DSC2311KE2-R0002T [MICROCHIP]
Crystal-less⢠Configurable Two-Output Clock Generator;
| 型号： | DSC2311KE2-R0002T |
| 厂家： | 
MICROCHIP |
| 描述： | Crystal-less⢠Configurable Two-Output Clock Generator |
| 文件： | 总18页 (文件大小：228K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DSC2311
Crystal-less™ Configurable Two-Output Clock Generator
Features
General Description
• Two Simultaneous CMOS Outputs
- Output 1 Range: 2.3 MHz to 170 MHz
- Output 2 Range: 2.3 MHz to 170 MHz
• Low RMS Phase Jitter: <1 ps (typ.)
• High Stability: ±25 ppm, ±50 ppm
• Wide Temperature Range
- Automotive: –40°C to +125°C
- Ext. Industrial –40°C to +105°C
- Industrial –40°C to +85°C
- Ext. Commercial –20°C to +70°C
• High Supply Noise Rejection: –50 dBc
• High Shock and Vibration Immunity
- Qualified to MIL-STD-883
The DSC2311 is a crystal-less™ clock generator that is
factory-configurable to simultaneously output two
separate frequencies from 2.3 MHz to 170 MHz. The
clock generator uses proven silicon MEMS technology
to provide low jitter and high frequency stability across
a wide range of supply voltages and temperatures. By
eliminating the external quartz crystal, crystal-less
clock generators significantly enhance reliability and
accelerate product development, while meeting
stringent clock performance criteria for a variety of
consumer electronics, communications, and storage
applications.
DSC2311 has an Output Enable/Disable feature that
allows it to disable the outputs when OE is low. The
device is available in a space-saving 6-pin 2.5 mm x
2.0 mm crystal-less VDFN package that uses only a
single external bypass capacitor. This requires a PCB
footprint equivalent to that of a 1.0 mm x 1.0 mm
crystal-based clock generator.
• High Reliability
- 20x higher MTBF than crystal-based clock
generator designs
• Supply Range of 2.25V to 3.6V
• Lead Free and RoHS-Compliant
Applications
• Consumer Electronics
• Camera and Imaging Modules
• Home Automation
• Industrial and Power Conversion
• Mobile Communications, Internet, and Sensor
Devices
• Solid State, Hard Drive, and Flash Drive Storage
Block Diagram
Control Circuitry
FOUT1
Output
MEMS
PLL
Control
and
Divider
OE
FOUT2
2016 Microchip Technology Inc.
DS20005611A-page 1
DSC2311
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage .......................................................................................................................................... –0.3V to +4.0V
Input Voltage .......................................................................................................................................–0.3V to VDD+0.3V
ESD Protection (HBM) ...............................................................................................................................................4 kV
ESD Protection (CDM) ............................................................................................................................................1.5 kV
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
Specifications: VDD = 3.3V; TA = +25°C unless otherwise specified.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Supply Voltage (Note 1)
VDD
2.25
—
3.6
V
—
EN pin low. All outputs
disabled.
Supply Current (Note 2)
IDD
—
—
21
—
23
mA
±25
Includes frequency
variations due to initial
tolerance, temperature, and
power supply voltage.
Frequency Stability (Note 3)
∆f
ppm
—
—
±50
Aging
∆f
—
—
—
—
—
—
—
±5
ppm One year at +25°C
Start-up Time (Note 4)
tSU
VIH
VIL
tDA
tEN
—
5
ms
T = +25°C
Input logic high
Input logic low
—
0.75 x VDD
—
Input Logic Levels
V
—
—
—
0.25 x VDD
Output Disable Time
Output Enable Time
5
ns
ns
20
—
Pull-up exists on all digital
IO
Pull-Up Resistor (Note 2)
Output Logic Levels
—
—
40
—
kΩ
VOH
VOL
0.9 x VDD
—
—
—
—
Output logic high, I = ±6 mA
Output logic low, I = ±6 mA
V
0.1 x VDD
Rise time. 20% to 80%;
CL = 15 pF
tR
tF
—
—
1.1
1.4
2.0
2.0
Output Transition Time
ns
Fall time. 20% to 80%;
CL = 15 pF
Commercial/Industrialtemp.
range
2.3
3.3
3.3
—
—
—
170
100
170
Frequency
f0
MHz Automotive temp. range
Extended Industrial temp.
range
Note 1: Pin 4 VDD should be filtered with a 0.01 µF capacitor.
