ATA663231-FAQW [MICROCHIP]
Interface Circuit, PDSO8;
| 型号： | ATA663231-FAQW |
| 厂家： | 
MICROCHIP |
| 描述： | Interface Circuit, PDSO8 光电二极管 |
| 文件： | 总26页 (文件大小：1207K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ATA663203/ATA663231/ATA663254
LIN Bus Device Family including Voltage Regulator and
LIN SBC(1) with Compatible Footprint
DATASHEET
Features
● Supply voltage up to 40V
● Operating voltage VS = 5V to 28V
● Supply current
● Sleep mode: typically 9µA
● Silent mode: typically 47µA
● Very low current consumption at low supply voltages (2V < VS < 5.5V):
typically 130µA
● Linear low-drop voltage regulator, 85mA current capability:
● MLC (multi-layer ceramic) capacitor with 0Ω ESR
● Normal, fail-safe, and silent mode
● Atmel ATA663254: VCC = 5.0V ±2%
● Atmel ATA663231: VCC = 3.3V ±2%
● Sleep mode: VCC is switched off
● Active mode
● Atmel ATA663203: VCC = 5.0V ±2%
● VCC undervoltage detection with open drain reset output (NRES, 4ms reset time)
● Voltage regulator is short-circuit and over-temperature protected
● LIN physical layer according to LIN 2.0, 2.1, 2.2, 2.2A and SAEJ2602-2
● Wake-up capability via LIN bus (100µs dominant)
● Wake-up source recognition
● TXD time-out timer
● Bus pin is over-temperature and short-circuit protected versus GND and battery
● Advanced EMC and ESD performance
● Fulfills the OEM “Hardware Requirements for LIN in Automotive Applications
Rev.1.3”
● Interference and damage protection according to ISO7637
● Qualified according to AEC-Q100
● Package: DFN8 with wettable flanks (Moisture Sensitivity Level 1)
Note:
1. LIN SBC: LIN system basis chip including LIN transceiver and voltage
regulator.
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1.
Description
The Atmel® ATA6632xx device family includes two basic products; a LIN system basis chip (SBC) and a low-drop voltage
regulator with compatible footprints.
The Atmel ATA663231/54 (system basis chip) is a fully integrated LIN transceiver, designed according to the LIN
specification 2.0, 2.1, 2.2, 2.2A and SAEJ2602-2, with a low-drop voltage regulator (3.3V/5V/85mA). The combination of
voltage regulator and bus transceiver makes it possible to develop simple but powerful slave nodes in LIN bus systems.
Atmel ATA663231/54 is designed to handle the low-speed data communication in vehicles (for example, in convenience
electronics). Improved slope control at the LIN driver ensures secure data communication up to 20Kbaud. The bus output is
designed to withstand high voltage. Sleep mode and silent mode guarantee minimized current consumption even in the case
of a floating or a short-circuited LIN bus.
The Atmel ATA663203 (voltage regulator) is a fully integrated low-drop voltage regulator, with 5V output voltage and 85mA
current capability. It is especially designed for the automotive environment. A key feature is that the current consumption is
always below 170µA (without load), even if the supply voltage is below the regulator’s nominal output voltage.
Table 1-1. ATA6632xx Device Family
Description
Atmel ATA6632xx
LIN-SBC with 3.3V regulator
LIN-SBC with 5V regulator
Voltage regulator 5V
31
54
03
Figure 1-1. Block Diagram LIN Transceiver with Integrated Voltage Regulator (SBC)
7
6
VS
Atmel ATA663231/54
VCC
Normal and
Receiver
Fail-safe
Mode
-
RXD
1
+
LIN
RF-filter
VCC
Wake-up bus timer
Slew rate control
Short-circuit and
overtemperature
protection
TXD
TXD
Time-out
timer
4
8
3
VCC
Voltage regulator
Sleep
EN
2
5
NRES
VCC
mode
Control
unit
Normal/Silent/
Fail-safe Mode
3.3V/5V
VCC
switched
off
GND
Undervoltage reset
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Figure 1-2. Block Diagram Voltage Regulator
VS
7
PMOS
Voltage
Reference
+
-
8
3
VCC
NRES
Undervoltage
Reset
Atmel ATA663203
5
GND
ATA663203/ATA663231/ATA663254 [DATASHEET]
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2.
Pin Configuration
Figure 2-1. Pinning DFN8
ATA663231
ATA663254
RXD
EN
NRES
TXD
VCC
VS
LIN
NC
NC
NRES
NC
ATA663203
VCC
VS
NC
DFN8
3 x 3
DFN8
3 x 3
GND
GND
SBC
Voltage regulator
Table 2-1. Pin Description
Pin
Symbol
RXD
EN
Function
1
Receive data output
Enables normal mode if the input is high
2
3
NRES
TXD
GND
LIN
VCC undervoltage output, open drain, low at reset
Transmit data input
4
5
Ground, heat slug
6
LIN bus line input/output
7
8
VS
Supply voltage
VCC
Output voltage regulator 3.3V/5V/85mA
Heat slug, internally connected to the GND pin
Backside
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3.
Pin Description
3.1
Supply Pin (VS)
LIN operating voltage is VS = 5V to 28V. Undervoltage detection is implemented to disable transmission if VS falls below typ.
4.5V, thereby avoiding false bus messages. After switching on VS, the IC starts in fail-safe mode and the voltage regulator is
switched on.
The supply current in sleep mode is typically 9µA and 47µA in silent mode.
3.2
3.3
Ground Pin (GND)
The IC does not affect the LIN bus in the event of GND disconnection. It is able to handle a ground shift of up to 11.5% of VS.
