5962-3826703MUX [MICROCHIP]

EEPROM, 128KX8, 200ns, Parallel, CMOS, CQCC32;
5962-3826703MUX
型号: 5962-3826703MUX
厂家: MICROCHIP    MICROCHIP
描述:

EEPROM, 128KX8, 200ns, Parallel, CMOS, CQCC32

可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 内存集成电路
文件: 总17页 (文件大小:432K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Features  
Fast Read Access Time - 120 ns  
Automatic Page Write Operation  
– Internal Address and Data Latches for 128-Bytes  
– Internal Control Timer  
Fast Write Cycle Time  
AT28C010 Mil  
– Page Write Cycle Time - 10 ms Maximum  
– 1 to 128-Byte Page Write Operation  
Low Power Dissipation  
– 80 mA Active Current  
1-Megabit  
(128K x 8)  
Paged Parallel  
EEPROMs  
– 300µA CMOS Standby Current  
Hardware and Software Data Protection  
DATA Polling for End of Write Detection  
High Reliability CMOS Technology  
– Endurance: 104 or 105 Cycles  
– Data Retention: 10 Years  
Single 5V 10% Supply  
CMOS and TTL Compatible Inputs and Outputs  
JEDEC Approved Byte-Wide Pinout  
AT28C010  
Military  
(continued)  
Pin Configuration  
32 LCC  
Top View  
Pin Name  
A0 - A16  
CE  
Function  
Addresses  
Chip Enable  
Output Enable  
Write Enable  
Data Inputs/Outputs  
No Connect  
A7  
A6  
A5  
A4  
A3  
A2 10  
A1 11  
A0 12  
I/O0 13  
5
6
7
8
9
29 A14  
28 A13  
27 A8  
26 A9  
25 A11  
24 OE  
23 A10  
22 CE  
21 I/O7  
OE  
WE  
I/O0 - I/O7  
NC  
CERDIP, FLATPACK  
Top View  
44 LCC  
Top View  
NC  
A16  
A15  
A12  
A7  
1
2
3
4
5
6
7
8
9
32 VCC  
31 WE  
30 NC  
29 A14  
28 A13  
27 A8  
PGA  
Top View  
A12  
A7  
7
8
9
39 A13  
38 A8  
37 A9  
36 A11  
35 NC  
34 NC  
33 NC  
32 NC  
31 OE  
30 A10  
29 CE  
A6  
A6  
A5 10  
NC 11  
NC 12  
NC 13  
A4 14  
A3 15  
A2 16  
A1 17  
A5  
26 A9  
A4  
25 A11  
24 OE  
23 A10  
22 CE  
21 I/O7  
20 I/O6  
19 I/O5  
18 I/O4  
17 I/O3  
A3  
A2 10  
A1 11  
A0 12  
I/O0 13  
I/O1 14  
I/O2 15  
GND 16  
Atmel-0010I-PEEPR-AT28C010-Datasheet_062015  
Description  
The AT28C010 is a high-performance Electrically Erasable and Programmable Read Only Mem-  
ory. Its one megabit of memory is organized as 131,072 words by 8 bits. Manufactured with  
Atmel’s advanced nonvolatile CMOS technology, the device offers access times to 120 ns with  
power dissipation of just 440 mW. When the device is deselected, the CMOS standby current is  
less than 300A.  
The AT28C010 is accessed like a Static RAM for the read or write cycle without the need for  
external components. The device contains a 128-byte page register to allow writing of up to 128-  
bytes simultaneously. During a write cycle, the address and 1 to 128-bytes of data are internally  
latched, freeing the address and data bus for other operations. Following the initiation of a write  
cycle, the device will automatically write the latched data using an internal control timer. The end  
of a write cycle can be detected by DATA POLLING of I/O7. Once the end of a write cycle has  
been detected a new access for a read or write can begin.  
Atmel's 28C010 has additional features to ensure high quality and manufacturability. The device  
utilizes internal error correction for extended endurance and improved data retention character-  
istics. An optional software data protection mechanism is available to guard against inadvertent  
writes. The device also includes an extra 128-bytes of EEPROM for device identification or  
tracking.  
