DSC6121HI2A-00AP [MICROCHIP]
CMOS Output Clock Oscillator;
| 型号： | DSC6121HI2A-00AP |
| 厂家： | 
MICROCHIP |
| 描述： | CMOS Output Clock Oscillator |
| 文件： | 总26页 (文件大小：789K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DSC61XX
Ultra-Small, Ultra-Low Power MEMS Oscillator
Features
General Description
• Wide Frequency Range: 2 KHz to 100 MHz
The DSC61xx family of MEMS oscillators combines the
industry leading low power consumption and
ultra-small packages with exceptional frequency
stability and jitter performance over temperature. The
single-output DSC61xx MEMS oscillators are excellent
choices for use as clock references in small,
battery-powered devices such as wearable and
Internet of Things (IoT) devices in which small size, low
power consumption, and long-term reliability are
paramount. They also meet the stringent mechanical
durability and reliability requirements withinAutomotive
Electronics Council standard Q100 (AEC-Q100), so
they are well suited for under-hood applications as well.
• Ultra–Low Power Consumption: 3 mA/12 A
(Active/Standby)
• Ultra-Small Footprints
- 1.6 mm 1.2 mm
- 2.0 mm 1.6 mm
- 2.5 mm 2.0 mm
- 3.2 mm 2.5 mm
• Frequency Select Input Supports 2 Predefined
Frequencies
• High Stability: ±25, ±50 ppm
• Wide Temperature Range
The DSC61xx family is available in ultra-small
1.6 mm x 1.2 mm and 2.0 mm x 1.6 mm packages.
Other package sizes include: 2.5 mm x 2.0 mm and
3.2 mm x 2.5 mm. These packages are “drop-in”
replacements for standard 4-pin CMOS quartz crystal
oscillators.
- Industrial: –40°C to 85°C
- Ext. Commercial: –20° to 70°C
• Excellent Shock & Vibration Immunity
- Qualified to MIL-STD-883
• High Reliability
- 20x Better MTF Than Quartz Oscillators
• Supply Range of 1.71V to 3.63V
• Short Sample Lead Time: <2 weeks
• Lead Free & RoHS Compliant
Package Types
DSC61XX
3.2x2.5
DFN
DSC61XX
2.5x2.0
LGA
Applications
Top View
• Low Power/portable Applications - IoT,
Embedded/smart Devices
Top View
4
3
2
4
3
• Consumer - Home Healthcare, Fitness Devices,
Home Automation
• Automotive - Rear View/surround View Cameras,
Infotainment System
• Industrial - Building/ Factory Automation,
Surveillance Camera
1
2
1
DSC61XX
2.0x1.6
LGA
DSC61XX
1.6x1.2
LGA
Top View
Top View
4
3
4
3
1
2
1
2
2016 Microchip Technology Inc.
DS20005624A-page 1
DSC61XX
Block Diagram
DSC6101/02/11/12/21/22/41/42/51/52/61/62
DIGITAL
CONTROL
SUPPLY
REGULATION
OE/STBY/FS
PIN 1
VDD
PIN 4
MEMS
RESONATOR
PLL
TEMP SENSOR
CONTROL &
COMPENSATION
OUTPUT
DIVIDER
VCO
DRIVER
GND
PIN 2
OUTPUT
PIN 3
DSC6183 (kHz Output)
