24C02CI/ST_技术文档

24C02C

2K 5.0V I²C^™Serial EEPROM

Features:

Package Types

SOIC, TSSOP

PDIP, MSOP

• Single-supply with operation from 4.5 to 5.5V

• Low-power CMOS technology:

A0

1

8

VCC

1

2

8

7

A0

A1

A2

VCC

WP

- Read current 1 mA, typical

A1

A2

2

3

7

6

WP

- Standby current 10 μA, typical

SCL

3

4

6

5

SCL

SDA

• 2-wire serial interface, I²C compatible

• Cascadable up to eight devices

VSS

4

5

SDA VSS

• Schmitt Trigger inputs for noise suppression

• Output slope control to eliminate ground bounce

• 100 kHz and 400 kHz clock compatibility

• Fast Page or Byte write time 1 ms, typical

• Self-timed erase/write cycle

DFN

1

VCC

WP

A0

A1

8

7

6

5

2

3

4

SCL

SDA

A2

VSS

• 16-byte page write buffer

• Hardware write-protect for upper half of the array

(80h-FFh)

Block Diagram

• ESD protection >4,000V

• More than 1 million erase/write cycles

• Data retention >200 years

WP

A0 A1 A2

HV Generator

• Factory programming available

I/O

Control

Logic

Memory

Control

Logic

• Packages include 8-lead PDIP, SOIC, TSSOP,

DFN and MSOP

EEPROM

Array

XDEC

• Pb-free and RoHS compliant

• Temperature ranges:

SDA

SCL

Vcc

Vss

- Industrial (I):

- Automotive (E):

-40°C to +85°C

-40°C to +125°C

Write-Protect

Circuitry

YDEC

Description:

Sense Amp.

R/W Control

The Microchip Technology Inc. 24C02C is a 2K bit

Serial Electrically Erasable PROM with a voltage range

of 4.5V to 5.5V. The device is organized as a single

block of 256 x 8-bit memory with a 2-wire serial

interface. Low-current design permits operation with

typical standby and active currents of only 10 μA and 1

mA, respectively. The device has a page write capabil-

ity for up to 16 bytes of data and has fast write cycle

times of only 1 ms for both byte and page writes.

Functional address lines allow the connection of up to

eight 24C02C devices on the same bus for up to 16K

bits of contiguous EEPROM memory. The device is

available in the standard 8-pin PDIP, 8-pin SOIC (3.90

mm), 8-pin 2x3 DFN, 8-pin MSOP and TSSOP

packages.

2

I C is a trademark of Philips Corporation.

DS21202G-page 1

24C02C

1.0

ELECTRICAL CHARACTERISTICS

(†)

Absolute Maximum Ratings

VCC.............................................................................................................................................................................7.0V

All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V

Storage temperature ...............................................................................................................................-65°C to +150°C

Ambient temperature with power applied................................................................................................-40°C to +125°C

ESD protection on all pins...................................................................................................................................... ≥ 4 kV

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those

indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for

extended periods may affect device reliability.

TABLE 1-1:

DC CHARACTERISTICS

All parameters apply across the

specified operating ranges unless

otherwise noted.

VCC = +4.5V to +5.5V

Industrial (I):

TA = -40°C to +85°C

TA = -40°C to +125°C

Automotive (E):

Parameter

Symbol

Min.

Max.

Units

Conditions

SCL and SDA pins:

High-level input voltage

VIH

0.7 VCC

—

0.3 VCC

—

V

Low-level input voltage

VIL

—

Hysteresis of Schmitt Trigger inputs

Low-level output voltage

VHYS

VOL

0.05 VCC

V

(Note)

—

0.40

±1

V

IOL = 3.0 mA, VCC = 4.5V

VIN = VSS or VCC, WP = Vss

VOUT = VSS or VCC

Input leakage current

ILI

μA

pF

Output leakage current

ILO

±1

Pin capacitance (all inputs/outputs)

CIN, COUT

10

VCC = 5.0V (Note)

TA = 25°C, f = 1 MHz

Operating current

Standby current

ICC Read

ICC Write

ICCS

—

1

3

mA

μA

VCC = 5.5V, SCL = 400 kHz

VCC = 5.5V

50

VCC = 5.5V, SDA = SCL = VCC

WP = VSS

Note:

This parameter is periodically sampled and not 100% tested.