Block Diagram  
Absolute Maximum Ratings*  
*NOTICE:  
Stresses beyond those listed under “Absolute  
Maximum Ratings” may cause permanent dam-  
age to the device. This is a stress rating only and  
functional operation of the device at these or any  
other conditions beyond those indicated in the  
operational sections of this specification is not  
implied. Exposure to absolute maximum rating  
conditions for extended periods may affect device  
reliability.  
Temperature Under Bias ............................... -55°C to +125°C  
Storage Temperature..................................... -65°C to +150°C  
All Input Voltages  
(including NC Pins)  
with Respect to Ground ...................................-0.6V to +6.25V  
All Output Voltages  
with Respect to Ground .............................-0.6V to VCC + 0.6V  
Voltage on OE and A9  
with Respect to Ground ...................................-0.6V to +13.5V  
2
AT28C010 Military  
Atmel-0010I-PEEPR-AT28C010-Datasheet_062015  
AT28C010 Military  
Device Operation  
READ: The AT28C010 is accessed like a Static RAM. When CE and OE are low and WE is  
high, the data stored at the memory location determined by the address pins is asserted on the  
outputs. The outputs are put in the high impedance state when either CE or OE is high. This  
dual-line control gives designers flexibility in preventing bus contention in their system.  
BYTE WRITE: A low pulse on the WE or CE input with CE or WE low (respectively) and OE high  
initiates a write cycle. The address is latched on the falling edge of CE or WE, whichever occurs  
last. The data is latched by the first rising edge of CE or WE. Once a byte write has been started  
it will automatically time itself to completion. Once a programming operation has been initiated  
and for the duration of tWC, a read operation will effectively be a polling operation.  
PAGE WRITE: The page write operation of the AT28C010 allows 1 to 128-bytes of data to be  
written into the device during a single internal programming period. A page write operation is ini-  
tiated in the same manner as a byte write; the first byte written can then be followed by 1 to 127  
additional bytes. Each successive byte must be written within 150s (tBLC) of the previous byte.  
If the tBLC limit is exceeded the AT28C010 will cease accepting data and commence the internal  
programming operation. All bytes during a page write operation must reside on the same page  
as defined by the state of the A7 - A16 inputs. For each WE high to low transition during the  
page write operation, A7 - A16 must be the same.  
The A0 to A6 inputs are used to specify which bytes within the page are to be written. The bytes  
may be loaded in any order and may be altered within the same load period. Only bytes which  
are specified for writing will be written; unnecessary cycling of other bytes within the page does  
not occur.  
DATA POLLING: The AT28C010 features DATA Polling to indicate the end of a write cycle.  
During a byte or page write cycle an attempted read of the last byte written will result in the com-  
plement of the written data to be presented on I/O7. Once the write cycle has been completed,  
true data is valid on all outputs, and the next write cycle may begin. DATA Polling may begin at  
anytime during the write cycle.  
TOGGLE BIT: In addition to DATA Polling the AT28C010 provides another method for determin-  
ing the end of a write cycle. During the write operation, successive attempts to read data from  
the device will result in I/O6 toggling between one and zero. Once the write has completed, I/O6  
will stop toggling and valid data will be read. Reading the toggle bit may begin at any time during  
the write cycle.  
DATA PROTECTION: If precautions are not taken, inadvertent writes may occur during transi-  
tions of the host system power supply. Atmel has incorporated both hardware and software fea-  
tures that will protect the memory against inadvertent writes.  
HARDWARE PROTECTION: Hardware features protect against inadvertent writes to the  
AT28C010 in the following ways: (a) VCC sense - if VCC is below 3.8V (typical) the write function  
is inhibited; (b) VCC power-on delay - once VCC has reached 3.8V the device will automatically  
time out 5 ms (typical) before allowing a write: (c) write inhibit - holding any one of OE low, CE  
high or WE high inhibits write cycles; (d) noise filter - pulses of less than 15 ns (typical) on the  
WE or CE inputs will not initiate a write cycle.  
SOFTWARE DATA PROTECTION: A software controlled data protection feature has been  
implemented on the AT28C010. When enabled, the software data protection (SDP), will prevent  
inadvertent writes. The SDP feature may be enabled or disabled by the user; the AT28C010 is  
shipped from Atmel with SDP disabled.  
