C3216Y5V1A226Z [MICROCHIP]

Breakout Module; 接模块


型号：	C3216Y5V1A226Z
厂家：	MICROCHIP
描述：	Breakout Module 接模块
文件：	总26页 (文件大小：387K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MCP2210

Breakout Module

User’s Guide

DS52056A

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,

KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,

PIC logo, rfPIC and UNI/O are registered trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,

MXDEV, MXLAB, SEEVAL and The Embedded Control

Solutions Company are registered trademarks of Microchip

Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, chipKIT,

chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,

dsPICworks, dsSPEAK, ECAN, ECONOMONITOR,

FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP,

Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB,

MPLINK, mTouch, Omniscient Code Generation, PICC,

PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE,

rfLAB, Select Mode, Total Endurance, TSHARC,

UniWinDriver, WiperLock and ZENA are trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

ISBN: 978-1-62076-117-5

QUALITY MANAGEMENT SYSTEM

CERTIFIED BY DNV

Microchip received ISO/TS-16949:2009 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC^®MCUs and dsPIC^®DSCs, KEELOQ^®code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

== ISO/TS 16949 ==

DS52056A-page 2

MCP2210 BREAKOUT MODULE

USER’S GUIDE

Table of Contents

Preface ........................................................................................................................... 5

Introduction............................................................................................................ 5

Document Layout .................................................................................................. 5

Conventions Used in this Guide............................................................................ 6

Recommended Reading........................................................................................ 7

The Microchip Web Site ........................................................................................ 7

Customer Support ................................................................................................. 7

Document Revision History................................................................................... 7

Chapter 1. Product Overview

1.1 Introduction ..................................................................................................... 9

1.2 MCP2210 Breakout Module General Description .......................................... 9

1.3 What the MCP2210 Breakout Module Kit Includes ........................................ 9

Chapter 2. Installation and Operation

2.1 Introduction ................................................................................................... 11

2.2 Board Setup ................................................................................................. 11

2.3 Board Operation ........................................................................................... 12

2.4 MCP2210 Typical Usage Scenarios ............................................................. 14

Appendix A. Schematic and Layouts

A.1 Introduction .................................................................................................. 17

A.2 Board – Schematic ....................................................................................... 18

A.3 Board – Top Silk and Pads .......................................................................... 19

A.4 Board – Top Silk, Pads and Copper ............................................................ 20

A.5 Board – Top Pads and Copper .................................................................... 21

A.6 Board – Bottom Silk and Pads ..................................................................... 22

A.7 Board – Bottom Silk, Pads and Copper ....................................................... 23

A.8 Board – Bottom Pads and Copper ............................................................... 24

Appendix B. Bill of Materials

Worldwide Sales and Service .................................................................................... 26

DS52056A-page 3

MCP2210 Breakout Module User’s Guide

DS52056A-page 4

MCP2210 BREAKOUT MODULE

USER’S GUIDE

Preface

NOTICE TO CUSTOMERS

All documentation becomes dated, and this manual is no exception. Microchip tools and

documentation are constantly evolving to meet customer needs, so some actual dialogs

and/or tool descriptions may differ from those in this document. Please refer to our web site

(www.microchip.com) to obtain the latest documentation available.

Documents are identified with a “DS” number. This number is located on the bottom of each

page, in front of the page number. The numbering convention for the DS number is

“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the

document.

For the most up-to-date information on development tools, see the MPLAB^®IDE online help.

Select the Help menu, and then Topics to open a list of available online help files.

