AT30TSE004A-MA5M-T [MICROCHIP]

SENSOR TEMPERATURE I2C 8UDFN;
AT30TSE004A-MA5M-T
型号: AT30TSE004A-MA5M-T
厂家: MICROCHIP    MICROCHIP
描述:

SENSOR TEMPERATURE I2C 8UDFN

输出元件 传感器 换能器
文件: 总45页 (文件大小:1414K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
AT30TSE004A  
Integrated Temperature Sensor with Serial EEPROM  
DATASHEET  
Features  
Integrated Temperature Sensor (TS) + 4-Kbit Serial EEPROM  
JEDEC JC42.4 (TSE2004av) DIMM Serial Presence Detect (SPD) + TS  
compliant  
Low voltage operation  
̶
Optimized for VCC range of 1.7V to 3.6V  
2-wire serial interface: I2C Fast Mode Plus (FM+) compatible  
̶
̶
100kHz, 400kHz, and 1MHz compatibility  
Bus Timeout supported  
Schmitt Trigger, filtered inputs for noise suppression  
Industry standard green (Pb/Halide-free/RoHS compliant) package options  
̶
̶
8-pad Ultra Thin DFN (2 x 3 x 0.6mm)  
8-pad Very Very Thin DFN (2 x 3 x 0.8mm)  
Temperature Sensor Features  
Highly accurate B-grade temp. measurements requiring no external  
components  
̶
̶
̶
±1.0°C accuracy (maximum) over the +75°C to +95°C range  
±2.0°C accuracy (maximum) over the +40°C to +125°C range  
±3.0°C accuracy (maximum) over the -20°C to +125°C range  
11-bit ADC temperature-to-digital converter with 0.125°C resolution  
Programmable hysteresis threshold: off, 0°C, 1.5°C, 3°C, and 6°C  
Low operating current  
̶
Temperature sensor active ~0.2mA (typical)  
Serial EEPROM Features  
Integrates 4-Kbits of Serial EEPROM  
̶
Internally organized into four quadrants of 128-bytes each  
Individual Reversible Software Write Protection on all four 128-byte quadrants  
Supports byte and Page Write operations  
Self-timed write cycle (5ms maximum)  
High-reliability  
̶
̶
Endurance: 1,000,000 write cycles  
Data retention: 100 years  
Low operating current  
̶
̶
Serial EEPROM Write ~1.5mA (typical)  
Serial EEPROM Read ~0.2mA (typical)  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
Table of Contents  
1. Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
2. Pin Descriptions and Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
3. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
4. Device Communication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
4.1  
4.2  
4.3  
4.4  
4.5  
4.6  
Start Condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Stop Condition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Acknowledge (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
No-Acknowledge (NACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Standby Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Device Reset and Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
4.6.1  
Power-Up Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
4.7  
4.8  
Timeout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
2-wire Software Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
5. Device Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
6. Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
6.1  
Functional Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
6.1.1  
6.1.2  
EVENT Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Alarm Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
6.2  
Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
6.2.1  
6.2.2  
6.2.3  
6.2.4  
6.2.5  
6.2.6  
6.2.7  
Pointer Register (8-bit Write Only, Address = N/A) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Capability Register (16-bit Read-only, Address = 00h) . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Configuration Register (16-bit Read/Write, Address = 01h) . . . . . . . . . . . . . . . . . . . . . . . 15  
Upper Limit Register (16-bit Read/Write, Address = 02h) . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Lower Limit Register (16-bit Read/Write, Address = 03h) . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Critical Alarm Register (16-bit Read/Write, Address = 04h) . . . . . . . . . . . . . . . . . . . . . . . 20  
Temperature Register (16-bit Read-only, Address = 05h) . . . . . . . . . . . . . . . . . . . . . . . . 21  
6.2.7.1  
Temperature Register Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
6.2.8  
6.2.9  
Manufacturer ID Register (16-bit Read-only, Address = 06h) . . . . . . . . . . . . . . . . . . . . . . 23  
Device ID Register (16-bit Read-only, Address = 07h) . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
6.3  
6.4  
Temperature Sensor Write Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
Temperature Sensor Read Operations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
7. Serial EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26  
7.1  
Memory Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26  
7.1.1 Set Page Address and Read Page Address Commands . . . . . . . . . . . . . . . . . . . . . . . . . 26  
Serial EEPROM Write Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
7.2  
7.2.1  
7.2.2  
7.2.3  
7.2.4  
Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29  
Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
Acknowledge (ACK) Polling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31  
Write Cycle Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31  
7.3  
Write Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32  
7.3.1  
7.3.2  
7.3.3  
Set RSWP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32  
Clear RSWP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
Read RSWP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
2
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
7.4  
Serial EEPROM Read Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34  
7.4.1  
7.4.2  
7.4.3  
Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35  
Random Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35  
Sequential Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36  
8. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37  
8.1  
8.2  
8.3  
8.4  
8.5  
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37  
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37  
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38  
Temperature Sensor Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39  
Pin Capacitance(1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39  
9. Ordering Code Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40  
10. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40  
11. Part Markings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41  
12. Package Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42  
12.1 8MA2 — 8-pad UDFN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42  
12.2 8MAA — 8-pad WDFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43  
13. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
3
1.  
Description  
The Atmel® AT30TSE004A is a combination Serial EEPROM and temperature sensor device containing 4096-  
bits of Serially Electrically Erasable and Programmable Read-Only Memory (EEPROM) organized as 512-bytes  
of eight bits each. The Serial EEPROM operation is tailored specifically for DRAM memory modules with Serial  
Presence Detect (SPD) to store a module’s vital product data such as the module’s size, speed, voltage, data  
width, and timing parameters.  
The AT30TSE004A is protocol compatible with the legacy JEDEC TSE2002av specification (2-Kbit) devices  
enabling the AT30TSE004A to be utilized in legacy applications without any software changes. The Serial  
EEPROM deploys special software commands to allow users to identify and set which half of the memory the  
internal address counter is located. This special page addressing method used to select the upper or lower half  
of the Serial EEPROM is the key to the legacy compatibility; however, there is one minor exception to the legacy  
compatibility as the AT30TSE004A does not support the Permanent Write Protection feature because it was  
removed from the JEDEC TSE2004a (DDR4) specification.  
In addition, the Serial EEPROM incorporates a Reversible Software Write Protection (RSWP) feature enabling  
the ability to selectively write protect any or all of the four 128-byte quadrants. Once the RSWP is set, it can only  
be reversed by sending a special software command sequence.  
The integrated temperature sensor converts temperatures from -20C to +125C to a digital word and provides  
an accuracy of ±1°C (max.) in the temperature range +75C to +95C. The temperature sensor continuously  
monitors temperature and updates the data in the Temperature Register at least eight times per second. The  
temperature data is latched internally by the device and may be read by software via a bus Master at anytime  
(even when the Serial EEPROM is busy writing data to the memory).  
The AT30TSE004A incorporates flexible user programmable internal registers to configure the temperature  
sensor’s performance and response to over and under temperature conditions. The device contains flexible  
programmable high, low, and critical temperature limits. The EVENT pin is an active low output and can be  
configured to operate as an Interrupt or as a Comparator output. The Manufacturer and Device ID Registers  
provide the ability to confirm the identity of the device. The AT30TSE004A supports the industry standard 2-wire  
I2C FM plus (Fast Mode +) serial interface allowing device communication to operate up to 1MHz. A bus timeout  
feature is supported for both temperature sensor and Serial EEPROM operations to help prevent system lock-  
ups. The AT30TSE004A is available in space saving 8-lead UDFN and WDFN packages.  
The UDFN is the recommended and preferred package.  
4
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
2.  
Pin Descriptions and Pinouts  
Table 2-1.  
Pin Descriptions  
Asserted  
State  
Symbol  
Name and Function  
Type  
Serial Clock: The SCL pin is used to provide a clock to the device and is used  
to control the flow of data to and from the device. Command and input data  
present on the SDA pin is always latched in on the rising edge of SCL, while  
output data on the SDA pin is always clocked out on the falling edge of SCL.  
SCL  
Input  
The SCL pin must either be forced high when the serial bus is idle or pulled-high  
using an external pull-up resistor.  
Serial Data: The SDA pin is an open-drain bidirectional input/output pin used to  
serially transfer data to and from the device.  
Input/  
Output  
SDA  
The SDA pin must be pulled-high using an external pull-up resistor (not to  
exceed 8Kin value) and may be wire-ORed with any number of other  
open-drain or open-collector pins from other devices on the same bus.  
EVENT: The EVENT pin is an open-drain output pin used to indicate when the  
temperature goes beyond the user-programmed temperature limits. The EVENT  
pin can be operated in one of three different modes; either Interrupt,  
Comparator, or Critical Alarm Modes. The ALERT pin must be pulled-high using  
an external pull-up resistor for proper operation.  
EVENT  
Output  
Input  
Device Address Inputs: The A0, A1, and A2 pins are used to select the device  
address and corresponds to the three Least-Significant Bits (LSB) of the I2C  
FM+ seven bit slave address. These pins can be directly connected to VCC or  
GND in any combination, allowing up to eight devices on the same bus.  
A2, A1, A0  
The A0 pin is also an overvoltage tolerant pin, allowing up to 10V to support the  
Reversible Software Write Protection (RSWP) feature (see Section 7.3 “Write  
Protection” on page 32).  
Device Power Supply: The VCC pin is used to supply the source voltage to the  
device. Operations at invalid VCC voltages may produce spurious results and  
should not be attempted.  
VCC  
Power  
Power  
Ground: The ground reference for the power supply. GND should be connected  
to the system ground.  
GND  
Figure 2-1.  
Pinout  
UDFN / WDFN  
A
A
A
1
2
3
4
8
7
6
5
V
0
1
2
CC  
EVENT  
SCL  
SDA  
GND  
Top View  
Note:  
UDFN is the recommended and preferred package. The metal pad on the bottom of the UDFN/WDFN  
package is not internally connected to a voltage potential. This pad can be a “no connect” or connected to GND.  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
5
3.  
Block Diagram  
Serial EEPROM  
Temperature Sensor  
Selected Resolution  
Temp. Range  
Accuracy  
H.V Pump/Timing  
Capability  
Configuration  
Critical Alarm Trip  
Device ID  
Output Feature  
EVENT Shutdown  
Timeout  
EEPROM Quadrant 0  
SPA = 0, (00h-7Fh)  
EEPROM Quadrant 1  
SPA = 0, (80h-FFh)  
X Address  
Decoder  
EEPROM Quadrant 2  
SPA = 1, (00h-7Fh)  
Manufacturer ID  
Temperature  
EEPROM Quadrant 3  
SPA= 1, (80h-FFh)  
A/D  
Converter  
Upper Alarm Trip  
Y Address Decoder  
Memory  
Control Logic  
Lower Alarm Trip  
Timeout  
Band Gap  
Temperature  
Sensor  
Write Protect Circuitry  
Pointer  
Register  
Serial  
Control Logic  
I2C  
Interface  
GND  
A
A
A
SCL SDA  
VCC  
EVENT  
2
0
1
6
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
 