SDP is enabled by the host system issuing a series of three write commands; three specific  
bytes of data are written to three specific addresses (refer to Software Data Protection Algo-  
rithm). After writing the 3-byte command sequence and after tWC the entire AT28C010 will be  
protected against inadvertent write operations. It should be noted, that once protected the host  
may still perform a byte or page write to the AT28C010. This is done by preceding the data to be  
written by the same 3-byte command sequence used to enable SDP.  
3
Atmel-0010I-PEEPR-AT28C010-Datasheet_062015  
Once set, SDP will remain active unless the disable command sequence is issued. Power transi-  
tions do not disable SDP and SDP will protect the AT28C010 during power-up and power-down  
conditions. All command sequences must conform to the page write timing specifications. The  
data in the enable and disable command sequences is not written to the device and the memory  
addresses used in the sequence may be written with data in either a byte or page write opera-  
tion.  
After setting SDP, any attempt to write to the device without the 3-byte command sequence will  
start the internal write timers. No data will be written to the device; however, for the duration of  
tWC, read operations will effectively be polling operations.  
DEVICE IDENTIFICATION: An extra 128-bytes of EEPROM memory are available to the user  
for device identification. By raising A9 to 12V 0.5V and using address locations 1FF80H to  
1FFFFH the bytes may be written to or read from in the same manner as the regular memory  
array.  
OPTIONAL CHIP ERASE MODE: The entire device can be erased using a 6-byte software  
code. Please see Software Chip Erase application note for details.  
DC and AC Operating Range  
AT28C010-12  
-55°C - 125°C  
5V 10%  
AT28C010-15  
-55°C - 125°C  
5V 10%  
AT28C010-20  
-55°C - 125°C  
5V 10%  
AT28C010-25  
-55°C - 125°C  
5V 10%  
Operating  
Temperature (Case)  
Mil.  
VCC Power Supply  
Operating Modes  
Mode  
CE  
VIL  
VIL  
VIH  
X
OE  
VIL  
VIH  
X (1)  
X
WE  
VIH  
VIL  
X
I/O  
Read  
DOUT  
DIN  
Write (2)  
Standby/Write Inhibit  
Write Inhibit  
Write Inhibit  
Output Disable  
High Z  
VIH  
X
X
VIL  
VIH  
X
X
High Z  
Notes: 1. X can be VIL or VIH.  
2. Refer to AC Programming Waveforms  
DC Characteristics  
Symbol  
Parameter  
Condition  
Min  
Max  
10  
Units  
A  
ILI  
Input Load Current  
Output Leakage Current  
VIN = 0V to VCC + 1V  
VI/O = 0V to VCC  
ILO  
10  
A  
ISB1  
ISB2  
ICC  
VCC Standby Current CMOS CE = VCC - 0.3V to VCC + 1V  
300  
3
A  
VCC Standby Current TTL  
VCC Active Current  
CE = 2.0V to VCC + 1V  
f = 5 MHz; IOUT = 0 mA  
mA  
mA  
V
80  
VIL  
Input Low Voltage  
0.8  
4
AT28C010 Military  
Atmel-0010I-PEEPR-AT28C010-Datasheet_062015  
AT28C010 Military  
DC Characteristics (Continued)  
Symbol  
Parameter  
Condition  
Min  
Max  
Units  
VIH  
Input High Voltage  
Output Low Voltage  
Output High Voltage  
Output High Voltage CMOS  
2.0  
V
V
V
V
VOL  
IOL = 2.1 mA  
0.45  
VOH1  
VOH2  
IOH = -400 A  
2.4  
4,2  
IOH = -100 A; VCC = 4.5V  
AC Read Characteristics  
AT28C010-12  
AT28C010-15  
AT28C010-20  
AT28C010-25  
Symbol  
Parameter  
Min  
Max  
120  
120  
50  
Min  
Max  
150  
150  
55  
Min  
Max  
200  
200  
55  
Min  
Max  
250  
250  
55  
Units  
tACC  
Address to Output Delay  
CE to Output Delay  
OE to Output Delay  
CE or OE to Output Float  
ns  
ns  
ns  
ns  
ns  
(1)  
tCE  
(2)  
tOE  
0
0
0
0
0
0
0
0
0
0
0
0
(3, 4)  
tDF  
50  
55  
55  
55  
tOH  
Output Hold from OE, CE or  
Address, whichever occurred first  
(5)  
tCEPH  
CE Pulse High Time  
50  
50  
50  
50  
ns  
AC Read Waveforms(1)(2)(3)(4)  
Notes: 1. CE may be delayed up to tACC - tCE after the address transition without impact on tACC  
2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE or by tACC  
OE after an address change without impact in tACC  
.
