93LC76CT-I/SN15KVAO [MICROCHIP]
EEPROM, 512X16, Serial, CMOS, PDSO8;
| 型号： | 93LC76CT-I/SN15KVAO |
| 厂家： | 
MICROCHIP |
| 描述： | EEPROM, 512X16, Serial, CMOS, PDSO8 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 时钟 光电二极管 内存集成电路 |
| 文件： | 总36页 (文件大小：1048K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
93AA76A/B/C, 93LC76A/B/C,
93C76A/B/C
8K Microwire Compatible Serial EEPROM
Device Selection Table
Part Number
VCC Range
ORG Pin
PE Pin
Word Size
Temp Ranges
Packages
93AA76A
93AA76B
93LC76A
93LC76B
93C76A
1.8-5.5
1.8-5-5
2.5-5.5
2.5-5.5
4.5-5.5
4.5-5.5
1.8-5.5
2.5-5.5
4.5-5.5
No
No
No
No
8-bit
16-bit
I
OT, SN
OT, SN
I
No
No
8-bit
I, E
I, E
I, E
I, E
I
OT, SN
No
No
16-bit
OT, SN
No
No
8-bit
OT, SN
93C76B
No
No
16-bit
OT, SN
93AA76C
93LC76C
93C76C
Yes
Yes
Yes
Yes
Yes
Yes
8- or 16-bit
8- or 16-bit
8- or 16-bit
P, SN, ST, MS, MC, MN
P, SN, ST, MS, MC, MN
P, SN, ST, MS, MC, MN
I, E
I, E
Features:
Description:
• Low-Power CMOS Technology
• ORG Pin to Select Word Size for ‘76C’ Version
The Microchip Technology Inc. 93XX76A/B/C devices
are 8Kbit, low-voltage, serial Electrically Erasable
PROMs (EEPROM). Word-selectable devices such as
the 93XX76C are dependent upon external logic levels
driving the ORG pin to set word size. In the SOT-23
package, the 93XX76A devices provide dedicated 8-bit
memory organization, while the 93XX76B devices
provide dedicated 16-bit memory organization. A
Program Enable (PE) pin allows the user to write-protect
the entire memory array. Advanced CMOS technology
makes these devices ideal for low-power, nonvolatile
memory applications. The 93XX Series is available in
standard packages including 8-lead PDIP and SOIC,
and advanced packaging including 8-lead MSOP, 6-lead
SOT-23, 8-lead 2x3 DFN/TDFN and 8-lead TSSOP. All
packages are Pb-free (Matte Tin) finish.
• 1024 x 8-bit Organization ‘A’ Devices (no ORG)
• 512 x 16-bit Organization ‘B’ Devices (no ORG)
• Program Enable Pin to Write-Protect the Entire
Array (‘76C’ version only)
• Self-Timed Erase/Write Cycles (including
Auto-Erase)
• Automatic ERAL Before WRAL
• Power-On/Off Data Protection Circuitry
• Industry Standard 3-Wire Serial I/O
• Device Status Signal (Ready/Busy)
• Sequential Read Function
• 1,000,000 Erase/Write Cycles
• Data Retention > 200 Years
Package Types (not to scale)
• Pb-free and RoHS Compliant
• Temperature Ranges Supported:
SOT-23
(OT)
PDIP/SOIC
(P, SN)
- Industrial (I)
-40°C to +85°C
CS
CLK
DI
1
2
3
4
8
7
6
5
V
PE*
CC
1
6
5
4
- Automotive (E) -40°C to +125°C
DO
V
CC
2
3
VSS
CS
Pin Function Table
ORG*
DI
CLK
DO
VSS
Name
CS
Function
*93XX76C only
Chip Select
CLK
DI
Serial Data Clock
DFN/TDFN
(MC, MN)
Serial Data Input
TSSOP/MSOP
(ST, MS)
DO
Serial Data Output
1
CS
VCC
8
1
8
7
6
5
CS
CLK
DI
V
PE
ORG
VSS
CC
VSS
PE
Ground
7 PE
CLK 2
2
3
4
Program Enable – 93XX76C only
Memory Configuration – 93XX76C only
Power Supply
ORG
6
5
DI
DO
3
4
DO
VSS
ORG
VCC
2003-2011 Microchip Technology Inc.
DS21796L-page 1
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
1.0
ELECTRICAL CHARACTERISTICS
(†)
Absolute Maximum Ratings
VCC.............................................................................................................................................................................7.0V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied................................................................................................-40°C to +125°C
ESD protection on all pins 4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
All parameters apply over the specified
ranges unless otherwise noted.
Industrial (I):
TA = -40°C to +85°C, VCC = +1.8V to 5.5V
Automotive (E): TA = -40°C to +125°C, VCC = +2.5V to 5.5V
Param.
No.
Symbol
Parameter
Min
Typ
Max
Units
Conditions
VCC 2.7V
D1
VIH1
VIH2
High-level input voltage
2.0
0.7 VCC
—
—
VCC +1
VCC +1
V
V
VCC < 2.7V
D2
D3
D4
VIL1
VIL2
Low-level input voltage
Low-level output voltage
High-level output voltage
-0.3
-0.3
—
—
0.8
0.2 VCC
V
V
VCC 2.7V
VCC < 2.7V
VOL1
VOL2
—
—
—
—
0.4
0.2
V
V
IOL = 2.1 mA, VCC = 4.5V
IOL = 100 A, VCC = 2.5V
VOH1
VOH2
2.4
VCC - 0.2
—
—
—
—
V
V
IOH = -400 A, VCC = 4.5V
IOH = -100 A, VCC = 2.5V
D5
D6
D7
ILI
Input leakage current
Output leakage current
—
—
—
—
—
—
±1
±1
7
A
A
pF
VIN = VSS or VCC
ILO
VOUT = VSS or VCC
CIN,
COUT
Pin capacitance (all inputs/
outputs)
VIN/VOUT = 0V (Note 1)
TA = 25°C, FCLK = 1 MHz
D8
D9
ICC write Write current
—
—
—
500
3
—
mA
A
FCLK = 3 MHz, VCC = 5.5V
FCLK = 2 MHz, VCC = 2.5V
ICC read Read current
—
—
—
—
—
100
1
500
—
mA
A
A
FCLK = 3 MHz, VCC = 5.5V
FCLK = 2 MHz, VCC = 3.0V
FCLK = 2 MHz, VCC = 2.5V
D10
D11
ICCS
Standby current
—
—
—
—
1
5
A
A
I – Temp
E – Temp
CLK = CS = 0V
ORG = DI = PE = VSS or VCC
(Note 2) (Note 3)
VPOR
VCC voltage detect
(Note 1)
—
—
1.5
3.8
—
—
V
V
93AA76A/B/C, 93LC76A/B/C
93C76A/B/C
Note 1: This parameter is periodically sampled and not 100% tested.
2: ORG and PE pins not available on ‘A’ or ‘B’ versions.
3: Ready/Busy status must be cleared from DO; see Section 3.4 “Data Out (DO)”.
DS21796L-page 2
2003-2011 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
TABLE 1-2:
AC CHARACTERISTICS
All parameters apply over the specified
ranges unless otherwise noted.
Industrial (I):
TA = -40°C to +85°C, VCC = +1.8V to 5.5V
Automotive (E): TA = -40°C to +125°C, VCC = +2.5V to 5.5V
Param.
No.
