24LC024-I/ST_技术文档

24AA024/24LC024/24AA025/24LC025

2K I²C^™Serial EEPROM

Description:

Device Selection Table

Part

Number

VCC

Range

Max

Clock

Temp. Write

The Microchip Technology Inc. 24AA024/24LC024/

Range Protect

24AA025/24LC025 is a 2 Kbit Serial Electrically

24AA024 1.7V-5.5V 400 kHz⁽¹⁾

24AA025 1.7V-5.5V 400 kHz⁽¹⁾

I

Yes

No

Erasable PROM with a voltage range of 1.7V to 5.5V.

The device is organized as a single block of 256 x 8-bit

memory with a 2-wire serial interface. Low current

design permits operation with typical standby and

active currents of only 1 μA and 1 mA, respectively.

The device has a page write capability for up to 16

bytes of data. Functional address lines allow the

connection of up to eight 24AA024/24LC024/

24AA025/24LC025 devices on the same bus for up to

16K bits of contiguous EEPROM memory. The device

is available in the standard 8-pin PDIP, 8-pin SOIC

(3.90 mm), TSSOP, 2x3 DFN and MSOP packages.

24LC024 2.5V-5.5V

24LC025 2.5V-5.5V

400 kHz

Yes

No

Note 1: 100 kHz for VCC < 2.5V

Features:

• Single supply with operation from 1.7V to 5.5V for

24AA024/24AA025 devices, 2.5V for 24LC024/

24LC025 devices

• Low-power CMOS technology:

Package Types

- Read current 1 mA, typical

- Standby current 1 μA, typical

SOIC, TSSOP

PDIP, MSOP

• 2-wire serial interface, I²C™ compatible

• Cascadable up to eight devices

• Schmitt Trigger inputs for noise suppression

• Output slope control to eliminate ground bounce

• 100 kHz and 400 kHz clock compatibility

• Page write time 5 ms maximum

• Self-timed erase/write cycle

A0

WP A1

SCL

A0

1

8

VCC

1

2

3

4

8

7

6

5

VCC

WP

A1

A2

2

3

4

7

6

5

A2

SCL

SDA

VSS

SDAVSS

DFN

A0 1

VCC

8

• 16-byte page write buffer

7 WP

2

3

4

A1

A2

VSS

SCL

SDA

6

5

• Hardware write-protect on 24XX024 devices

• ESD protection >4,000V

• More than 1 million erase/write cycles

• Data retention >200 years

Note:

WP pin is not internally connected on the

24XX025.

• Factory programming available

Block Diagram

• Packages include 8-lead PDIP, SOIC, TSSOP,

DFN and MSOP

A0 A1 A2

WP*

HV Generator

• Pb-free and RoHS compliant

• Temperature ranges:

I/O

Control

Logic

Memory

Control

Logic

- Industrial (I): -40°C to +85°C

EEPROM

Array

XDEC

SDA

SCL

Write-Protect

Circuitry

VCC

VSS

YDEC

Sense Amp.

R/W Control

DS21210K-page 1

24AA024/24LC024/24AA025/24LC025

1.0

ELECTRICAL CHARACTERISTICS

(†)

Absolute Maximum Ratings

VCC.............................................................................................................................................................................6.5V

All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V

Storage temperature ...............................................................................................................................-65°C to +150°C

Ambient temperature with power applied................................................................................................-40°C to +125°C

ESD protection on all pins ......................................................................................................................................................≥ 4 kV

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those

indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for

extended periods may affect device reliability.

TABLE 1-1:

DC CHARACTERISTICS

All parameters apply across the

specified operating ranges unless

otherwise noted.

VCC = 1.7V to 5.5V

Industrial (I): TA = -40°C to +85°C

Parameter

Symbol

Min.

Max.

Units

Conditions

SCL and SDA pins:

High-level input voltage

VIH

VIL

0.7 VCC

—

0.3 VCC

—

V

—

Low-level input voltage

—

Hysteresis of Schmitt Trigger inputs VHYS

0.05 VCC

—

(Note)

Low-level output voltage

VOL

0.40

IOL = 3.0 mA, VCC = 4.5V

IOL = 2.1 mA, VCC = 2.5V

Input leakage current

ILI

—

±1

10

μA

pF

VIN = VSS or VCC

Output leakage current

ILO

VOUT = VSS or VCC

Pin capacitance (all inputs/outputs)

CIN, COUT

VCC = 5.0V (Note)

TA = 25°C, FCLK = 1 MHz

Operating current

Standby current

ICC Read

ICC Write

ICCS

—

1

3

1

mA

μA

VCC = 5.5V, SCL = 400 kHz

VCC = 5.5V

VCC = 5.5V, SDA = SCL = VCC

WP = VSS, A0, A1, A2 = VSS

Note:

This parameter is periodically sampled and not 100% tested.