DS21202G-page 2

24C02C

TABLE 1-2:

AC CHARACTERISTICS

All parameters apply across the

specified operating ranges unless

otherwise noted.

VCC = +4.5V to +5.5V

Industrial (I):

TA = -40°C to +85°C

Automotive (E):

TA = -40°C to +125°C

TA > +85°C

-40°C ≤ TA ≤ +85°C

Parameter

Clock frequency

Symbol

Units

Remarks

Min.

Max.

Min.

Max.

FCLK

THIGH

TLOW

TR

—

4000

4700

—

100

—

600

1300

—

400

—

kHz

ns

Clock high time

Clock low time

—

ns

SDA and SCL rise time

SDA and SCL fall time

Start condition hold time

1000

300

—

300

—

ns

(Note 1)

TF

—

ns

(Note 1)

THD:STA

4000

600

ns

After this period the first

clock pulse is generated

Start condition setup time

TSU:STA

4700

—

600

—

ns

Only relevant for repeated

Start condition

Data input hold time

Data input setup time

Stop condition setup time

Output valid from clock

Bus free time

THD:DAT

TSU:DAT

TSU:STO

TAA

0

—

0

—

ns

(Note 2)

250

4000

—

100

600

—

3500

—

900

—

(Note 2)

TBUF

4700

1300

Time the bus must be free

before a new transmission

can start

Output fall time from VIH

minimum to VIL maximum

TOF

—

250 20 + 0.1 CB

250

50

ns

(Note 1), CB ≤ 100 pF

Input filter spike suppression TSP

(SDA and SCL pins)

50

—

(Note 3)

Write cycle time

Endurance

TWR

—

1.5

—

1

ms Byte or Page mode

1M

—

cycles 25°C, VCC = 5.0V, Block

mode (Note 4)

Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.

2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region

(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.

3: The combined TSP and VHYS specifications are due to Schmitt Trigger inputs which provide improved

noise spike suppression. This eliminates the need for a TI specification for standard operation.

4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific

application, please consult the Total Endurance™ Model which can be obtained from Microchip’s web site

at www.microchip.com.

FIGURE 1-1:

BUS TIMING DATA

THIGH

TF

TR

SCL

TSU:STA

TLOW

THD:DAT

TSU:DAT

TSU:STO

SDA

IN

THD:STA

TSP

TBUF

TAA

SDA

OUT

DS21202G-page 3

24C02C

2.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 2-1.

TABLE 2-1:

Name

PIN FUNCTION TABLE

PDIP SOIC TSSOP

DFN

MSOP

Description

Address Pin A0

A0

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

A1

2

3

4

5

6

7

8

Address Pin A1

A2

Address Pin A2

VSS

SDA

SCL

WP

VCC

Ground

Serial Address/Data I/O

Serial Clock

Write-Protect Input

+4.5 to 5.5V Power Supply

2.1

SDA Serial Data

3.0

FUNCTIONAL DESCRIPTIONS

This is a bidirectional pin used to transfer addresses

and data into and data out of the device. It is an open

drain terminal, therefore the SDA bus requires a pull-up

resistor to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for

400 kHz).

The 24C02C supports a bidirectional 2-wire bus and

data transmission protocol. A device that sends data

onto the bus is defined as transmitter, and a device

receiving data as receiver. The bus has to be controlled

by a master device which generates the Serial Clock

(SCL), controls the bus access, and generates the Start

and Stop conditions, while the 24C02C works as slave.

Both master and slave can operate as transmitter or

receiver but the master device determines which mode

is activated.

For normal data transfer SDA is allowed to change only

during SCL low. Changes during SCL high are

reserved for indicating the Start and Stop conditions.

