93C86AT-I/ST_技术文档

93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C

93AA66A/B/C, 93LC66A/B/C, 93C66A/B/C

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C

1K-16K Microwire Compatible Serial EEPROMs

Features:

Description:

• Densities from 1 Kbits through 16 Kbits

• Low-power CMOS technology

Microchip Technology Inc. supports the 3-wire

Microwire bus with low-voltage serial Electrically

Erasable PROMs (EEPROM) that range in density

from 1 Kbits up to 16 Kbits. Each density is available

with and without the ORG functionality, and selected

by the part number ordered. Advanced CMOS technol-

ogy makes these devices ideal for low-power, nonvol-

atile memory applications. The entire series of

Microwire devices are available in the standard 8-lead

PDIP and SOIC packages, as well as the more

advanced packaging such as the 8-lead MSOP, 8-lead

TSSOP, 6-lead SOT-23, and 8-lead DFN (2x3). All

packages are Pb-free.

• Available with or without ORG function:

With ORG function:

- ORG pin at Logic Low: 8-bit word

- ORG pin at Logic High: 16-bit word

Without ORG function:

- ‘A’ version: 8-bit word

- ‘B’ version: 16-bit word

• Program Enable pin:

- Write-protect for entire array

(93XX76C and 93XX86C only)

Pin Diagrams (not to scale)

• Self-timed Erase/Write cycles

(including auto-erase)

PDIP/SOIC

ROTATED SOIC

(P, SN)

(ex: 93LC46BX)

• Automatic ERAL before WRAL

• Power-on/off data protection circuitry

• Industry standard 3-wire serial I/O

• Device Status signal (Ready/Busy)

• Sequential Read function

(1,3)

V

CC

(2,3)

ORG

1

2

3

4

1

2

3

4

CS

CLK

DI

8

7

6

5

NC

8

7

6

5

VCC

PE

VSS

(1,3)

ORG

CS

DO

DI

DO

CLK

V

SS

• 1,000,000 E/W cycles

• Data retention > 200 years

DFN (MC)

• Pb-free and RoHS compliant

• Temperature ranges supported:

CS

V

CC

PE^(2,3)

1

8

7

6

5

CLK

DI

DO

2

3

4

ORG^(1,3)

- Industrial (I)

-40°C to +85°C

-40°C to +125°C

VSS

- Automotive (E)

TSSOP/MSOP

(ST, MS)

SOT-23

(OT)

Pin Function Table

Name

Function

8

7

6

5

1

2

3

4

CS

VCC

1

2

3

6

5

4

V

CC

DO

PE^(2,3)

ORG^(1,3)

CLK

CS

CLK

DI

Chip Select

VSS

CS

CLK

DI

DO

Serial Data Clock

Serial Data Input

Serial Data Output

Ground

DI

VSS

DO

Note 1: ORG pin: Only on 93XX46C/56C/66C/76C/86C.

2: PE pin: Only on 93XX76C/86C.

VSS

PE

Program Enable

Memory Configuration

Power Supply

3: ORG/PE: No internal connections on 93XXA/B.

ORG

VCC

Note:

ORG and PE functionality not available in

all products. See Table 1-1, Device

Selection Table.

DS21929D-page 1

93XX46X/56X/66X/76X/86X

TABLE 1-1:

Part Number

DEVICE SELECTION TABLE

Density

VCC

Organization

(Words)

Temp

Range

ORG Pin

PE Pin

Packages

(Kbits) Range

93XX46A/B/C

93AA46A

93AA46B

93AA46C

93LC46A

93LC46B

93LC46C

93C46A

1

1.8-5.5

2.5-5.5

4.5-5.5

No

128 x 8 bits

64 x 16 bits

No

I

P, SN, ST, MS, OT, MC

P, SN, ST, MS, MC

I

Yes

No

Selectable x8 or x16

128 x 8 bits

I

I, E

P, SN, ST, MS, OT, MC

P, SN, ST, MS, MC

No

64 x 16 bits

Yes

No

Selectable x8 or x16

128 x 8 bits

P, SN, ST, MS, OT, MC

P, SN, ST, MS, MC

93C46B

No

64 x 16 bits

93C46C

Yes

Selectable x8 or x16

93AA46AX/BX/CX, 93LC46AX/BX/CX, 93C46AX/BX/CX (Alternate pinout with die rotated 90°)

93AA46AX

93AA46BX

93AA46CX

93LC46AX

93LC46BX

93LC46CX

93C46AX

93C46BX

93C46CX

93XX56A/B/C

93AA56A

93AA56B

93AA56C

93LC56A

93LC56B

93LC56C

93C56A

1

1.8-5.5

2.5-5.5

4.5-5.5

No

128 x 8 bits

64 x 16 bits

No

I

P, SN, ST, MS, OT, MC

P, SN, ST, MS, MC

I

Yes

No

Selectable x8 or x16

128 x 8 bits

I

I, E

P, SN, ST, MS, OT, MC

P, SN, ST, MS, MC

No

64 x 16 bits

Yes

No

Selectable x8 or x16

128 x 8 bits

P, SN, ST, MS, OT, MC

P, SN, ST, MS, MC

No

64 x 16 bits

Yes

Selectable x8 or x16

2

1.8-5.5

2.5-5.5

4.5-5.5

No

256 x 8 bits

128 x 16 bits

No

I

P, SN, ST, MS, OT, MC

P, SN, ST, MS, MC

I

Yes

No

Selectable x8 or x16

256 x 8 bits

I

I, E

P, SN, ST, MS, OT, MC

P, SN, ST, MS, MC

No

128 x 16 bits

Yes

No

Selectable x8 or x16

256 x 8 bits

P, SN, ST, MS, OT, MC

P, SN, ST, MS, MC

93C56B

No

128 x 16 bits

93C56C

Yes

Selectable x8 or x16

93XX66A/B/C

93AA66A

93AA66B

93AA66C

93LC66A

93LC66B

93LC66C

93C66A

4

1.8-5.5

2.5-5.5

4.5-5.5

No

512 x 8 bits

256 x 16 bits

No

I

P, SN, ST, MS, OT, MC

P, SN, ST, MS, MC

I

Yes

No

Selectable x8 or x16

512 x 8 bits

I

I, E

P, SN, ST, MS, OT, MC

P, SN, ST, MS, MC

No

256 x 16 bits

Yes

No

Selectable x8 or x16

512 x 8 bits

P, SN, ST, MS, OT, MC

P, SN, ST, MS, MC

93C66B

No

256 x 16 bits

93C66C

Yes

Selectable x8 or x16

DS21929D-page 2

93XX46X/56X/66X/76X/86X

TABLE 1-1:

Part Number

DEVICE SELECTION TABLE (CONTINUED)

Density

VCC

Organization

(Words)

Temp

Range

ORG Pin

PE Pin

Packages

(Kbits) Range

93XX76A/B/C

93AA76A

93AA76B

93AA76C

93LC76A

93LC76B

93LC76C

93C76A

8

1.8-5.5

2.5-5.5

4.5-5.5

No

1024 x 8 bits

512 x 16 bits

No

I

OT

I

Yes

No

Selectable x8 or x16

1024 x 8 bits

Yes

No

I

P, SN, ST, MS, MC

I, E

OT

No

512 x 16 bits

No

OT

Yes

No

Selectable x8 or x16

1024 x 8 bits

Yes

No

P, SN, ST, MS, MC

OT

93C76B

No

512 x 16 bits

No

OT

93C76C

Yes

Selectable x8 or x16

Yes

P, SN, ST, MS, MC

93XX86A/B/C

93AA86A

93AA86B

93AA86C

93LC86A

93LC86B

93LC86C

93C86A

16

1.8-5.5

2.5-5.5

4.5-5.5

No

2048 x 8 bits

1024 x 16 bits

No

I

OT

I

OT

Yes

No

Selectable x8 or x16

2048 x 8 bits

Yes

No

I

P, SN, ST, MS, MC

I, E

OT

No

1024 x 16 bits

No

OT

Yes

No

Selectable x8 or x16

2048 x 8 bits

Yes

No

P, SN, ST, MS, MC

OT

93C86B

No

1024 x 16 bits

No

OT

93C86C

Yes

Selectable x8 or x16

Yes

P, SN, ST, MS, MC

DS21929D-page 3

93XX46X/56X/66X/76X/86X

2.0

ELECTRICAL CHARACTERISTICS

(†)

Absolute Maximum Ratings

VCC.............................................................................................................................................................................7.0V

All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V

Storage temperature ...............................................................................................................................-65°C to +150°C

Ambient temperature with power applied................................................................................................-40°C to +125°C

ESD protection on all pins ......................................................................................................................................................≥ 4 kV

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those

indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for

extended periods may affect device reliability.