Symbol
Parameter
Clock frequency
Min
Max
Units
Conditions
A1
FCLK
—
3
2
1
MHz 4.5V VCC < 5.5V
MHz 2.5V VCC < 4.5V
MHz 1.8V VCC < 2.5V
A2
A3
A4
TCKH
TCKL
TCSS
Clock high time
200
250
450
—
—
—
ns
ns
ns
4.5V VCC < 5.5V
2.5V VCC < 4.5V
1.8V VCC < 2.5V
Clock low time
100
200
450
ns
ns
ns
4.5V VCC < 5.5V
2.5V VCC < 4.5V
1.8V VCC < 2.5V
Chip Select setup time
50
100
250
ns
ns
ns
4.5V VCC < 5.5V
2.5V VCC < 4.5V
1.8V VCC < 2.5V
A5
A6
A7
TCSH
TCSL
TDIS
Chip Select hold time
Chip Select low time
Data input setup time
0
—
—
—
ns
ns
1.8V VCC < 5.5V
1.8V VCC < 5.5V
250
50
100
250
ns
ns
ns
4.5V VCC < 5.5V
2.5V VCC < 4.5V
1.8V VCC < 2.5V
A8
A9
TDIH
TPD
Data input hold time
50
100
250
—
ns
ns
ns
4.5V VCC < 5.5V
2.5V VCC < 4.5V
1.8V VCC < 2.5V
Data output delay time
—
100
250
400
ns
ns
ns
4.5V VCC < 5.5V, CL = 100 pF
2.5V VCC < 4.5V, CL = 100 pF
1.8V VCC < 2.5V, CL = 100 pF
A10
A11
TCZ
TSV
Data output disable time
Status valid time
—
—
100
200
ns
ns
4.5V VCC < 5.5V, (Note 1)
1.8V VCC < 4.5V, (Note 1)
200
300
500
ns
ns
ns
4.5V VCC < 5.5V, CL = 100 pF
2.5V VCC < 4.5V, CL = 100 pF
1.8V VCC < 2.5V, CL = 100 pF
A12
A13
TWC
TWC
Program cycle time
—
—
5
ms
Erase/Write mode (AA and LC
versions)
2
ms
Erase/Write mode
(93C versions)
A14
A15
A16
TEC
TWL
—
—
—
6
ms
ms
ERAL mode, 4.5V VCC 5.5V
WRAL mode, 4.5V VCC 5.5V
15
—
Endurance
1M
cycles 25°C, VCC = 5.0V, (Note 2)
Note 1: This parameter is periodically sampled and not 100% tested.
2: This application is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model, which may be obtained from Microchip’s web
site at www.microchip.com.
2003-2011 Microchip Technology Inc.
DS21796L-page 3
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
FIGURE 1-1:
SYNCHRONOUS DATA TIMING
VIH
VIL
VIH
CS
TCSS
TCKH
TCKL
TCSH
CLK
DI
VIL
TDIS
TDIH
VIH
VIL
TCZ
TCZ
TPD
TPD
VOH
DO
(Read)
VOL
VOH
TSV
DO
(Program)
Status Valid
VOL
Note: TSV is relative to CS.
TABLE 1-3: INSTRUCTION SET FOR X16 ORGANIZATION (93XX76B OR 93XX76C WITH ORG = 1)
Req. CLK
Cycles
Instruction SB Opcode
Address
Data In
Data Out
READ
EWEN
ERASE
ERAL
WRITE
WRAL
EWDS
1
1
1
1
1
1
1
10
00
11
00
01
00
00
X
1
X
1
X
0
0
A8 A7 A6 A5 A4 A3 A2 A1 A0
—
—
—
—
D15-D0
High-Z
29
13
13
13
29
29
13
1
x
x
x
x
x
x
x
x
A8 A7 A6 A5 A4 A3 A2 A1 A0
(RDY/BSY)
(RDY/BSY)
(RDY/BSY)
0
X
X
X
X
X
X
X
X
A8 A7 A6 A5 A4 A3 A2 A1 A0 D15-D0
1
0
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
D15-D0 (RDY/BSY)
High-Z
—
TABLE 1-4: INSTRUCTION SET FOR X8 ORGANIZATION (93XX76A OR 93XX76C WITH ORG = 0)
Req.CLK
Cycles
Instruction SB Opcode
Address
Data In
Data Out
READ
EWEN
ERASE
ERAL
WRITE
WRAL
EWDS
1
1
1
1
1
1
1
10
00
11
00
01
00
00
X
1
X
1
X
0
0
A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
—
—
—
—
D7-D0
High-Z
22
14
14
14
22
22
14
1
x
x
x
x
x
x
x
x
x
A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
(RDY/BSY)
(RDY/BSY)
(RDY/BSY)
(RDY/BSY)
High-Z
0
x
x
x
x
x
x
x
x
x
A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7-D0
1
0
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
D7-D0
—
DS21796L-page 4
2003-2011 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
2.3
Data Protection
2.0
FUNCTIONAL DESCRIPTION
All modes of operation are inhibited when VCC is below
a typical voltage of 1.5V for ‘93AA’ and ‘93LC’ devices
or 3.8V for ‘93C’ devices.
When the ORG pin (93XX76C) is connected to VCC,
the (x16) organization is selected. When it is connected
to ground, the (x8) organization is selected. Instruc-
tions, addresses and write data are clocked into the DI
pin on the rising edge of the clock (CLK). The DO pin is
normally held in a High-Z state except when reading
data from the device, or when checking the Ready/
Busy status during a programming operation. The
Ready/Busy status can be verified during an Erase/
Write operation by polling the DO pin; DO low indicates
that programming is still in progress, while DO high
indicates the device is ready. DO will enter the High-Z
state on the falling edge of CS.
The EWEN and EWDS commands give additional
protection against accidentally programming during
normal operation.
Note:
For added protection, an EWDS command
should be performed after every write
operation and an external 10 k pull-down
protection resistor should be added to the
CS pin.
After power-up the device is automatically in the EWDS
mode. Therefore, an EWEN instruction must be
performed before the initial ERASEor WRITEinstruction
can be executed.
2.1
Start Condition
The Start bit is detected by the device if CS and DI are
both high with respect to the positive edge of CLK for
the first time.
Note:
To prevent accidental writes to the array in
the 93XX76C devices, set the PE pin to a
logic low.
Before a Start condition is detected, CS, CLK and DI
may change in any combination (except to that of a
Start condition), without resulting in any device
operation (Read, Write, Erase, EWEN, EWDS, ERAL
or WRAL). As soon as CS is high, the device is no
longer in Standby mode.
Block Diagram
VCC
VSS
Address
Decoder
Memory
Array
An instruction following a Start condition will only be
executed if the required opcode, address and data bits
for any particular instruction are clocked in.
Address
Counter
Note:
When preparing to transmit an instruction,
either the CLK or DI signal levels must be
at a logic low as CS is toggled active high.
DO
Output
Buffer
Data Register
DI
2.2
Data In/Data Out (DI/DO)
Mode
Decode
Logic
It is possible to connect the Data In and Data Out pins
together. However, with this configuration it is possible
for a “bus conflict” to occur during the “dummy zero”
that precedes the read operation if A0 is a logic high-
level. Under such a condition the voltage level seen at
Data Out is undefined and will depend upon the relative
impedances of Data Out and the signal source driving
A0. The higher the current sourcing capability of the
driver, the higher the voltage at the Data Out pin. In
order to limit this current, a resistor should be
connected between DI and DO.
ORG*
CS
PE*
Clock
Register
CLK
*ORG and PE inputs are not available on
A/B devices.
2003-2011 Microchip Technology Inc.
DS21796L-page 5
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
The DO pin indicates the Ready/Busy status of the
2.4
Erase
device if CS is brought high after a minimum of 250 ns
low (TCSL). DO at logical ‘0’ indicates that programming
is still in progress. DO at logical ‘1’ indicates that the
register at the specified address has been erased and
the device is ready for another instruction.
The ERASE instruction forces all data bits of the
specified address to the logical ‘1’ state. The rising
edge of CLK before the last address bit initiates the
write cycle.
Note:
After the Erase cycle is complete, issuing
a Start bit and then taking CS low will clear
the Ready/Busy status from DO.
FIGURE 2-1:
ERASE TIMING
TCSL
CS
Check Status
CLK
DI
1
1
1
AN
AN-1 AN-2
A0
•••
TSV
TCZ
High-Z
Busy
Ready
DO
High-Z
TWC
The DO pin indicates the Ready/Busy status of the
device, if CS is brought high after a minimum of 250 ns
low (TCSL).
2.5
Erase All (ERAL)
The Erase All (ERAL) instruction will erase the entire
memory array to the logical ‘1’ state. The ERAL cycle
is identical to the erase cycle, except for the different
opcode. The ERAL cycle is completely self-timed. The
rising edge of CLK before the last data bit initiates the
write cycle. Clocking of the CLK pin is not necessary
after the device has entered the ERAL cycle.
