59C11E/SN [MICROCHIP]

128 X 8 4-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOIC-8;
59C11E/SN
型号: 59C11E/SN
厂家: MICROCHIP    MICROCHIP
描述:

128 X 8 4-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOIC-8

可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器
文件: 总12页 (文件大小:104K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
59C11  
1K 5.0V Microwire Serial EEPROM  
FEATURES  
PACKAGE TYPES  
• Low power CMOS technology  
DIP  
• Pin selectable memory organization  
- 128 x 8 or 64 x 16 bit organization  
• Single 5V only operation  
CS  
CLK  
DI  
1
2
3
4
8
7
6
5
VCC  
• Self timed WRITE, ERAL and WRAL cycles  
• Automatic erase before WRITE  
• RDY/BSY status information during WRITE  
• Power on/off data protection circuitry  
• 1,000,000 ERASE/WRITE cycles guaranteed  
• Data Retention > 200 Years  
RDY/BSY  
ORG  
DO  
VSS  
• 8-pin DIP or SOIC package  
SOIC  
Temperature ranges supported  
- Commercial (C):  
- Industrial (I):  
- Automotive (E):  
0˚C to +70˚C  
-40˚C to +85˚C  
-40˚C to +125˚C  
1
2
3
4
8
7
6
5
VCC  
CS  
CLK  
DI  
RDY/BSY  
ORG  
DESCRIPTION  
The Microchip Technology Inc. 59C11 is a 1K bit Elec-  
trically Erasable PROM. The device is configured as  
128 x 8 or 64 x 16, selectable externally by means of  
the control pin ORG. Advanced CMOS technology  
makes this device ideal for low power nonvolatile mem-  
ory applications. The 59C11 is available in the standard  
8-pin DIP and a surface mount SOIC package.  
VSS  
DO  
BLOCK DIAGRAM  
VCC  
VSS  
MEMORY  
ARRAY  
128 x 8 or  
ADDRESS  
DECODER  
ORG  
64 x 16  
OUTPUT  
BUFFER  
DATA REGISTER  
DO  
DI  
MODE  
DECODE  
CS  
LOGIC  
RDY/BSY  
CLOCK  
GENERATOR  
CLK  
Microwire is a registered trademark of National Semiconductor Incorporated.  
1996 Microchip Technology Inc.  
DS20040J-page 1  
This document was created with FrameMaker 4 0 4  
59C11  
TABLE 1-1:  
Name  
PIN FUNCTION TABLE  
Function  
1.0  
ELECTRICAL CHARACTERISTICS  
1.1  
Maximum Ratings*  
CS  
CLK  
Chip Select  
VCC...................................................................................7.0V  
All inputs and outputs w.r.t. VSS ............... -0.6V to VCC +1.0V  
Storage temperature .................................. -65˚C to +150˚C  
Ambient temperature with power applied...... -65˚C to +125˚C  
Soldering temperature of leads (10 seconds) ............. +300˚C  
ESD protection on all pins................................................4 kV  
Serial Clock  
DI  
Data In  
DO  
Data Out  
VSS  
Ground  
ORG  
RDY/BSY  
VCC  
Memory Array Organization  
Ready/Busy Status  
+5V Power SUpply  
*Notice: Stresses above those listed under “Maximum ratings”  
may cause permanent damage to the device. This is a stress rat-  
ing only and functional operation of the device at those or any  
other conditions above those indicated in the operational listings  
of this specification is not implied. Exposure to maximum rating  
conditions for extended periods may affect device reliability.  