2: Output is enabled if Enable pad is floated or not connected. Operating current = disabled current + ∆IDD
from FOUT1 + ∆IDD from FOUT2. See Current Consumption graph for more information.
3: For other ppm stabilities, please contact the factory.
4: tSU is time to 100 ppm stable output frequency after VDD is applied and outputs are enabled.
5: Period jitter includes crosstalk from adjacent output.
DS20005611A-page 2
2016 Microchip Technology Inc.
DSC2311
ELECTRICAL CHARACTERISTICS (CONTINUED)
Specifications: VDD = 3.3V; TA = +25°C unless otherwise specified.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Output Duty Cycle
SYM
JPER
45
—
—
3
55
—
%
—
Period Jitter (Note 5)
psRMS FO1 = FO2 = 25 MHz
200 kHz to 20 MHz @
25 MHz
—
—
—
0.3
0.38
1.7
—
—
2
100 kHz to 20 MHz @
25 MHz
Integrated Phase Noise
JCC
psRMS
12 kHz to 20 MHz @
25 MHz
Note 1: Pin 4 VDD should be filtered with a 0.01 µF capacitor.
2: Output is enabled if Enable pad is floated or not connected. Operating current = disabled current + ∆IDD
from FOUT1 + ∆IDD from FOUT2. See Current Consumption graph for more information.
3: For other ppm stabilities, please contact the factory.
4: tSU is time to 100 ppm stable output frequency after VDD is applied and outputs are enabled.
5: Period jitter includes crosstalk from adjacent output.
2016 Microchip Technology Inc.
DS20005611A-page 3
DSC2311
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Temperature Ranges
Sym.
Min.
Typ.
Max.
Units
Conditions
TA
TA
TA
TA
TJ
TS
—
–20
–40
–40
–40
—
—
—
—
—
—
—
—
+70
+85
°C
°C
°C
°C
°C
°C
°C
Ordering Option E
Ordering Option I
Ordering Option L
Ordering Option M
—
Operating Temperature Range (T)
+105
+125
+150
+150
+260
Junction Temperature
Storage Temperature Range
Soldering Temperature Range
–40
—
—
40 sec. max.
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature, and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
DS20005611A-page 4
2016 Microchip Technology Inc.
DSC2311
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin Number
PIN FUNCTION TABLE
Pin Name
Description
1
2
3
4
5
6
ENABLE
N/C
Output Enable for both CLK0 and CLK1.
Do not connect.
GROUND
CLK0
Ground.
Clock Output 0 (CMOS).
Clock Output 1 (CMOS).
Supply Voltage.
CLK1
VDD
2016 Microchip Technology Inc.
DS20005611A-page 5
DSC2311
3.0
OUTPUT WAVEFORM
tR
tF
VOH
Output
VOL
tEN
1/fo
tDA
VIH
Enable
VIL
FIGURE 3-1:
OE Function and Output Waveform: LVCMOS.
DS20005611A-page 6
2016 Microchip Technology Inc.
DSC2311
4.0
CURRENT CONSUMPTION
Total Current = Disabled Current + ∆IDD FOUT1 + ∆IDD FOUT2
18
16
14
12
10
8
3 pF
5 pF
10 pF
15 pF
6
4
2
0
0
20
40
60
80
FOUT (MHz)
100
120
140
FIGURE 4-1:
∆I / Output vs. Frequency and Load @ 3.3V V
DD DD
2016 Microchip Technology Inc.
DS20005611A-page 7
DSC2311
5.0
SOLDER REFLOW PROFILE
20-40
SECONDS
260°C
217°C
200°C
60-150
SECONDS
REFLOW
150°C
25°C
60-180
SECONDS
PRE-HEAT
COOL
TIME
8 MINUTES MAX.
6-PIN QFN MSL 1 @ 260°C refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp)
Preheat Time 150°C to 200°C
Time Maintained above 217°C
Peak Temperature
3°C/sec. max.
60-180 sec.
60-150 sec.
255°C to 260°C
20-40 sec.
Time within 5°C of Actual Peak
Ramp-Down Rate
6°C/sec. max.
8 minutes max.