Note:
After the ERAL command is complete,
issuing a Start bit and then taking CS low
will clear the Ready/Busy status from DO.
VCC must be 4.5V for proper operation of ERAL.
FIGURE 2-2:
ERAL TIMING
TCSL
CS
Check Status
CLK
DI
1
0
0
1
0
x
x
•••
TSV
TCZ
High-Z
Busy
Ready
DO
High-Z
TEC
DS21796L-page 6
2003-2011 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
Once the EWEN instruction is executed, programming
remains enabled until an EWDSinstruction is executed
or VCC is removed from the device.
2.6
Erase/Write Disable and Enable
(EWDS/EWEN)
The 93XX76A/B/C powers up in the Erase/Write
Disable (EWDS) state. All programming modes must be
preceded by an Erase/Write Enable (EWEN) instruction.
To protect against accidental data disturbance, the
EWDSinstruction can be used to disable all erase/write
functions and should follow all programming opera-
tions. Execution of a READinstruction is independent of
both the EWENand EWDSinstructions.
FIGURE 2-3:
EWDS TIMING
TCSL
CS
CLK
DI
•••
1
0
0
0
0
x
x
FIGURE 2-4:
EWEN TIMING
TCSL
CS
CLK
DI
•••
1
0
0
1
1
x
x
The output data bits will toggle on the rising edge of the
CLK and are stable after the specified time delay (TPD).
Sequential read is possible when CS is held high. The
memory data will automatically cycle to the next register
and output sequentially.
2.7
Read
The READ instruction outputs the serial data of the
addressed memory location on the DO pin. A dummy
zero bit precedes the 8-bit (If ORG pin is low or A-version
devices) or 16-bit (If ORG pin is high or B-version
devices) output string.
FIGURE 2-5:
READ TIMING
CS
CLK
DI
•••
A0
AN
1
1
0
High-Z
DO
0
Dx
D0
Dx
D0
Dx
D0
•••
•••
•••
2003-2011 Microchip Technology Inc.
DS21796L-page 7
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
The DO pin indicates the Ready/Busy status of the
2.8
Write
device, if CS is brought high after a minimum of 250 ns
low (TCSL). DO at logical ‘0’ indicates that programming
is still in progress. DO at logical ‘1’ indicates that the
register at the specified address has been written with
the data specified and the device is ready for another
instruction.
The WRITE instruction is followed by 8 bits (if ORG is
low or A-version devices) or 16 bits (if ORG pin is high
or B-version devices) of data which are written into the
specified address. The self-timed auto-erase and
programming cycle is initiated by the rising edge of CLK
on the last data bit.
Note:
The write sequence requires a logic high
signal on the PE pin prior to the rising
edge of the last data bit.
Note:
After the Write cycle is complete, issuing a
Start bit and then taking CS low will clear
the Ready/Busy status from DO.
FIGURE 2-6:
WRITE TIMING
TCSL
CS
CLK
DI
0
1
1
AN
A0
Dx
D0
•••
•••
TSV
TCZ
High-Z
Busy
Ready
DO
High-Z
TWC
DS21796L-page 8
2003-2011 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
The DO pin indicates the Ready/Busy status of the
device if CS is brought high after a minimum of 250 ns
2.9
Write All (WRAL)
The Write All (WRAL) instruction will write the entire
memory array with the data specified in the command.
The self-timed auto-erase and programming cycle is
initiated by the rising edge of CLK on the last data bit.
Clocking of the CLK pin is not necessary after the
device has entered the WRAL cycle. The WRAL
command includes an automatic ERAL cycle for the
device, so the WRAL instruction does not require an
ERAL instruction. However, the chip must be in the
EWEN status.
low (TCSL).
Note:
The write sequence requires a logic high
signal on the PE pin prior to the rising
edge of the last data bit.
Note:
After the Write All cycle is complete,
issuing a Start bit and then taking CS low
will clear the Ready/Busy status from DO.
VCC must be 4.5V for proper operation of WRAL.
FIGURE 2-7:
WRAL TIMING
TCSL
CS
CLK
0
1
x
1
0
0
•••
Dx
•••
DI
x
D0
TSV
TCZ
High-Z
Busy Ready
DO
HIGH-Z
TWL
2003-2011 Microchip Technology Inc.
DS21796L-page 9
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
3.0
PIN DESCRIPTIONS
TABLE 3-1:
Name
PIN DESCRIPTIONS
PDIP
SOIC
TSSOP
MSOP
DFN(1)
TDFN(1) SOT-23
Function
Chip Select
CS
1
2
3
4
5
6
1
2
3
4
5
6
1
2
3
4
5
6
1
2
3
4
5
6
1
2
3
4
5
6
1
2
3
4
5
6
5
4
CLK
DI
Serial Clock
Data In
3
DO
VSS
ORG
1
Data Out
Ground
2
—
Organization/93XX76C
only
PE
7
7
7
7
7
7
—
Program Enable/
93XX76C only
VCC
8
8
8
8
8
8
6
Power Supply
Note 1: The exposed pad on the DFN/TDFN package may be connected to VSS or left floating.
data bits before an instruction is executed. CLK and DI
then become “don’t care” inputs waiting for a new Start
condition to be detected.
3.1
Chip Select (CS)
A high level selects the device; a low level deselects
the device and forces it into Standby mode. However, a
programming cycle that is already in progress will be
completed, regardless of the Chip Select (CS) input
signal. If CS is brought low during a program cycle, the
device will go into Standby mode as soon as the
programming cycle is completed.
3.3
Data In (DI)
Data In (DI) is used to clock in a Start bit, opcode,
address and data synchronously with the CLK input.
3.4
Data Out (DO)
CS must be low for 250 ns minimum (TCSL) between
consecutive instructions. If CS is low, the internal
control logic is held in a Reset status.
Data Out (DO) is used in the Read mode to output data
synchronously with the CLK input (TPD after the
positive edge of CLK).
3.2
Serial Clock (CLK)
This pin also provides Ready/Busy status information
during erase and write cycles. Ready/Busy status infor-
mation is available on the DO pin if CS is brought high
after being low for minimum Chip Select Low Time
(TCSL) and an erase or write operation has been
initiated.
The Serial Clock is used to synchronize the communi-
cation between a master device and the 93XX series
device. Opcodes, address and data bits are clocked in
on the positive edge of CLK. Data bits are also clocked
out on the positive edge of CLK.
CLK can be stopped anywhere in the transmission
sequence (at high or low-level) and can be continued
anytime with respect to Clock High Time (TCKH) and
Clock Low Time (TCKL). This gives the controlling
master freedom in preparing opcode, address and
data.
The Status signal is not available on DO, if CS is held
low during the entire erase or write cycle. In this case,
DO is in the High-Z mode. If status is checked after the
erase/write cycle, the data line will be high to indicate
the device is ready.
Note:
After a programming cycle is complete,
issuing a Start bit and then taking CS low
will clear the Ready/Busy status from DO.
CLK is a “don’t care” if CS is low (device deselected). If
CS is high, but the Start condition has not been
detected (DI = 0), any number of clock cycles can be
received by the device without changing its status (i.e.,
waiting for a Start condition).
3.5
Organization (ORG)
When the ORG pin is connected to VCC or Logic HI, the
(x16) memory organization is selected. When the ORG
pin is tied to VSS or Logic LO, the (x8) memory
organization is selected. For proper operation, ORG
must be tied to a valid logic level.
CLK cycles are not required during the self-timed write
(i.e., auto erase/write) cycle.
After detection of a Start condition the specified number
of clock cycles (respectively, low-to-high transitions of
CLK) must be provided. These clock cycles are
required to clock in all required opcode, address and
93XX76A devices are always (x8) organization and
93XX76B devices are always (x16) organization.
DS21796L-page 10
2003-2011 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
3.6
Program Enable (PE)
This pin allows the user to enable or disable the ability
to write data to the memory array. If the PE pin is tied
to VCC, the device can be programmed. If the PE pin is
tied to VSS, programming will be inhibited. This pin
cannot be floated – it must be tied to VCC or VSS. PE is
not available on 93XX76A or 93XX76B. On those
devices, programming is always enabled.
2003-2011 Microchip Technology Inc.