Voltage Regulator Output Pin (VCC)
The internal 3.3V/5V voltage regulator is capable of driving loads up to 85mA, supplying the microcontroller and other ICs on
the PCB and is protected against overload by means of current limitation and overtemperature shutdown. Furthermore, the
output voltage is monitored and causes a reset signal at the NRES output pin if it drops below a defined threshold
VVCC_th_uv_down
.
3.4
3.5
Undervoltage Reset Output (NRES)
If the VCC voltage falls below the undervoltage detection threshold VCC_th_uv_down, NRES switches to low after tres_f. The
NRES stays low even if VCC = 0V because NRES is internally driven from the VS voltage. If VS voltage ramps down, NRES
stays low until VS < 1.5V and then becomes highly impedant.
The implemented undervoltage delay keeps NRES low for tReset = 4ms after VCC reaches its nominal value.
Bus Pin (LIN) (SBC only)
A low-side driver with internal current limitation and thermal shutdown as well as an internal pull-up resistor according to LIN
specification 2.x is implemented. The voltage range is from –27V to +40V. This pin exhibits no reverse current from the LIN
bus to VS, even in the event of a GND shift or VBat disconnection. The LIN receiver thresholds comply with the LIN protocol
specification.
The fall time (from recessive to dominant) and the rise time (from dominant to recessive) are slope-controlled.
During a short circuit at LIN to VBat, the output limits the output current to IBUS_LIM. Due to the power dissipation, the chip
temperature exceeds TLINoff and the LIN output is switched off. The chip cools down and after a hysteresis of Thys, switches
the output on again. RXD stays on high because LIN is high. The VCC regulator works independently during LIN
overtemperature switch-off.
During a short circuit from LIN to GND the IC can be switched into sleep or silent mode and even in this case the current
consumption is lower than 100µA in sleep mode and lower than 120µA in silent mode. If the short-circuit disappears, the IC
starts with a remote wake-up.
The reverse current is < 2µA at pin LIN during loss of VBat. This is optimal behavior for bus systems where some slave nodes
are supplied from battery or ignition.
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3.6
Input/Output (TXD) (SBC only)
In normal mode the TXD pin is the microcontroller interface for controlling the state of the LIN output. TXD must be pulled to
ground in order to drive the LIN bus low. If TXD is high or unconnected (internal pull-up resistor), the LIN output transistor is
turned off and the bus is in the recessive state. If the TXD pin stays at GND level while switching into normal mode, it must
be pulled to high level longer than 10µs before the LIN driver can be activated. This feature prevents the bus line from being
accidentally driven to dominant state after normal mode has been activated (also in case of a short circuit at TXD to GND).
During fail-safe mode, this pin is used as output and signals the fail-safe source.
The TXD input has an internal pull-up resistor.
An internal timer prevents the bus line from being driven permanently in the dominant state. If TXD is forced to low longer
than tdom > 20ms, the LIN bus driver is switched to the recessive state. Nevertheless, when switching to sleep mode, the
actual level at the TXD pin is relevant.
To reactivate the LIN bus driver, switch TXD to high (> 10µs).
3.7
3.8
Output Pin (RXD) (SBC only)
In normal mode this pin reports the state of the LIN bus to the microcontroller. LIN high (recessive state) is indicated by a
high level at RXD; LIN low (dominant state) is indicated by a low level at RXD.
The output is a push-pull stage switching between VCC and GND. The AC characteristics are measured by an external load
capacitor of 20pF.
In silent mode the RXD output switches to high.
Enable Input Pin (EN) (SBC only)
The enable input pin controls the operating mode of the device. If EN is high, the circuit is in normal mode, with transmission
paths from TXD to LIN and from LIN to RXD both active. The VCC voltage regulator operates with 3.3V/5V/85mA output
capability.
If EN is switched to low while TXD is still high, the device is forced to silent mode. No data transmission is then possible, and
current consumption is reduced to IVSsilent typ. 47µA. The VCC regulator retains its full functionality.
If EN is switched to low while TXD is low, the device is forced to sleep mode. No data transmission is possible, and the
voltage regulator is switched off.
The EN pin provides a pull-down resistor to force the transceiver into recessive mode if EN is disconnected.
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4.
Functional Description
4.1
Physical Layer Compatibility
Because the LIN physical layer is independent of higher LIN layers (e.g., LIN protocol layer), all nodes with a LIN physical
layer according to revision 2.x can be mixed with LIN physical layer nodes based on earlier versions (i.e., LIN 1.0, LIN 1.1,
LIN 1.2, LIN 1.3) without any restrictions.
4.2
Operating Modes
Figure 4-1. SBC Operating Modes
a: VS > VVS_th_U_F_up (2.4V)
b: VS < VVS_th_U_down (1.9V)
c: Bus wake-up event (LIN)
d: VCC < VVCC_th_uv_down (2.4V/4.2V)
e: VS < VVS_th_N_F_down (3.9V)
f: VS > VVS_th_F_N_up (4.9V)
Unpowered Mode
All circuitry OFF
a
b
Fail-safe Mode
VCC: ON 5V/3.3V
VCC monitor active
Communication: OFF
Wake-up Signalling
EN = 0
TXD = 0
& f
EN = 0
TXD = 1
& f & d
Undervoltage Signalling
EN = 1
& f
c & f,
d
d,
e
b
c & f
b
EN = 1
& f
EN = 1
Sleep Mode
Normal Mode
Silent Mode
& f
VCC: OFF
Communication: OFF
Go to sleep
VCC: 5V/3.3V
VCC monitor active
Communication: ON
Go to silent
VCC: 5V/3.3V
command EN = 0
EN = 0 command
TXD = 1
VCC monitor active
Communication: OFF
TXD = 0
Table 4-1. SBC (ATA663254, ATA663231) Operating Modes
Operating Mode
Transceiver
VCC (SBC only)
LIN
TXD
RXD
Signaling fail-safe sources (see
Table 4-2)
Fail-safe
OFF
3.3V/5V
Recessive
Normal
ON
OFF
OFF
3.3V/5V
3.3V/5V
0V
TXD-dependent
Recessive
Follows data transmission
Silent (SBC only)
Sleep/Unpowered
High
Low
High
Low
Recessive
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Figure 4-2. Voltage Regulator Operating Modes
a: VS > V
b: VS < V
(2.4V)
(1.9V)
VS_th_U_F_up
VS_th_U_down
Unpowered Mode
All circuitry OFF
a
b
Active Mode
VCC: ON 5V
VCC monitor active
4.2.1 Normal Mode (SBC only)
This is the normal transmitting and receiving mode of the LIN Interface, in accordance with LIN specification 2.x.
