DSC6023ME1B-B [MICROCHIP]
Ultra-Small, Ultra-Low Power MEMS Oscillator;
| 型号： | DSC6023ME1B-B |
| 厂家： | 
MICROCHIP |
| 描述： | Ultra-Small, Ultra-Low Power MEMS Oscillator |
| 文件： | 总26页 (文件大小：335K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DSC60XXB
Ultra-Small, Ultra-Low Power MEMS Oscillator
Features
General Description
• Wide Frequency Range: 2 kHz to 80 MHz
The DSC60xxB family of MEMS oscillators combines
industry-leading low-power consumption, ultra-small
packages with exceptional frequency stability, and jitter
performance over temperature. The single-output
DSC60xxB MEMS oscillators are excellent choices for
use as clock references in small, battery-powered
devices such as wearable and Internet of Things (IoT)
devices in which small size, low power consumption,
and long-term reliability are paramount. The
Automotive Grade AEC-Q100 qualified option is
available for this device.
• Ultra-Low Power Consumption: 1.3 mA/1 µA
(Active/Standby)
• Ultra-Small Footprints
- 1.6 mm x 1.2 mm
- 2.0 mm x 1.6 mm
- 2.5 mm x 2.0 mm
• Frequency Select Input Supports Two
Pre-Defined Frequencies
• High Stability: ±20 ppm, ±25 ppm, ±50 ppm
• Wide Temperature Range
The DSC60xxB family is available in ultra-small
1.6 mm x 1.2 mm, 2.0 mm x 1.6 mm and 2.5 mm x
2.0 mm packages. These packages are “drop-in”
replacements for standard 4-pin CMOS quartz crystal
oscillators.
- Automotive: –40°C to +125°C
- Ext. Industrial: –40°C to +105°C
- Industrial: –40°C to +85°C
- Ext. Commercial: –20° to +70°C
• Excellent Shock and Vibration Immunity
- Qualified to MIL-STD-883
Package Types
DSC60XXB
• High Reliability
2.5 mm x 2.0 mm LGA
2.0 mm x 1.6 mm LGA
1.6 mm x 1.2 mm LGA
(Top View)
- 20x Better MTF Than Quartz Oscillators
• Supply Range of 1.71V to 3.63V
• Short Sample Lead Time: <2 weeks
• Lead Free & RoHS Compliant
Applications
• Low Power/Portable Applications: IoT,
Embedded/Smart Devices
OE/STDBY/FS
GND
4
1
2
VDD
OUT
• Consumer: Home Healthcare, Fitness Devices,
Home Automation
3
• Automotive: Rear View/Surround View Cameras,
Infotainment System (Please refer to DSA60xx
Family)
