27C256-25I/P [MICROCHIP]

256K (32K x 8) Low-Voltage CMOS EPROM; 256K ( 32K ×8 )低电压CMOS EPROM
27C256-25I/P
型号: 27C256-25I/P
厂家: MICROCHIP    MICROCHIP
描述:

256K (32K x 8) Low-Voltage CMOS EPROM
256K ( 32K ×8 )低电压CMOS EPROM

存储 内存集成电路 光电二极管 可编程只读存储器 OTP只读存储器 电动程控只读存储器
文件: 总10页 (文件大小:132K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Obsolete Device  
27LV256  
256K (32K x 8) Low-Voltage CMOS EPROM  
FEATURES  
PACKAGE TYPES  
PDIP  
• Wide voltage range 3.0V to 5.5V  
• High speed performance  
VPP • 1  
28 VCC  
27 A14  
26 A13  
25 A8  
24 A9  
23 A11  
22 OE  
21 A10  
20 CE  
19 O7  
18 O6  
17 O5  
16 O4  
15 O3  
A12  
A7  
A6  
A5  
A4  
A3  
A2  
A1  
A0  
O0  
O1  
O2  
2
3
4
- 200 ns access time available at 3.0V  
• CMOS Technology for low power consumption  
- 8 mA Active current at 3.0V  
5
6
7
8
- 20 mA Active current at 5.5V  
9
10  
11  
12  
13  
- 100 µA Standby current  
• Factory programming available  
• Auto-insertion-compatible plastic packages  
• Auto ID aids automated programming  
• Separate chip enable and output enable controls  
• High speed “Express” programming algorithm  
• Organized 32K x 8: JEDEC standard pinouts  
- 28-pin Dual-in-line package  
VSS 14  
PLCC  
5
29  
A6  
A8  
6
28  
A5  
A4  
A3  
A2  
A1  
A0  
NC  
O0  
A9  
7
27  
A11  
- 32-pin PLCC package  
8
26  
25  
24  
23  
22  
21  
NC  
OE  
A10  
CE  
O7  
O6  
9
- 28-pin SOIC package  
10  
11  
12  
13  
- Tape and reel  
• Data Retention > 200 years  
• Available for the following temperature ranges:  
- Commercial:  
- Industrial:  
0°C to +70°C  
-40°C to +85°C  
SOIC  
VPP  
A12  
A7  
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
VCC  
A14  
A13  
A8  
DESCRIPTION  
2
3
A6  
4
The Microchip Technology Inc. 27LV256 is a low volt-  
age (3.0 volt) CMOS EPROM designed for battery  
powered applications. The device is organized as a  
32K x 8 (32K-Byte) non-volatile memory product. The  
27LV256 consumes only 8 mA maximum of active cur-  
rent during a 3.0 volt read operation therefore improv-  
ing battery performance. This device is designed for  
very low voltage applications where conventional 5.0  
volt only EPROMS can not be used. Accessing individ-  
ual bytes from an address transition or from power-up  
(chip enable pin going low) is accomplished in less than  
200 ns at 3.0V. This device allows systems designers  
the ability to use low voltage non-volatile memory with  
today’s' low voltage microprocessors and peripherals in  
battery powered applications.  
A5  
5
A9  
A4  
6
A11  
OE  
A10  
CE  
O7  
A3  
7
A2  
8
A1  
9
A0  
10  
11  
12  
13  
14  
O0  
O1  
O2  
VSS  
O6  
O5  
O4  
O3  
A complete family of packages is offered to provide the  
most flexibility in applications. For surface mount appli-  
cations, PLCC or SOIC packaging is available. Tape  
and reel packaging is also available for PLCC or SOIC  
packages.  