DS21210K-page 2

24AA024/24LC024/24AA025/24LC025

TABLE 1-2:

AC CHARACTERISTICS

VCC = 1.7V to 5.5V

Industrial (I): TA = -40°C to +85°C

All parameters apply across the specified

operating ranges unless otherwise noted.

Vcc = 2.5V - 5.5V

FAST MODE

STD MODE

Parameter

Symbol

Units

Remarks

Min.

Max.

Min.

Max.

Clock frequency

FCLK

THIGH

TLOW

TR

—

4000

4700

—

100

—

600

1300

—

400

—

kHz

ns

—

Clock high time

—

Clock low time

—

ns

—

SDA and SCL rise time

SDA and SCL fall time

Start condition hold time

1000

300

—

300

—

ns

(Note 1)

TF

—

ns

THD:STA

4000

600

ns

After this period the first

clock pulse is generated

Start condition setup time

TSU:STA

4700

—

600

—

ns

Only relevant for repeated

Start condition

Data input hold time

Data input setup time

Stop condition setup time

Output valid from clock

Bus free time

THD:DAT

TSU:DAT

TSU:STO

TAA

0

—

0

—

ns

(Note 2)

—

250

4000

—

100

600

—

3500

—

900

—

(Note 2)

TBUF

4700

1300

Time the bus must be free

before a new transmission

can start

Output fall time from VIH

minimum to VIL maximum

TOF

—

250

50

20 +0.1

CB

250

50

ns

(Note 1), C_B≤ 100 pF

Input filter spike suppression TSP

(SDA and SCL pins)

—

(Note 3)

Write cycle time

Endurance

TWC

—

5

—

5

ms Byte or Page mode

1M

—

1M

—

cycles 25°C, (Note 4)

Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.

2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region

(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.

3: The combined TSP and VHYS specifications are due to Schmitt Trigger inputs which provide improved

noise spike suppression. This eliminates the need for a TI specification for standard operation.

4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific

application, please consult the Total Endurance™ Model which can be downloaded at

www.microchip.com.

DS21210K-page 3

24AA024/24LC024/24AA025/24LC025

FIGURE 1-1:

BUS TIMING DATA

THIGH

TF

TR

SCL

TSU:STA

TLOW

THD:DAT

TSU:DAT

TSU:STO

SDA

IN

THD:STA

TSP

TBUF

TAA

SDA

OUT

DS21210K-page 4

24AA024/24LC024/24AA025/24LC025

2.0

PIN DESCRIPTIONS

Pin Function Table

Name

A0

PDIP

SOIC

TSSOP

DFN

MSOP

Description

Address Pin AO

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

A1

Address Pin A1

A2

Address Pin A2

VSS

SDA

SCL

WP

VCC

Ground

Serial Address/Data I/O

Serial Clock

Write-Protect Input

+1.7 to 5.5V Power Supply

2.1

SDA Serial Data

2.5

Noise Protection

SDA is a bidirectional pin used to transfer addresses

and data into and out of the device. It is an open-drain

terminal, therefore, the SDA bus requires a pull-up

resistor to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for

400 kHz).

The 24AA024/24LC024/24AA025/24LC025 employs a

VCC threshold detector circuit which disables the

internal erase/write logic if the VCC is below 1.5 volts at

nominal conditions.

The SCL and SDA inputs have Schmitt Trigger and

filter circuits which suppress noise spikes to assure

proper device operation, even on a noisy bus.

For normal data transfer, SDA is allowed to change

only during SCL low. Changes during SCL high are

reserved for indicating the Start and Stop conditions.

3.0

FUNCTIONAL DESCRIPTION

2.2

SCL Serial Clock

The 24AA024/24LC024/24AA025/24LC025 supports

a bidirectional, 2-wire bus and data transmission

protocol. A device that sends data onto the bus is

defined as transmitter, while a device receiving data

is defined as receiver. The bus has to be controlled

by a master device which generates the Serial Clock

(SCL), controls the bus access and generates the

Start and Stop conditions, while the 24AA024/

24LC024/24AA025/24LC025 works as slave. Both

master and slave can operate as transmitter or

receiver, but the master device determines which

mode is activated.

The SCL input is used to synchronize the data transfer

from and to the device.

2.3

A0, A1, A2

The levels on the A0, A1 and A2 inputs are compared

with the corresponding bits in the slave address. The

chip is selected if the compare is true.

Up to eight 24AA024/24LC024/24AA025/24LC025

devices may be connected to the same bus by using

different Chip Select bit combinations. These inputs

must be connected to either VCC or VSS.