SUPPLY
REGULATION
DRIVER
P4
VDD
P1
OUTPUT
MEMS
RESONATOR
PLL
TEMP SENSOR
CONTROL &
COMPENSATION
OUTPUT
DIVIDER
VCO
P2
GND
P3
DNC
DS20005624A-page 2
2016 Microchip Technology Inc.
DSC61XX
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Supply Voltage .......................................................................................................................................... –0.3V to +4.0V
Input Voltage, VIN............................................................................................................................... –0.3V to VDD+0.3V
ESD Protection .......................................................................................................4000V HBM, 400V MM, 2000V CDM
DSC61XX ELECTRICAL CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, VDD= 1.8V –5% to 3.3V +10%, TA= –40°C to 85°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Supply Voltage, Note 1
VDD
1.71
—
3.63
V
—
FOUT = 27 MHz, VDD = 1.8V,
No Load
Active Supply Current
IDD
—
3.0
—
mA
A
—
—
12
80
—
—
VDD = 1.8/2.5V
Standby Supply Current
Note 2
ISTBY
VDD = 3.3V
±25
±50
Frequency Stability Note 3
Aging
Δf
Δf
—
—
ppm
ppm
ms
All temp ranges
—
—
—
—
±5
±1
1st year @25°C
Per year after first year
From 90% VDD to valid clock
output, T = 25°C
Startup Time
tSU
—
—
1.3
Input Logic Levels Note 4
Input Logic High
VIH
VIL
0.7xVDD
—
—
—
—
V
V
—
0.3xVDD
Input Logic Low
Output Disable Time
Note 5
tDA
tEN
—
—
—
—
—
—
200+Period
ns
s
k
—
—
Output Enable Time
Note 6
1
Enable Pull-up Resistor
Note 7
300
—
If configured
Output Logic Levels
Output Logic High
Output Logic Low
VOH
VOL
0.8xVDD
—
—
—
—
V
V
I = 6mA
0.2xVDD
I = –6mA
Note 1: Pin 4 VDD should be filtered with 0.1 uf capacitor.
2: Not including current through pull-up resistor on EN pin (if configured). Higher standby current seen at
>3.3V VDD
.
3: Includes frequency variations due to initial tolerance, temp. and power supply voltage.
4: Input waveform must be monotonic with rise/fall time < 10 ms
5: Output Disable time takes up to 1 Period of the output waveform + 200 ns.
6: For parts configured with OE, not Standby.
7: Output is enabled if pad is floated or not connected.
2016 Microchip Technology Inc.
DS20005624A-page 3
DSC61XX
DSC61XX ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, VDD= 1.8V –5% to 3.3V +10%, TA= –40°C to 85°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
DSC61X2
—
1
1.5
ns
VDD = 1.8V
DD = 2.5V/3.3V
VDD = 1.8V
High Drive,
20% to 80%
V
CL=15 pF
tRX/tFX
—
—
—
0.5
1.2
1.5
1.0
2.0
2.2
ns
ns
ns
Output Transition Time
Rise Time/Fall Time
DSC61X1
Std Drive,
20% to 80%
CL=10 pF
tRY/tFY
VDD = 2.5V/3.3V
Frequency
f0
0.002
45
—
—
100
55
11
9
MHz
%
Output on Pin 1 for < 1 MHz
—
Output Duty Cycle
SYM
—
9.5
7.5
50
35
V
DD = 1.8V
VDD = 2.5V/3.3V
DD = 1.8V
VDD = 2.5V/3.3V
FOUT
=
Period Jitter, RMS
JPER
psRMS
27 MHz
—
—
70
60
V
Cycle-to-Cycle Jitter
(peak)
FOUT
=
JCy–Cy
ps
27 MHz
—
Note 1: Pin 4 VDD should be filtered with 0.1 uf capacitor.
2: Not including current through pull-up resistor on EN pin (if configured). Higher standby current seen at
>3.3V VDD
.
3: Includes frequency variations due to initial tolerance, temp. and power supply voltage.
4: Input waveform must be monotonic with rise/fall time < 10 ms
5: Output Disable time takes up to 1 Period of the output waveform + 200 ns.
6: For parts configured with OE, not Standby.
7: Output is enabled if pad is floated or not connected.
DS20005624A-page 4
2016 Microchip Technology Inc.
DSC61XX
TEMPERATURE SPECIFICATIONS
Parameters
Temperature Ranges
Sym.
Min.
Typ.
Max.
