AT97SC3205-G3M45-20 [MICROCHIP]

FF COM SPI TPM 4X4 32VQFN SEK -;
AT97SC3205-G3M45-20
型号: AT97SC3205-G3M45-20
厂家: MICROCHIP    MICROCHIP
描述:

FF COM SPI TPM 4X4 32VQFN SEK -

外围集成电路
文件: 总10页 (文件大小:326K)
中文:  中文翻译
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AT97SC3205  
Trusted Platform Module – SPI Interface  
SUMMARY DATASHEET  
Features  
Compliant to the Trusted Computing Group (TCG) Trusted Platform Module  
(TPM) Version 1.2 Specification  
Compliant with TCG PC Client-Specific TPM Interface Specification (TIS)  
Version 1.3  
Single-chip, Turnkey Solution  
Hardware Asymmetric Crypto Engine  
Atmel® AVR® RISC Microprocessor  
Internal EEPROM Storage for RSA Keys  
Serial Peripheral Interface (SPI) Protocol Up to 45MHz*  
(*Typical PC Operating Range is 24MHz to 33MHz)  
Secure Hardware and Firmware Design and Chip Layout  
FIPS-140-2 Module Certified Including the High-quality Random Number  
Generator (RNG), HMAC, AES, SHA, and RSA Engines  
NV Storage Space for 2066 bytes of User Defined Data  
3.3V Supply Voltage  
28-lead Thin TSSOP and 32-pad QFN Package  
Offered in Both Commercial (0°C to 70°C) and Industrial (-40°C to +85°C)  
Temperature Ranges  
Description  
The Atmel AT97SC3205 is a fully integrated security module designed to be  
integrated into personal computers and other embedded systems. It implements  
version 1.2 of the Trusted Computing Group (TCG) specification for Trusted  
Platform Modules (TPM).  
This is a summary document.  
The complete document is  
available under NDA. For more  
information, please contact  
your local Atmel sales office.  
Atmel-8884AS-TPM-AT97SC3205-Datasheet-Summary_022014  
1.  
Pin Configurations and Pinouts  
Table 1-1.  
Pin Configurations  
Function  
Pin Name  
VCC  
3.3V Supply Voltage  
GND  
Ground  
GPIO Express-00  
PP/GPIO  
GPIO  
GPIO assigned to TPM_NV_INDEX_GPIO_00  
Hardware Physical Presence or GPIO pin.  
General Purpose Input/Output Pin  
SPI Slave Data Output  
MISO  
MOSI  
SPI Slave Data Input  
PIRQ#  
SPI Interrupt Requests  
SPI_CLK  
SPI_CS#  
SPI_RST#  
TestI  
SPI Clock Input  
SPI Chip Select  
SPI Reset Pin  
TestI Manufacturing Test Input (Disabled)  
TestBI Manufacturing Test Input (Disabled)  
Indicate External Tamper Event  
No Connect  
TestBI  
XTamper  
NC  
Figure 1-1. Pinouts  
28-pin TSSOP  
4.40mm x 9.70mm Body  
0.65mm Pitch  
32-pin QFN  
4.00mm x 4.00mm Body  
0.90mm Pitch  
1
2
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
NC  
GPIO2  
NC  
GPIO1  
3
MISO  
GND  
VCC  
32 31 30 29 28 27 26 25  
1
2
3
4
5
6
7
8
24 MISO  
VCC  
4
GND  
23 GND  
GND  
5
VCC  
NC  
22 VCC  
GPIO Express-00  
6
MOSI  
SPI_CS#  
SPI_CLK  
PIRQ#  
VCC  
GPIO Express-00  
21 MOSI  
PP/GPIO  
7
PP/GPIO  
20 SPI_CS#  
19 SPI_CLK  
18 PIRQ#  
17 SPI_RST#  
TestI  
8
TestI  
TestBI/GPIO/XTamper  
9
TestBI/GPIO/XTamper  
NC  
VCC  
10  
11  
12  
13  
14  
VCC  
GND  
NC  
GND  
9
10 11 12 13 14 15 16  
GPIO3  
SPI_RST#  
NC  
NC  
NC  
2
AT97SC3205 [SUMMARY DATASHEET]  
Atmel-8884AS-TPM-AT97SC3205-Datasheet-Summary_022014  
2.  
