24LC08B-I/OTG_技术文档

24AA08/24LC08B

8K I²C^™Serial EEPROM

Description:

Device Selection Table

The Microchip Technology Inc. 24AA08/24LC08B

(24XX08*) is a 8 Kbit Electrically Erasable PROM. The

device is organized as four blocks of 256 x 8-bit

memory with a 2-wire serial interface. Low voltage

design permits operation down to 1.8V, with standby

and active currents of only 1 μA and 1 mA,

Part

Number

VCC

Range

Max Clock

Frequency

Temp

Ranges

24AA08

1.8-5.5

2.5-5.5

400 kHz⁽¹⁾

400 kHz

I

24LC08B

I, E

Note 1: 100 kHz for VCC <2.5V

respectively. The 24XX08 also has a page write

capability for up to 16 bytes of data. The 24XX08 is

available in the standard 8-pin PDIP, surface mount

SOIC, TSSOP, 2x3 DFN and MSOP packages, and is

also available in the 5-lead SOT-23 package.

Features:

• Single supply with operation down to 1.8V

• Low-power CMOS technology:

- 1 mA active current, typical

Block Diagram

- 1 μA standby current, typical (I-temp)

• Organized as 4 blocks of 256 bytes (4 x 256 x 8)

• 2-wire serial interface bus, I²C™ compatible

• Schmitt Trigger inputs for noise suppression

• Output slope control to eliminate ground bounce

• 100 kHz (<2.5V) and 400 kHz (≥2.5V) compatibility

• Self-timed write cycle (including auto-erase)

• Page write buffer for up to 16 bytes

• 2 ms typical write cycle time for page write

• Hardware write-protect for entire memory

• Can be operated as a serial ROM

HV

Generator

WP

I/O

Control

Logic

Memory

Control

Logic

EEPROM

Array

XDEC

Page

Latches

I/O

SCL

YDEC

SDA

• Factory programming (QTP) available

• ESD protection > 4,000V

Sense Amp.

R/W Control

VCC

VSS

• 1,000,000 erase/write cycles

Package Types

• Data retention > 200 years

SOIC, TSSOP

• 8-lead PDIP, SOIC, TSSOP, DFN and MSOP

packages

PDIP, MSOP

A0

1

8

VCC

1

8

7

6

5

A0

A1

A2

VCC

WP

• 5-lead SOT-23 package

2

3

4

A1

A2

2

3

4

7

6

5

WP

• Standard and Pb-free finishes available

• Available for extended temperature ranges:

- Industrial (I): -40°C to +85°C

SCL

SDA

VSS

SDA VSS

- Automotive (E): -40°C to +125°C

SOT-23-5

DFN

1

VCC

WP

A0

8

7

6

5

WP

Vcc

1

5

4

SCL

2

3

4

A1

SCL

SDA

2

3

A2

VSS

Vss

SDA

Note:

Pins A0, A1 and A2 are not used by the 24XX08. (No

internal connections).

*24XX08 is used in this document as a generic part

number for the 24AA08/24LC08B devices.

DS21710D-page 1

24AA08/24LC08B

Package TypeElectrical Characteristics

(†)

Absolute Maximum Ratings

VCC.............................................................................................................................................................................6.5V

All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V

Storage temperature ...............................................................................................................................-65°C to +150°C

Ambient temperature with power applied................................................................................................-65°C to +125°C

ESD protection on all pins ......................................................................................................................................................≥ 4 kV

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to

the device. This is a stress rating only and functional operation of the device at those or any other conditions

above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating

conditions for extended periods may affect device reliability.

TABLE 1-1:

DC CHARACTERISTICS

VCC = +1.8V to +5.5V

DC CHARACTERISTICS

Industrial (I):

TA = -40°C to +85°C

Automotive (E): TA = -40°C to +125°C

Param.

Symbol

No.

Characteristic

Min

Typ

Max

Units

Conditions

D1

D2

D3

D4

VIH

—

WP, SCL and SDA pins

High-level input voltage

Low-level input voltage

—

V

—

0.7 VCC

—

VIL

0.3 VCC

—

V

—

VHYS

Hysteresis of Schmitt

Trigger inputs

0.05 VCC

V

(Note)

D5

D6

D7

D8

VOL

ILI

Low-level output voltage

Input leakage current

Output leakage current

—

0.40

±1

V

IOL = 3.0 mA, VCC = 2.5V

VIN = .1V to VCC

μA

pF

ILO

±1

VOUT = .1V to VCC

CIN,

Pin capacitance

10

VCC = 5.0V (Note)

COUT

(all inputs/outputs)

TA = 25°C, FCLK = 1 MHz

D9

ICC write Operating current

—

0.1

3

1

mA

VCC = 5.5V, SCL = 400 kHz

—

D10

D11

ICC read

0.05

ICCS

Standby current

—

0.01

—

1

5

μA

Industrial

Automotive

SDA = SCL = VCC

WP = VSS

Note:

This parameter is periodically sampled and not 100% tested.