• Industrial: Building/Factory Automation,
Surveillance Camera
2019 Microchip Technology Inc.
DS20006133A-page 1
DSC60XXB
Block Diagram
DSC60xxB
DIGITAL
CONTROL
SUPPLY
REGULATION
OE/STBY/FS
PIN 1
VDD
PIN 4
MEMS
RESONATOR
PLL
TEMP SENSOR
CONTROL &
COMPENSATION
OUTPUT
DIVIDER
VCO
DRIVER
GND
PIN 2
OUTPUT
PIN 3
DS20006133A-page 2
2019 Microchip Technology Inc.
DSC60XXB
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Supply Voltage.......................................................................................................................................... –0.3V to +4.0V
Input Voltage (VIN) ..............................................................................................................................–0.3V to VDD+0.3V
ESD Protection ............................................................................................................ 4 kV HBM, 400V MM, 2 kV CDM
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, VDD = 1.8V –5% to 3.3V +10%, TA = –40°C to +125°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Supply Voltage Note 1
VDD
1.71
—
3.63
V
—
FOUT = 24 MHz, VDD = 1.8V,
No Load
Active Supply Current
Power Supply Ramp
IDD
tPU
—
1.3
—
mA
ms
0.1
—
—
1.0
1.5
—
100
—
Note 9
VDD = 1.8/2.5V
Standby Supply Current
Note 2
ISTBY
µA
—
—
V
DD = 3.3V
—
Frequency
f0
0.002
80
MHz
±20
±25
±50
Frequency Stability Note 3
∆f
—
—
ppm
All temp ranges
—
—
—
—
±5
±1
1st year @25°C
Aging
∆f
ppm
ms
Per year after first year
From 90% VDD to valid clock
output, T = 25°C
Startup Time
tSU
—
—
1.5
VIH
VIL
0.7 x VDD
—
—
—
—
V
V
Input Logic High
Input Logic Low
Input Logic Levels
Note 4
0.3 x VDD
Output Disable Time
Note 5
200 +
2 Periods
tDA
tEN
—
—
—
—
—
—
ns
µs
kΩ
—
—
Output Enable Time
Note 6
1
Enable Pull-Up Resistor
Note 7
300
—
If configured
VOH
VOL
0.8 x VDD
—
—
—
—
V
V
Output Logic High, I = 1 mA
Output Logic Low, I = –1 mA
Output Logic Levels,
Low Drive
0.2 x VDD
Note 1: Pin 4 VDD should be filtered with 0.1 µF capacitor.
2: Not including current through pull-up resistor on EN pin (if configured).
3: Includes frequency variations due to initial tolerance, temp. and power supply voltage.
4: Input waveform must be monotonic with rise/fall time < 10 ms
5: Output Disable time takes up to two periods of the output waveform + 200 ns.
6: For parts configured with OE, not Standby.
7: Output is enabled if pad is floated or not connected.
8: Output Duty Cycle will be 40% to 60% when output frequency is between 40 MHz to 60 MHz.
9: Time to reach 90% of target VDD. Power ramp rise must be monotonic.
10: Peak-to-peak period jitter is measured over 10,000 cycles.
2019 Microchip Technology Inc.
DS20006133A-page 3
DSC60XXB
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, VDD = 1.8V –5% to 3.3V +10%, TA = –40°C to +125°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
—
2.5
3.5
VDD = 1.8V
DSC60x3B
Low Drive,
20% to 80%
CL = 5 pF
tRX/tFX
ns
VDD
2.5V/3.3V
=
—
—
1.5
1.2
2.2
2.0
Output Transition Time
Rise Time/Fall Time
VDD = 1.8V
DSC60x1B
Std. Drive,
20% to 80%
CL = 10 pF
tRY/tFY
ns
%
VDD
2.5V/3.3V
=
—
45
—
0.6
—
1.2
55
—
Output Duty Cycle Note 8
SYM
—
DSC60x3B
Low Drive,
28
VDD = 1.8V
FOUT
=
27 MHz
CL = 5 pF
VDD
2.5V/3.3V
=
—
—
—
—
—
—
—
23
20
—
—
—
—
—
—
—
Period Jitter, RMS
JPER
ps
DSC60x1B
Std. Drive,
V
DD = 1.8V
FOUT
=
27 MHz
CL = 10 pF
VDD
2.5V/3.3V
=
18
DSC60x3B
Low Drive,
120
90
VDD = 1.8V
FOUT
=
27 MHz
CL = 5 pF
VDD
2.5V/3.3V
=
Cycle-to-Cycle Jitter, Peak
JCy–Cy
ps
DSC60x1B
Std. Drive,
115
90
VDD = 1.8V
FOUT
=
27 MHz
CL = 10 pF
VDD
2.5V/3.3V
=
Note 1: Pin 4 VDD should be filtered with 0.1 µF capacitor.
2: Not including current through pull-up resistor on EN pin (if configured).
3: Includes frequency variations due to initial tolerance, temp. and power supply voltage.
4: Input waveform must be monotonic with rise/fall time < 10 ms
5: Output Disable time takes up to two periods of the output waveform + 200 ns.
6: For parts configured with OE, not Standby.
7: Output is enabled if pad is floated or not connected.
8: Output Duty Cycle will be 40% to 60% when output frequency is between 40 MHz to 60 MHz.
9: Time to reach 90% of target VDD. Power ramp rise must be monotonic.
10: Peak-to-peak period jitter is measured over 10,000 cycles.