2004 Microchip Technology Inc.  
DS11020H-page 1  
27LV256  
TABLE 1-1:  
Name  
PIN FUNCTION TABLE  
Function  
1.0  
ELECTRICAL  
CHARACTERISTICS  
1.1  
Maximum Ratings*  
A0-A14  
CE  
Address Inputs  
Chip Enable  
VCC and input voltages w.r.t. VSS........-0.6V to +7.25V  
VPP voltage w.r.t. VSS during  
programming......................................... -0.6V to +14V  
OE  
Output Enable  
Programming Voltage  
Data Output  
VPP  
Voltage on A9 w.r.t. VSS ......................-0.6V to +13.5V  
Output voltage w.r.t. VSS ................-0.6V to VCC +1.0V  
Storage temperature ..........................-65°C to +150°C  
Ambient temp. with power applied .....-65°C to +125°C  
O0 - O7  
VCC  
+5V or +3V Power Supply  
Ground  
VSS  
*Notice: Stresses above those listed under “Maximum Ratings”  
may cause permanent damage to the device. This is a stress rat-  
ing only and functional operation of the device at those or any  
other conditions above those indicated in the operation listings of  
this specification is not implied. Exposure to maximum rating con-  
ditions for extended periods may affect device reliability.  
NC  
No Connection; No Internal  
Connection  
NU  
Not Used; No External Connection Is  
Allowed  
TABLE 1-2:  
READ OPERATION DC CHARACTERISTICS  
VCC = +5V ±10% or 3.0V where indicated  
Commercial:  
Industrial:  
Tamb = 0°C to +70°C  
Tamb = -40°C to +85°C  
Parameter  
Part*  
Status  
Symbol Min.  
Max.  
Units Conditions  
Input Voltages  
all  
Logic "1"  
Logic "0"  
VIH  
VIL  
2.0  
-0.5  
VCC+1  
0.8  
V
V
Input Leakage  
all  
all  
ILI  
-10  
2.4  
10  
µA VIN = 0 to VCC  
Output Voltages  
Logic "1"  
Logic "0"  
VOH  
VOL  
V
V
IOH = -400 µA  
IOL = 2.1 mA  
0.45  
10  
6
Output Leakage  
all  
all  
ILO  
-10  
µA VOUT = 0V to VCC  
Input Capacitance  
CIN  
pF VIN = 0V; Tamb = 25°C;  
f = 1 MHz  
Output Capacitance  
all  
COUT  
12  
pF VOUT = 0V; Tamb = 25°C;  
f = 1 MHz  
Power Supply Current,  
Active  
C
I
TTL input  
TTL input  
ICC1  
ICC2  
20 @ 5.0V  
8 @ 3.0V  
25 @ 5.0V  
10 @ 3.0V  
mA VCC = 5.5V; VPP = VCC  
mA f = 1 MHz;  
mA OE = CE = VIL;  
mA IOUT = 0 mA;  
VIL = -0.1 to 0.8V;  
VIH = 2.0 to VCC;  
Note 1  
Power Supply Current,  
Standby  
C
I
TTL input  
TTL input  
ICC(S)  
1 @ 3.0V  
2 @ 3.0V  
mA  
mA  
all  
CMOS input  
100 @ 3.0V µA CE=VCC ± 0.2V  
* Parts: C=Commercial Temperature Range  
I =Industrial Temperature Ranges  
Note 1: Typical active current increases .75 mA per MHz up to operating frequency for all temperature ranges.  
DS11020H-page 2  
2004 Microchip Technology Inc.  
27LV256  
TABLE 1-3:  
READ OPERATION AC CHARACTERISTICS  
AC Testing Waveform:  
Output Load:  
VIH = 2.4V and VIL = 0.45V; VOH = 2.0V VOL = 0.8V  
1 TTL Load + 100 pF  
Input Rise and Fall Times: 10 ns  
Ambient Temperature:  
Commercial:  
Industrial:  
Tamb = 0°C to +70°C  
Tamb = -40°C to +85°C  
27HC256-20  
27HC256-25  
27HC256-30  
Parameter  
Sym  
Units  
Conditions  
Min  
Max  
Min  
Max  
Min  
Max  
Address to Output Delay  
CE to Output Delay  
OE to Output Delay  
tACC  
tCE  
0
200  
200  
100  
50  
0
250  
250  
125  
50  
0
300  
300  
125  
50  
ns  
ns  
ns  
ns  
CE = OE = VIL  
OE = VIL  
tOE  
CE = VIL  
CE or OE to O/P High  
Impedance  
tOFF  
Output Hold from  
Address CE or OE,  
whichever goes first  
tOH  
0
0
0
ns  
FIGURE 1-1: READ WAVEFORMS  
VIH  
Address  
Address valid  
VIL  
VIH  
CE  
VIL  
tCE(2)  
VIH  
OE  
VIL  
tOFF(1,3)  
tOH  
tOE(2)  
VOH  
Outputs  
O0 - O7  
High Z  
High Z  
Valid Output  
VOL  
tACC  
Notes: (1) tOFF is specified for OE or CE, whichever occurs first  
(2) OE may be delayed up to t CE - t OE after the falling edge of CE without impact on t  
(3) This parameter is sampled and is not 100% tested.  
