DSC1122 [MICROCHIP]
Low-Jitter Precision LVPECL Oscillator;
| 型号： | DSC1122 |
| 厂家： | 
MICROCHIP |
| 描述： | Low-Jitter Precision LVPECL Oscillator |
| 文件： | 总28页 (文件大小：1231K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DSC1102/22
Low-Jitter Precision LVPECL Oscillator
Features
General Description
• Low RMS Phase Jitter: <1 ps (typ.)
The DSC1102 and DSC1122 series of high
performance oscillators utilizes a proven silicon MEMS
technology to provide excellent jitter and stability over
a wide range of supply voltages and temperatures. By
eliminating the need for quartz or SAW technology,
MEMS oscillators significantly enhance reliability and
accelerate product development, while meeting
stringent clock performance criteria for a variety of
communications, storage, and networking applications.
• High Stability: ±10 ppm, ±20 ppm, ±25 ppm,
±50 ppm
• Wide Temperature Range
- Ext. Industrial: –40°C to +105°C
- Industrial: –40°C to +85°C
- Ext. Commercial: –20°C to +70°C
• High Supply Noise Rejection: –50 dBc
• Wide Frequency Range: 2.3 MHz to 460 MHz
• Small Industry Standard Footprints:
DSC1102 has a standby feature allowing it to
completely power down when EN pin is pulled low;
whereas for DSC1122, only the outputs are disabled
when EN is low. Both oscillators are available in
industry standard packages, including the smallest
2.5 mm x 2.0 mm, and are drop-in replacements for
standard 6-pin LVPECL quartz crystal oscillators.
- 2.5 mm x 2.0 mm, 3.2 mm x 2.5 mm,
5.0 mm x 3.2 mm, and 7.0 mm x 5.0 mm
• Excellent Shock and Vibration Immunity
- Qualified to MIL-STD-883
• High Reliability
- 20x Better MTF than Quartz Oscillators
• Low Current Consumption
Block Diagram
• Supply Range of 2.25V to 3.63V
• Standby and Output Enable Function
• Lead Free and RoHS Compliant
• LVDS and HCSL Versions Available
Pin 1
Pin 6
VDD
TEMP SENSOR &
COMPENSATION
CIRCUITRY
ENABLE
Applications
• Storage Area Networks
Pin 2
NC
Pin 5
OUTPUT
MEMS
PLL
DIVIDER
DRIVER
OSCILLATOR
- SATA, SAS, Fibre Channel
• Passive Optical Networks
- EPON, 10G-EPON, GPON, 10G-GPON
• Ethernet
Pin 3
GND
Pin 4
OUTPUT
- 1G, 10GBASE-T/KR/LR/SR, and FCoE
• HD/SD/SDI Video and Surveillance
TABLE 1:
EN Pin
OUTPUT ENABLE MODES
DSC1102
DSC1122
High
NC
Outputs Active
Outputs Active
Standby
Outputs Active
Outputs Active
Outputs Disabled
Low
2019 Microchip Technology Inc.
DS20006254A-page 1
DSC1102/22
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage ..........................................................................................................................................–0.3V to +4.0V
Input Voltage .................................................................................................................................... –0.3V to VDD + 0.3V
ESD Protection (HBM) ...............................................................................................................................................4 kV
ESD Protection (MM) ............................................................................................................................................... 400V
ESD Protection (CDM) ............................................................................................................................................1.5 kV
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
Specifications: VDD = 3.3V; TA = +25°C unless otherwise specified.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Supply Voltage (Note 1)
VDD
2.25
—
3.63
V
—
DSC1102, EN pin low,
Output is disabled
—
—
—
0.095
22
Supply Current
IDD
mA
DSC1122, EN pin low,
Output is disabled
20
—
—
—
—
—
—
—
—
—
—
±10
±20
±25
±50
±5
Includes frequency variation
due to initial tolerance,
temp., and power supply
voltage.