Block Diagram  
ROM  
Program  
EEPROM  
Program  
AVR  
8-bit RISC  
CPU  
SRAM  
GPIO Express-00  
GPIO  
SPI  
PP/GPIO  
EEPROM  
Data  
MOSI  
MISO  
CRYPTO  
Engine  
RNG  
SPI_CLK  
SPI_CS#  
PIRQ#  
SPI_RST#  
Timer  
Physical  
Security  
Circuitry  
The TPM includes hardware Random Number Generator (RNG), including a FIPS certified Pseudo Random  
Number Generator that is used for key generation and TCG protocol functions. The RNG is also available to the  
system to generate random numbers that may be needed during normal operation.  
The chip uses a dynamic internal memory management scheme to store multiple RSA keys. Other than the  
standard TCG commands (TPM_FlushSpecific, TPM_Loadkey2), no system intervention is required to manage  
this internal key cache.  
The TPM is offered to OEM and ODM manufacturers as a turnkey solution, including the firmware integrated on the  
chip. In addition, Atmel provides the necessary device driver software for integration into certain operating  
systems, along with BIOS drivers. Atmel will also provide manufacturing support software for use by OEMs and  
ODMs during initialization and verification of the TPM during board assembly.  
Full documentation for TCG primitives can be found in the TCG TPM Main Specification, Parts 1 to 3, on the TCG  
web site located at https://www.trustedcomputinggroup.org. TPM features specific to PC client platforms are  
specified in the TCG PC Client Specific TPM Interface Specification, version 1.3, also available on the TCG web  
site. Implementation guidance for PC platforms is outlined in the TCG PC Client Specific Implementation  
Specification for Conventional Bios, version 1.2, also available on the TCG web site.  
AT97SC3205 [SUMMARY DATASHEET]  
3
Atmel-8884AS-TPM-AT97SC3205-Datasheet-Summary_022014  
3.  
Pin Description  
=
Table 3-1.  
Pin  
Pin Descriptions  
Description  
Power Supply, 3.3V. Care should be taken to prevent excessive noise. Effective decoupling of the VCC inputs to the  
Atmel TPM is critical to assure consistently reliable operation over the lifetime of the system. The Atmel  
recommendation is for a decoupling bypass capacitor within the range of 2200pF to 4700pF, to be placed as close as  
possible, < 5mm, to each of the VCC pins, located between each VCC pin and the immediately adjacent GND pin. A  
0.1μF decoupling bypass capacitor should be placed at the node in which these VCC traces join, which should be as  
close as possible, < 10mm, to the TPM. In all cases, this bypass capacitor should be closer than the next closest  
component. All capacitors should be of high quality, with dielectric ratings of X5R or X7R. A low-power state is  
automatically entered when the chip is idle. No further action is required by the system to enter low-power mode.  
VCC  
System Ground.  
GND  
General Purpose Input/Output. Internal pull-up resistor. This pin is mapped to NV Index  
TPM_NV_INDEX_GPIO_00. Default TPM configuration: GPIO Input. GPIO-Express-00 also serves as the XOR  
chain Output during I/O test mode. Since GPIO-Express-00 has an internal pull-up, it should be left floating if unused.  
GPIO Express-00  
General Purpose Input/Output. Internal pull-down resistor. This pin is an indicator for hardware physical  
presence; active high. Default TPM configuration: GPIO input. Since PP/GPIO has an internal pull-down, it should be  
left floating if unused.  
PP/GPIO  
General Purpose Input/Output. If unused, this pin can be tied to GND or VCC at the customers discretion.  
Master In Slave Out. SPI Slave Data Output. This pin serves as the SPI Data output from the TPM.  
Master Out Slave In. SPI Slave Data Input. This pin serves as the SPI Data Input to the TPM.  
GPIO  
MISO  
MOSI  
SPI Interrupt Pin, Active-low. This pin is used by the TPM to assert interrupts. If unused, this pin should be tied to  
ground directly or through a 4.7Kresistor.  
PIRQ#  
Clock used to drive the SPI bus. This pin should be asserted high for power savings when the TPM is not in use.  
SPI_CS# Chip Select, Active-low. The TPM chip select.  
SPI_CLK  
SPI_CS#  
SPI Reset Pin, Active-low. Pulsing this signal low resets the internal state of the TPM, and is equivalent to  
removal/restoration of power to the chip. The required minimum reset pulse width is 2μs. On power-up, it is critical  
that reset be kept active-low until VCC, and SPI_CLK stabilize. To be compliant with TCG requirements, this pin  
needs to be tied to system reset. TPM_Init is indicated by asserting this pin.  