4.  
Device Communication  
The AT30TSE004A operates as a slave device and utilizes a simple 2-wire digital serial interface, compatible  
with the I2C Fast Mode Plus (I2C FM+) protocol, to communicate with a host controller, commonly referred to as  
the bus Master. The Master initiates and controls all Read and Write operations to the slave devices on the  
serial bus, and both the Master and the slave devices can transmit and receive data on the bus.  
The serial interface is comprised of just two signal lines: the Serial Clock (SCL) and the Serial Data (SDA). The  
SCL pin is used to receive the clock signal from the Master, while the bidirectional SDA pin is used to receive  
command and data information from the Master, as well as, to send data back to the Master. Data is always  
latched into the AT30TSE004A on the rising edge of SCL and is always output from the device on the falling  
edge of SCL. Both the SCL and SDA pin incorporate integrated spike suppression filters and Schmitt Triggers to  
minimize the effects of input spikes and bus noise.  
All command and data information is transferred with the Most-Significant Bit (MSB) first. During the bus  
communication, one data bit is transmitted every clock cycle, and after eight bits (one byte) of data has been  
transferred, the receiving device must respond with either an acknowledge (ACK) or a no-acknowledge (NACK)  
response bit during a ninth clock cycle (ACK/NACK clock cycle) generated by the Master; therefore, nine clock  
cycles are required for every one byte of data transferred. There are no unused clock cycles during any Read or  
Write operation so there must not be any interruptions or breaks in the data stream during each data byte  
transfer and ACK or NACK clock cycle.  
During data transfers, data on the SDA pin must only change while SCL is low, and the data must remain stable  
while SCL is high. If data on the SDA pin changes while SCL is high, then either a Start or a Stop condition will  
occur. Start and Stop conditions are used to initiate and end all serial bus communication between the Master  
and the slave devices.The number of data bytes transferred between a Start and a Stop condition is not limited  
and is determined by the Master.  
In order for the serial bus to be idle, both the SCL and SDA pins must be in the Logic 1 state at the same time.  
4.1  
4.2  
4.3  
Start Condition  
A Start condition occurs when there is a high-to-low transition on the SDA pin while the SCL pin is stable in the  
Logic 1 state. The Master uses a Start condition to initiate any data transfer sequence, and the Start condition  
must precede any command. AT30TSE004A will continuously monitor the SDA and SCL pins for a Start  
condition, and the device will not respond unless one is given. Please refer to Figure 4-1 on page 8 for more  
details.  
Stop Condition  
A Stop condition occurs when there is a low-to-high transition on the SDA pin while the SCL pin is stable in the  
Logic 1 state. The Master uses the Stop condition to end a data transfer sequence to the AT30TSE004A which  
will subsequently return to the idle state. The Master can also utilize a repeated Start condition instead of a Stop  
condition to end the current data transfer if the Master will perform another operation. Please refer to Figure 4-1  
on page 8 for more details.  
Acknowledge (ACK)  
After every byte of data is received, AT30TSE004A must acknowledge to the Master that it has successfully  
received the data byte by responding with an ACK. This is accomplished by the Master first releasing the SDA  
line and providing the ACK/NACK clock cycle (a ninth clock cycle for every byte). During the ACK/NACK clock  
cycle, the AT30TSE004A must output a Logic 0 (ACK) for the entire clock cycle such that the SDA line must be  
stable in the Logic 0 state during the entire high period of the clock cycle. Please refer to Figure 4-1 on page 8  
for more details.  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
7
4.4  
No-Acknowledge (NACK)  
When the AT30TSE004A is transmitting data to the Master, the Master can indicate that it is done receiving data  
and wants to end the operation by sending a NACK response to the AT30TSE004A instead of an ACK  
response. This is accomplished by the Master outputting a Logic 1 during the ACK/NACK clock cycle, at which  
point the AT30TSE004A will release the SDA line so that the Master can then generate a Stop condition.  
In addition, the AT30TSE004A can use a NACK to respond to the Master instead of an ACK for certain invalid  
operation cases such as an attempt to Write to a read-only register (e.g. an attempt to Write to the Temperature  
Register).  
Figure 4-1.  
Start, Stop, and ACK  
SDA  
Must Be  
Stable  
SDA  
Must Be  
Stable  
Acknowledge Window  
9
1
2
8
SCL  
SDA  
Stop  
Condition  
Acknowledge  
Valid  
Start  
Condition  
The transmitting device (Master or Slave) must  
release the SDA line at this point to allow the  
the receiving device (Master or Slave) to drive  
the SDA line low to ACK the previous 8-bit word.  
The receiver (Master or Slave)  
must release the SDA line at  
this point to allow the transmitter  
to continue sending new data.  
SDA  
Change  
Allowed  
SDA  
Change  
Allowed  
4.5  
4.6  
Standby Mode  
The AT30TSE004A incorporates a low-power Standby Mode which is enabled:  
Upon power-up or  
After the receipt of the Stop condition and the completion of any internal operations.  
Device Reset and Initialization  
The AT30TSE004A incorporates an internal Power-On Reset (POR) circuit to help prevent inadvertent  
operations during power-up and power-down cycles. On a cold power-up, the supply voltage must rise  
monotonically between V  
and V  
without any ring back to ensure a proper power-up (see Figure  
POR(max)  
CC(min)  
4-2 on page 9). Once the supply voltage has passed the V  
threshold, the device’s internal reset process  
POR(min)  
is initiated. Completion of the internal reset process occurs within the tINIT time listed in Table 4.6.1 on page 9.  
Upon completion of the internal reset process, the device will have the following power-on default conditions:  
Temperature sensor starts monitoring temperature continuously.  
Pointer Register = 00h  
Upper Limit, Lower Limit, and Critical Alarm Registers are set to 0C.  
EVENT pin is pulled high by the external pull up resistor.  
Operational mode is Comparator.  
Hysteresis level is set to 0C.  
EVENT pin polarity is set low.  
EVENT output is disabled and not asserted.  
Serial EEPROM’s SPA = 0.  
8
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
Table 6-1 on page 13 shows the power-on register default values. The Upper Limit, Lower Limit, Critical Alarm,  
and Configuration Registers should be programmed to their user desired values before the temperature sensor  
can properly function. Before selecting the device and issuing protocol, a valid and stable supply voltage must  
be applied and no protocol should be issued to the device for the time specified by the tINIT parameter. The  
supply voltage must remain stable and valid until the end of the protocol transmission, and for a Serial EEPROM  
Write instruction, until the end of the internal write cycle.  
Figure 4-2.  
Power-Up Timing  
Cold  
Power-On Reset  
Warm  
Power-On Reset  
VCC  
Device Access  
Permitted  
tINIT  
VCC (min)  
tPOR  
VPOR (max)  
VPOR (min)  
Do Not Attempt  
Device Access  
During This Time  
tPOFF  
Time  
4.6.1 Power-Up Conditions  
Symbol  
tPOR  
Parameter  
Min  
Max  
Units  
ms  
V
Power-on Reset Time  
10.0  
Power-on Reset Threshold  
1.6  
vPON  
vPOFF  
tPOFF  
tINIT  
Power-off Threshold for Warm Power-on Cycle  
Warm Power Cycle Off Time  
0.9  
V
1.0  
ms  
ms  
Time from Power-On to First Command  
10.0  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
9
4.7  
Timeout  
The AT30TSE004A supports the industry standard bus Timeout feature on both temperature sensor and Serial  
EEPROM operations to help prevent potential system bus hang-ups. The device resets its serial interface and  
will stop driving the bus (will let SDA float high) if the SCL pin is held low for more than the minimum Timeout  
(tOUT) specification. The AT30TSE004A will be ready to accept a new Start condition before the maximum tOUT  
has elapsed (see Figure 4-3). This feature does require a minimum SCL clock speed of 10kHz to avoid any  
timeout issues.  
Figure 4-3.  
Timeout  
tTIMEOUT  
(MAX)  
tTIMEOUT  
(MIN)  
SCL  
Device will release Bus and  
be ready to accept a new  
Start Condition within this Time  
4.8  
2-wire Software Reset  
After an interruption in protocol, power loss, or system reset, any 2-wire part can be reset by following these  
steps:  
1. Create a Start condition.  
2. Clock nine cycles.  
3. Create another Start condition followed by Stop condition as shown in Figure 4-4.  
Figure 4-4.  
2-wire Software Reset  
Dummy Clock Cycles  
3
1
2
8
9
SCL  
Start  
Condition  
Start  
Condition  
Stop  
Condition  
SDA  
10  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
 
 
 
5.  
Device Addressing  
The AT30TSE004A is designed to allow the Serial EEPROM and the temperature sensor to operate in parallel  
while executing valid command protocol. For example, when the temperature sensor is busy during a  
temperature conversion cycle, it is possible to perform any Serial EEPROM operation during this time and vice  
versa.  
The device requires a 7-bit device address and a Read/Write select bit following a Start condition from the  
Master to initiate communication with either the temperature sensor or the Serial EEPROM. The device address  
byte is comprised of a 4-bit device type identifier followed by three device address bits (A2, A1,and A0) and a  
R/W bit and is clocked by the Master on the SDA pin with the Most Significant Bit first (see Table 5-1).  
The AT30TSE004A will respond to three unique device type identifiers. The device type identifier of  
‘1010’(Ah) is necessary to select the device for reading or writing. The device type identifier of ‘0110’(6h)  
has multiple purposes. First, it is used to access the page address function which determines what the internal  
address counter is set to. For more information on accessing the page address function, please refer to Section  
7.1.1 “Set Page Address and Read Page Address Commands” on page 26 The device type identifier of  
‘0110’(6h) is also used to access the Software Write Protection feature of the device. Information on the  
Software Write Protection functionality can be found in Section 7.3 “Write Protection” on page 32.  
Table 5-1.  
AT30TSE004A Device Address Byte  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Function  
Device Type Identifier  
Device Address  
Read/Write  
Serial EEPROM  
Read/Write  
1
0
0
0
1
0
1
1
1
0
0
1
A2  
A2  
A2  
A1  
A1  
A1  
A0  
A0  
A0  
R/  
R/  
R/  
W
W
W
Serial EEPROM Write  
Protection and Page  
Address Functions  
Temperature Sensor  
The software device address bits (A2, A1, and A0) must match their corresponding hard-wired device address  
inputs (A2, A1 and A0) allowing up to eight devices on the bus at the same time (see Table 5-2). The eighth bit of  
the address byte is the R/W operation selection bit. A Read operation is selected if this bit is a Logic 1, and a  
Serial EEPROM Write operation is selected if this bit is a Logic 0. Upon a compare of the device address byte,  
the AT30TSE004A will output an ACK during the ninth clock cycle; if a compare is not true, the device will output  
a NACK during the ninth clock cycle and return the device to the low-power Standby Mode.  
Table 5-2.  
Device Address Combinations  
Software Device Address Bits  
Hard-wired Device Address Inputs  
A2, A1, A0  
0 0 0  
A2  
A1  
A0  
GND  
GND  
GND  
GND  
VCC  
GND  
GND  
VCC  
GND  
VCC  
0 0 1  
0 1 0  
GND  
VCC  
0 1 1  
VCC  
1 0 0  
GND  
GND  
VCC  
GND  
VCC  
1 0 1  
VCC  
1 1 0  
VCC  
GND  
VCC  
1 1 1  
VCC  
VCC  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
11  
 