TABLE 2-1:

DC CHARACTERISTICS

VCC = 1.8V to 5.5V

All parameters apply over the specified

ranges unless otherwise noted.

Industrial (I):

TA = -40°C to +85°C

Automotive (E): TA = -40°C to +125°C

Param.

No.

Symbol

Parameter

Min.

Typ.

Max.

Units

Conditions

D1

VIH1

VIH2

High-level input voltage

2.0

0.7 VCC

—

VCC +1

V

VCC ≥ 2.7V

VCC < 2.7V

D2

D3

D4

VIL1

VIL2

Low-level input voltage

Low-level output voltage

High-level output voltage

-0.3

—

0.8

0.2 VCC

V

VCC ≥ 2.7V

VCC < 2.7V

VOL1

VOL2

—

0.4

0.2

V

IOL = 2.1 mA, VCC = 4.5V

IOL = 100 μA, VCC = 2.5V

VOH1

VOH2

2.4

VCC-0.2

—

V

IOH = -400 μA, VCC = 4.5V

IOH = -100 μA, VCC = 2.5V

D5

D6

D7

ILI

Input leakage current

Output leakage current

—

±1

7

μA

pF

VIN = VSS to VCC

ILO

VOUT = VSS to VCC

CIN,

Pin capacitance

VIN/VOUT = 0V (Note 1)

COUT

(all inputs/outputs)

TA = 25°C, FCLK = 1 MHz

D8

ICC write Write current

—

2

mA

FCLK = 3 MHz, VCC = 5.5V

(93XX46X/56X/66X)

—

3

mA

FCLK = 3 MHz, VCC = 5.5V

(93XX76X/86X)

FCLK = 2 MHz, VCC = 2.5V

500

—

μA

D9

ICC read Read current

—

100

1

500

—

mA

μA

FCLK = 3 MHz, VCC = 5.5V

FCLK = 2 MHz, VCC = 3.0V

FCLK = 2 MHz, VCC = 2.5V

D10

ICCS

Standby current

—

1

5

μA

I-Temp (Note 2, 3)

E-Temp

CLK = Cs = 0V

ORG = DI = VSS or VCC

D11

VPOR

VCC voltage detect

—

1.5V

3.8V

—

V

93AAX6A/B/C, 93LCX6A/B/C,

93CX6A/B/C (Note 1)

Note 1: This parameter is periodically sampled and not 100% tested.

2: ORG and PE pins not available on ‘A’ or ‘B’ versions.

3: Ready/Busy status must be cleared from DO, see Section 4.4 “Data Out (DO)”.

DS21929D-page 4

93XX46X/56X/66X/76X/86X

TABLE 2-2:

AC CHARACTERISTICS

VCC = 1.8V to 5.5V

All parameters apply over the specified

ranges unless otherwise noted.

Industrial (I):

TA = -40°C to +85°C

Automotive (E): TA = -40°C to +125°C

Param.

No.

Symbol

Parameter

Clock frequency

Min.

Max.

Units

Conditions

A1

FCLK

—

3

2

1

MHz 4.5V ≤ VCC < 5.5V

MHz 2.5V ≤ VCC < 4.5V

MHz 1.8V ≤ VCC < 2.5V

A2

A3

A4

TCKH

TCKL

TCSS

Clock high time

200

250

450

—

ns

4.5V ≤ VCC < 5.5V

2.5V ≤ VCC < 4.5V

1.8V ≤ VCC < 2.5V

Clock low time

100

200

450

ns

4.5V ≤ VCC < 5.5V

2.5V ≤ VCC < 4.5V

1.8V ≤ VCC < 2.5V

Chip Select setup time

50

100

250

ns

4.5V ≤ VCC < 5.5V

2.5V ≤ VCC < 4.5V

1.8V ≤ VCC < 2.5V

A5

A6

A7

TCSH

TCSL

TDIS

Chip Select hold time

Chip Select low time

Data input setup time

0

—

ns

1.8V ≤ VCC < 5.5V

250

50

100

250

ns

4.5V ≤ VCC < 5.5V

2.5V ≤ VCC < 4.5V

1.8V ≤ VCC < 2.5V

A8

A9

TDIH

TPD

Data input hold time

50

100

250

—

ns

4.5V ≤ VCC < 5.5V

2.5V ≤ VCC < 4.5V

1.8V ≤ VCC < 2.5V

Data output delay time

—

100

ns

4.5V ≤ VCC < 5.5V, CL = 100 pF

(93C76X/86X)

—

200

250

400

ns

4.5V ≤ VCC < 5.5V, CL = 100 pF

2.5V ≤ VCC < 4.5V, CL = 100 pF

1.8V ≤ VCC < 2.5V, CL = 100 pF

A10

A11

TCZ

TSV

Data output disable time

Status valid time

—

100

200

ns

4.5V ≤ VCC < 5.5V, (Note 1)

1.8V ≤ VCC < 4.5V, (Note 1)

200

300

500

ns

4.5V ≤ VCC < 5.5V, CL = 100 pF

2.5V ≤ VCC < 4.5V, CL = 100 pF

1.8V ≤ VCC < 2.5V, CL = 100 pF

A12

TWC

Program cycle time

—

5

ms

Erase/Write mode

93XX76X/86X

(AA and LC versions)

6

ms

93XX46X/56X/66X

(AA and LC versions)

A13

A14

A15

A16

TWC

TEC

TWL

—

2

6

ms

93C46X/56X/66X/76X/86X

Program cycle time

Endurance

ERAL mode, 4.5V ≤ VCC ≤ 5.5V

WRAL mode, 4.5V ≤ VCC ≤ 5.5V

—

15

—

1M

cycles 25°C, VCC = 5.0V, (Note 2)

Note 1: This parameter is periodically sampled and not 100% tested.

2: This application is not tested but ensured by characterization. For endurance estimates in a specific

application, please consult the Total Endurance™ Model which may be downloaded from Microchip’s web

site at www.microchip.com.

DS21929D-page 5

93XX46X/56X/66X/76X/86X

FIGURE 2-1:

SYNCHRONOUS DATA TIMING

VIH

VIL

VIH

CS

TCSS

TCKH

TCKL

TCSH

CLK

DI

VIL

TDIS

TDIH

VIH

VIL

TCZ

TPD

VOH

DO

(Read)

VOL

VOH

TSV

DO

(Program)

Status Valid

VOL

Note:

Status Valid Time (TSV) is relative to CS.

DS21929D-page 6

93XX46X/56X/66X/76X/86X

TABLE 2-3:

INSTRUCTION SET FOR 93XX46A/B/C

Req.

