AT30TSE004A-MA5M-T [MICROCHIP]
SENSOR TEMPERATURE I2C 8UDFN;型号: | AT30TSE004A-MA5M-T |
厂家: | MICROCHIP |
描述: | SENSOR TEMPERATURE I2C 8UDFN 输出元件 传感器 换能器 |
文件: | 总45页 (文件大小:1414K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
AT30TSE004A
Integrated Temperature Sensor with Serial EEPROM
DATASHEET
Features
Integrated Temperature Sensor (TS) + 4-Kbit Serial EEPROM
JEDEC JC42.4 (TSE2004av) DIMM Serial Presence Detect (SPD) + TS
compliant
Low voltage operation
̶
Optimized for VCC range of 1.7V to 3.6V
2-wire serial interface: I2C Fast Mode Plus (FM+) compatible
̶
̶
100kHz, 400kHz, and 1MHz compatibility
Bus Timeout supported
Schmitt Trigger, filtered inputs for noise suppression
Industry standard green (Pb/Halide-free/RoHS compliant) package options
̶
̶
8-pad Ultra Thin DFN (2 x 3 x 0.6mm)
8-pad Very Very Thin DFN (2 x 3 x 0.8mm)
Temperature Sensor Features
Highly accurate B-grade temp. measurements requiring no external
components
̶
̶
̶
±1.0°C accuracy (maximum) over the +75°C to +95°C range
±2.0°C accuracy (maximum) over the +40°C to +125°C range
±3.0°C accuracy (maximum) over the -20°C to +125°C range
11-bit ADC temperature-to-digital converter with 0.125°C resolution
Programmable hysteresis threshold: off, 0°C, 1.5°C, 3°C, and 6°C
Low operating current
̶
Temperature sensor active ~0.2mA (typical)
Serial EEPROM Features
Integrates 4-Kbits of Serial EEPROM
̶
Internally organized into four quadrants of 128-bytes each
Individual Reversible Software Write Protection on all four 128-byte quadrants
Supports byte and Page Write operations
Self-timed write cycle (5ms maximum)
High-reliability
̶
̶
Endurance: 1,000,000 write cycles
Data retention: 100 years
Low operating current
̶
̶
Serial EEPROM Write ~1.5mA (typical)
Serial EEPROM Read ~0.2mA (typical)
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015
Table of Contents
1. Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2. Pin Descriptions and Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4. Device Communication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.1
4.2
4.3
4.4
4.5
4.6
Start Condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Stop Condition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Acknowledge (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
No-Acknowledge (NACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Standby Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Device Reset and Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.6.1
Power-Up Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.7
4.8
Timeout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2-wire Software Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5. Device Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6. Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6.1
Functional Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6.1.1
6.1.2
EVENT Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Alarm Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6.2
Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6.2.1
6.2.2
6.2.3
6.2.4
6.2.5
6.2.6
6.2.7
Pointer Register (8-bit Write Only, Address = N/A) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Capability Register (16-bit Read-only, Address = 00h) . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Configuration Register (16-bit Read/Write, Address = 01h) . . . . . . . . . . . . . . . . . . . . . . . 15
Upper Limit Register (16-bit Read/Write, Address = 02h) . . . . . . . . . . . . . . . . . . . . . . . . . 18
Lower Limit Register (16-bit Read/Write, Address = 03h) . . . . . . . . . . . . . . . . . . . . . . . . . 19
Critical Alarm Register (16-bit Read/Write, Address = 04h) . . . . . . . . . . . . . . . . . . . . . . . 20
Temperature Register (16-bit Read-only, Address = 05h) . . . . . . . . . . . . . . . . . . . . . . . . 21
6.2.7.1
Temperature Register Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
6.2.8
6.2.9
Manufacturer ID Register (16-bit Read-only, Address = 06h) . . . . . . . . . . . . . . . . . . . . . . 23
Device ID Register (16-bit Read-only, Address = 07h) . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.3
6.4
Temperature Sensor Write Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Temperature Sensor Read Operations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
7. Serial EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
7.1
Memory Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
7.1.1 Set Page Address and Read Page Address Commands . . . . . . . . . . . . . . . . . . . . . . . . . 26
Serial EEPROM Write Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7.2
7.2.1
7.2.2
7.2.3
7.2.4
Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Acknowledge (ACK) Polling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Write Cycle Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
7.3
Write Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
7.3.1
7.3.2
7.3.3
Set RSWP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Clear RSWP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Read RSWP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
2
AT30TSE004A [DATASHEET]
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015
7.4
Serial EEPROM Read Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
7.4.1
7.4.2
7.4.3
Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Random Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Sequential Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
8. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
8.1
8.2
8.3
8.4
8.5
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Temperature Sensor Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Pin Capacitance(1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
9. Ordering Code Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
10. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
11. Part Markings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
12. Package Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
12.1 8MA2 — 8-pad UDFN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
12.2 8MAA — 8-pad WDFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
13. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
AT30TSE004A [DATASHEET]
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015
3
1.
Description
The Atmel® AT30TSE004A is a combination Serial EEPROM and temperature sensor device containing 4096-
bits of Serially Electrically Erasable and Programmable Read-Only Memory (EEPROM) organized as 512-bytes
of eight bits each. The Serial EEPROM operation is tailored specifically for DRAM memory modules with Serial
Presence Detect (SPD) to store a module’s vital product data such as the module’s size, speed, voltage, data
width, and timing parameters.
The AT30TSE004A is protocol compatible with the legacy JEDEC TSE2002av specification (2-Kbit) devices
enabling the AT30TSE004A to be utilized in legacy applications without any software changes. The Serial
EEPROM deploys special software commands to allow users to identify and set which half of the memory the
internal address counter is located. This special page addressing method used to select the upper or lower half
of the Serial EEPROM is the key to the legacy compatibility; however, there is one minor exception to the legacy
compatibility as the AT30TSE004A does not support the Permanent Write Protection feature because it was
removed from the JEDEC TSE2004a (DDR4) specification.
In addition, the Serial EEPROM incorporates a Reversible Software Write Protection (RSWP) feature enabling
the ability to selectively write protect any or all of the four 128-byte quadrants. Once the RSWP is set, it can only
be reversed by sending a special software command sequence.
The integrated temperature sensor converts temperatures from -20C to +125C to a digital word and provides
an accuracy of ±1°C (max.) in the temperature range +75C to +95C. The temperature sensor continuously
monitors temperature and updates the data in the Temperature Register at least eight times per second. The
temperature data is latched internally by the device and may be read by software via a bus Master at anytime
(even when the Serial EEPROM is busy writing data to the memory).
The AT30TSE004A incorporates flexible user programmable internal registers to configure the temperature
sensor’s performance and response to over and under temperature conditions. The device contains flexible
programmable high, low, and critical temperature limits. The EVENT pin is an active low output and can be
configured to operate as an Interrupt or as a Comparator output. The Manufacturer and Device ID Registers
provide the ability to confirm the identity of the device. The AT30TSE004A supports the industry standard 2-wire
I2C FM plus (Fast Mode +) serial interface allowing device communication to operate up to 1MHz. A bus timeout
feature is supported for both temperature sensor and Serial EEPROM operations to help prevent system lock-
ups. The AT30TSE004A is available in space saving 8-lead UDFN and WDFN packages.
The UDFN is the recommended and preferred package.
4
AT30TSE004A [DATASHEET]
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015
2.
Pin Descriptions and Pinouts
Table 2-1.
Pin Descriptions
Asserted
State
Symbol
Name and Function
Type
Serial Clock: The SCL pin is used to provide a clock to the device and is used
to control the flow of data to and from the device. Command and input data
present on the SDA pin is always latched in on the rising edge of SCL, while
output data on the SDA pin is always clocked out on the falling edge of SCL.
SCL
—
Input
The SCL pin must either be forced high when the serial bus is idle or pulled-high
using an external pull-up resistor.
Serial Data: The SDA pin is an open-drain bidirectional input/output pin used to
serially transfer data to and from the device.
Input/
Output
SDA
—
—
The SDA pin must be pulled-high using an external pull-up resistor (not to
exceed 8K in value) and may be wire-ORed with any number of other
open-drain or open-collector pins from other devices on the same bus.
EVENT: The EVENT pin is an open-drain output pin used to indicate when the
temperature goes beyond the user-programmed temperature limits. The EVENT
pin can be operated in one of three different modes; either Interrupt,
Comparator, or Critical Alarm Modes. The ALERT pin must be pulled-high using
an external pull-up resistor for proper operation.
EVENT
Output
Input
Device Address Inputs: The A0, A1, and A2 pins are used to select the device
address and corresponds to the three Least-Significant Bits (LSB) of the I2C
FM+ seven bit slave address. These pins can be directly connected to VCC or
GND in any combination, allowing up to eight devices on the same bus.
A2, A1, A0
—
The A0 pin is also an overvoltage tolerant pin, allowing up to 10V to support the
Reversible Software Write Protection (RSWP) feature (see Section 7.3 “Write
Protection” on page 32).
Device Power Supply: The VCC pin is used to supply the source voltage to the
device. Operations at invalid VCC voltages may produce spurious results and
should not be attempted.
VCC
—
—
Power
Power
Ground: The ground reference for the power supply. GND should be connected
to the system ground.
GND
Figure 2-1.
Pinout
UDFN / WDFN
A
A
A
1
2
3
4
8
7
6
5
V
0
1
2
CC
EVENT
SCL
SDA
GND
Top View
Note:
UDFN is the recommended and preferred package. The metal pad on the bottom of the UDFN/WDFN
package is not internally connected to a voltage potential. This pad can be a “no connect” or connected to GND.
AT30TSE004A [DATASHEET]
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015
5
3.
Block Diagram
Serial EEPROM
Temperature Sensor
Selected Resolution
Temp. Range
Accuracy
H.V Pump/Timing
Capability
Configuration
Critical Alarm Trip
Device ID
Output Feature
EVENT Shutdown
Timeout
EEPROM Quadrant 0
SPA = 0, (00h-7Fh)
EEPROM Quadrant 1
SPA = 0, (80h-FFh)
X Address
Decoder
EEPROM Quadrant 2
SPA = 1, (00h-7Fh)
Manufacturer ID
Temperature
EEPROM Quadrant 3
SPA= 1, (80h-FFh)
A/D
Converter
Upper Alarm Trip
Y Address Decoder
Memory
Control Logic
Lower Alarm Trip
Timeout
Band Gap
Temperature
Sensor
Write Protect Circuitry
Pointer
Register
Serial
Control Logic
I2C
Interface
GND
A
A
A
SCL SDA
VCC
EVENT
2
0
1
6
AT30TSE004A [DATASHEET]
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015
4.