Units
Conditions
Junction Operating Temperature
Storage Temperature Range
Soldering Temperature
TJ
TA
TS
—
–55
—
+150
—
—
+150
—
°C
°C
°C
—
—
+260
40 Sec. Max.
2016 Microchip Technology Inc.
DS20005624A-page 5
DSC61XX
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
DSC6101/03/11/13/21/23/41/43/51/53/61/63 PIN FUNCTION TABLE (OUTPUT
FREQUENCY ≥1MHZ)
Pin Number
Pin Name
Pin Type
Description
Output Enable: H = Specified Frequency Output, Note 1
L = Output is high impedance
OE
Standby: H = Specified Frequency Output, Note 1
L = Output is high impedance. Device is in low power
mode, supply current is at ISTBY
1
STDBY
FS
I
Frequency Select: H = Output Frequency 1, Note 2
L = Output Frequency 2
2
3
4
GND
Output
VDD
Power
O
Power supply ground
Oscillator clock output
Power supply
Power
Note 1: DSC610x/1x/2x has 300 kΩ internal pull-up resistor on pin1. DSC614x/5x/6x has no internal pull-up resistor
on pin1 and needs external pull-up or being driven by other chip.
2: Two pre-programmed frequencies can be configured at http://clockworks.microchip.com/timing/
3: Bypass with 0.1μF capacitor placed as close to VDD pin as possible.
TABLE 2-2:
Pin Number
DSC6183 PIN FUNCTION TABLE (OUTPUT FREQUENCY <1MHZ)
Pin Name
Pin Type
Description
1
2
3
4
Output
GND
DNC
VDD
O
Kilohertz Oscillator clock output
Power
DNC
Power supply ground
Do Not Connect
Power
Power supply, Note 1
Note 1: Bypass with 0.1 μF capacitor placed as close to VDD pin as possible.
DSC61xx family is available in multiple output driver configurations.
The standard-drive (61x1) and high-drive (61x2) deliver respective output currents of greater than 3 mA and 6 mA at
20%/80% of the supply voltage. For heavy loads of 15 pF or higher, the high-drive option is recommended.
DS20005624A-page 6
2016 Microchip Technology Inc.
DSC61XX
3.0
OUTPUT WAVEFORM
FIGURE 3-1:
OUTPUT WAVEFORM
tR
tF
VOH
OUTPUT
VOL
tEN
1/fo
tDA
VIH
ENABLE
VIL
2016 Microchip Technology Inc.
DS20005624A-page 7
DSC61XX
4.0
TEST CIRCUIT
FIGURE 4-1:
TEST CIRCUIT
4
3
2
1
µ
CL
DS20005624A-page 8
2016 Microchip Technology Inc.
DSC61XX
5.0
BOARD LAYOUT (RECOMMENDED)
FIGURE 5-1:
BOARD LAYOUT (RECOMMENDED)
2016 Microchip Technology Inc.
DS20005624A-page 9
DSC61XX
6.0
SOLDER REFLOW PROFILE
FIGURE 6-1:
SOLDER REFLOW
20-40
Sec
260
°
C
217
200
°
°
C
C
60-150
Sec
Reflow
60-180
Sec
150
25
°
°
C
C
Cool
Pre heat
Time
8 min max
MSL 1 @ 260°C refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp)
Preheat Time 150°C to 200°C
Time maintained above 217°C
Peak Temperature
3°C/Sec Max.
60-180 Sec
60-150 Sec
255-260°C
20-40 Sec
Time within 5°C of actual Peak
Ramp-Down Rate
6°C/Sec Max.
8 min. Max.