DS21710D-page 2

24AA08/24LC08B

TABLE 1-2:

AC CHARACTERISTICS

VCC = +1.8V to +5.5V

AC CHARACTERISTICS

Industrial (I):

TA = -40°C to +85°C

Automotive (E):

TA = -40°C to +125°C

Param.

Symbol

No.

Characteristic

Clock frequency

Min

Typ

Max

Units

Conditions

1

2

3

4

FCLK

THIGH

TLOW

TR

—

400

100

kHz 2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA08)

Clock high time

Clock low time

600

4000

—

ns

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA08)

1300

4700

—

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA08)

2.5V ≤ VCC ≤ 5.5V (Note 1)

1.8V ≤ VCC < 2.5V (24AA08)

(Note 1)

SDA and SCL rise time

(Note 1)

—

300

1000

5

TF

SDA and SCL fall time

—

300

ns

(Note 1)

6

THD:STA Start condition hold time

600

4000

—

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA08)

7

TSU:STA Start condition setup

time

600

4700

—

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA08)

(Note 2)

8

THD:DAT Data input hold time

0

—

9

TSU:DAT Data input setup time

100

250

—

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA08)

10

11

12

TSU:STO Stop condition setup

time

600

4000

—

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA08)

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA08)

TAA

Output valid from clock

(Note 2)

—

900

3500

TBUF

Bus free time: Time the

bus must be free before

a new transmission can

start

1300

4700

—

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA08)

13

14

TOF

TSP

Output fall time from VIH 20+0.1CB

—

250

ns

2.5V ≤ VCC ≤ 5.5V

minimum to VIL

maximum

—

1.8V ≤ VCC < 2.5V (24AA08)

Input filter spike

suppression

—

50

(Notes 1 and 3)

(SDA and SCL pins)

15

16

TWC

—

Write cycle time (byte or

page)

—

5

ms

—

Endurance

1M

—

cycles 25°C, (Note 4)

Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.

2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region

(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.

3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved

noise spike suppression. This eliminates the need for a TI specification for standard operation.

4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific

application, please consult the Total Endurance™ Model which can be obtained from Microchip’s web site:

www.microchip.com.

DS21710D-page 3

24AA08/24LC08B

FIGURE 1-1: BUS TIMING DATA

5

4

2

3

SCL

7

14

8

9

10

6

SDA

IN

12

11

SDA

OUT

FIGURE 1-2: BUS TIMING START/STOP

D4

SCL

6

7

10

SDA

Start

Stop

DS21710D-page 4

24AA08/24LC08B

3.4

Data Valid (D)

2.0

FUNCTIONAL DESCRIPTION

The state of the data line represents valid data when,

after a Start condition, the data line is stable for the

duration of the high period of the clock signal.

The 24XX08 supports a bidirectional, 2-wire bus and

data transmission protocol. A device that sends data

onto the bus is defined as a transmitter, while a device

receiving data is defined as a receiver. The bus has to

be controlled by a master device which generates the

Serial Clock (SCL), controls the bus access and

generates the Start and Stop conditions, while the

24XX08 works as slave. Both master and slave can

operate as transmitter or receiver, but the master

device determines which mode is activated.

The data on the line must be changed during the low

period of the clock signal. There is one clock pulse per

bit of data.

Each data transfer is initiated with a Start condition and

terminated with a Stop condition. The number of the

data bytes transferred between the Start and Stop

conditions is determined by the master device and is

theoretically unlimited, although only the last sixteen

will be stored when doing a write operation. When an

overwrite does occur it will replace data in a first-in first-

out (FIFO) fashion.

3.0

BUS CHARACTERISTICS

The following bus protocol has been defined:

• Data transfer may be initiated only when the bus

is not busy.

3.5

Acknowledge

• During data transfer, the data line must remain

stable whenever the clock line is high. Changes in

the data line while the clock line is high will be

interpreted as a Start or Stop condition.

Each receiving device, when addressed, is obliged to

generate an acknowledge after the reception of each

byte. The master device must generate an extra clock

pulse which is associated with this Acknowledge bit.

Accordingly, the following bus conditions have been

defined (Figure 2-1).

Note:

The 24XX08 does not generate any

Acknowledge bits if an internal program-

ming cycle is in progress.

3.1

Bus Not Busy (A)

The device that acknowledges, has to pull down the

SDA line during the acknowledge clock pulse in such a

way that the SDA line is stable low during the high

period of the acknowledge related clock pulse. Of

course, setup and hold times must be taken into

account. During reads, a master must signal an end of

data to the slave by not generating an Acknowledge bit

on the last byte that has been clocked out of the slave.