SPI_RST#  
TestI  
TestI Manufacturing Test Input. Disabled after manufacturing. Tie TestI to ground directly or through a 4.7k  
resistor.  
TestBI Manufacturing Test Input. The Atmel TPM does not support legacy addressing via the optional BADD  
implementation of this pin.The TestBI pin also serves as the XTamper pin or an additional GPIO pin, active high.  
(See the application note, “Atmel Specific TPM Commands Reference Guide” for details on XTamper  
implementation). If unused, this pin should be tied to ground directly or through a 4.7Kresistor.  
TestBI/GPIO/  
XTamper  
No Connect Pins (TSSOP).  
The AT97SC3205 TSSOP package has additional pins which are no connects and can be tied to GND, VCC, or left  
floating at the customers discretion:  
NC – TSSOP Pin 5  
NC – TSSOP Pin 12  
NC – TSSOP Pin 13  
NC – TSSOP Pin 14  
NC – TSSOP Pin 15  
NC – TSSOP Pin 27  
NC – TSSOP Pin 28  
NC  
4
AT97SC3205 [SUMMARY DATASHEET]  
Atmel-8884AS-TPM-AT97SC3205-Datasheet-Summary_022014  
Table 3-1.  
Pin  
Pin Descriptions (Continued)  
Description  
No Connect Pins (QFN).  
The AT97SC3205 QFN package has additional pins which are no connects and can be tied to GND, VCC, or left  
floating at the customers discretion:  
NC – QFN Pin 7  
NC – QFN Pin 10  
NC – QFN Pin 11  
NC – QFN Pin 13  
NC – QFN Pin 14  
NC – QFN Pin 15  
NC – QFN Pin 16  
NC – QFN Pin 25  
NC – QFN Pin 26  
NC – QFN Pin 27  
NC – QFN Pin 28  
NC – QFN Pin 31  
NC  
Note:  
1. The substrate center pad for the 32-pin QFN is directly tied to GND internally; therefore, this pad can either be left  
floating or tied to GND.  
AT97SC3205 [SUMMARY DATASHEET]  
5
Atmel-8884AS-TPM-AT97SC3205-Datasheet-Summary_022014  
4.  
Ordering Information  
Atmel Ordering Code  
Package  
Operating Range  
28X1 (28-pin thin TSSOP)  
32M3 (32-pin very thin QFN)  
Commercial (0°C to 70°C)  
Industrial (-40°C to 85°C)  
AT97SC3205(1)  
Lead-free, RoHS  
Note:  
1. Please see the AT97SC3205 datasheet addendum for the complete catalog number ordering code.  
Package Type  
28X1  
32M3  
28-lead, 4.4mm body width, Plastic Thin Shrink Small Outline (thin TSSOP)  
32-pad, 4.0 x 4.0 x 0.9mm body, 0.4mm lead pitch, Very Thin Quad Flat No-Lead (QFN)  
6
AT97SC3205 [SUMMARY DATASHEET]  
Atmel-8884AS-TPM-AT97SC3205-Datasheet-Summary_022014  
 
5.  
Package Drawings  
5.1  
28X1 — 28-lead Thin TSSOP  
TOP VIEW  
END VIEW  
DETAIL 'A'  
C
(12° REF)  
D
B
1
14  
S
R1  
H
R
C
L
(0°~8°)  
L
d 0.20 C B A  
2X N/2 TIPS  
28  
15  
0.25  
e
SEE DETAIL "A"  
A2  
A
(1.00 REF)  
D
A
C
(12° REF)  
d 0.10 C  
28X b  
A1  
SEATING  
PLANE  
0.10  
j
n
C B A  
m
COMMON DIMENSIONS  
(UNIT OF MEASURE=MM)  
SIDE VIEW  
SYMBOL MIN  
NOM  
MAX  
NOTE  
-
-
-
A
1.10  
0.15  
0.95  
A1  
A2  
0.05  
0.85  
0.90  
2
1
-
-
b
c
0.19  
0.09  
0.30  
0.20  
9.70  
9.60  
9.80  
D
Note:  
1. Refer to JEDEC drawing MO-153,variation AE  
2. Dimension D does not include mold flash, protrusions or gate burrs. Mold  
E
E1  
e
6.40BSC  
1
4.30  
4.40  
4.50  
0.65 BSC  
flash,protrusions or gate burrs shall not exceed 0.15mm per end. Dimension E1  
does not include interlead flash or protrusion. Interlead flash or protrusion  
shall not exceed 0.25mm per side.  