INTRODUCTION

This chapter contains general information that will be useful to know before using the

MCP2210 Breakout Module. Items discussed in this chapter include:

• Document Layout

• Conventions Used in this Guide

• Recommended Reading

• The Microchip Web Site

• Customer Support

• Document Revision History

DOCUMENT LAYOUT

This document describes how to use the MCP2210 Breakout Module board. The

manual layout is as follows:

• Chapter 1. “Product Overview” – Important information about the MCP2210

Breakout Module

• Chapter 2. “Installation and Operation” – Covers the initial set-up of this board,

required tools, board setup and Graphical User Interface (GUI)

• Appendix A. “Schematic and Layouts” – Shows the schematic and board

layouts for the MCP2210 Breakout Module User’s Guide

• Appendix B. “Bill of Materials” – Lists the parts used to populate the MCP2210

Breakout Module

DS52056A-page 5

MCP2210 Breakout Module User’s Guide

CONVENTIONS USED IN THIS GUIDE

This manual uses the following documentation conventions:

DOCUMENTATION CONVENTIONS

Description

Arial font:

Represents

Examples

Italic characters

Referenced books

Emphasized text

A window

MPLAB^®IDE User’s Guide

...is the only compiler...

the Output window

Initial caps

A dialog

the Settings dialog

A menu selection

select Enable Programmer

“Save project before build”

Quotes

A field name in a window or

dialog

Underlined, italic text with

right angle bracket

A menu path

File>Save

Bold characters

A dialog button

A tab

Click OK

Click the Power tab

4‘b0010, 2‘hF1

N‘Rnnnn

A number in verilog format,

where N is the total number of

digits, R is the radix and n is a

digit.

Text in angle brackets < >

Courier New font:

A key on the keyboard

Press <Enter>, <F1>

Plain Courier New

Sample source code

Filenames

#define START

autoexec.bat

c:\mcc18\h

File paths

Keywords

_asm, _endasm, static

-Opa+, -Opa-

0, 1

Command-line options

Bit values

Constants

0xFF, ‘A’

Italic Courier New

Square brackets [ ]

A variable argument

file.o, where file can be

any valid filename

Optional arguments

mcc18 [options] file

[options]

Curly brackets and pipe

character: { | }

Choice of mutually exclusive errorlevel {0|1}

arguments; an OR selection

Ellipses...

Replaces repeated text

var_name [,

var_name...]

Represents code supplied by void main (void)

user

{ ...

}

DS52056A-page 6

Preface

RECOMMENDED READING

This user's guide describes how to use MCP2210 Breakout Module. Other useful

documents are listed below. The following Microchip document is available and

recommended as a supplemental reference resource.

• MCP2210 Data Sheet - “USB-to-SPI Protocol Converter with GPIO (Master

Mode)” (DS22288)

THE MICROCHIP WEB SITE

Microchip provides online support via our web site at www.microchip.com. This web

site is used as a means to make files and information easily available to customers.

Accessible by using your favorite Internet browser, the web site contains the following

information:

• Product Support – Data sheets and errata, application notes and sample

programs, design resources, user’s guides and hardware support documents,

latest software releases and archived software

• General Technical Support – Frequently Asked Questions (FAQs), technical

support requests, online discussion groups, Microchip consultant program

member listing

• Business of Microchip – Product selector and ordering guides, latest Microchip

press releases, listing of seminars and events, listings of Microchip sales offices,

distributors and factory representatives

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

Customers should contact their distributor, representative or field application engineer

(FAE) for support. Local sales offices are also available to help customers. A listing of

sales offices and locations is included in the back of this document.

Technicalsupportisavailablethroughthewebsiteat:http://www.microchip.com/support.

DOCUMENT REVISION HISTORY

Revision A (March 2012)

• Initial Release of this Document.

DS52056A-page 7

MCP2210 Breakout Module User’s Guide

NOTES:

DS52056A-page 8

MCP2210 BREAKOUT MODULE

USER’S GUIDE

Chapter 1. Product Overview

1.1

1.2

INTRODUCTION

This chapter provides an overview of the MCP2210 Breakout Module and covers the

following topics:

• MCP2210 Breakout Module General Description

• What the MCP2210 Breakout Module Kit Includes

MCP2210 BREAKOUT MODULE GENERAL DESCRIPTION

The MCP2210 Breakout Module is a development and evaluation platform for the

MCP2210 device. The module is comprised of a single DIP form-factor board.