In this case, the slave (24XX08) will leave the data line

high to enable the master to generate the Stop

condition.

Both data and clock lines remain high.

3.2

Start Data Transfer (B)

A high-to-low transition of the SDA line while the clock

(SCL) is high determines a Start condition. All

commands must be preceded by a Start condition.

3.3

Stop Data Transfer (C)

A low-to-high transition of the SDA line while the clock

(SCL) is high determines a Stop condition. All

operations must be ended with a Stop condition.

FIGURE 3-1:

DATA TRANSFER SEQUENCE ON THE SERIAL BUS

(A)

(B)

(D)

(C) (A)

SCL

SDA

Start

Condition

Stop

Condition

Address or

Acknowledge

Valid

Data

Allowed

to Change

DS21710D-page 5

24AA08/24LC08B

FIGURE 3-2:

CONTROL BYTE

ALLOCATION

3.6

Device Addressing

A control byte is the first byte received following the

Start condition from the master device (Figure 2-2).

The control byte consists of a four-bit control code. For

the 24XX08, this is set as ‘1010’ binary for read and

write operations. The next three bits of the control byte

are the block-select bits (B2, B1, B0). B2 is a “don’t

care” for the 24XX08. They are used by the master

device to select which of the four 256 word-blocks of

memory are to be accessed. These bits are in effect the

three Most Significant bits of the word address.

Start

Read/Write

A

SLAVE ADDRESS

R/W

1

0

1

0

x

B1

B0

x = “don’t care”

The last bit of the control byte defines the operation to

be performed. When set to ‘1’ a read operation is

selected. When set to ‘0’ a write operation is selected.

Following the Start condition, the 24XX08 monitors the

SDA bus, checking the device type identifier being

transmitted and, upon receiving a ‘1010’ code, the

slave device outputs an Acknowledge signal on the

SDA line. Depending on the state of the R/W bit, the

24XX08 will select a read or write operation.

Control

Code

Operation

Block Select

R/W

Read

Write

Block Address

1010

1

0

DS21710D-page 6

24AA08/24LC08B

4.2

Page Write

4.0

4.1

WRITE OPERATION

Byte Write

The write control byte, word address and the first data

byte are transmitted to the 24XX08 in the same way as

in a byte write. However, instead of generating a Stop

condition, the master transmits up to 16 data bytes to

the 24XX08, which are temporarily stored in the on-

chip page buffer and will be written into memory once

the master has transmitted a Stop condition. Upon

receipt of each word, the four lower-order address

pointer bits are internally incremented by ‘1’. The

higher-order 7 bits of the word address remain

constant. If the master should transmit more than 16

words prior to generating the Stop condition, the

address counter will roll over and the previously

received data will be overwritten. As with the byte write

operation, once the Stop condition is received an

internal write cycle will begin (Figure 3-2).

Following the Start condition from the master, the

device code (4 bits), the block address (3 bits) and the

R/W bit, which is a logic-low, is placed onto the bus by

the master transmitter. This indicates to the addressed

slave receiver that a byte with a word address will

follow once it has generated an Acknowledge bit during

the ninth clock cycle. Therefore, the next byte transmit-

ted by the master is the word address and will be

written into the address pointer of the 24XX08. After

receiving another Acknowledge signal from the

24XX08, the master device will transmit the data word

to be written into the addressed memory location. The

24XX08 acknowledges again and the master

generates a Stop condition. This initiates the internal

write cycle and, during this time, the 24XX08 will not

generate Acknowledge signals (Figure 3-1).

Note:

Page write operations are limited to writing

bytes within a single physical page,

regardless of the number of bytes

actually being written. Physical page

boundaries start at addresses that are

integer multiples of the page buffer size (or

‘page-size’) and end at addresses that are

integer multiples of [page size – 1]. If a

Page Write command attempts to write

across a physical page boundary, the

result is that the data wraps around to the

beginning of the current page (overwriting

data previously stored there), instead of

being written to the next page, as might be

expected. It is therefore necessary for the

application software to prevent page write

operations that would attempt to cross a

page boundary.

FIGURE 4-1: BYTE WRITE

S

T

A

R

T

BUS ACTIVITY

MASTER

Control

Byte

Word

Address

O

P

Data

SDA LINE

S

P

A

C

K

A

C

K

A

C

K

BUS ACTIVITY

FIGURE 4-2: PAGE WRITE

S

T

A

R

T

BUS ACTIVITY

MASTER

Control

Byte

Word

Address (n)

O

P

Data (n)

Data (n + 1)

Data (n + 15)

SDA LINE

S

P

A

C

K

A

C

K

A

C

K

A

C

BUS ACTIVITY

K

DS21710D-page 7

24AA08/24LC08B

5.0

ACKNOWLEDGE POLLING

6.0

WRITE PROTECTION

Since the device will not acknowledge during a write

cycle, this can be used to determine when the cycle is

complete (this feature can be used to maximize bus

throughput). Once the Stop condition for a Write

command has been issued from the master, the device

initiates the internally-timed write cycle and ACK polling

can then be initiated immediately. This involves the

master sending a Start condition followed by the control

byte for a Write command (R/W = 0). If the device is still

busy with the write cycle, no ACK will be returned. If the

cycle is complete, the device will return the ACK and

the master can then proceed with the next Read or

Write command. See Figure 4-1 for a flow diagram of

this operation.