-
t
.
3. tDF is specified from OE or CE wichever occurs first (CL = 5 pF).  
4. This parameter is characterized and is not 100% tested.  
5. If CE is de-asserted, it must remain de-asserted for at least 50ns during read operations other-  
wise incorrect data may be read.  
5
Atmel-0010I-PEEPR-AT28C010-Datasheet_062015  
Input Test Waveforms and  
Measurement Level  
Output Test Load  
Pin Capacitance  
f = 1 MHz, T = 25°C(1)  
Symbol  
CIN  
Typ  
Max  
10  
Units  
pF  
Conditions  
VIN = 0V  
4
COUT  
8
12  
pF  
VOUT = 0V  
Note:  
1. This parameter is 100% characterized and is not 100% tested.  
AC Write Characteristics  
Symbol  
Parameter  
Min  
Max  
Units  
tWC  
Write Cycle Time  
Address Set-up Time  
Address Hold Time  
Data Set-up Time  
Data Hold Time  
10  
ms  
ns  
ns  
ns  
ns  
ns  
s  
ns  
tAS  
0
50  
50  
0
tAH  
tDS  
tDH  
tWP  
Write Pulse Width  
Byte Load Cycle Time  
Write Pulse Width High  
100  
tBLC  
tWPH  
150  
50  
6
AT28C010 Military  
Atmel-0010I-PEEPR-AT28C010-Datasheet_062015  
AT28C010 Military  
AC Write Waveforms  
WE Controlled  
CE Controlled  
Page Mode Characteristics  
Symbol  
tAS, tOES  
tAH  
Parameter  
Min  
0
Max  
Units  
ns  
Address, OE Set-up Time  
Address Hold Time  
50  
0
ns  
tCS  
Chip Select Set-up Time  
Chip Select Hold Time  
Write Pulse Width (WE or CE)  
Data Set-up Time  
ns  
tCH  
0
ns  
tWP  
100  
50  
0
ns  
tDS  
ns  
tDH, tOEH  
Data, OE Hold Time  
ns  
7
Atmel-0010I-PEEPR-AT28C010-Datasheet_062015  
Page Mode Write Waveforms (1)(2)  
Notes: 1. A7 through A16 must specify the page address during each high to low transition of WE (or  
CE).  
2. OE must be high only when WE and CE are both low.  
8
AT28C010 Military  
Atmel-0010I-PEEPR-AT28C010-Datasheet_062015  
AT28C010 Military  
Chip Erase Waveforms  
tS = 5 msec (min.)  
tW = tH = 10 msec (min.)  
VH = 12.0V 0.5V  
Software Data  
Protection Enable Algorithm(1)  
LOAD DATA AA  
TO  
ADDRESS 5555  
LOAD DATA 55  
TO  
ADDRESS 2AAA  
LOAD DATA A0  
TO  
ADDRESS 5555  
WRITES ENABLED(2)  
LOAD DATA XX  
TO  
ANY ADDRESS(4)  
LOAD LAST BYTE  
TO  
LAST ADDRESS  
ENTER DATA  
PROTECT STATE  
Notes: 1. Data Format: I/O7 - I/O0 (Hex);  
Address Format: A14 - A0 (Hex).  
2. Write Protect state will be activated at end of write even if no other data is loaded.  
3. Write Protect state will be deactivated at end of write period even if no other data if loaded.  
4. 1 to 128 bytes of data are loaded.  
9
Atmel-0010I-PEEPR-AT28C010-Datasheet_062015  
Software Data  
Protection Disable Algorithm(1)  
LOAD DATA AA  
TO  
ADDRESS 5555  
LOAD DATA 55  
TO  
ADDRESS 2AAA  
LOAD DATA 80  
TO  
ADDRESS 5555  
LOAD DATA AA  
TO  
ADDRESS 5555  
LOAD DATA 55  
TO  
ADDRESS 2AAA  
LOAD DATA 20  
TO  
ADDRESS 5555  
EXIT DATA  
PROTECT STATE(3)  
LOAD DATA XX  
TO  
ANY ADDRESS(4)  
LOAD LAST BYTE  
TO  
LAST ADDRESS  
Software Protected Program Cycle Waveform(1)(2)(3)  
Notes: 1. A0 - A14 must conform to the addressing sequence for the first 3 bytes as shown above.  