CLK

Instruction SB Opcode

Address

Data In Data Out

Cycles

93XX46B OR 93XX46C WITH ORG = 1

(16-BIT WORD ORGANIZATION)

ERASE

ERAL

EWDS

EWEN

READ

WRITE

WRAL

1

11

00

10

01

00

A5 A4 A3 A2 A1 A0

—

(RDY/BSY)

High-Z

9

1

0

1

0

1

x

9

High-Z

9

A5 A4 A3 A2 A1 A0

D15-D0

25

A5 A4 A3 A2 A1 A0 D15-D0 (RDY/BSY)

D15-D0 (RDY/BSY)

0

1

x

93XX46A OR 93XX46C WITH ORG = 0

(8-BIT WORD ORGANIZATION)

ERASE

ERAL

EWDS

EWEN

READ

WRITE

WRAL

1

11

00

10

01

00

A6 A5 A4 A3 A2 A1 A0

—

(RDY/BSY)

High-Z

10

18

1

0

1

0

1

x

High-Z

A6 A5 A4 A3 A2 A1 A0

D7-D0

A6 A5 A4 A3 A2 A1 A0 D7-D0 (RDY/BSY)

D7-D0 (RDY/BSY)

0

1

x

TABLE 2-4:

INSTRUCTION SET FOR 93XX56A/B/C

Req.

CLK

Instruction SB Opcode

Address

Data In

Data Out

Cycles

93XX56B OR 93XX56C WITH ORG = 1

(16-BIT WORD ORGANIZATION)

ERASE

ERAL

EWDS

EWEN

READ

WRITE

WRAL

1

11

00

10

01

00

x

1

0

1

x

0

A6 A5 A4 A3 A2 A1 A0

—

(RDY/BSY)

High-Z

11

27

0

1

x

High-Z

A6 A5 A4 A3 S2 A1 A0

D15-D0

A6 A5 A4 A3 S2 A1 A0 D15-D0 (RDY/BSY)

D15-D0 (RDY/BSY)

(8-BIT WORD ORGANIZATION)

A7 A6 A5 A4 A3 A2 A1 A0

1

x

93XX56A OR 93XX56C WITH ORG = 0

ERASE

ERAL

EWDS

EWEN

READ

WRITE

WRAL

1

11

00

10

01

00

x

1

0

1

x

0

—

(RDY/BSY)

High-Z

12

20

0

1

x

High-Z

A7 A6 A5 A4 A3 A2 A1 A0

D7-D0

A7 A6 A5 A4 A3 A2 A1 A0 D7-D0 (RDY/BSY)

D7-D0 (RDY/BSY)

1

x

DS21929D-page 7

93XX46X/56X/66X/76X/86X

TABLE 2-5:

INSTRUCTION SET FOR 93XX66A/B/C

Req.

CLK

Instruction SB Opcode

Address

Data In

Data Out

Cycles

93XX66B OR 93XX66C WITH ORG = 1

(16-BIT WORD ORGANIZATION)

ERASE

ERAL

EWDS

EWEN

READ

WRITE

WRAL

1

11

00

10

01

00

A7 A6 A5 A4 A3 A2 A1 A0

—

(RDY/BSY)

High-Z

11

27

1

0

1

0

1

x

High-Z

A7 A6 A5 A4 A3 A2 A1 A0

D15-D0

A7 A6 A5 A4 A3 A2 A1 A0 D15-D0 (RDY/BSY)

D15-D0 (RDY/BSY)

(8-BIT WORD ORGANIZATION)

A8 A7 A6 A5 A4 A3 A2 A1 A0

0

1

x

93XX66A OR 93XX66C WITH ORG = 0

ERASE

ERAL

EWDS

EWEN

READ

WRITE

WRAL

1

11

00

10

01

00

—

(RDY/BSY)

High-Z

12

20

1

0

1

0

1

x

High-Z

A8 A7 A6 A5 A4 A3 A2 A1 A0

D7-D0

A8 A7 A6 A5 A4 A3 A2 A1 A0 D7-D0 (RDY/BSY)

D7-D0 (RDY/BSY)

0

1

x

TABLE 2-6:

INSTRUCTION SET FOR 93XX76A/B/C

Req.

CLK

Instruction SB Opcode

Address

Data In

Data Out

Cycles

93XX76B OR 93XX76C WITH ORG = 1

(16-BIT WORD ORGANIZATION)

ERASE

ERAL

EWDS

EWEN

READ

WRITE

WRAL

1

11

00

10

01

00

x

1

0

1

x

0

A8 A7 A6 A5 A4 A3 A2 A1 A0

—

(RDY/BSY)

High-Z

13

29

0

1

x

High-Z

A8 A7 A6 A5 A4 A3 A2 A1 A0

D15-D0

A8 A7 A6 A5 A4 A3 A2 A1 A0 D15-D0 (RDY/BSY)

D15-D0 (RDY/BSY)

(8-BIT WORD ORGANIZATION)

A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

1

x

93XX76A OR 93XX76C WITH ORG = 0

ERASE

ERAL

EWDS

EWEN

READ

WRITE

WRAL

1

11

00

10

01

00

x

1

0

1

x

0

—

(RDY/BSY)

High-Z

14

22

0

1

x

High-Z

A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

D7-D0

A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7-D0 (RDY/BSY)

D7-D0 (RDY/BSY)

1

x

DS21929D-page 8

93XX46X/56X/66X/76X/86X

TABLE 2-7:

INSTRUCTION SET FOR 93XX86A/B/C

Req.

CLK

Instruction SB Opcode

Address

Data In

Data Out

Cycles

93XX86B OR 93XX86C WITH ORG = 1

(16-BIT WORD ORGANIZATION)

A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

ERASE

ERAL

EWDS

EWEN

READ

WRITE

WRAL

1

11

00

10

01

00

—

(RDY/BSY)

High-Z

13

29

1

0

1

0

1

x

High-Z

A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

D15-D0

A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D15-D0 (RDY/BSY)

D15-D0 (RDY/BSY)

(8-BIT WORD ORGANIZATION)

A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

0

1

x

93XX86A OR 93XX86C WITH ORG = 0

ERASE

ERAL

EWDS

EWEN

READ

WRITE

WRAL

1

11

00

10

01

00

—

(RDY/BSY)

High-Z

14

22

1

0

1

0

1

x

High-Z

A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

D7-D0

A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7-D0 (RDY/BSY)

D7-D0 (RDY/BSY)

0

1

x

DS21929D-page 9

93XX46X/56X/66X/76X/86X

3.3

Data Protection

3.0

FUNCTIONAL DESCRIPTION

All modes of operation are inhibited when VCC is below

a typical voltage of 1.5V for ‘93AAXX’ and ‘93LCXX’

devices or 3.8V for ‘93CXX’ devices.

When the ORG pin is connected to VCC, the (x16)

organization is selected. When it is connected to

ground, the (x8) organization is selected. Instruc-

tions, addresses and write data are clocked into the

DI pin on the rising edge of the clock (CLK). The DO

pin is normally held in a High-Z state except when

reading data from the device, or when checking the

Ready/Busy status during a programming operation.

The Ready/Busy status can be verified during an

Erase/Write operation by polling the DO pin; DO low

indicates that programming is still in progress, while

DO high indicates the device is ready. DO will enter

the High-Z state on the falling edge of CS.

The EWEN and EWDS commands give additional

protection against accidentally programming during

normal operation.

Note:

For added protection, an EWDS command

should be performed after every write

operation and an external 10 kΩ pull-down

protection resistor should be added to the

CS pin.

After power-up, the device is automatically in the

EWDS mode. Therefore, an EWENinstruction must be

performed before the initial ERASEor WRITEinstruction

can be executed.

3.1

Start Condition

The Start bit is detected by the device if CS and DI are

both high with respect to the positive edge of CLK for

the first time.

Note:

To prevent accidental writes to the array in

the 93XX76C/86C devices, set the PE pin

to a logic low.

Before a Start condition is detected, CS, CLK and DI

may change in any combination (except to that of a

Start condition), without resulting in any device

operation (Read, Write, Erase, EWEN, EWDS, ERAL

or WRAL). As soon as CS is high, the device is no

longer in Standby mode.