The VCC voltage regulator operates with 3.3V/5V output voltage, with a low tolerance of ±2% and a maximum output current
of 85mA. If an undervoltage condition occurs, NRES is switched to low and the IC changes its state to fail-safe mode.
4.2.2 Silent Mode (SBC only)
A falling edge at EN while TXD is high switches the IC into silent mode. The TXD signal has to be logic high during the mode
select window. The transmission path is disabled in silent mode. The voltage regulator is active. The overall supply current
from VBat is a combination of the IVSsilent = 47µA plus the VCC regulator output current IVCC
.
Figure 4-3. Switching to Silent Mode
Normal Mode
Silent Mode
EN
Mode select window
TXD
td = 3.2µs
NRES
VCC
LIN
Delay time silent mode
td_silent = maximum 20µs
LIN switches directly to recessive mode
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In silent mode the internal slave termination between the LIN pin and VS pin is disabled to minimize the current consumption
in case the pin LIN is short-circuited to GND. Only a weak pull-up current (typically 10µA) between the LIN pin and VS pin is
present. Silent mode can be activated independently from the current level on pin LIN.
If an undervoltage condition occurs, NRES is switched to low and the Atmel® SBC changes its state to fail-safe mode.
4.2.3 Sleep Mode (SBC only)
A falling edge at EN while TXD is low switches the IC into sleep mode. The TXD signal has to be logic low during the mode
select window (Figure 4-6).
Figure 4-4. Switching to Sleep Mode
Sleep Mode
Normal Mode
EN
Mode select window
TXD
td = 3.2µs
NRES
VCC
LIN
Delay time sleep mode
d_sleep = maximum 20µs
t
LIN switches directly to recessive mode
In order to avoid any influence to the LIN pin when switching into sleep mode it is possible to switch the EN up to 3.2µs
earlier to low than the TXD. The easiest and best way to do this is by having two falling edges at TXD and EN at the same
time.
In sleep mode the transmission path is disabled. Supply current from VBat is typically IVSsleep = 9µA. The VCC regulator is
switched off; NRES and RXD are low. The internal slave termination between the LIN pin and VS pin is disabled to minimize
the current consumption in case the LIN pin is short-circuited to GND. Only a weak pull-up current (typically 10µA) between
the LIN pin and the VS pin is present. The sleep mode can be activated independently from the current level on the LIN pin.
Voltage below the LIN pre-wake detection VLINL at the LIN pin activates the internal LIN receiver and starts the wake-up
detection timer.
If the TXD pin is short-circuited to GND, it is possible to switch to sleep mode via EN after t > tdom
.
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4.2.4 Fail-Safe Mode (SBC only)
The device automatically switches to fail-safe mode at system power-up. The voltage regulator is switched on. The NRES
output remains low for tres = 4ms and causes the microcontroller to be reseted. LIN communication is switched off. The IC
stays in this mode until EN is switched to high. The IC then changes to normal mode. A low at NRES switches the IC into fail-
safe mode directly. During fail-safe mode the TXD pin is an output and, together with the RXD output pin, signals the fail-
safe source.
If the device enters fail-safe mode coming from the normal mode (EN=1) due to an VS undervoltage condition (VS <
VVS_th_N_F_down), it is possible to switch into sleep or silent mode by a falling edge at the EN input. With this feature the current
consumption can be further reduced.
A wake-up event from either silent or sleep mode is signalled to the microcontroller using the RXD pin and the TXD pin. A VS
undervoltage condition is also signalled at these two pins. The coding is shown in the table below.
A wake-up event switches the IC to fail-safe mode.
Table 4-2.
Signaling in Fail-safe Mode
Fail-Safe Sources
TXD
Low
High
RXD
Low
Low
LIN wake-up (LIN pin)
VSth (battery) undervoltage detection (VS < 3.9V)
4.2.5 Active Mode (Voltage Regulator only)
The device automatically switches to active mode at system power-up. The VCC voltage regulator operates with 5V output
voltage, with a low tolerance of ±2% and a maximum output current of 85mA. The NRES output remains low for tres = 4ms
and causes the microcontroller to be reseted. The current consumption is typically 47µA.
If an undervoltage condition occurs, NRES switches to low.
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4.3
Wake-up Scenarios from Silent Mode or Sleep Mode
4.3.1 Remote Wake-up via LIN Bus
4.3.1.1 Remote Wake-up from Silent Mode (SBC only)
A remote wake-up from silent mode is only possible if TXD is high. A voltage less than the LIN pre-wake detection VLINL at
the LIN pin activates the internal LIN receiver and starts the wake-up detection timer. A falling edge at the LIN pin followed
by a dominant bus level maintained for a certain period of time (> tbus) and the following rising edge at pin LIN (see Figure 4-
5) result in a remote wake-up request. The device switches from silent mode to fail-safe mode, the VCC voltage regulator
remains activated and the internal LIN slave termination resistor is switched on. The remote wake-up request is indicated by
a low level at the RXD pin and TXD pin (strong pull-down at TXD). EN high can be used to switch directly to normal mode.