 
6.  
Temperature Sensor  
6.1  
Functional Description  
The temperature sensor consists of a Delta-Sigma Analog to Digital Converter (ADC) with a band gap type  
temperature sensor that monitors and updates its temperature measurement at least eight times per second  
converting the temperature readings into digital data bits and latching them into the Temperature Register that  
can be read via the 2-wire I2C FM+ serial interface.  
The device communicates over a 2-wire I2C FM+ interface with a Master consisting of a Serial Clock (SCL) and  
a Serial Bidirectional Data Bus (SDA) with clock frequencies up to 1MHz. The Master generates the SCL signal  
and is used by the AT30TSE004A to receive and send serial data on the SDA line with the Most Significant Bit  
transferred first. A pull-up resistor is required on the SDA pin since it has an open drain configuration.  
6.1.1 EVENT Output  
The EVENT pin has three operating modes depending on the configuration settings:  
Interrupt Mode  
Comparator Mode  
Critical Alarm (Crit_Alarm) Mode  
While in Interrupt Mode, once a temperature reaches a boundary limit, the AT30TSE004A asserts the EVENT  
pin. The EVENT pin will remain asserted until the system clears the interrupt by writing a Logic 1 to the EVTCLR  
bit five in the Configuration Register. When the temperature drops below specified limits, the device returns  
back to either Interrupt or Comparator Mode as programmed in the Configuration Register’s EVTMOD bit zero.  
In Comparator Mode, the EVENT pin remains asserted until the error condition that caused the pin to be  
asserted no longer exists and the EVENT pin will clear itself. In the Crit_Alarm Mode, when the measured  
temperature exceeds Crit_Alarm limit, the EVENT pin will remain asserted until the temperature drops below the  
Crit_Alarm limit minus hysteresis (see Figure 6-1 on page 17). All event thresholds use hysteresis as  
programmed in the Configuration Register.  
6.1.2 Alarm Window  
The Alarm Window consists of the Upper Limit Register and Lower Limit Register. The Upper Limit Register  
holds the upper temperature trip point and the Lower Limit Register holds the lower temperature trip point. After  
the EVENT pin control is enabled, the EVENT output will be triggered upon entering and exiting from this  
window.  
6.2  
Register Descriptions  
This section describes all the temperature sensor registers that are used in the AT30TSE004A. The  
AT30TSE004A contains several registers that are user accessible and/or programmable and utilized for latching  
the temperature readings, storing high, low, and critical temperature limits, configuring the temperature sensor  
performance, and reporting temperature sensor status.  
These registers include a Capability Register, Configuration Register, Upper Limit Register, Lower Limit  
Register, Critical Alarm Register, Temperature Register, Manufacturer Identification Register, and a Device  
Identification/Device Revision Register.  
The AT30TSE004A utilizes an 8-bit Pointer Register to access the 16-bit registers. Table 6-1 indicates the  
Write/Read access capability for each register.  
Note:  
Reading from a Write-only register will result in reading Logic 0 data, and writing to a Read-only register will have  
no impact even though the Write sequence will be acknowledged by the device.  
12  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
Table 6-1.  
Registers  
Register  
Address  
n/a  
Read/Write  
Section  
6.2.1  
6.2.2  
6.2.3  
6.2.4  
6.2.5  
6.2.6  
6.2.7  
6.2.8  
6.2.9  
N/A  
Power-On Default  
00h  
Pointer Register  
W
R
Capability Register  
00h  
00F7h  
0000h  
0000h  
0000h  
0000h  
N/A  
Configuration Register  
Upper Limit Register  
Lower Limit Register  
Critical Alarm Register  
Temperature Register  
Manufacturer I.D. Register  
Device I.D./Device Revision Register  
Reserved (1)  
01h  
R/W  
R/W  
R/W  
R/W  
R
02h  
03h  
04h  
05h  
06h  
R
1114h  
2200h  
N/A  
07h  
R
08h to 0Fh  
R/W  
Note:  
1. Write operations to reserve registers should be avoided as it may cause undesirable results.  
6.2.1 Pointer Register (8-bit Write Only, Address = N/A)  
The AT30TSE004A utilizes a Pointer Register to select and access all the data registers shown on Table 6-1.  
The Pointer Register is an 8-bit Write-only register (see Table 6-2). The power-on default value is 00h which is  
the address location for the Capability Register.  
Table 6-2.  
Pointer Register  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Symbol  
Pointer Register Value  
R/W  
W
0
W
0
W
0
W
0
W
0
W
0
W
0
W
0
Default Value  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
13  
 
 
 
 
6.2.2 Capability Register (16-bit Read-only, Address = 00h)  
This register is a 16-bit read-only register used to specify the functional capabilities of the temperature sensor.  
The AT30TSE004A is capable of measuring temperature with ±1C over the active range and ±2C over the  
monitor range. The Capability Register functions are described in Table 6-3 and Table 6-4.  
Table 6-3.  
Capability Register Bit Distribution  
Bit 15  
Bit 14  
Bit 13  
Bit 12  
Bit 11  
Bit 10  
Bit 9  
Bit 8  
Symbol  
RFU  
Default Value  
R/W Access  
0
R
0
0
R
0
R
0
R
0
0
R
0
R
R
Bit 6  
TMOUT  
1
R
Bit 2  
RANGE  
1
Bit 7  
EVSD  
1
Bit 5  
VHV  
1
Bit 4  
Bit 3  
Bit 1  
SACC  
1
Bit 0  
ICAP  
1
Symbol  
TPRES  
Default Value  
R/W Access  
1
0
R
R
R
R
R
R
R
R
Table 6-4.  
Capability Register Bit Description  
Symbol Description  
Bit  
15:8  
RFU  
Reserved for Future Use and must be Logic 0.  
Event Output Status During Shutdown Mode:  
1 = The EVENT pin output is deasserted (not driven) when entering Shutdown Mode and will  
remain deasserted upon exit from Shutdown Mode until the next temperature measurement  
sample is taken. In Interrupt Mode, the EVENT pin maybe asserted when existing Shutdown if  
a pending Interrupt has not be cleared.  
7
EVSD  
TMOUT  
Timeout:  
6
5
1 = BusTimeout supported within the range 25 to 35ms.  
A0 Pin High Voltage:  
V
HV  
1 = The A0 pin supports a maximum voltage up to 10V.  
Temperature Resolution:  
4:3  
2
TPRES  
RANGE  
10 =Supports 0.125C (11-bit resolution).  
1 = Can read temperatures below 0°C and sets appropriate sign bit.  
Supported Accuracy:  
1
0
SACC  
ICAP  
1 = Supports a B-grade accuracy of ±1C over the active range (75C to 95C) and 2C over the  
monitor range (40C to 125C).  
Interrupt Capability:  
1 = Supports Interrupt capabilities.  
14  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
 
 
6.2.3 Configuration Register (16-bit Read/Write, Address = 01h)  
The AT30TSE004A incorporates a 16-bit Configuration Register allowing the user to set key operational  
features of the temperature sensor. The Configuration Register functions are described in Table 6-5 and  
Table 6-6.  
Table 6-5.  
Configuration Register Bit Distribution  
Bit 15  
Bit 14  
Bit 13  
RFU  
0
Bit 12  
Bit 11  
Bit 10  
Bit 9  
Bit 8  
SHTDWN  
0
Symbol  
HYSTENB  
Default Value  
0
0
0
Bit 4  
EVTSTS  
0
0
Bit 3  
EVTOUT  
0
0
Bit 2  
CRITEVT  
0
0
Bit 1  
EVTPOL  
0
Bit 7  
Bit 6  
Bit 5  
EVTCLR  
0
Bit 0  
Symbol  
CRTALML WINLOCK  
EVTMOD  
0
Default Value  
R/W Access  
0
0
R/W  
R/W  
W
R
R/W  
R/W  
R/W  
R/W  
Table 6-6.  
Configuration Register Bit Description  
Symbol Description  
Bit  
15:11 RFU  
Reserved for Future Use and must be Logic 0.  
Hysteresis Enable:  
00 = 0C Disable hysteresis (Power-on default)  
01 = 1.5C Enable hysteresis  
10 = 3.0C Enable hysteresis  
11 = 6.0C Enable hysteresis  
The purpose of these bits is to control the hysteresis applied to the temperature limit trip point  
boundaries. The above hysteresis applies to all limits when temperature drops below the user  
specified temperature limit trip points.  
10:9  
HYSTENB  
Note:  
Hysteresis applies to decreasing temperature only. Once the temperature is above  
a given threshold, the temperature must drop below the boundary limit minus  
hysteresis in order for a Comparator EVENT to be cleared.  
Example:  
If these two bits are set to ‘01’ for 1.5C and the Upper Limit is set to 85C, as  
temperature rises above 85C, bit 14 of the Temperature Register will be set to a  
Logic 1. Bit 14 will remain set until the temperature drops below the threshold  
(85C) minus the hysteresis value(83.5C).  
Note:  
Hysteresis is also applied to the EVENT pin functionality. This bit cannot be  
changed if the Crit_Alarm or Alarm Window Lock bits is set.  
Shutdown Mode:  
0 = The temperature sensor is enabled for continuous conversion (power-on default).  
1 = The temperature sensor is disabled.  
To save power in Shutdown Mode, the temperature sensor is not active and will not generate  
interrupts or update the temperature data. The EVENT pin is deasserted (not driven).  
8
SHTDWN  
This bit cannot be set to a Logic 1 if either of the Crit_Alarm or Alarm Window Lock bits is set,  
however, it can be cleared at any time. The device will respond to protocol commands and the  
bus timeout is active when in Shutdown Mode.  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
15  
 
 
Table 6-6.  
Bit  
Configuration Register Bit Description (Continued)  
Symbol  
Description  
Crit_Alarm Lock bit:  
0 = The Crit_Alarm Register can be updated (power-on default).  
1 = The Crit_Alarm Register is locked and cannot be updated.  
This bit locks the Critical Alarm Register from being updated.  
Once set, it can only be cleared to a Logic 0 by an internal Power-On Reset.  
7
CRTALML  
Alarm Window Lock bit:  
0 = The Upper Limit and Lower Limit Registers can be updated (power-on default).  
1 = The Upper and Lower Limit Registers are locked and cannot be updated.  
Once set, it can be only be cleared to a Logic 0 by an internal Power-On Reset.  
6
5
WINLOCK  
EVTCLR  
EVENT Clear:  
0 = Has no effect (power-on default).  
1 = Clears (releases) the active EVENT pin in Interrupt Mode.  
This bit will clear the EVENT pin after it has been enabled. This bit is a  
write-only bit and will read as a Logic 0 and is ignored when in Comparator Mode.  
EVENT Pin Output Status:  
4
3
EVTSTS  
EVTOUT  
0 = The EVENT output is not asserted by the device (power-on default).  
1 = The EVENT output is asserted due to a limit or alarm condition.  
EVENT Output Control:  
0 = The EVENT output is disabled and will not generate interrupts (power-on default).  
1 = The EVENT output is enabled.  
This bit cannot be altered if the Crit_Alarm or the Alarm Window Lock bits is set.  
Critical Temperature only:  
0 = The EVENT output is asserted if the measured temperature is above the Upper Limit or  
Critical Alarm, or is below the Lower Limit (power-on default).  
2
CRITEVT  
1 = The EVENT output is asserted only for a Critical Alarm violation when the temperature is  
greater then the Crit_Alarm.  
This bit cannot be altered if the Alarm Window Lock bit is set.  
EVENT Polarity:  
0 = The EVENT pin is active low (power-on default).  
1 = The EVENT pin is active high.  
1
0
EVTPOL  
EVTMOD  
This bit cannot be altered if the Crit_Alarm or the Alarm Window Lock bit is set.  
A pull-up resistor is required on this pin to achieve the Logic 1 state.  
EVENT Mode:  
0 = The EVENT pin will operate in Comparator Mode (power-on default).  
1 = The EVENT pin will operate in Interrupt Mode.  
This bit cannot be altered if the Crit_Alarm or the Alarm Window Lock bit is set.  
16  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
Figure 6-1.  
EVENT Pin Mode Functionality  
Crit_Alarm  
Upper Limit  
Switches to  
Comparator  
Mode  
Measured  
Temperature  
Lower Limit  
Software Resets Interrupt  
EVENT Pin in  
Interrupt Mode”  
(Active Low)  
EVENT Pin in  
“Comparator  
Mode”  
(Active Low)  
EVENT Pin in  
“Crit_Alarm  
Only Mode”  
(Active High)  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
17  
6.2.4 Upper Limit Register (16-bit Read/Write, Address = 02h)  
The Upper Limit Register holds the user programmed upper temperature boundary trip point in 2’s complement  
format (0.125C resolution) that can be utilized to monitor the temperature in an operating window between the  
Upper Limit Register and the Lower Limit Register settings (see Table 6-7 and Table 6-9). When the  
temperature increases above this trip point, drops below, or is equal to the trip point (minus any hysteresis set),  
then the EVENT pin is asserted (if enabled). This register is read-only if the Alarm Window Lock (WINLOCK) bit  
six in the Configuration Register is set to a Logic 1.  
Table 6-7.  
Upper Limit Register Bit Distribution  
Bit 15  
Bit 14  
RFU  
0
Bit 13  
Bit 12  
SIGN  
0
Bit 11  
Bit 10  
Bit 9  
Bit 8  
Symbol  
ALMWINH  
Default Value  
R/W Access  
0
R
0
R
0
0
0
0
R
R/W  
Bit 4  
R/W  
Bit 3  
R/W  
Bit 2  
R/W  
Bit 1  
R/W  
Bit 0  
Bit 7  
Bit 6  
Bit 5  
Symbol  
ALMWINH  
RFU  
Default Value  
R/W Access  
0
0
0
0
0
0
0
0
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R
R
Table 6-8.  
Upper Limit Register Bit Description  
Symbol Description  
Bit  
15:13 RFU  
Reserved for Future Use. Read as Logic 0.  
Sign bit:  
12  
SIGN  
0 = The temperature is greater than or equal to 0°C.  
1= The temperature is less than 0°C.  
Upper Limit temperature bits:  
Represented in 2’s complement format.  
11:2  
0:1  
ALMWINH  
RFU  
Read-only access if Alarm Window is locked (Configuration Register bit 6 high).  
R/W access if the Alarm Window is unlocked.  
Reserved for Future Use. Read as Logic 0.  
18  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
 