Frequency Stability
Δf
ppm
Aging - First Year
ΔfY1
ppm One year at +25°C
Year two and beyond at
Aging - After First Year
Start-up Time (Note 2)
ΔfY2+
—
—
<±1
ppm/yr
+25°C
tSU
VIH
VIL
tDA
—
—
—
—
—
—
—
5
ms
T = +25°C
Input logic high
Input logic low
—
0.75 x VDD
—
Input Logic Levels
V
—
—
—
—
0.25 x VDD
Output Disable Time (Note 3)
Output Enable Time
5
5
ns
ms
ns
DSC1102
DSC1122
tEN
20
Enable Pull-Up Resistor
(Note 4)
RPU
—
40
—
kΩ
Pull-up resistor exists
LVPECL Outputs
Supply Current
IDD
VOH
VOL
—
—
56.5
—
58
mA
V
Output Enabled, RL = 50ꢀ
Output logic high, RL = 50ꢀ
Output logic low
VDD – 1.08
—
VDD – 1.55
—
Output Logic Levels
—
—
—
Peak-to-Peak Output Swing
800
mV
Single-Ended
Note 1: Pin 6 VDD should be filtered with a 0.1 μF capacitor.
2: tSU is time to 100 ppm stable output frequency after VDD is applied and outputs are enabled.
3: Output Waveform and Test Circuit figures below define the parameters.
4: Output is enabled if pad is floated or not connected.
DS20006254A-page 2
2019 Microchip Technology Inc.
DSC1102/22
ELECTRICAL CHARACTERISTICS (CONTINUED)
Specifications: VDD = 3.3V; TA = +25°C unless otherwise specified.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
tr
Rise time, 20% to 80%
Output Transition Time
(Note 3)
—
250
—
ps
Fall time, RL = 50ꢀ,
CL = 0 pF
tf
Frequency
f0
2.3
48
—
—
—
460
52
MHz
%
—
Output Duty Cycle
Period Jitter
SYM
JPER
Differential
—
2.5
—
psRMS
200 kHz to 20 MHz @
156.25 MHz
—
—
—
0.25
0.38
1.7
—
—
2
100 kHz to 20 MHz @
156.25 MHz
Integrated Phase Noise
JPH
psRMS
12 kHz to 20 MHz @
156.25 MHz
Note 1: Pin 6 VDD should be filtered with a 0.1 μF capacitor.
2: SU is time to 100 ppm stable output frequency after VDD is applied and outputs are enabled.
t
3: Output Waveform and Test Circuit figures below define the parameters.
4: Output is enabled if pad is floated or not connected.
2019 Microchip Technology Inc.
DS20006254A-page 3
DSC1102/22
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Temperature Ranges
Sym.
Min.
Typ.
Max.
Units
Conditions
–20
–40
–40
—
—
—
—
—
—
—
+70
+85
°C
°C
°C
°C
°C
°C
Ordering Option E
Ordering Option I
Ordering Option L
—
Operating Temperature Range
TA
+105
+150
+150
+260
Junction Temperature
TJ
TS
—
Storage Temperature Range
Soldering Temperature
–55
—
—
40 sec. max.
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature, and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability.
DS20006254A-page 4
2019 Microchip Technology Inc.
DSC1102/22
2.0
PIN DESCRIPTIONS
EN
NC
1
2
3
6
5
4
VDD
OUT
OUT
GND
FIGURE 2-1:
Pin Configuration, 6-Lead QFN
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin Number
PIN FUNCTION TABLE
Pin Name
Description
1
2
3
4
5
6
EN
NC
Enable or Standby.
Leave unconnected or connect to ground.
GND
OUT
OUT
VDD
Ground.
Output.
Complementary Output.
Supply Voltage.
2019 Microchip Technology Inc.
DS20006254A-page 5
DSC1102/22
3.0
NOMINAL PERFORMANCE PARAMETERS
Unless specified otherwise, T = +25°C, VDD = 3.3V.
FIGURE 3-1:
Ratio.
Power Supply Rejection
FIGURE 3-2:
Phase Noise).
Phase Jitter (Integrated
3.1
Output Waveform
tR
tF
Output
Output
80
%
350 mV
50%
20%
tEN
1/fo
tDA
VIH
Enable
VIL
FIGURE 3-3:
Output Waveform.
