DSC1124BE3T [MICROCHIP]
Low Jitter Precision HCSL Oscillator;
| 型号： | DSC1124BE3T |
| 厂家： | 
MICROCHIP |
| 描述： | Low Jitter Precision HCSL Oscillator |
| 文件： | 总28页 (文件大小：496K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DSC1104/24
Low Jitter Precision HCSL Oscillator
Features
General Description
• Low RMS Phase Jitter: <1 ps (typ.)
The DSC1104 and DSC1124 series of high
performance oscillators utilizes a proven silicon MEMS
technology to provide excellent jitter and stability over
a wide range of supply voltages and temperatures. By
eliminating the need for quartz or SAW technology,
MEMS oscillators significantly enhance reliability and
accelerate product development, while meeting
stringent clock performance criteria for a variety of
communications, storage, and networking applications.
• High Stability: ±10 ppm, ±20 ppm, ±25 ppm,
±50 ppm
• Wide Temperature Range
- Industrial: –40°C to +85°C
- Ext. Commercial: –20°C to +70°C
- Ext. Industrial: –40°C to +105°C
• High Supply Noise Rejection: –50 dBc
• Wide Frequency Range: 2.3 MHz to 460 MHz
• Small Industry Standard Footprints:
DSC1104 has a standby feature allowing it to
completely power down when EN pin is pulled low;
whereas for DSC1124, only the outputs are disabled
when EN is low. Both oscillators are available in
industry standard packages, including the small
2.5 mm x 2.0 mm, and are drop-in replacements for
standard 6-pin HCSL quartz crystal oscillators.
- 2.5 mm x 2.0 mm, 3.2 mm x 2.5 mm,
5.0 mm x 3.2 mm, and 7.0 mm x 5.0 mm
• Excellent Shock and Vibration Immunity
- Qualified to MIL-STD-883
• High Reliability
- 20x Better MTF than Quartz Oscillators
• Low Current Consumption
Block Diagram
• Supply Range of 2.25V to 3.6V
• Standby and Output Enable Function
• Lead Free and RoHS Compliant
Pin 1
ENABLE
Pin 6
VDD
TEMP SENSOR &
COMPENSATION
CIRCUITRY
Applications
• Storage Area Networks
- SATA, SAS, Fibre Channel
• Passive Optical Networks
- EPON, 10G-EPON, GPON, 10G-PON
• Ethernet
Pin 2
NC
Pin 5
OUTPUT
MEMS
PLL
DIVIDER
DRIVER
OSCILLATOR
Pin 3
GND
Pin 4
OUTPUT
- 1G, 10GBASE-T/KR/LR/SR, and FCoE
• HD/SD/SDI Video and Surveillance
• PCI Express: Gen 1 to Gen 4
• Display Port
TABLE 1:
EN Pin
OUTPUT ENABLE MODES
DSC1104
DSC1124
High
NC
Outputs Active
Outputs Active
Standby
Outputs Active
Outputs Active
Outputs Disabled
Low
2017 Microchip Technology Inc.
DS20005870A-page 1
DSC1104/24
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage .......................................................................................................................................... –0.3V to +4.0V
Input Voltage .....................................................................................................................................–0.3V to VDD + 0.3V
ESD Protection (HBM) ...............................................................................................................................................4 kV
ESD Protection (MM) ................................................................................................................................................400V
ESD Protection (CDM) ............................................................................................................................................1.5 kV
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
Specifications: VDD = 3.3V; TA = +25°C unless otherwise specified.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Supply Voltage (Note 1)
VDD
2.25
—
3.6
V
—
DSC1104, EN pin low,
Output is disabled
—
—
—
0.095
22
Supply Current
IDD
mA
DSC1124, EN pin low,
Output is disabled
20
—
—
—
—
—
—
—
—
—
—
—
—
±10
Includes frequency variation
due to initial tolerance,
temp., and power supply
voltage
—
±20
Frequency Stability
Δf
ppm
—
±25
—
±50
Aging
ΔfY1
tSU
VIH
VIL
—
±5
ppm One year at +25°C
Start-up Time (Note 2)
—
5
ms
T = +25°C
Input logic high
Input logic low
—
0.75 x VDD
—
Input Logic Levels
V
—
—
—
—
0.25 x VDD
Output Disable Time (Note 3)
Output Enable Time
tDA
5
5
ns
ms
ns
DSC1104
DSC1124
tEN
20
Enable Pull-Up Resistor
(Note 4)
RPU
—
40
—
kΩ
Pull-up resistor exists
HCSL Outputs
Supply Current
IDD
VOH
VOL
—
—
0.725
—
40
—
42
—
mA
V
Output Enabled, RL = 50Ω
Output logic high, RL = 50Ω
Output logic low
Output Logic Levels
—
0.1
—
Peak-to-Peak Output Swing
—
750
mV
Single-Ended
Rise time, 20% to 80%,RL =
50Ω, CL = 2 pF
tr
tf
200
200
—
—
400
—
Output Transition Time
(Note 3)
ps
Fall time, 20% to 80%,RL =
50Ω, CL = 2 pF
Frequency
f0
2.3
48
—
—
460
52
MHz Single frequency
Output Duty Cycle
SYM
%
Differential
DS20005870A-page 2
2017 Microchip Technology Inc.
DSC1104/24
ELECTRICAL CHARACTERISTICS (CONTINUED)
Specifications: VDD = 3.3V; TA = +25°C unless otherwise specified.