6.2.5 Lower Limit Register (16-bit Read/Write, Address = 03h)  
The Lower Limit Register holds the user programmed lower temperature boundary trip point in 2’s complement  
format (0.125C resolution) that can be utilized to monitor the temperature in an operating window (see  
Table 6-7 and Table 6-9). When the temperature decreases below this trip point minus any hysteresis set or  
increases to meet or exceed this trip point, then the EVENT pin is asserted (if enabled).  
This register becomes read-only if the Alarm Window Lock (WINLOCK) bit six in the Configuration Register is  
set to a Logic 1.  
Table 6-9.  
Lower Limit Register Bit Distribution  
Bit 15  
Bit 14  
RFU  
0
Bit 13  
Bit 12  
SIGN  
0
Bit 11  
Bit 10  
Bit 9  
Bit 8  
Symbol  
ALMWINL  
Default Value  
R/W Access  
0
R
0
R
0
0
0
0
R
R/W  
Bit 4  
R/W  
Bit 3  
R/W  
Bit 2  
R/W  
Bit 1  
R/W  
Bit 0  
Bit 7  
Bit 6  
Bit 5  
Symbol  
ALMWINL  
RFU  
Default Value  
R/W Access  
0
0
0
0
0
0
0
0
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R
R
Table 6-10.  
Lower Limit Register Bit Description  
Bit  
Symbol Description  
15:13 RFU  
Reserved for Future Use. Read as Logic 0.  
Sign bit:  
12  
SIGN  
0 = The temperature is greater than or equal to 0°C.  
1 = The temperature is less than 0°C.  
Lower Limit temperature bits:  
Represented in 2’s complement format.  
11:2  
0:1  
ALMWINL  
RFU  
Read-only access if Alarm Window is locked (Configuration Register bit 6 high).  
R/W access if the Alarm Window is unlocked.  
Reserved for Future Use. Read as Logic 0.  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
19  
 
6.2.6 Critical Alarm Register (16-bit Read/Write, Address = 04h)  
The Critical Alarm Register holds the user programmed Critical Alarm temperature boundary trip point in  
2’s complement format (0.125°C resolution) that can be utilized to monitor the temperature (see Table 6-11 and  
Table 6-12). When the temperature increases above this trip point, the EVENT pin will be asserted (if enabled).  
It will remain asserted until temperature decreases below or equal to the trip point minus any hysteresis set.  
This register becomes read-only if the Critical Alarm Lock Bit (CRTALML) bit seven in the Configuration  
Register is set to a Logic 1.  
Table 6-11.  
Critical Alarm Register Bit Distribution  
Bit 15  
Bit 14  
RFU  
0
Bit 13  
Bit 12  
SIGN  
0
Bit 11  
Bit 10  
Bit 9  
Bit 8  
Symbol  
CRITEVT  
Default Value  
R/W Access  
0
R
0
R
0
0
0
0
R
R/W  
Bit 4  
R/W  
Bit 3  
R/W  
Bit 2  
R/W  
Bit 1  
R/W  
Bit 0  
Bit 7  
Bit 6  
Bit 5  
Symbol  
CRITEVT  
RFU  
Default Value  
R/W Access  
0
0
0
0
0
0
0
0
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R
R
Table 6-12.  
Critical Alarm Register Bit Description  
Bit  
Symbol Description  
15:13 RFU  
Reserved for Future Use. Read as Logic 0.  
Sign bit:  
12  
SIGN  
0 = The temperature is greater than or equal to 0°C.  
1 = The temperature is less than 0°C.  
Critical Alarm temperature bits:  
Represented in 2’s complement format.  
11:2  
0:1  
CRITEVT  
RFU  
Read-only access if Alarm Window is locked (Configuration Register bit 6 high).  
R/W access if the Alarm Window is unlocked.  
Reserved for Future Use. Read as Logic 0.  
20  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
 
 
6.2.7 Temperature Register (16-bit Read-only, Address = 05h)  
The Temperature Register holds the internal temperature measurement data represented in 2’s complement  
format allowing for resolution equal to 0.125C (least significant bit). The upper three bits (15, 14, and 13) of the  
Temperature Register indicates the trip status of the current temperature and most important, are not affected  
by the status of the output of the EVENT pin (see Table 6-13 and Table 6-14).  
Table 6-13.  
Temperature Register Bit Distribution  
Bit 15  
Bit 14  
Bit 13  
Bit 12  
SIGN  
0
Bit 11  
128°C  
0
Bit 10  
64°C  
0
Bit 9  
Bit 8  
16°C  
0
Symbol  
CRITHIGH ALMHIGH ALMLOW  
32°C  
Default Value  
R/W Access  
0
R
0
R
0
R
0
R
R
R
R
Bit 1  
0.125°C  
0
R
Bit 7  
8°C  
0
Bit 6  
4°C  
0
Bit 5  
2°C  
0
Bit 4  
1°C  
0
Bit 3  
0.5°C  
0
Bit 2  
0.25°C  
0
Bit 0  
RFU  
0
Symbol  
Default Value  
R/W Access  
R
R
R
R
R
R
R
R
Table 6-14.  
Temperature Register Bit Description  
Bit  
Symbol Description  
0 = The temperature is less than the Critical Alarm Register setting.  
1 = The temperature is greater than or equal to Critical Alarm Register setting.  
15  
CRITHIGH  
ALMHIGH  
When this bit is set to a Logic 1, it will automatically clear once the measured temperature  
decreases below or is equal to the trip point minus any hysteresis set.  
0 = The temperature is below the Upper Limit Register setting.  
1 = The temperature is above the Upper Limit Register setting.  
14  
When the bit is set to a Logic 1, it will automatically clear once the measured temperature  
decreases below or is equal to the trip point minus any hysteresis set.  
0 = The temperature is above the Lower Limit Register setting.  
1 = The temperature is below the Lower Limit Register setting.  
13  
12  
ALMLOW  
SIGN  
When the bit is set to a Logic 1, it will automatically clear once the measured temperature  
increases above or is to equal to the trip point.  
Sign bit:  
0 = The temperature is greater than or equal to 0°C.  
1 = The temperature is less than 0°C.  
Temperature bits:  
11:1  
0
TEMP  
RFU  
Represented in 2’s complement format.  
The encoding of bits B11 through B2 is the same as in the limit and alarm registers.  
Reserved for Future Use. Read as Logic 0.  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
21  
 
 
6.2.7.1 Temperature Register Format  
This section will clarify the Temperature Register format and temperature bit value assignments utilized for  
temperature for the following registers: Upper Limit, Lower Limit, Critical Alarm, and Temperature Registers.  
The temperatures expressed in the Upper Limit, Lower Limit, Critical Alarm, and Temperature Registers are  
indicated in 2’s complement format. In each of the temperature limit registers, bits 12 through bit two are utilized  
for temperature settings, or in the case of the Temperature Register, holds the internal temperature  
measurement with bits 12 through bit one allowing 0.125ºC resolution.  
Table 6-15 indicates the Temperature Register’s assigned bit values utilized for temperature and shows  
examples for the Temperature Register bit values for various temperature readings.  
Table 6-15.  
Temperature Register Format  
Position Bit 12 Bit 11 Bit 10 Bit 9  
Bit Value SIGN 128°C 64°C 32°C  
Bit 8  
Bit 7 Bit 6  
8°C 4°C  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
16°C  
2°C  
1°C  
0.5°C 0.25°C 0.125°C  
X
Table 6-16.  
Temperature Register Examples  
Temperature Register Value Examples  
Temperature  
+125°C  
+99.75°C  
+85°C  
Binary (Bit 15 – Bit 0)  
xxx0 0111 1101 00xx  
xxx0 0110 0011 11xx  
xxx0 0101 0101 00xx  
xxx0 0010 0111 00xx  
xxx0 0000 1111 11xx  
xxx0 0000 0000 01xx  
xxx0 0000 0000 00xx  
xxx1 1111 1111 11xx  
xxx1 1111 1110 00xx  
xxx1 1110 1100 00xx  
+39°C  
+15.75°C  
+0.25°C  
0°C  
-0.25°C  
-1°C  
-20°C  
22  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
 
6.2.8 Manufacturer ID Register (16-bit Read-only, Address = 06h)  
The Manufacturer ID Register contains the PCI SIG number assigned to Atmel (1114h) as shown in Table 6-17.  
Table 6-17.  
Manufacturer ID Register Bit Distribution  
Bit 15  
Bit 14  
Bit 13  
Bit 12  
Bit 11  
Bit 10  
Bit 9  
Bit 8  
Symbol  
Manufacturer ID  
Default Value  
R/W Access  
0
R
0
R
0
R
1
R
0
R
0
R
0
R
1
R
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Symbol  
Manufacturer ID  
Default Value  
R/W Access  
0
0
0
1
0
1
0
0
R
R
R
R
R
R
R
R
6.2.9 Device ID Register (16-bit Read-only, Address = 07h)  
The upper or high order byte is used to specify the device identification and the low byte is used to specify the  
device revision. The Device ID for the AT30TSE004A is 2200h (see Table 6-18).  
Table 6-18.  
Device ID Register Bit Distribution  
Bit 15  
Bit 14  
Bit 13  
Bit 12  
Bit 11  
Bit 10  
Bit 9  
Bit 8  
Symbol  
Device ID  
Default Value  
R/W Access  
0
R
0
R
1
R
0
R
0
R
0
R
1
R
0
R
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Symbol  
Device Revision  
Default Value  
R/W Access  
0
0
0
0
0
0
0
0
R
R
R
R
R
R
R
R
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
23  
 
 
6.3  
Temperature Sensor Write Operations  
Writing to the Temperature Register of the AT30TSE004A is accomplished through a modified Write operation  
for two data bytes. To maintain 2-wire compatibility, the 16-bit registers are accessed through a Pointer Register  
requiring the TS Write sequence to include a Pointer Register byte following the device address byte to write the  
two data bytes. Figure 6-2 illustrates the entire Write transaction.  
Figure 6-2.  
SCL  
Temperature Sensor Register Write Operation  
1
2
0
3
4
5
6
7
8
0
9
0
1
2
3
4
5
6
7
8
9
0
Device Address Byte  
A2 A1 A0  
Pointer Register Byte  
0
1
1
P7 P6 P5 P4 P3 P2 P1 P0  
MSB  
SDA  
MSB  
Start  
by  
Master  
ACK  
from  
Slave  
ACK  
from  
Slave  
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
0
Least Significant Data Byte  
Most Significant Data Byte  
D15 D14 D13 D12 D11 D10 D9 D8  
MSB  
0
D7 D6 D5 D4 D3 D2 D1 D0  
MSB  
Start  
by  
Master  
Stop  
by  
Master  
ACK  
from  
Slave  
ACK  
from  
Slave  
24  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
 