CE  
2004 Microchip Technology Inc.  
DS11020H-page 3  
27LV256  
TABLE 1-4:  
PROGRAMMING DC CHARACTERISTICS  
Ambient Temperature: Tamb = 25°C ± 5°C  
VCC = 6.5V ± 0.25V, VPP = 13.0V ± 0.25V  
Parameter  
Status  
Symbol  
Min  
Max.  
Units  
Conditions  
Input Voltages  
Logic”1”  
Logic”0”  
VIH  
VIL  
2.0  
-0.1  
VCC+1  
0.8  
V
V
Input Leakage  
ILI  
-10  
2.4  
10  
µA  
VIN = 0V to VCC  
Output Voltages  
Logic”1”  
Logic”0”  
VOH  
VOL  
V
V
IOH = -400 µA  
IOL = 2.1 mA  
0.45  
20  
VCC Current, program & verify  
VPP Current, program  
ICC2  
IPP2  
VH  
mA  
mA  
V
Note 1  
Note 1  
25  
A9 Product Identification  
11.5  
12.5  
Note 1: VCC must be applied simultaneously or before VPP and removed simultaneously or after VPP.  
TABLE 1-5:  
PROGRAMMING AC CHARACTERISTICS  
for Program, Program Verify  
and Program Inhibit Modes  
AC Testing Waveform: VIH=2.4V and VIL=0.45V; VOH=2.0V; VOL=0.8V  
Output Load: 1 TLL Load + 100pF  
Ambient Temperature: Tamb=25°C±5°C  
VCC= 6.5V ± 0.25V, VPP =13.0V ± 0.25V  
Parameter  
Symbol  
Min. Max. Units  
Remarks  
Address Set-Up Time  
Data Set-Up Time  
Data Hold Time  
tAS  
tDS  
2
2
µs  
µs  
µs  
µs  
ns  
µs  
µs  
µs  
µs  
µs  
ns  
tDH  
2
Address Hold Time  
Float Delay (2)  
tAH  
0
tDF  
0
130  
VCC Set-Up Time  
Program Pulse Width (1)  
CE Set-Up Time  
tVCS  
tPW  
tCES  
tOES  
tVPS  
tOE  
2
95  
2
105  
100 µs typical  
OE Set-Up Time  
2
VPP Set-Up Time  
Data Valid from OE  
2
100  
Note 1: For express algorithm, initial programming width tolerance is 100 µs ±5%.  
2: This parameter is only sampled and not 100% tested. Output float is defined as the point where data is no  
longer driven (see timing diagram).  