DS20006133A-page 4
2019 Microchip Technology Inc.
DSC60XXB
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, VDD = 1.8V –5% to 3.3V +10%, TA = –40°C to +125°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
DSC60x3B
Low Drive,
FOUT
—
210
—
VDD = 1.8V
=
27 MHz
CL = 5 pF
VDD
2.5V/3.3V
=
—
—
—
190
160
144
—
—
—
Period Jitter,
Peak-to-Peak, Note 10
JPERPK-PK
ps
DSC60x1B
Std. Drive,
V
DD = 1.8V
FOUT
=
27 MHz
CL = 10 pF
VDD
2.5V/3.3V
=
Note 1: Pin 4 VDD should be filtered with 0.1 µF capacitor.
2: Not including current through pull-up resistor on EN pin (if configured).
3: Includes frequency variations due to initial tolerance, temp. and power supply voltage.
4: Input waveform must be monotonic with rise/fall time < 10 ms
5: Output Disable time takes up to two periods of the output waveform + 200 ns.
6: For parts configured with OE, not Standby.
7: Output is enabled if pad is floated or not connected.
8: Output Duty Cycle will be 40% to 60% when output frequency is between 40 MHz to 60 MHz.
9: Time to reach 90% of target VDD. Power ramp rise must be monotonic.
10: Peak-to-peak period jitter is measured over 10,000 cycles.
2019 Microchip Technology Inc.
DS20006133A-page 5
DSC60XXB
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Temperature Ranges
Sym.
Min.
Typ.
Max.
Units
Conditions
Maximum Junction Temperature
Storage Ambient Temperature Range
Soldering Temperature
TJ
TS
—
—
–55
—
—
—
+150
+150
—
°C
°C
°C
—
—
+260
40 sec. max.
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the max-
imum allowable power dissipation will cause the device operating junction temperature to exceed the max-
imum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability.
DS20006133A-page 6
2019 Microchip Technology Inc.
DSC60XXB
2.0
PIN DESCRIPTIONS
The DSC60xxB is a highly configurable device and can be factory programmed in many different ways to meet the
customer’s needs. Microchip’s ClockWorks® Configurator http://clockworks.microchip.com/Timing/ must be used to
choose the necessary options, create the final part number, data sheet, and order samples. The descriptions of the pins
are listed in Table 2-1.
TABLE 2-1:
Pin Number
DSC60XXB PIN FUNCTION TABLE
Pin Name
Description
OE
Output Enable: H = Active, L = Disabled (High Impedance).
Standby: H = Device is active, L = Device is in standby (Low
Power Mode).
STDBY
1
Frequency Select: H = Output Frequency 1, L = Output
Frequency 2.
FS
2
3
4
GND
OUTPUT
VDD
Ground.
Oscillator clock output
Power Supply: 1.71V to 3.63V.
An explanation of the different options listed in Table 2-1 follows.
2.1
Pin 1
This is a control pin and may be configured to fulfill one
of six different functions. If not actively driven, a 10 kΩ
pull-up resistor is recommended.
2.1.1
OUTPUT ENABLE (OE)
Pin 1 may be configured as OE. Oscillator output may
be turned on and off according to the state of this pin.
2.1.2
STDBY
Pin 1 may be configured as Standby. When the pin is
low, both output buffer and PLL will be off and the
device will enter a low power mode.
2.1.3
FREQUENCY SELECT (FS)
Pin 1 may be configured as FS. The output may be set
to one of two pre-programmed frequencies. The output
clock frequencies can only be set to either kHz or MHz.
A combination of kHz and MHz cannot be set.
2.2
Pins 2 through 4
Pins 2 and 4 are the supply terminals, GND and VDD
respectively. Pin 3 is the clock output, programmable to
Standard and Low Drive strength settings. Visit
ClockWorks® Configurator to customize your device.
2019 Microchip Technology Inc.
DS20006133A-page 7
DSC60XXB
3.0
DIAGRAMS
tR
tF
VOH
OUTPUT
VOL
tEN
1/fo
tDA
VIH
ENABLE
VIL
FIGURE 3-1:
Output Waveform.