2. After the command sequence has been issued and a page write operation follows, the page  
address inputs (A7 - A16) must be the same for each high to low transition of WE (or CE).  
3. OE must be high only when WE and CE are both low.  
10  
AT28C010 Military  
Atmel-0010I-PEEPR-AT28C010-Datasheet_062015  
AT28C010 Military  
Data Polling Characterstics(1)  
Symbol  
Parameter  
Min  
10  
Typ  
Max  
Units  
ns  
tDH  
Data Hold Time  
tOEH  
tOE  
OE Hold Time  
10  
ns  
OE to Output Delay (2)  
Write Recovery Time  
ns  
tWR  
0
ns  
Notes: 1. These parameters are characterized and not 100% tested.  
2. See AC Read Characteristics.  
Data Polling Waveforms  
Toggle Bit Characteristics(1)  
Symbol  
Parameter  
Min  
10  
Typ  
Max  
Units  
ns  
tDH  
Data Hold Time  
tOEH  
tOE  
tOEHP  
tWR  
OE Hold Time  
10  
ns  
OE to Output Delay (2)  
OE High Pulse  
ns  
150  
0
ns  
Write Recovery Time  
ns  
Notes: 1. These parameters are characterized and not 100% tested.  
2. See AC Read Characteristics.  
Toggle Bit Waveforms(1)(2)(3)  
Notes: 1. Toggling either OE or CE or both OE and CE will operate toggle bit.  
2. Beginning and ending state of I/O6 will vary.  
3. Any addres location may be used but the address should not vary.  
11  
Atmel-0010I-PEEPR-AT28C010-Datasheet_062015  
AT28C010 Ordering Information(1)  
I
CC (mA)  
tACC  
(ns)  
Active  
Standby  
Ordering Code  
Package  
Operation Range  
120  
150  
200  
250  
80  
0.3  
AT28C010(E)-12DM/883  
AT28C010(E)-12EM/883  
AT28C010(E)-12FM/883  
AT28C010(E)-12LM/883  
AT28C010(E)-12UM/883  
32D6  
32L1  
32F  
Military/883C  
Class B, Fully Compliant  
(-55C to 125C)  
44L  
30U  
80  
80  
80  
0.3  
0.3  
0.3  
AT28C010(E)-15DM/883  
AT28C010(E)-15EM/883  
AT28C010-15FM/883  
32D6  
32L1  
32F  
Military/883C  
Class B, Fully Compliant  
(-55C to 125C)  
AT28C010(E)-15LM/883  
AT28C010(E)-15UM/883  
44L  
30U  
AT28C010-20DM/883  
AT28C010-20EM/883  
AT28C010-20FM/883  
AT28C010-20LM/883  
AT28C010-20UM/883  
32D6  
32L1  
32F  
Military/883C  
Class B, Fully Compliant  
(-55C to 125C)  
44L  
30U  
AT28C010-25DM/883  
AT28C010-25EM/883  
AT28C010-25FM/883  
AT28C010-25LM/883  
AT28C010-25UM/883  
32D6  
32L1  
32F  
Military/883C  
Class B, Fully Compliant  
(-55C to 125C)  
44L  
30U  
AT28C010-W  
Die Sales  
Military  
(-55C to 125C)  
80  
0.3  
AT28C010-DWFM  
Wafer Sales  
Note:  