DS11020H-page 4  
2004 Microchip Technology Inc.  
27LV256  
FIGURE 1-2: PROGRAMMING WAVEFORMS  
Program  
Verify  
VIH  
Address  
Data  
Address Stable  
VIL  
VIH  
VIL  
tAS  
tDS  
tAH  
High Z  
Data Stable  
Data Out Valid  
tDF  
(1)  
tDH  
13.0V(2)  
5.0V  
6.5V(2)  
5.0V  
VIH  
VPP  
VCC  
CE  
tVPS  
tVCS  
VIL  
tOES  
tPW  
tOE  
(1)  
VIH  
OE  
tOPW  
VIL  
Notes:  
(1) tDF and t OE are characteristics of the device but must be accommodated by the programmer  
(2) VCC = 6.5V ±0.25V, V PP = VH = 13.0V ±0.25V for express algorithm  
TABLE 1-6:  
MODES  
Operation Mode  
CE  
OE  
VPP  
A9  
O0 - O7  
Read  
VIL  
VIL  
VIH  
VIH  
VIH  
VIL  
VIL  
VIL  
VIH  
VIL  
VIH  
X
VCC  
VH  
X
X
DOUT  
DIN  
Program  
Program Verify  
Program Inhibit  
Standby  
VH  
X
DOUT  
VH  
X
High Z  
VCC  
VCC  
VCC  
X
High Z  
Output Disable  
Identity  
VIH  
VIL  
X
High Z  
VH  
Identity Code  
X = Don’t Care  
1.2  
Read Mode  
For Read operations, if the addresses are stable, the  
address access time (tACC) is equal to the delay from  
CE to output (tCE). Data is transferred to the output  
after a delay from the falling edge of OE (tOE).  
(See Timing Diagrams and AC Characteristics)  
Read Mode is accessed when:  
a) the CE pin is low to power up (enable) the chip  
b) the OE pin is low to gate the data to the output  
pins  
2004 Microchip Technology Inc.  
DS11020H-page 5  
27LV256  
1.3  
Standby Mode  
1.6  
Verify  
The standby mode is defined when the CE pin is high  
(VIH) and a program mode is not defined. Output Dis-  
able  
After the array has been programmed it must be veri-  
fied to ensure that all the bits have been correctly pro-  
grammed. This mode is entered when all of the  
following conditions are met:  
1.4  
Output Enable  
a) VCC is at the proper level  
b) VPP is at the proper VH level  
c) the CE pin is high  
This feature eliminates bus contention in multiple bus  
microprocessor systems and the outputs go to a high  
impedance when the following condition is true:  
d) the OE line is low  
The OE pin is high and program mode is not  
defined.  
1.7  
Inhibit  
When Programming multiple devices in parallel with  
different data, only CE needs to be under separate con-  
trol to each device. By pulsing the CE line low on a par-  
ticular device, that device will be programmed, and all  
other devices with CE held high will not be pro-  
grammed with the data although address and data are  
available on their input pins.  
1.5  
Programming Mode  
The Express algorithm has been developed to improve  
on the programming throughput times in a production  
environment. Up to 10 100-microsecond pulses are  
applied until the byte is verified. No over-programming  
is required. A flowchart of the express algorithm is  
shown in Figure 1.  
1.8  
Identity Mode  
Programming takes place when:  
In this mode specific data is outputted which identifies  
the manufacturer as Microchip Technology Inc. and  
device type. This mode is entered when Pin A9 is  
taken to VH (11.5V to 12.5V). The CE and OE lines  
must be at VIL. A0 is used to access any of the two  
non-erasable bytes whose data appears on O0 through  
O7.  
a) VCC is brought to the proper voltage  
b) VPP is brought to the proper VH level  
c) the OE pin is high  
d) the CE pin is low  
Since the erased state is “1” in the array, programming  
of “0” is required. The address to be programmed is set  
via pins A0-A14 and the data to be programmed is pre-  
sented to pins O0-O7. When data and address are sta-  
ble, a low-going pulse on the CE line programs that  
location.  
Pin  
Identity  
Input  
Output  
A0 0 O O O O O O O  
H
e
x
7
6
5
4
3
2
1
0
Manufacturer  
Device Type*  
VIL  
VIH  
0
1
0
0
1
0
0
0
1
1
0
1
0
0
1
0
29  
8C  
* Code subject to change.  
DS11020H-page 6  
2004 Microchip Technology Inc.  
27LV256  
FIGURE 1-3: PROGRAMMING EXPRESS ALGORITHM  
Conditions:  
T
V
V
amb = 25+/-5C  
CC = 6.5+/-0.25V  
PP = 13.0+/-0.25V  
Start  
ADDR = First Location  
V
CC = 6.5V  
V
PP = 13.0V  
X = 0  
Program one 100  
µ
s pulse  
Pass  
Increment X  
Verify  
Byte  
Fail  
No  
Yes  
Device  
Failed  
X = 10?  