Device Communication
The AT30TSE004A operates as a slave device and utilizes a simple 2-wire digital serial interface, compatible
with the I2C Fast Mode Plus (I2C FM+) protocol, to communicate with a host controller, commonly referred to as
the bus Master. The Master initiates and controls all Read and Write operations to the slave devices on the
serial bus, and both the Master and the slave devices can transmit and receive data on the bus.
The serial interface is comprised of just two signal lines: the Serial Clock (SCL) and the Serial Data (SDA). The
SCL pin is used to receive the clock signal from the Master, while the bidirectional SDA pin is used to receive
command and data information from the Master, as well as, to send data back to the Master. Data is always
latched into the AT30TSE004A on the rising edge of SCL and is always output from the device on the falling
edge of SCL. Both the SCL and SDA pin incorporate integrated spike suppression filters and Schmitt Triggers to
minimize the effects of input spikes and bus noise.
All command and data information is transferred with the Most-Significant Bit (MSB) first. During the bus
communication, one data bit is transmitted every clock cycle, and after eight bits (one byte) of data has been
transferred, the receiving device must respond with either an acknowledge (ACK) or a no-acknowledge (NACK)
response bit during a ninth clock cycle (ACK/NACK clock cycle) generated by the Master; therefore, nine clock
cycles are required for every one byte of data transferred. There are no unused clock cycles during any Read or
Write operation so there must not be any interruptions or breaks in the data stream during each data byte
transfer and ACK or NACK clock cycle.
During data transfers, data on the SDA pin must only change while SCL is low, and the data must remain stable
while SCL is high. If data on the SDA pin changes while SCL is high, then either a Start or a Stop condition will
occur. Start and Stop conditions are used to initiate and end all serial bus communication between the Master
and the slave devices.The number of data bytes transferred between a Start and a Stop condition is not limited
and is determined by the Master.
In order for the serial bus to be idle, both the SCL and SDA pins must be in the Logic 1 state at the same time.
4.1
4.2
4.3
Start Condition
A Start condition occurs when there is a high-to-low transition on the SDA pin while the SCL pin is stable in the
Logic 1 state. The Master uses a Start condition to initiate any data transfer sequence, and the Start condition
must precede any command. AT30TSE004A will continuously monitor the SDA and SCL pins for a Start
condition, and the device will not respond unless one is given. Please refer to Figure 4-1 on page 8 for more
details.
Stop Condition
A Stop condition occurs when there is a low-to-high transition on the SDA pin while the SCL pin is stable in the
Logic 1 state. The Master uses the Stop condition to end a data transfer sequence to the AT30TSE004A which
will subsequently return to the idle state. The Master can also utilize a repeated Start condition instead of a Stop
condition to end the current data transfer if the Master will perform another operation. Please refer to Figure 4-1
on page 8 for more details.
Acknowledge (ACK)
After every byte of data is received, AT30TSE004A must acknowledge to the Master that it has successfully
received the data byte by responding with an ACK. This is accomplished by the Master first releasing the SDA
line and providing the ACK/NACK clock cycle (a ninth clock cycle for every byte). During the ACK/NACK clock
cycle, the AT30TSE004A must output a Logic 0 (ACK) for the entire clock cycle such that the SDA line must be
stable in the Logic 0 state during the entire high period of the clock cycle. Please refer to Figure 4-1 on page 8
for more details.
AT30TSE004A [DATASHEET]
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7
4.4
No-Acknowledge (NACK)
When the AT30TSE004A is transmitting data to the Master, the Master can indicate that it is done receiving data
and wants to end the operation by sending a NACK response to the AT30TSE004A instead of an ACK
response. This is accomplished by the Master outputting a Logic 1 during the ACK/NACK clock cycle, at which
point the AT30TSE004A will release the SDA line so that the Master can then generate a Stop condition.
In addition, the AT30TSE004A can use a NACK to respond to the Master instead of an ACK for certain invalid
operation cases such as an attempt to Write to a read-only register (e.g. an attempt to Write to the Temperature
Register).
Figure 4-1.
Start, Stop, and ACK
SDA
Must Be
Stable
SDA
Must Be
Stable
Acknowledge Window
9
1
2
8
SCL
SDA
Stop
Condition
Acknowledge
Valid
Start
Condition
The transmitting device (Master or Slave) must
release the SDA line at this point to allow the
the receiving device (Master or Slave) to drive
the SDA line low to ACK the previous 8-bit word.
The receiver (Master or Slave)
must release the SDA line at
this point to allow the transmitter
to continue sending new data.
SDA
Change
Allowed
SDA
Change
Allowed
4.5
4.6
Standby Mode
The AT30TSE004A incorporates a low-power Standby Mode which is enabled:
Upon power-up or
After the receipt of the Stop condition and the completion of any internal operations.
Device Reset and Initialization
The AT30TSE004A incorporates an internal Power-On Reset (POR) circuit to help prevent inadvertent
operations during power-up and power-down cycles. On a cold power-up, the supply voltage must rise
monotonically between V
and V
without any ring back to ensure a proper power-up (see Figure
POR(max)
CC(min)
4-2 on page 9). Once the supply voltage has passed the V
threshold, the device’s internal reset process
POR(min)
is initiated. Completion of the internal reset process occurs within the tINIT time listed in Table 4.6.1 on page 9.
Upon completion of the internal reset process, the device will have the following power-on default conditions:
Temperature sensor starts monitoring temperature continuously.
Pointer Register = 00h
Upper Limit, Lower Limit, and Critical Alarm Registers are set to 0C.
EVENT pin is pulled high by the external pull up resistor.
Operational mode is Comparator.
Hysteresis level is set to 0C.
EVENT pin polarity is set low.
EVENT output is disabled and not asserted.
Serial EEPROM’s SPA = 0.
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Table 6-1 on page 13 shows the power-on register default values. The Upper Limit, Lower Limit, Critical Alarm,
and Configuration Registers should be programmed to their user desired values before the temperature sensor
can properly function. Before selecting the device and issuing protocol, a valid and stable supply voltage must
be applied and no protocol should be issued to the device for the time specified by the tINIT parameter. The
supply voltage must remain stable and valid until the end of the protocol transmission, and for a Serial EEPROM
Write instruction, until the end of the internal write cycle.
Figure 4-2.
Power-Up Timing
Cold
Power-On Reset
Warm
Power-On Reset
VCC
Device Access
Permitted
tINIT
VCC (min)
tPOR
VPOR (max)
VPOR (min)
Do Not Attempt
Device Access
During This Time
tPOFF
Time
4.6.1 Power-Up Conditions
Symbol
tPOR
Parameter
Min
Max
Units
ms
V
Power-on Reset Time
10.0
Power-on Reset Threshold
1.6
vPON
vPOFF
tPOFF
tINIT
Power-off Threshold for Warm Power-on Cycle
Warm Power Cycle Off Time
0.9
V
1.0
ms
ms
Time from Power-On to First Command
10.0
AT30TSE004A [DATASHEET]
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9
4.7
Timeout
The AT30TSE004A supports the industry standard bus Timeout feature on both temperature sensor and Serial
EEPROM operations to help prevent potential system bus hang-ups. The device resets its serial interface and
will stop driving the bus (will let SDA float high) if the SCL pin is held low for more than the minimum Timeout
(tOUT) specification. The AT30TSE004A will be ready to accept a new Start condition before the maximum tOUT
has elapsed (see Figure 4-3). This feature does require a minimum SCL clock speed of 10kHz to avoid any
timeout issues.
Figure 4-3.
Timeout
tTIMEOUT
(MAX)
tTIMEOUT
(MIN)
SCL
Device will release Bus and
be ready to accept a new
Start Condition within this Time
4.8
2-wire Software Reset
After an interruption in protocol, power loss, or system reset, any 2-wire part can be reset by following these
steps:
1. Create a Start condition.
2. Clock nine cycles.
3. Create another Start condition followed by Stop condition as shown in Figure 4-4.
Figure 4-4.
2-wire Software Reset
Dummy Clock Cycles
3
1
2
8
9
SCL
Start
Condition
Start
Condition
Stop
Condition
SDA
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5.
Device Addressing
The AT30TSE004A is designed to allow the Serial EEPROM and the temperature sensor to operate in parallel
while executing valid command protocol. For example, when the temperature sensor is busy during a
temperature conversion cycle, it is possible to perform any Serial EEPROM operation during this time and vice
versa.
The device requires a 7-bit device address and a Read/Write select bit following a Start condition from the
Master to initiate communication with either the temperature sensor or the Serial EEPROM. The device address
byte is comprised of a 4-bit device type identifier followed by three device address bits (A2, A1,and A0) and a
R/W bit and is clocked by the Master on the SDA pin with the Most Significant Bit first (see Table 5-1).
The AT30TSE004A will respond to three unique device type identifiers. The device type identifier of
‘1010’(Ah) is necessary to select the device for reading or writing. The device type identifier of ‘0110’(6h)
has multiple purposes. First, it is used to access the page address function which determines what the internal
address counter is set to. For more information on accessing the page address function, please refer to Section
7.1.1 “Set Page Address and Read Page Address Commands” on page 26 The device type identifier of
‘0110’(6h) is also used to access the Software Write Protection feature of the device. Information on the
Software Write Protection functionality can be found in Section 7.3 “Write Protection” on page 32.
Table 5-1.
AT30TSE004A Device Address Byte
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Function
Device Type Identifier
Device Address
Read/Write
Serial EEPROM
Read/Write
1
0
0
0
1
0
1
1
1
0
0
1
A2
A2
A2
A1
A1
A1
A0
A0
A0
R/
R/
R/
W
W
W
Serial EEPROM Write
Protection and Page
Address Functions
Temperature Sensor
The software device address bits (A2, A1, and A0) must match their corresponding hard-wired device address
inputs (A2, A1 and A0) allowing up to eight devices on the bus at the same time (see Table 5-2). The eighth bit of
the address byte is the R/W operation selection bit. A Read operation is selected if this bit is a Logic 1, and a
Serial EEPROM Write operation is selected if this bit is a Logic 0. Upon a compare of the device address byte,
the AT30TSE004A will output an ACK during the ninth clock cycle; if a compare is not true, the device will output
a NACK during the ninth clock cycle and return the device to the low-power Standby Mode.
Table 5-2.
Device Address Combinations
Software Device Address Bits
Hard-wired Device Address Inputs
A2, A1, A0
0 0 0
A2
A1
A0
GND
GND
GND
GND
VCC
GND
GND
VCC
GND
VCC
0 0 1
0 1 0
GND
VCC
0 1 1
VCC
1 0 0
GND
GND
VCC
GND
VCC
1 0 1
VCC
1 1 0
VCC
GND
VCC
1 1 1
VCC
VCC
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11
6.