TABLE 1-2:  
DC CHARACTERISTICS  
VCC = +5.0V (±10%)  
Commercial (C):  
Tamb  
= 0°C to 70°C  
Industrial (I):  
Automotive (E):  
Tamb  
Tamb  
= -40°C to +85°C  
= -40°C to 125°C  
Parameter  
Symbol  
Min  
Max  
Units  
Conditions  
VCC detector threshold  
High level input voltage  
Low level input voltage  
High level output voltage  
Low level output voltage  
Input leakage current  
Output leakage current  
VTH  
VIH  
VIL  
2.8  
2.0  
-0.3  
2.4  
4.5  
Vcc+1  
0.8  
V
V
V
VOH  
VOL  
ILI  
V
IOH = -400 µA  
0.4  
10  
V
IOL = 3.2 mA  
µA  
µA  
pF  
VIN = 0V to VCC (Note 1)  
VOUT = 0V to VCC (Note 1)  
ILO  
10  
Pin capacitance  
CIN,  
7
VIN/VOUT = 0V (Note 2)  
(all inputs/outputs)  
COUT  
Tamb = 25°C, f = 1 MHz  
Operating current (all modes)  
Standby current  
ICC write  
ICCS  
4
mA  
FCLK = 1 MHz, VCC = 5.5V  
CS = 0V, VCC = 5.5V  
100  
µA  
Note 1: Internal resister pull-up at Pin 6. Active output at Pin 7.  
2: This parameter is periodically sampled and not 100% tested.  
FIGURE 1-1: SYNCHRONOUS DATA TIMING  
TCKH  
TCKL  
TCSH  
VIH  
CLK  
DI  
VIL  
TDIH  
TDIS  
TDIH  
TDIS  
VIH  
VALID  
VALID  
VIL  
TCSL  
VIH  
TCSS  
CS  
VIL  
TPD  
TPD  
TCZ  
VIH/ VOH  
VIL/VOL  
HIGH  
DO  
VALID  
VALID  
Z
DS20040J-page 2  
1996 Microchip Technology Inc.  
59C11  
TABLE 1-3:  
AC CHARACTERISTICS  
Parameter  
Symbol  
Min  
Max  
Units  
Conditions  
Clock frequency  
Clock high time  
Clock low time  
FCLK  
TCKH  
TCKL  
TCSS  
TCSH  
TCS  
1
MHz  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
500  
500  
50  
0
Chip select setup time  
Chip select hold time  
Chip select low time  
100  
100  
100  
Data input setup time  
TDIS  
TDIH  
TPD  
Data input hold time  
Data output delay time  
400  
100  
400  
400  
CL = 100 pF  
Data output disable time (from CS = low)  
Data output disable time (from last clock)  
RDY/BSY delay time  
TCZ  
0
CL = 100 pF  
CL = 100 pF  
TDDZ  
TRBD  
Twc  
0
Program cycle time (Auto Erase and Write)  
1
15  
ms  
ms  
for 8-bit mode  
for ERAL and WRAL  
in 8/16-bit modes  
Endurance  
1M  
cycles 25°C, Vcc = 5.0V, Block Mode  
(Note 1)  
Note 1: This parameter is not tested but guaranteed by characterization. For endurance estimates in a specific appli-  
cation, please consult the Total Endurance Model which can be obtained on our BBS or website.  
TABLE 1-4:  
INSTRUCTION SET  
6 X 16 MODE, ORG = 1  
Address  
Number of  
Req. CLK CYcles  
Instruction  
Start Bit  
Opcode  
Data In  
Data Out  
READ  
WRITE  
EWEN  
EWDS  
ERAL  
1
1
1
1
1
1
1 0 X X  
X 1 X X  
0 0 1 1  
0 0 0 0  
0 0 1 0  
0 0 0 1  
A5 A4 A3 A2 A1 A0  
A5 A4 A3 A2 A1 A0  
D15-D0  
D15-D0  
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
27  
27  
11  
11  
11  
27  
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
WRAL  
D15-D0  
128 X 8 MODE, ORG = 0  
Number of  
Req. CLK CYcles  
Instruction  
Start Bit  
Opcode  
Address  
Data In  
Data Out  
READ  
WRITE  
EWEN  
EWDS  
ERAL  
1
1
1
1
1
1
1 0 X X  
X 1 X X  
0 0 1 1  
0 0 0 0  
0 0 1 0  
0 0 0 1  
A6 A5 A4 A3 A2 A1 A0  
A6 A5 A4 A3 A2 A1 A0  
D7-D0  
D7-D0  
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
20  
20  
12  
12  
12  
20  
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
WRAL  
D7-D0  
1996 Microchip Technology Inc.  
DS20040J-page 3  
59C11  
2.4  
READ Mode  
2.0  
FUNCTIONAL DESCRIPTION  
The READ instruction outputs the serial data of the  
addressed memory location on the DO pin. A dummy  
bit (logical 0) precedes the 8- or 16-bit output string.  