Last  
Address?  
Yes  
No  
Increment Address  
CC = VPP = 4.5V, 5.5V  
All  
V
Yes  
bytes  
= original  
data?  
No  
Device  
Passed  
Device  
Failed  
2004 Microchip Technology Inc.  
DS11020H-page 7  
27LV256  
27LV256 Product Identification System  
To order or to obtain information, e.g., on pricing or delivery, please use the listed part numbers, and refer to the factory or the listed  
sales offices.  
27LV256  
25  
I
/P  
L = Plastic Leaded Chip Carrier  
P = Plastic DIP (600 Mil)  
Package:  
SO = Plastic SOIC (300 Mil)  
Temperature  
Range:  
Blank = 0°C to +70°C  
I = -40°C to +85°C  
20 = 200 ns  
25 = 250 ns  
30 = 300 ns (SOIC only)  
Access  
Time:  
Device:  
27LV256  
256K (32K x 8) Low-Voltage CMOS EPROM  
DS11020H-page 8  
2004 Microchip Technology Inc.  
Note the following details of the code protection feature on Microchip devices:  
Microchip products meet the specification contained in their particular Microchip Data Sheet.  
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the  
intended manner and under normal conditions.  
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our  
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data  
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.  
Microchip is willing to work with the customer who is concerned about the integrity of their code.  
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not  
mean that we are guaranteeing the product as “unbreakable.”  
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our  
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts  
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.  
Information contained in this publication regarding device  
applications and the like is intended through suggestion only  
and may be superseded by updates. It is your responsibility to  
ensure that your application meets with your specifications.  
No representation or warranty is given and no liability is  
assumed by Microchip Technology Incorporated with respect  
to the accuracy or use of such information, or infringement of  
patents or other intellectual property rights arising from such  
use or otherwise. Use of Microchip’s products as critical  
components in life support systems is not authorized except  
with express written approval by Microchip. No licenses are  
conveyed, implicitly or otherwise, under any intellectual  
property rights.  
Trademarks  
The Microchip name and logo, the Microchip logo, Accuron,  
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,  
PRO MATE, PowerSmart, rfPIC, and SmartShunt are  
registered trademarks of Microchip Technology Incorporated  
in the U.S.A. and other countries.  
AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL,  
SmartSensor and The Embedded Control Solutions Company  
are registered trademarks of Microchip Technology  
Incorporated in the U.S.A.  
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,  
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,  
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial  
Programming, ICSP, ICEPIC, Migratable Memory, MPASM,  
MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net,  
PICLAB, PICtail, PowerCal, PowerInfo, PowerMate,  
PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial,  
SmartTel and Total Endurance are trademarks of Microchip  
Technology Incorporated in the U.S.A. and other countries.  
SQTP is a service mark of Microchip Technology Incorporated  
in the U.S.A.  
All other trademarks mentioned herein are property of their  
respective companies.  
© 2004, Microchip Technology Incorporated, Printed in the  
U.S.A., All Rights Reserved.  
Printed on recycled paper.  
Microchip received ISO/TS-16949:2002 quality system certification for  
its worldwide headquarters, design and wafer fabrication facilities in  
Chandler and Tempe, Arizona and Mountain View, California in  
October 2003. The Company’s quality system processes and  
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping  
devices, Serial EEPROMs, microperipherals, nonvolatile memory and  
analog products. In addition, Microchip’s quality system for the design  
and manufacture of development systems is ISO 9001:2000 certified.  