Temperature Sensor
6.1
Functional Description
The temperature sensor consists of a Delta-Sigma Analog to Digital Converter (ADC) with a band gap type
temperature sensor that monitors and updates its temperature measurement at least eight times per second
converting the temperature readings into digital data bits and latching them into the Temperature Register that
can be read via the 2-wire I2C FM+ serial interface.
The device communicates over a 2-wire I2C FM+ interface with a Master consisting of a Serial Clock (SCL) and
a Serial Bidirectional Data Bus (SDA) with clock frequencies up to 1MHz. The Master generates the SCL signal
and is used by the AT30TSE004A to receive and send serial data on the SDA line with the Most Significant Bit
transferred first. A pull-up resistor is required on the SDA pin since it has an open drain configuration.
6.1.1 EVENT Output
The EVENT pin has three operating modes depending on the configuration settings:
Interrupt Mode
Comparator Mode
Critical Alarm (Crit_Alarm) Mode
While in Interrupt Mode, once a temperature reaches a boundary limit, the AT30TSE004A asserts the EVENT
pin. The EVENT pin will remain asserted until the system clears the interrupt by writing a Logic 1 to the EVTCLR
bit five in the Configuration Register. When the temperature drops below specified limits, the device returns
back to either Interrupt or Comparator Mode as programmed in the Configuration Register’s EVTMOD bit zero.
In Comparator Mode, the EVENT pin remains asserted until the error condition that caused the pin to be
asserted no longer exists and the EVENT pin will clear itself. In the Crit_Alarm Mode, when the measured
temperature exceeds Crit_Alarm limit, the EVENT pin will remain asserted until the temperature drops below the
Crit_Alarm limit minus hysteresis (see Figure 6-1 on page 17). All event thresholds use hysteresis as
programmed in the Configuration Register.
6.1.2 Alarm Window
The Alarm Window consists of the Upper Limit Register and Lower Limit Register. The Upper Limit Register
holds the upper temperature trip point and the Lower Limit Register holds the lower temperature trip point. After
the EVENT pin control is enabled, the EVENT output will be triggered upon entering and exiting from this
window.
6.2
Register Descriptions
This section describes all the temperature sensor registers that are used in the AT30TSE004A. The
AT30TSE004A contains several registers that are user accessible and/or programmable and utilized for latching
the temperature readings, storing high, low, and critical temperature limits, configuring the temperature sensor
performance, and reporting temperature sensor status.
These registers include a Capability Register, Configuration Register, Upper Limit Register, Lower Limit
Register, Critical Alarm Register, Temperature Register, Manufacturer Identification Register, and a Device
Identification/Device Revision Register.
The AT30TSE004A utilizes an 8-bit Pointer Register to access the 16-bit registers. Table 6-1 indicates the
Write/Read access capability for each register.
Note:
Reading from a Write-only register will result in reading Logic 0 data, and writing to a Read-only register will have
no impact even though the Write sequence will be acknowledged by the device.
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Table 6-1.
Registers
Register
Address
n/a
Read/Write
Section
6.2.1
6.2.2
6.2.3
6.2.4
6.2.5
6.2.6
6.2.7
6.2.8
6.2.9
N/A
Power-On Default
00h
Pointer Register
W
R
Capability Register
00h
00F7h
0000h
0000h
0000h
0000h
N/A
Configuration Register
Upper Limit Register
Lower Limit Register
Critical Alarm Register
Temperature Register
Manufacturer I.D. Register
Device I.D./Device Revision Register
Reserved (1)
01h
R/W
R/W
R/W
R/W
R
02h
03h
04h
05h
06h
R
1114h
2200h
N/A
07h
R
08h to 0Fh
R/W
Note:
1. Write operations to reserve registers should be avoided as it may cause undesirable results.
6.2.1 Pointer Register (8-bit Write Only, Address = N/A)
The AT30TSE004A utilizes a Pointer Register to select and access all the data registers shown on Table 6-1.
The Pointer Register is an 8-bit Write-only register (see Table 6-2). The power-on default value is 00h which is
the address location for the Capability Register.
Table 6-2.
Pointer Register
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Symbol
Pointer Register Value
R/W
W
0
W
0
W
0
W
0
W
0
W
0
W
0
W
0
Default Value
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13
6.2.2 Capability Register (16-bit Read-only, Address = 00h)
This register is a 16-bit read-only register used to specify the functional capabilities of the temperature sensor.
The AT30TSE004A is capable of measuring temperature with ±1C over the active range and ±2C over the
monitor range. The Capability Register functions are described in Table 6-3 and Table 6-4.
Table 6-3.
Capability Register Bit Distribution
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Symbol
RFU
Default Value
R/W Access
0
R
0
0
R
0
R
0
R
0
0
R
0
R
R
Bit 6
TMOUT
1
R
Bit 2
RANGE
1
Bit 7
EVSD
1
Bit 5
VHV
1
Bit 4
Bit 3
Bit 1
SACC
1
Bit 0
ICAP
1
Symbol
TPRES
Default Value
R/W Access
1
0
R
R
R
R
R
R
R
R
Table 6-4.
Capability Register Bit Description
Symbol Description
Bit
15:8
RFU
Reserved for Future Use and must be Logic 0.
Event Output Status During Shutdown Mode:
1 = The EVENT pin output is deasserted (not driven) when entering Shutdown Mode and will
remain deasserted upon exit from Shutdown Mode until the next temperature measurement
sample is taken. In Interrupt Mode, the EVENT pin maybe asserted when existing Shutdown if
a pending Interrupt has not be cleared.
7
EVSD
TMOUT
Timeout:
6
5
1 = BusTimeout supported within the range 25 to 35ms.
A0 Pin High Voltage:
V
HV
1 = The A0 pin supports a maximum voltage up to 10V.
Temperature Resolution:
4:3
2
TPRES
RANGE
10 =Supports 0.125C (11-bit resolution).
1 = Can read temperatures below 0°C and sets appropriate sign bit.
Supported Accuracy:
1
0
SACC
ICAP
1 = Supports a B-grade accuracy of ±1C over the active range (75C to 95C) and 2C over the
monitor range (40C to 125C).
Interrupt Capability:
1 = Supports Interrupt capabilities.
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6.2.3 Configuration Register (16-bit Read/Write, Address = 01h)
The AT30TSE004A incorporates a 16-bit Configuration Register allowing the user to set key operational
features of the temperature sensor. The Configuration Register functions are described in Table 6-5 and
Table 6-6.
Table 6-5.
Configuration Register Bit Distribution
Bit 15
Bit 14
Bit 13
RFU
0
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
SHTDWN
0
Symbol
HYSTENB
Default Value
0
0
0
Bit 4
EVTSTS
0
0
Bit 3
EVTOUT
0
0
Bit 2
CRITEVT
0
0
Bit 1
EVTPOL
0
Bit 7
Bit 6
Bit 5
EVTCLR
0
Bit 0
Symbol
CRTALML WINLOCK
EVTMOD
0
Default Value
R/W Access
0
0
R/W
R/W
W
R
R/W
R/W
R/W
R/W
Table 6-6.
Configuration Register Bit Description
Symbol Description
Bit
15:11 RFU
Reserved for Future Use and must be Logic 0.
Hysteresis Enable:
00 = 0C Disable hysteresis (Power-on default)
01 = 1.5C Enable hysteresis
10 = 3.0C Enable hysteresis
11 = 6.0C Enable hysteresis
The purpose of these bits is to control the hysteresis applied to the temperature limit trip point
boundaries. The above hysteresis applies to all limits when temperature drops below the user
specified temperature limit trip points.
10:9
HYSTENB
Note:
Hysteresis applies to decreasing temperature only. Once the temperature is above
a given threshold, the temperature must drop below the boundary limit minus
hysteresis in order for a Comparator EVENT to be cleared.
Example:
If these two bits are set to ‘01’ for 1.5C and the Upper Limit is set to 85C, as
temperature rises above 85C, bit 14 of the Temperature Register will be set to a
Logic 1. Bit 14 will remain set until the temperature drops below the threshold
(85C) minus the hysteresis value(83.5C).
Note:
Hysteresis is also applied to the EVENT pin functionality. This bit cannot be
changed if the Crit_Alarm or Alarm Window Lock bits is set.
Shutdown Mode:
0 = The temperature sensor is enabled for continuous conversion (power-on default).
1 = The temperature sensor is disabled.
To save power in Shutdown Mode, the temperature sensor is not active and will not generate
interrupts or update the temperature data. The EVENT pin is deasserted (not driven).
8
SHTDWN
This bit cannot be set to a Logic 1 if either of the Crit_Alarm or Alarm Window Lock bits is set,
however, it can be cleared at any time. The device will respond to protocol commands and the
bus timeout is active when in Shutdown Mode.
AT30TSE004A [DATASHEET]
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15
Table 6-6.
Bit
Configuration Register Bit Description (Continued)
Symbol
Description
Crit_Alarm Lock bit:
0 = The Crit_Alarm Register can be updated (power-on default).
1 = The Crit_Alarm Register is locked and cannot be updated.
This bit locks the Critical Alarm Register from being updated.
Once set, it can only be cleared to a Logic 0 by an internal Power-On Reset.
7
CRTALML
Alarm Window Lock bit:
0 = The Upper Limit and Lower Limit Registers can be updated (power-on default).
1 = The Upper and Lower Limit Registers are locked and cannot be updated.
Once set, it can be only be cleared to a Logic 0 by an internal Power-On Reset.
6
5
WINLOCK
EVTCLR
EVENT Clear:
0 = Has no effect (power-on default).
1 = Clears (releases) the active EVENT pin in Interrupt Mode.
This bit will clear the EVENT pin after it has been enabled. This bit is a
write-only bit and will read as a Logic 0 and is ignored when in Comparator Mode.
EVENT Pin Output Status:
4
3
EVTSTS
EVTOUT
0 = The EVENT output is not asserted by the device (power-on default).
1 = The EVENT output is asserted due to a limit or alarm condition.
EVENT Output Control:
0 = The EVENT output is disabled and will not generate interrupts (power-on default).
1 = The EVENT output is enabled.
This bit cannot be altered if the Crit_Alarm or the Alarm Window Lock bits is set.
Critical Temperature only:
0 = The EVENT output is asserted if the measured temperature is above the Upper Limit or
Critical Alarm, or is below the Lower Limit (power-on default).