Time 25°C to Peak Temperature
DS20005624A-page 10
2016 Microchip Technology Inc.
DSC61XX
7.0
PACKAGING INFORMATION
4-Lead VFLGA 1.6 mm x 1.2 mm Package Outline
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.05 C
2X
1
2
TOP VIEW
0.05 C
0.10 C
A1
A
C
SEATING
PLANE
4X
(A3)
0.08 C
SIDE VIEW
b2
1
3X b1
0.07
0.03
C A B
C
CH
2
CH
NOTE 1
e1
e1
2
4X L
N
e
BOTTOM VIEW
Microchip Technology Drawing C04-1199A Sheet 1 of 2
2016 Microchip Technology Inc.
DS20005624A-page 11
DSC61XX
4-Lead VFLGA 1.6 mm x 1.2 mm Package Outline
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Terminal Pitch
Terminal Pitch
Overall Height
Standoff
N
4
e
1.20 BSC
0.75 BSC
0.84
e1
A
A1
0.79
0.00
0.89
0.05
0.02
Substrate Thickness (with Terminals) A3
0.20 REF
1.60 BSC
1.20 BSC
0.30
0.375
0.35
Overall Length
Overall Width
D
E
Terminal Width
Terminal Width
Terminal Length
Terminal 1 Index Chamfer
b1
b2
L
0.25
0.325
0.30
-
0.35
0.425
0.40
-
CH
0.125
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1199A Sheet 2 of 2
DS20005624A-page 12
2016 Microchip Technology Inc.
DSC61XX
4-Lead VFLGA 1.6 mm x 1.2 mm Recommended Land Pattern
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E1
X1
G1
4
Y
C
G2
1
2
(CH)
SILK SCREEN
X2
E2
RECOMMENDED LAND PATTERN
Units
MILLIMETERS
Dimension Limits
MIN
NOM
1.20 BSC
1.16 BSC
0.75
MAX
Contact Pitch
Contact Pitch
E1
E2
C
Contact Spacing
Contact Width (X3)
Contact Width
X1
X2
Y
0.35
0.43
0.50
Contact Pad Length (X6)
Space Between Contacts (X4)
Space Between Contacts (X3)
Contact 1 Index Chamfer
G1
G2
CH
0.85
0.25
0.13 X 45° REF
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3199A
2016 Microchip Technology Inc.
DS20005624A-page 13
DSC61XX
4-Lead VLGA 2.0 mm x 1.6 mm Package Outline
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.05 C
2X
1
2
TOP VIEW
0.05 C
0.10 C
A1
A
C
SEATING
PLANE
4X
(A3)
0.08 C
SIDE VIEW
b2
1
3X b1
0.07
0.03
C A B
C
CH
2
CH
NOTE 1
e1
e1
2
4X L
N
e
BOTTOM VIEW
Microchip Technology Drawing C04-1200A Sheet 1 of 2
DS20005624A-page 14
2016 Microchip Technology Inc.
DSC61XX
4-Lead VLGA 2.0 mm x 1.6 mm Package Outline (Continued)
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Terminal Pitch
Terminal Pitch
Overall Height
Standoff
N
6
e
1.55 BSC
0.95 BSC
0.84
e1
A
A1
0.79
0.00
0.89
0.05
0.02
Substrate Thickness (with Terminals) A3
0.20 REF
2.00 BSC
1.60 BSC
0.35
0.45
0.55
Overall Length
Overall Width
D
E
Terminal Width
Terminal Width
Terminal Length
Terminal 1 Index Chamfer
b1
b2
L
0.30
0.40
0.50
-
0.40
0.50
0.60
-
CH
0.15
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1200A Sheet 2 of 2
2016 Microchip Technology Inc.
DS20005624A-page 15
DSC61XX
4-Lead VFLGA 2.0 mm x 1.6 mm Package Outline
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X1
4
Y
G2
C
1
2
(CH)
G1
E
SILK SCREEN
RECOMMENDED LAND PATTERN
Units
MILLIMETERS
Dimension Limits
MIN
NOM
1.55 BSC
0.95
MAX
Contact Pitch
Contact Spacing
E
C
Contact Width (X4)
Contact Width (X2)
Contact Pad Length (X6)
X1
X2
Y
0.50
0.40
0.70
Space Between Contacts (X4)
Space Between Contacts (X3)