The output data changes during the high state of the  
system clock (CLK). The dummy bit is output TPD after  
the positive edge of CLK, which was used to clock in the  
last address bit (A0). Therefore, care must be taken if  
DI and DO are connected together as a bus contention  
will occur for one clock cycle if A0 is a one.  
2.1  
START Condition  
The START bit is detected by the device if CS and DI  
are both High with respect to the positive edge of CLK  
for the first time.  
Before a START condition is detected, CS, CLK, and DI  
may change in any combination (except to that of a  
START condition) without resulting in any device oper-  
ation (READ, WRITE, EWEN, EWDS, ERAL, and  
WRAL). As soon as CS is HIGH, the device is no longer  
in the standby mode.  
DO will go into HIGH-Z mode with the positive edge of  
the next CLK cycle. This follows the output of the last  
data bit D0 or the negative edge of CS, whichever  
occurs first. D0 remains stable between CLK cycles for  
an unlimited time as long as CS stays HIGH.  
An instruction following a START condition will only be  
executed if the required amount of opcode, address  
and data bits for any particular instruction is clocked in.  
The most significant data bit (D15 or D7) is always out-  
put first, followed by the lower significant bits (D14 - D0  
or D6 - D0).  
After execution of an instruction (i.e. clock in or out of  
the last required address or data bit) CLK and DI  
become don't care bits until a new start condition is  
detected.  
2.5  
WRITE  
Note: CS must go LOW between consecutive  
The WRITE instruction is followed by 8 or 16 bits of data  
which are written into the specified address. The most  
significant data bit (D15 or D7) has to be clocked in first  
followed by the lower significant data bits (D14 – D0 or  
D6 – D0). If a WRITE instruction is recognized by the  
device and all data bits have been clocked in, the  
device performs an automatic erase cycle on the spec-  
ified address before the data are written. The WRITE  
cycle is completely self timed and commences auto-  
matically after the rising edge of the CLK signal for the  
last data bit (D0).  
instructions.  
2.2  
DI/DO Pins  
It is possible to connect the Data In and Data Out pins  
together. However, with this configuration it is possible  
for a “bus conflict” to occur during the “dummy zero” that  
precedes the READ operation, ifA0 is a logic high level.  
Under such a condition the voltage level seen at Data  
Out is undefined and will depend upon the relative  
impedances of Data Out and the signal source driving  
A0. The higher the current sourcing capability ofA0, the  
higher the voltage at the Data Out pin.  
The WRITE cycle takes 1 ms maximum for 8-bit mode  
and 2 ms maximum for 16-bit mode.  
2.3  
Data Protection  
2.6  
Erase/Write Enable and Disable  
(EWEN, EWDS)  
During power-up, all modes of operation are inhibited  
until VCC has reached a level of 2.8 V. During power-  
down, the source data protection circuitry acts to inhibit  
all modes when VCC has fallen below 2.8 V.  
The device is automatically in the ERASE/WRITE Dis-  
able mode (EWDS) after power-up. Therefore, EWEN  
instruction has to be performed before any WRITE,  
ERAL, or WRAL instruction is executed by the device.  
For added data protection, the device should be put in  
the ERASE/WRITE Disable mode (EWDS) after pro-  
gramming operations are completed.  
The EWEN and EWDS commands give additional pro-  
tection against accidentally programming during nor-  
mal operation.  
After power-up, the device is automatically in the  
EWDS mode. Therefore, EWEN instruction must be  
performed before any WRITE, ERAL or WRAL instruc-  
tion can be executed. After programming is completed,  
the EWDS instruction offers added protection against  
unintended data changes.  
2.7  
ERASE All (ERAL)  
The entire chip will be erased to logical “1s” if this  
instruction is received by the device and it is in the  
EWEN mode. The ERAL cycle is completely self-timed  
and commences after the rising edge of the CLK signal  
for the last dummy address bit. ERAL takes 15 ms max-  
imum.  