Parameters
Period Jitter
Sym.
Min.
Typ.
Max.
Units
Conditions
JPER
—
2.5
—
psRMS
—
200 kHz to 20 MHz @
156.25 MHz
—
—
—
0.25
0.38
1.7
—
—
2
100 kHz to 20 MHz @
156.25 MHz
Integrated Phase Noise
JPH
psRMS
12 kHz to 20 MHz @
156.25 MHz
Note 1: Pin 6 VDD should be filtered with a 0.1 µF capacitor.
2: tSU is time to 100 ppm stable output frequency after VDD is applied and outputs are enabled.
3: Output Waveform and Test Circuit figures below define the parameters.
4: Output is enabled if pad is floated or not connected.
2017 Microchip Technology Inc.
DS20005870A-page 3
DSC1104/24
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
–20
–40
–40
—
—
—
—
—
—
—
+70
+85
°C
°C
°C
°C
°C
°C
Ordering Option E
Ordering Option I
Ordering Option L
—
Operating Temperature Range
TA
+105
+150
+150
+260
Junction Temperature
TJ
TS
—
Storage Temperature Range
Soldering Temperature
–55
—
—
40 sec. max.
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature, and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability.
DS20005870A-page 4
2017 Microchip Technology Inc.
DSC1104/24
2.0
PIN DESCRIPTIONS
EN
NC
1
2
3
6
5
4
VDD
OUT
OUT
GND
FIGURE 2-1:
Pin Configuration, 6-Lead QFN.
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin Number Pin Name
Description
1
2
3
4
5
6
EN
NC
Enable.
Leave unconnected.
Ground.
GND
OUT
OUT
VDD
Output.
Complementary output.
Input.
2017 Microchip Technology Inc.
DS20005870A-page 5
DSC1104/24
3.0
NOMINAL PERFORMANCE PARAMETERS
Unless specified otherwise, T = +25°C, VDD = 3.3V.
2.5
2.0
1.5
1.0
0.5
0.0
0
50-mV
50MHz-HCSL
106MHz-HCSL
156MHz-HCSL
212MHz-HCSL
-10
100-mV
-20
-30
-40
-50
-60
-70
-80
0.1
1
10
100
1000
10000
0
200
400
600
800
1000
Supply Noise Frequency (kHz)
Low-end of integration BW: x kHz to 20 MHz
FIGURE 3-2:
Phase Noise).
Phase Jitter (Integrated
FIGURE 3-1:
Ratio.
Power Supply Rejection
DS20005870A-page 6
2017 Microchip Technology Inc.
DSC1104/24
4.0
OUTPUT WAVEFORM
tR
tF
Output
80%
830 mv
50%
20%
Output
tEN
1/fo
tDA
VIH
Enable
VIL
FIGURE 4-1:
Output Waveform.
2017 Microchip Technology Inc.
DS20005870A-page 7
DSC1104/24
5.0
TYPICAL TERMINATION SCHEME
VDD
0.1uF
Rs = 0 Ω for test
6
5
Rs
2
3
100 Ω
4
Rs
50 Ω
50 Ω
Rs serves to match the trace
impedances. Depending on
bo ard layo ut, th e value may
range from 0 to 30 ohms.
FIGURE 5-1:
Typical Termination Scheme.
6.0
TEST CIRCUIT
FIGURE 6-1:
Test Circuit.
DS20005870A-page 8
2017 Microchip Technology Inc.
DSC1104/24
7.0
SOLDER REFLOW PROFILE
MSL 1 @ 260°C refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp)
Preheat Time 150°C to 200°C
Time Maintained above 217°C
Peak Temperature
3°C/sec. max.
60-180 sec.
60-150 sec.
255°C to 260°C
20-40 sec.
Time within 5°C of Actual Peak
Ramp-Down Rate
6°C/sec. max.
8 minutes max.