IDD
4
1
3
2
VDD
0.1μF
CL
VDA
FIGURE 3-2:
Test Circuit.
Via to GND Layer
C1
VDD
Enable
Output
GND
Via to GND Layer
FIGURE 3-3:
Recommended Board Layout.
DS20006133A-page 8
2019 Microchip Technology Inc.
DSC60XXB
4.0
SOLDER REFLOW PROFILE
20-40
Seconds
260°C
60-150
Seconds
217°C
200°C
Reflow
60-180
150°C
25°C
Seconds
Pre-Heat
Cool
Time
8 minutes max.
FIGURE 4-1:
Solder Reflow Profile.
MSL 1 @ 260°C refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp)
Preheat Time 150°C to 200°C
Time maintained above 217°C
Peak Temperature
3°C/sec. max.
60 to 180 sec.
60 to 150 sec.
255°C to 260°C
20 to 40 sec.
Time within 5°C of actual Peak
Ramp-Down Rate
6°C/sec. max.
8 minutes max.
Time 25°C to Peak Temperature
2019 Microchip Technology Inc.
DS20006133A-page 9
DSC60XXB
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
4-Lead VFLGA*
2.5 x 2.0
Example
XXXXXXX
XXXYYWW
SSS
0400000
DCP1834
287
4-Lead VFLGA*
2.0 x 1.6/1.6 x 1.2
Example
XXXX
SSS
011H
502
Legend: XX...X Product code or customer-specific information
Y
Year code (last digit of calendar year)
YY
WW
SSS
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
*
e
3
)
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (⎯) symbol may not be to scale.
DS20006133A-page 10
2019 Microchip Technology Inc.
DSC60XXB
4-Lead VFLGA 1.6 mm x 1.2 mm Package Outline
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.05 C
2X
1
2
TOP VIEW
0.05 C
0.10 C
A1
A
C
SEATING
PLANE
4X
(A3)
0.08 C
SIDE VIEW
b2
1
3X b1
0.07
0.03
C A B
C
CH
2
CH
NOTE 1
e1
e1
2
4X L
N
e
BOTTOM VIEW
Microchip Technology Drawing C04-1199A Sheet 1 of 2
2019 Microchip Technology Inc.
DS20006133A-page 11
DSC60XXB
4-Lead VFLGA 1.6 mm x 1.2 mm Package Outline
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Terminal Pitch
Terminal Pitch
Overall Height
Standoff
N
4
e
1.20 BSC
0.75 BSC
0.84
e1
A
A1
0.79
0.00
0.89
0.05
0.02
Substrate Thickness (with Terminals) A3
0.20 REF
1.60 BSC
1.20 BSC
0.30
0.375
0.35
Overall Length
Overall Width
D
E
Terminal Width
Terminal Width
Terminal Length
Terminal 1 Index Chamfer
b1
b2
L
0.25
0.325
0.30
-
0.35
0.425
0.40
-
CH
0.125
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1199A Sheet 2 of 2
DS20006133A-page 12
2019 Microchip Technology Inc.
DSC60XXB
4-Lead VFLGA 1.6 mm x 1.2 mm Recommended Land Pattern
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E1
X1
G1
4
Y
C
G2
1
2
(CH)
SILK SCREEN
X2
E2
RECOMMENDED LAND PATTERN
Units
MILLIMETERS
Dimension Limits
MIN
NOM
1.20 BSC
1.16 BSC
0.75
MAX
Contact Pitch
Contact Pitch
E1
E2
C
Contact Spacing
Contact Width (X3)
Contact Width
X1
X2
Y
0.35
0.43
0.50
Contact Pad Length (X6)
Space Between Contacts (X4)
Space Between Contacts (X3)