DS20040J-page 4  
1996 Microchip Technology Inc.  
59C11  
2.8  
WRITE All (WRAL)  
The entire chip will be written with the data specified in  
that command. The WRAL cycle is completely self-  
timed and commences after the last data bit (D0) has  
been clocked in. WRAL takes 15 ms maximum.  
Note: The WRAL does not include an automatic  
ERASE cycle for the chip. Therefore, the  
WRAL instruction must be preceded by an  
ERAL instruction and the chip must be in  
the EWEN status in both cases. The  
WRAL instruction is used for testing and/or  
device initialization.  
FIGURE 2-1: READ MODE  
CLK  
T
CSL  
CS  
OPCODE  
SB  
1
AN  
X
A0  
X
DI  
1
0
X
X
T
DDZ  
TPD  
DO  
HIGH - Z  
D0  
0
DN  
NOTE: ORGANIZATION  
AN  
DN  
D7  
128 x 8  
64 x 16  
A6  
A5  
NEW INSTRUCTION  
OR STANDBY (CS = 0)  
D15  
FIGURE 2-2: WRITE MODE  
CLK  
TCSL  
CS  
SB  
OPCODE  
AN  
X
A0  
X
DN  
D0  
DI  
1
X
1
X
X
X
X
DO  
HIGH - Z  
TRBD  
RDY/BSY  
TWC  
NOTE: ORGANIZATION  
AN  
A6  
A5  
DN  
128 x 8  
64 x 16  
D7  
NEW INSTRUCTION  
OR STANDBY (CS = 0)  
D15  
1996 Microchip Technology Inc.  
DS20040J-page 5  
59C11  
FIGURE 2-3: ERASE/WRITE ENABLE AND DISABLE  
CLK  
TCSL  
CS  
SB  
1
OPCODE  
AN  
X
A0  
X
SB  
DI  
0
0
0
0
1
EWDS  
EWEN  
1
DO  
HIGH - Z  
NOTE: ORGANIZATION  
AN  
128 x 8  
64 x 16  
A6  
A5  
NEW INSTRUCTION  
OR STANDBY (CS = 0)  
FIGURE 2-4: ERASE ALL (ERAL)  
CLK  
TCSH  
TCSL  
SB  
CS  
SB  
1
OPCODE  
AN  
A0  
X
DI  
0
0
1
0
X
DO  
HIGH - Z  
TRBD  
RDY/BSY  
NOTE: ORGANIZATION  
AN  
A6  
TWC  
128 x 8  
64 x 16  
NEW INSTRUCTION  
OR STANDBY (CS = 0)  
A5  
FIGURE 2-5: WRITE ALL  
CLK  
TCSH  
TCSL  
CS  
SB  
OPCODE  
0
AN  
X
A0  
DN  
D0  
X
DI  
1
0
0
1
X
X
DO  
HIGH - Z  
TRBD  
RDY/BSY  
TWC  
NOTE: ORGANIZATION  
AN  
A6  
DN  
D7  
128 x 8  
64 x 16  
NEW INSTRUCTION  
OR STANDBY (CS = 0)  
A5  
D15  
DS20040J-page 6  
1996 Microchip Technology Inc.  
59C11  
3.4  
Data Out (DO)  
3.0  
PIN DESCRIPTION  
Data Out is used in the READ mode to output data syn-  
chronously with the CLK input (TPD after the positive  
edge of CLK). This output is in HIGH–Z mode except  
if data is clocked out as a result of a READ instruction.  
3.1  
Chip Select (CS)  
A HIGH level selects the device. A LOW level dese-  
lects the device and forces it into standby mode. How-  
ever, a WRITE cycle which is already initiated and/or in  
progress will be completed, regardless of the CS input  
signal. If CS is brought LOW during a WRITE cycle, the  
device will go into standby mode as soon as the WRITE  
cycle is completed.  
DI and DO can be connected together to perform a 3-  
wire interface (CS, CLK, DI/DO).  
Care must be taken with the leading dummy zero which  
is output after a READ command has been detected.  
Also, the controlling device must not drive the DI/DO  
bus during WRITE cycles.  
CS must be LOW for 100 ns (TCSL) minimum between  
consecutive instructions. If CS is LOW, the internal  
control logic is held in a RESET status.  