Figure 4-5. LIN Wake-up from Silent Mode
Bus wake-up filtering time
tbus
Fail-safe Mode
Normal Mode
LIN bus
RXD
High
Low
TXD
VCC
High
High
Low (strong pull-down)
Fail-safe mode 3.3V/5V
Silent mode 3.3V/5V
Normal mode
EN High
EN
Undervoltage detection active
NRES
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4.3.1.2 Remote Wake-up from Sleep Mode (SBC only)
A falling edge at the LIN pin followed by a dominant bus level maintained for a certain period of time (> tbus) and a following
rising edge at the LIN pin result in a remote wake-up request, causing the device to switch from sleep mode to fail-safe
mode.
The VCC regulator is activated, and the internal LIN slave termination resistor is switched on. The remote wake-up request is
indicated by a low level at RXD and TXD (strong pull-down at TXD) (see Figure 4-6).
EN high can be used to switch directly from sleep/silent mode to fail-safe mode. If EN is still high after VCC ramp-up and
undervoltage reset time, the IC switches to normal mode.
Figure 4-6. LIN Wake-up from Sleep Mode
Bus wake-up filtering time
tbus
Fail-safe Mode
Normal Mode
High
LIN bus
RXD
High
Low
Low
TXD
VCC
High
Low (strong pull-down)
On state
Off state
tVCC
EN High
EN
Reset
time
Low
NRES
Microcontroller
start-up time delay
4.3.2 Wake-up Source Recognition (SBC only)
The device can distinguish between different wake-up sources. The wake-up source can be read on the TXD and RXD pin in
fail-safe mode. These flags are immediately reset if the microcontroller sets the EN pin to high and the IC is in normal mode.
Table 4-3. Signaling in Fail-safe Mode
Fail-Safe Sources
TXD
Low
High
RXD
Low
Low
LIN wake-up (LIN pin)
VSth (battery) undervoltage detection (VS < 3.9V)
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4.4
Behavior under Low Supply Voltage Condition
After the battery voltage has been connected to the application circuit, the voltage at the VS pin increases according to the
block capacitor used in the application (see Figure 8-1 on page 23). If VVS is higher than the minimum VS operation
threshold VVS_th_U_F_up, the IC mode changes from unpowered mode to fail-safe mode. As soon as VVS exceeds the
undervoltage threshold VVS_th_F_N_up, the LIN transceiver can be activated.
The VCC output voltage reaches its nominal value after tVCC. This parameter depends on the externally applied VCC
capacitor and the load. The NRES output is low for the reset time delay treset. No mode change is possible during this time
treset
.
The behavior of VCC, NRES and VS is shown in the following diagrams (ramp-up and ramp-down):
Figure 4-7. VCC and NRES versus VS (Ramp-up) for 3.3V (SBC only)
7.0
6.5
6.0
5.5
5.0
4.5
4.0
VS
3.5
3.0
2.5
2.0
1.5
1.0
VCC
NRES
0.5
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
VS (V)
Figure 4-8. VCC and NRES versus VS (Ramp-down) for 3.3V (SBC only)
7.0
6.5
6.0
5.5
5.0
VS
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
NRES
VCC
0.5
0.0
7.0 6.5 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0
VS (V)
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Figure 4-9. VCC and NRES versus VS (Ramp-up) for 5V (SBC and Voltage Regulator)
7.0
6.5
6.0
5.5
5.0
4.5
4.0
VS
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
VCC
NRES
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
VS (V)
Figure 4-10. VCC and NRES versus VS (Ramp-down) for 5V (SBC and Voltage Regulator)
7.0
6.5
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
VS
NRES
VCC
7.0 6.5 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0
VS (V)
Please note that the upper graphs are only valid if the VS ramp-up and ramp-down times are much slower than the VCC
ramp-up time tVcc and the NRES delay time treset
.
If during sleep mode the voltage level of VVS drops below the undervoltage detection threshold VVS_th_N_F_down (typ. 4.3V),
the operation mode is not changed and no wake-up is possible. Only if the supply voltage on pin VS drops below the VS
operation threshold VVS_th_U_down (typ. 2.05V), does the IC switch to unpowered mode.
If during silent mode the VCC voltage drops below the VCC undervoltage threshold VVCC_th_uv_down the IC switches into fail-
safe mode. If the supply voltage on pin VS drops below the VS operation threshold VVS_th_U_down (typ. 2.05V), does the IC
switch to unpowered mode.
If during normal mode the voltage level on the VS pin drops below the VS undervoltage detection threshold VVS_th_N_F_down
(typ. 4.3V), the IC switches to fail-safe mode. This means the LIN transceiver is disabled in order to avoid malfunctions or
false bus messages. The voltage regulator remains active.
For 3.3V SBC: In this undervoltage situation it is possible to switch the device into sleep mode or silent mode by a
falling edge at the EN input. For this feature, switching into these two current saving modes is always guaranteed,
allowing current consumption to be reduced even further.
When the VCC voltage drops below the VCC undervoltage threshold VVCC_th_uv_down (typ. 2.6V) the IC switches into
fail-safe mode.
For 5V SBC: Because of the VCC undervoltage condition in this situation, the IC is in fail-safe mode and can be
switched into sleep mode only.
Only when the supply voltage VVS drops below the operation threshold VVS_th_U_down (typ. 2.05V) does the IC switch
into unpowered mode.
The current consumption of the SBC in silent mode or in fail-safe mode and the voltage regulator is always below 170µA,
even when the supply voltage VS is lower than the regulator’s nominal output voltage VCC.