Block Diagram

VCC

VSS

HV Generator

An instruction following a Start condition will only be

executed if the required opcode, address and data bits

for any particular instruction are clocked in.

X

EEPROM

Array

Memory

Control

Logic

Note:

When preparing to transmit an instruction,

either the CLK or DI signal levels must be

at a logic low as CS is toggled active high.

I/O Control

Logic

Dec

Byte Latches

3.2

Data In/Data Out (DI/DO)

It is possible to connect the Data In and Data Out pins

together. However, with this configuration it is possible

for a “bus conflict” to occur during the “dummy zero”

that precedes the read operation, if A0 is a logic high

level. Under such a condition the voltage level seen at

Data Out is undefined and will depend upon the relative

impedances of Data Out and the signal source driving

A0. The higher the current sourcing capability of the

driver, the higher the voltage at the Data Out pin. In

order to limit this current, a resistor should be

connected between DI and DO.

Y Decoder

DI

DO

CS

Sense Amp.

R/W Control

CLK

ORG

(1)

(2)

PE

Note 1: ORG pin: Only on 93XX46C/56C/66C/76C/86C.

2: PE pin: Only on 93XX76C/86C.

DS21929D-page 10

93XX46X/56X/66X/76X/86X

The DO pin indicates the Ready/Busy status of the

device if CS is brought high after a minimum of 250 ns

low (TCSL). DO at logical ‘0’ indicates that programming

is still in progress. DO at logical ‘1’ indicates that the

register at the specified address has been erased and

the device is ready for another instruction.

3.4

ERASE

The ERASE instruction forces all data bits of the

specified address to the logical ‘1’ state. CS is brought

low following the loading of the last address bit. This

falling edge of the CS pin initiates the self-timed

programming cycle, except on ‘93CXX’ devices where

the rising edge of CLK before the last address bit

initiates the write cycle.

Note:

After the Erase cycle is complete, issuing

a Start bit and then taking CS low will clear

the Ready/Busy status from DO.

FIGURE 3-1:

ERASE TIMING FOR 93AAXX AND 93LCXX DEVICES

TCSL

Check Status

CS

CLK

DI

1

AN

AN-1 AN-2

A0

•••

TSV

BUSY

TCZ

High-Z

DO

Ready

High-Z

TWC

FIGURE 3-2:

ERASE TIMING FOR 93CXX DEVICES

TCSL

Check Status

CS

CLK

1

AN

AN-1 AN-2

A0

•••

DI

TSV

TCZ

High-Z

DO

Busy

Ready

High-Z

TWC

DS21929D-page 11

93XX46X/56X/66X/76X/86X

The DO pin indicates the Ready/Busy status of the

device, if CS is brought high after a minimum of 250 ns

low (TCSL).

3.5

ERASE ALL (ERAL)

The Erase All (ERAL) instruction will erase the entire

memory array to the logical ‘1’ state. The ERAL cycle

is identical to the Erase cycle, except for the different

opcode. The ERAL cycle is completely self-timed and

commences at the falling edge of the CS, except on

‘93CXX’ devices where the rising edge of CLK before

the last data bit initiates the write cycle. Clocking of the

CLK pin is not necessary after the device has entered

the ERAL cycle.

VCC must be ≥ 4.5V for proper operation of ERAL.

Note:

After the ERAL command is complete,

issuing a Start bit and then taking CS low

will clear the Ready/Busy status from DO.

FIGURE 3-3:

ERAL TIMING FOR 93AAXX AND 93LCXX DEVICES

TCSL

Check Status

CS

CLK

DI

1

0

1

0

X

•••

TSV

TCZ

High-Z

DO

Busy

Ready

High-Z

TEC

Vcc must be ≥ 4.5V for proper operation of ERAL.

FIGURE 3-4:

ERAL TIMING FOR 93CXX DEVICES

TCSL

CS

Check Status

CLK

1

0

1

0

X

•••

DI

TSV

TCZ

High-Z

DO

Busy

Ready

High-Z

TEC

DS21929D-page 12

93XX46X/56X/66X/76X/86X

3.6

ERASE/WRITE DISABLE And

ENABLE (EWDS/EWEN)

The 93XX series devices power-up in the Erase/Write

Disable (EWDS) state. All programming modes must

be preceded by an Erase/Write Enable (EWEN) instruc-

tion. Once the EWENinstruction is executed, program-

ming remains enabled until an EWDS instruction is

executed or VCC is removed from the device.

To protect against accidental data disturbance, the

EWDSinstruction can be used to disable all Erase/Write

functions and should follow all programming

operations. Execution of

a READ instruction is

independent of both the EWENand EWDSinstructions.

FIGURE 3-5:

EWDS TIMING

TCSL

CS

CLK

•••

1

0

x

DI

FIGURE 3-6:

EWEN TIMING

TCSL

CS

CLK

•••

1

0

1

x

DI

DS21929D-page 13

93XX46X/56X/66X/76X/86X

3.7

READ

The READ instruction outputs the serial data of the

addressed memory location on the DO pin. A dummy

zero bit precedes the 8-bit (If ORG pin is low or A-version

devices) or 16-bit (If ORG pin is high or B-version

devices) output string. The output data bits will toggle on

the rising edge of the CLK and are stable after the spec-

ified time delay (TPD). Sequential read is possible when

CS is held high. The memory data will automatically cycle

to the next register and output sequentially.

FIGURE 3-7:

READ TIMING

CS

CLK

DI

An

•••

1

0

A0

High-Z

DO

0

Dx

D0

Dx

D0

Dx

D0

•••

DS21929D-page 14

93XX46X/56X/66X/76X/86X

The DO pin indicates the Ready/Busy status of the

device, if CS is brought high after a minimum of 250 ns

3.8

WRITE

The WRITEinstruction is followed by 8 bits (If ORG is

low or A-version devices) or 16 bits (If ORG pin is high

or B-version devices) of data which are written into the

specified address. For 93AAXX and 93LCXX devices,

after the last data bit is clocked into DI, the falling edge

of CS initiates the self-timed auto-erase and program-

ming cycle. For 93CXX devices, the self-timed auto-

erase and programming cycle is initiated by the rising

edge of CLK on the last data bit.

low (TCSL). DO at logical ‘0’ indicates that programming

is still in progress. DO at logical ‘1’ indicates that the

register at the specified address has been written with

the data specified and the device is ready for another

instruction.

Note:

For devices with PE functionality such as

the 93XX76C or 93XX86C, the write

sequence requires a logic high signal on

the PE pin prior to the rising edge of clock

on the last data bit.

After the Write cycle is complete, issuing a

Start bit and then taking CS low will clear

the Ready/Busy status from DO.

FIGURE 3-8:

WRITE TIMING FOR 93AAXX AND 93LCXX DEVICES

TCSL

CS

CLK

0

1

An

A0

Dx

D0

•••

DI

TSV

TCZ

High-Z

DO

Busy

Ready

High-Z

Twc

FIGURE 3-9:

WRITE TIMING FOR 93CXX DEVICES

TCSL

CS

CLK

DI

0

1

An

A0

Dx

D0

•••

TSV

TCZ

High-Z

Busy

Ready

DO

High-Z

Twc

DS21929D-page 15

93XX46X/56X/66X/76X/86X

The DO pin indicates the Ready/Busy status of the

device if CS is brought high after a minimum of 250 ns

low (TCSL).

3.9

WRITE ALL (WRAL)

The Write All (WRAL) instruction will write the entire

memory array with the data specified in the command.

For 93AAXX and 93LCXX devices, after the last data

bit is clocked into DI, the falling edge of CS initiates the

self-timed auto-erase and programming cycle. For

93CXX devices, the self-timed auto-erase and pro-

gramming cycle is initiated by the rising edge of CLK on

the last data bit. Clocking of the CLK pin is not neces-

sary after the device has entered the WRAL cycle. The

WRAL command does include an automatic ERAL

cycle for the device. Therefore, the WRAL instruction

does not require an ERALinstruction, but the chip must

be in the EWEN status.