1. See Valid Part Number table below.  
Package Type  
32D6  
32-Lead, 0.600" Wide, Non-Windowed, Ceramic Dual Inline (Cerdip)  
32-Lead, Non-Windowed, Ceramic Bottom-Brazed Flat Package (Flatpack)  
32-Pad, Non-windowed, Combo Lid, Leadless Chip Carrier (LCC)  
44-Pad, Non-Windowed, Ceramic Leadless Chip Carrier (LCC)  
30-Pin, Ceramic Pin Grid Array (PGA)  
32F  
32L1  
44L  
30U  
W
Die  
DWFM  
Wafer  
Options  
Blank  
E
Standard Device: Endurance = 10K Write Cycles; Write Time = 10 ms  
High Endurance Option: Endurance = 100K Write Cycles  
12  
AT28C010 Military  
Atmel-0010I-PEEPR-AT28C010-Datasheet_062015  
AT28C010 Military  
5962-38267 Ordering Information(1)  
I
CC (mA)  
tACC  
(ns)  
Active  
Standby  
Ordering Code  
Package  
Operation Range  
120  
150  
200  
250  
80  
0.3  
5962-38267 07 MXX  
5962-38267 07 MUX  
5962-38267 07 MZX  
5962-38267 07 MYX  
5962-38267 07 MTX  
32D6  
32L1  
32F  
Military/883C  
Class B, Fully Compliant  
(-55C to 125C)  
44L  
30U  
80  
80  
80  
0.3  
0.3  
5962-38267 05 MXX  
5962-38267 05 MUX  
5962-38267 05 MZX  
5962-38267 05 MYX  
5962-38267 05 MTX  
32D6  
32L1  
32F  
Military/883C  
Class B, Fully Compliant  
(-55C to 125C)  
44L  
30U  
5962-38267 03 MXX  
5962-38267 03 MUX  
5962-38267 03 MZX  
5962-38267 03 MYX  
5962-38267 03 MTX  
32D6  
32L1  
32F  
Military/883C  
Class B, Fully Compliant  
(-55C to 125C)  
44L  
30U  
0.3  
5962-38267 01 MXX  
5962-38267 01 MUX  
5962-38267 01 MZX  
5962-38267 01 MYX  
5962-38267 01 MTX  
32D6  
32L1  
32F  
Military/883C  
Class B, Fully Compliant  
(-55C to 125C)  
44L  
30U  
Note:  
1. See Valid Part Number table below.  
Package Type  
32D6  
32-Lead, 0.600" Wide, Non-Windowed, Ceramic Dual Inline (Cerdip)  
32-Lead, Non-Windowed, Ceramic Bottom-Brazed Flat Package (Flatpack)  
32-Pad, Non-windowed, Combo Lid, Leadless Chip Carrier (LCC)  
44-Pad, Non-Windowed, Ceramic Leadless Chip Carrier (LCC)  
30-Pin, Ceramic Pin Grid Array (PGA)  
32F  
32L1  
44L  
30U  
W
Die  
DWFM  
Wafer  
Options  
Blank  
E
Standard Device: Endurance = 10K Write Cycles; Write Time = 10 ms  
High Endurance Option: Endurance = 100K Write Cycles  
13  
Atmel-0010I-PEEPR-AT28C010-Datasheet_062015  
Valid Part Numbers  
The following table lists standard Atmel products that can be ordered.  
Device Numbers  
AT28C010  
Speed  
12  
Package and Temperature Combinations  
DM/883, EM/883, FM/883, LM/883, UM/883  
DM/883, EM/883, LM/883, UM/883  
DM/883, EM/883, FM/883, LM/883, UM/883  
DM/883, EM/883, LM/883, UM/883  
DM/883, EM/883, FM/883, LM/883, UM/883  
DM/883, EM/883, FM/883, LM/883, UM/883  
W, DWFN  
AT28C010E  
AT28C010  
12  
15  
AT28C010E  
AT28C010  
15  
20  
AT28C010  
25  
AT28C010  
Die Products  
Reference Section: Parallel EEPROM Die Products  
14  
AT28C010 Military  
Atmel-0010I-PEEPR-AT28C010-Datasheet_062015  
AT28C010 Military  
Packaging Information  
32F, 32-Lead, Non-Windowed, Ceramic Bottom  