The MCP2210 Breakout Module has the following features:

• SPI bus signals (MOSI, MISO, SCK)

• Nine GP lines, configurable for GPIO, Chip Select or dedicated function operation

• Provides a user selectable (by using a jumper) power supply of 3.3V or 5V (up to

500 mA)

• DIP form-factor (0.6 inches overall row spacing between pins)

• PICkit™ Serial Analyzer header – used for SPI communication only

A Windows^®-based PC software was created to help with the evaluation/demonstration

of the MCP2210 device as a USB-to-SPI (Master) device. It allows I/O control and

custom device configuration. The software is downloadable from the board web page

on www.microchip.com.

A DLL package is included to allow development of custom PC applications using the

MCP2210. The DLL package is also available for download on the board web page.

1.3

WHAT THE MCP2210 BREAKOUT MODULE KIT INCLUDES

The MCP2210 Breakout Module Kit includes:

• MCP2210 Breakout Module (ADM00419)

• Mini-USB cable

• Important Information Sheet

DS52056A-page 9

MCP2210 Breakout Module User’s Guide

NOTES:

DS52056A-page 10

MCP2210 BREAKOUT MODULE

USER’S GUIDE

Chapter 2. Installation and Operation

2.1

INTRODUCTION

The MCP2210 Breakout Module is designed to demonstrate the device as a

USB-to-SPI (Master) bridge solution.

The package is comprised of a single board and has the following features:

• Small plug-in board with DIP form factor (600 millimeters overall row spacing

between pins)

• Mini-USB connector

• Access to SPI bus and all GP signals through USB port

• PICkit™ Serial Analyzer compatible header

• 3.3 or 5V jumper selectable V_DD; the breakout board can be used to supply up to

500 mA to the rest of the system. The board already provides a signal trace

between the V_DDand the 3.3V rail. For systems requiring 5V V_DDpower supply,

_DDheader must be mounted on the board. A jumper will close the middle pin and

the 5V pin.

2.2

BOARD SETUP

Follow these steps to set up the MCP2210 Breakout Module:

1. Download the support material (PC applications and DLL libraries) that can be

found on the board’s page, on the Microchip web site.

2. Attach the MCP2210 Breakout Module to a board that has one or more SPI slave

devices attached to a bus (SPI).

3. Plug the MCP2210 Breakout Module in to a PC.

4. The computer operating system will automatically install the driver for this board.

When the installation is complete, the board is ready for operation.

5. Install the downloaded PC software.

6. Start the SPI Terminal utility.

DS52056A-page 11

MCP2210 Breakout Module User’s Guide

2.3

BOARD OPERATION

The MCP2210 will be detected by a Windows PC host as an HID device. The

accompanying software can be used to exercise the MCP2210 Breakout Module’s

features and also provides a reference point for users that want to design their own

applications based on the MCP2210 device.

2.3.1

MCP2210 Breakout Board Operation

The MCP2210 Breakout Module can be used as a stand-alone USB-to-SPI (Master)

bridge module. The breakout board provides all the signals required to assist the user

in building their boards with the MCP2210.

The board has the following features:

• SPI bus signals (MOSI, MISO, SCK)

• Nine GP signals that can be configured for:

- GPIO functionality (digital input or output pins)

- Chip Select functionality (working with the SPI bus signals)

- Dedicated function pins

• Jumper selectable power supply: 3.3 or 5V (up to 500 mA)

• PICkit™ Serial Analyzer header using GP4 pin as Chip Select signal

Note: This function is available only on SPI operations, it does not work on I²C or

UART signals.

• DIP form-factor (0.6 inches overall row spacing between pins)

By using the provided software and libraries, the user can create personalized PC

applications, using the breakout board as a USB-to-SPI (Master) bridge adapter.