6.4  
Temperature Sensor Read Operations  
Reading data from the temperature sensor may be accomplished in one of two ways:  
If the location latched in the Pointer Register is correct (for normal operation, it is expected the same  
address will be read repeatedly to read the temperature from the Temperature Register), the Register  
Pointer Word Read sequence should be utilized as shown in Figure 6-3. To perform a Register Pointer  
Word Read, the Master transmits a Start condition followed by a device address byte with the R/W select  
bit to a Logic 1. The AT30TSE004A should respond with an ACK and will transmit the most significant  
data byte. The Master should send an ACK followed by the device transmitting the least significant data  
byte. To end the Read operation, the Master sends a NACK followed by a Stop condition.  
If it is desired to Read a Random Register or simply change to read a different register from the  
temperature sensor, then the Preset Pointer Register Word Read protocol sequence should be followed  
and is shown in Figure 6-4. The Preset Pointer Register Word Read sequence allows the Pointer Register  
to be preloaded with the correct register address to gain access to the desired register to be read. To  
perform a Preset Pointer Register Word Read, the Master transmits a Start condition followed by a device  
address byte (with the R/W select bit to a Logic 0) and a Pointer Register byte to the AT30TSE004A.  
Once the device address and Pointer Register bytes are clocked in and acknowledged by the  
AT30TSE004A, the Master must generate another Start condition. The Master transmits another device  
address byte (with the R/W select bit to a Logic 1) followed by an ACK by the AT30TSE004A and the  
device transmitting the most significant data byte. The Master should send a ACK followed by the device  
transmitting the least significant data byte. To end the Read operation, the Master should send a NACK  
followed by a Stop condition.  
Figure 6-3.  
Register Pointer Word Read  
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
1
SCK  
Device Address Byte  
A2 A1 A0  
Most Significant Data Byte  
Least Significant Data Byte  
0
MSB  
0
1
1
1
0
D15 D14 D13 D12 D11 D10 D9 D8  
MSB  
D7 D6 D5 D4 D3 D2 D1 D0  
MSB  
SDA  
Start  
by  
Master  
Stop  
by  
Master  
ACK  
from  
Slave  
ACK  
from  
Master  
NACK  
from  
Master  
Figure 6-4.  
Preset Pointer Register Word Read  
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
0
SCL  
Device Address Byte  
A2 A1 A0  
Pointer Register Byte  
0
MSB  
0
1
1
0
0
P7 P6 P5 P4 P3 P2 P1 P0  
MSB  
SDA  
Start  
by  
Master  
ACK  
from  
Slave  
ACK  
from  
Slave  
1
0
2
0
3
4
5
6
7
8
1
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
Least Significant Data Byte  
Most Significant Data Byte  
Device Address Byte  
A2 A1 A0  
1
1
0
D15 D14 D13 D12 D11 D10 D9 D8  
MSB  
0
D7 D6 D5 D4 D3 D2 D1 D0  
MSB  
MSB  
Start  
by  
Master  
Stop  
by  
Master  
ACK  
from  
Master  
NACK  
from  
Master  
ACK  
from  
Slave  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
25  
 
 
7.  
Serial EEPROM  
7.1  
Memory Organization  
To provide the greatest flexibility and backwards compatibility with the previous generations of SPD devices, the  
AT30TSE004A memory organization is organized into two independent 2-Kbit memory arrays. Each 2-Kbit  
(256-byte) section is internally organized into two independent quadrants of 128 bytes with each quadrant  
comprised of eight pages of 16 bytes. Including both memory sections, there are four 128-byte quadrants  
totaling 512 bytes. The Memory Array organization details are shown in Section on page 6 and Table 7-1.  
7.1.1 Set Page Address and Read Page Address Commands  
The AT30TSE004A incorporates an innovative memory addressing technique that utilizes a Set Page Address  
(SPA) and Read Page Address (RPA) commands to select and verify the desired half of the memory is enabled  
to perform Write and Read operations.  
Example:  
If SPA = 0, then the first-half or lower 256 bytes of the Serial EEPROM is selected allowing  
access to Quadrant 0 and Quadrant 1. Alternately, if SPA = 1, then the second-half or upper 256  
bytes of the Serial EEPROM is selected allowing access to Quadrant 2 and Quadrant 3.  
Table 7-1.  
Set Page Address and Memory Organization  
Block  
Set Page Address (SPA)  
Memory Address Locations  
00h to 7Fh  
Quadrant 0  
Quadrant 1  
Quadrant 2  
Quadrant 3  
0
0
1
1
80h to FFh  
00h to 7Fh  
80h to FFh  
Note:  
Due to the requirement for the A0 pin to be driven to VHV, the SPA and the RPA commands are fully supported in a  
single DIMM (isolated DIMM) end application or a single DIMM programming station only.  
Setting the Set Page Address (SPA) value selects the desired half of the EEPROM for performing Write or Read  
operations. This is done by sending the SPA as seen in Figure 7-1. The SPA command sequence requires the  
Master to transmit a Start condition followed by sending a control byte of ‘011011*0’ where the ‘*’ in the bit  
7 position will dictate which half of the EEPROM is being addressed. A ‘0’ in this position (or 6Ch) is required  
to set the page address to the first half of the memory and a ‘1’ (or 6Eh) is necessary to set the page address  
to the second half of the memory. After receiving the control byte, the AT30TSE004A should return an ACK and  
the Master should follow by sending two data bytes of don’t care values. The AT30TSE004A responds with a  
ACK to each of these two data bytes although the JEDEC TSE2004av specification allows for either an ACK or  
NACK response. The protocol is completed by the Master sending a Stop condition to end the operation.  
Figure 7-1.  
Set Page Address (SPA)  
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
SCL  
Control Byte  
Address Byte  
Data Byte  
0
1
1
0
1
1
*
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
SDA  
MSB  
MSB  
MSB  
Start  
by  
Master  
Stop  
by  
Master  
ACK  
from  
Slave  
ACK  
from  
Slave  
ACK  
from  
Slave  
Bit * = 0: Indicates the page address is located in the first half of the memory.  
Bit * = 1: Indicates the page address is located in the second half of the memory.  
26  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
 
 
 
Reading the state of the SPA can be accomplished via the Read Page Address (RPA) command. The Master  
can issue the RPA command to determine if the AT30TSE004A’s internal address counter is located in the first  
2-Kbit section or the second 2-Kbit memory section based upon the device’s ACK or NACK response to the  
RPA command.  
The RPA command sequence requires the Master to transmit a Start condition followed by a control byte of  
‘01101101’(6Dh). The device’s current address counter (page address) is located in the first half of the  
memory if the AT30TSE004A responds with an ACK to the RPA command. Alternatively, if the device’s  
response to the RPA command is a NACK, indicates the page address is located in the second half of the  
memory (see Figure 7-2). Following the control byte and the device’s ACK or NACK response, the  
AT30TSE004A should transmit two data bytes of don’t care values. The Master should NACK on these two data  
bytes followed by the Master sending a Stop condition to end the operation.  
After power-up, the SPA is set to zero indicating internal address counter is located in the first half of the  
memory. Performing a software reset (see Section 4.8 “2-wire Software Reset” on page 10) will also set the  
SPA to zero.  
The AT30TSE004A incorporates a Reversible Software Write Protect (RSWP) feature that allows the ability to  
selectively write protect data stored in any or all of the four Serial EEPROM 128-byte quadrants. See  
Section 7.3 “Write Protection” on page 32 for more information on the RSWP feature.  
Figure 7-2.  
Read Page Address (RPA)  
1
2
1
3
1
4
5
6
1
7
0
8
9
*
1
2
3
4
5
6
7
8
9
1
1
2
3
4
5
6
7
8
9
1
SCL  
Control Byte  
Most Significant Data Byte  
Least Significant Data Byte  
0
0
1
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
SDA  
MSB  
MSB  
MSB  
Start  
by  
Master  
Stop  
by  
Master  
ACK or NACK  
from  
NACK  
from  
Master  
NACK  
from  
Master  
Slave  
Bit * = 0: ACK indicates the device’s internal address counter is located in the first half of the memory.  
Bit * = 1: NACK indicates the device’s internal address counter is located in the second half of the memory.  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
27  
 
7.2  
Serial EEPROM Write Operations  
The 4-Kbit Serial EEPROM within the AT30TSE004A supports single Byte Write and Page Write operations up to the  
maximum page size of 16 bytes in one operation. The only difference between a Byte Write and a Page Write  
operation is the amount of data bytes loaded. Regardless of whether a Byte Write or Page Write operation is  
performed, the internally self-timed write cycle will take the same amount of time to write the data to the addressed  
memory location(s). Temperature sensor operations can be accessed during the write cycle to read the Temperature  
Register or perform any other temperature sensor function.  
Caution:  
All Byte Write and Page Write operations should be preceded by the SPA and or RPA commands to  
ensure the internal address counter is located in the desired half of the memory.  
If a Byte Write or Page Write operation is attempted to a protected quadrant, then the AT30TSE004A will  
respond (ACK or NACK) to the Write operation according to Table 7-2.  
Table 7-2.  
Serial EEPROM Acknowledge Status When Writing Data or Defining Write Protection  
Word  
Address  
Sent  
Word  
Address  
Response  
Quadrant  
Status  
Instruction  
Sent  
Instruction  
Response  
Data Word Data Word  
Write  
Cycle  
Sent  
Response  
Set RSWP  
NACK  
ACK  
Don’t Care  
Don’t Care  
NACK  
ACK  
Don’t Care  
NACK  
No  
Write Protected  
with Set RSWP  
Clear RSWP  
Don’t Care  
Data  
ACK  
Yes  
Byte Write or  
Page Write to  
Protected Quadrant  
Word  
Address  
ACK  
ACK  
NACK  
No  
Set RSWP or  
Clear RSWP  
ACK  
ACK  
Don’t Care  
ACK  
ACK  
Don’t Care  
Data  
ACK  
ACK  
Yes  
Yes  
Not Protected  
Byte Write or  
Page Write  
Word  
Address  
28  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
 
7.2.1 Byte Write  
Following the Start condition from the Master, the device type identifier (‘1010’), the device address bits and  
the R/W select bit (set to a Logic 0) are clocked onto the bus by the Master (see Figure 7-3). This indicates to  
the addressed device that the Master will follow by transmitting a byte with the word address. The  
AT30TSE004A will respond with an ACK during the ninth clock cycle. Then the next byte transmitted by the  
Master is the 8-bit word address of the byte location to be written into the Serial EEPROM. After receiving an  
ACK from the AT30TSE004A, the Master transmits the data word to be programmed followed by an ACK from  
the AT30TSE004A. The Master ends the Write sequence with a Stop condition during the 10th clock cycle to  
initiate the internally self-timed write cycle. A Stop condition issued during any other clock cycle during the Write  
operation will not trigger the internally self-timed write cycle. Once the write cycle begins, the pre-loaded data  
word will be programmed in the amount of time not to exceed the tWR specification. The tWR time is defined in  
more detail in Section 7.2.4 on page 31. During this time, the Master should wait a fixed amount of time set to  
the tWR specification, or for time sensitive applications, an ACK polling routine can be implemented (see  
Figure 7-5 on page 31). All inputs are ignored by the Serial EEPROM during the write cycle and the Serial  
EEPROM will not respond until the write cycle is complete. The Serial EEPROM will increment its internal  
address counter each time a byte is written.  
Note:  
The temperature sensor operations can be accessed during the write cycle to read the Temperature Register or  
perform any other temperature sensor function.  
Figure 7-3.  
Byte Write to Serial EEPROM  
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
0
SCL  
Device Address Byte  
A2 A1 A0  
Word Address Byte  
Data Word  
1
MSB  
0
1
0
0
0
A7 A6 A5 A4 A3  
MSB  
A2 A1 A0  
D7 D6 D5 D4 D3 D2 D1 D0  
MSB  
SDA  
Stop  
by  
Master  
Start  
by  
Master  
ACK  
from  
Slave  
ACK  
from  
Slave  
ACK  
from  
Slave  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
29  
 