2.4

WP (24XX024 Only)

WP is the hardware write-protect pin. It must be tied to

VCC or VSS. If tied to Vcc, hardware write protection is

enabled. If WP is tied to Vss, the hardware write

protection is disabled. Note that the WP pin is available

only on the 24XX024. This pin is not internally

connected on the 24LC025.

DS21210K-page 5

24AA024/24LC024/24AA025/24LC025

The data on the line must be changed during the low

period of the clock signal. There is one bit of data per

clock pulse.

4.0

BUS CHARACTERISTICS

The following bus protocol has been defined:

• Data transfer may be initiated only when the bus

is not busy.

Each data transfer is initiated with a Start condition and

terminated with a Stop condition. The number of the

data bytes transferred between the Start and Stop

conditions is determined by the master device and is,

theoretically, unlimited, (though only the last sixteen will

be stored when performing a write operation). When an

overwrite does occur, it will replace data in a first-in

first-out fashion.

• During data transfer, the data line must remain

stable whenever the clock line is high. Changes in

the data line while the clock line is high will be

interpreted as a Start or Stop condition.

Accordingly, the following bus conditions have been

defined (Figure 4-1).

4.5

Acknowledge

4.1

Bus Not Busy (A)

Each receiving device, when addressed, is required to

generate an acknowledge after the reception of each

byte. The master device must generate an extra clock

pulse which is associated with this Acknowledge bit.

Both data and clock lines remain high.

4.2

Start Data Transfer (B)

A high-to-low transition of the SDA line while the clock

(SCL) is high determines a Start condition. All

commands must be preceded by a Start condition.

Note:

The 24AA024/24LC024/24AA025/24LC025

does not generate any Acknowledge bits if

an internal programming cycle is in

progress.

4.3

Stop Data Transfer (C)

The device that acknowledges has to pull down the SDA

line during the acknowledge clock pulse in such a way

that the SDA line is stable low during the high period of

the acknowledge-related clock pulse. Of course, setup

and hold times must be taken into account. A master

must signal an end of data to the slave by not generating

an Acknowledge bit on the last byte that has been

clocked out of the slave. In this case, the slave must

leave the data line high to enable the master to generate

the Stop condition (Figure 4-2).

A low-to-high transition of the SDA line while the clock

(SCL) is high determines a Stop condition. All

operations must be ended with a Stop condition.

4.4

Data Valid (D)

The state of the data line represents valid data when,

after a Start condition, the data line is stable for the

duration of the high period of the clock signal.

FIGURE 4-1:

DATA TRANSFER SEQUENCE ON THE SERIAL BUS CHARACTERISTICS

(A)

(B)

(C)

(D)

(C) (A)

SCL

SDA

Start

Condition

Stop

Condition

Address or

Acknowledge

Valid

Data

Allowed

to Change

FIGURE 4-2:

ACKNOWLEDGE TIMING

Acknowledge

Bit

1

2

3

4

5

6

7

8

9

1

2

3

SCL

SDA

Data from transmitter

Transmitter must release the SDA line at this point allowing

the Receiver to pull the SDA line low to acknowledge the

previous eight bits of data.

Receiver must release the SDA line at this

point so the Transmitter can continue

sending data.

DS21210K-page 6

24AA024/24LC024/24AA025/24LC025

FIGURE 5-1:

CONTROL BYTE FORMAT

5.0

DEVICE ADDRESSING

Read/Write Bit

A control byte is the first byte received following the

Start condition from the master device (Figure 5-1).

The control byte consists of a four-bit control code. For

the 24AA024/24LC024/24AA025/24LC025, this is set

as ‘1010’ binary for read and write operations. The next

three bits of the control byte are the Chip Select bits

(A2, A1, A0). The Chip Select bits allow the use of up

Chip Select

Control Code

Bits

S

1

0

1

0

A2 A1 A0 R/W ACK

to

eight

24AA024/24LC024/24AA025/24LC025

Slave Address

Acknowledge Bit

devices on the same bus and are used to select which

device is accessed. The Chip Select bits in the control

byte must correspond to the logic levels on the corre-

sponding A2, A1 and A0 pins for the device to respond.

These bits are in effect the three Most Significant bits of

the word address.

Start Bit

5.1

Contiguous Addressing Across

Multiple Devices

The last bit of the control byte defines the operation to

be performed. When set to a one, a read operation is

selected. When set to a zero, a write operation is

selected. Following the Start condition, the 24AA024/

24LC024/24AA025/24LC025 monitors the SDA bus

checking the control byte being transmitted. Upon

receiving a ‘1010’ code and appropriate Chip Select

bits, the slave device outputs an Acknowledge signal

on the SDA line. Depending on the state of the R/W bit,

the 24AA024/24LC024/24AA025/24LC025 will select a

read or write operation.