2.3.2

MCP2210 Utility

The MCP2210 Utility software was created for custom device setting requirements. A

few of the settings that this utility can alter include VID, PID, power requirements, and

string descriptors. A download link for this software can be found on the board web

page. For instructions on the use of this software, refer to the software’s supporting

documentation included within the application install package.

2.3.3

SPI Terminal Utility

The SPI Terminal Utility is a tool that allows low-level data exchange at the SPI bus

level. This application is useful for low-level communication and troubleshooting

between the MCP2210 and various SPI slave modules.

The utility window has different sections for GP designation, SPI transfer parameters

and user data areas.

DS52056A-page 12

Installation and Operation

FIGURE 2-1:

SPI TERMINAL UTILITY WINDOW

SPI user data

section

GP Settings Section

HEX/Decimal

user data

mode

SPI Transfer

Parameters

Section

Transfer Data button

GP Direct

Settings section

Status messages

After the application is started, the state of the connection with the MCP2210 is shown

in the Status Messages section (lower left corner of the screen).

The user can establish the GP configuration. The GPs can be used as chip select pins.

Each GP Active and Idle value can be established by selecting the appropriate check

boxes, or by directly supplying the correct value in the GP Direct Settings section. The

same behavior applies to the GP designation (the GP designation can be established

by clicking the appropriate radio button, or by directly supplying the GP designation

value in the GP Settings Direct Values section).

The SPI settings pertaining to the needed SPI transfer can be established in the SPI

Parameters section.

The data to be sent goes in the Tx Data field. To send the data to the SPI slave device,

click the SPI Transfer Data button on the lower-right side of the screen. The data

received from the SPI slave device is displayed in the Rx Data field.

The user data can be supplied in either HEX or Decimal mode. This can be accom-

plished by selecting the HEX mode check box. The data in the Tx and Rx Data fields

will be displayed in HEX or Decimal.

DS52056A-page 13

MCP2210 Breakout Module User’s Guide

A wider range of tests is available when using this board and the utility software with

the MCP2210 Evaluation Kit (ADM00421). This kit allows communication with several

SPI slave devices (I/O expander, EEPROM, ADC and temperature sensor). For more

details on examples using the SPI Terminal Utility software, see MCP2210 Evaluation

Kit User’s Guide (DS52057).

2.4

MCP2210 TYPICAL USAGE SCENARIOS

MCP2210 can be used in systems where an SPI bus is available. The MCP2210 can

be either the single master on the bus, or one of the masters sharing the bus, if a proper

master access arbitration scheme is in place.

A typical usage scenario is shown in Figure 2-2, where MCP2210 is the only master on

the SPI bus. This links the SPI slave chips in the system, while a few GPs (configured

for Chip Select function) can be used as Chip Select lines.

If SPI slave interrupt monitoring is required, the GP6 needs to be configured for its

dedicated function, in order to monitor the interrupts coming from the SPI slave chips.

The PC application will take care of all the details necessary for data transfer between

the MCP2210 and the SPI slave chips.

FIGURE 2-2:

MCP2210 TYPICAL USAGE DIAGRAM

MCP2210

SPI bus

MOSI, MISO, SCK

USB-to-SPI

bridge

USB

Chip Select lines

External

Interrupt

(GP6)

CS0-CS8

SPI slave chip #1

SPI slave chip #n

...

Interrupt

When a system requires more than one SPI master that share the same bus, an

arbitration scheme needs to be developed, in order to prevent the multiple SPI masters

from accessing the bus at the same time.

MCP2210 has support for an arbitration mechanism which uses GP7 and GP8

(configured for dedicated pin functionality) for this purpose.