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4.5
Voltage Regulator
Figure 4-11. Voltage Regulator: Supply Voltage Ramp-up and Ramp-down
V
VS
12V
VCC
5.0V/3.3V
4.8V/2.9V
VVS_th_N_f_down
2.4V
t
tVCC
tReset
tres_f
NRES
5.0V/3.3V
t
The voltage regulator needs an external capacitor for compensation and to smooth the disturbances from the
microcontroller. It is recommended to use a MLC capacitor with a minimum capacitance of 1.8µF together with a 100nF
ceramic capacitor. Depending on the application, the values of these capacitors can be modified by the customer.
During a short circuit at VCC, the output limits the output current to IVCClim. Because of undervoltage, NRES switches to low
and sends a reset to the microcontroller. If the chip temperature exceeds the value TVCCoff, the VCC output switches off. The
chip cools down and, after a hysteresis of Thys, switches the output on again.
When the Atmel ATA6632xx is being soldered onto the PCB it is mandatory to connect the heat slug with a wide GND plate
on the printed board to get a good heat sink.
The main power dissipation of the IC is created from the VCC output current IVCC, which is needed for the application.
“Power Dissipation: Safe Operating Area: Regulator’s Output Current IVcc versus Supply Voltage VS” is shown in Figure 4-
12.
Figure 4-12. Power Dissipation: Safe Operating Area: Regulator’s Output Current IVcc versus Supply Voltage VS at
Different Ambient Temperatures (Rthja = 50K/W assumed)
90
Tamb = 85°C
Tamb = 95°C
Tamb = 105°C
Tamb = 115°C
80
70
60
50
40
30
20
10
0
Tamb = 125°C
5
6
7
8
9
10
11 12 13 14
15 16
17 18
VS [V]
ATA663203/ATA663231/ATA663254 [DATASHEET]
15
9337D–AUTO–07/14
5.
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Parameters
Symbol
Min.
Typ.
Max.
Unit
Supply voltage VS
VS
–0.3
+40
V
Pulse time ≤ 500ms
Ta = 25°C
Output current IVCC ≤ 85mA
VS
VS
+43.5
28
V
V
Pulse time ≤ 2min
Ta = 25°C
Output current IVCC ≤ 85mA
Logic pins voltage levels (RxD, TxD, EN,
NRES)
VLogic
ILogic
–0.3
–5
+5.5
+5
V
Logic pins output DC currents
mA
LIN
- DC voltage
- Pulse time < 500ms
VLIN
–27
+40
+43.5
V
V
VCC
- DC voltage
- DC input current
VVCC
IVCC
–0.3
+5.5
+200
V
mA
ESD according to IBEE LIN EMC
Test specification 1.0 following IEC 61000-4-2
- Pin VS, LIN to GND (with external circuitry
acc. applications diagram)
±6
kV
ESD HBM following STM5.1
with 1.5kΩ/100pF
- Pin VS, LIN to GND
±6
±3
kV
kV
HBM ESD
ANSI/ESD-STM5.1
JESD22-A114
AEC-Q100 (002)
CDM ESD STM 5.3.1
±750
±200
V
V
Machine Model ESD
AEC-Q100-RevF(003)
Junction temperature
Storage temperature
Tj
–40
–55
+150
+150
°C
°C
Ts
16
ATA663203/ATA663231/ATA663254 [DATASHEET]
9337D–AUTO–07/14
6.
Thermal Characteristics
Parameters
Symbol
Min.
Typ.
Max.
Unit
Thermal resistance junction to heat slug
RthjC
10
K/W
Thermal resistance junction to ambient, where
heat slug is soldered to PCB according to
JEDEC
Rthja
50
K/W
Thermal shutdown of VCC regulator
Thermal shutdown of LIN output
Thermal shutdown hysteresis
TVCCoff
TLINoff
Thys
150
150
165
165
10
180
180
°C
°C
°C
7.
Electrical Characteristics
5V < VS < 28V, –40°C < Tj < 150°C; unless otherwise specified all values refer to GND pins.
No. Parameters
VS pin
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
1
1.1 Nominal DC voltage range
VS
VS
VS
5
6
13.5
9
28
12
V
A
B
Sleep mode
VLIN > VS – 0.5V
VS < 14V, T = 27°C
IVSsleep
µA
Sleep mode
VLIN > VS – 0.5V
VS < 14V
Supply current in sleep
mode
1.2
VS
VS
IVSsleep
3
10
50
15
µA
µA
A
A
Sleep mode, VLIN = 0V
bus shorted to GND
VS < 14V
IVSsleep_short
20
100
Bus recessive
5.5V< VS < 14V
without load at VCC
T = 27°C
VS
IVSsilent
30
47
58
µA
B
Bus recessive
5.5V< VS < 14V
without load at VCC
VS
VS
IVSsilent
30
50
50
64
µA
µA
A
A
Supply current in silent
mode (SBC) /
Active mode (voltage
regulator)
1.3
Bus recessive
2.0V< VS < 5,5V
without load at VCC
IVSsilent
130
170
Silent mode
5.5V< VS < 14V
bus shorted to GND
without load at VCC
VS
VS
VS
IVSsilent_short
50
80
120
290
950
µA
µA
µA
A
A
A
Bus recessive
VS < 14V
without load at VCC
Supply current in normal
mode
1.4
IVSrec
150
200
230
700
Bus dominant (internal
Supply current in normal LIN pull-up resistor active)
1.5
IVSdom
mode
VS < 14V
without load at VCC
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
ATA663203/ATA663231/ATA663254 [DATASHEET]
17
9337D–AUTO–07/14
7.
Electrical Characteristics (Continued)
5V < VS < 28V, –40°C < Tj < 150°C; unless otherwise specified all values refer to GND pins.