2
CRITEVT
1 = The EVENT output is asserted only for a Critical Alarm violation when the temperature is
greater then the Crit_Alarm.
This bit cannot be altered if the Alarm Window Lock bit is set.
EVENT Polarity:
0 = The EVENT pin is active low (power-on default).
1 = The EVENT pin is active high.
1
0
EVTPOL
EVTMOD
This bit cannot be altered if the Crit_Alarm or the Alarm Window Lock bit is set.
A pull-up resistor is required on this pin to achieve the Logic 1 state.
EVENT Mode:
0 = The EVENT pin will operate in Comparator Mode (power-on default).
1 = The EVENT pin will operate in Interrupt Mode.
This bit cannot be altered if the Crit_Alarm or the Alarm Window Lock bit is set.
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Figure 6-1.
EVENT Pin Mode Functionality
Crit_Alarm
Upper Limit
Switches to
Comparator
Mode
Measured
Temperature
Lower Limit
Software Resets Interrupt
EVENT Pin in
Interrupt Mode”
(Active Low)
EVENT Pin in
“Comparator
Mode”
(Active Low)
EVENT Pin in
“Crit_Alarm
Only Mode”
(Active High)
AT30TSE004A [DATASHEET]
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17
6.2.4 Upper Limit Register (16-bit Read/Write, Address = 02h)
The Upper Limit Register holds the user programmed upper temperature boundary trip point in 2’s complement
format (0.125C resolution) that can be utilized to monitor the temperature in an operating window between the
Upper Limit Register and the Lower Limit Register settings (see Table 6-7 and Table 6-9). When the
temperature increases above this trip point, drops below, or is equal to the trip point (minus any hysteresis set),
then the EVENT pin is asserted (if enabled). This register is read-only if the Alarm Window Lock (WINLOCK) bit
six in the Configuration Register is set to a Logic 1.
Table 6-7.
Upper Limit Register Bit Distribution
Bit 15
Bit 14
RFU
0
Bit 13
Bit 12
SIGN
0
Bit 11
Bit 10
Bit 9
Bit 8
Symbol
ALMWINH
Default Value
R/W Access
0
R
0
R
0
0
0
0
R
R/W
Bit 4
R/W
Bit 3
R/W
Bit 2
R/W
Bit 1
R/W
Bit 0
Bit 7
Bit 6
Bit 5
Symbol
ALMWINH
RFU
Default Value
R/W Access
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R
R
Table 6-8.
Upper Limit Register Bit Description
Symbol Description
Bit
15:13 RFU
Reserved for Future Use. Read as Logic 0.
Sign bit:
12
SIGN
0 = The temperature is greater than or equal to 0°C.
1= The temperature is less than 0°C.
Upper Limit temperature bits:
Represented in 2’s complement format.
11:2
0:1
ALMWINH
RFU
Read-only access if Alarm Window is locked (Configuration Register bit 6 high).
R/W access if the Alarm Window is unlocked.
Reserved for Future Use. Read as Logic 0.
18
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6.2.5 Lower Limit Register (16-bit Read/Write, Address = 03h)
The Lower Limit Register holds the user programmed lower temperature boundary trip point in 2’s complement
format (0.125C resolution) that can be utilized to monitor the temperature in an operating window (see
Table 6-7 and Table 6-9). When the temperature decreases below this trip point minus any hysteresis set or
increases to meet or exceed this trip point, then the EVENT pin is asserted (if enabled).
This register becomes read-only if the Alarm Window Lock (WINLOCK) bit six in the Configuration Register is
set to a Logic 1.
Table 6-9.
Lower Limit Register Bit Distribution
Bit 15
Bit 14
RFU
0
Bit 13
Bit 12
SIGN
0
Bit 11
Bit 10
Bit 9
Bit 8
Symbol
ALMWINL
Default Value
R/W Access
0
R
0
R
0
0
0
0
R
R/W
Bit 4
R/W
Bit 3
R/W
Bit 2
R/W
Bit 1
R/W
Bit 0
Bit 7
Bit 6
Bit 5
Symbol
ALMWINL
RFU
Default Value
R/W Access
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R
R
Table 6-10.
Lower Limit Register Bit Description
Bit
Symbol Description
15:13 RFU
Reserved for Future Use. Read as Logic 0.
Sign bit:
12
SIGN
0 = The temperature is greater than or equal to 0°C.
1 = The temperature is less than 0°C.
Lower Limit temperature bits:
Represented in 2’s complement format.
11:2
0:1
ALMWINL
RFU
Read-only access if Alarm Window is locked (Configuration Register bit 6 high).
R/W access if the Alarm Window is unlocked.
Reserved for Future Use. Read as Logic 0.
AT30TSE004A [DATASHEET]
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19
6.2.6 Critical Alarm Register (16-bit Read/Write, Address = 04h)
The Critical Alarm Register holds the user programmed Critical Alarm temperature boundary trip point in
2’s complement format (0.125°C resolution) that can be utilized to monitor the temperature (see Table 6-11 and
Table 6-12). When the temperature increases above this trip point, the EVENT pin will be asserted (if enabled).
It will remain asserted until temperature decreases below or equal to the trip point minus any hysteresis set.
This register becomes read-only if the Critical Alarm Lock Bit (CRTALML) bit seven in the Configuration
Register is set to a Logic 1.
Table 6-11.
Critical Alarm Register Bit Distribution
Bit 15
Bit 14
RFU
0
Bit 13
Bit 12
SIGN
0
Bit 11
Bit 10
Bit 9
Bit 8
Symbol
CRITEVT
Default Value
R/W Access
0
R
0
R
0
0
0
0
R
R/W
Bit 4
R/W
Bit 3
R/W
Bit 2
R/W
Bit 1
R/W
Bit 0
Bit 7
Bit 6
Bit 5
Symbol
CRITEVT
RFU
Default Value
R/W Access
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R
R
Table 6-12.
Critical Alarm Register Bit Description
Bit
Symbol Description
15:13 RFU
Reserved for Future Use. Read as Logic 0.
Sign bit:
12
SIGN
0 = The temperature is greater than or equal to 0°C.
1 = The temperature is less than 0°C.
Critical Alarm temperature bits:
Represented in 2’s complement format.
11:2
0:1
CRITEVT
RFU
Read-only access if Alarm Window is locked (Configuration Register bit 6 high).
R/W access if the Alarm Window is unlocked.
Reserved for Future Use. Read as Logic 0.
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6.2.7 Temperature Register (16-bit Read-only, Address = 05h)
The Temperature Register holds the internal temperature measurement data represented in 2’s complement
format allowing for resolution equal to 0.125C (least significant bit). The upper three bits (15, 14, and 13) of the
Temperature Register indicates the trip status of the current temperature and most important, are not affected
by the status of the output of the EVENT pin (see Table 6-13 and Table 6-14).
Table 6-13.
Temperature Register Bit Distribution
Bit 15
Bit 14
Bit 13
Bit 12
SIGN
0
Bit 11
128°C
0
Bit 10
64°C
0
Bit 9
Bit 8
16°C
0
Symbol
CRITHIGH ALMHIGH ALMLOW
32°C
Default Value
R/W Access
0
R
0
R
0
R
0
R
R
R
R
Bit 1
0.125°C
0
R
Bit 7
8°C
0
Bit 6
4°C
0
Bit 5
2°C
0
Bit 4
1°C
0
Bit 3
0.5°C
0
Bit 2
0.25°C
0
Bit 0
RFU
0
Symbol
Default Value
R/W Access
R
R
R
R
R
R
R
R
Table 6-14.
Temperature Register Bit Description
Bit
Symbol Description
0 = The temperature is less than the Critical Alarm Register setting.
1 = The temperature is greater than or equal to Critical Alarm Register setting.
15
CRITHIGH
ALMHIGH
When this bit is set to a Logic 1, it will automatically clear once the measured temperature
decreases below or is equal to the trip point minus any hysteresis set.
0 = The temperature is below the Upper Limit Register setting.
1 = The temperature is above the Upper Limit Register setting.
14
When the bit is set to a Logic 1, it will automatically clear once the measured temperature
decreases below or is equal to the trip point minus any hysteresis set.
0 = The temperature is above the Lower Limit Register setting.
1 = The temperature is below the Lower Limit Register setting.
13
12
ALMLOW
SIGN
When the bit is set to a Logic 1, it will automatically clear once the measured temperature
increases above or is to equal to the trip point.
Sign bit:
0 = The temperature is greater than or equal to 0°C.
1 = The temperature is less than 0°C.
Temperature bits:
11:1
0
TEMP
RFU
Represented in 2’s complement format.
The encoding of bits B11 through B2 is the same as in the limit and alarm registers.
Reserved for Future Use. Read as Logic 0.
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21
6.2.7.1 Temperature Register Format
This section will clarify the Temperature Register format and temperature bit value assignments utilized for
temperature for the following registers: Upper Limit, Lower Limit, Critical Alarm, and Temperature Registers.
The temperatures expressed in the Upper Limit, Lower Limit, Critical Alarm, and Temperature Registers are
indicated in 2’s complement format. In each of the temperature limit registers, bits 12 through bit two are utilized
for temperature settings, or in the case of the Temperature Register, holds the internal temperature
measurement with bits 12 through bit one allowing 0.125ºC resolution.
Table 6-15 indicates the Temperature Register’s assigned bit values utilized for temperature and shows
examples for the Temperature Register bit values for various temperature readings.
Table 6-15.
Temperature Register Format
Position Bit 12 Bit 11 Bit 10 Bit 9
Bit Value SIGN 128°C 64°C 32°C
Bit 8
Bit 7 Bit 6
8°C 4°C
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
16°C
2°C
1°C
0.5°C 0.25°C 0.125°C
X
Table 6-16.
Temperature Register Examples
Temperature Register Value Examples
Temperature
+125°C
+99.75°C
+85°C
Binary (Bit 15 – Bit 0)
xxx0 0111 1101 00xx
xxx0 0110 0011 11xx
xxx0 0101 0101 00xx
xxx0 0010 0111 00xx
xxx0 0000 1111 11xx
xxx0 0000 0000 01xx
xxx0 0000 0000 00xx
xxx1 1111 1111 11xx
xxx1 1111 1110 00xx
xxx1 1110 1100 00xx
+39°C
+15.75°C
+0.25°C
0°C
-0.25°C
-1°C
-20°C
22
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6.2.8 Manufacturer ID Register (16-bit Read-only, Address = 06h)
The Manufacturer ID Register contains the PCI SIG number assigned to Atmel (1114h) as shown in Table 6-17.
Table 6-17.