Contact 1 Index Chamfer
G1
G2
CH
1.05
0.25
0.13 X 45° REF
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3200A
DS20005624A-page 16
2016 Microchip Technology Inc.
DSC61XX
4-Lead VLGA 2.5 mm x 2.0 mm Package Outline
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.05 C
2X
1
2
TOP VIEW
0.05 C
0.10 C
A1
C
A
SEATING
PLANE
4X
(A3)
0.08 C
SIDE VIEW
4X b1
0.07
0.03
C A B
C
CH
1
2
CH
NOTE 1
e1
e1
2
4X L
N
e
BOTTOM VIEW
Microchip Technology Drawing C04-1202A Sheet 1 of 2
2016 Microchip Technology Inc.
DS20005624A-page 17
DSC61XX
4-Lead VLGA 2.5 mm x 2.0 mm Package Outline (Continued)
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Terminal Pitch
Terminal Pitch
Overall Height
Standoff
N
4
e
1.65 BSC
1.25 BSC
0.84
e1
A
A1
0.79
0.00
0.89
0.05
0.02
Substrate Thickness (with Terminals) A3
0.20 REF
2.50 BSC
2.00 BSC
0.65
0.65
0.225
Overall Length
Overall Width
D
E
Terminal Width
Terminal Length
Terminal 1 Index Chamfer
b1
L
CH
0.60
0.60
-
0.70
0.70
-
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1202A Sheet 2 of 2
DS20005624A-page 18
2016 Microchip Technology Inc.
DSC61XX
4-Lead VLGA 2.5 mm x 2.0 mm Recommended Land Pattern
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X
4
Y
C
G2
1
2
(CH)
G1
E
SILK SCREEN
RECOMMENDED LAND PATTERN
Units
MILLIMETERS
Dimension Limits
MIN
NOM
1.65 BSC
1.25
MAX
Contact Pitch
Contact Spacing
Contact Width (X4)
Contact Pad Length (X6)
E
C
X
Y
0.70
0.80
Space Between Contacts (X4)
Space Between Contacts (X3)
Contact 1 Index Chamfer
G1
G2
CH
0.95
0.45
0.13 X 45° REF
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3202A
2016 Microchip Technology Inc.
DS20005624A-page 19
DSC61XX
4-Lead CDFN 3.2 mm x 2.5 mm Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
TITLE
4 LEAD CDFN 3.2x2.5mm COL PACKAGE OUTLINE & RECOMMENDED LAND PATTERN
DRAWING #
UNIT
MM
CDFN3225-4LD-PL-1
NOTE:
1. Green shaded rectangles in Recommended Land Pattern are solder stencil opening.
DS20005624A-page 20
2016 Microchip Technology Inc.
DSC61XX
APPENDIX A: REVISION HISTORY
Revision A (September 2016)
• Initial release of DSC61XX Microchip data sheet
DS20005624A.
2015 Microchip Technology Inc.
DS20005624A-page 21
DSC61XX
NOTES:
DS20005624A-page 22
2015 Microchip Technology Inc.
DSC61XX
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
X
PART NO.
X
X
X
X – XXX.XXXX
X
X
a)
DSC6112JI2A-100.0000: Ultra–Low Power MEMS
Oscillator, Pin1= Standby
with internal Pull–Up, High
Output Drive Strength,
Device Pin 1
Definition
Output Package
Drive
Strength
Temperature
Range
Revision Frequency
Tape
and
Reel
Frequency
Stability
4-Lead 2.5 mm x 2.0 mm
VFLGA, Industrial Tem-
perature (–40°C to +85°C),
Device:
DSC61XX:
