN
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
e
3
*
)
3
e
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for product code or customer-specific information. Package may or
not include the corporate logo.
20005462B-page 8
2015 Microchip Technology Inc.
HV9919B
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
2015 Microchip Technology Inc.
20005462B-page 9
HV9919B
APPENDIX A: REVISION HISTORY
Revision A (November 2015)
• Updated file to Microchip format.
• Revised Absolute Maximum Ratings†.
• Modified values and notes in Table 1-1.
• Added condition to Temperature Specifications.
• Changed value in Section 3.2 “5.0V Regulator”.
• Wording change in Section 3.7 “MOSFET Selec-
tion”.
• Minor text changes throughout.
Revision B (December 2015)
• Updated Revision History.
20005462B-page 10
2015 Microchip Technology Inc.
HV9919B
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
-
-
PART NO.
Device
XX
X
X
Examples:
a)
HV9919BK7-G
8-Lead DFN package,
3000/Reel
Package Environmental Media
Options Type
Device:
HV9919B = Hysteretic, Buck, High Brightness LED Driver
with High-Side Current Sensing
Package:
K7
= 48-lead DFN
Environmental
Media Type:
G
= Lead (Pb)-free/ROHS-compliant package
= 3000/Reel
(blank)
2015 Microchip Technology Inc.
20005462B-page 11
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
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suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O,
Total Endurance, TSHARC, USBCheck, VariSense,
ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2015, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0111-7
QUALITYꢀMANAGEMENTꢀꢀSYSTEMꢀ
CERTIFIEDꢀBYꢀDNVꢀ
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
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devices, Serial EEPROMs, microperipherals, nonvolatile memory and
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and manufacture of development systems is ISO 9001:2000 certified.
== ISO/TSꢀ16949ꢀ==ꢀ
20005462B-page 12
2015 Microchip Technology Inc.
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Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Boston
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
China - Dongguan
Tel: 86-769-8702-9880
Italy - Venice
Tel: 39-049-7625286
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Seoul
Cleveland
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Poland - Warsaw
Tel: 48-22-3325737
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Sweden - Stockholm
Tel: 46-8-5090-4654
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Detroit
Novi, MI
UK - Wokingham
Tel: 44-118-921-5800
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Tel: 248-848-4000
Fax: 44-118-921-5820
Houston, TX
Tel: 281-894-5983
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
New York, NY
Tel: 631-435-6000
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
San Jose, CA
Tel: 408-735-9110
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
07/14/15
20005462B-page 13
2015 Microchip Technology Inc.
HV9919BK7-G 替代型号
型号 | 制造商 | 描述 | 替代类型 | 文档 |
HV9919K7-G | SUPERTEX | LED Driver, 1-Segment, PDSO8, 3 X 3 MM, 0.80 MM HEIGHT, 0.65 MM PITCH, GREEN, MO-229WEEC-2 | 功能相似 |
HV9919BK7-G 相关器件
型号 | 制造商 | 描述 | 价格 | 文档 |
HV9919K7-G | SUPERTEX | LED Driver, 1-Segment, PDSO8, 3 X 3 MM, 0.80 MM HEIGHT, 0.65 MM PITCH, GREEN, MO-229WEEC-2, DFN-8 | 获取价格 | |
HV9921 | SUPERTEX | 3-Pin Switch-Mode LED Lamp Driver IC | 获取价格 | |
HV9921 | MICROCHIP | The HV9921 is a pulse width modulated (PWM) high-efficiency LED driver control IC. It allows effic | 获取价格 | |
HV9921N3 | SUPERTEX | 3-Pin Switch-Mode LED Lamp Driver IC | 获取价格 | |
HV9921N3-G | SUPERTEX | 3-Pin Switch-Mode LED Lamp Driver ICs | 获取价格 | |
HV9921N8 | SUPERTEX | 3-Pin Switch-Mode LED Lamp Driver IC | 获取价格 | |
HV9921N8-G | SUPERTEX | 3-Pin Switch-Mode LED Lamp Driver ICs | 获取价格 | |
HV9922 | SUPERTEX | 3-Pin Switch-Mode LED Lamp Driver IC | 获取价格 | |
HV9922 | MICROCHIP | The HV9922 is a pulse width modulated (PWM) high-efficiency LED driver control IC. It allows effic | 获取价格 | |
HV9922N3 | SUPERTEX | 3-Pin Switch-Mode LED Lamp Driver IC | 获取价格 |
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