2.2

SCL Serial Clock

This input is used to synchronize the data transfer from

and to the device.

2.3

A0, A1, A2

The levels on these inputs are compared with the

corresponding bits in the slave address. The chip is

selected if the compare is true.

Up to eight 24C02C devices may be connected to the

same bus by using different Chip Select bit combina-

tions. These inputs must be connected to either VCC or

VSS.

2.4

WP

This is the hardware write-protect pin. It must be tied to

VCC or VSS. If tied to Vcc, the hardware write protection

is enabled. If the WP pin is tied to Vss the hardware

write protection is disabled.

2.5

Noise Protection

The 24C02C employs a VCC threshold detector circuit

which disables the internal erase/write logic if the VCC

is below 3.8 volts at nominal conditions.

The SCL and SDA inputs have Schmitt Trigger and

filter circuits which suppress noise spikes to assure

proper device operation even on a noisy bus.

DS21202G-page 4

24C02C

The data on the line must be changed during the low

period of the clock signal. There is one bit of data per

clock pulse.

4.0

BUS CHARACTERISTICS

The following bus protocol has been defined:

• Data transfer may be initiated only when the bus

is not busy.

Each data transfer is initiated with a Start condition and

terminated with a Stop condition. The number of the

data bytes transferred between the Start and Stop

conditions is determined by the master device and is

theoretically unlimited, although only the last sixteen

will be stored when doing a write operation. When an

overwrite does occur it will replace data in a first-in first-

out fashion.

• During data transfer, the data line must remain

stable whenever the clock line is high. Changes in

the data line while the clock line is high will be

interpreted as a Start or Stop condition.

Accordingly, the following bus conditions have been

defined (Figure 4-1).

4.5

Acknowledge

4.1

Bus Not Busy (A)

Each receiving device, when addressed, is required to

generate an acknowledge after the reception of each

byte. The master device must generate an extra clock

pulse which is associated with this Acknowledge bit.

Both data and clock lines remain high.

4.2

Start Data Transfer (B)

A high-to-low transition of the SDA line while the clock

(SCL) is high determines a Start condition. All

commands must be preceded by a Start condition.

Note:

The 24C02C does not generate any

Acknowledge bits if an internal

programming cycle is in progress.

The device that acknowledges has to pull down the

SDA line during the Acknowledge clock pulse in such a

way that the SDA line is stable low during the high

period of the acknowledge related clock pulse. Of

course, setup and hold times must be taken into

account. A master must signal an end of data to the

slave by not generating an Acknowledge bit on the last

byte that has been clocked out of the slave. In this

case, the slave must leave the data line high to enable

the master to generate the Stop condition (Figure 4-2).

4.3

Stop Data Transfer (C)

A low-to-high transition of the SDA line while the clock

(SCL) is high determines a Stop condition. All opera-

tions must be ended with a Stop condition.

4.4

Data Valid (D)

The state of the data line represents valid data when,

after a Start condition, the data line is stable for the

duration of the high period of the clock signal.

FIGURE 4-1:

DATA TRANSFER SEQUENCE ON THE SERIAL BUS CHARACTERISTICS

(A)

(B)

(C)

(D)

(C) (A)

SCL

SDA

Start

Condition

Stop

Condition

Address or

Acknowledge

Valid

Data

Allowed

to Change

FIGURE 4-2:

ACKNOWLEDGE TIMING

Acknowledge

Bit

1

2

3

4

5

6

7

8

9

1

2

3

SCL

SDA

Data from transmitter

Receiver must release the SDA line at this point

so the Transmitter can continue sending data.

Transmitter must release the SDA line at this point

allowing the Receiver to pull the SDA line low to

acknowledge the previous eight bits of data.

DS21202G-page 5

24C02C

FIGURE 5-1:

CONTROL BYTE FORMAT

5.0

DEVICE ADDRESSING

Read/Write Bit

A control byte is the first byte received following the

Start condition from the master device (Figure 5-1).