The 24XX08 can be used as a serial ROM when the

WP pin is connected to VCC. Programming will be

inhibited and the entire memory will be write-protected.

FIGURE 5-1:

ACKNOWLEDGE POLLING

FLOW

Send

Write Command

Send Stop

Condition to

Initiate Write Cycle

Send Start

Send Control Byte

with R/W = 0

Did Device

Acknowledge

(ACK = 0)?

No

Yes

DS21710D-page 8

24AA08/24LC08B

7.3

Sequential Read

7.0

READ OPERATION

Sequential reads are initiated in the same way as a

random read, except that once the 24XX08 transmits

the first data byte, the master issues an acknowledge

as opposed to a Stop condition in a random read. This

directs the 24XX08 to transmit the next sequentially-

addressed 8-bit word (Figure 6-3).

Read operations are initiated in the same way as write

operations, with the exception that the R/W bit of the

slave address is set to ‘1’. There are three basic types

of read operations: current address read, random read

and sequential read.

7.1

Current Address Read

To provide sequential reads, the 24XX08 contains an

internal address pointer that is incremented by one

upon completion of each operation. This address

pointer allows the entire memory contents to be serially

read during one operation.

The 24XX08 contains an address counter that main-

tains the address of the last word accessed, internally

incremented by ‘1’. Therefore, if the previous access

(either a read or write operation) was to address n, the

next current address read operation would access data

from address n + 1. Upon receipt of the slave address

with R/W bit set to ‘1’, the 24XX08 issues an acknowl-

edge and transmits the 8-bit data word. The master will

not acknowledge the transfer but does generate a Stop

condition and the 24XX08 discontinues transmission

(Figure 6-1).

7.4

Noise Protection

The 24XX08 employs a VCC threshold detector circuit

which disables the internal erase/write logic if the VCC

is below 1.5V at nominal conditions.

The SCL and SDA inputs have Schmitt Trigger and

filter circuits which suppress noise spikes to assure

proper device operation, even on a noisy bus.

7.2

Random Read

Random read operations allow the master to access

any memory location in a random manner. To perform

this type of read operation, the word address must first

be set. This is accomplished by sending the word

address to the 24XX08 as part of a write operation.

Once the word address is sent, the master generates a

Start condition following the acknowledge. This

terminates the write operation, but not before the

internal address pointer is set. The master then issues

the control byte again, but with the R/W bit set to a ‘1’.

The 24XX08 will then issue an acknowledge and trans-

mit the 8-bit data word. The master will not acknowl-

edge the transfer but does generate a Stop condition

and the 24XX08 will discontinue transmission

(Figure 6-2).

FIGURE 7-1:

CURRENT ADDRESS READ

S

BUS ACTIVITY

MASTER

T

A

R

Control

Byte

S

T

Data (n)

O

P

T

SDA LINE

S

P

A

C

K

N

O

BUS ACTIVITY

A

C

K

DS21710D-page 9

24AA08/24LC08B

FIGURE 7-2:

RANDOM READ

S

T

A

R

T

A

R

T

S

T

BUS ACTIVITY

MASTER

Control

Byte

Word

Address (n)

Control

Byte

Data (n)

O

P

S

P

S

SDA LINE

A

C

K

A

C

K

A

C

K

N

O

BUS ACTIVITY

A

C

K

FIGURE 7-3:

SEQUENTIAL READ

S

T

BUS ACTIVITY

MASTER

Control

Byte

O

P

Data (n)

Data (n + 1)

Data (n + 2)

Data (n + X)

SDA LINE

P

A

C

K

A

C

K

N

O

C

BUS ACTIVITY

K

A

C

K

DS21710D-page 10

24AA08/24LC08B

8.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 7-1.

TABLE 8-1:

Name

PIN FUNCTION TABLE

PDIP

SOIC

TSSOP

DFN

MSOP

SOT-23

Description

Not Connected

A0

A1

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

—

2

Not Connected

A2

Not Connected

VSS

SDA

SCL

WP

VCC

Ground

3

Serial Address/Data I/O

Serial Clock

1

5

Write-Protect Input

+1.8V to 5.5V Power Supply

4

8.1

Serial Address/Data Input/Output

(SDA)

8.3

Write-Protect (WP)

The WP pin must be connected to either VSS or VCC.