The Chip Select bits A2, A1 and A0 can be used to

expand the contiguous address space for up to 16K bits

by adding up to eight 24AA024/24LC024/24AA025/

24LC025 devices on the same bus. In this case, soft-

ware can use A0 of the control byte as address bit A8,

A1 as address bit A9 and A2 as address bit A10. It is

not possible to sequentially read across device

boundaries.

DS21210K-page 7

24AA024/24LC024/24AA025/24LC025

The higher-order four bits of the word address remain

constant. If the master should transmit more than 16

bytes prior to generating the Stop condition, the

address counter will roll over and the previously

received data will be overwritten. As with the byte-write

operation, once the Stop condition is received, an

internal write cycle will begin (Figure 6-2). If an attempt

is made to write to the protected portion of the array

when the hardware write protection has been enabled,

the device will acknowledge the command, but no data

will be written. The write cycle time must be observed

even if write protection is enabled.

6.0

6.1

WRITE OPERATIONS

Byte Write

Following the Start signal from the master, the device

code(4 bits), the Chip Select bits (3 bits) and the R/W

bit (which is a logic-low) is placed onto the bus by the

master transmitter. The device will acknowledge this

control byte during the ninth clock pulse. The next byte

transmitted by the master is the word address and will

be written into the Address Pointer of the 24AA024/

24LC024/24AA025/24LC025. After receiving another

Acknowledge signal from the 24AA024/24LC024/

24AA025/24LC025, the master device will transmit the

data word to be written into the addressed memory

location. The 24AA024/24LC024/24AA025/24LC025

acknowledges again and the master generates a Stop

condition. This initiates the internal write cycle and, dur-

ing this time, the 24AA024/24LC024/24AA025/

24LC025 will not generate Acknowledge signals

(Figure 6-1). If an attempt is made to write to the

protected portion of the array when the hardware write

protection (24XX024 only) has been enabled, the

device will acknowledge the command, but no data will

be written. The write cycle time must be observed even

if write protection is enabled.

Note:

Page write operations are limited to writing

bytes within a single physical page,

regardless of the number of bytes

actually being written. Physical page

boundaries start at addresses that are

integer multiples of the page buffer size (or

‘page size’) and end at addresses that are

integer multiples of [page size – 1]. If a

Page Write command attempts to write

across a physical page boundary, the

result is that the data wraps around to the

beginning of the current page (overwriting

data previously stored there), instead of

being written to the next page, as might be

expected. It is therefore necessary for the

application software to prevent page write

operations that would attempt to cross a

page boundary.

6.2

Page Write

The write control byte, word address and the first data

byte are transmitted to the 24AA024/24LC024/

24AA025/24LC025 in the same way as in a byte write.

However, instead of generating a Stop condition, the

master transmits up to 15 additional data bytes to the

24AA024/24LC024/24AA025/24LC025, which are

temporarily stored in the on-chip page buffer and will be

written into the memory once the master has transmit-

ted a Stop condition. Upon receipt of each word, the

four lower-order Address Pointer bits are internally

incremented by one.

6.3

Write Protection

The WP pin (available on 24XX024 only) must be tied

to VCC or VSS. If tied to VCC, the entire array will be

write-protected. If the WP pin is tied to VSS, write

operations to all address locations are allowed.

FIGURE 6-1:

BYTE WRITE

S

T

A

R

T

S

BUS ACTIVITY

MASTER

Control

Byte

Word

Address

T

Data

O

P

SDA LINE

S

P

A

C

K

A

C

K

A

C

K

BUS ACTIVITY

FIGURE 6-2:

PAGE WRITE

S

T

A

R

T

S

T

O

P

BUS ACTIVITY

MASTER

Control

Byte

Word

Address (n)

Data (n)

Data (n +1)

Data (n + 15)

SDA LINE

S

P

A

C

K

A

C

K

A

C

K

A

C

K

A

C

K

BUS ACTIVITY

DS21210K-page 8

24AA024/24LC024/24AA025/24LC025

FIGURE 7-1:

ACKNOWLEDGE POLLING

FLOW

7.0

ACKNOWLEDGE POLLING

Since the device will not acknowledge during a write

cycle, this can be used to determine when the cycle is

complete (this feature can be used to maximize bus

throughput). Once the Stop condition for a Write

command has been issued from the master, the device

initiates the internally-timed write cycle, with ACK

polling being initiated immediately. This involves the

master sending a Start condition followed by the control

byte for a Write command (R/W = 0). If the device is still

busy with the write cycle, no ACK will be returned. If no

ACK is returned, the Start bit and control byte must be

re-sent. If the cycle is complete, the device will return

the ACK and the master can then proceed with the next

Read or Write command. See Figure 7-1 for a flow

diagram of this operation.