Ultra-Low Power MEMS Oscillator
±25 ppm,
100 MHz Frequency, Bulk.
Revision
A,
Pin Definition:
Selection Pin 1
Internal Pull Register
0
1
2
4
5
6
8
OE
Pull-up
Pull-up
Pull-up
None
b)
DSC6101HE1A-016.0000T: Ultra–Low
Power
MEMS Oscillator, Pin1= OE
with Internal Pull–Up, Stan-
dard Output Drive Strength,
4-Lead 1.6 mm x1.2 mm
VFLGA, Extended Com-
mercial Temperature
STDBY
FS
OE
STDBY
FS
None
None
(–20°C
±50 ppm,
to
+70°C),
A,
KHz
None
Output
Revision
16 MHz Frequency, Tape
and Reel.
Output Drive
Strength:
1
2
Standard
High
c)
DSC6183ME1A-032k768:
Ultra–Low
Power
MEMS Oscillator, Pin1=
32.768 KHz Clock Output,
Low Output Drive Strength,
4-Lead 2.0 mm x1.6 mm
VFLGA, Extended Com-
mercial Temperature
Packages:
C
J
M
H
=
=
=
=
4-Lead 3.2 mm x 2.5 mm DFN
4-Lead 2.5 mm x 2.0 mm VFLGA
4-Lead 2.0 mm x 1.6 mm VFLGA
4-Lead 1.6 mm x 1.2 mm VFLGA
(–20°C
to
+70°C),
Temperature
Range:
E
I
=
=
-20C to +70C (Extended Commercial)
-40C to +85C (Industrial)
±50 ppm, Revision A, Bulk
DSC6121CI2A-001A: Ultra–Low Power MEMS
Oscillator, Pin1= FS with
d)
Frequency
Stability:
1
2
=
=
± 50 ppm
± 25 ppm
internal Pull-up, Standard
Output Drive Strength, 4-
Lead 3.2 mm x 2.5 mm
CDFN, Industrial Tempera-
ture (-40 to 85 C), ±25
Revision:
A
=
Revision A
ppm, Revision A, Fre-
quency code = 001A (con-
Frequency:
xxx.xxxx = User-Defined Frequency between
001.0000 MHz and 100.0000 MHz
xxxkxxx = User-Defined Frequency between 002.000 kHz
and 999.999 kHz
figured
through
ClockWorks), Bulk
xxxx =
Frequency configuration code when pin 1 = FS.
Configure the part online through ClockWorks
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This
Tape and Reel:
Blank
T
=
=
Bulk
Tape and Reel
identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
Note 1: Please visit Microchip ClockWorks® Configurator Website to configure the part number for customized fre-
quency. http://clockworks.microchip.com/timing/.
2016 Microchip Technology Inc.
DS20005624A-page 23
DSC61XX
NOTES:
DS20005624A-page 24
2016 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,
KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,
MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,
RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O
are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
ETHERSYNCH, Hyper Speed Control, HyperLight Load,
IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,
Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2016, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0961-8
2016 Microchip Technology Inc.
DS20005624A-page 25
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
www.microchip.com
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Germany - Dusseldorf
Tel: 49-2129-3766400
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Germany - Karlsruhe
Tel: 49-721-625370
India - Pune
Tel: 91-20-3019-1500
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Austin, TX
Tel: 512-257-3370
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Boston
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
China - Dongguan
Tel: 86-769-8702-9880
Italy - Venice
Tel: 39-049-7625286
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Guangzhou
Tel: 86-20-8755-8029
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
Korea - Seoul
Cleveland
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Poland - Warsaw
Tel: 48-22-3325737
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Sweden - Stockholm
Tel: 46-8-5090-4654
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Detroit
Novi, MI
Tel: 248-848-4000
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Houston, TX
Tel: 281-894-5983
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Los Angeles
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Taiwan - Kaohsiung
Tel: 886-7-213-7828
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
06/23/16
DS20005624A-page 26
2016 Microchip Technology Inc.
相关型号：
©2020 ICPDF网 联系我们和版权申明