SDA is a bidirectional pin used to transfer addresses

and data into and out of the device. Since it is an open-

drain terminal, the SDA bus requires a pull-up resistor

to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for 400 kHz).

If tied to VSS, normal memory operation is enabled

(read/write the entire memory 00-03FFH).

If tied to VCC, write operations are inhibited. The entire

memory will be write-protected. Read operations are

not affected.

For normal data transfer, SDA is allowed to change

only during SCL low. Changes during SCL high are

reserved for indicating Start and Stop conditions.

This feature allows the user to use the 24XX08 as a

serial ROM when WP is enabled (tied to VCC).

8.2

Serial Clock (SCL)

8.4

A0, A1, A2

The SCL input is used to synchronize the data transfer

to and from the device.

The A0, A1 and A2 pins are not used by the 24XX08.

They may be left floating or tied to either VSS or VCC.

DS21710D-page 11

24AA08/24LC08B

9.0

9.1

PACKAGING INFORMATION

Package Marking Information

Example:

8-Lead PDIP (300 mil)

24LC08B

I/P13F

XXXXXXXX

T/XXXNNN

0527

YYWW

Example:

8-Lead SOIC (150 mil)

24LC08B

I/SN0527

XXXXXXXX

T/XXYYWW

13F

NNN

Example:

8-Lead TSSOP

4L08

XXXX

TYWW

NNN

I527

13F

TSSOP/MSOP

Marking Codes

Device

Example:

8-Lead MSOP

STD

Pb-free

24AA08

4A08

4L08

G4A8

G4L8

XXXXXT

4L08BI

24LC08B

YWWNNN

Y52713F

Example:

5-Lead SOT-23

SOT-23

Marking Codes

Device

STD

Pb-free

24AA08

24LC08B-I

24LC08B-E

B4

M4

N4

B4

M4

N4

XXNN

M43F

Note:

Pb-free part number using “G”

suffix is marked on carton

DS21710D-page 12

24AA08/24LC08B

8-Lead 2x3 DFN

Example:

XXX

YWW

NN

244

527

13

Legend: XX...X Part number or part number code

T

Temperature (I, E)

Y

Year code (last digit of calendar year)

YY

WW

NNN

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code (2 characters for small packages)

Pb-free JEDEC designator for Matte Tin (Sn)

e

3

Note:

For very small packages with no room for the Pb-free JEDEC designator

, the marking will only appear on the outer carton or reel label.

e

3

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

Note:

Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.

*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.

DS21710D-page 13

24AA08/24LC08B

8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)

E1

D

2

n

1

α

E

A2

A

L

c

A1

β

B1

B

p

eB

Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

8

MAX

n

p

Number of Pins

Pitch

8

.100

.155

.130

2.54

Top to Seating Plane

A

.140

.170

3.56

2.92

3.94

3.30

4.32

Molded Package Thickness

Base to Seating Plane

Shoulder to Shoulder Width

Molded Package Width

Overall Length

A2

A1

E

.115

.015

.300

.240

.360

.125

.008

.045

.014

.310

5

.145

3.68

0.38

7.62

6.10

9.14

3.18

0.20

1.14

0.36

7.87

5

.313

.250

.373

.130

.012

.058

.018

.370

10

.325

.260

.385

.135

.015

.070

.022

.430

15

7.94

6.35

9.46

3.30

0.29

1.46

0.46

9.40

10

8.26

6.60

9.78

3.43

0.38

1.78

0.56

10.92

15

E1

D

Tip to Seating Plane

Lead Thickness

L

c

Upper Lead Width

B1

B

Lower Lead Width

Overall Row Spacing

Mold Draft Angle Top

Mold Draft Angle Bottom

§

eB

α

β

5

10

15

5

10

15

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-001

Drawing No. C04-018

DS21710D-page 14

24AA08/24LC08B

8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)

E

E1

p

D

2

B

n

1

h

α

45°

c

A2

A

φ

β

L

A1

Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

MAX

n

p

Number of Pins

Pitch

8

.050

.061

.056

.007

.237

.154

.193

.015

.025

4

1.27

1.55

1.42

0.18

6.02

3.91

4.90

0.38

0.62

4

Overall Height

A

.053

.069

1.35

1.75

Molded Package Thickness

Standoff

A2

A1

E

.052

.004

.228

.146

.189

.010

.019

0

.061

.010

.244

.157

.197

.020

.030

8

1.32

0.10

5.79

3.71

4.80

0.25

0.48

0

1.55

0.25

6.20

3.99

5.00

0.51

0.76

8

§

Overall Width

Molded Package Width

Overall Length

E1

D

Chamfer Distance

Foot Length

h

L

φ

Foot Angle

c

Lead Thickness

Lead Width

.008

.013

0

.009

.017

12

.010

.020

15

0.20

0.33

0

0.23

0.42

12

0.25

0.51

15

B

α

β

Mold Draft Angle Top

Mold Draft Angle Bottom

0

12

15

0

12

15

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-012

Drawing No. C04-057

DS21710D-page 15

24AA08/24LC08B

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)