Time 25°C to Peak Temperature
2017 Microchip Technology Inc.
DS20005870A-page 9
DSC1104/24
8.0
8.1
PACKAGE MARKING INFORMATION
Package Marking Information
Example
6-Pin CDFN/VDFN*
XXXXXXX
DCPYYWW
0SSS
0750000
DCP1723
0421
Legend: XX...X Product code, customer-specific information, or frequency in MHz
without printed decimal point
Y
Year code (last digit of calendar year)
YY
WW
SSS
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
*
e
3
)
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
DS20005870A-page 10
2017 Microchip Technology Inc.
DSC1104/24
6-Lead VDFN 2.5 mm x 2.0 mm Package Outline and Recommended Land Pattern
6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.05 C
1
TOP2VIEW
2X
0.05 C
0.10 C
A
C
A1
SEATING
PLANE
6X
0.08 C
SIDE VIEW
2X b2
1
2
L2
5X L1
N
4X b1
0.10
0.05
C A B
C
e
BOTTOM VIEW
Microchip Technology Drawing C04-1005A Sheet 1 of 2
2017 Microchip Technology Inc.
DS20005870A-page 11
DSC1104/24
6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Pitch
Overall Height
Standoff
Overall Length
Overall Width
Terminal Width
Terminal Width
Terminal Length
Terminal Length
N
6
e
0.825 BSC
0.85
A
A1
D
0.80
0.00
0.90
0.05
0.02
2.50 BSC
2.00 BSC
0.65
0.25
0.70
E
b1
b2
L1
L2
0.60
0.20
0.60
0.70
0.30
0.80
0.665
0.765
0.865
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1005A Sheet 2 of 2
DS20005870A-page 12
2017 Microchip Technology Inc.
DSC1104/24
6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X1
X2
1
2
Y
G2 C
6
G1
SILK SCREEN
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
MILLIMETERS
MIN
NOM
MAX
Contact Pitch
E
X1
X2
Y
0.825 BSC
Contact Pad Width (X4)
Contact Pad Width (X2)
Contact Pad Length (X6)
Contact Pad Spacing
0.65
0.25
0.85
C
1.45
Space Between Contacts (X4)
Space Between Contacts (X3)
G1
G2
0.38
0.60
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-3005A
2017 Microchip Technology Inc.
DS20005870A-page 13
DSC1104/24
6-Lead VDFN 3.2 mm x 2.5 mm Package Outline and Recommended Land Pattern
6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.05 C
2X
1
2
TOP VIEW
0.05 C
0.10 C
0.08 C
A1
C
A
SEATING
PLANE
6X
SIDE VIEW
2X b2
1
2
NOTE 1
L
N
4X b1
L1
e
0.07
0.05
C A B
C
BOTTOM VIEW
Microchip Technology Drawing C04-1007A Sheet 1 of 2
DS20005870A-page 14
2017 Microchip Technology Inc.
DSC1104/24
6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Pitch
Overall Height
Standoff
Overall Length
Overall Width
Terminal Width
Terminal Width
Terminal Length
Terminal Pullback
N
6
e
1.05 BSC
0.85
0.02
3.20 BSC
2.50 BSC
0.90
0.50
0.70
0.10 REF
A
A1
D
0.80
0.00
0.90
0.05
E
b1
b2
L
0.85
0.45
0.65
0.95
0.55
0.75
L1
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1007A Sheet 2 of 2
2017 Microchip Technology Inc.
DS20005870A-page 15
DSC1104/24
6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X2
G
6
C
Y
1
2
X1
SILK SCREEN
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
MILLIMETERS
MIN
0.25
NOM
1.05 BSC
1.60
MAX
Contact Pitch
E
C
X1
X2
Y
Contact Pad Spacing
Contact Pad Width (X4)
Contact Pad Width (X2)
Contact Pad Length (X6)
1.00
0.60
0.85
Space Between Contacts (X4)
G1
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3007A
DS20005870A-page 16
2017 Microchip Technology Inc.
DSC1104/24
6-Lead CDFN 5.0 mm x 3.2 mm Package Outline and Recommended Land Pattern
2017 Microchip Technology Inc.
DS20005870A-page 17
DSC1104/24
6-Lead VDFN 7.0 mm x 5.0 mm Package Outline and Recommended Land Pattern
6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN]
With 2.8x1.8 mm Exposed Pad
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X2
EV
6
ØV
C
Y2
EV
G
Y1
1
2
X1
E
SILK SCREEN
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
MILLIMETERS
NOM
2.54 BSC
MIN
MAX
Contact Pitch
Optional Center Pad Width
Optional Center Pad Length
Contact Pad Spacing
X2
Y2
C
2.90
1.90
3.70
Contact Pad Width (X6)
Contact Pad Length (X6)
Contact Pad to Center Pad (X2)
Thermal Via Diameter (X6)