VCC must be ≥ 4.5V for proper operation of WRAL.

Note:

For devices with PE functionality such as

the 93XX76C or 93XX86C, the write

sequence requires a logic high signal on

the PE pin prior to the rising edge of clock

on the last data bit.

Note:

After the Write All cycle is complete,

issuing a Start bit and then taking CS low

will clear the Ready/Busy status from DO.

FIGURE 3-10:

WRAL TIMING FOR 93AAXX AND 93LCXX DEVICES

TCSL

CS

CLK

0

1

X

1

0

•••

Dx

•••

x

D0

DI

TSV

TCZ

High-Z

Busy

DO

Ready

HIGH-Z

TWL

VCC must be ≥ 4.5V for proper operation of WRAL.

FIGURE 3-11:

WRAL TIMING FOR 93CXX DEVICES

TCSL

CS

CLK

0

1

X

1

0

•••

Dx

•••

DI

x

D0

TSV

TCZ

High-Z

Busy

DO

Ready

HIGH-Z

TWL

DS21929D-page 16

93XX46X/56X/66X/76X/86X

4.0

PIN DESCRIPTIONS

TABLE 4-1:

Name

PIN DESCRIPTIONS

SOIC/PDIP/MSOP/

TSSOP/DFN

SOT-23

Function

CS

CLK

DI

1

2

3

4

5

4

3

1

2

Chip Select

Serial Clock

Data In

DO

Data Out

Ground

VSS

ORG

NC⁽¹⁾

PE

Organization (93XX46C/56C/66C/76C/86C)

No connect on 93XXA/B devices

Program Enable (93XX76C/86C)

No connect on 93XXA/B devices

Power Supply

6

N/A

7

8

N/A

6

NC⁽¹⁾

VCC

Note 1: With no internal connection, logic levels on NC pins are “don’t cares.”

After detection of a Start condition the specified number

4.1

Chip Select (CS)

of clock cycles (respectively low-to-high transitions of

CLK) must be provided. These clock cycles are

required to clock in all required opcode, address and

data bits before an instruction is executed. CLK and DI

then become “don't care” inputs waiting for a new Start

condition to be detected.

A high level selects the device; a low level deselects

the device and forces it into Standby mode. However, a

programming cycle which is already in progress will be

completed, regardless of the Chip Select (CS) input

signal. If CS is brought low during a program cycle, the

device will go into Standby mode as soon as the

programming cycle is completed.

4.3

Data In (DI)

CS must be low for 250 ns minimum (TCSL) between

consecutive instructions. If CS is low, the internal

control logic is held in a Reset status.

Data In (DI) is used to clock in a Start bit, opcode,

address and data synchronously with the CLK input.

4.4

Data Out (DO)

4.2

Serial Clock (CLK)

Data Out (DO) is used in the Read mode to output data

synchronously with the CLK input (TPD after the

positive edge of CLK).

The Serial Clock is used to synchronize the communi-

cation between a master device and the 93XX series

device. Opcodes, address and data bits are clocked in

on the positive edge of CLK. Data bits are also clocked

out on the positive edge of CLK.

This pin also provides Ready/Busy status information

during Erase and Write cycles. Ready/Busy status

information is available on the DO pin if CS is brought

high after being low for minimum Chip Select Low Time

(TCSL) and an erase or write operation has been

initiated.

CLK can be stopped anywhere in the transmission

sequence (at high or low level) and can be continued

anytime with respect to Clock High Time (TCKH) and

Clock Low Time (TCKL). This gives the controlling mas-

ter freedom in preparing opcode, address and data.

The Status signal is not available on DO, if CS is held

low during the entire Erase or Write cycle. In this case,

DO is in the High-Z mode. If status is checked after the

Erase/Write cycle, the data line will be high to indicate

the device is ready.

CLK is a “don't care” if CS is low (device deselected). If

CS is high, but the Start condition has not been

detected (DI = 0), any number of clock cycles can be

received by the device without changing its status (i.e.,

waiting for a Start condition).

Note:

After the Read cycle is complete, issuing a

Start bit and then taking CS low will clear

the Ready/Busy status from DO.

CLK cycles are not required during the self-timed Write

(i.e., auto Erase/Write) cycle.

DS21929D-page 17

93XX46X/56X/66X/76X/86X

4.5

Organization (ORG)

4.6

Program Enable (PE)

When the ORG pin is connected to VCC or Logic HI, the

(x16) memory organization is selected. When the ORG

pin is tied to VSS or Logic LO, the (x8) memory

organization is selected. For proper operation, ORG

must be tied to a valid logic level.

A logic level on the PE pin will enable or disable the abil-

ity to write data to the memory array in only the 8-lead

93XX76C and 93XX86C devices. For all other devices

the PE function is not present and the PE pin is a no

connect. When driving the PE pin to a logic High, the

device can be programmed, but when the PE pin is

driven Low, programming is inhibited. This pin is used

in parallel with the EWEN/EWDS latch to protect the

memory array from inadvertent writes, as shown in

Table 4-2.

For devices without the ORG functionality, there is no

internal connection to the ORG pin. In these devices

the functionality has been set at the factory to support

a single word size.

‘A’ series devices – x8 organization

‘B’ series devices – x16 organization

In either the 93XX76C or 93XX86C devices, the PE pin

must be tied to a specific logic level and cannot be

floated. In all other devices without the PE function, the

PE pin has no internal connections and programming is

always enabled.

TABLE 4-2:

WRITE PROTECTION SCHEME

EWEN/EWDS Latch

PE Pin*

Array WRITE

Enabled

Disabled

Enabled

Disabled

1

0

Yes

No

* PE pin level does not alter the state of the EWEN/EWDS latch.

Note:

For devices with PE functionality such as 93XX76C or 93XX86C, the write sequence requires a logic high

signal on the PE pin prior to the rising edge of clock on the last data bit.

DS21929D-page 18

93XX46X/56X/66X/76X/86X

APPENDIX A: REVISION HISTORY

Revision A

Original release of document. Combined all the 93-Series

Microwire Serial EEPROM device data sheets.

Revision B

Revised 2x3 (MC) DFN package drawing.

Revision C

Correction to Table 2-6, 93XX76A (EWDS).

Revision D (03/2007)

Revised Description; Delete Pb-free notes; Replaced

Package Drawings; Revised Product ID System.

DS21929D-page 19

93XX46X/56X/66X/76X/86X

5.0

5.1

PACKAGING INFORMATION

Package Marking Information

Example: Pb-free

8-Lead PDIP

93LC46A

I/P IL7

XXXXXXXX

TXXXXNNN

e

3

0528

YYWW

3-Wire 8-Lead PDIP Package Marking

Part

93AA46A

Line 1 Marking

Part

93LC46A

Line 1 Marking

Part

93C46A

Line 1 Marking

93AA46A

93AA46B

93AA46C

93AA56A

93AA56B

93AA56C

93AA66A

93AA66B

93AA66C

93AA76A

93AA76B

93AA76C

93AA86A

93AA86B

93AA86C

93LC46A

93LC46B

93LC46C

93LC56A

93LC56B

93LC56C

93LC66A

93LC66B

93LC66C

93LC76A

93LC76B

93LC76C

93LC86A

93LC86B

93LC86C

93C46A

93C46B

93C46C

93C56A

93C56B

93C56C

93C66A

93C66B

93C66C

93C76A

93C76B

93C76C

93C86A

93C86B

93C86C

93AA46B

93AA46C

93AA56A

93AA56B

93AA56C

93AA66A

93AA66B

93AA66C

93AA76A

93AA76B

93AA76C

93AA86A

93AA86B

93AA86C

Note:

93LC46B

93LC46C

93LC56A

93LC56B

93LC56C

93LC66A

93LC66B

93LC66C

93LC76A

93LC76B

93LC76C

93LC86A

93LC86B

93LC86C

93C46B

93C46C

93C56A

93C56B

93C56C

93C66A

93C66B

93C66C

93C76A

93C76B

93C76C

93C86A

93C86B

93C86C

Temperature range on second line.