E

E1

p

D

2

1

n

B

α

A

c

A1

A2

φ

β

L

Units

INCHES

NOM

MILLIMETERS*

Dimension Limits

MIN

MAX

MIN

NOM

8

MAX

n

p

Number of Pins

Pitch

8

.026

0.65

Overall Height

A

.043

1.10

0.95

0.15

6.50

4.50

3.10

0.70

8

Molded Package Thickness

Standoff

A2

A1

E

.033

.035

.004

.251

.173

.118

.024

4

.037

.006

.256

.177

.122

.028

8

0.85

0.05

0.90

0.10

6.38

4.40

3.00

0.60

4

§

.002

.246

.169

.114

.020

0

Overall Width

6.25

4.30

2.90

0.50

0

Molded Package Width

Molded Package Length

Foot Length

E1

D

L

φ

Foot Angle

c

Lead Thickness

.004

.007

0

.006

.010

5

.008

.012

10

0.09

0.19

0

0.15

0.25

5

0.20

0.30

10

Lead Width

B

α

β

Mold Draft Angle Top

Mold Draft Angle Bottom

0

5

10

0

5

10

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.005” (0.127mm) per side.

JEDEC Equivalent: MO-153

Drawing No. C04-086

DS21710D-page 16

24AA08/24LC08B

8-Lead Plastic Micro Small Outline Package (MS) (MSOP)

E

E1

p

D

2

B

n

1

α

A2

A

c

φ

A1

(F)

L

β

Units

Dimension Limits

INCHES

NOM

MILLIMETERS*

MIN

MAX

MIN

NOM

MAX

n

p

Number of Pins

Pitch

8

.026 BSC

0.65 BSC

Overall Height

A

A2

A1

E

-

.043

-

1.10

Molded Package Thickness

Standoff

.030

.033

.037

0.75

0.00

0.85

-

0.95

0.15

.000

-

.006

Overall Width

.193 TYP.

4.90 BSC

Molded Package Width

Overall Length

Foot Length

E1

D

.118 BSC

3.00 BSC

L

.016

.024

.037 REF

.031

0.40

0.60

0.95 REF

0.80

Footprint (Reference)

Foot Angle

F

φ

c

0°

.003

.009

5°

-

8°

.009

.016

15°

0°

0.08

0.22

5°

-

8°

0.23

0.40

15°

Lead Thickness

Lead Width

.006

B

α

β

.012

Mold Draft Angle Top

Mold Draft Angle Bottom

*Controlling Parameter

Notes:

-

5°

15°

5°

15°

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not

exceed .010" (0.254mm) per side.

JEDEC Equivalent: MO-187

Drawing No. C04-111

DS21710D-page 17

24AA08/24LC08B

5-Lead Plastic Small Outline Transistor (OT) (SOT-23)

E

E1

p

B

p1

D

n

1

α

c

A

A2

φ

A1

L

β

Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

5

MAX

n

p

Number of Pins

5

Pitch

.038

.075

.046

.043

.003

.110

.064

.116

.018

5

0.95

1.90

p1

Outside lead pitch (basic)

Overall Height

A

A2

A1

E

.035

.000

.102

.059

.110

.014

0

.057

0.90

1.18

1.10

0.08

2.80

1.63

2.95

0.45

5

1.45

Molded Package Thickness

.051

.006

.118

.069

.122

.022

10

1.30

0.15

3.00

1.75

3.10

0.55

10

Standoff

§

0.00

2.60

1.50

2.80

0.35

0

Overall Width

Molded Package Width

Overall Length

E1

D

Foot Length

L

φ

Foot Angle

c

Lead Thickness

Lead Width

.004

.014

0

.006

.017

5

.008

.020

10

0.09

0.35

0

0.15

0.43

5

0.20

0.50

10

B

α

β

Mold Draft Angle Top

Mold Draft Angle Bottom

0

5

10

0

5

10

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MO-178

Drawing No. C04-091

DS21710D-page 18

24AA08/24LC08B

8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated

p

D

b

n

L

E

E2

EXPOSED

METAL

PAD

2

1

PIN 1

ID INDEX

AREA

D2

(NOTE 2)

BOTTOM VIEW

TOP VIEW

A

A1

A3

EXPOSED

TIE BAR

(NOTE 1)

Units

Dimension Limits

INCHES

NOM

8

MILLIMETERS*

NOM

MIN

MAX

MIN

MAX

n

p

Number of Pins

Pitch

8

.020 BSC

0.50 BSC

0.90

Overall Height

Standoff

A

A1

A3

D

.031

.035

.001

.008 REF.