DS20006254A-page 6
2019 Microchip Technology Inc.
DSC1102/22
3.2
Typical Termination Scheme
VDD
VDD
R1
R2
R3
6
5
2
3
ꢀꢁ
4
R4
FIGURE 3-4:
Typical Termination Scheme.
The values for R1, R2, R3, and R4 in the termination scheme depend on what VDD is used. Table 3-1 lists the
recommended values for each resistor depending on VDD
.
TABLE 3-1:
RECOMMENDED RESISTOR VALUES
VDD
R1, R3
R2, R4
3.3V
2.5V
130ꢀ
249ꢀ
82ꢀ
62ꢀ
3.3
Test Circuit
FIGURE 3-5:
Test Circuit.
2019 Microchip Technology Inc.
DS20006254A-page 7
DSC1102/22
3.4
Recommended Board Layout
Via to GND layer
Supply bypass
capacitor
Via to GND layer
FIGURE 3-6:
Recommended Board Layout.
3.5
Solder Reflow Profile
MSL 1 @ 260°C refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp)
Preheat Time 150°C to 200°C
Time Maintained above 217°C
Peak Temperature
3°C/sec. max.
60-180 sec.
60-150 sec.
255°C to 260°C
20-40 sec.
Time within 5°C of Actual Peak
Ramp-Down Rate
6°C/sec. max.
8 minutes max.
Time 25°C to Peak Temperature
DS20006254A-page 8
2019 Microchip Technology Inc.
DSC1102/22
4.0
4.1
PACKAGE MARKING INFORMATION
Package Marking Information
Example
6-Lead CDFN/VDFN*
XXXXXXX
DCPYYWW
0SSS
0400000
DCP1941
0603
Legend: XX...X Product code or customer-specific information
Y
YY
WW
SSS
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC® designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
e
3
)
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
2019 Microchip Technology Inc.
DS20006254A-page 9
DSC1102/22
DS20006254A-page 10
2019 Microchip Technology Inc.
DSC1102/22
2019 Microchip Technology Inc.
DS20006254A-page 11
DSC1102/22
DS20006254A-page 12
2019 Microchip Technology Inc.
DSC1102/22
6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.05 C
2X
1
2
TOP VIEW
0.05 C
0.10 C
0.08 C
A1
C
A
SEATING
PLANE
6X
SIDE VIEW
2X b2
1
2
NOTE 1
L
N
4X b1
L1
e
0.07
0.05
C A B
C
BOTTOM VIEW
Microchip Technology Drawing C04-1007A Sheet 1 of 2
2019 Microchip Technology Inc.
DS20006254A-page 13
DSC1102/22
6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Pitch
Overall Height
Standoff
Overall Length
Overall Width
Terminal Width
Terminal Width
Terminal Length
Terminal Pullback
N
6
e
1.05 BSC
0.85
0.02
3.20 BSC
2.50 BSC
0.90
0.50
0.70
0.10 REF
A
A1
D
0.80
0.00
0.90
0.05
E
b1
b2
L
0.85
0.45
0.65
0.95
0.55
0.75
L1
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1007A Sheet 2 of 2
DS20006254A-page 14
2019 Microchip Technology Inc.
DSC1102/22
6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X2
G
6
C
Y
1
2
X1
SILK SCREEN
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
MILLIMETERS
MIN
0.25
NOM
1.05 BSC
1.60
MAX
Contact Pitch
E
C
X1
X2
Y
Contact Pad Spacing
Contact Pad Width (X4)
Contact Pad Width (X2)
Contact Pad Length (X6)
1.00
0.60
0.85
Space Between Contacts (X4)