32D6, 32-Lead, 0.600" Wide, Non-Windowed,  
Ceramic Dual inline Package (Cerdip)  
Dimensions in Millimeters and (Inches)  
MIL-STD-1835 D-16 CONFIG A  
Brazed Flat Package (Flatpack)  
Dimensions in Millimeters and (Inches)  
MIL-STD-1835 F-18 CONFIG B  
42.70(1.68)  
41.70(1.64)  
PIN #1 ID  
9.40(0.370)  
6.86(0.270)  
PIN  
1
0.51(0.020)  
0.38(0.015)  
15.50(0.610)  
13.00(0.510)  
21.08(0.830)  
20.60(0.811)  
1.27(0.050) BSC  
2.49(0.098)MAX  
0.127(0.005)MIN  
38.10(1.500) REF  
5.72(0.225)  
MAX  
1.14(0.045) MAX  
12.40(0.488)  
11.99(0.472)  
SEATING  
PLANE  
3.05(0.120)  
2.49(0.098)  
1.52(0.060)  
0.38(0.015)  
0.58(0.023)  
0.36(0.014)  
0.18(0.007)  
0.10(0.004)  
5.08(0.200)  
3.18(0.125)  
1.65(0.065)  
1.14(0.045)  
10.36(0.408)  
9.02(0.355)  
2.54(0.100)BSC  
1.14(0.045)  
0.66(0.026)  
15.70(0.620)  
15.00(0.590)  
1.83(0.072)  
0.76(0.030)  
0º~ 15º REF  
0.381(0.015)  
0.203(0.008)  
17.80(0.700) MAX  
MIL-STD-1835 C-12  
JEDEC OUTLINE MO-115  
44L, 44-Pad, Non-Windowed, Ceramic  
Leadless Chip Carrier (LCC)  
32L1, 32-Pad, Non-windowed, Combo Lid, Leadless  
Chip Carrier (LCC)  
Dimensions in Millimeters* and (Inches)  
Dimensions in Millimeters* and (Inches)  
16.81(0.662)  
16.26(0.640)  
11.63(0.458)  
11.23(0.442)  
2.74(0.108)  
2.16(0.085)  
2.29(0.090)  
1.91(0.075)  
16.81(0.662)  
16.26(0.640)  
14.22(0.560)  
13.72(0.540)  
2.03(0.080)  
1.40(0.055)  
1.91(0.075)  
1.40(0.055)  
PIN 1  
PIN 1  
1.40(0.055)  
1.14(0.045)  
1.40(0.055)  
1.14(0.045)  
INDEX CORNER  
INDEX CORNER  
2.41(0.095)  
1.91(0.075)  
2.41(0.095)  
1.91(0.075)  
0.635(0.025)  
X 45°  
0.635(0.025)  
X 45°  
0.381(0.015)  
0.381(0.015)  
0.305(0.012)  
0.178(0.007)  
0.305(0.012)  
0.178(0.007)  
RADIUS  
RADIUS  
10.16(0.400) BSC  
12.70(0.500) BSC  
0.737(0.029)  
0.533(0.021)  
0.737(0.029)  
0.533(0.021)  
1.27(0.050) TYP  
1.02(0.040) X 45°  
1.27(0.050) TYP  
1.02(0.040) X 45°  
2.16(0.085)  
1.65(0.065)  
2.16(0.085)  
1.65(0.065)  
7.62(0.300) BSC  
12.70(0.500) BSC  
*Controlling dimension: millimeters  
*Controlling dimension: millimeters  
15  
Atmel-0010I-PEEPR-AT28C010-Datasheet_062015  
Packaging Information  
30U, 30-Pin, Ceramic Pin Grid Array (PGA)  
Dimensions in Millimeters and (Inches)  
7.26(0.286)  
6.50(0.256)  
13.74(0.541)  
13.36(0.526)  
2.57(0.101)  
2.06(0.081)  
1.40(0.055)  
1.14(0.045)  
0.58(0.023)  
0.43(0.017)  
16.18(0.637)  
15.82(0.623)  
3.12(0.123)  
2.62(0.103)  
1.83(0.072)  
1.57(0.062)  
14.17(0.558)  
13.77(0.542)  
2.54(0.100) TYP  
16.71(0.658)  
16.31(0.642)  
12.70(0.500) TYP  
2.54(0.100) TYP  
10.41(0.410)  
9.91(0.390)  
16  
AT28C010 Military  
Atmel-0010I-PEEPR-AT28C010-Datasheet_062015  
X
X X X X  
X
Atmel Corporation  
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© 2015 Atmel Corporation. / Rev.: Atmel-0010I-PEEPR-AT28C010-Military-Datasheet_062015.  
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