The control byte consists of a four bit control code; for

the 24C02C this is set as ‘1010’ binary for read and

write operations. The next three bits of the control byte

are the Chip Select bits (A2, A1, A0). The Chip Select

bits allow the use of up to eight 24C02C devices on the

same bus and are used to select which device is

accessed. The Chip Select bits in the control byte must

correspond to the logic levels on the corresponding A2,

A1 and A0 pins for the device to respond. These bits

are in effect the three Most Significant bits of the word

address.

Chip Select

Control Code

Bits

S

1

0

1

0

A2 A1 A0 R/W ACK

Slave Address

Acknowledge Bit

Start Bit

5.1

Contiguous Addressing Across

Multiple Devices

The last bit of the control byte defines the operation to

be performed. When set to a ‘1’ a read operation is

selected, and when set to a ‘0’ a write operation is

selected. Following the Start condition, the 24C02C

monitors the SDA bus checking the control byte being

transmitted. Upon receiving a ‘1010’ code and appro-

priate Chip Select bits, the slave device outputs an

Acknowledge signal on the SDA line. Depending on the

state of the R/W bit, the 24C02C will select a read or

write operation.

The Chip Select bits A2, A1, A0 can be used to expand

the contiguous address space for up to 16K bits by

adding up to eight 24C02C devices on the same bus.

In this case, software can use A0 of the control byte

as address bit A8, A1 as address bit A9, and A2 as

address bit A10. It is not possible to write or read

across device boundaries.

DS21202G-page 6

24C02C

As with the byte write operation, once the Stop

condition is received an internal write cycle will begin

(Figure 6-2). If an attempt is made to write to the

protected portion of the array when the hardware write

protection has been enabled, the device will acknowl-

edge the command, but no data will be written. The

write cycle time must be observed even if the write

protection is enabled.

6.0

6.1

WRITE OPERATIONS

Byte Write

Following the Start signal from the master, the device

code(4 bits), the Chip Select bits (3 bits) and the R/W

bit, which is a logic low, is placed onto the bus by the

master transmitter. The device will acknowledge this

control byte during the ninth clock pulse. The next byte

transmitted by the master is the word address and will

be written into the Address Pointer of the 24C02C.

After receiving another Acknowledge signal from the

24C02C the master device will transmit the data word

to be written into the addressed memory location. The

24C02C acknowledges again and the master gener-

ates a Stop condition. This initiates the internal write

cycle, and during this time the 24C02C will not gener-

ate Acknowledge signals (Figure 6-1). If an attempt is

made to write to the protected portion of the array when

the hardware write protection has been enabled, the

device will acknowledge the command but no data will

be written. The write cycle time must be observed even

if the write protection is enabled.

Note:

Page write operations are limited to writing

bytes within a single physical page,

regardless of the number of bytes

actually being written. Physical page

boundaries start at addresses that are

integer multiples of the page buffer size (or

‘page size’) and end at addresses that are

integer multiples of [page size – 1]. If a

Page Write command attempts to write

across a physical page boundary, the

result is that the data wraps around to the

beginning of the current page (overwriting

data previously stored there), instead of

being written to the next page as might be

expected. It is therefore necessary for the

application software to prevent page write

operations that would attempt to cross a

page boundary.

6.2

Page Write

The write control byte, word address and the first data

byte are transmitted to the 24C02C in the same way as

in a byte write. But instead of generating a Stop

condition, the master transmits up to 15 additional data

bytes to the 24C02C which are temporarily stored in

the on-chip page buffer and will be written into the

memory after the master has transmitted a Stop

condition. After the receipt of each word, the four lower

order Address Pointer bits are internally incremented

by one. The higher order four bits of the word address

remains constant. If the master should transmit more

than 16 bytes prior to generating the Stop condition, the

address counter will roll over and the previously

received data will be overwritten.

6.3

Write Protection

The WP pin must be tied to VCC or VSS. If tied to VCC,

the upper half of the array (080-0FF) will be write-

protected. If the WP pin is tied to VSS, then write

operations to all address locations are allowed.