DS21796L-page 11
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
4.0
4.1
PACKAGING INFORMATION
Package Marking Information
8-Lead MSOP (150 mil)
Example:
3L76CI
5281L7
XXXXXXT
YWWNNN
Example:
4EL7
6-Lead SOT-23
XXNN
Example:
93LC76C
8-Lead PDIP
XXXXXXXX
T/XXXNNN
I/P
1L7
e
3
0528
YYWW
Example:
93LC76CI
8-Lead SOIC
XXXXXXXT
SN
0528
e
3
XXXXYYWW
1L7
NNN
Example:
8-Lead TSSOP
L76C
I528
1L7
XXXX
TYWW
NNN
Example:
8-Lead 2x3 DFN
3B4
528
L7
XXX
YWW
NN
Example:
8-Lead 2x3 TDFN
EB4
528
L7
XXX
YWW
NN
DS21796L-page 12
2003-2011 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
1st Line Marking Codes
Part Number
SOT-23
DFN
TDFN
TSSOP
MSOP
I Temp.
E Temp.
I Temp.
E Temp.
I Temp.
E Temp.
93AA76A
93AA76B
93AA76C
93LC76A
93LC76B
93LC76C
93C76A
—
—
—
—
4BNN
4LNN
—
—
—
—
—
—
—
—
—
—
—
A76C
—
3A76CT
—
—
3B1
—
—
EB1
—
—
4ENN
4PNN
—
4FNN
4RNN
—
—
—
—
—
—
—
—
—
L76C
—
3L76CT
—
3B4
—
3B5
—
EB4
—
EB5
—
4HNN
4TNN
—
4JNN
4UNN
—
93C76B
—
—
—
—
—
—
93C76C
C76C
3C76CT
3B7
3B8
EB7
EB8
Note:
T = Temperature grade (I, E)
NN = Alphanumeric traceability code
Legend: XX...X Part number or part number code
T
Temperature (I, E)
Y
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
YY
WW
NNN
e
3
Note: For very small packages with no room for the Pb-free JEDEC designator
, the marking will only appear on the outer carton or reel label.
e
3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2003-2011 Microchip Technology Inc.
DS21796L-page 13
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21796L-page 14
2003-2011 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2003-2011 Microchip Technology Inc.
DS21796L-page 15
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21796L-page 16
2003-2011 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢈꢆꢏꢐꢊꢈꢋꢑꢃꢆꢒꢓꢄꢑꢉꢋꢉꢊꢔꢓꢆꢕꢏꢒꢖꢆꢗꢍꢏꢒꢁꢘꢙꢚ
ꢛꢔꢊꢃꢜ ꢧꢈꢓꢉꢍꢒꢅꢉꢄꢈꢇꢍꢉꢎꢐꢓꢓꢅꢆꢍꢉꢔꢊꢎꢨꢊꢚꢅꢉꢋꢓꢊꢦꢃꢆꢚꢇꢩꢉꢔꢏꢅꢊꢇꢅꢉꢇꢅꢅꢉꢍꢒꢅꢉꢕꢃꢎꢓꢈꢎꢒꢃꢔꢉꢪꢊꢎꢨꢊꢚꢃꢆꢚꢉꢜꢔꢅꢎꢃꢑꢃꢎꢊꢍꢃꢈꢆꢉꢏꢈꢎꢊꢍꢅꢋꢉꢊꢍꢉ
ꢒꢍꢍꢔꢢꢫꢫꢦꢦꢦꢁꢄꢃꢎꢓꢈꢎꢒꢃꢔꢁꢎꢈꢄꢫꢔꢊꢎꢨꢊꢚꢃꢆꢚ
b
4
N
E
E1
PIN 1 ID BY
LASER MARK
1
2
3
e
e1
D
c
A
φ
A2
L
A1
L1
ꢬꢆꢃꢍꢇꢕꢭꢮꢮꢭꢕꢌꢣꢌꢯꢜ
ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢉꢮꢃꢄꢃꢍꢇ
ꢕꢭꢰ
ꢰꢱꢕ
ꢕꢛꢲ
ꢰꢐꢄꢳꢅꢓꢉꢈꢑꢉꢪꢃꢆꢇꢰ
ꢪꢃꢍꢎꢒ
ꢱꢐꢍꢇꢃꢋꢅꢉꢮꢅꢊꢋꢉꢪꢃꢍꢎꢒ
ꢱꢥꢅꢓꢊꢏꢏꢉꢶꢅꢃꢚꢒꢍ
ꢕꢈꢏꢋꢅꢋꢉꢪꢊꢎꢨꢊꢚꢅꢉꢣꢒꢃꢎꢨꢆꢅꢇꢇ
ꢜꢍꢊꢆꢋꢈꢑꢑ
ꢱꢥꢅꢓꢊꢏꢏꢉꢺꢃꢋꢍꢒ
ꢕꢈꢏꢋꢅꢋꢉꢪꢊꢎꢨꢊꢚꢅꢉꢺꢃꢋꢍꢒ
ꢱꢥꢅꢓꢊꢏꢏꢉꢮꢅꢆꢚꢍꢒ
ꢧꢈꢈꢍꢉꢮꢅꢆꢚꢍꢒ
ꢴ
ꢅ
ꢅꢀ
ꢛ
ꢛꢘ
ꢛꢀ
ꢌ
ꢌꢀ
ꢂ
ꢮ
ꢗꢁꢵꢟꢉꢠꢜꢡ
ꢀꢁꢵꢗꢉꢠꢜꢡ
ꢗꢁꢵꢗ
ꢗꢁꢸꢵ
ꢗꢁꢗꢗ
ꢘꢁꢘꢗ
ꢀꢁꢹꢗ
ꢘꢁꢙꢗ
ꢗꢁꢀꢗ
ꢗꢁꢹꢟ
ꢗꢻ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢀꢁꢞꢟ
ꢀꢁꢹꢗ
ꢗꢁꢀꢟ
ꢹꢁꢘꢗ
ꢀꢁꢸꢗ
ꢹꢁꢀꢗ
ꢗꢁꢴꢗ
ꢗꢁꢸꢗ
ꢹꢗꢻ
ꢧꢈꢈꢍꢔꢓꢃꢆꢍ
ꢧꢈꢈꢍꢉꢛꢆꢚꢏꢅ
ꢮꢅꢊꢋꢉꢣꢒꢃꢎꢨꢆꢅꢇꢇ
ꢮꢅꢊꢋꢉꢺꢃꢋꢍꢒ
ꢮꢀ
ꢀ
ꢎ
ꢳ
ꢗꢁꢗꢸ
ꢗꢁꢘꢗ
ꢗꢁꢘꢴ
ꢗꢁꢟꢀ
ꢛꢔꢊꢃꢉꢜ
ꢀꢁ ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢇꢉꢂꢉꢊꢆꢋꢉꢌꢀꢉꢋꢈꢉꢆꢈꢍꢉꢃꢆꢎꢏꢐꢋꢅꢉꢄꢈꢏꢋꢉꢑꢏꢊꢇꢒꢉꢈꢓꢉꢔꢓꢈꢍꢓꢐꢇꢃꢈꢆꢇꢁꢉꢕꢈꢏꢋꢉꢑꢏꢊꢇꢒꢉꢈꢓꢉꢔꢓꢈꢍꢓꢐꢇꢃꢈꢆꢇꢉꢇꢒꢊꢏꢏꢉꢆꢈꢍꢉꢅꢖꢎꢅꢅꢋꢉꢗꢁꢀꢘꢙꢉꢄꢄꢉꢔꢅꢓꢉꢇꢃꢋꢅꢁ
ꢘꢁ ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢃꢆꢚꢉꢊꢆꢋꢉꢍꢈꢏꢅꢓꢊꢆꢎꢃꢆꢚꢉꢔꢅꢓꢉꢛꢜꢕꢌꢉꢝꢀꢞꢁꢟꢕꢁ
ꢠꢜꢡꢢ ꢠꢊꢇꢃꢎꢉꢂꢃꢄꢅꢆꢇꢃꢈꢆꢁꢉꢣꢒꢅꢈꢓꢅꢍꢃꢎꢊꢏꢏꢤꢉꢅꢖꢊꢎꢍꢉꢥꢊꢏꢐꢅꢉꢇꢒꢈꢦꢆꢉꢦꢃꢍꢒꢈꢐꢍꢉꢍꢈꢏꢅꢓꢊꢆꢎꢅꢇꢁ
ꢕꢃꢎꢓꢈꢎꢒꢃꢔ ꢣꢅꢎꢒꢆꢈꢏꢈꢚꢤ ꢂꢓꢊꢦꢃꢆꢚ ꢡꢗꢞꢼꢗꢘꢸꢠ
2003-2011 Microchip Technology Inc.