Send

Write Command

Send Stop

Condition to

Initiate Write Cycle

Send Start

Send Control Byte

with R/W = 0

Did Device

Acknowledge

(ACK = 0)?

No

Yes

DS21210K-page 9

24AA024/24LC024/24AA025/24LC025

8.3

Sequential Read

8.0

READ OPERATIONS

Sequential reads are initiated in the same way as a

random read except that after the 24AA024/24LC024/

24AA025/24LC025 transmits the first data byte, the

master issues an acknowledge (as opposed to a Stop

condition in a random read). This directs the 24AA024/

24LC024/24AA025/24LC025 to transmit the next

sequentially-addressed 8-bit word (Figure 8-3).

Read operations are initiated in the same way as write

operations, with the exception that the R/W bit of the

slave address is set to ‘1’. There are three basic types

of read operations: current address read, random read

and sequential read.

8.1

Current Address Read

To provide sequential reads, the 24AA024/24LC024/

24AA025/24LC025 contains an internal Address

Pointer that is incremented by one upon completion of

each operation. This Address Pointer allows the entire

memory contents to be serially read during one

operation. The internal Address Pointer will

automatically roll over from address 0FFh to address

000h.

The 24AA024/24LC024/24AA025/24LC025 contains

an address counter that maintains the address of the

last word accessed, internally incremented by one.

Therefore, if the previous read access was to address

n, the next current address read operation would

access data from address n + 1. Upon receipt of the

slave address with the R/W bit set to ‘1’, the 24AA024/

24LC024/24AA025/24LC025 issues an acknowledge

and transmits the 8-bit data word. The master will not

acknowledge the transfer, but does generate a Stop

condition and the 24AA024/24LC024/24AA025/

24LC025 discontinues transmission (Figure 8-1).

FIGURE 8-1:

CURRENT ADDRESS

READ

S

T

A

R

T

S

T

O

P

Control

Byte

BUS ACTIVITY

MASTER

8.2

Random Read

Data

Random read operations allow the master to access

any memory location in a random manner. To perform

this type of read operation, the word address must first

be set. This is accomplished by sending the word

address to the 24AA024/24LC024/24AA025/24LC025

as part of a write operation. Once the word address is

sent, the master generates a Start condition following

the acknowledge. This terminates the write operation,

but not before the internal Address Pointer is set. The

master then issues the control byte again, but with the

R/W bit set to a ‘1’. The 24AA024/24LC024/24AA025/

24LC025 will then issue an acknowledge and transmits

the eight bit data word. The master will not acknowl-

edge the transfer but does generate a Stop condition

SDA LINE

P

S

N

O

A

C

K

A

C

K

BUS ACTIVITY

and

the

24AA024/24LC024/24AA025/24LC025

discontinues transmission (Figure 8-2). After this

command, the internal address counter will point to the

address location following the one that was just read.

DS21210K-page 10

24AA024/24LC024/24AA025/24LC025

FIGURE 8-2:

RANDOM READ

S

T

A

R

T

S

T

A

R

T

S

T

O

P

BUS ACTIVITY

MASTER

Control

Byte

Word

Address (n)

Control

Byte

Data (n)

S

P

S

SDA LINE

N

O

A

C

K

A

C

K

A

C

K

A

C

K

BUS ACTIVITY

FIGURE 8-3:

SEQUENTIAL READ

S

T

O

P

BUS ACTIVITY

MASTER

Control

Byte

Data (n)

Data (n + 1)

Data (n + 2)

Data (n + x)

P

SDA LINE

N

O

A

C

K

A

C

K

A

C

K

A

C

K

A

C

K

BUS ACTIVITY

DS21210K-page 11

24AA024/24LC024/24AA025/24LC025

9.0

9.1

PACKAGING INFORMATION

Package Marking Information

8-Lead PDIP (300 mil)

Example:

24LC024

XXXXXXXX

T/XXXNNN

I/P

13F

e

3

YYWW

0519

8-Lead SOIC (3.90 mm)

Example:

24LC024I

XXXXXXXT

XXXXYYWW

SN

0519

e

3

13F

NNN

Example:

8-Lead TSSOP

4L24

I519

13F

XXXX

TYWW

NNN

Example:

8-Lead MSOP

4L24I

51913F

XXXXT

YWWNNN

8-Lead 2x3 DFN

Example:

XXX

YWW

NN

2P4

519

13

DS21210K-page 12

24AA024/24LC024/24AA025/24LC025

1st Line Marking Codes

Part Number

24AA024

TSSOP

MSOP

DFN

4A24

4A24T

4L24T

4A25T

4L25T

2P1

2P4

2R1

2R4

24LC024

24AA025

24LC025

Note:

4L24

4A25

4L25

T = Temperature grade (I, E)

Legend: XX...X Part number or part number code

T

Temperature (I, E)

Y

Year code (last digit of calendar year)

YY

WW

NNN

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code (2 characters for small packages)

Pb-free JEDEC designator for Matte Tin (Sn)

e

3

Note: For very small packages with no room for the Pb-free JEDEC designator

, the marking will only appear on the outer carton or reel label.

e

3

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

Note:

Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.

*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.

DS21210K-page 13

24AA024/24LC024/24AA025/24LC025

8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

N

NOTE 1

E1

3

1

2

D

E

A2

A

L

A1

c

e

eB

b1

b

Units

INCHES

Dimension Limits

MIN

NOM

8

MAX

Number of Pins

Pitch

N

e

.100 BSC

–

Top to Seating Plane

A

–

.210

.195

–

Molded Package Thickness

Base to Seating Plane

Shoulder to Shoulder Width

Molded Package Width

Overall Length

A2

A1

E

.115

.015

.290

.240

.348

.115

.008

.040

.014

–

.130

–

.310

.250

.365

.130

.010

.060

.018

–

.325

.280

.400

.150

.015

.070

.022

.430

E1

D

Tip to Seating Plane

Lead Thickness

L

c

Upper Lead Width

b1

b

Lower Lead Width

Overall Row Spacing §

eB

Notes:

1. Pin 1 visual index feature may vary, but must be located with the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-018B

DS21210K-page 14

24AA024/24LC024/24AA025/24LC025

8-Lead Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

D

e

N

E

E1

NOTE 1

1

2

3

α

h

b

h

c

φ

A2

A

L

A1

L1

β

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

Pitch

N

e

8

1.27 BSC

Overall Height

A

–

1.75

–

Molded Package Thickness

Standoff

A2

A1

E

1.25

0.10

–

§

–

0.25

Overall Width

6.00 BSC

Molded Package Width

Overall Length

Chamfer (optional)

Foot Length

E1

D

h

3.90 BSC

4.90 BSC

0.25

0.40

–

0.50

1.27

L

–

Footprint

L1

φ

1.04 REF

Foot Angle

0°

0.17

0.31

5°

–

8°

Lead Thickness

Lead Width

c

0.25

0.51

15°

b

Mold Draft Angle Top

Mold Draft Angle Bottom

α

β

5°

15°

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-057B

DS21210K-page 15

24AA024/24LC024/24AA025/24LC025

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

D

N

E

E1

NOTE 1

1

2

b

e

c

φ

A

A2

A1

L

L1

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

Pitch

N

e

8

0.65 BSC

Overall Height

A

–

1.20

1.05

0.15

Molded Package Thickness

Standoff

A2

A1

E

0.80

0.05

1.00

–

Overall Width

6.40 BSC

Molded Package Width

Molded Package Length

Foot Length

E1

D

4.30

2.90

0.45

4.40

4.50

3.10

0.75

3.00

L

0.60

Footprint

L1

φ

1.00 REF

Foot Angle

0°

–

8°

Lead Thickness

c

0.09

0.20

0.30

Lead Width

b

0.19

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-086B

DS21210K-page 16

24AA024/24LC024/24AA025/24LC025

8-Lead Plastic Micro Small Outline Package (MS or UA) [MSOP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

D

N

E

E1

NOTE 1

2

b

1

e

c

φ

A2

A

L

L1

A1

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

Pitch

N

e

8

0.65 BSC

Overall Height

A

–

1.10

0.95

0.15

Molded Package Thickness

Standoff

A2

A1

E

0.75

0.00

0.85

–

4.90 BSC

3.00 BSC

0.60

Overall Width

Molded Package Width

Overall Length

Foot Length

E1

D

L

0.40

0.80

Footprint

L1

φ

0.95 REF

–

Foot Angle

0°

8°

Lead Thickness

Lead Width

c

0.08

–

0.23

0.40

b

0.22

–

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-111B

DS21210K-page 17

24AA024/24LC024/24AA025/24LC025

8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

e

D

b

N

L

K

E2

E

EXPOSED PAD

NOTE 1

2

1

2

D2

BOTTOM VIEW

TOP VIEW

A

NOTE 2

A3

A1

Units

MILLIMETERS

Dimension Limits

MIN

NOM

8

MAX

Number of Pins

Pitch

N

e

0.50 BSC

0.90

Overall Height

Standoff

A

0.80

0.00

1.00

0.05

A1

A3

D

0.02

Contact Thickness

Overall Length

Overall Width

0.20 REF

2.00 BSC

3.00 BSC

–

E

Exposed Pad Length

Exposed Pad Width

Contact Width

Contact Length

Contact-to-Exposed Pad

D2

E2

b

1.30

1.50

0.18

0.30

0.20

1.75

1.90

0.30

0.50

–

0.25

L

0.40

K

–

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package may have one or more exposed tie bars at ends.