G1
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3007A
2019 Microchip Technology Inc.
DS20006254A-page 15
DSC1102/22
DS20006254A-page 16
2019 Microchip Technology Inc.
DSC1102/22
6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN]
With 2.8x1.8 mm Exposed Pad
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.20 C
2X
1
2
0.20 C
TOP VIEW
A1
0.10 C
0.08 C
C
A
SEATING
PLANE
6X
SIDE VIEW
0.10
C A B
D2
2
1
0.10
C A B
NOTE 1
E2
6X L
(K)
6X b
N
0.10
0.05
C A B
C
e
BOTTOM VIEW
Microchip Technology Drawing C04-1010A Sheet 1 of 2
2019 Microchip Technology Inc.
DS20006254A-page 17
DSC1102/22
6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN]
With 2.8x1.8 mm Exposed Pad
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Pitch
Overall Height
N
6
2.54
0.85
0.02
7.00 BSC
2.80
5.00 BSC
1.80
1.40
1.10
e
A
A1
D
D2
E
E2
b
L
0.80
0.00
0.90
0.05
Standoff
Overall Length
Exposed Pad Length
Overall Width
Exposed Pad Width
Terminal Width
Terminal Length
2.70
2.90
1.70
1.35
1.00
1.90
1.45
1.20
Terminal-to-Exposed-Pad
K
0.20 REF
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1010A Sheet 2 of 2
DS20006254A-page 18
2019 Microchip Technology Inc.
DSC1102/22
6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN]
With 2.8x1.8 mm Exposed Pad
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X2
EV
6
ØV
C
Y2
EV
G
Y1
1
2
X1
E
SILK SCREEN
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
MILLIMETERS
NOM
2.54 BSC
MIN
MAX
Contact Pitch
Optional Center Pad Width
Optional Center Pad Length
Contact Pad Spacing
X2
Y2
C
2.90
1.90
3.70
Contact Pad Width (X6)
Contact Pad Length (X6)
Contact Pad to Center Pad (X2)
Thermal Via Diameter (X6)
Thermal Via Pitch
X1
Y1
G
V
EV
1.50
1.35
0.20
0.33
1.20
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-3010A
2019 Microchip Technology Inc.
DS20006254A-page 19
DSC1102/22
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2019 Microchip Technology Inc.
DS20006254A-page 21
DSC1102/22
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DS20006254A-page 22
2019 Microchip Technology Inc.
DSC1102/22
APPENDIX A: REVISION HISTORY
Revision A (October 2019)
• Initial creation of document DSC1102/22 to Micro-
chip data sheet template DS20006254A.
• •Minor text changes throughout.
2019 Microchip Technology Inc.
DS20006254A-page 23
DSC1102/22
NOTES:
DS20006254A-page 24
2019 Microchip Technology Inc.
DSC1102/22
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
X
PART NO.
X
X
-XXX.XXXX
X
a) DSC1102AE1-053.5000:
DSC1102,
Device Package
6-Lead 7x5 VDFN,
Ext. Commercial
Temp. Range, ±50 ppm
Stability, 53.5 MHz
Frequency, Tube
Temperature Stability
Range
Frequency
Packaging
Option
Device:
DSC1102:
DSC1122:
Low-Jitter Precision LVPECL Oscillator with
Standby Pin
Low-Jitter Precision LVPECL Oscillator with
Output Enable
b) DSC1122BI2-246.8100T: DSC1122,
6-Lead 5x3.2 CDFN,
Industrial Temp. Range,
±25 ppm Stability,
246.81 MHz Frequency,
1000/Reel
Package:
A
B
C
D
N
=
=
=
=
=
6-Lead 7.0 mm x 5.0 mm VDFN
6-Lead 5.0 mm x 3.2 mm CDFN
6-Lead 3.2 mm x 2.5 mm VDFN
6-Lead 2.5 mm x 2.0 mm VDFN
6-Lead 7.0 mm x 5.0 mm VDFN w/o center
pad
c) DSC1102CL5-156.2500:
DSC1102,
6-Lead 3.2x2.5 VDFN,
Ext. Industrial
Temp. Range, ±10 ppm
Stability, 156.25 MHz
Frequency, Tube
Temperature
Range:
E
I
L
=
=
=
–20C to +70C (Extended Commercial)
–40C to +85C (Industrial)
–40C to +105C (Extended Industrial)
d) DSC1122DE3-094.5500T: DSC1122,
6-Lead 2.5x2.0 VDFN,
Stability:
1
2
3
5
=
=
=
=
±50 ppm
±25 ppm
±20 ppm
±10 ppm
Industrial Temp. Range,
±20 ppm Stability,
94.55 MHz Frequency,
1000/Reel
Frequency:
xxx.xxxx =2.3 MHz to 460 MHz (User Defined)
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
Packing Option:
<blank>= Tube
T
=
1000/Reel
Note:
Please visit the Microchip ClockWorks® Configurator to configure
the part number for customized frequency.