3.5  
Organization (ORG)  
3.2  
Serial Clock (CLK)  
This input selects the memory array organization.  
When the ORG pin is connected to +5 V the 64 x 16  
organization is selected. When it is connected to  
ground, the 128 x 8 organization is selected. If the  
ORG pin is left unconnected, then an internal pull-up  
device will select the 64 x 16 organization. In applica-  
tions subject to electrical noise, it is recommended that  
this pin not be left floating, but tied either high or low.  
The Serial Clock is used to synchronize the communi-  
cation between a master device and the 59C11.  
Opcode, address, and data bits are clocked in on the  
positive edge of CLK. Data bits are also clocked out on  
the positive edge of CLK.  
CLK can be stopped anywhere in the transmission  
sequence (at HIGH or LOW level) and can be continued  
anytime (with respect to clock high time (TCKH) and  
clock low time (TCKL)). This gives freedom in preparing  
opcode, address and data for the controlling master.  
3.6  
Ready/Busy (RDY/BSY)  
Pin 7 provides RDY/BSY status information. RDY/BSY  
is low if the device is performing a WRITE, ERAL, or  
WRAL operation. When it is HIGH the internal, self-  
timed WRITE, ERAL or WRAL operation has been  
completed and the device is ready to receive a new  
instruction.  
CLK is a “Don't Care” if CS is LOW (device deselected).  
If CS is HIGH, but a START condition has not been  
detected, any number of clock cycles can be received  
by the device without changing its status (i.e., waiting  
for START condition).  
CLK cycles are not required during the self-timed  
WRITE (i.e., auto erase/write) cycle.  
After detection of a START condition the specified num-  
ber of clock cycles (respectively LOW to HIGH transi-  
tions of CLK) must be provided. These clock cycles are  
required to clock in all required opcode, address, and  
data bits before an instruction is executed (see instruc-  
tion set truth table). When that limit has been reached,  
CLK and DI become “Don't Care” inputs until CS is  
brought LOW for at least chip select low time (TCSL)  
and brought HIGH again and a WRITE cycle (if any) is  
completed.  
3.3  
Data In (DI)  
Data In is used to clock in START bit, opcode, address  
and data synchronously with the CLK input.  
1996 Microchip Technology Inc.  
DS20040J-page 7  
59C11  
NOTES:  
DS20040J-page 8  
1996 Microchip Technology Inc.  
59C11  
NOTES:  
1996 Microchip Technology Inc.  
DS20040J-page 9  
59C11  
NOTES:  
DS20040J-page 10  
1996 Microchip Technology Inc.  
59C11  
59C11 Product Identification System  
To order or to obtain information, e.g., on pricing or delivery, please use the listed part numbers, and refer to the factory or the listed  
sales offices.  
59C11  
I
/P  
Package:  
P = Plastic DIP (300 mil Body)  
SN = Plastic SOIC (150 mil Body)  
SM = Plastic SOIC (207 mil Body)  
Temperature  
Range:  
Blank = 0°C to +70°C  
I = -40°C to +85°C  
E = -40°C to +125°C  
Device:  
59C11  
1K Microwire Serial EEPROM  
59C11T  
1K Microwire Serial EEPROM (Tape and Reel)  
1996 Microchip Technology Inc.  
DS20040J-page 11  
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Tel: 516 273-5305 Fax: 516 273-5335  
San Jose  
Microchip Technology Inc.  
2107 North First Street, Suite 590  
San Jose, CA 95131  
Tel: 408 436-7950 Fax: 408 436-7955  
Toronto  
Microchip Technology Inc.  
5925 Airport Road, Suite 200  
Mississauga, Ontario L4V 1W1, Canada  
Tel: 905 405-6279 Fax: 905 405-6253  
All rights reserved. 1996, Microchip Technology Incorporated, USA. 9/96  
Printed on recycled paper.  
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. No repre-  
sentation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement  
of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not autho-  
rized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. The Microchip logo and  
name are registered trademarks of Microchip Technology Inc. All rights reserved. All other trademarks mentioned herein are the property of their respective companies.  
DS20040J-page 12  
1996 Microchip Technology Inc.  

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