Manufacturer ID Register Bit Distribution
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Symbol
Manufacturer ID
Default Value
R/W Access
0
R
0
R
0
R
1
R
0
R
0
R
0
R
1
R
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Symbol
Manufacturer ID
Default Value
R/W Access
0
0
0
1
0
1
0
0
R
R
R
R
R
R
R
R
6.2.9 Device ID Register (16-bit Read-only, Address = 07h)
The upper or high order byte is used to specify the device identification and the low byte is used to specify the
device revision. The Device ID for the AT30TSE004A is 2200h (see Table 6-18).
Table 6-18.
Device ID Register Bit Distribution
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Symbol
Device ID
Default Value
R/W Access
0
R
0
R
1
R
0
R
0
R
0
R
1
R
0
R
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Symbol
Device Revision
Default Value
R/W Access
0
0
0
0
0
0
0
0
R
R
R
R
R
R
R
R
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23
6.3
Temperature Sensor Write Operations
Writing to the Temperature Register of the AT30TSE004A is accomplished through a modified Write operation
for two data bytes. To maintain 2-wire compatibility, the 16-bit registers are accessed through a Pointer Register
requiring the TS Write sequence to include a Pointer Register byte following the device address byte to write the
two data bytes. Figure 6-2 illustrates the entire Write transaction.
Figure 6-2.
SCL
Temperature Sensor Register Write Operation
1
2
0
3
4
5
6
7
8
0
9
0
1
2
3
4
5
6
7
8
9
0
Device Address Byte
A2 A1 A0
Pointer Register Byte
0
1
1
P7 P6 P5 P4 P3 P2 P1 P0
MSB
SDA
MSB
Start
by
Master
ACK
from
Slave
ACK
from
Slave
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
0
Least Significant Data Byte
Most Significant Data Byte
D15 D14 D13 D12 D11 D10 D9 D8
MSB
0
D7 D6 D5 D4 D3 D2 D1 D0
MSB
Start
by
Master
Stop
by
Master
ACK
from
Slave
ACK
from
Slave
24
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6.4
Temperature Sensor Read Operations
Reading data from the temperature sensor may be accomplished in one of two ways:
If the location latched in the Pointer Register is correct (for normal operation, it is expected the same
address will be read repeatedly to read the temperature from the Temperature Register), the Register
Pointer Word Read sequence should be utilized as shown in Figure 6-3. To perform a Register Pointer
Word Read, the Master transmits a Start condition followed by a device address byte with the R/W select
bit to a Logic 1. The AT30TSE004A should respond with an ACK and will transmit the most significant
data byte. The Master should send an ACK followed by the device transmitting the least significant data
byte. To end the Read operation, the Master sends a NACK followed by a Stop condition.
If it is desired to Read a Random Register or simply change to read a different register from the
temperature sensor, then the Preset Pointer Register Word Read protocol sequence should be followed
and is shown in Figure 6-4. The Preset Pointer Register Word Read sequence allows the Pointer Register
to be preloaded with the correct register address to gain access to the desired register to be read. To
perform a Preset Pointer Register Word Read, the Master transmits a Start condition followed by a device
address byte (with the R/W select bit to a Logic 0) and a Pointer Register byte to the AT30TSE004A.
Once the device address and Pointer Register bytes are clocked in and acknowledged by the
AT30TSE004A, the Master must generate another Start condition. The Master transmits another device
address byte (with the R/W select bit to a Logic 1) followed by an ACK by the AT30TSE004A and the
device transmitting the most significant data byte. The Master should send a ACK followed by the device
transmitting the least significant data byte. To end the Read operation, the Master should send a NACK
followed by a Stop condition.
Figure 6-3.
Register Pointer Word Read
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
1
SCK
Device Address Byte
A2 A1 A0
Most Significant Data Byte
Least Significant Data Byte
0
MSB
0
1
1
1
0
D15 D14 D13 D12 D11 D10 D9 D8
MSB
D7 D6 D5 D4 D3 D2 D1 D0
MSB
SDA
Start
by
Master
Stop
by
Master
ACK
from
Slave
ACK
from
Master
NACK
from
Master
Figure 6-4.
Preset Pointer Register Word Read
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
0
SCL
Device Address Byte
A2 A1 A0
Pointer Register Byte
0
MSB
0
1
1
0
0
P7 P6 P5 P4 P3 P2 P1 P0
MSB
SDA
Start
by
Master
ACK
from
Slave
ACK
from
Slave
1
0
2
0
3
4
5
6
7
8
1
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
Least Significant Data Byte
Most Significant Data Byte
Device Address Byte
A2 A1 A0
1
1
0
D15 D14 D13 D12 D11 D10 D9 D8
MSB
0
D7 D6 D5 D4 D3 D2 D1 D0
MSB
MSB
Start
by
Master
Stop
by
Master
ACK
from
Master
NACK
from
Master
ACK
from
Slave
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25
7.
Serial EEPROM
7.1
Memory Organization
To provide the greatest flexibility and backwards compatibility with the previous generations of SPD devices, the
AT30TSE004A memory organization is organized into two independent 2-Kbit memory arrays. Each 2-Kbit
(256-byte) section is internally organized into two independent quadrants of 128 bytes with each quadrant
comprised of eight pages of 16 bytes. Including both memory sections, there are four 128-byte quadrants
totaling 512 bytes. The Memory Array organization details are shown in Section on page 6 and Table 7-1.
7.1.1 Set Page Address and Read Page Address Commands
The AT30TSE004A incorporates an innovative memory addressing technique that utilizes a Set Page Address
(SPA) and Read Page Address (RPA) commands to select and verify the desired half of the memory is enabled
to perform Write and Read operations.
Example:
If SPA = 0, then the first-half or lower 256 bytes of the Serial EEPROM is selected allowing
access to Quadrant 0 and Quadrant 1. Alternately, if SPA = 1, then the second-half or upper 256
bytes of the Serial EEPROM is selected allowing access to Quadrant 2 and Quadrant 3.
Table 7-1.
Set Page Address and Memory Organization
Block
Set Page Address (SPA)
Memory Address Locations
00h to 7Fh
Quadrant 0
Quadrant 1
Quadrant 2
Quadrant 3
0
0
1
1
80h to FFh
00h to 7Fh
80h to FFh
Note:
Due to the requirement for the A0 pin to be driven to VHV, the SPA and the RPA commands are fully supported in a
single DIMM (isolated DIMM) end application or a single DIMM programming station only.
Setting the Set Page Address (SPA) value selects the desired half of the EEPROM for performing Write or Read
operations. This is done by sending the SPA as seen in Figure 7-1. The SPA command sequence requires the
Master to transmit a Start condition followed by sending a control byte of ‘011011*0’ where the ‘*’ in the bit
7 position will dictate which half of the EEPROM is being addressed. A ‘0’ in this position (or 6Ch) is required
to set the page address to the first half of the memory and a ‘1’ (or 6Eh) is necessary to set the page address
to the second half of the memory. After receiving the control byte, the AT30TSE004A should return an ACK and
the Master should follow by sending two data bytes of don’t care values. The AT30TSE004A responds with a
ACK to each of these two data bytes although the JEDEC TSE2004av specification allows for either an ACK or
NACK response. The protocol is completed by the Master sending a Stop condition to end the operation.
Figure 7-1.
Set Page Address (SPA)
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
SCL
Control Byte
Address Byte
Data Byte
0
1
1
0
1
1
*
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
SDA
MSB
MSB
MSB
Start
by
Master
Stop
by
Master
ACK
from
Slave
ACK
from
Slave
ACK
from
Slave
Bit * = 0: Indicates the page address is located in the first half of the memory.
Bit * = 1: Indicates the page address is located in the second half of the memory.
26
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Reading the state of the SPA can be accomplished via the Read Page Address (RPA) command. The Master
can issue the RPA command to determine if the AT30TSE004A’s internal address counter is located in the first
2-Kbit section or the second 2-Kbit memory section based upon the device’s ACK or NACK response to the
RPA command.
The RPA command sequence requires the Master to transmit a Start condition followed by a control byte of
‘01101101’(6Dh). The device’s current address counter (page address) is located in the first half of the
memory if the AT30TSE004A responds with an ACK to the RPA command. Alternatively, if the device’s
response to the RPA command is a NACK, indicates the page address is located in the second half of the
memory (see Figure 7-2). Following the control byte and the device’s ACK or NACK response, the
AT30TSE004A should transmit two data bytes of don’t care values. The Master should NACK on these two data
bytes followed by the Master sending a Stop condition to end the operation.
After power-up, the SPA is set to zero indicating internal address counter is located in the first half of the
memory. Performing a software reset (see Section 4.8 “2-wire Software Reset” on page 10) will also set the
SPA to zero.
The AT30TSE004A incorporates a Reversible Software Write Protect (RSWP) feature that allows the ability to
selectively write protect data stored in any or all of the four Serial EEPROM 128-byte quadrants. See
Section 7.3 “Write Protection” on page 32 for more information on the RSWP feature.
Figure 7-2.
Read Page Address (RPA)
1
2
1
3
1
4
5
6
1
7
0
8
9
*
1
2
3
4
5
6
7
8
9
1
1
2
3
4
5
6
7
8
9
1
SCL
Control Byte
Most Significant Data Byte
Least Significant Data Byte
0
0
1
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
SDA
MSB
MSB
MSB
Start
by
Master
Stop
by
Master
ACK or NACK
from
NACK
from
Master
NACK
from
Master
Slave
Bit * = 0: ACK indicates the device’s internal address counter is located in the first half of the memory.
Bit * = 1: NACK indicates the device’s internal address counter is located in the second half of the memory.
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27
7.2
Serial EEPROM Write Operations
The 4-Kbit Serial EEPROM within the AT30TSE004A supports single Byte Write and Page Write operations up to the
maximum page size of 16 bytes in one operation. The only difference between a Byte Write and a Page Write
operation is the amount of data bytes loaded. Regardless of whether a Byte Write or Page Write operation is
performed, the internally self-timed write cycle will take the same amount of time to write the data to the addressed
memory location(s). Temperature sensor operations can be accessed during the write cycle to read the Temperature
Register or perform any other temperature sensor function.
Caution:
All Byte Write and Page Write operations should be preceded by the SPA and or RPA commands to
ensure the internal address counter is located in the desired half of the memory.
If a Byte Write or Page Write operation is attempted to a protected quadrant, then the AT30TSE004A will
respond (ACK or NACK) to the Write operation according to Table 7-2.
Table 7-2.