No. Parameters
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
Bus recessive
5.5V < VS < 14V
without load at VCC
VS
IVSfail
40
55
80
µA
A
Supply current in fail-safe
mode
1.6
Bus recessive
2.0V < VS < 5.5V
without load at VCC
VS
IVSfail
50
130
170
µA
A
VS undervoltage threshold Decreasing supply voltage
VS VVS_th_N_F_down
3.9
4.1
4.3
4.6
4.7
4.9
V
V
A
A
1.7 (switching from normal to
fail-safe mode)
Increasing supply voltage
VS
VVS_th_F_N_up
VS undervoltage
hysteresis
1.8
VS
VS
VS
VVS_hys_F_N
VVS_th_U_down
VVS_th_U_F_up
0.1
1.9
2.0
0.25
2.05
2.25
0.4
2.3
2.4
V
V
V
A
A
A
Switch to unpowered mode
VS operation threshold
1.9 (switching to unpowered
mode)
Switch from unpowered to
fail-safe mode
VS undervoltage
1.10
VS
VVS_hys_U
0.1
0.2
0.2
0.3
0.4
V
A
hysteresis
2
RXD output pin (only SBC)
Low-level output sink
capability
Normal mode,
VLIN = 0V, IRXD = 2mA
2.1
RXD
RXD
VRXDL
VRXDH
V
V
A
A
High-level output source Normal mode
capability
VCC
–
VCC –
0.2V
2.2
3
VLIN = VS, IRXD = –2mA
0.4V
TXD input/output pin (only SBC)
3.1 Low-level voltage input
3.2 High-level voltage input
3.3 Pull-up resistor
TXD
TXD
VTXDL
VTXDH
–0.3
2
+0.8
V
V
A
A
VCC
+
0.3V
VTXD = 0V
TXD
TXD
RTXD
ITXD
40
–3
70
100
+3
kΩ
A
A
3.4 High-level leakage current VTXD = VCC
µA
Low-level output sink
3.7 current at LIN wake-up
request
Fail-safe Mode
VLIN = VS
VTXD = 0.4V
TXD
ITXD
2
2.5
8
mA
A
4
EN input pin (only SBC)
4.1 Low-level voltage input
EN
EN
VENL
VENH
–0.3
2
+0.8
V
V
A
A
VCC
+
4.2 High-level voltage input
0.3V
4.3 Pull-down resistor
VEN = VCC
VEN = 0V
EN
EN
REN
IEN
50
–3
125
200
+3
kΩ
A
A
4.4 Low-level input current
µA
5
NRES open drain output pin
VS ≥ 5.5V
INRES = 2mA
5.1 Low-level output voltage
NRES
NRES
VNRESL
tReset
0.2
4
0.4
6
V
A
A
VVS ≥ 5.5V
CNRES = 20pF
5.2 Undervoltage reset time
2
ms
Reset debounce time for VVS ≥ 5.5V
5.3
NRES
NRES
tres_f
0.5
–3
10
+3
µs
A
A
falling edge
CNRES = 20pF
5.4 Switch off leakage current VNRES = 5.5V
INRES_L
µA
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
18
ATA663203/ATA663231/ATA663254 [DATASHEET]
9337D–AUTO–07/14
7.
Electrical Characteristics (Continued)
5V < VS < 28V, –40°C < Tj < 150°C; unless otherwise specified all values refer to GND pins.
No. Parameters
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
8
VCC voltage regulator (3.3V)
4V < VS < 18V
(0mA to 50mA)
VCC
VCC
VCC
VCCnor
VCCnor
VCClow
3.234
3.234
3.366
3.366
3.366
V
V
V
A
C
A
8.1 Output voltage VCC
4.5V < VS < 18V
(0mA to 85mA)
Output voltage VCC at low
8.2
VS
3V < VS < 4V
VVS – VD
8.3 Regulator drop voltage
8.4 Regulator drop voltage
VS > 3V, IVCC = –15mA
VS > 3V, IVCC = –50mA
VCC
VCC
VCC
VCC
VCC
VCC
VD1
VD2
100
300
0.1
150
500
0.2
mV
mV
%
A
A
A
A
A
D
8.5 Line regulation maximum 4V < VS < 18V
8.6 Load regulation maximum 5mA < IVCC < 50mA
8.7 Output current limitation VS > 4V
VCCline
VCCload
IVCClim
Cload
0.1
0.5
%
–180
2.2
–120
mA
µF
8.8 Load capacity
MLC capacitor
1.8
2.3
VCC undervoltage
Referred to VCC
VS > 4V
VCC VVCC_th_uv_down
VCC VVCC_th_uv_up
2.5
2.6
200
1
2.8
2.9
300
1.5
V
V
A
A
A
A
threshold (NRES ON)
8.9
VCC undervoltage
Referred to VCC
VS > 4V
2.5
threshold (NRES OFF)
Hysteresis of VCC
8.10
Referred to VCC
VS > 4V
VCC
VCC
VVCC_hys_uv
tVCC
100
mV
ms
undervoltage threshold
Ramp-up time VS > 4V to CVCC = 2.2µF
VCC = 3.3V
8.11
9
Iload = –5mA at VCC
VCC voltage regulator (5V)
5.5V < VS < 18V
(0mA to 50mA)
VCC
VCC
VCC
VCCnor
VCCnor
VCClow
4.9
4.9
5.1
5.1
5.1
V
V
V
A
C
A
9.1 Output voltage VCC
6V < VS < 18V
(0mA to 85mA)
Output voltage VCC at low
9.2
VS
4V < VS < 5.5V
VVS – VD
9.3 Regulator drop voltage
9.4 Regulator drop voltage
9.5 Regulator drop voltage
VS > 4V, IVCC = –20mA
VS > 4V, IVCC = –50mA
VS > 3.3V, IVCC = –15mA
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VD1
VD2
100
300
200
500
150
0.2
mV
mV
mV
%
A
A
A
A
A
A
D
VD3
9.6 Line regulation maximum 5.5V < VS < 18V
9.7 Load regulation maximum 5mA < IVCC < 50mA
9.8 Output current limitation VS > 5.5V
VCCline
VCCload
IVCClim
Cload
0.1
0.1
0.5
%
–180
2.2
–120
mA
µF
9.9 Load capacity
MLC capacitor
1.8
4.2
VCC undervoltage
Referred to VCC
VS > 4V
VCC VVCC_th_uv_down
4.4
4.6
200
1
4.6
4.8
300
1.5
V
V
A
A
A
A
threshold (NRES ON)
9.10
VCC undervoltage
Referred to VCC
VS > 4V
VCC
VCC
VCC
VVCC_hys_uv
VVCC_hys_uv
tVCC
4.3
threshold (NRES OFF)
Hysteresis of undervoltage Referred to VCC
9.11
9.12
100
mV
ms
threshold
Ramp-up time VS > 5.5V CVCC = 2.2µF
to VCC = 5V Iload = –5mA at VCC
VS > 5.5V
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
ATA663203/ATA663231/ATA663254 [DATASHEET]
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9337D–AUTO–07/14
7.