http://clockworks.microchip.com/timing
2019 Microchip Technology Inc.
DS20006254A-page 25
DSC1102/22
NOTES:
DS20006254A-page 26
2019 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT,
chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex,
flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck,
LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi,
Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer,
PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire,
Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST,
SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,
TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA
are registered trademarks of Microchip Technology Incorporated in
the U.S.A. and other countries.
APT, ClockWorks, The Embedded Control Solutions Company,
EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load,
IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision
Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire,
SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, Vite, WinPath, and ZL are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, and Symmcom are registered trademarks of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2019, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-5100-6
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2019 Microchip Technology Inc.
DS20006254A-page 27
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Australia - Sydney
Tel: 61-2-9868-6733
India - Bangalore
Tel: 91-80-3090-4444
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Beijing
Tel: 86-10-8569-7000
India - New Delhi
Tel: 91-11-4160-8631
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
China - Chengdu
Tel: 86-28-8665-5511
India - Pune
Tel: 91-20-4121-0141
Finland - Espoo
Tel: 358-9-4520-820
China - Chongqing
Tel: 86-23-8980-9588
Japan - Osaka
Tel: 81-6-6152-7160
Web Address:
www.microchip.com
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
China - Dongguan
Tel: 86-769-8702-9880
Japan - Tokyo
Tel: 81-3-6880- 3770
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Guangzhou
Tel: 86-20-8755-8029
Korea - Daegu
Tel: 82-53-744-4301
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Tel: 49-8931-9700
China - Hangzhou
Tel: 86-571-8792-8115
Korea - Seoul
Tel: 82-2-554-7200
Germany - Haan
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Austin, TX
Tel: 512-257-3370
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Tel: 852-2943-5100
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Boston
Westborough, MA
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China - Nanjing
Tel: 86-25-8473-2460
Malaysia - Penang
Tel: 60-4-227-8870
Germany - Karlsruhe
Tel: 49-721-625370
China - Qingdao
Philippines - Manila
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Tel: 86-532-8502-7355
Tel: 63-2-634-9065
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
China - Shanghai
Tel: 86-21-3326-8000
Singapore
Tel: 65-6334-8870
Germany - Rosenheim
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China - Shenyang
Tel: 86-24-2334-2829
Taiwan - Hsin Chu
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Dallas
Addison, TX
Tel: 972-818-7423
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Israel - Ra’anana
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China - Shenzhen
Tel: 86-755-8864-2200
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Tel: 886-7-213-7830
Italy - Milan
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Fax: 39-0331-466781
China - Suzhou
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Taiwan - Taipei
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Detroit
Novi, MI
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China - Wuhan
Tel: 86-27-5980-5300
Thailand - Bangkok
Tel: 66-2-694-1351
Italy - Padova
Tel: 39-049-7625286
Houston, TX
Tel: 281-894-5983
China - Xian
Tel: 86-29-8833-7252
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
China - Xiamen
Tel: 86-592-2388138
Norway - Trondheim
Tel: 47-7288-4388
China - Zhuhai
Tel: 86-756-3210040
Poland - Warsaw
Tel: 48-22-3325737
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Raleigh, NC
Tel: 919-844-7510
Sweden - Gothenberg
Tel: 46-31-704-60-40
New York, NY
Tel: 631-435-6000
Sweden - Stockholm
Tel: 46-8-5090-4654
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
DS20006254A-page 28
2019 Microchip Technology Inc.
05/14/19
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