Contact 1 Index Chamfer
G1
G2
CH
0.85
0.25
0.13 X 45° REF
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3199A
2019 Microchip Technology Inc.
DS20006133A-page 13
DSC60XXB
4-Lead VFLGA 2.0 mm x 1.6 mm Package Outline
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.05 C
2X
1
2
TOP VIEW
0.05 C
0.10 C
A1
A
C
SEATING
PLANE
4X
(A3)
0.08 C
SIDE VIEW
b2
1
3X b1
0.07
0.03
C A B
C
CH
2
CH
NOTE 1
e1
e1
2
4X L
N
e
BOTTOM VIEW
Microchip Technology Drawing C04-1200A Sheet 1 of 2
DS20006133A-page 14
2019 Microchip Technology Inc.
DSC60XXB
4-Lead VFLGA 2.0 mm x 1.6 mm Package Outline (Continued)
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Terminal Pitch
Terminal Pitch
Overall Height
Standoff
N
6
e
1.55 BSC
0.95 BSC
0.84
e1
A
A1
0.79
0.00
0.89
0.05
0.02
Substrate Thickness (with Terminals) A3
0.20 REF
2.00 BSC
1.60 BSC
0.35
0.45
0.55
Overall Length
Overall Width
D
E
Terminal Width
Terminal Width
Terminal Length
Terminal 1 Index Chamfer
b1
b2
L
0.30
0.40
0.50
-
0.40
0.50
0.60
-
CH
0.15
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1200A Sheet 2 of 2
2019 Microchip Technology Inc.
DS20006133A-page 15
DSC60XXB
4-Lead VFLGA 2.0 mm x 1.6 mm Package Outline
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X1
4
Y
G2
C
1
2
(CH)
G1
E
SILK SCREEN
RECOMMENDED LAND PATTERN
Units
MILLIMETERS
Dimension Limits
MIN
NOM
1.55 BSC
0.95
MAX
Contact Pitch
Contact Spacing
E
C
Contact Width (X4)
Contact Width (X2)
Contact Pad Length (X6)
X1
X2
Y
0.50
0.40
0.70
Space Between Contacts (X4)
Space Between Contacts (X3)
Contact 1 Index Chamfer
G1
G2
CH
1.05
0.25
0.13 X 45° REF
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3200A
DS20006133A-page 16
2019 Microchip Technology Inc.
DSC60XXB
4-Lead VLGA 2.5 mm x 2.0 mm Package Outline
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.05 C
2X
1
2
TOP VIEW
0.05 C
0.10 C
A1
C
A
SEATING
PLANE
4X
(A3)
0.08 C
SIDE VIEW
4X b1
0.07
0.03
C A B
C
CH
1
2
CH
NOTE 1
e1
e1
2
4X L
N
e
BOTTOM VIEW
Microchip Technology Drawing C04-1202A Sheet 1 of 2
2019 Microchip Technology Inc.
DS20006133A-page 17
DSC60XXB
4-Lead VLGA 2.5 mm x 2.0 mm Package Outline (Continued)
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Terminal Pitch
Terminal Pitch
Overall Height
Standoff
N
4
e
1.65 BSC
1.25 BSC
0.84
e1
A
A1
0.79
0.00
0.89
0.05
0.02
Substrate Thickness (with Terminals) A3
0.20 REF
2.50 BSC
2.00 BSC
0.65
0.65
0.225
Overall Length
Overall Width
D
E
Terminal Width
Terminal Length
Terminal 1 Index Chamfer
b1
L
CH
0.60
0.60
-
0.70
0.70
-
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1202A Sheet 2 of 2
DS20006133A-page 18
2019 Microchip Technology Inc.
DSC60XXB
4-Lead VLGA 2.5 mm x 2.0 mm Recommended Land Pattern
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X
4
Y
C
G2
1
2
(CH)
G1
E
SILK SCREEN
RECOMMENDED LAND PATTERN
Units
MILLIMETERS
Dimension Limits
MIN
NOM
1.65 BSC
1.25
MAX
Contact Pitch
Contact Spacing
Contact Width (X4)
Contact Pad Length (X6)
E
C
X
Y
0.70
0.80
Space Between Contacts (X4)
Space Between Contacts (X3)
Contact 1 Index Chamfer
G1
G2
CH
0.95
0.45
0.13 X 45° REF
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3202A
2019 Microchip Technology Inc.
DS20006133A-page 19
DSC60XXB
NOTES:
DS20006133A-page 20
2019 Microchip Technology Inc.
DSC60XXB
APPENDIX A: REVISION HISTORY
Revision A (January 2019)
• Initial creation of DSC60xxB Microchip data sheet
DS20006133A.