DS21796L-page 17
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21796L-page 18
2003-2011 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
ꢝꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢞꢐꢄꢈꢆꢟꢑꢁꢂꢋꢑꢃꢆꢕꢇꢖꢆꢠꢆꢙꢡꢡꢆꢎꢋꢈꢆꢢꢔꢅꢣꢆꢗꢇꢞꢟꢇꢚ
ꢛꢔꢊꢃꢜ ꢧꢈꢓꢉꢍꢒꢅꢉꢄꢈꢇꢍꢉꢎꢐꢓꢓꢅꢆꢍꢉꢔꢊꢎꢨꢊꢚꢅꢉꢋꢓꢊꢦꢃꢆꢚꢇꢩꢉꢔꢏꢅꢊꢇꢅꢉꢇꢅꢅꢉꢍꢒꢅꢉꢕꢃꢎꢓꢈꢎꢒꢃꢔꢉꢪꢊꢎꢨꢊꢚꢃꢆꢚꢉꢜꢔꢅꢎꢃꢑꢃꢎꢊꢍꢃꢈꢆꢉꢏꢈꢎꢊꢍꢅꢋꢉꢊꢍꢉ
ꢒꢍꢍꢔꢢꢫꢫꢦꢦꢦꢁꢄꢃꢎꢓꢈꢎꢒꢃꢔꢁꢎꢈꢄꢫꢔꢊꢎꢨꢊꢚꢃꢆꢚ
N
NOTE 1
E1
3
1
2
D
E
A2
A
L
A1
c
e
eB
b1
b
ꢬꢆꢃꢍꢇꢭꢰꢡꢶꢌꢜ
ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢉꢮꢃꢄꢃꢍꢇ
ꢕꢭꢰ
ꢰꢱꢕ
ꢕꢛꢲ
ꢰꢐꢄꢳꢅꢓꢉꢈꢑꢉꢪꢃꢆꢇꢰ
ꢪꢃꢍꢎꢒ
ꢣꢈꢔꢉꢍꢈꢉꢜꢅꢊꢍꢃꢆꢚꢉꢪꢏꢊꢆꢅ
ꢸ
ꢅ
ꢛ
ꢁꢀꢗꢗꢉꢠꢜꢡ
ꢷ
ꢷ
ꢁꢘꢀꢗ
ꢁꢀꢵꢟ
ꢷ
ꢕꢈꢏꢋꢅꢋꢉꢪꢊꢎꢨꢊꢚꢅꢉꢣꢒꢃꢎꢨꢆꢅꢇꢇ
ꢠꢊꢇꢅꢉꢍꢈꢉꢜꢅꢊꢍꢃꢆꢚꢉꢪꢏꢊꢆꢅ
ꢜꢒꢈꢐꢏꢋꢅꢓꢉꢍꢈꢉꢜꢒꢈꢐꢏꢋꢅꢓꢉꢺꢃꢋꢍꢒ
ꢕꢈꢏꢋꢅꢋꢉꢪꢊꢎꢨꢊꢚꢅꢉꢺꢃꢋꢍꢒ
ꢱꢥꢅꢓꢊꢏꢏꢉꢮꢅꢆꢚꢍꢒ
ꢣꢃꢔꢉꢍꢈꢉꢜꢅꢊꢍꢃꢆꢚꢉꢪꢏꢊꢆꢅ
ꢮꢅꢊꢋꢉꢣꢒꢃꢎꢨꢆꢅꢇꢇ
ꢬꢔꢔꢅꢓꢉꢮꢅꢊꢋꢉꢺꢃꢋꢍꢒ
ꢛꢘ
ꢛꢀ
ꢌ
ꢌꢀ
ꢂ
ꢮ
ꢎ
ꢳꢀ
ꢳ
ꢅꢠ
ꢁꢀꢀꢟ
ꢁꢗꢀꢟ
ꢁꢘꢵꢗ
ꢁꢘꢞꢗ
ꢁꢹꢞꢸ
ꢁꢀꢀꢟ
ꢁꢗꢗꢸ
ꢁꢗꢞꢗ
ꢁꢗꢀꢞ
ꢷ
ꢁꢀꢹꢗ
ꢷ
ꢁꢹꢀꢗ
ꢁꢘꢟꢗ
ꢁꢹꢴꢟ
ꢁꢀꢹꢗ
ꢁꢗꢀꢗ
ꢁꢗꢴꢗ
ꢁꢗꢀꢸ
ꢷ
ꢁꢹꢘꢟ
ꢁꢘꢸꢗ
ꢁꢞꢗꢗ
ꢁꢀꢟꢗ
ꢁꢗꢀꢟ
ꢁꢗꢙꢗ
ꢁꢗꢘꢘ
ꢁꢞꢹꢗ
ꢮꢈꢦꢅꢓꢉꢮꢅꢊꢋꢉꢺꢃꢋꢍꢒ
ꢱꢥꢅꢓꢊꢏꢏꢉꢯꢈꢦꢉꢜꢔꢊꢎꢃꢆꢚꢉꢉꢽ
ꢛꢔꢊꢃꢉꢜ
ꢀꢁ ꢪꢃꢆꢉꢀꢉꢥꢃꢇꢐꢊꢏꢉꢃꢆꢋꢅꢖꢉꢑꢅꢊꢍꢐꢓꢅꢉꢄꢊꢤꢉꢥꢊꢓꢤꢩꢉꢳꢐꢍꢉꢄꢐꢇꢍꢉꢳꢅꢉꢏꢈꢎꢊꢍꢅꢋꢉꢦꢃꢍꢒꢉꢍꢒꢅꢉꢒꢊꢍꢎꢒꢅꢋꢉꢊꢓꢅꢊꢁ
ꢘꢁ ꢽꢉꢜꢃꢚꢆꢃꢑꢃꢎꢊꢆꢍꢉꢡꢒꢊꢓꢊꢎꢍꢅꢓꢃꢇꢍꢃꢎꢁ
ꢹꢁ ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢇꢉꢂꢉꢊꢆꢋꢉꢌꢀꢉꢋꢈꢉꢆꢈꢍꢉꢃꢆꢎꢏꢐꢋꢅꢉꢄꢈꢏꢋꢉꢑꢏꢊꢇꢒꢉꢈꢓꢉꢔꢓꢈꢍꢓꢐꢇꢃꢈꢆꢇꢁꢉꢕꢈꢏꢋꢉꢑꢏꢊꢇꢒꢉꢈꢓꢉꢔꢓꢈꢍꢓꢐꢇꢃꢈꢆꢇꢉꢇꢒꢊꢏꢏꢉꢆꢈꢍꢉꢅꢖꢎꢅꢅꢋꢉꢁꢗꢀꢗꢾꢉꢔꢅꢓꢉꢇꢃꢋꢅꢁ
ꢞꢁ ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢃꢆꢚꢉꢊꢆꢋꢉꢍꢈꢏꢅꢓꢊꢆꢎꢃꢆꢚꢉꢔꢅꢓꢉꢛꢜꢕꢌꢉꢝꢀꢞꢁꢟꢕꢁ
ꢠꢜꢡꢢꢉꢠꢊꢇꢃꢎꢉꢂꢃꢄꢅꢆꢇꢃꢈꢆꢁꢉꢣꢒꢅꢈꢓꢅꢍꢃꢎꢊꢏꢏꢤꢉꢅꢖꢊꢎꢍꢉꢥꢊꢏꢐꢅꢉꢇꢒꢈꢦꢆꢉꢦꢃꢍꢒꢈꢐꢍꢉꢍꢈꢏꢅꢓꢊꢆꢎꢅꢇꢁ
ꢕꢃꢎꢓꢈꢎꢒꢃꢔ ꢣꢅꢎꢒꢆꢈꢏꢈꢚꢤ ꢂꢓꢊꢦꢃꢆꢚ ꢡꢗꢞꢼꢗꢀꢸꢠ
2003-2011 Microchip Technology Inc.