7.2.2 Page Write  
The 4-Kbit Serial EEPROM is capable of writing up to 16 data bytes at a time executing the Page Write protocol  
sequence (see Figure 7-4). A partial or full Page Write operation is initiated the same as a Byte Write operation  
except that the Master does not send a Stop condition after the first data word is clocked in. Instead, after the  
Serial EEPROM has acknowledged receipt of the first data word, the Master can transmit up to fifteen more data  
words. The device will respond with an ACK after each data word is received. The lower four bits of the data  
word address are internally incremented following the receipt of each data word. The higher data word address  
bits are not incremented, retaining the memory page row location. When the internally generated word address  
reaches the page boundary, then the following data word is placed at the beginning of the same page. If more  
than sixteen data words are transmitted to the Serial EEPROM, the data word address will roll-over and the  
previous data will be overwritten. The address roll-over during a Write sequence is from the last byte of the  
current page to the first byte of the same page.  
The Master ends the Page Write sequence with a Stop condition during the 10th clock cycle to initiate the  
internally self-timed write cycle. A Stop condition issued during any other clock cycle during the Write operation  
will not trigger the internally self-timed write cycle. Once the write cycle begins, the pre-loaded data words will  
be programmed in the amount of time not to exceed the tWR specification. All inputs are ignored by the Serial  
EEPROM during the write cycle and the Serial EEPROM will not respond until the write cycle is complete. The  
t
WR time is defined in more detail in Section 7.2.4 on page 31. During this time, the Master should wait a fixed  
amount of time set to the tWR specification, or for time sensitive applications, an ACK polling routine can be  
implemented (see Figure 7-5 on page 31).  
Figure 7-4.  
Page Write to Serial EEPROM  
1
2
0
3
4
5
6
7
8
0
9
0
1
2
3
4
5
6
7
8
9
0
SCL  
SDA  
Device Address Byte  
A2 A1 A0  
Word Address Byte  
1
MSB  
1
0
A7 A6 A5 A4 A3 A2 A1 A0  
MSB  
Start  
by  
Master  
ACK  
from  
Slave  
ACK  
from  
Slave  
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
0
Data Word (n)  
Data Word (n+1)  
Data Word (n+15)  
D7 D6 D5 D4 D3 D2 D1 D0  
MSB  
D7 D6 D5 D4 D3 D2 D1 D0  
MSB  
D7 D6 D5 D4 D3 D2 D1 D0  
MSB  
Stop  
by  
Master  
ACK  
from  
Slave  
ACK  
from  
Slave  
ACK  
from  
Slave  
30  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
 
7.2.3 Acknowledge (ACK) Polling  
An ACK polling routine can be implemented to optimize time sensitive applications that would not prefer waiting  
the fixed maximum write cycle time and would prefer to know immediately when the Serial EEPROM write cycle  
has completed to start a subsequent operation. Once the internally self timed write cycle has started (the Stop  
condition during the 10th clock cycle at the end of the Write sequence), the Serial EEPROM inputs are disabled  
and ACK polling can be initiated (see Figure 7-5). An ACK polling routine involves sending a valid Start  
condition followed by the device address byte. While the write cycle is in progress, the device will not respond  
with an ACK indicating the Serial EEPROM is busy writing data. Once complete, the device will ACK and the  
next device operation can be started.  
Note:  
The temperature sensor operations can be accessed during the write cycle to read the Temperature Register or  
perform any other user desired temperature sensor operation.  
Figure 7-5.  
Acknowledge Polling Flow Chart  
Send Start  
Condition  
Followed  
Send  
Stop  
Did  
the Device  
ACK?  
Send Any  
YES  
Continue to  
Next Operation  
Condition  
to Initiate  
Write Cycle  
Write  
by Valid  
Protocol  
Device Address  
Byte  
NO  
7.2.4 Write Cycle Timing  
The length of the self timed write cycle, or tWR, is defined as the amount of time from a valid Stop condition that  
begins the internal write sequence to the Start condition of the first device address byte sent to the  
AT30TSE004A that it subsequently responds to with an ACK. Figure 7-6 has been included to show this  
measurement.  
Figure 7-6.  
Write cycle Timing  
SCL  
8
9
9
Data Word n  
D0  
ACK  
ACK  
SDA  
First Acknowledge from the device  
to a valid device address sequence after  
write cycle is initiated. The minumum tWR  
can only be determined through  
tWR  
the use of an ACK Polling routine.  
Stop  
Condition  
Start  
Condition  
Stop  
Condition  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
31  
 
 
7.3  
Write Protection  
The AT30TSE004A incorporates a Reversible Software Write Protection (RSWP) feature that allows the ability  
to selectively write protect data stored in each of the four independent 128-byte Serial EEPROM quadrants.  
Table 7-3 identifies the memory quadrant identifier with its associated quadrant, SPA and memory address  
locations.  
The AT30TSE004A has three RSWP software commands:  
Set RSWP command for setting the RSWP.  
Clear RSWP command for resetting all of the quadrants that are software write protected.  
Read RSWP command for reading the RSWP status.  
Table 7-3.  
Serial EEPROM Memory Organization  
Memory Quadrant  
Identifier  
Block  
Quadrant 0  
SPA  
Address Locations  
00h to 7Fh  
0
0
1
1
001  
100  
101  
000  
Quadrant 1  
Quadrant 2  
Quadrant 3  
80h to FFh  
00h to 7Fh  
80h to FFh  
7.3.1 Set RSWP  
Setting the RSWP is enabled by sending the Set RSWP command, similar to a normal Write command to the  
device which programs the Write Protection to the target quadrant. The Set RSWP sequence requires sending  
a control byte of ‘0110MMM0’ (where the ‘M’ represents the memory quadrant identifier for the target quadrant  
to be write-protected) with the R/W bit set to a Logic 0. In conjunction with sending the protocol, the A0 pin must  
be connected to VHV for the duration of RSWP sequence (see Figure 7-7 and Section 8.2). The Set RSWP  
command acts on a single quadrant only as specified in the Set RSWP command and can only be reversed by  
issuing the Clear RSWP command and will unprotect all quadrants in one operation (see Table 7-4).  
Example:  
If Quadrant 0 and Quadrant 3 are to be write-protected, two separate Set RSWP commands  
would be required; however, only one Clear RSWP command is needed to clear and unprotect  
both quadrants.  
Table 7-4.  
Set RSWP and Clear RSWP  
Control Byte  
Memory Quadrant  
Pin  
A1  
X
Device Type Identifier  
Identifier  
R/W  
Function  
A2  
X
A0  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2 Bit 1  
Bit 0  
Set RSWP, Quadrant 0  
Set RSWP, Quadrant 1  
Set RSWP, Quadrant 2  
Set RSWP, Quadrant 3  
Clear RSWP  
0
1
1
0
0
0
0
0
0
1
1
0
1
0
1
0
0
0
0
0
X
X
X
X
VHV  
0
1
1
0
X
X
X
X
Notes: 1. X = Don’t care but recommend to be hard-wired to VCC or GND.  
2. See Section 8.2 for the VHV values.  
3. Due to the requirement for the A0 pin to be driven to VHV, the Set RSWP and Clear RSWP commands are fully  
supported in a single DIMM (isolated DIMM) end application or single DIMM programming station only.  
32  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
 
 
Figure 7-7.  
Set RSWP and Clear RSWP  
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
SCL  
Control Byte  
Word Address Byte  
Data Word  
0
MSB  
1
1
0
M
M
M
0
0
X
MSB  
X
X
X
X
X
X
X
0/1  
X
MSB  
X
X
X
X
X
X
X
0/1  
SDA  
Start  
by  
Master  
Stop  
by  
Master  
ACK  
from  
Slave  
ACK or NACK  
from  
ACK or NACK  
from  
Slave  
Slave  
M = Memory Quadrant Identifier  
X = Don’t care  
7.3.2 Clear RSWP  
Similar to the Set RSWP command, the reversible write protection on all quadrants can be reversed or  
unprotected by transmitting the Clear RSWP command. The Clear RSWP sequence requires the Master to  
send a Start condition followed by sending a control byte of ‘01100110’ (66h) with the R/W bit set to a Logic 0.  
The AT30TSE004A should respond with an ACK. The Master transmits a word address byte and data bytes  
with don’t care values. The AT30TSE004A will respond with either an ACK or NACK to both the word address  
and data word. In conjunction with sending the protocol, the A0 pin must be connected to VHV for the duration of  
the Clear RSWP command (see Figure 7-7 and Section 8.2). To end the Clear RSWP sequence, the Master  
sends a Stop condition.  
Caution:  
The write protection of individual quadrants cannot be reversed separately, and executing the Clear  
RSWP command will clear the write protection on all four quadrants leaving all quadrants with no  
software write protection.  
7.3.3 Read RSWP  
The Read RSWP command allows the ability to check a quadrant’s write protection status. To find out if the  
Software Write Protection has been set to a specific quadrant, the same procedure that was used to set the  
quadrant’s write protection can be utilized except that the R/W select bit is set to a Logic 1, and the A0 pin is not  
required to have VHV (see Table 7-6).  
The Read RSWP sequence requires sending a control byte of ‘0110MMM1’ (where the ‘M’ represents the  
memory quadrant identifier for the quadrant to be read) with the R/W bit set to a Logic 1 (see Figure 7-8).  
If the RSWP has not been set, then the AT30TSE004A responds to the control byte with an ACK, and responds  
to the word address byte and data word with a NACK. If the RSWP has been set, the AT30TSE004A responds  
to all three bytes (control, word address, and data bytes) with a NACK as shown in Table 7-5.  
Table 7-5.  
Serial EEPROM Acknowledge When Reading Protection Status  
Quadrant  
Status  
Instruction  
Sent  
Instruction  
Response  
Word Address  
Sent  
Word Address  
Response  
Data Word  
Sent  
Data Word  
Response  
Write Protected  
Not Protected  
Read RSWP  
Read RSWP  
NACK  
ACK  
Don’t Care  
Don’t Care  
NACK  
NACK  
Don’t Care  
Don’t Care  
NACK  
NACK  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
33  
 