2004 Microchip Technology Inc.  
DS11020H-page 9  
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A-4600 Wels  
Austria  
Tel: 43-7242-2244-399  
Fax: 43-7242-2244-393  
Denmark  
Regus Business Centre  
Lautrup hoj 1-3  
Ballerup DK-2750 Denmark  
Tel: 45-4420-9895 Fax: 45-4420-9910  
France  
Parc d’Activite du Moulin de Massy  
43 Rue du Saule Trapu  
Batiment A - ler Etage  
91300 Massy, France  
Tel: 33-1-69-53-63-20  
Fax: 33-1-69-30-90-79  
16200 Addison Road, Suite 255  
Addison Plaza  
China - Shanghai  
Room 701, Bldg. B  
Far East International Plaza  
No. 317 Xian Xia Road  
Shanghai, 200051  
Addison, TX 75001  
Tel: 972-818-7423  
Fax: 972-818-2924  
Detroit  
Tel: 86-21-6275-5700  
Fax: 86-21-6275-5060  
Tri-Atria Office Building  
32255 Northwestern Highway, Suite 190  
Farmington Hills, MI 48334  
Tel: 248-538-2250  
China - Shenzhen  
Rm. 1812, 18/F, Building A, United Plaza  
No. 5022 Binhe Road, Futian District  
Shenzhen 518033, China  
Tel: 86-755-82901380  
Fax: 86-755-8295-1393  
China - Shunde  
Fax: 248-538-2260  
Kokomo  
2767 S. Albright Road  
Kokomo, IN 46902  
Tel: 765-864-8360  
Fax: 765-864-8387  
Room 401, Hongjian Building, No. 2  
Fengxiangnan Road, Ronggui Town, Shunde  
District, Foshan City, Guangdong 528303, China  
Tel: 86-757-28395507 Fax: 86-757-28395571  
Los Angeles  
25950 Acero St., Suite 200  
Mission Viejo, CA 92691  
Tel: 949-462-9523  
Germany  
China - Qingdao  
Rm. B505A, Fullhope Plaza,  
No. 12 Hong Kong Central Rd.  
Qingdao 266071, China  
Tel: 86-532-5027355 Fax: 86-532-5027205  
Steinheilstrasse 10  
D-85737 Ismaning, Germany  
Tel: 49-89-627-144-0  
Fax: 49-89-627-144-44  
Fax: 949-462-9608  
San Jose  
1300 Terra Bella Avenue  
Mountain View, CA 94043  
Tel: 650-215-1444  
Italy  
India  
Via Salvatore Quasimodo, 12  
20025 Legnano (MI)  
Milan, Italy  
Divyasree Chambers  
1 Floor, Wing A (A3/A4)  
No. 11, O’Shaugnessey Road  
Bangalore, 560 025, India  
Tel: 91-80-22290061 Fax: 91-80-22290062  
Japan  
Fax: 650-961-0286  
Tel: 39-0331-742611  
Fax: 39-0331-466781  
Netherlands  
Waegenburghtplein 4  
NL-5152 JR, Drunen, Netherlands  
Tel: 31-416-690399  
Toronto  
6285 Northam Drive, Suite 108  
Mississauga, Ontario L4V 1X5, Canada  
Tel: 905-673-0699  
Yusen Shin Yokohama Building 10F  
3-17-2, Shin Yokohama, Kohoku-ku,  
Yokohama, Kanagawa, 222-0033, Japan  
Tel: 81-45-471- 6166 Fax: 81-45-471-6122  
Fax: 905-673-6509  
Fax: 31-416-690340  
ASIA/PACIFIC  
Australia  
Microchip Technology Australia Pty Ltd  
Unit 32 41 Rawson Street  
Epping 2121, NSW  
Sydney, Australia  
Tel: 61-2-9868-6733  
Fax: 61-2-9868-6755  
United Kingdom  
505 Eskdale Road  
Winnersh Triangle  
Korea  
168-1, Youngbo Bldg. 3 Floor  
Samsung-Dong, Kangnam-Ku  
Seoul, Korea 135-882  
Wokingham  
Berkshire, England RG41 5TU  
Tel: 44-118-921-5869  
Fax: 44-118-921-5820  
Tel: 82-2-554-7200 Fax: 82-2-558-5932 or  
82-2-558-5934  
07/12/04  
2004 Microchip Technology Inc.  

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