DS21796L-page 19
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21796L-page 20
2003-2011 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2003-2011 Microchip Technology Inc.
DS21796L-page 21
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
ꢝꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢈꢆꢏꢐꢊꢈꢋꢑꢃꢆꢕꢍꢛꢖꢆꢠꢆꢛꢄꢓꢓꢔꢤꢥꢆꢙꢦꢧꢡꢆꢎꢎꢆꢢꢔꢅꢣꢆꢗꢍꢏꢟꢨꢚ
ꢛꢔꢊꢃꢜ ꢧꢈꢓꢉꢍꢒꢅꢉꢄꢈꢇꢍꢉꢎꢐꢓꢓꢅꢆꢍꢉꢔꢊꢎꢨꢊꢚꢅꢉꢋꢓꢊꢦꢃꢆꢚꢇꢩꢉꢔꢏꢅꢊꢇꢅꢉꢇꢅꢅꢉꢍꢒꢅꢉꢕꢃꢎꢓꢈꢎꢒꢃꢔꢉꢪꢊꢎꢨꢊꢚꢃꢆꢚꢉꢜꢔꢅꢎꢃꢑꢃꢎꢊꢍꢃꢈꢆꢉꢏꢈꢎꢊꢍꢅꢋꢉꢊꢍꢉ
ꢒꢍꢍꢔꢢꢫꢫꢦꢦꢦꢁꢄꢃꢎꢓꢈꢎꢒꢃꢔꢁꢎꢈꢄꢫꢔꢊꢎꢨꢊꢚꢃꢆꢚ
DS21796L-page 22
2003-2011 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
ꢝꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢒꢩꢋꢑꢆꢍꢩꢓꢋꢑꢪꢆꢍꢎꢄꢈꢈꢆꢏꢐꢊꢈꢋꢑꢃꢆꢕꢍꢒꢖꢆꢠꢆꢫꢦꢫꢆꢎꢎꢆꢢꢔꢅꢣꢆꢗꢒꢍꢍꢏꢇꢚ
ꢛꢔꢊꢃꢜ ꢧꢈꢓꢉꢍꢒꢅꢉꢄꢈꢇꢍꢉꢎꢐꢓꢓꢅꢆꢍꢉꢔꢊꢎꢨꢊꢚꢅꢉꢋꢓꢊꢦꢃꢆꢚꢇꢩꢉꢔꢏꢅꢊꢇꢅꢉꢇꢅꢅꢉꢍꢒꢅꢉꢕꢃꢎꢓꢈꢎꢒꢃꢔꢉꢪꢊꢎꢨꢊꢚꢃꢆꢚꢉꢜꢔꢅꢎꢃꢑꢃꢎꢊꢍꢃꢈꢆꢉꢏꢈꢎꢊꢍꢅꢋꢉꢊꢍꢉ
ꢒꢍꢍꢔꢢꢫꢫꢦꢦꢦꢁꢄꢃꢎꢓꢈꢎꢒꢃꢔꢁꢎꢈꢄꢫꢔꢊꢎꢨꢊꢚꢃꢆꢚ
D
N
E
E1
NOTE 1
1
2
b
e
c
φ
A
A2
A1
L
L1
ꢬꢆꢃꢍꢇꢕꢭꢮꢮꢭꢕꢌꢣꢌꢯꢜ
ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢉꢮꢃꢄꢃꢍꢇ
ꢕꢭꢰ
ꢰꢱꢕ
ꢕꢛꢲ
ꢰꢐꢄꢳꢅꢓꢉꢈꢑꢉꢪꢃꢆꢇꢰ
ꢪꢃꢍꢎꢒ
ꢸ
ꢅ
ꢗꢁꢴꢟꢉꢠꢜꢡ
ꢱꢥꢅꢓꢊꢏꢏꢉꢶꢅꢃꢚꢒꢍ
ꢕꢈꢏꢋꢅꢋꢉꢪꢊꢎꢨꢊꢚꢅꢉꢣꢒꢃꢎꢨꢆꢅꢇꢇ
ꢜꢍꢊꢆꢋꢈꢑꢑꢉ
ꢛ
ꢷ
ꢗꢁꢸꢗ
ꢗꢁꢗꢟ
ꢷ
ꢀꢁꢗꢗ
ꢷ
ꢀꢁꢘꢗ
ꢀꢁꢗꢟ
ꢗꢁꢀꢟ
ꢛꢘ
ꢛꢀ
ꢌ
ꢱꢥꢅꢓꢊꢏꢏꢉꢺꢃꢋꢍꢒ
ꢴꢁꢞꢗꢉꢠꢜꢡ
ꢕꢈꢏꢋꢅꢋꢉꢪꢊꢎꢨꢊꢚꢅꢉꢺꢃꢋꢍꢒ
ꢕꢈꢏꢋꢅꢋꢉꢪꢊꢎꢨꢊꢚꢅꢉꢮꢅꢆꢚꢍꢒ
ꢧꢈꢈꢍꢉꢮꢅꢆꢚꢍꢒ
ꢌꢀ
ꢂ
ꢮ
ꢞꢁꢹꢗ
ꢘꢁꢵꢗ
ꢗꢁꢞꢟ
ꢞꢁꢞꢗ
ꢹꢁꢗꢗ
ꢗꢁꢴꢗ
ꢞꢁꢟꢗ
ꢹꢁꢀꢗ
ꢗꢁꢙꢟ
ꢧꢈꢈꢍꢔꢓꢃꢆꢍ
ꢧꢈꢈꢍꢉꢛꢆꢚꢏꢅ
ꢮꢅꢊꢋꢉꢣꢒꢃꢎꢨꢆꢅꢇꢇ
ꢮꢅꢊꢋꢉꢺꢃꢋꢍꢒ
ꢮꢀ
ꢀ
ꢀꢁꢗꢗꢉꢯꢌꢧ
ꢗꢻ
ꢗꢁꢗꢵ
ꢗꢁꢀꢵ
ꢷ
ꢷ
ꢷ
ꢸꢻ
ꢎ
ꢳ
ꢗꢁꢘꢗ
ꢗꢁꢹꢗ
ꢛꢔꢊꢃꢉꢜ
ꢀꢁ ꢪꢃꢆꢉꢀꢉꢥꢃꢇꢐꢊꢏꢉꢃꢆꢋꢅꢖꢉꢑꢅꢊꢍꢐꢓꢅꢉꢄꢊꢤꢉꢥꢊꢓꢤꢩꢉꢳꢐꢍꢉꢄꢐꢇꢍꢉꢳꢅꢉꢏꢈꢎꢊꢍꢅꢋꢉꢦꢃꢍꢒꢃꢆꢉꢍꢒꢅꢉꢒꢊꢍꢎꢒꢅꢋꢉꢊꢓꢅꢊꢁ
ꢘꢁ ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢇꢉꢂꢉꢊꢆꢋꢉꢌꢀꢉꢋꢈꢉꢆꢈꢍꢉꢃꢆꢎꢏꢐꢋꢅꢉꢄꢈꢏꢋꢉꢑꢏꢊꢇꢒꢉꢈꢓꢉꢔꢓꢈꢍꢓꢐꢇꢃꢈꢆꢇꢁꢉꢕꢈꢏꢋꢉꢑꢏꢊꢇꢒꢉꢈꢓꢉꢔꢓꢈꢍꢓꢐꢇꢃꢈꢆꢇꢉꢇꢒꢊꢏꢏꢉꢆꢈꢍꢉꢅꢖꢎꢅꢅꢋꢉꢗꢁꢀꢟꢉꢄꢄꢉꢔꢅꢓꢉꢇꢃꢋꢅꢁ
ꢹꢁ ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢃꢆꢚꢉꢊꢆꢋꢉꢍꢈꢏꢅꢓꢊꢆꢎꢃꢆꢚꢉꢔꢅꢓꢉꢛꢜꢕꢌꢉꢝꢀꢞꢁꢟꢕꢁ
ꢠꢜꢡꢢ ꢠꢊꢇꢃꢎꢉꢂꢃꢄꢅꢆꢇꢃꢈꢆꢁꢉꢣꢒꢅꢈꢓꢅꢍꢃꢎꢊꢏꢏꢤꢉꢅꢖꢊꢎꢍꢉꢥꢊꢏꢐꢅꢉꢇꢒꢈꢦꢆꢉꢦꢃꢍꢒꢈꢐꢍꢉꢍꢈꢏꢅꢓꢊꢆꢎꢅꢇꢁ
ꢯꢌꢧꢢ ꢯꢅꢑꢅꢓꢅꢆꢎꢅꢉꢂꢃꢄꢅꢆꢇꢃꢈꢆꢩꢉꢐꢇꢐꢊꢏꢏꢤꢉꢦꢃꢍꢒꢈꢐꢍꢉꢍꢈꢏꢅꢓꢊꢆꢎꢅꢩꢉꢑꢈꢓꢉꢃꢆꢑꢈꢓꢄꢊꢍꢃꢈꢆꢉꢔꢐꢓꢔꢈꢇꢅꢇꢉꢈꢆꢏꢤꢁ
ꢕꢃꢎꢓꢈꢎꢒꢃꢔ ꢣꢅꢎꢒꢆꢈꢏꢈꢚꢤ ꢂꢓꢊꢦꢃꢆꢚ ꢡꢗꢞꢼꢗꢸꢴꢠ
2003-2011 Microchip Technology Inc.