Legend: XX...X Part number or part number code

T

Temperature (I, E)

Y

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code (2 characters for small packages)

Pb-free JEDEC designator for Matte Tin (Sn)

YY

WW

NNN

e

3

Note: For very small packages with no room for the Pb-free JEDEC designator

, the marking will only appear on the outer carton or reel label.

e

3

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

DS21929D-page 20

93XX46X/56X/66X/76X/86X

Example: Pb-free

8-Lead SOIC

93LC46AI

SN 0528

XXXXXXXT

XXXXYYWW

e

3

1L7

NNN

3-Wire 8-Lead SOIC (SN) Package Marking

Part

93AA46A

Line 1 Marking

Part

Line 1 Marking

Part

93C46A

Line 1 Marking

93AA46AT

93AA46BT

93AA46CT

93AA56AT

93AA56BT

93AA56CT

93AA66AT

93AA66BT

93AA66CT

93AA76AT

93AA76BT

93AA76CT

93AA86AT

93AA86BT

93AA86CT

93LC46A

93LC46B

93LC46C

93LC56A

93LC56B

93LC56C

93LC66A

93LC66B

93LC66C

93LC76A

93LC76B

93LC76C

93LC86A

93LC86B

93LC86C

93LC46AT

93LC46BT

93LC46CT

93LC56AT

93LC56BT

93LC56CT

93LC66AT

93LC66BT

93LC66CT

93LC76AT

93LC76BT

93LC76CT

93LC86AT

93LC86BT

93LC86CT

93C46AT

93C46BT

93C46CT

93C56AT

93C56BT

93C56CT

93C66AT

93C66BT

93C66CT

93C76AT

93C76BT

93C76CT

93C86AT

93C86BT

93C86CT

93AA46B

93AA46C

93AA56A

93AA56B

93AA56C

93AA66A

93AA66B

93AA66C

93AA76A

93AA76B

93AA76C

93AA86A

93AA86B

93AA86C

Note:

93C46B

93C46C

93C56A

93C56B

93C56C

93C66A

93C66B

93C66C

93C76A

93C76B

93C76C

93C86A

93C86B

93C86C

T = Temperature Range: I = Industrial, E = Extended

Legend: XX...X Part number or part number code

T

Temperature (I, E)

Y

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code (2 characters for small packages)

Pb-free JEDEC designator for Matte Tin (Sn)

YY

WW

NNN

e

3

Note: For very small packages with no room for the Pb-free JEDEC designator

, the marking will only appear on the outer carton or reel label.

e

3

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

DS21929D-page 21

93XX46X/56X/66X/76X/86X

Example:

8-Lead 2x3 DFN

304

506

L7

XXX

YWW

NN

3-Wire 2x3 DFN Package Marking

Industrial

Line 1

E-Temp

Line 1

Industrial

Line 1

E-Temp

Line 1

Industrial E-Temp

Part

Line 1

Marking

93AA46A

93AA46B

93AA46C

301

311

321

302

312

322

93LC46A

93LC46B

93LC46C

304

314

324

305

315

325

93C46A

93C46B

93C46C

307

317

327

308

318

328

93AA56A

93AA56B

93AA56C

331

341

351

332

342

352

93LC56A

93LC56B

93LC56C

334

344

354

335

345

355

93C56A

93C56B

93C56C

337

347

357

338

348

358

93AA66A

93AA66B

93AA66C

361

371

381

362

372

382

93LC66A

93LC66B

93LC66C

364

374

384

365

375

385

93C66A

93C66B

93C66C

367

377

387

368

378

388

93AA76C

93AA86C

3B1

3E1

3B2

3E2

93LC76C

93LC86C

3B4

3E4

3B5

3E5

93C76C

93C86C

3B7

3E7

3B8

3E8

Legend: XX...X Part number or part number code

T

Temperature (I, E)

Y

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code (2 characters for small packages)

Pb-free JEDEC designator for Matte Tin (Sn)

YY

WW

NNN

e

3

Note: For very small packages with no room for the Pb-free JEDEC designator

, the marking will only appear on the outer carton or reel label.

e

3

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

DS21929D-page 22

93XX46X/56X/66X/76X/86X

Example:

1EL7

6-Lead SOT-23

XXNN

3-Wire 6-Lead SOT-23 Package Marking

Industrial

Line 1

E-Temp

Line 1

Industrial

Line 1

E-Temp

Line 1

Industrial E-Temp

Part

Line 1

Marking

93AA46A

93AA46B

1BNN

1LNN

1CNN

1MNN

93LC46A

93LC46B

1ENN

1PNN

1FNN

1RNN

93C46A

93C46B

1HNN

1TNN

1JNN

1UNN

93AA56A

93AA56B

2BNN

2LNN

2CNN

2MNN

93LC56A

93LC56B

2ENN

2PNN

2FNN

2RNN

93C56A

93C56B

2HNN

2TNN

2JNN

2UNN

93AA66A

93AA66B

3BNN

3LNN

3CNN

3MNN

93LC66A

93LC66B

3ENN

3PNN

3FNN

3RNN

93C66A

93C66B

3HNN

3TNN

3JNN

3UNN

93AA76A

93AA76B

4BNN

4LNN

4CNN

4MNN

93LC76A

93LC76B

4ENN

4PNN

4FNN

4RNN

93C76A

93C76B

4HNN

4TNN

4JNN

4UNN

93AA86A

93AA86B

5BNN

5LNN

5CNN

5MNN

93LC86A

93LC86B

5ENN

5PNN

5FNN

5RNN

93C86A

93C86B

5HNN

5TNN

5JNN

5UNN

Legend: XX...X Part number or part number code

T

Temperature (I, E)

Y

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code (2 characters for small packages)

Pb-free JEDEC designator for Matte Tin (Sn)

YY

WW

NNN

e

3

Note: For very small packages with no room for the Pb-free JEDEC designator

, the marking will only appear on the outer carton or reel label.

e

3

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

DS21929D-page 23

93XX46X/56X/66X/76X/86X

8-Lead MSOP (150 mil)

Example:

3L46AI

5281L7

XXXXXXT

YWWNNN

3-Wire 8-Lead MSOP Package Marking

Part

93AA46A

Line 1 Marking

Part

Line 1 Marking

Part

93C46A

Line 1 Marking

3A46AT

3A46BT

3A46CT

3A56AT

3A56BT

3A56CT

3A66AT

3A66BT

3A66CT

3A76AT

3A76BT

3A76CT

3A86AT

3A86BT

3A86CT

93LC46A

93LC46B

93LC46C

93LC56A

93LC56B

93LC56C

93LC66A

93LC66B

93LC66C

93LC76A

93LC76B

93LC76C

93LC86A

93LC86B

93LC86C

3L46AT

3L46BT

3L46CT

3L56AT

3L56BT

3L56CT

3L66AT

3L66BT

3L66CT

3L76AT

3L76BT

3L76CT

3L86AT

3L86BT

3L86CT

3C46AT

3C46BT

3C46CT

3C56AT

3C56BT

3C56CT

3C66AT

3C66BT

3C66CT

3C76AT

3C76BT

3C76CT

3C86AT

3C86BT

3C86CT

93AA46B

93AA46C

93AA56A

93AA56B

93AA56C

93AA66A

93AA66B

93AA66C

93AA76A

93AA76B

93AA76C

93AA86A

93AA86B

93AA86C

Note:

93C46B

93C46C

93C56A

93C56B

93C56C

93C66A

93C66B

93C66C

93C76A

93C76B

93C76C

93C86A

93C86B

93C86C

T = Temperature Range: I = Industrial, E = Extended

Legend: XX...X Part number or part number code

T

Temperature (I, E)

Y

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code (2 characters for small packages)

Pb-free JEDEC designator for Matte Tin (Sn)

YY

WW

NNN

e

3

Note: For very small packages with no room for the Pb-free JEDEC designator

, the marking will only appear on the outer carton or reel label.

e

3

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

DS21929D-page 24

93XX46X/56X/66X/76X/86X

Example:

8-Lead TSSOP

L46A

I528

1L7

XXXX

TYWW

NNN

3-Wire 8-Lead TSSOP Package Marking

Part

93AA46A

Line 1 Marking

Part

Line 1 Marking

Part

93C46A

Line 1 Marking

A46A

A46B

A46C

A56A

A56B

A56C

A66A

A66B

A66C

A76A

A76B

A76C

A86A

A86B

A86C

93LC46A

93LC46B

93LC46C

93LC56A

93LC56B

93LC56C

93LC66A

93LC66B

93LC66C

93LC76A

93LC76B

93LC76C

93LC86A

93LC86B

93LC86C

L46A

L46B

L46C

L56A

L56B

L56C

L66A

L66B

L66C

L76A

L76B

L76C

L86A

L86B

L86C

C46A

C46B

C46C

C56A

C56B

C56C

C66A

C66B

C66C

C76A

C76B

C76C

C86A

C86B

C86C

93AA46B

93AA46C

93AA56A

93AA56B

93AA56C

93AA66A

93AA66B

93AA66C

93AA76A

93AA76B

93AA76C

93AA86A

93AA86B

93AA86C

Note:

93C46B

93C46C

93C56A

93C56B

93C56C

93C66A

93C66B

93C66C

93C76A

93C76B

93C76C

93C86A

93C86B

93C86C

Temperature range on second line.

Legend: XX...X Part number or part number code

T

Temperature (I, E)

Y

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code (2 characters for small packages)

Pb-free JEDEC designator for Matte Tin (Sn)

YY

WW

NNN

e

3

Note: For very small packages with no room for the Pb-free JEDEC designator

, the marking will only appear on the outer carton or reel label.

e

3

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

DS21929D-page 25

93XX46X/56X/66X/76X/86X

8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

N

NOTE 1

E1

3

1

2

D

E

A2

A

L

A1

c

e

eB

b1

b

Units

INCHES

Dimension Limits

MIN

NOM

8

MAX

Number of Pins

Pitch

N

e

.100 BSC

–

Top to Seating Plane

A

–

.210

.195

–

Molded Package Thickness

Base to Seating Plane

Shoulder to Shoulder Width

Molded Package Width

Overall Length

A2

A1

E

.115

.015

.290

.240

.348

.115

.008

.040

.014

–

.130

–

.310

.250

.365

.130

.010

.060

.018

–

.325

.280

.400

.150

.015

.070

.022

.430

E1

D

Tip to Seating Plane

Lead Thickness

L

c

Upper Lead Width

b1

b

Lower Lead Width

Overall Row Spacing §

eB

Notes:

1. Pin 1 visual index feature may vary, but must be located with the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-018B

DS21929D-page 26

93XX46X/56X/66X/76X/86X

8-Lead Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

D

e

N

E

E1

NOTE 1

1

2

3

α

h

b

h

c

φ

A2

A

L

A1

L1

β

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

Pitch

N

e

8

1.27 BSC

Overall Height

A

–

1.75

–

Molded Package Thickness

Standoff

A2

A1

E

1.25

0.10

–

§

–

0.25

Overall Width

6.00 BSC

Molded Package Width

Overall Length

Chamfer (optional)

Foot Length

E1

D

h

3.90 BSC

4.90 BSC

0.25

0.40

–

0.50

1.27

L

–

Footprint

L1

φ

1.04 REF

Foot Angle

0°

0.17

0.31

5°

–

8°

Lead Thickness

Lead Width

c

0.25

0.51

15°

b

Mold Draft Angle Top

Mold Draft Angle Bottom

α

β

5°

15°

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-057B

DS21929D-page 27

93XX46X/56X/66X/76X/86X

8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

e

D

b

N

L

K

E2

E

EXPOSED PAD

NOTE 1

2

1

2

D2

BOTTOM VIEW

TOP VIEW

A

NOTE 2

A3

A1

Units

MILLIMETERS

Dimension Limits

MIN

NOM

8

MAX

Number of Pins

Pitch

N

e

0.50 BSC

0.90

Overall Height

Standoff

A

0.80

0.00

1.00

0.05

A1

A3

D

0.02

Contact Thickness

Overall Length

Overall Width

0.20 REF

2.00 BSC

3.00 BSC

–

E

Exposed Pad Length

Exposed Pad Width

Contact Width

Contact Length

Contact-to-Exposed Pad

D2

E2

b

1.30

1.50

0.18

0.30

0.20

1.75

1.90

0.30

0.50

–

0.25

L

0.40

K

–

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package may have one or more exposed tie bars at ends.

3. Package is saw singulated.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-123B

DS21929D-page 28

93XX46X/56X/66X/76X/86X

6-Lead Plastic Small Outline Transistor (CH or OT) [SOT-23]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

b

4

N

E

E1

PIN 1 ID BY

LASER MARK

1

2

3

e

e1

D

c

A

φ

A2

L

A1

L1

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

Pitch

N

e

6

0.95 BSC

Outside Lead Pitch

Overall Height

e1

A

1.90 BSC

0.90

0.89

0.00

2.20

1.30

2.70

0.10

0.35

0°

–

1.45

1.30

0.15

3.20

1.80

3.10

0.60

0.80

30°

Molded Package Thickness

Standoff

A2

A1

E

Overall Width

Molded Package Width

Overall Length

Foot Length

E1

D

L

Footprint

L1

φ

Foot Angle

Lead Thickness

Lead Width

c

0.08

0.20

0.26

0.51

b

Notes:

1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.

2. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-028B

DS21929D-page 29

93XX46X/56X/66X/76X/86X

8-Lead Plastic Micro Small Outline Package (MS or UA) [MSOP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

D

N

E

E1

NOTE 1

2

b

1

e

c

φ

A2

A

L

L1

A1

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

Pitch

N

e

8

0.65 BSC

Overall Height

A

–

1.10

0.95

0.15

Molded Package Thickness

Standoff

A2

A1

E

0.75

0.00

0.85

–

4.90 BSC

3.00 BSC

0.60

Overall Width

Molded Package Width

Overall Length

Foot Length

E1

D

L

0.40

0.80

Footprint

L1

φ

0.95 REF

–

Foot Angle

0°

8°

Lead Thickness

c

0.08

–

0.23

0.40

Lead Width

b

0.22

–

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-111B

DS21929D-page 30

93XX46X/56X/66X/76X/86X

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

D

N

E

E1

NOTE 1

1

2

b

e

c

φ

A

A2

A1

L

L1

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

Pitch

N

e

8

0.65 BSC

Overall Height

A

–

1.20

1.05

0.15

Molded Package Thickness

Standoff

A2

A1

E

0.80

0.05

1.00

–

Overall Width

6.40 BSC

Molded Package Width

Molded Package Length

Foot Length

E1

D

4.30

2.90

0.45

4.40

4.50

3.10

0.75

3.00

L

0.60

Footprint

L1

φ

1.00 REF

Foot Angle

0°

–

8°

Lead Thickness

c

0.09

0.20

0.30

Lead Width

b

0.19

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-086B

DS21929D-page 31

93XX46X/56X/66X/76X/86X

NOTES:

DS21929D-page 32

93XX46X/56X/66X/76X/86X

THE MICROCHIP WEB SITE

CUSTOMER SUPPORT

Microchip provides online support via our WWW site at

www.microchip.com. This web site is used as a means

to make files and information easily available to

customers. Accessible by using your favorite Internet

browser, the web site contains the following

information:

Users of Microchip products can receive assistance

through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

• Product Support – Data sheets and errata,

application notes and sample programs, design

resources, user’s guides and hardware support

documents, latest software releases and archived

software

• Development Systems Information Line

Customers

should

contact

their

distributor,

representative or field application engineer (FAE) for

support. Local sales offices are also available to help

customers. A listing of sales offices and locations is

included in the back of this document.