.039

.002

0.80

0.00

1.00

.000

0.02

0.05

Contact Thickness

Overall Length

0.20 REF.

2.00 BSC

--

.079 BSC

--

(Note 3)

Exposed Pad Length

Overall Width

D2

E

.055

.064

1.39

1.62

.118 BSC

--

3.00 BSC

--

(Note 3)

Exposed Pad Width

Contact Width

E2

b

.047

.008

.012

.071

.012

.020

1.20

0.20

0.30

1.80

0.30

0.50

.010

0.25

Contact Length

L

.016

0.40

*Controlling Parameter

Notes:

1. Package may have one or more exposed tie bars at ends.

2. Pin 1 visual index feature may vary, but must be located within the hatched area.

3. Exposed pad dimensions vary with paddle size.

4. JEDEC equivalent: MO-229

Drawing No. C04-123

Revised 05/24/04

DS21710D-page 19

24AA08/24LC08B

APPENDIX A: REVISION HISTORY

Revision C

Corrections to Section 1.0, Electrical Characteristics.

Section 9.1, 24LC08B standard marking code.

Revision D

Added DFN package.

DS21710D-page 20

24AA08/24LC08B

THE MICROCHIP WEB SITE

CUSTOMER SUPPORT

Microchip provides online support via our WWW site at

www.microchip.com. This web site is used as a means

to make files and information easily available to

customers. Accessible by using your favorite Internet

browser, the web site contains the following

information:

Users of Microchip products can receive assistance

through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

• Product Support – Data sheets and errata,

application notes and sample programs, design

resources, user’s guides and hardware support

documents, latest software releases and archived

software

• Development Systems Information Line

Customers

should

contact

their

distributor,

representative or field application engineer (FAE) for

support. Local sales offices are also available to help

customers. A listing of sales offices and locations is

included in the back of this document.

• General Technical Support – Frequently Asked

Questions (FAQ), technical support requests,

online discussion groups, Microchip consultant

program member listing

Technical support is available through the web site

at: http://support.microchip.com

• Business of Microchip – Product selector and

ordering guides, latest Microchip press releases,

listing of seminars and events, listings of

Microchip sales offices, distributors and factory

representatives

In addition, there is

a

Development Systems

Information Line which lists the latest versions of

Microchip’s development systems software products.

This line also provides information on how customers

can receive currently available upgrade kits.

The Development Systems Information Line

numbers are:

CUSTOMER CHANGE NOTIFICATION

SERVICE

1-800-755-2345 – United States and most of Canada

1-480-792-7302 – Other International Locations

Microchip’s customer notification service helps keep

customers current on Microchip products. Subscribers

will receive e-mail notification whenever there are

changes, updates, revisions or errata related to a

specified product family or development tool of interest.

To register, access the Microchip web site at

www.microchip.com, click on Customer Change

Notification and follow the registration instructions.

DS21710D-page 21

24AA08/24LC08B

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-

uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation

can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

To:

Technical Publications Manager

Reader Response

Total Pages Sent ________

RE:

From:

Name

Company

Address

City / State / ZIP / Country

Telephone: (_______) _________ - _________

FAX: (______) _________ - _________

Application (optional):

Would you like a reply?

Y

N

24AA08/24LC08B

DS21710D

Literature Number:

Device:

Questions:

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

DS21710D-page 22

24AA08/24LC08B

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

X

PART NO.

Device

X

/XX

Examples:

a) 24AA08-I/P: Industrial Temperature,1.8V,

PDIP package

Temperature Package

Range

Lead Finish

b) 24AA08-I/SN: Industrial Temperature,1.8V,

SOIC package

2

24AA08:

24AA08T:

=

1.8V, 16 Kbit I C Serial EEPROM

c) 24AA08T-I/OT: Industrial Temperature,

1.8V, SOT-23 package, Tape and Reel

2

(Tape and Reel)

2

24LC08B:

=

2.5V, 16 Kbit I C Serial EEPROM

24LC08BT: = 2.5V, 16 Kbit I C Serial EEPROM

(Tape and Reel)

2

d) 24LC08B-I/P: Industrial Temperature, 2.5V,

PDIP package

e) 24LC08B-E/SN: Automotive Temp.,2.5V

SOIC package

Temperature

Range:

I

E

= -40°C to +85°C

= -40°C to +125°C

f)

24LC08BT-I/OT: Industrial Temperature,

2.5V, SOT-23 package, Tape and Reel

g) 24LC08B-I/PG: Industrial Temperature,

2.5V, PDIP package, Pb-free

Package:

P

=

Plastic DIP (300 mil body), 8-lead

Plastic SOIC (150 mil body), 8-lead

Plastic TSSOP (4.4 mm), 8-lead

2x3 DFN, 8-lead

Plastic Micro Small Outline (MSOP), 8-lead

SOT-23, 5-lead (Tape and Reel only)

SN

ST

MC

MS

OT

=

h) 24LC08BT-I/SNG: Industrial Temperature,

2.5V, SOIC package, Tape and Reel,

Pb-free

Lead Finish Blank =

Standard 63% / 37% SnPb

Matte Tin (Pure Sn)

G

=

Sales and Support

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and

recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

3. The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System

Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

DS21710D-page 23

24AA08/24LC08B

NOTES:

DS21710D-page 24

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR WAR-

RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,

WRITTEN OR ORAL, STATUTORY OR OTHERWISE,

RELATED TO THE INFORMATION, INCLUDING BUT NOT

LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,

MERCHANTABILITY OR FITNESS FOR PURPOSE.