Time 25°C to Peak Temperature
DS20005611A-page 8
2016 Microchip Technology Inc.
DSC2311
6.0
PACKAGE MARKING INFORMATION
6-Lead VDFN 2.5 mm x 2.0 mm Package Outline and Recommended Land Pattern
6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.05 C
1
TOP2VIEW
2X
0.05 C
0.10 C
A
C
A1
SEATING
PLANE
6X
0.08 C
SIDE VIEW
2X b2
1
2
L2
5X L1
N
4X b1
0.10
0.05
C A B
C
e
BOTTOM VIEW
Microchip Technology Drawing C04-1005A Sheet 1 of 2
2016 Microchip Technology Inc.
DS20005611A-page 9
DSC2311
6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Pitch
Overall Height
Standoff
Overall Length
Overall Width
Terminal Width
Terminal Width
Terminal Length
Terminal Length
N
6
e
0.825 BSC
0.85
0.02
2.50 BSC
2.00 BSC
0.65
0.25
0.70
0.765
A
A1
D
0.80
0.00
0.90
0.05
E
b1
b2
L1
L2
0.60
0.20
0.60
0.70
0.30
0.80
0.665
0.865
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1005A Sheet 2 of 2
DS20005611A-page 10
2016 Microchip Technology Inc.
DSC2311
6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X1
X2
1
2
Y
G2 C
6
G1
SILK SCREEN
E
RECOMMENDED LAND PATTERN
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Contact Pitch
E
X1
X2
Y
0.825 BSC
Contact Pad Width (X4)
Contact Pad Width (X2)
Contact Pad Length (X6)
Contact Pad Spacing
0.65
0.25
0.85
C
1.45
Space Between Contacts (X4)
Space Between Contacts (X3)
G1
G2
0.38
0.60
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-3005A
2016 Microchip Technology Inc.
DS20005611A-page 11
DSC2311
NOTES:
DS20005611A-page 12
2016 Microchip Technology Inc.
DSC2311
APPENDIX A: REVISION HISTORY
Revision A (September 2016)
• Converted Micrel data sheet DSC2311 to Micro-
chip DS20005611A.
• Minor text changes throughout.
• Package name updated to VDFN.
2016 Microchip Technology Inc.
DS20005611A-page 13
DSC2311
NOTES:
DS20005611A-page 14
2016 Microchip Technology Inc.
DSC2311
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
X
PART NO.
X
X
-Rxxxx
X
a)
DSC2311KE1-RxxxxT: Crystal-less Configurable
Two-Output Clock Genera-
Device Package
Temperature Stability
Range
Frequency
Package
tor, 6-LD VDFN, Extended
Commercial Temp. Range,
±50 ppm Stability, Custom
Device:
DSC2311:
Crystal-less Configurable Two-Output Clock
Generator
Frequency (F
and
OUT1
F
), Tape & Reel
OUT2
b)
DSC2311KM2-Rxxxx: Crystal-less Configurable
Two-Output Clock Genera-
Package:
K
=
6-LEAD 2.5 mm x 2.0 mm VDFN
tor, 6-LD VDFN, Automotive
Temp. Range, ±25 ppm Sta-
Temperature
Range:
E
I
L
M
=
=
=
=
–20C to +70C (Extended Commercial)
–40C to +85C (Industrial)
–40C to +105C (Extended Industrial)
–40C to +125C (Automotive)
bility, Custom Frequency
(F
and F
), Tube
OUT2
OUT1
Stability:
1
2
=
=
±50 ppm
±25 ppm
Frequency:
Rxxxx
=
Custom Frequency Code
Packing Option:
Blank
T
=
=
Tube
Tape & Reel
Output Clock Frequencies
Output frequencies are factory-configured to individual customer
and product requirements, subject to output control and divider lim-
itations. Contact sales with your custom frequency needs.
Frequency Code
R0001
FOUT1 (MHz)
FOUT2 (MHz)
127
127
25
R0002
125
2016 Microchip Technology Inc.
DS20005611A-page 15
DSC2311
NOTES:
DS20005611A-page 16
2016 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
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suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
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are registered trademarks of Microchip Technology
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Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
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headquarters, design and wafer fabrication facilities in Chandler and
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All other trademarks mentioned herein are property of their
respective companies.
QUALITYꢀMANAGEMENTꢀꢀSYSTEMꢀ
CERTIFIEDꢀBYꢀDNVꢀ
© 2016, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0986-1
== ISO/TSꢀ16949ꢀ==ꢀ
2016 Microchip Technology Inc.
DS20005611A-page 17
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06/23/16
DS20005611A-page 18
2016 Microchip Technology Inc.
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