DS21796L-page 23
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21796L-page 24
2003-2011 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
ꢝꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢞꢐꢄꢈꢆꢬꢈꢄꢊꢥꢆꢛꢔꢆꢂꢃꢄꢅꢆꢇꢄꢌꢪꢄꢭꢃꢆꢕꢮꢨꢖꢆꢠꢆꢘꢯꢙꢯꢡꢦꢧꢆꢎꢎꢆꢢꢔꢅꢣꢆꢗꢞꢬꢛꢚ
ꢛꢔꢊꢃꢜ ꢧꢈꢓꢉꢍꢒꢅꢉꢄꢈꢇꢍꢉꢎꢐꢓꢓꢅꢆꢍꢉꢔꢊꢎꢨꢊꢚꢅꢉꢋꢓꢊꢦꢃꢆꢚꢇꢩꢉꢔꢏꢅꢊꢇꢅꢉꢇꢅꢅꢉꢍꢒꢅꢉꢕꢃꢎꢓꢈꢎꢒꢃꢔꢉꢪꢊꢎꢨꢊꢚꢃꢆꢚꢉꢜꢔꢅꢎꢃꢑꢃꢎꢊꢍꢃꢈꢆꢉꢏꢈꢎꢊꢍꢅꢋꢉꢊꢍꢉ
ꢒꢍꢍꢔꢢꢫꢫꢦꢦꢦꢁꢄꢃꢎꢓꢈꢎꢒꢃꢔꢁꢎꢈꢄꢫꢔꢊꢎꢨꢊꢚꢃꢆꢚ
e
D
b
N
N
L
K
E2
E
EXPOSED PAD
NOTE 1
NOTE 1
2
1
1
2
D2
BOTTOM VIEW
TOP VIEW
A
NOTE 2
ꢬꢆꢃꢍꢇꢕꢭꢮꢮꢭꢕꢌꢣꢌꢯꢜ
A3
A1
ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢉꢮꢃꢄꢃꢍꢇ
ꢕꢭꢰ
ꢰꢱꢕ
ꢕꢛꢲ
ꢰꢐꢄꢳꢅꢓꢉꢈꢑꢉꢪꢃꢆꢇꢰ
ꢪꢃꢍꢎꢒ
ꢱꢥꢅꢓꢊꢏꢏꢉꢶꢅꢃꢚꢒꢍ
ꢜꢍꢊꢆꢋꢈꢑꢑꢉ
ꢡꢈꢆꢍꢊꢎꢍꢉꢣꢒꢃꢎꢨꢆꢅꢇꢇ
ꢱꢥꢅꢓꢊꢏꢏꢉꢮꢅꢆꢚꢍꢒ
ꢱꢥꢅꢓꢊꢏꢏꢉꢺꢃꢋꢍꢒ
ꢌꢖꢔꢈꢇꢅꢋꢉꢪꢊꢋꢉꢮꢅꢆꢚꢍꢒ
ꢌꢖꢔꢈꢇꢅꢋꢉꢪꢊꢋꢉꢺꢃꢋꢍꢒ
ꢡꢈꢆꢍꢊꢎꢍꢉꢺꢃꢋꢍꢒ
ꢸ
ꢅ
ꢛ
ꢛꢀ
ꢛꢹ
ꢂ
ꢗꢁꢟꢗꢉꢠꢜꢡ
ꢗꢁꢵꢗ
ꢗꢁꢗꢘ
ꢗꢁꢘꢗꢉꢯꢌꢧ
ꢘꢁꢗꢗꢉꢠꢜꢡ
ꢹꢁꢗꢗꢉꢠꢜꢡ
ꢷ
ꢷ
ꢗꢁꢘꢟ
ꢗꢁꢞꢗ
ꢷ
ꢗꢁꢸꢗ
ꢗꢁꢗꢗ
ꢀꢁꢗꢗ
ꢗꢁꢗꢟ
ꢌ
ꢂꢘ
ꢌꢘ
ꢳ
ꢮ
U
ꢀꢁꢹꢗ
ꢀꢁꢟꢗ
ꢗꢁꢘꢗ
ꢗꢁꢹꢗ
ꢗꢁꢘꢗ
ꢀꢁꢟꢟ
ꢀꢁꢙꢟ
ꢗꢁꢹꢗ
ꢗꢁꢟꢗ
ꢷ
ꢡꢈꢆꢍꢊꢎꢍꢉꢮꢅꢆꢚꢍꢒ
ꢡꢈꢆꢍꢊꢎꢍꢼꢍꢈꢼꢌꢖꢔꢈꢇꢅꢋꢉꢪꢊꢋ
ꢛꢔꢊꢃꢉꢜ
ꢀꢁ ꢪꢃꢆꢉꢀꢉꢥꢃꢇꢐꢊꢏꢉꢃꢆꢋꢅꢖꢉꢑꢅꢊꢍꢐꢓꢅꢉꢄꢊꢤꢉꢥꢊꢓꢤꢩꢉꢳꢐꢍꢉꢄꢐꢇꢍꢉꢳꢅꢉꢏꢈꢎꢊꢍꢅꢋꢉꢦꢃꢍꢒꢃꢆꢉꢍꢒꢅꢉꢒꢊꢍꢎꢒꢅꢋꢉꢊꢓꢅꢊꢁ
ꢘꢁ ꢪꢊꢎꢨꢊꢚꢅꢉꢄꢊꢤꢉꢒꢊꢥꢅꢉꢈꢆꢅꢉꢈꢓꢉꢄꢈꢓꢅꢉꢅꢖꢔꢈꢇꢅꢋꢉꢍꢃꢅꢉꢳꢊꢓꢇꢉꢊꢍꢉꢅꢆꢋꢇꢁ
ꢹꢁ ꢪꢊꢎꢨꢊꢚꢅꢉꢃꢇꢉꢇꢊꢦꢉꢇꢃꢆꢚꢐꢏꢊꢍꢅꢋꢁ
ꢞꢁ ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢃꢆꢚꢉꢊꢆꢋꢉꢍꢈꢏꢅꢓꢊꢆꢎꢃꢆꢚꢉꢔꢅꢓꢉꢛꢜꢕꢌꢉꢝꢀꢞꢁꢟꢕꢁ
ꢠꢜꢡꢢ ꢠꢊꢇꢃꢎꢉꢂꢃꢄꢅꢆꢇꢃꢈꢆꢁꢉꢣꢒꢅꢈꢓꢅꢍꢃꢎꢊꢏꢏꢤꢉꢅꢖꢊꢎꢍꢉꢥꢊꢏꢐꢅꢉꢇꢒꢈꢦꢆꢉꢦꢃꢍꢒꢈꢐꢍꢉꢍꢈꢏꢅꢓꢊꢆꢎꢅꢇꢁ
ꢯꢌꢧꢢ ꢯꢅꢑꢅꢓꢅꢆꢎꢅꢉꢂꢃꢄꢅꢆꢇꢃꢈꢆꢩꢉꢐꢇꢐꢊꢏꢏꢤꢉꢦꢃꢍꢒꢈꢐꢍꢉꢍꢈꢏꢅꢓꢊꢆꢎꢅꢩꢉꢑꢈꢓꢉꢃꢆꢑꢈꢓꢄꢊꢍꢃꢈꢆꢉꢔꢐꢓꢔꢈꢇꢅꢇꢉꢈꢆꢏꢤꢁ
ꢕꢃꢎꢓꢈꢎꢒꢃꢔ ꢣꢅꢎꢒꢆꢈꢏꢈꢚꢤ ꢂꢓꢊꢦꢃꢆꢚ ꢡꢗꢞꢼꢀꢘꢹꢡ
2003-2011 Microchip Technology Inc.