Thermal Via Pitch
X1
Y1
G
V
EV
1.50
1.35
0.20
0.33
1.20
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-3010A
DS20005870A-page 18
2017 Microchip Technology Inc.
DSC1104/24
6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN]
With 2.8x1.8 mm Exposed Pad
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.20 C
2X
1
2
0.20 C
TOP VIEW
A1
0.10 C
0.08 C
C
A
SEATING
PLANE
6X
SIDE VIEW
0.10
C A B
D2
2
1
0.10
C A B
NOTE 1
E2
6X L
(K)
6X b
N
0.10
0.05
C A B
C
e
BOTTOM VIEW
Microchip Technology Drawing C04-1010A Sheet 1 of 2
2017 Microchip Technology Inc.
DS20005870A-page 19
DSC1104/24
6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN]
With 2.8x1.8 mm Exposed Pad
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Pitch
Overall Height
N
6
2.54
0.85
0.02
7.00 BSC
2.80
5.00 BSC
1.80
1.40
1.10
e
A
A1
D
D2
E
E2
b
L
0.80
0.00
0.90
0.05
Standoff
Overall Length
Exposed Pad Length
Overall Width
Exposed Pad Width
Terminal Width
Terminal Length
2.70
2.90
1.70
1.35
1.00
1.90
1.45
1.20
Terminal-to-Exposed-Pad
K
0.20 REF
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1010A Sheet 2 of 2
DS20005870A-page 20
2017 Microchip Technology Inc.
DSC1104/24
6-Lead CDFN 7.0 mm x 5.0 mm Package Outline and Recommended Land Pattern
2017 Microchip Technology Inc.
DS20005870A-page 21
DSC1104/24
NOTES:
DS20005870A-page 22
2017 Microchip Technology Inc.
DSC1104/24
APPENDIX A: REVISION HISTORY
Revision A (December 2017)
• Initial conversion of Micrel document DSC1104/24
to Microchip data sheet template DS20005870A.
• Minor text changes throughout.
2017 Microchip Technology Inc.
DS20005870A-page 23
DSC1104/24
NOTES:
DS20005870A-page 24
2017 Microchip Technology Inc.
DSC1104/24
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
X
PART NO.
X
X
-XXX.XXXX
X
a) DSC1104AE1- Low Jitter Precision HCSL Oscillator
Device Package
Temperature Stability
Range
Frequency
Packaging
Option
053.5000:
with Standby, 6-Lead 7x5 CDFN, Ext.
Commercial Temp. Range, ±50 ppm
Stability, 53.5 MHz Frequency, Tube
b) DSC1124BI2- Low Jitter Precision HCSL Oscillator, 6-
Device:
DSC1104:
Low-Jitter Precision HCSL Oscillator with
Standby
246.8100T:
Lead 5x3.2 VDFN, Industrial Temp.
Range, ±25 ppm Stability, 246.81 MHz
Frequency, 1000/Reel
DSC1124:
Low-Jitter Precision HCSL Oscillator
c) DSC1104CL5- Low Jitter Precision HCSL Oscillator
156.2500:
with Standby, 6-Lead 3.2x2.5 VDFN,
Ext. Industrial Temp. Range, ±10 ppm
Standby, 156.25 MHz Frequency, Tube
Package:
A
B
C
D
N
=
=
=
=
=
6-Lead 7.0 mm x 5.0 mm CDFN
6-Lead 5.0 mm x 3.2 mm CDFN
6-Lead 3.2 mm x 2.5 mm CDFN
6-Lead 2.5 mm x 2.0 mm CDFN
6-Lead 7.0 mm x 5.0 mm CDFN w/o center
pad
d) DSC1124DE3- Low Jitter Precision HCSL Oscillator, 6-
094.5500T:
Lead 2.5x2.0 CDFN, Ext. commercial
Temp. Range, ±20 ppm Stability,
94.55 MHz Frequency, 1000/Reel
Temperature
Range:
E
I
L
=
=
=
–20C to +70C (Extended Commercial)
–40C to +85C (Industrial)
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
–40C to +105C (Extended Industrial)
Stability:
1
2
3
5
=
=
=
=
±50 ppm
±25 ppm
±20 ppm
±10 ppm
Frequency:
xxx.xxxx =2.3 MHz to 460 MHz (User Defined)
Packing Option:
<blank>= Tube
T
=
1000/Reel
2017 Microchip Technology Inc.
DS20005870A-page 25
DSC1104/24
NOTES:
DS20005870A-page 26
2017 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENAare trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
QUALITYꢀMANAGEMENTꢀꢀSYSTEMꢀ
CERTIFIEDꢀBYꢀDNVꢀ
© 2017, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-2440-6
== ISO/TSꢀ16949ꢀ==ꢀ
2017 Microchip Technology Inc.
DS20005870A-page 27
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DS20005870A-page 28
2017 Microchip Technology Inc.
10/25/17
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