FIGURE 6-1:

BYTE WRITE

S

T

A

R

T

S

Bus Activity

Master

Control

Byte

Word

Address

T

Data

O

P

SDA Line

S

P

A

C

K

A

C

K

A

C

K

Bus Activity

FIGURE 6-2:

PAGE WRITE

S

T

A

R

T

S

T

O

P

Bus Activity

Master

Control

Byte

Word

Address (n)

Data n

Data n +1

Data n + 15

SDA Line

S

P

A

C

K

A

C

K

A

C

K

A

C

K

A

C

K

Bus Activity

DS21202G-page 7

24C02C

7.0

ACKNOWLEDGE POLLING

8.0

READ OPERATIONS

Since the device will not acknowledge during a write

cycle, this can be used to determine when the cycle is

complete (this feature can be used to maximize bus

throughput). Once the Stop condition for a Write

command has been issued from the master, the device

initiates the internally timed write cycle. ACK polling

can be initiated immediately. This involves the master

sending a Start condition followed by the control byte

for a Write command (R/W = 0). If the device is still

busy with the write cycle, then no ACK will be returned.

If no ACK is returned, then the Start bit and control byte

must be re-sent. If the cycle is complete, then the

device will return the ACK and the master can then

proceed with the next Read or Write command. See

Figure 7-1 for flow diagram.

Read operations are initiated in the same way as write

operations with the exception that the R/W bit of the

slave address is set to one. There are three basic types

of read operations: current address read, random read,

and sequential read.

8.1

Current Address Read

The 24C02C contains an address counter that main-

tains the address of the last word accessed, internally

incremented by one. Therefore, if the previous read

access was to address n, the next current address read

operation would access data from address n + 1. Upon

receipt of the slave address with the R/W bit set to one,

the 24C02C issues an acknowledge and transmits the

eight bit data word. The master will not acknowledge

the transfer, but does generate a Stop condition and the

24C02C discontinues transmission (Figure 8-1).

FIGURE 7-1:

ACKNOWLEDGE

POLLING FLOW

8.2

Random Read

Send

Random read operations allow the master to access

any memory location in a random manner. To perform

this type of read operation, first the word address must

be set. This is done by sending the word address to the

24C02C as part of a write operation. After the word

address is sent, the master generates a Start condition

following the acknowledge. This terminates the write

operation, but not before the internal Address Pointer is

set. Then the master issues the control byte again but

with the R/W bit set to a one. The 24C02C will then

issue an acknowledge and transmits the eight bit data

word. The master will not acknowledge the transfer but

does generate a Stop condition and the 24C02C

discontinues transmission (Figure 8-2). After this

command, the internal address counter will point to the

address location following the one that was just read.

Write Command

Send Stop

Condition to

Initiate Write Cycle

Send Start

Send Control Byte

with R/W = 0

8.3

Sequential Read

Did Device

Acknowledge

(ACK = 0)?

No

Sequential reads are initiated in the same way as a

random read except that after the 24C02C transmits

the first data byte, the master issues an acknowledge

as opposed to a Stop condition in a random read. This

directs the 24C02C to transmit the next sequentially

addressed 8-bit word (Figure 8-3).

Yes

To provide sequential reads, the 24C02C contains an

internal Address Pointer which is incremented by one

at the completion of each operation. This Address

Pointer allows the entire memory contents to be serially

read during one operation. The internal Address

Pointer will automatically roll over from address FF to

address 00.

DS21202G-page 8

24C02C

FIGURE 8-1:

CURRENT READ ADDRESS

S

T

A

R

T

S

T

O

P

Bus Activity

Master

Control

Byte

Data

SDA line

P

S

A

C

K

N

O

Bus Activity

A

C

K

FIGURE 8-2:

RANDOM READ

S

T

A

R

T

S

T

A

R

T

S

T

O

P

Bus Activity

Master

Control

Byte

Word

Address (n)

Control

Byte

Data (n)

S

P

S

SDA line

A

C

K

A

C

K

A

C

K

N

O

Bus Activity

A

C

K

FIGURE 8-3:

SEQUENTIAL READ

S

T

O

P

Bus Activity

Master

Control

Data n

Byte

Data n + 1

Data n + 2

Data n + X

P

SDA line

A

C

K

A

C

K

A

C

K

A

C

K

N

O

A

C

K

Bus Activity

DS21202G-page 9

24C02C

9.0

9.1

PACKAGING INFORMATION

Package Marking Information

8-Lead PDIP (300 mil)

Example:

24C02C

XXXXXXXX

T/XXXNNN

I/P

13F

e

3

YYWW

0527

8-Lead SOIC (3.90 mm)

Example:

24C02CI

XXXXXXXT

e

3

XXXXYYWW

SN

0527

NNN

13F

Example:

8-Lead TSSOP

4C2C

I527

13F

XXXX

TYWW

NNN

Example:

8-Lead MSOP

4C2CI

XXXXT

52713F

YWWNNN

8-Lead 2x3 DFN

Example:

XXX

YWW

NN

2P7

527

13

DS21202G-page 10

24C02C

1st Line Marking Codes

Part Number

DFN

TSSOP

MSOP

I Temp.

E Temp.

24C02C

4C2C

4C2CT

2P7

2P8

Note:

T = Temperature grade (I, E)

Legend: XX...X Part number or part number code

T

Temperature (I, E)

Y

Year code (last digit of calendar year)

YY

WW

NNN

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code (2 characters for small packages)

Pb-free JEDEC designator for Matte Tin (Sn)

e

3

Note: For very small packages with no room for the Pb-free JEDEC designator

e

3

, the marking will only appear on the outer carton or reel label.

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

Note:

Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.

*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.

DS21202G-page 11

24C02C

8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

N

NOTE 1

E1

3

1

2

D

E

A2

A

L

A1

c

e

eB

b1

b

Units

INCHES

Dimension Limits

MIN

NOM

8

MAX

Number of Pins

Pitch

N

e

.100 BSC

–

Top to Seating Plane

A

–

.210

.195

–

Molded Package Thickness

Base to Seating Plane

Shoulder to Shoulder Width

Molded Package Width

Overall Length

A2

A1

E

.115

.015

.290

.240

.348

.115

.008

.040

.014

–

.130

–

.310

.250

.365

.130

.010

.060

.018

–

.325

.280

.400

.150

.015

.070

.022

.430

E1

D

Tip to Seating Plane

Lead Thickness

L

c

Upper Lead Width

b1

b

Lower Lead Width

Overall Row Spacing §

eB

Notes:

1. Pin 1 visual index feature may vary, but must be located with the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-018B

DS21202G-page 12

24C02C

8-Lead Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

D

e

N

E

E1

NOTE 1

1

2

3

α

h

b

h

c

φ

A2

A

L

A1

L1

β

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

Pitch

N

e

8

1.27 BSC

Overall Height

A

–

1.75

–

Molded Package Thickness

Standoff

A2

A1

E

1.25

0.10

–

§

–

0.25

Overall Width

6.00 BSC

Molded Package Width

Overall Length

Chamfer (optional)

Foot Length

E1

D

h

3.90 BSC

4.90 BSC

0.25

0.40

–

0.50

1.27

L

–

Footprint

L1

φ

1.04 REF

Foot Angle

0°

0.17

0.31

5°

–

8°

Lead Thickness

Lead Width

c

0.25

0.51

15°

b

Mold Draft Angle Top

Mold Draft Angle Bottom

α

β

5°

15°

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-057B

DS21202G-page 13

24C02C

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

D

N

E

E1

NOTE 1

1

2

b

e

c

φ

A

A2

A1

L

L1

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

Pitch

N

e

8

0.65 BSC

Overall Height

A

–

1.20

1.05

0.15

Molded Package Thickness

Standoff

A2

A1

E

0.80

0.05

1.00

–

Overall Width

6.40 BSC

Molded Package Width

Molded Package Length

Foot Length

E1

D

4.30

2.90

0.45

4.40

4.50

3.10

0.75

3.00

L

0.60

Footprint

L1

φ

1.00 REF

Foot Angle

0°

–

8°

Lead Thickness

c

0.09

0.20

0.30

Lead Width

b

0.19

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-086B

DS21202G-page 14

24C02C

8-Lead Plastic Micro Small Outline Package (MS or UA) [MSOP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