 
Table 7-6.  
Function  
Read RSWP  
Control Byte  
Memory Quadrant  
Pin  
A1  
X
Device Type Identifier  
Identifier  
R/W  
B0  
1
A2  
X
A0  
B7  
B6  
B5  
B4  
B3  
0
B2  
0
B1  
1
Read RSWP, Quadrant 0  
Read RSWP, Quadrant 1  
Read RSWP, Quadrant 2  
Read RSWP, Quadrant 3  
0, 1  
or  
VHV  
X
X
1
0
0
1
0
1
1
0
X
X
1
0
1
1
X
X
0
0
0
1
Notes: 1. X= Don’t care but recommend to be hard-wired to VCC or GND.  
2. See Section 8.2 for the VHV values.  
Figure 7-8.  
Read RSWP  
1
2
1
3
1
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
1
2
3
4
5
6
7
8
9
1
SCK  
Control Byte  
Word Address Byte  
Data Byte  
0
0
M
M
M
1
0/1  
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
SDA  
MSB  
MSB  
MSB  
Start  
by  
Master  
Stop  
by  
Master  
ACK or NACK  
from  
NACK  
from  
Master  
NACK  
from  
Master  
Slave  
M = Memory Quadrant Identifier  
X = Don’t care  
7.4  
Serial EEPROM Read Operations  
All Read operations are initiated by the Master transmitting a Start bit, a device type identifier of ‘1010’ (Ah),  
three software address bits (A2, A1, and A0) that match their corresponding hard-wired address pins (A2, A1,  
and A0), and the R/W select bit with a Logic 1 state. In the following clock cycle, the device should respond with  
an ACK. The subsequent protocol depends on the type of Read operation desired. There are three Read  
operations:  
Current Address Read  
Random Address Read  
Sequential Read  
Caution:  
All Read operations should be preceded by the SPA and or RPA commands to ensure the desired half of  
the memory is selected. The reason this is important, for example, during a Sequential Read operation  
on the last byte in the first half of the memory (address FFh) with SPA=0 (indicating first half is selected),  
the internal address counter will roll-over to address 00h in the first half of memory as opposed to the first  
byte in the second half of the memory. For more information on the SPA and RPA commands, see  
Section 7.1.1 “Set Page Address and Read Page Address Commands” on page 26.  
34  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
7.4.1 Current Address Read  
Following a Start condition, the Master only transmits the device address byte with the R/W select bit set to a  
Logic 1 (see Figure 7-9). The AT30TSE004A should respond with an ACK and then serially transmits the data  
word addressed by the internal address counter. The internal data word address counter maintains the last  
address accessed during the last Read or Write operation, incremented by one. This address stays valid  
between operations as long as power to the device is maintained. The address roll-over during a Read is from  
the last byte of the last page to the first byte of the first page of the addressed 2-Kbit (depends on the current  
SPA setting). To end the command, the Master does not respond with an ACK but does generate a following  
Stop condition.  
Figure 7-9.  
Current Address Read from Serial EEPROM  
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
SCL  
Device Address Byte  
Data Word (n)  
1
MSB  
0
1
0
A2 A1 A0  
1
0
D7 D6 D5 D4 D3 D2 D1 D0  
MSB  
1
SDA  
Start  
by  
Master  
Stop  
by  
Master  
ACK  
from  
Slave  
NACK  
from  
Master  
7.4.2 Random Read  
A Random Read operation allows the Master to access any memory location in a random manner and requires  
a dummy write sequence to preload the starting data word address. To perform a Random Read, the device  
address byte and the word address byte are transmitted to the AT30TSE004A as part of the dummy Write  
sequence (see Figure 7-10). Once the device address byte and data word address are clocked in and  
acknowledged by the AT30TSE004A, the Master must generate another Start condition. The Master initiates a  
Current Address Read by sending another device address byte with the R/W select bit to a Logic 1. The  
AT30TSE004A acknowledges the device address byte, increments its internal address counter and serially  
clocks out the first data word. The device will continue to transmit sequential data words as long as the Master  
continues to ACK each data word. To end the sequence, the Master responds with a NACK and a Stop  
condition.  
Figure 7-10. Random Read from Serial EEPROM  
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
0
SCL  
SDA  
Device Address Byte  
A2 A1 A0  
Word Address Byte  
1
MSB  
0
1
0
0
0
A7 A6 A5 A4 A3 A2 A1 A0  
MSB  
Start  
by  
Master  
ACK  
from  
Slave  
ACK  
from  
Slave  
Dummy Write  
1
2
3
4
5
6
7
8
1
9
1
2
3
4
5
6
7
8
9
1
Data Word (n)  
Device Address Byte  
A2 A1 A0  
1
MSB  
0
1
0
0
D7 D6 D5 D4 D3 D2 D1 D0  
MSB  
Start  
by  
Master  
Stop  
by  
Master  
ACK  
from  
Slave  
NACK  
from  
Master  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
35  
 
 
7.4.3 Sequential Read  
A Sequential Read operation is initiated in the same way as a Random Read operation, except after the  
AT30TSE004A transmits the first data word, the Master responds with an ACK (instead of a NACK followed by  
a Stop condition). As long as the AT34TSE004A receives an ACK, it will continue to increment the data word  
address and serially clock out the sequential data words (see Figure 7-11). When the internal address counter is  
at the last byte of the last page, the data word address will roll-over to the beginning of the selected 2-Kbit array  
(depending on the SPA setting) starting at address zero, and the Sequential Read operation will continue. The  
Sequential Read operation is terminated when the Master responds with a NACK followed by a Stop condition.  
Figure 7-11. Sequential Read from Serial EEPROM  
1
2
0
3
4
5
6
7
8
1
9
0
1
2
3
4
5
6
7
8
9
0
SCL  
SDA  
Device Address Byte  
Data Word (n)  
1
MSB  
1
0
A2 A1 A0  
D7 D6 D5 D4 D3 D2 D1 D0  
MSB  
Start  
by  
Master  
ACK  
from  
Slave  
ACK  
from  
Master  
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
1
Data Word (n+1)  
Data Word (n+2)  
Data Word (n+x)  
D7 D6 D5 D4 D3 D2 D1 D0  
MSB  
D7 D6 D5 D4 D3 D2 D1 D0  
MSB  
D7 D6 D5 D4 D3 D2 D1 D0  
MSB  
Stop  
by  
Master  
ACK  
from  
Master  
ACK  
from  
Master  
NACK  
from  
Master  
36  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
 
8.  
Electrical Specifications  
8.1  
Absolute Maximum Ratings*  
*Notice: Stresses beyond those listed under “Absolute Maximum  
Ratings” may cause permanent damage to the device.  
Functional operation of the device at these ratings or any  
other conditions beyond those indicated in the operational  
sections of this specification is not implied. Exposure to  
absolute maximum rating conditions for extended periods  
may affect device reliability. Voltage extremes referenced in  
the “Absolute Maximum Ratings” are intended to  
accommodate short duration undershoot/overshoot  
conditions and does not imply or guarantee functional  
device operation at these levels for any extended period of  
time.  
Temperature under Bias. . . . . . . -40°C to +125°C  
Storage Temperature . . . . . . . . -65°C to +150°C  
Supply voltage  
with respect to ground . . . . . . . . . .-0.5V to +4.3V  
A0 Pin . . . . . . . . . . . . . . . . . . . . .-0.5V to +12.0V  
All other input voltages  
with respect to ground . . . . . .-0.5V to VCC + 0.5V  
EVENT Pin . . . . . . . . . . . . . .-0.5V to VCC + 0.3V  
Pull-up voltages applied to the EVENT Pin that exceed the  
“Absolute Maximum Ratings” may forward bias the ESD  
protection circuitry. Doing so may result in improper device  
function and may corrupt temperature measurements.  
All other output voltages  
with respect to ground . . . . . .-0.5V to VCC + 0.5V  
8.2  
DC Characteristics  
Applicable over recommended operating range: TAI = -20°C to +125°C, VCC = 1.7V to 3.6V (unless otherwise noted).  
Symbol  
VCC1  
Parameter  
Test Condition  
Min  
1.7  
2.2  
Typ  
Max  
3.6  
Units  
Supply Voltage  
Supply Voltage  
V
V
VCC2  
3.6  
ICC1  
ICC2  
ICC3  
Supply Current(2)  
Supply Current(2)  
Temp Sensor  
VCC = 3.6V  
VCC = 3.6V  
VCC = 3.6V  
Read at 100kHz  
0.4  
1.5  
0.2  
1.0  
3.0  
0.5  
mA  
mA  
mA  
Write at 100kHz  
EE Inactive  
VCC = 1.7V  
VIN = VCC or VSS  
VIN = VCC or VSS  
1.6  
1.6  
0.1  
0.1  
3.0  
4.0  
μA  
μA  
μA  
μA  
V
ISB  
Standby Current(3)  
VCC = 3.6V  
ILI  
Input Leakage Current  
Output Leakage Current  
Input Low Level(1)  
VIN = VCC or VSS  
2.0  
ILO  
VIL  
VOUT = VCC or VSS  
2.0  
-0.5  
0.3 * VCC  
VIH  
Input High Level(1)  
0.7 * Vcc  
Vcc + 0.5  
0.4  
V
V
VOL1  
VOL2  
VCC > 2V  
IOL = 3mA  
Low-Level Output Voltage  
Open-Drain  
VCC 2V  
IOL = 2mA  
0.2 * VCC  
V
VOL = 0.4V  
VOL = 0.6V  
VOL = 0.4V  
Freq 400kHz  
Freq 400kHz  
Freq > 400kHz  
3.0  
6.0  
mA  
mA  
mA  
IOL  
Low-Level Output Current  
A0 Pin High Voltage  
20.0  
VHV  
VHV - VCC 4.8V  
7
10  
V
V
V
VHYST1  
VHYST2  
Notes: 1.  
Input Hysteresis (SDA, SCL) VCC < 2V  
0.10 * VCC  
0.05 * VCC  
Input Hysteresis (SDA, SCL) VCC 2V  
V
IL min and VIH max are reference only and are not tested.  
2. TS in Shutdown mode.  
3. Serial EEPROM inactive, TS in Shutdown mode.  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
37  
 
 
 
8.3  
AC Characteristics  
Applicable over recommended operating range: TAI = -20°C to +125°C, VCC = 1.7V to 3.6V, CL = 1 TTL Gate and 100μF  
(unless otherwise noted).  
VCC < 2.2V  
100kHz  
VCC 2.2V  
400kHz 1000kHz  
Symbol  
fSCL  
Parameter  
Min  
10(2)  
4700  
4000  
Max  
Min  
Max  
Min  
Max  
Units  
kHz  
ns  
Clock Frequency, SCL  
Clock Pulse Width Low  
Clock Pulse Width High  
Noise Suppression Time  
100  
10(2)  
1300  
600  
400  
10(2)  
500  
260  
1000  
tLOW  
tHIGH  
tI  
ns  
50  
50  
50  
ns  
Time the bus must be free before a  
new transmission can start(1)  
tBUF  
4700  
1300  
500  
ns  
tHD.STA  
tSU.STA  
tHD.DI  
tSU.DAT  
tR  
Start Hold Time  
4000  
4700  
0
600  
600  
0
260  
260  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ms  
ms  
Start Set-up Time  
Data In Hold Time  
Data In Set-up Time  
Inputs Rise Time(1)  
Inputs Fall Time(1)  
Stop Set-up Time  
Data Out Hold Time  
Write Cycle Time  
Timeout Time  
250  
100  
20  
50  
1000  
300  
300  
300  
120  
120  
tF  
20  
tSU.STO  
tHD.DAT  
tWR  
4000  
200  
600  
200  
260  
0
3450  
5
900  
5
350  
5
tOUT  
25  
35  
25  
35  
25  
35  
EEPROM  
Write Endurance  
Write  
Cycles  
25°C, Page Mode(1)  
1,000,000  
Notes: 1. This parameter is ensured by characterization only.  
2. The minimum frequency is specified at 10kHz to avoid activating the timeout feature.  
Figure 8-1.  
SCL: Serial Clock  
SDA: Serial Data I/O  
tHIGH  
tF  
tR  
tLOW  
tLOW  
SCL  
SDA  
tSU.STA  
tHD.STA  
tHD.DAT  
tSU.DAT  
tSU.STO  
tBUF  
38  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
 