Serial EEPROM Acknowledge Status When Writing Data or Defining Write Protection
Word
Address
Sent
Word
Address
Response
Quadrant
Status
Instruction
Sent
Instruction
Response
Data Word Data Word
Write
Cycle
Sent
Response
Set RSWP
NACK
ACK
Don’t Care
Don’t Care
NACK
ACK
Don’t Care
NACK
No
Write Protected
with Set RSWP
Clear RSWP
Don’t Care
Data
ACK
Yes
Byte Write or
Page Write to
Protected Quadrant
Word
Address
ACK
ACK
NACK
No
Set RSWP or
Clear RSWP
ACK
ACK
Don’t Care
ACK
ACK
Don’t Care
Data
ACK
ACK
Yes
Yes
Not Protected
Byte Write or
Page Write
Word
Address
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7.2.1 Byte Write
Following the Start condition from the Master, the device type identifier (‘1010’), the device address bits and
the R/W select bit (set to a Logic 0) are clocked onto the bus by the Master (see Figure 7-3). This indicates to
the addressed device that the Master will follow by transmitting a byte with the word address. The
AT30TSE004A will respond with an ACK during the ninth clock cycle. Then the next byte transmitted by the
Master is the 8-bit word address of the byte location to be written into the Serial EEPROM. After receiving an
ACK from the AT30TSE004A, the Master transmits the data word to be programmed followed by an ACK from
the AT30TSE004A. The Master ends the Write sequence with a Stop condition during the 10th clock cycle to
initiate the internally self-timed write cycle. A Stop condition issued during any other clock cycle during the Write
operation will not trigger the internally self-timed write cycle. Once the write cycle begins, the pre-loaded data
word will be programmed in the amount of time not to exceed the tWR specification. The tWR time is defined in
more detail in Section 7.2.4 on page 31. During this time, the Master should wait a fixed amount of time set to
the tWR specification, or for time sensitive applications, an ACK polling routine can be implemented (see
Figure 7-5 on page 31). All inputs are ignored by the Serial EEPROM during the write cycle and the Serial
EEPROM will not respond until the write cycle is complete. The Serial EEPROM will increment its internal
address counter each time a byte is written.
Note:
The temperature sensor operations can be accessed during the write cycle to read the Temperature Register or
perform any other temperature sensor function.
Figure 7-3.
Byte Write to Serial EEPROM
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
0
SCL
Device Address Byte
A2 A1 A0
Word Address Byte
Data Word
1
MSB
0
1
0
0
0
A7 A6 A5 A4 A3
MSB
A2 A1 A0
D7 D6 D5 D4 D3 D2 D1 D0
MSB
SDA
Stop
by
Master
Start
by
Master
ACK
from
Slave
ACK
from
Slave
ACK
from
Slave
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29
7.2.2 Page Write
The 4-Kbit Serial EEPROM is capable of writing up to 16 data bytes at a time executing the Page Write protocol
sequence (see Figure 7-4). A partial or full Page Write operation is initiated the same as a Byte Write operation
except that the Master does not send a Stop condition after the first data word is clocked in. Instead, after the
Serial EEPROM has acknowledged receipt of the first data word, the Master can transmit up to fifteen more data
words. The device will respond with an ACK after each data word is received. The lower four bits of the data
word address are internally incremented following the receipt of each data word. The higher data word address
bits are not incremented, retaining the memory page row location. When the internally generated word address
reaches the page boundary, then the following data word is placed at the beginning of the same page. If more
than sixteen data words are transmitted to the Serial EEPROM, the data word address will roll-over and the
previous data will be overwritten. The address roll-over during a Write sequence is from the last byte of the
current page to the first byte of the same page.
The Master ends the Page Write sequence with a Stop condition during the 10th clock cycle to initiate the
internally self-timed write cycle. A Stop condition issued during any other clock cycle during the Write operation
will not trigger the internally self-timed write cycle. Once the write cycle begins, the pre-loaded data words will
be programmed in the amount of time not to exceed the tWR specification. All inputs are ignored by the Serial
EEPROM during the write cycle and the Serial EEPROM will not respond until the write cycle is complete. The
t
WR time is defined in more detail in Section 7.2.4 on page 31. During this time, the Master should wait a fixed
amount of time set to the tWR specification, or for time sensitive applications, an ACK polling routine can be
implemented (see Figure 7-5 on page 31).
Figure 7-4.
Page Write to Serial EEPROM
1
2
0
3
4
5
6
7
8
0
9
0
1
2
3
4
5
6
7
8
9
0
SCL
SDA
Device Address Byte
A2 A1 A0
Word Address Byte
1
MSB
1
0
A7 A6 A5 A4 A3 A2 A1 A0
MSB
Start
by
Master
ACK
from
Slave
ACK
from
Slave
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
0
Data Word (n)
Data Word (n+1)
Data Word (n+15)
D7 D6 D5 D4 D3 D2 D1 D0
MSB
D7 D6 D5 D4 D3 D2 D1 D0
MSB
D7 D6 D5 D4 D3 D2 D1 D0
MSB
Stop
by
Master
ACK
from
Slave
ACK
from
Slave
ACK
from
Slave
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7.2.3 Acknowledge (ACK) Polling
An ACK polling routine can be implemented to optimize time sensitive applications that would not prefer waiting
the fixed maximum write cycle time and would prefer to know immediately when the Serial EEPROM write cycle
has completed to start a subsequent operation. Once the internally self timed write cycle has started (the Stop
condition during the 10th clock cycle at the end of the Write sequence), the Serial EEPROM inputs are disabled
and ACK polling can be initiated (see Figure 7-5). An ACK polling routine involves sending a valid Start
condition followed by the device address byte. While the write cycle is in progress, the device will not respond
with an ACK indicating the Serial EEPROM is busy writing data. Once complete, the device will ACK and the
next device operation can be started.
Note:
The temperature sensor operations can be accessed during the write cycle to read the Temperature Register or
perform any other user desired temperature sensor operation.
Figure 7-5.
Acknowledge Polling Flow Chart
Send Start
Condition
Followed
Send
Stop
Did
the Device
ACK?
Send Any
YES
Continue to
Next Operation
Condition
to Initiate
Write Cycle
Write
by Valid
Protocol
Device Address
Byte
NO
7.2.4 Write Cycle Timing
The length of the self timed write cycle, or tWR, is defined as the amount of time from a valid Stop condition that
begins the internal write sequence to the Start condition of the first device address byte sent to the
AT30TSE004A that it subsequently responds to with an ACK. Figure 7-6 has been included to show this
measurement.
Figure 7-6.
Write cycle Timing
SCL
8
9
9
Data Word n
D0
ACK
ACK
SDA
First Acknowledge from the device
to a valid device address sequence after
write cycle is initiated. The minumum tWR
can only be determined through
tWR
the use of an ACK Polling routine.
Stop
Condition
Start
Condition
Stop
Condition
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31
7.3
Write Protection
The AT30TSE004A incorporates a Reversible Software Write Protection (RSWP) feature that allows the ability
to selectively write protect data stored in each of the four independent 128-byte Serial EEPROM quadrants.
Table 7-3 identifies the memory quadrant identifier with its associated quadrant, SPA and memory address
locations.
The AT30TSE004A has three RSWP software commands:
Set RSWP command for setting the RSWP.
Clear RSWP command for resetting all of the quadrants that are software write protected.
Read RSWP command for reading the RSWP status.
Table 7-3.
Serial EEPROM Memory Organization
Memory Quadrant
Identifier
Block
Quadrant 0
SPA
Address Locations
00h to 7Fh
0
0
1
1
001
100
101
000
Quadrant 1
Quadrant 2
Quadrant 3
80h to FFh
00h to 7Fh
80h to FFh
7.3.1 Set RSWP
Setting the RSWP is enabled by sending the Set RSWP command, similar to a normal Write command to the
device which programs the Write Protection to the target quadrant. The Set RSWP sequence requires sending
a control byte of ‘0110MMM0’ (where the ‘M’ represents the memory quadrant identifier for the target quadrant
to be write-protected) with the R/W bit set to a Logic 0. In conjunction with sending the protocol, the A0 pin must
be connected to VHV for the duration of RSWP sequence (see Figure 7-7 and Section 8.2). The Set RSWP
command acts on a single quadrant only as specified in the Set RSWP command and can only be reversed by
issuing the Clear RSWP command and will unprotect all quadrants in one operation (see Table 7-4).
Example:
If Quadrant 0 and Quadrant 3 are to be write-protected, two separate Set RSWP commands
would be required; however, only one Clear RSWP command is needed to clear and unprotect
both quadrants.
Table 7-4.
Set RSWP and Clear RSWP
Control Byte
Memory Quadrant
Pin
A1
X
Device Type Identifier
Identifier
R/W
Function
A2
X
A0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2 Bit 1
Bit 0
Set RSWP, Quadrant 0
Set RSWP, Quadrant 1
Set RSWP, Quadrant 2
Set RSWP, Quadrant 3
Clear RSWP
0
1
1
0
0
0
0
0
0
1
1
0
1
0
1
0
0
0
0
0
X
X
X
X
VHV
0
1
1
0
X
X
X
X
Notes: 1. X = Don’t care but recommend to be hard-wired to VCC or GND.
2. See Section 8.2 for the VHV values.
3. Due to the requirement for the A0 pin to be driven to VHV, the Set RSWP and Clear RSWP commands are fully
supported in a single DIMM (isolated DIMM) end application or single DIMM programming station only.
32
AT30TSE004A [DATASHEET]
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015
Figure 7-7.
Set RSWP and Clear RSWP
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
SCL
Control Byte
Word Address Byte
Data Word
0
MSB
1
1
0
M
M
M
0
0
X
MSB
X
X
X
X
X
X
X
0/1
X
MSB
X
X
X
X
X
X
X
0/1
SDA
Start
by
Master
Stop
by
Master
ACK
from
Slave
ACK or NACK
from
ACK or NACK
from
Slave
Slave
M = Memory Quadrant Identifier
X = Don’t care
7.3.2 Clear RSWP
Similar to the Set RSWP command, the reversible write protection on all quadrants can be reversed or
unprotected by transmitting the Clear RSWP command. The Clear RSWP sequence requires the Master to
send a Start condition followed by sending a control byte of ‘01100110’ (66h) with the R/W bit set to a Logic 0.
The AT30TSE004A should respond with an ACK. The Master transmits a word address byte and data bytes
with don’t care values. The AT30TSE004A will respond with either an ACK or NACK to both the word address
and data word. In conjunction with sending the protocol, the A0 pin must be connected to VHV for the duration of
the Clear RSWP command (see Figure 7-7 and Section 8.2). To end the Clear RSWP sequence, the Master
sends a Stop condition.