Electrical Characteristics (Continued)
5V < VS < 28V, –40°C < Tj < 150°C; unless otherwise specified all values refer to GND pins.
No. Parameters Test Conditions Pin Symbol Min.
LIN bus driver (only SBC): bus load conditions:
Typ.
Max.
Unit
Type*
10 Load 1 (small): 1nF, 1kΩ; Load 2 (large): 10nF, 500Ω; CRXD = 20pF, Load 3 (medium): 6.8nF, 660Ω characterized on samples
12.7 and 12.8 specifies the timing parameters for proper operation at 20kb/s and 12.9 and 12.10 at 10.4kb/s
Driver recessive output
voltage
10.1
Load1/Load2
LIN
LIN
LIN
LIN
LIN
LIN
LIN
LIN
VBUSrec
V_LoSUP
V_HiSUP
V_LoSUP_1k
V_HiSUP_1k
RLIN
0.9 × VS
VS
1.2
2
V
V
A
A
A
A
A
A
D
A
VVS = 7V
Rload = 500Ω
10.2 Driver dominant voltage
10.3 Driver dominant voltage
10.4 Driver dominant voltage
10.5 Driver dominant voltage
10.6 Pull-up resistor to VS
VVS = 18V
Rload = 500Ω
V
VVS = 7V
0.6
0.8
20
V
R
load = 1000Ω
VVS = 18V
Rload = 1000Ω
V
The serial diode is
mandatory
30
47
1.0
200
kΩ
V
Voltage drop at the serial In pull-up path with Rslave
diodes
10.7
10.8
VSerDiode
IBUS_LIM
0.4
40
ISerDiode = 10mA
LIN current limitation
VBUS = VBat_max
120
mA
Input leakage current
driver off
VBUS = 0V
Input leakage current at
10.9 the receiver including pull-
up resistor as specified
LIN
LIN
IBUS_PAS_dom
–1
–0.35
mA
µA
A
A
VBat = 12V
Driver off
Leakage current LIN
recessive
8V < VBat < 18V
8V < VBUS < 18V
VBUS ≥ VBat
10.10
IBUS_PAS_rec
10
20
Leakage current when
control unit disconnected
from ground.
Loss of local ground must
not affect communication
in the residual network
GNDDevice = VS
VBat = 12V
0V < VBUS < 18V
10.11
LIN
IBUS_NO_gnd
–10
+0.5
+10
µA
A
Leakage current at
disconnected battery.
Node has to sustain the
VBat disconnected
10.12 current that can flow under VSUP_Device = GND
this condition. Bus must 0V < VBUS < 18V
remain operational under
LIN
LIN
IBUS_NO_bat
0.1
2
µA
pF
A
D
this condition.
Capacitance on pin LIN to
10.13
GND
CLIN
20
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
20
ATA663203/ATA663231/ATA663254 [DATASHEET]
9337D–AUTO–07/14
7.
Electrical Characteristics (Continued)
5V < VS < 28V, –40°C < Tj < 150°C; unless otherwise specified all values refer to GND pins.
No. Parameters
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
11 LIN bus receiver (only SBC)
Center of receiver
threshold
VBUS_CNT
(Vth_dom + Vth_rec)/2
=
0.475 ×
VS
0.5 ×
VS
0.525 ×
VS
11.1
LIN
VBUS_CNT
V
A
11.2 Receiver dominant state VEN = 5V/3.3V
11.3 Receiver recessive state VEN = 5V/3.3V
LIN
LIN
VBUSdom
VBUSrec
–27
0.4 × VS
V
V
A
A
0.6 × VS
40
0.028 ×
VS
0.175 ×
VS
11.4 Receiver input hysteresis Vhys = Vth_rec – Vth_dom
LIN
LIN
LIN
VBUShys
VLINH
0.1 x VS
V
V
V
A
A
A
Pre-wake detection LIN
11.5
VS +
0.3V
VS – 2V
–27
high-level input voltage
Pre-wake detection LIN
low-level input voltage
VS –
3.3V
11.6
Activates the LIN receiver
VLIN = 0V
VLINL
12 Internal timers (only SBC)
Dominant time for
12.1
LIN
EN
tbus
50
5
100
15
150
20
µs
µs
A
A
wake-up via LIN bus
Time delay for mode
12.2 change from fail-safe into VEN = 5V/3.3V
normal mode via EN pin
tnorm
Time delay for mode
12.3 change from normal mode VEN = 0V
to sleep mode via EN pin
EN
tsleep
5
15
40
20
60
µs
A
A
TXD dominant time-out
12.5
VTXD = 0V
TXD
tdom
20
ms
time
Time delay for mode
change from silent mode
into normal mode via EN
pin
12.6
VEN = 5V/3.3V
EN
ts_n
5
15
40
µs
A
A
THRec(max) = 0.744 × VS
THDom(max) = 0.581 × VS
VS = 7.0V to 18V
tBit = 50µs
D1 = tbus_rec(min)/(2 × tBit)
12.7 Duty cycle 1
12.8 Duty cycle 2
12.9 Duty cycle 3
12.10 Duty cycle 4
LIN
D1
0.396
THRec(min) = 0.422 × VS
THDom(min) = 0.284 × VS
VS = 7.6V to 18V
tBit = 50µs
D2 = tbus_rec(max)/(2 × tBit)
LIN
LIN
LIN
D2
D3
D4
0.581
A
A
A
THRec(max) = 0.778 × VS
THDom(max) = 0.616 × VS
VS = 7.0V to 18V
tBit = 96µs
D3 = tbus_rec(min)/(2 × tBit)
0.417
THRec(min) = 0.389 × VS
THDom(min) = 0.251 × VS
VS = 7.6V to 18V
0.590
tBit = 96µs
D4 = tbus_rec(max)/(2 × tBit)
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
ATA663203/ATA663231/ATA663254 [DATASHEET]
21
9337D–AUTO–07/14
7.