 
8.4  
Temperature Sensor Characteristics  
Applicable over recommended operating range: TAI = -20°C to +125°C, VCC = 1.7V to 3.6V (unless otherwise noted).  
Freq. 400kHz  
Freq. > 400kHz  
Symbol Parameter  
Test Condition  
Min  
Typ  
±0.5  
±1.0  
±2.0  
75.0  
0.125  
Max  
Min  
Typ  
±0.5  
±1.0  
±2.0  
75.0  
0.125  
Max  
Units  
°C  
+75°C < Ta < +95°C  
+40°C < Ta < +125°C  
-20°C < Ta < +125°C  
±1.0  
±2.0  
±1.0  
±2.0  
TS Accuracy  
TACC  
°C  
(B-grade)  
±3.0  
±3.0  
°C  
TCONV  
TRES  
TS Conversion Time  
TS Resolution  
125.0  
125.0  
ms  
°C  
8.5  
Pin Capacitance(1)  
Applicable over recommended operating range from TA = +25°C, f = 1MHz, VCC = 1.7V – 3.6V.  
Symbol Test condition  
Max  
8
Units  
pF  
Conditions  
C
C
Input/Output Capacitance (SDA, EVENT)  
V
= 0V  
= 0V  
I/O  
I/O  
Input Capacitance (A0, A1, A2, SCL)  
6
pF  
V
IN  
IN  
Note:  
1. This parameter is ensured by characterization only.  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
39  
 
9.  
Ordering Code Detail  
A T 3 0 T S E 0 0 4 A - M A 5 M - T  
Atmel Designator  
Product Family  
Shipping Carrier Option  
B = Bulk (Tubes)  
T
= Tape and Reel  
Voltage Option  
M = 1.7V to 3.6V  
30TSE = Digital Temperature Sensor  
with Integrated EEPROM  
Sensor Type  
Device Grade  
5
= Green, NiPdAu Lead Finish  
Temperature Range  
(-20°C to +125°C)  
Device Density  
4 = 4-kilobit  
Package Option  
MA = 8-lead, 2.0 x 3.0 x 0.6mm (UDFN)  
MAA = 8-lead, 2.0 x 3.0 x 0.8mm (WDFN)  
Device Revision  
10. Ordering Information  
Operating  
Voltage  
Operational  
Ordering Code(1)  
Package Lead Finish  
Max. Frequency  
Range  
AT30TSE004A-MA5M-T(2)  
AT30TSE004A-MAA5M-T(2)  
8MA2  
8MAA  
NiPdAu  
1.7V to 3.6V  
1000kHz  
–20C to 125C  
Notes: 1. Consistent with the general semiconductor market trend, Atmel will supply devices with either gold or copper  
bond wires to increase manufacturing flexibility and ensure a long-term continuity of supply. There is no  
difference in product quality, reliability, or performance between the two variations.  
2. T = Tape and Reel  
UDFN and WDFN= 5,000 per reel  
Package Type  
8MA2  
8MAA  
8-lead, 2.0 x 3.0 x 0.6mm, Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead (UDFN)  
8-lead, 2.0 x 3.0 x 0.8mm, Thermally Enhanced Plastic Very Very Thin Dual Flat No Lead (WDFN)  
40  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
 
 
11. Part Markings  
AT30TSE004A: Package Marking Information  
8-lead UDFN  
2.0 x 3.0 mm Body  
8-lead WDFN  
2.0 x 3.0 mm Body  
T8A  
T8A  
5M@  
YXX  
5M@  
YXX  
Note 1:  
Designates pin 1  
Note 2: Package drawings are not to scale  
Catalog Number Truncation  
AT30TSE004A  
Truncation Code ###: T8A  
Date Codes  
Voltages  
Y = Year  
2: 2012  
3: 2013  
4: 2014  
5: 2015  
M = Month  
WW = Work Week of Assembly  
% = Minimum Voltage  
M: 1.7V min  
6: 2016  
7: 2017  
8: 2018  
9: 2019  
A: January  
B: February  
...  
02: Week 2  
04: Week 4  
...  
L: December  
52: Week 52  
Country of Assembly  
Lot Number  
AAA...A = Atmel Wafer Lot Number  
Grade/Lead Finish Material  
@ = Country of Assembly  
5: Industrial  
(-20°C to 125°C)  
NiPdAu  
Trace Code  
Atmel Truncation  
XX = Trace Code (Atmel Lot Numbers Correspond to Code)  
Example: AA, AB.... YZ, ZZ  
AT: Atmel  
ATM: Atmel  
ATML: Atmel  
3/8/13  
TITLE  
DRAWING NO.  
REV.  
30TSE004ASM, AT30TSE004A Package Marking Information  
30TSE004A  
A
Package Mark Contact:  
DL-CSO-Assy_eng@atmel.com  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
41  
12. Package Drawings  
12.1 8MA2 — 8-pad UDFN  
E
1
8
7
6
5
Pin 1 ID  
2
3
4
D
C
TOP VIEW  
E2  
SIDE VIEW  
A2  
A
A1  
b (8x)  
8
1
2
3
4
COMMON DIMENSIONS  
(Unit of Measure = mm)  
7
6
5
Pin#1 ID  
D2  
MIN  
0.50  
MAX  
0.60  
NOM  
0.55  
NOTE  
SYMBOL  
A
A1  
A2  
D
0.0  
-
0.02  
-
0.05  
0.55  
2.10  
1.60  
3.10  
1.40  
0.30  
e (6x)  
L (8x)  
BOTTOM VIEW  
K
1.90  
1.40  
2.90  
1.20  
0.18  
2.00  
D2  
E
1.50  
3.00  
Notes:  
1. This drawing is for general information only. Refer to  
Drawing MO-229, for proper dimensions, tolerances,  
datums, etc.  
E2  
b
1.30  
0.25  
3
2. The Pin #1 ID is a laser-marked feature on Top View.  
3. Dimensions b applies to metallized terminal and is  
measured between 0.15 mm and 0.30 mm from the  
terminal tip. If the terminal has the optional radius on  
the other end of the terminal, the dimension should  
not be measured in that radius area.  
C
1.52 REF  
0.35  
L
0.30  
0.20  
0.40  
-
e
0.50 BSC  
-
K
4. The Pin #1 ID on the Bottom View is an orientation  
feature on the thermal pad.  
11/26/14  
TITLE  
DRAWING NO.  
REV.  
GPC  
8MA2, 8-pad 2 x 3 x 0.6mm Body, Thermally  
YNZ  
8MA2  
G
Package Drawing Contact:  
packagedrawings@atmel.com  
Enhanced Plastic Ultra Thin Dual Flat No-Lead  
Package (UDFN)  
42  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
12.2 8MAA — 8-pad WDFN  
TOP VIEW  
BOTTOM VIEW  
A
D2  
b
(8X)  
Pin 1  
Index  
Area  
E2  
E
Pin 1 ID  
L (8X)  
D
e (6X)  
A2  
A1  
1.50 REF.  
A3  
COMMON DIMENSIONS  
(Unit of Measure = mm)  
SIDE VIEW  
MIN  
0.70  
MAX  
0.80  
NOM  
0.75  
NOTE  
SYMBOL  
A
A1  
A2  
A3  
D
0.00  
0.45  
0.02  
0.55  
2.0 REF  
2.00  
-
0.05  
0.65  
1.90  
1.20  
2.90  
1.20  
0.18  
0.30  
2.10  
1.60  
3.10  
1.60  
0.30  
0.45  
D2  
E
3.00  
-
Notes:  
1. This drawing is for general information only. Refer to JEDEC  
Drawing MO-229, WCED-3, for proper dimensions,  
E2  
b
tolerances, datums, etc.  
0.25  
2
2. Dimension b applies to metallized terminal and is measured  
between 0.15 mm and 0.30 mm from the terminal tip. If the  
terminal has the optional radius on the other end of the terminal,  
the dimension should not be measured in that radius area.  
3. Soldering the large thermal pad is optional, but not recommended.  
No electrical connection is accomplished to the device through  
this pad, so if soldered it should be tied to ground  
L
e
0.50 BSC  
09/11/12  
TITLE  
DRAWING NO.  
REV.  
GPC  
8MAA, 8-pad 2.0 x 3.0mm Body, 0.50mm Pitch  
Very, Very Thin Dual No Lead Package  
(WDFN) (Sawn)  
YRV  
8MAA  
A
Package Drawing Contact:  
packagedrawings@atmel.com  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
43  
13. Revision History  
Doc. Rev.  
Date  
Comments  
Updated the Set Page Address and Read Page Address Commands, AC Characteristics  
table, and the 8MA2 package drawing.  
8868D  
10/2015  
8868C  
8868B  
8868A  
12/2013  
07/2013  
04/2013  
Updated Section, “Power-up Conditions” and Figure, “Power-up Timing”.  
Updated the Absolute Maximum Ratings.  
Initial document release.  
FunctionZZ_Summary Notes  
44  
AT30TSE004A [DATASHEET]  
Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015  
X X  
X X X X  
Atmel Corporation  
1600 Technology Drive, San Jose, CA 95110 USA  
T: (+1)(408) 441.0311  
F: (+1)(408) 436.4200  
|
www.atmel.com  
© 2015 Atmel Corporation. / Rev.: Atmel-8868D-DTS-AT30TSE004A-Datasheet_102015.  
Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, and others are registered trademarks or trademarks of Atmel Corporation in U.S. and  
other countries. Other terms and product names may be trademarks of others.  
DISCLAIMER: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right  
is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL TERMS AND CONDITIONS OF SALES LOCATED ON THE  
ATMEL WEBSITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT  
SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES  
FOR LOSS AND PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS  
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this  
document and reserves the right to make changes to specifications and products descriptions at any time without notice. Atmel does not make any commitment to update the information  
contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel products are not intended,  
authorized, or warranted for use as components in applications intended to support or sustain life.  
SAFETY-CRITICAL, MILITARY, AND AUTOMOTIVE APPLICATIONS DISCLAIMER: Atmel products are not designed for and will not be used in connection with any applications where  
the failure of such products would reasonably be expected to result in significant personal injury or death (“Safety-Critical Applications”) without an Atmel officer's specific written  
consent. Safety-Critical Applications include, without limitation, life support devices and systems, equipment or systems for the operation of nuclear facilities and weapons systems.  
Atmel products are not designed nor intended for use in military or aerospace applications or environments unless specifically designated by Atmel as military-grade. Atmel products are  
not designed nor intended for use in automotive applications unless specifically designated by Atmel as automotive-grade.  

相关型号:

AT30TSE004A-MAA5M-T

SENSOR TEMPERATURE I2C 8WDFN
MICROCHIP

AT30TSE752

9- to 12-bit Selectable, ±0.5°C Accurate Digital Temperature Sensor with Nonvolatile Registers and Serial EEPROM
ATMEL

AT30TSE752-MA8-T

9- to 12-bit Selectable, ±0.5°C Accurate Digital Temperature Sensor with Nonvolatile Registers and Serial EEPROM
ATMEL

AT30TSE752-SS8-B

9- to 12-bit Selectable, ±0.5°C Accurate Digital Temperature Sensor with Nonvolatile Registers and Serial EEPROM
ATMEL

AT30TSE752-SS8-T

9- to 12-bit Selectable, ±0.5°C Accurate Digital Temperature Sensor with Nonvolatile Registers and Serial EEPROM
ATMEL

AT30TSE752-XM8-B

9- to 12-bit Selectable, ±0.5°C Accurate Digital Temperature Sensor with Nonvolatile Registers and Serial EEPROM
ATMEL

AT30TSE752-XM8-T

9- to 12-bit Selectable, ±0.5°C Accurate Digital Temperature Sensor with Nonvolatile Registers and Serial EEPROM
ATMEL

AT30TSE752A

9- to 12-bit Selectable, ±0.5°C Accurate Digital Temperature Sensor with Nonvolatile Registers
ATMEL

AT30TSE752A-SS8M-B

Serial Switch/Digital Sensor, 12 Bit(s), 3Cel, Rectangular, Surface Mount, 0.150 INCH, GREEN, PLASTIC, MS-012AA, SOIC-8
ATMEL

AT30TSE752A-SS8M-B

SENSOR TEMP I2C/SMBUS 8SOIC
MICROCHIP

AT30TSE752A-SS8M-T

SENSOR TEMP I2C/SMBUS 8SOIC
MICROCHIP

AT30TSE752A-XM8M-B

SENSOR TEMP I2C/SMBUS 8MSOP
MICROCHIP