D

N

E

E1

NOTE 1

2

b

1

e

c

φ

A2

A

L

L1

A1

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

Pitch

N

e

8

0.65 BSC

Overall Height

A

–

1.10

0.95

0.15

Molded Package Thickness

Standoff

A2

A1

E

0.75

0.00

0.85

–

4.90 BSC

3.00 BSC

0.60

Overall Width

Molded Package Width

Overall Length

Foot Length

E1

D

L

0.40

0.80

Footprint

L1

φ

0.95 REF

–

Foot Angle

0°

8°

Lead Thickness

Lead Width

c

0.08

–

0.23

0.40

b

0.22

–

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-111B

DS21202G-page 15

24C02C

8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

e

D

b

N

L

K

E2

E

EXPOSED PAD

NOTE 1

2

1

2

D2

BOTTOM VIEW

TOP VIEW

A

NOTE 2

A3

A1

Units

MILLIMETERS

Dimension Limits

MIN

NOM

8

MAX

Number of Pins

Pitch

N

e

0.50 BSC

0.90

Overall Height

Standoff

A

0.80

0.00

1.00

0.05

A1

A3

D

0.02

Contact Thickness

Overall Length

Overall Width

0.20 REF

2.00 BSC

3.00 BSC

–

E

Exposed Pad Length

Exposed Pad Width

Contact Width

Contact Length

Contact-to-Exposed Pad

D2

E2

b

1.30

1.50

0.18

0.30

0.20

1.75

1.90

0.30

0.50

–

0.25

L

0.40

K

–

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package may have one or more exposed tie bars at ends.

3. Package is saw singulated.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-123B

DS21202G-page 16

24C02C

APPENDIX A: REVISION HISTORY

Revision D

Corrections to Section 1.0, Electrical Characteristics.

Revision E

Added DFN package.

Revision F (02/2007)

Revised Features section; Section 1.0 revised Ambient

temperature; Revised Tables 1-1, 1-2, (removed com-

mercial temp); Revised Table 2-1; Replaced On-line

Support page; Replaced Package Drawings; Revised

Product ID section.

Revision G (03/2007)

Replaced Package Drawings (Rev. AM).

DS21202G-page 17

24C02C

NOTES:

DS21202G-page 18

24C02C

THE MICROCHIP WEB SITE

CUSTOMER SUPPORT

Microchip provides online support via our WWW site at

www.microchip.com. This web site is used as a means

to make files and information easily available to

customers. Accessible by using your favorite Internet

browser, the web site contains the following

information:

Users of Microchip products can receive assistance

through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

• Product Support – Data sheets and errata,

application notes and sample programs, design

resources, user’s guides and hardware support

documents, latest software releases and archived

software

• Development Systems Information Line

Customers

should

contact

their

distributor,

representative or field application engineer (FAE) for

support. Local sales offices are also available to help

customers. A listing of sales offices and locations is

included in the back of this document.

• General Technical Support – Frequently Asked

Questions (FAQ), technical support requests,

online discussion groups, Microchip consultant

program member listing

Technical support is available through the web site

at: http://support.microchip.com

• Business of Microchip – Product selector and

ordering guides, latest Microchip press releases,

listing of seminars and events, listings of

Microchip sales offices, distributors and factory

representatives

CUSTOMER CHANGE NOTIFICATION

SERVICE

Microchip’s customer notification service helps keep

customers current on Microchip products. Subscribers

will receive e-mail notification whenever there are

changes, updates, revisions or errata related to a

specified product family or development tool of interest.

To register, access the Microchip web site at

www.microchip.com, click on Customer Change

Notification and follow the registration instructions.