DS21796L-page 25
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21796L-page 26
2003-2011 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2003-2011 Microchip Technology Inc.
DS21796L-page 27
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21796L-page 28
2003-2011 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
ꢝꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢞꢐꢄꢈꢆꢬꢈꢄꢊꢥꢆꢛꢔꢆꢂꢃꢄꢅꢆꢇꢄꢌꢪꢄꢭꢃꢆꢕꢮꢛꢖꢆꢠꢆꢘꢯꢙꢯꢡꢦꢰꢱꢆꢎꢎꢆꢢꢔꢅꢣꢆꢗꢒꢞꢬꢛꢚ
ꢛꢔꢊꢃꢜ ꢧꢈꢓꢉꢍꢒꢅꢉꢄꢈꢇꢍꢉꢎꢐꢓꢓꢅꢆꢍꢉꢔꢊꢎꢨꢊꢚꢅꢉꢋꢓꢊꢦꢃꢆꢚꢇꢩꢉꢔꢏꢅꢊꢇꢅꢉꢇꢅꢅꢉꢍꢒꢅꢉꢕꢃꢎꢓꢈꢎꢒꢃꢔꢉꢪꢊꢎꢨꢊꢚꢃꢆꢚꢉꢜꢔꢅꢎꢃꢑꢃꢎꢊꢍꢃꢈꢆꢉꢏꢈꢎꢊꢍꢅꢋꢉꢊꢍꢉ
ꢒꢍꢍꢔꢢꢫꢫꢦꢦꢦꢁꢄꢃꢎꢓꢈꢎꢒꢃꢔꢁꢎꢈꢄꢫꢔꢊꢎꢨꢊꢚꢃꢆꢚ
2003-2011 Microchip Technology Inc.
DS21796L-page 29
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
APPENDIX A: REVISION HISTORY
Revision A (05/2003)
Initial Release.
Revision B (07/2003)
Revision C (12/2003)
Corrections to Section 1.0, Electrical Characteristics.
Section 4.1, 6-Lead SOT-23 package to OT.
Revision D (02/2004)
Corrections to Device Selection Table, Table 1-1, Table
1-2, Section 2.4, Section 2.5, Section 2.8 and Section
2.9. Added note to Figure 2-7.
Revision E (03/2005)
Added DFN package.
Revision F (04/2005)
Added notes throughout.
Revision G (09/2006)
Revised note in Sections 2.8 and 2.9. Replaced DFN
package drawing.
Revision H (11/2006)
Updated Package Drawings.
Revision J (10/2007)
Revised Device Selection Table; Revised Pin Function
Table; Revised Package Types; Revised Table 3-1;
Replaced Package Drawings; Revised Product ID
System.
Revision K (5/2008)
Revised Figures 2-1, 2-2, 2-6 and 2-7; Revised
Package Marking Information; Replaced Package
Drawings.
Revision L (01/2012)
Added TDFN package.
DS21796L-page 30
2003-2011 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
Technical support is available through the web site
at: http://microchip.com/support
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
2003-2011 Microchip Technology Inc.
DS21796L-page 31
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
(480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
TO:
RE:
Technical Publications Manager
Reader Response
Total Pages Sent ________
From:
Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Literature Number: DS21796L
Application (optional):
Would you like a reply?
Y
N
Device: 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21796L-page 32
2003-2011 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office..
/XX
X
PART NO.
X
X
Examples:
a)
93AA76C-I/P: 8K, 1024x8 or 512x16 Serial
EEPROM, PDIP package, 1.8V
Package
Device Tape & Reel
Lead Finish
Temperature
Range
b)
93AA76AT-I/OT: 8K, 1024x8 Serial EEPROM,
SOT-23 package, tape and reel, 1.8V
Device:
93AA76A: 8K 1.8V Microwire Serial EEPROM (x8)
93AA76B: 8K 1.8V Microwire Serial EEPROM (x16)
93AA76C: 8K 1.8V Microwire Serial EEPROM w/ORG
c)
93AA76CT-I/MS: 8K, 1024x8 or 512x16 Serial
EEPROM, MSOP package, tape and reel, 1.8V
a)
b)
c)
93LC76C-I/ST: 8K, 1024x8 or 512x16 Serial
EEPROM, TSSOP package, 2.5V
93LC76BT-I/OT: 8K, 512x16 Serial EEPROM,
SOT-23 package, tape and reel, 2.5V
93LC76CT-E/MNY: 8K, 1024x8 or 512x16
Serial EEPROM, Automotive Temp, TDFN
package
93LC76A: 8K 2.5V Microwire Serial EEPROM (x8)
93LC76B: 8K 2.5V Microwire Serial EEPROM (x16)
93LC76C: 8K 2.5V Microwire Serial EEPROM w/ORG
93C76A: 8K 5.0V Microwire Serial EEPROM (x8)
93C76B: 8K 5.0V Microwire Serial EEPROM (x16)
93C76C: 8K 5.0V Microwire Serial EEPROM w/ORG
a)
b)
c)
93C76C-I/MS: 8K, 1024x8 or 512x16 Serial
EEPROM, MSOP package, 5.0V
93C76AT-I/OT: 8K, 1024x8 Serial EEPROM,
SOT-23 package, tape and reel, 5.0V
93C76BX-I/SN: 8K, 512x16 Serial EEPROM,
rotated SOIC package, 5.0V
Tape & Reel:
Blank
T
=
=
Standard pinout
Tape & Reel
Temperature Range:
Package:
I
E
=
=
-40°C to +85°C
-40°C to +125°C
MS
OT
P
SN
ST
=
=
=
=
=
=
=
Plastic MSOP (Micro Small outline), 8-lead
Plastic SOT-23, 6-lead (Tape & Reel only)
Plastic DIP (300 mil body), 8-lead
Plastic SOIC (3.90 mm body), 8-lead
Plastic TSSOP (4.4 mm body), 8-lead
Plastic DFN (2x3x0.90 mm body), 8-lead
Plastic TDFN (2x3x0.75 mm body), 8-lead
(Tape & Reel only)
MC
MNY(1)
Note 1:
“Y” indicates a Nickel Palladium Gold (NiPdAu) finish.
2003-2011 Microchip Technology Inc.
DS21796L-page 33
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
NOTES:
DS21796L-page 34
2003-2011 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
32
PIC logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, chipKIT,
chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,
dsPICworks, dsSPEAK, ECAN, ECONOMONITOR,
FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP,
Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB,
MPLINK, mTouch, Omniscient Code Generation, PICC,
PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE,
rfLAB, Select Mode, Total Endurance, TSHARC,
UniWinDriver, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2003-2011, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-61341-957-1
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
2003-2011 Microchip Technology Inc.
DS21796L-page 35
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
www.microchip.com
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Osaka
Tel: 81-66-152-7160
Fax: 81-66-152-9310
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Korea - Seoul
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Los Angeles
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-330-9305
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
China - Xiamen
Tel: 905-673-0699
Fax: 905-673-6509
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
11/29/11
DS21796L-page 36
2003-2011 Microchip Technology Inc.
相关型号：
©2020 ICPDF网 联系我们和版权申明