Electrical Characteristics (Continued)
5V < VS < 28V, –40°C < Tj < 150°C; unless otherwise specified all values refer to GND pins.
No. Parameters
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
Slope time falling and
rising edge at LIN
tSLOPE_fall
tSLOPE_rise
12.11
13
VS = 7.0V to 18V
LIN
3.5
22.5
µs
A
Receiver electrical AC parameters of the LIN physical layer
LIN receiver, RXD load conditions: CRXD = 20pF
Propagation delay of
receiver
VS = 7.0V to 18V
trx_pd = max(trx_pdr , trx_pdf
13.1
RXD
trx_pd
6
µs
µs
A
A
)
Symmetry of receiver
13.2 propagation delay rising
edge minus falling edge
VS = 7.0V to 18V
trx_sym = trx_pdr – trx_pdf
RXD
trx_sym
–2
+2
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Figure 7-1. Definition of Bus Timing Characteristics
tBit
tBit
tBit
TXD
(Input to transmitting node)
tBus_dom(max)
tBus_rec(min)
Thresholds of
receiving node1
THRec(max)
VS
THDom(max)
(Transceiver supply
of transmitting node)
LIN Bus Signal
Thresholds of
THRec(min)
THDom(min)
receiving node2
tBus_dom(min)
tBus_rec(max)
RXD
(Output of receiving node1)
trx_pdf(1)
trx_pdr(1)
RXD
(Output of receiving node2)
trx_pdr(2)
trx_pdf(2)
22
ATA663203/ATA663231/ATA663254 [DATASHEET]
9337D–AUTO–07/14
8.
Application Circuits
Figure 8-1. Typical Application Circuit SBC
D1
VBAT
VCC
C1
10µF/50V
+
C5
C4
R1
10kΩ
100nF
2.2µF
D2
VCC
Atmel
R2
RXD
VCC
VS
ATA663254
ATA663231
1kΩ
Master node
pull up
EN
DFN8
3 x 3
C2
100nF
C3
Microcontroller
GND
NRES
TXD
LIN
LIN
220pF
GND
GND
Note:
Heat slug must always be connected to GND.
Figure 8-2. Typical Application Circuit Voltage Regulator
VCC
D1
VBAT
C5
C4
C1
+
100nF
2.2µF
10µF/50V
R1
VCC
Microcontroller
GND
10kΩ
Atmel
VCC
ATA663203
VS
C2
100nF
DFN8
3 x 3
NRES
GND
GND
Note:
Heat slug must always be connected to GND.
ATA663203/ATA663231/ATA663254 [DATASHEET]
23
9337D–AUTO–07/14
9.
Ordering Information
Extended Type Number
ATA663231-FAQW
ATA663254-FAQW
ATA663203-FAQW
Package
DFN8
Remarks
3.3V LIN system basis chip, Pb-free, 6k, taped and reeled
5V LIN system basis chip, Pb-free, 6k, taped and reeled
5V voltage regulator, Pb-free, 6k, taped and reeled
DFN8
DFN8
10. Package Information
Top View
D
8
PIN 1 ID
technical drawings
according to DIN
specifications
1
Dimensions in mm
Side View
Partially Plated Surface
Bottom View
1
4
COMMON DIMENSIONS
(Unit of Measure = mm)
Symbol MIN
NOM
0.85
0.035
0.21
3
MAX NOTE
8
5
A
A1
A3
D
0.8
0.9
0.05
0.26
3.1
Z
e
0
0.16
2.9
2.3
2.9
1.5
0.35
0.25
D2
D2
E
2.4
2.5
3
3.1
E2
L
1.6
1.7
Z 10:1
0.4
0.45
0.35
b
0.3
e
0.65
b
10/11/13
TITLE
DRAWING NO.
6.543-5165.03-4
REV.
GPC
Package Drawing Contact:
packagedrawings@atmel.com
Package: VDFN_3x3_8L
Exposed pad 2.4x1.6
1
24
ATA663203/ATA663231/ATA663254 [DATASHEET]
9337D–AUTO–07/14
11. Revision History
Please note that the following page numbers referred to in this section refer to the specific revision mentioned, not to this
document.
Revision No.
History
• Figure 1- 2 ATA663203 “Block Diagram Voltage Regulator” on page 3 added
• ATA663203 pin configuration on page 4 added
• Figure 4-3 ATA663203 “Voltage Regulator Operating Modes” on page 8 added
• Section 4.2.5 ATA663203 “Active Mode (Voltage Regulator only)” on page 10 added
• Figure 8-2 ATA663203 “Typical Application Circuit Voltage Regulator” on page 23 added
• Section 9 ATA663203 “Ordering Information” on page 24 updated
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