• General Technical Support – Frequently Asked

Questions (FAQ), technical support requests,

online discussion groups, Microchip consultant

program member listing

Technical support is available through the web site

at: http://support.microchip.com

• Business of Microchip – Product selector and

ordering guides, latest Microchip press releases,

listing of seminars and events, listings of

Microchip sales offices, distributors and factory

representatives

CUSTOMER CHANGE NOTIFICATION

SERVICE

Microchip’s customer notification service helps keep

customers current on Microchip products. Subscribers

will receive e-mail notification whenever there are

changes, updates, revisions or errata related to a

specified product family or development tool of interest.

To register, access the Microchip web site at

www.microchip.com, click on Customer Change

Notification and follow the registration instructions.

DS21929D-page 33

93XX46X/56X/66X/76X/86X

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-

uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation

can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

To:

Technical Publications Manager

Reader Response

Total Pages Sent ________

RE:

From:

Name

Company

Address

City / State / ZIP / Country

Telephone: (_______) _________ - _________

FAX: (______) _________ - _________

Application (optional):

Would you like a reply?

Y

N

93XX46X/56X/66X/76X/86X

DS21929D

Literature Number:

Device:

Questions:

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

DS21929D-page 34

93XX46X/56X/66X/76X/86X

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Tape &

Reel

Temp

Range

EEPROM

Series

Word

Size

Voltage

Density

Package

93

AA = 1.8V-5.5V

LC = 2.5V-5.5V

C = 4.5V-5.5V

46 = 1 Kbit

56 = 2 Kbit

66 = 4 Kbit

76 = 8 Kbit

86 = 16 Kbit

A = x8 bit

B = x16 bit

C = Selectable

Blank = Std Pkg

T = Tape & Reel

I = -40°C to +85°C

E = -40°C to +125°C

P = 8-Lead PDIP

SN = 8-Lead SOIC (3.90 mm)

MC = 8-Lead 2x3 DFN

CH or OT = 6-Lead SOT-23

MS = 8-Lead MSOP

Examples:

ST = 8-Lead TSSOP

a)

93AA46A-I/MS: 1K, 128x8 Serial EEPROM,

Industrial Temperature, MSOP package, 1.8V

b)

93AA46BT-I/OT: 1K, 64x16 Serial EEPROM,

SOT-23 package, tape and reel, 1.8V

c)

d)

93AA46CT-I/MS: 1K, 128x8 or 64x16 Serial

EEPROM, MSOP package, tape and reel, 1.8V

93AA46BX-I/SN: 1K, 128x8 Serial EEPROM,

Industrial temperature, SOIC package (alter-

nate pinout), tape and reel package, 1.8V

e)

f)

93LC66A-I/MS: 4K, 512x8 Serial EEPROM,

MSOP package, 2.5V

93LC66BT-I/OT: 4K, 256x16 Serial EEPROM,

SOT-23 package, tape and reel, 2.5V

g)

h)

i)

93C86AT-I/OT: 16K, 2048x8 Serial EEPROM,

SOT-23 package, tape and reel, 5.0V

93C86BT-I/OT: 16K, 1024x16 Serial EEPROM,

SOT-23 package, tape and reel, 5.0V

93C86CT-I/MC: 16K, 2048x8 or 1024x16

Serial EEPROM, DFN Industrial temperature,

tape and reel package, 5.0V

DS21929D-page 35

93XX46X/56X/66X/76X/86X

NOTES:

DS21929D-page 36

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,

PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and

SmartShunt are registered trademarks of Microchip

Technology Incorporated in the U.S.A. and other countries.

AmpLab, FilterLab, Linear Active Thermistor, Migratable

Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor

and The Embedded Control Solutions Company are

registered trademarks of Microchip Technology Incorporated

in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard,

dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,

ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,

In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,

MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,

PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,

PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,

rfPICDEM, Select Mode, Smart Serial, SmartTel, Total

Endurance, UNI/O, WiperLock and ZENA are trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona, Gresham, Oregon and Mountain View, California. The

Company’s quality system processes and procedures are for its PIC^®

MCUs and dsPIC^®DSCs, KEELOQ^®code hopping devices, Serial

EEPROMs, microperipherals, nonvolatile memory and analog

products. In addition, Microchip’s quality system for the design and

manufacture of development systems is ISO 9001:2000 certified.

DS21929D-page 37

WORLDWIDE SALES AND SERVICE

AMERICAS

ASIA/PACIFIC

EUROPE

Corporate Office

Asia Pacific Office

Suites 3707-14, 37th Floor

Tower 6, The Gateway

Habour City, Kowloon

Hong Kong

Tel: 852-2401-1200

Fax: 852-2401-3431

India - Bangalore

Tel: 91-80-4182-8400

Fax: 91-80-4182-8422

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://support.microchip.com

Web Address:

www.microchip.com

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

India - New Delhi

Tel: 91-11-4160-8631

Fax: 91-11-4160-8632

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

India - Pune

Tel: 91-20-2566-1512

Fax: 91-20-2566-1513

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

Atlanta

Duluth, GA

Tel: 678-957-9614

Fax: 678-957-1455

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Japan - Yokohama

Tel: 81-45-471- 6166

Fax: 81-45-471-6122

China - Beijing

Tel: 86-10-8528-2100

Fax: 86-10-8528-2104

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Korea - Gumi

Tel: 82-54-473-4301

Fax: 82-54-473-4302

Boston

China - Chengdu

Tel: 86-28-8665-5511

Fax: 86-28-8665-7889

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Korea - Seoul

China - Fuzhou

Tel: 86-591-8750-3506

Fax: 86-591-8750-3521

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

China - Hong Kong SAR

Tel: 852-2401-1200

Fax: 852-2401-3431

Malaysia - Penang

Tel: 60-4-646-8870

Fax: 60-4-646-5086

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

UK - Wokingham

Tel: 44-118-921-5869

Fax: 44-118-921-5820

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Detroit

Farmington Hills, MI

Tel: 248-538-2250

Fax: 248-538-2260

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Kokomo

Kokomo, IN

Tel: 765-864-8360

Fax: 765-864-8387

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

Taiwan - Hsin Chu

Tel: 886-3-572-9526

Fax: 886-3-572-6459

China - Shenzhen

Tel: 86-755-8203-2660

Fax: 86-755-8203-1760

Taiwan - Kaohsiung

Tel: 886-7-536-4818

Fax: 886-7-536-4803

Los Angeles

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

China - Shunde

Tel: 86-757-2839-5507

Fax: 86-757-2839-5571

Taiwan - Taipei

Tel: 886-2-2500-6610

Fax: 886-2-2508-0102

Santa Clara

Santa Clara, CA

Tel: 408-961-6444

Fax: 408-961-6445

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

Toronto

Mississauga, Ontario,

Canada

Tel: 905-673-0699

Fax: 905-673-6509

China - Xian

Tel: 86-29-8833-7250

Fax: 86-29-8833-7256

12/08/06

DS21929D-page 38


型号：	93C86AT-I/ST
厂家：	MICROCHIP
描述：	1K-16K Microwire Compatible Serial EEPROMs 1K - 16K与Microwire兼容串行EEPROM 存储内存集成电路光电二极管可编程只读存储器电动程控只读存储器电可擦编程只读存储器时钟
文件：	总38页 (文件大小：703K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

93C86AT-I/ST [MICROCHIP]

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