DS52056A-page 14

Installation and Operation

When GP8 is configured for its dedicated functionality, the pin can be used as a bus

release request for MCP2210 coming from another master. GP7 (configured for its

dedicated functionality) is used as an SPI bus release acknowledge signal towards the

requesting master. When an external SPI master requests the MCP2210 to release the

bus, the device completes the current SPI transfer (or it can be cancelled by the PC

application sending the proper USB command), then releases the bus and signals the

event on the acknowledge pin (GP7). The second master now has ownership of the

bus, and can keep it, as long as the SPI bus request pin (GP8) is kept asserted.

By using the dedicated functionality of the GP7 and GP8, the MCP2210 can be used

in a multiple SPI master system.

FIGURE 2-3:

MCP2210 TYPICAL USAGE DIAGRAM

SPI Bus Release Request

MCP2210

GP8

GP7

SPI Bus Release

Acknowledge

SPI Master #2

USB

SPI bus

MOSI, MISO, SCK

USB-to-SPI

bridge

External

Interrupt

(GP6)

External

Interrupt

Chip-Select lines

SPI slave chip #1

SPI slave chip #n

Interrupt

...

Interrupt

DS52056A-page 15

MCP2210 Breakout Module User’s Guide

DS52056A-page 16

MCP2210 BREAKOUT MODULE

USER’S GUIDE

Appendix A. Schematic and Layouts

A.1 INTRODUCTION

This appendix contains the following schematics and layouts for the MCP2210

Breakout Module:

• Board – Schematic

• Board – Top Silk and Pads

• Board – Top Silk, Pads and Copper

• Board – Top Pads and Copper

• Board – Bottom Silk and Pads

• Board – Bottom Silk, Pads and Copper

• Board – Bottom Pads and Copper

DS52056A-page 17

MCP2210 Breakout Module User’s Guide

A.2 BOARD – SCHEMATIC

3 2 1

M O S

S C K

O S M I

G P

N G N D

6 5 4 3 2 1

DS52056A-page 18

Schematic and Layouts

A.3 BOARD – TOP SILK AND PADS

DS52056A-page 19

MCP2210 Breakout Module User’s Guide

A.4 BOARD – TOP SILK, PADS AND COPPER

DS52056A-page 20

Schematic and Layouts

A.5 BOARD – TOP PADS AND COPPER

DS52056A-page 21

MCP2210 Breakout Module User’s Guide

A.6 BOARD – BOTTOM SILK AND PADS

DS52056A-page 22

Schematic and Layouts

A.7 BOARD – BOTTOM SILK, PADS AND COPPER

DS52056A-page 23

MCP2210 Breakout Module User’s Guide

A.8 BOARD – BOTTOM PADS AND COPPER

DS52056A-page 24

MCP2210 BREAKOUT MODULE

USER’S GUIDE

Appendix B. Bill of Materials

TABLE B-1:

BILL OF MATERIALS

Qty Designator

Description_

Manufacturer 1

Part Number

Cap. Cerm. 22 uF 10V 20% Y5V 1206

TDK^®Corporation

AVX Corporation

TDK Corporation

Tyco^®Electronics

C3216Y5V1A226Z

0603YC104KAT2A

C1608X5R0J475K

C1608X7R1C105K

HDR M 1x7 Vertical

C2, C4, C5 Cap. Cerm .1 uF 10% 16V X7R 0603

Cap. Cerm. 4.7 uF 6.3V 10% X5R 0603

Cap. Cerm. 1 uF 16V 10% X7R 0603

J1, J2

DO NOT POPULATE

Conn. Hdr. Male .100 1x7 Pos. Vertical

DO NOT POPULATE

Conn. Hdr. Male .100 1x6 Pos. Vertical

Tyco Electronics

HDR M 1x6 Vertical

HDR M 1x3 Vertical

DO NOT POPULATE

Conn. Hdr. Male .100 1x3 Pos. Vertical

Conn. Rcpt. USB Mini B R/A SMD

Res. 390 Ohm 1/10W 5% 0603 SMD

IC USB-TO-SPI SSOP-20

Hirose Electric Co. Ltd.