Microchip disclaims all liability arising from this information and

its use. Use of Microchip’s products as critical components in

life support systems is not authorized except with express

written approval by Microchip. No licenses are conveyed,

implicitly or otherwise, under any Microchip intellectual property

rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,

PRO MATE, PowerSmart, rfPIC, and SmartShunt are

registered trademarks of Microchip Technology Incorporated

in the U.S.A. and other countries.

AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,

PICMASTER, SEEVAL, SmartSensor and The Embedded

Control Solutions Company are registered trademarks of

Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, dsPICDEM,

dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,

FanSense, FlexROM, fuzzyLAB, In-Circuit Serial

Programming, ICSP, ICEPIC, MPASM, MPLIB, MPLINK,

MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail,

PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB,

rfPICDEM, Select Mode, Smart Serial, SmartTel and Total

Endurance are trademarks of Microchip Technology

Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 quality system certification for

its worldwide headquarters, design and wafer fabrication facilities in

Chandler and Tempe, Arizona and Mountain View, California in

October 2003. The Company’s quality system processes and

procedures are for its PICmicro^®8-bit MCUs, KEELOQ^®code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

DS21710D-page 25

WORLDWIDE SALES AND SERVICE

AMERICAS

ASIA/PACIFIC

EUROPE

Corporate Office

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

India - Bangalore

Tel: 91-80-2229-0061

Fax: 91-80-2229-0062

Austria - Weis

Tel: 43-7242-2244-399

Fax: 43-7242-2244-393

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://support.microchip.com

Web Address:

www.microchip.com

China - Beijing

Tel: 86-10-8528-2100

Fax: 86-10-8528-2104

Denmark - Ballerup

Tel: 45-4450-2828

Fax: 45-4485-2829

India - New Delhi

Tel: 91-11-5160-8631

Fax: 91-11-5160-8632

China - Chengdu

Tel: 86-28-8676-6200

Fax: 86-28-8676-6599

France - Massy

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

Japan - Kanagawa

Tel: 81-45-471- 6166

Fax: 81-45-471-6122

Atlanta

China - Fuzhou

Tel: 86-591-8750-3506

Fax: 86-591-8750-3521

Germany - Ismaning

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Korea - Seoul

Alpharetta, GA

Tel: 770-640-0034

Fax: 770-640-0307

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

China - Hong Kong SAR

Tel: 852-2401-1200

Fax: 852-2401-3431

Boston

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Westford, MA

Tel: 978-692-3848

Fax: 978-692-3821

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

Taiwan - Kaohsiung

Tel: 886-7-536-4818

Fax: 886-7-536-4803

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

England - Berkshire

Tel: 44-118-921-5869

Fax: 44-118-921-5820

Taiwan - Taipei

Tel: 886-2-2500-6610

Fax: 886-2-2508-0102

Dallas

Addison, TX

China - Shenzhen

Tel: 86-755-8203-2660

Fax: 86-755-8203-1760

Tel: 972-818-7423

Fax: 972-818-2924

Taiwan - Hsinchu

Tel: 886-3-572-9526

Fax: 886-3-572-6459

China - Shunde

Detroit

Tel: 86-757-2839-5507

Fax: 86-757-2839-5571

Farmington Hills, MI

Tel: 248-538-2250

Fax: 248-538-2260

China - Qingdao

Tel: 86-532-502-7355

Fax: 86-532-502-7205

Kokomo

Kokomo, IN

Tel: 765-864-8360

Fax: 765-864-8387

Los Angeles

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

San Jose

Mountain View, CA

Tel: 650-215-1444

Fax: 650-961-0286

Toronto

Mississauga, Ontario,

Canada

Tel: 905-673-0699

Fax: 905-673-6509

10/20/04

DS21710D-page 26


型号：	24LC08B-I/OTG
厂家：	MICROCHIP
描述：	8K IC SERIAL EEPROM 8K IC串行EEPROM 可编程只读存储器电动程控只读存储器电可擦编程只读存储器
文件：	总26页 (文件大小：368K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

24LC08B-I/OTG [MICROCHIP]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB

SI9137LG

SI9122E