3. Package is saw singulated.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-123B

DS21210K-page 18

24AA024/24LC024/24AA025/24LC025

APPENDIX A: REVISION HISTORY

Revision F

Corrections to Section 1.0, Electrical Characteristics.

Revision G

Added part number 24AA025 to document.

Correction to Section 1.0, Ambient Temperature.

Revision H

Added DFN package.

Revision J (02/2007)

Revised Features section; Revised Pin Function Table;

Changed 1.8V to 1.7V, Table 1-1 and Table 1-2;

Replaced Package Drawings; Replaced On-line

Support page; Revised Product ID section.

Revision K (03/2007)

Replaced Package Drawings (Rev. AM).

DS21210K-page 19

24AA024/24LC024/24AA025/24LC025

NOTES:

DS21210K-page 20

24AA024/24LC024/24AA025/24LC025

THE MICROCHIP WEB SITE

CUSTOMER SUPPORT

Microchip provides online support via our WWW site at

www.microchip.com. This web site is used as a means

to make files and information easily available to

customers. Accessible by using your favorite Internet

browser, the web site contains the following

information:

Users of Microchip products can receive assistance

through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

• Product Support – Data sheets and errata,

application notes and sample programs, design

resources, user’s guides and hardware support

documents, latest software releases and archived

software

• Development Systems Information Line

Customers

should

contact

their

distributor,

representative or field application engineer (FAE) for

support. Local sales offices are also available to help

customers. A listing of sales offices and locations is

included in the back of this document.

• General Technical Support – Frequently Asked

Questions (FAQ), technical support requests,

online discussion groups, Microchip consultant

program member listing

Technical support is available through the web site

at: http://support.microchip.com

• Business of Microchip – Product selector and

ordering guides, latest Microchip press releases,

listing of seminars and events, listings of

Microchip sales offices, distributors and factory

representatives

CUSTOMER CHANGE NOTIFICATION

SERVICE

Microchip’s customer notification service helps keep

customers current on Microchip products. Subscribers

will receive e-mail notification whenever there are

changes, updates, revisions or errata related to a

specified product family or development tool of interest.

To register, access the Microchip web site at

www.microchip.com, click on Customer Change

Notification and follow the registration instructions.

DS21210K-page 21

24AA024/24LC024/24AA025/24LC025

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-

uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation

can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

To:

Technical Publications Manager

Reader Response

Total Pages Sent ________

RE:

From:

Name

Company

Address

City / State / ZIP / Country

Telephone: (_______) _________ - _________

FAX: (______) _________ - _________

Application (optional):

Would you like a reply?

Y

N

24AA024/24LC024/24AA025/24LC025

DS21210K

Literature Number:

Device:

Questions:

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

DS21210K-page 22

24AA024/24LC024/24AA025/24LC025

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Examples:

PART NO.

Device

X

/XX

a) 24AA024-I/P: Industrial Temperature,

1.7V, PDIP Package

Temperature Package

Range

b) 24AA024-I/SN: Industrial Temperature,

1.7V, SOIC Package

c) 24AA025T-I/ST: Industrial Temperature,

1.7V, TSSOP Package, Tape and Reel,

no WP

Device:

24AA024: 1.7V, 2 Kbit Addressable Serial EEPROM with

WP pin.

24AA024T:1.7V, 2 Kbit Addressable Serial EEPROM

(Tape and Reel) with WP pin.

d) 24LC024-I/P: Industrial Temperature,

2.5V, PDIP Package

24LC024: 2.5V, 2 Kbit Addressable Serial EEPROM with

WP pin.

24LC024T:2.5V, 2 Kbit Addressable Serial EEPROM

(Tape and Reel) with WP pin.

24AA025: 1.7V, 2 Kbit Addressable Serial EEPROM with

no WP pin.

24AA025T:1.7V, 2 Kbit Addressable Serial EEPROM

(Tape and Reel) with no WP pin.

e) 24LC024-I/MS: Industrial Temperature,

2.5V, MSOP Package, Tape and Reel

f)

24LC025-T-I/SN: Industrial Temperature,

2.5V, SOIC Package, Tape and Reel, No

WP

24LC025: 2.5V, 2 Kbit Addressable Serial EEPROM

(Tape and Reel) with no WP pin.