Caution:
The write protection of individual quadrants cannot be reversed separately, and executing the Clear
RSWP command will clear the write protection on all four quadrants leaving all quadrants with no
software write protection.
7.3.3 Read RSWP
The Read RSWP command allows the ability to check a quadrant’s write protection status. To find out if the
Software Write Protection has been set to a specific quadrant, the same procedure that was used to set the
quadrant’s write protection can be utilized except that the R/W select bit is set to a Logic 1, and the A0 pin is not
required to have VHV (see Table 7-6).
The Read RSWP sequence requires sending a control byte of ‘0110MMM1’ (where the ‘M’ represents the
memory quadrant identifier for the quadrant to be read) with the R/W bit set to a Logic 1 (see Figure 7-8).
If the RSWP has not been set, then the AT30TSE004A responds to the control byte with an ACK, and responds
to the word address byte and data word with a NACK. If the RSWP has been set, the AT30TSE004A responds
to all three bytes (control, word address, and data bytes) with a NACK as shown in Table 7-5.
Table 7-5.
Serial EEPROM Acknowledge When Reading Protection Status
Quadrant
Status
Instruction
Sent
Instruction
Response
Word Address
Sent
Word Address
Response
Data Word
Sent
Data Word
Response
Write Protected
Not Protected
Read RSWP
Read RSWP
NACK
ACK
Don’t Care
Don’t Care
NACK
NACK
Don’t Care
Don’t Care
NACK
NACK
AT30TSE004A [DATASHEET]
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015
33
Table 7-6.
Function
Read RSWP
Control Byte
Memory Quadrant
Pin
A1
X
Device Type Identifier
Identifier
R/W
B0
1
A2
X
A0
B7
B6
B5
B4
B3
0
B2
0
B1
1
Read RSWP, Quadrant 0
Read RSWP, Quadrant 1
Read RSWP, Quadrant 2
Read RSWP, Quadrant 3
0, 1
or
VHV
X
X
1
0
0
1
0
1
1
0
X
X
1
0
1
1
X
X
0
0
0
1
Notes: 1. X= Don’t care but recommend to be hard-wired to VCC or GND.
2. See Section 8.2 for the VHV values.
Figure 7-8.
Read RSWP
1
2
1
3
1
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
1
2
3
4
5
6
7
8
9
1
SCK
Control Byte
Word Address Byte
Data Byte
0
0
M
M
M
1
0/1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
SDA
MSB
MSB
MSB
Start
by
Master
Stop
by
Master
ACK or NACK
from
NACK
from
Master
NACK
from
Master
Slave
M = Memory Quadrant Identifier
X = Don’t care
7.4
Serial EEPROM Read Operations
All Read operations are initiated by the Master transmitting a Start bit, a device type identifier of ‘1010’ (Ah),
three software address bits (A2, A1, and A0) that match their corresponding hard-wired address pins (A2, A1,
and A0), and the R/W select bit with a Logic 1 state. In the following clock cycle, the device should respond with
an ACK. The subsequent protocol depends on the type of Read operation desired. There are three Read
operations:
Current Address Read
Random Address Read
Sequential Read
Caution:
All Read operations should be preceded by the SPA and or RPA commands to ensure the desired half of
the memory is selected. The reason this is important, for example, during a Sequential Read operation
on the last byte in the first half of the memory (address FFh) with SPA=0 (indicating first half is selected),
the internal address counter will roll-over to address 00h in the first half of memory as opposed to the first
byte in the second half of the memory. For more information on the SPA and RPA commands, see
Section 7.1.1 “Set Page Address and Read Page Address Commands” on page 26.
34
AT30TSE004A [DATASHEET]
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015
7.4.1 Current Address Read
Following a Start condition, the Master only transmits the device address byte with the R/W select bit set to a
Logic 1 (see Figure 7-9). The AT30TSE004A should respond with an ACK and then serially transmits the data
word addressed by the internal address counter. The internal data word address counter maintains the last
address accessed during the last Read or Write operation, incremented by one. This address stays valid
between operations as long as power to the device is maintained. The address roll-over during a Read is from
the last byte of the last page to the first byte of the first page of the addressed 2-Kbit (depends on the current
SPA setting). To end the command, the Master does not respond with an ACK but does generate a following
Stop condition.
Figure 7-9.
Current Address Read from Serial EEPROM
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
SCL
Device Address Byte
Data Word (n)
1
MSB
0
1
0
A2 A1 A0
1
0
D7 D6 D5 D4 D3 D2 D1 D0
MSB
1
SDA
Start
by
Master
Stop
by
Master
ACK
from
Slave
NACK
from
Master
7.4.2 Random Read
A Random Read operation allows the Master to access any memory location in a random manner and requires
a dummy write sequence to preload the starting data word address. To perform a Random Read, the device
address byte and the word address byte are transmitted to the AT30TSE004A as part of the dummy Write
sequence (see Figure 7-10). Once the device address byte and data word address are clocked in and
acknowledged by the AT30TSE004A, the Master must generate another Start condition. The Master initiates a
Current Address Read by sending another device address byte with the R/W select bit to a Logic 1. The
AT30TSE004A acknowledges the device address byte, increments its internal address counter and serially
clocks out the first data word. The device will continue to transmit sequential data words as long as the Master
continues to ACK each data word. To end the sequence, the Master responds with a NACK and a Stop
condition.
Figure 7-10. Random Read from Serial EEPROM
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
0
SCL
SDA
Device Address Byte
A2 A1 A0
Word Address Byte
1
MSB
0
1
0
0
0
A7 A6 A5 A4 A3 A2 A1 A0
MSB
Start
by
Master
ACK
from
Slave
ACK
from
Slave
Dummy Write
1
2
3
4
5
6
7
8
1
9
1
2
3
4
5
6
7
8
9
1
Data Word (n)
Device Address Byte
A2 A1 A0
1
MSB
0
1
0
0
D7 D6 D5 D4 D3 D2 D1 D0
MSB
Start
by
Master
Stop
by
Master
ACK
from
Slave
NACK
from
Master
AT30TSE004A [DATASHEET]
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015
35
7.4.3 Sequential Read
A Sequential Read operation is initiated in the same way as a Random Read operation, except after the
AT30TSE004A transmits the first data word, the Master responds with an ACK (instead of a NACK followed by
a Stop condition). As long as the AT34TSE004A receives an ACK, it will continue to increment the data word
address and serially clock out the sequential data words (see Figure 7-11). When the internal address counter is
at the last byte of the last page, the data word address will roll-over to the beginning of the selected 2-Kbit array
(depending on the SPA setting) starting at address zero, and the Sequential Read operation will continue. The
Sequential Read operation is terminated when the Master responds with a NACK followed by a Stop condition.
Figure 7-11. Sequential Read from Serial EEPROM
1
2
0
3
4
5
6
7
8
1
9
0
1
2
3
4
5
6
7
8
9
0
SCL
SDA
Device Address Byte
Data Word (n)
1
MSB
1
0
A2 A1 A0
D7 D6 D5 D4 D3 D2 D1 D0
MSB
Start
by
Master
ACK
from
Slave
ACK
from
Master
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
1
Data Word (n+1)
Data Word (n+2)
Data Word (n+x)
D7 D6 D5 D4 D3 D2 D1 D0
MSB
D7 D6 D5 D4 D3 D2 D1 D0
MSB
D7 D6 D5 D4 D3 D2 D1 D0
MSB
Stop
by
Master
ACK
from
Master
ACK
from
Master
NACK
from
Master
36
AT30TSE004A [DATASHEET]
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015
8.
Electrical Specifications
8.1
Absolute Maximum Ratings*
*Notice: Stresses beyond those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
Functional operation of the device at these ratings or any
other conditions beyond those indicated in the operational
sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods
may affect device reliability. Voltage extremes referenced in
the “Absolute Maximum Ratings” are intended to
accommodate short duration undershoot/overshoot
conditions and does not imply or guarantee functional
device operation at these levels for any extended period of
time.
Temperature under Bias. . . . . . . -40°C to +125°C
Storage Temperature . . . . . . . . -65°C to +150°C
Supply voltage
with respect to ground . . . . . . . . . .-0.5V to +4.3V
A0 Pin . . . . . . . . . . . . . . . . . . . . .-0.5V to +12.0V
All other input voltages
with respect to ground . . . . . .-0.5V to VCC + 0.5V
EVENT Pin . . . . . . . . . . . . . .-0.5V to VCC + 0.3V
Pull-up voltages applied to the EVENT Pin that exceed the
“Absolute Maximum Ratings” may forward bias the ESD
protection circuitry. Doing so may result in improper device
function and may corrupt temperature measurements.
All other output voltages
with respect to ground . . . . . .-0.5V to VCC + 0.5V
8.2
DC Characteristics
Applicable over recommended operating range: TAI = -20°C to +125°C, VCC = 1.7V to 3.6V (unless otherwise noted).
Symbol
VCC1
Parameter
Test Condition
Min
1.7
2.2
Typ
Max
3.6
Units
Supply Voltage
Supply Voltage
V
V
VCC2
3.6
ICC1
ICC2
ICC3
Supply Current(2)
Supply Current(2)
Temp Sensor
VCC = 3.6V
VCC = 3.6V
VCC = 3.6V
Read at 100kHz
0.4
1.5
0.2
1.0
3.0
0.5
mA
mA
mA
Write at 100kHz
EE Inactive
VCC = 1.7V
VIN = VCC or VSS
VIN = VCC or VSS
1.6
1.6
0.1
0.1
3.0
4.0
μA
μA
μA
μA
V
ISB
Standby Current(3)
VCC = 3.6V
ILI
Input Leakage Current
Output Leakage Current
Input Low Level(1)
VIN = VCC or VSS
2.0
ILO
VIL
VOUT = VCC or VSS
2.0
-0.5
0.3 * VCC
VIH
Input High Level(1)
0.7 * Vcc
Vcc + 0.5
0.4
V
V
VOL1
VOL2
VCC > 2V
IOL = 3mA
Low-Level Output Voltage
Open-Drain
VCC ≤ 2V
IOL = 2mA
0.2 * VCC
V
VOL = 0.4V
VOL = 0.6V
VOL = 0.4V
Freq ≤ 400kHz
Freq ≤ 400kHz
Freq > 400kHz
3.0
6.0
mA
mA
mA
IOL
Low-Level Output Current
A0 Pin High Voltage
20.0
VHV
VHV - VCC ≥ 4.8V
7
10
V
V
V
VHYST1
VHYST2
Notes: 1.