2019 Microchip Technology Inc.
DS20006133A-page 21
DSC60XXB
NOTES:
DS20006133A-page 22
2019 Microchip Technology Inc.
DSC60XXB
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
X
PART NO.
X
X
X
X – XXX.XXXX
X
X
a) DSC6013JI3B-80.0000:
Device Pin 1
Definition
Output Package
Drive
Strength
Temperature
Range
Revision Frequency
Ultra–Low Power MEMS Oscillator, Pin1 = STDBY
with Internal Pull-Up, Low Drive Strength, 4-Lead
2.5 mm x 2.0 mm VLGA, Industrial Temperature,
±20 ppm Stability, Revision B, 80 MHz Frequency,
140/Tube
Tape
and
Reel
Frequency
Stability
Device:
DSC60:
Ultra-Low Power MEMS Oscillator
b) DSC6001HE1B-016.0000T:
Pin 1 Definition:
Selection
Pin 1
Internal Pull-Up Register
Ultra–Low Power MEMS Oscillator, Pin1 = OE with
Internal Pull–Up, Standard Drive Strength, 4-Lead
1.6 mm x 1.2 mm VFLGA, Extended Commercial
Temp., ±50 ppm Stability, Revision B, 16 MHz
Frequency, 1,000/Reel
0
1
2
4
5
6
OE
Pull-up
Pull-up
Pull-up
None
STDBY
FS
OE
c) DSC6021MI2B-005Q:
STDBY
FS
None
Ultra–Low Power MEMS Oscillator, Pin1 = Freq. Select
with Internal Pull-Up, Standard Drive Strength, 4-Lead
2.0 mm x 1.6 mm VFLGA, Industrial Temperature,
±25 ppm Stability, Revision B, Two Frequencies
Configured through ClockWorks, 100/Bag
None
Output Drive
Strength:
1
3
Standard
Low
Package:
J
M
H
=
=
=
4-Lead 2.5 mm x 2.0 mm VLGA
4-Lead 2.0 mm x 1.6 mm VFLGA
4-Lead 1.6 mm x 1.2 mm VFLGA
Temperature
Range:
A
L
I
=
=
=
=
–40C to +125C (Automotive)
–40C to +105C (Extended Industrial)
–40C to +85C (Industrial)
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the Tape
and Reel option.
E
–20C to +70C (Extended Commercial)
Frequency
Stability:
1
2
3
=
=
=
± 50 ppm
± 25 ppm
± 20 ppm
Revision:
B
=
Revision B
Frequency:
xxx.xxxx = User-Defined Frequency between
001.0000 MHz and 80.0000 MHz
xxxkxxx = User-Defined Frequency between 002.000 kHz
and 999.999 kHz
xxxx
= Frequency configuration code when pin 1 = FS.
®
Configure the part online through ClockWorks
configurator.
Tape and Reel:
<blank>= 140/Tube (J Package Option)
<blank>= 100/Bag (M & H Package Options)
T
B
=
=
1,000/Reel
3,000/Reel
Note 1: Please visit Microchip ClockWorks® Configurator Website to configure the part number for customized fre-
quency. http://clockworks.microchip.com/timing/.
2019 Microchip Technology Inc.
DS20006133A-page 23
DSC60XXB
NOTES:
DS20006133A-page 24
2019 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo,
CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo,
JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo,
SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity,
JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation,
PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon,
QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O,
SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
QUALITYꢀMANAGEMENTꢀꢀSYSTEMꢀ
CERTIFIEDꢀBYꢀDNVꢀ
© 2019, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-4072-7
== ISO/TSꢀ16949ꢀ==ꢀ
2019 Microchip Technology Inc.
DS20006133A-page 25
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
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Tel: 480-792-7200
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Technical Support:
http://www.microchip.com/
support
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Tel: 61-2-9868-6733
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Tel: 91-80-3090-4444
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Tel: 86-10-8569-7000
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DS20006133A-page 26
2019 Microchip Technology Inc.
08/15/18
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