Panasonic^®- ECG

UX60SC-MB-5ST(80)

ERJ-3GEYJ391V

MCP2210-I/SS

Microchip Technology

Inc.

IC LDO Reg. 500 mA 3.3V SOT-223-3

Cer. Resonator 12.0 MHz SMD

Microchip Technology

Inc.

Murata Electronics^®

MCP1825S-3302E/DB

CSTCE12M0G55-R0

Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM

used in manufacturing uses all RoHS-compliant components.

DS52056A-page 25

Worldwide Sales and Service

AMERICAS

ASIA/PACIFIC

EUROPE

Corporate Office

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://www.microchip.com/

support

Asia Pacific Office

Suites 3707-14, 37th Floor

Tower 6, The Gateway

Harbour City, Kowloon

Hong Kong

Tel: 852-2401-1200

Fax: 852-2401-3431

India - Bangalore

Tel: 91-80-3090-4444

Fax: 91-80-3090-4123

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

India - New Delhi

Tel: 91-11-4160-8631

Fax: 91-11-4160-8632

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

India - Pune

Tel: 91-20-2566-1512

Fax: 91-20-2566-1513

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

Web Address:

www.microchip.com

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Japan - Osaka

Tel: 81-66-152-7160

Fax: 81-66-152-9310

Atlanta

Duluth, GA

Tel: 678-957-9614

Fax: 678-957-1455

China - Beijing

Tel: 86-10-8569-7000

Fax: 86-10-8528-2104

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Japan - Yokohama

Tel: 81-45-471- 6166

Fax: 81-45-471-6122

China - Chengdu

Tel: 86-28-8665-5511

Fax: 86-28-8665-7889

Boston

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Korea - Daegu

Tel: 82-53-744-4301

Fax: 82-53-744-4302

China - Chongqing

Tel: 86-23-8980-9588

Fax: 86-23-8980-9500

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

Korea - Seoul

China - Hangzhou

Tel: 86-571-2819-3187

Fax: 86-571-2819-3189

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

UK - Wokingham

Tel: 44-118-921-5869

Fax: 44-118-921-5820

Cleveland

Independence, OH

Tel: 216-447-0464

Fax: 216-447-0643

China - Hong Kong SAR

Tel: 852-2401-1200

Fax: 852-2401-3431

Malaysia - Kuala Lumpur

Tel: 60-3-6201-9857

Fax: 60-3-6201-9859

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

China - Nanjing

Tel: 86-25-8473-2460

Fax: 86-25-8473-2470

Malaysia - Penang

Tel: 60-4-227-8870

Fax: 60-4-227-4068

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Detroit

Farmington Hills, MI

Tel: 248-538-2250

Fax: 248-538-2260

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Indianapolis

Noblesville, IN

Tel: 317-773-8323

Fax: 317-773-5453

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

Taiwan - Hsin Chu

Tel: 886-3-5778-366

Fax: 886-3-5770-955

Los Angeles

China - Shenzhen

Tel: 86-755-8203-2660

Fax: 86-755-8203-1760

Taiwan - Kaohsiung

Tel: 886-7-536-4818

Fax: 886-7-330-9305

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

Taiwan - Taipei

Tel: 886-2-2500-6610

Fax: 886-2-2508-0102

Santa Clara

Santa Clara, CA

Tel: 408-961-6444

Fax: 408-961-6445

China - Xian

Tel: 86-29-8833-7252

Fax: 86-29-8833-7256

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

Toronto

Mississauga, Ontario,

Canada

China - Xiamen

Tel: 905-673-0699

Fax: 905-673-6509

Tel: 86-592-2388138

Fax: 86-592-2388130

China - Zhuhai

Tel: 86-756-3210040

Fax: 86-756-3210049

11/29/11

DS52056A-page 26

C3216Y5V1A226Z [MICROCHIP]

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