Input Hysteresis (SDA, SCL) VCC < 2V
0.10 * VCC
0.05 * VCC
Input Hysteresis (SDA, SCL) VCC ≥ 2V
V
IL min and VIH max are reference only and are not tested.
2. TS in Shutdown mode.
3. Serial EEPROM inactive, TS in Shutdown mode.
AT30TSE004A [DATASHEET]
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015
37
8.3
AC Characteristics
Applicable over recommended operating range: TAI = -20°C to +125°C, VCC = 1.7V to 3.6V, CL = 1 TTL Gate and 100μF
(unless otherwise noted).
VCC < 2.2V
100kHz
VCC ≥ 2.2V
400kHz 1000kHz
Symbol
fSCL
Parameter
Min
10(2)
4700
4000
Max
Min
Max
Min
Max
Units
kHz
ns
Clock Frequency, SCL
Clock Pulse Width Low
Clock Pulse Width High
Noise Suppression Time
100
10(2)
1300
600
400
10(2)
500
260
1000
tLOW
tHIGH
tI
ns
50
50
50
ns
Time the bus must be free before a
new transmission can start(1)
tBUF
4700
1300
500
ns
tHD.STA
tSU.STA
tHD.DI
tSU.DAT
tR
Start Hold Time
4000
4700
0
600
600
0
260
260
0
ns
ns
ns
ns
ns
ns
ns
ns
ms
ms
Start Set-up Time
Data In Hold Time
Data In Set-up Time
Inputs Rise Time(1)
Inputs Fall Time(1)
Stop Set-up Time
Data Out Hold Time
Write Cycle Time
Timeout Time
250
100
20
50
1000
300
300
300
120
120
tF
20
tSU.STO
tHD.DAT
tWR
4000
200
600
200
260
0
3450
5
900
5
350
5
tOUT
25
35
25
35
25
35
EEPROM
Write Endurance
Write
Cycles
25°C, Page Mode(1)
1,000,000
Notes: 1. This parameter is ensured by characterization only.
2. The minimum frequency is specified at 10kHz to avoid activating the timeout feature.
Figure 8-1.
SCL: Serial Clock
SDA: Serial Data I/O
tHIGH
tF
tR
tLOW
tLOW
SCL
SDA
tSU.STA
tHD.STA
tHD.DAT
tSU.DAT
tSU.STO
tBUF
38
AT30TSE004A [DATASHEET]
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015
8.4
Temperature Sensor Characteristics
Applicable over recommended operating range: TAI = -20°C to +125°C, VCC = 1.7V to 3.6V (unless otherwise noted).
Freq. ≤ 400kHz
Freq. > 400kHz
Symbol Parameter
Test Condition
Min
Typ
±0.5
±1.0
±2.0
75.0
0.125
Max
Min
Typ
±0.5
±1.0
±2.0
75.0
0.125
Max
Units
°C
+75°C < Ta < +95°C
+40°C < Ta < +125°C
-20°C < Ta < +125°C
±1.0
±2.0
±1.0
±2.0
TS Accuracy
TACC
°C
(B-grade)
±3.0
±3.0
°C
TCONV
TRES
TS Conversion Time
TS Resolution
125.0
125.0
ms
°C
8.5
Pin Capacitance(1)
Applicable over recommended operating range from TA = +25°C, f = 1MHz, VCC = 1.7V – 3.6V.
Symbol Test condition
Max
8
Units
pF
Conditions
C
C
Input/Output Capacitance (SDA, EVENT)
V
= 0V
= 0V
I/O
I/O
Input Capacitance (A0, A1, A2, SCL)
6
pF
V
IN
IN
Note:
1. This parameter is ensured by characterization only.
AT30TSE004A [DATASHEET]
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015
39
9.
Ordering Code Detail
A T 3 0 T S E 0 0 4 A - M A 5 M - T
Atmel Designator
Product Family
Shipping Carrier Option
B = Bulk (Tubes)
T
= Tape and Reel
Voltage Option
M = 1.7V to 3.6V
30TSE = Digital Temperature Sensor
with Integrated EEPROM
Sensor Type
Device Grade
5
= Green, NiPdAu Lead Finish
Temperature Range
(-20°C to +125°C)
Device Density
4 = 4-kilobit
Package Option
MA = 8-lead, 2.0 x 3.0 x 0.6mm (UDFN)
MAA = 8-lead, 2.0 x 3.0 x 0.8mm (WDFN)
Device Revision
10. Ordering Information
Operating
Voltage
Operational
Ordering Code(1)
Package Lead Finish
Max. Frequency
Range
AT30TSE004A-MA5M-T(2)
AT30TSE004A-MAA5M-T(2)
8MA2
8MAA
NiPdAu
1.7V to 3.6V
1000kHz
–20C to 125C
Notes: 1. Consistent with the general semiconductor market trend, Atmel will supply devices with either gold or copper
bond wires to increase manufacturing flexibility and ensure a long-term continuity of supply. There is no
difference in product quality, reliability, or performance between the two variations.
2. T = Tape and Reel
UDFN and WDFN= 5,000 per reel
Package Type
8MA2
8MAA
8-lead, 2.0 x 3.0 x 0.6mm, Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead (UDFN)
8-lead, 2.0 x 3.0 x 0.8mm, Thermally Enhanced Plastic Very Very Thin Dual Flat No Lead (WDFN)
40
AT30TSE004A [DATASHEET]
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015
11. Part Markings
AT30TSE004A: Package Marking Information
8-lead UDFN
2.0 x 3.0 mm Body
8-lead WDFN
2.0 x 3.0 mm Body
T8A
T8A
5M@
YXX
5M@
YXX
Note 1:
Designates pin 1
Note 2: Package drawings are not to scale
Catalog Number Truncation
AT30TSE004A
Truncation Code ###: T8A
Date Codes
Voltages
Y = Year
2: 2012
3: 2013
4: 2014
5: 2015
M = Month
WW = Work Week of Assembly
% = Minimum Voltage
M: 1.7V min
6: 2016
7: 2017
8: 2018
9: 2019
A: January
B: February
...
02: Week 2
04: Week 4
...
L: December
52: Week 52
Country of Assembly
Lot Number
AAA...A = Atmel Wafer Lot Number
Grade/Lead Finish Material
@ = Country of Assembly
5: Industrial
(-20°C to 125°C)
NiPdAu
Trace Code
Atmel Truncation
XX = Trace Code (Atmel Lot Numbers Correspond to Code)
Example: AA, AB.... YZ, ZZ
AT: Atmel
ATM: Atmel
ATML: Atmel
3/8/13
TITLE
DRAWING NO.
REV.
30TSE004ASM, AT30TSE004A Package Marking Information
30TSE004A
A
Package Mark Contact:
DL-CSO-Assy_eng@atmel.com
AT30TSE004A [DATASHEET]
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015
41
12. Package Drawings
12.1 8MA2 — 8-pad UDFN
E
1
8
7
6
5
Pin 1 ID
2
3
4
D
C
TOP VIEW
E2
SIDE VIEW
A2
A
A1
b (8x)
8
1
2
3
4
COMMON DIMENSIONS
(Unit of Measure = mm)
7
6
5
Pin#1 ID
D2
MIN
0.50
MAX
0.60
NOM
0.55
NOTE
SYMBOL
A
A1
A2
D
0.0
-
0.02
-
0.05
0.55
2.10
1.60
3.10
1.40
0.30
e (6x)
L (8x)
BOTTOM VIEW
K
1.90
1.40
2.90
1.20
0.18
2.00
D2
E
1.50
3.00
Notes:
1. This drawing is for general information only. Refer to
Drawing MO-229, for proper dimensions, tolerances,
datums, etc.
E2
b
1.30
0.25
3
2. The Pin #1 ID is a laser-marked feature on Top View.
3. Dimensions b applies to metallized terminal and is
measured between 0.15 mm and 0.30 mm from the
terminal tip. If the terminal has the optional radius on
the other end of the terminal, the dimension should
not be measured in that radius area.
C
1.52 REF
0.35
L
0.30
0.20
0.40
-
e
0.50 BSC
-
K
4. The Pin #1 ID on the Bottom View is an orientation
feature on the thermal pad.
11/26/14
TITLE
DRAWING NO.
REV.
GPC
8MA2, 8-pad 2 x 3 x 0.6mm Body, Thermally
YNZ
8MA2
G
Package Drawing Contact:
packagedrawings@atmel.com
Enhanced Plastic Ultra Thin Dual Flat No-Lead
Package (UDFN)
42
AT30TSE004A [DATASHEET]
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015
12.2 8MAA — 8-pad WDFN
TOP VIEW
BOTTOM VIEW
A
D2
b
(8X)
Pin 1
Index
Area
E2
E
Pin 1 ID
L (8X)
D
e (6X)
A2
A1
1.50 REF.
A3
COMMON DIMENSIONS
(Unit of Measure = mm)
SIDE VIEW
MIN
0.70
MAX
0.80
NOM
0.75
NOTE
SYMBOL
A
A1
A2
A3
D
0.00
0.45
0.02
0.55
2.0 REF
2.00
-
0.05
0.65
1.90
1.20
2.90
1.20
0.18
0.30
2.10
1.60
3.10
1.60
0.30
0.45
D2
E
3.00
-
Notes:
1. This drawing is for general information only. Refer to JEDEC
Drawing MO-229, WCED-3, for proper dimensions,
E2
b
tolerances, datums, etc.
0.25
–
2
2. Dimension b applies to metallized terminal and is measured
between 0.15 mm and 0.30 mm from the terminal tip. If the
terminal has the optional radius on the other end of the terminal,
the dimension should not be measured in that radius area.
3. Soldering the large thermal pad is optional, but not recommended.
No electrical connection is accomplished to the device through
this pad, so if soldered it should be tied to ground
L
e
0.50 BSC
09/11/12
TITLE
DRAWING NO.
REV.
GPC
8MAA, 8-pad 2.0 x 3.0mm Body, 0.50mm Pitch
Very, Very Thin Dual No Lead Package
(WDFN) (Sawn)
YRV
8MAA
A
Package Drawing Contact:
packagedrawings@atmel.com
AT30TSE004A [DATASHEET]
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015
43
13. Revision History
Doc. Rev.
Date
Comments
Updated the Set Page Address and Read Page Address Commands, AC Characteristics
table, and the 8MA2 package drawing.
8868D
10/2015
8868C
8868B
8868A
12/2013
07/2013
04/2013
Updated Section, “Power-up Conditions” and Figure, “Power-up Timing”.
Updated the Absolute Maximum Ratings.
Initial document release.
FunctionZZ_Summary Notes
44
AT30TSE004A [DATASHEET]
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015
X X
X X X X
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