24LC025T:2.5V, 2 Kbit Addressable Serial EEPROM

(Tape and Reel) with no WP pin.

Temperature Range:

Package:

I

=

-40°C to +85°C

P

=

Plastic DIP, (300 mil Body), 8-lead

Plastic SOIC, (3.90 mm Body)

TSSOP, 8-lead

MSOP, 8-lead

2x3 DFN, 8-lead

SN

ST

MS

MC

DS21210K-page 23

24AA024/24LC024/24AA025/24LC025

NOTES:

DS21210K-page 24

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,

PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and

SmartShunt are registered trademarks of Microchip

Technology Incorporated in the U.S.A. and other countries.

AmpLab, FilterLab, Linear Active Thermistor, Migratable

Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor

and The Embedded Control Solutions Company are

registered trademarks of Microchip Technology Incorporated

in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard,

dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,

ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,

In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,

MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,

PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,

PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,

rfPICDEM, Select Mode, Smart Serial, SmartTel, Total

Endurance, UNI/O, WiperLock and ZENA are trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona, Gresham, Oregon and Mountain View, California. The

Company’s quality system processes and procedures are for its PIC^®

MCUs and dsPIC^®DSCs, KEELOQ^®code hopping devices, Serial

EEPROMs, microperipherals, nonvolatile memory and analog

products. In addition, Microchip’s quality system for the design and

manufacture of development systems is ISO 9001:2000 certified.

DS21210K-page 25

WORLDWIDE SALES AND SERVICE

AMERICAS

ASIA/PACIFIC

EUROPE

Corporate Office

Asia Pacific Office

Suites 3707-14, 37th Floor

Tower 6, The Gateway

Habour City, Kowloon

Hong Kong

Tel: 852-2401-1200

Fax: 852-2401-3431

India - Bangalore

Tel: 91-80-4182-8400

Fax: 91-80-4182-8422

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://support.microchip.com

Web Address:

www.microchip.com

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

India - New Delhi

Tel: 91-11-4160-8631

Fax: 91-11-4160-8632

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

India - Pune

Tel: 91-20-2566-1512

Fax: 91-20-2566-1513

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

Atlanta

Duluth, GA

Tel: 678-957-9614

Fax: 678-957-1455

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Japan - Yokohama

Tel: 81-45-471- 6166

Fax: 81-45-471-6122

China - Beijing

Tel: 86-10-8528-2100

Fax: 86-10-8528-2104

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Korea - Gumi

Tel: 82-54-473-4301

Fax: 82-54-473-4302

Boston

China - Chengdu

Tel: 86-28-8665-5511

Fax: 86-28-8665-7889

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Korea - Seoul

China - Fuzhou

Tel: 86-591-8750-3506

Fax: 86-591-8750-3521

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

China - Hong Kong SAR

Tel: 852-2401-1200

Fax: 852-2401-3431

Malaysia - Penang

Tel: 60-4-646-8870

Fax: 60-4-646-5086

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

UK - Wokingham

Tel: 44-118-921-5869

Fax: 44-118-921-5820

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Detroit

Farmington Hills, MI

Tel: 248-538-2250

Fax: 248-538-2260

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Kokomo

Kokomo, IN

Tel: 765-864-8360

Fax: 765-864-8387

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

Taiwan - Hsin Chu

Tel: 886-3-572-9526

Fax: 886-3-572-6459

China - Shenzhen

Tel: 86-755-8203-2660

Fax: 86-755-8203-1760

Taiwan - Kaohsiung

Tel: 886-7-536-4818

Fax: 886-7-536-4803

Los Angeles

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

China - Shunde

Tel: 86-757-2839-5507

Fax: 86-757-2839-5571

Taiwan - Taipei

Tel: 886-2-2500-6610

Fax: 886-2-2508-0102

Santa Clara

Santa Clara, CA

Tel: 408-961-6444

Fax: 408-961-6445

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

Toronto

Mississauga, Ontario,

Canada

Tel: 905-673-0699

Fax: 905-673-6509

China - Xian

Tel: 86-29-8833-7250

Fax: 86-29-8833-7256

12/08/06

DS21210K-page 26


型号：	24LC024-I/ST
厂家：	MICROCHIP
描述：	2K I2C⑩ Serial EEPROM 2K I2C ™串行EEPROM 存储内存集成电路光电二极管双倍数据速率可编程只读存储器电动程控只读存储器电可擦编程只读存储器时钟
文件：	总26页 (文件大小：387K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

24LC024-I/ST [MICROCHIP]

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