L
0.75  
0.45  
0.09  
0.09  
0.20  
0.60  
-
-
-
R
-
-
-
3. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion  
shall be 0.08mm total in excess of the "b" dimension at maximum material  
condition. Minimum space between protrusion and adjacent lead is 0.07mm.  
R1  
S
7/8/2011  
DRAWING NO. REV.  
TITLE  
GPC  
TFL  
28X1, 28-lead, 4.4mm Body Width, Plastic Thin  
Shrink Small Outline Package (TSSOP)  
Package Drawing Contact:  
packagedrawings@atmel.com  
A
28X1  
AT97SC3205 [SUMMARY DATASHEET]  
7
Atmel-8884AS-TPM-AT97SC3205-Datasheet-Summary_022014  
5.2  
32M3 — 32-pad QFN  
D
A
B
E
32  
1
2
PIN #1 ID  
DATUM A OR B  
2X  
d 0.10  
C
L
2X  
d 0.10  
C
TOP VIEW  
SIDE VIEW  
e/2  
f 0.10  
C
C
A
3.  
d 0.05  
C
TERMINAL TIP  
SEATING PLANE  
A3  
DETAIL "A"  
A1  
D2  
K
(DATUM A)  
D2/2  
SEE DETAIL "A"  
32X L  
E2/2  
5.  
(NE-1) X  
e
E2  
COMMON DIMENSIONS  
(Unit of Measure = mm)  
(DATUM B)  
2
1
K
MIN  
0.80  
MAX  
0.90  
NOM  
0.85  
NOTE  
SYMBOL  
A
3.  
32X b  
32  
PIN #1 ID  
0.07 m C A B  
0.05 m C  
e
A1  
A3  
D
0.00  
0.02  
0.20 REF  
4.0 BSC  
2.60  
0.05  
j
(8D-1) X  
e
SEE DETAIL "A"  
BOTTOM VIEW  
D2  
E
2.50  
2.70  
NOTES :  
4.0 BSC  
2.60  
1. DIMENSIONING AND TOLERANCING CONFORME TO ASME Y14.5M - 1994.  
E2  
b
2.50  
0.15  
0.35  
0.20  
2.70  
0.25  
0.45  
-
2. ALL DIMENSIONS ARE IN MILLIMETERS, 0 IS IN DEGREES.  
0.20  
3. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED  
BETWEEN 0.15 AND 0.30mm FROM TERMINAL TIP. IF THE TERMINAL HAS  
THE OPTIONAL RADIUS ON THE OTHER END OF THE TERMINAL, THE  
DIMENSION b SHOULD NOT BE MEASURED IN THAT RADIUS AREA.  
4. MAX. PACKAGE WARPAGE IS 0.05 mm.  
L
0.40  
K
e
0.40 BSC  
5. MAXIMUM ALLOWABLE BURRS IS 0.076 mm IN ALL DIRECTIONS.  
6. THIS DRAWING CONFORMES TO JEDEC REGISTERED OUTLINE MO-220  
05/15/13  
TITLE  
DRAWING NO.  
REV.  
GPC  
32M3, 32-pad 4.0 x 4.0 x 0.90mm Body, 0.40mm  
Lead Pitch, Very Thin Quad Flat No-Lead  
Package (VQFN)  
ZAK  
32M3  
A
Package Drawing Contact:  
packagedrawings@atmel.com  
8
AT97SC3205 [SUMMARY DATASHEET]  
Atmel-8884AS-TPM-AT97SC3205-Datasheet-Summary_022014  
6.  
Revision History  
Doc. Rev.  
Date  
Comments  
8884AS  
02/2014  
Initial summary document release  
FunctionZZ_Summary Notes  
AT97SC3205 [SUMMARY DATASHEET]  
9
Atmel-8884AS-TPM-AT97SC3205-Datasheet-Summary_022014  
X
X X X X  
X
Atmel Corporation  
1600 Technology Drive, San Jose, CA 95110 USA  
T: (+1)(408) 441.0311  
F: (+1)(408) 436.4200  
|
www.atmel.com  
© 2014 Atmel Corporation. / Rev.: Atmel-8884AS-TPM-AT97SC3205-Datasheet-Summary_022014.  
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