DS21202G-page 19

24C02C

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-

uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation

can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

To:

Technical Publications Manager

Reader Response

Total Pages Sent ________

RE:

From:

Name

Company

Address

City / State / ZIP / Country

Telephone: (_______) _________ - _________

FAX: (______) _________ - _________

Application (optional):

Would you like a reply?

Y

N

24C02C

DS21202G

Literature Number:

Device:

Questions:

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

DS21202G-page 20

24C02C

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO.

Device

X

/XX

Temperature

Range

Package

Device:

24C02C 2K I²C™ Serial EEPROM

24C02CT 2K I²C™ Serial EEPROM (Tape and Reel)

Temperature

Range:

I

E

=

-40°C to +85°C

-40°C to +125°C

Package:

P

=

Plastic DIP (300 mil Body), 8-lead

Plastic SOIC, (3.90 mm Body), 8-lead

TSSOP (4.4 mm Body), 8-lead

Plastic Micro Small Outline (MSOP), 8-lead

2x3 DFN, 8-lead

SN

ST

MS

MC

DS21202G-page 21

24C02C

NOTES:

DS21202G-page 22

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,

PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and

SmartShunt are registered trademarks of Microchip

Technology Incorporated in the U.S.A. and other countries.

AmpLab, FilterLab, Linear Active Thermistor, Migratable

Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor

and The Embedded Control Solutions Company are

registered trademarks of Microchip Technology Incorporated

in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard,

dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,

ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,

In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,

MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,

PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,

PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,

rfPICDEM, Select Mode, Smart Serial, SmartTel, Total

Endurance, UNI/O, WiperLock and ZENA are trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona, Gresham, Oregon and Mountain View, California. The

Company’s quality system processes and procedures are for its PIC^®

MCUs and dsPIC^®DSCs, KEELOQ^®code hopping devices, Serial

EEPROMs, microperipherals, nonvolatile memory and analog

products. In addition, Microchip’s quality system for the design and

manufacture of development systems is ISO 9001:2000 certified.

DS21202G-page 23

WORLDWIDE SALES AND SERVICE

AMERICAS

ASIA/PACIFIC

EUROPE

Corporate Office

Asia Pacific Office

Suites 3707-14, 37th Floor

Tower 6, The Gateway

Habour City, Kowloon

Hong Kong

Tel: 852-2401-1200

Fax: 852-2401-3431

India - Bangalore

Tel: 91-80-4182-8400

Fax: 91-80-4182-8422

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://support.microchip.com

Web Address:

www.microchip.com

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

India - New Delhi

Tel: 91-11-4160-8631

Fax: 91-11-4160-8632

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

India - Pune

Tel: 91-20-2566-1512

Fax: 91-20-2566-1513

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

Atlanta

Duluth, GA

Tel: 678-957-9614

Fax: 678-957-1455

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Japan - Yokohama

Tel: 81-45-471- 6166

Fax: 81-45-471-6122

China - Beijing

Tel: 86-10-8528-2100

Fax: 86-10-8528-2104

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Korea - Gumi

Tel: 82-54-473-4301

Fax: 82-54-473-4302

Boston

China - Chengdu

Tel: 86-28-8665-5511

Fax: 86-28-8665-7889

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Korea - Seoul

China - Fuzhou

Tel: 86-591-8750-3506

Fax: 86-591-8750-3521

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

China - Hong Kong SAR

Tel: 852-2401-1200

Fax: 852-2401-3431

Malaysia - Penang

Tel: 60-4-646-8870

Fax: 60-4-646-5086

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

UK - Wokingham

Tel: 44-118-921-5869

Fax: 44-118-921-5820

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Detroit

Farmington Hills, MI

Tel: 248-538-2250

Fax: 248-538-2260

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Kokomo

Kokomo, IN

Tel: 765-864-8360

Fax: 765-864-8387

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

Taiwan - Hsin Chu

Tel: 886-3-572-9526

Fax: 886-3-572-6459

China - Shenzhen

Tel: 86-755-8203-2660

Fax: 86-755-8203-1760

Taiwan - Kaohsiung

Tel: 886-7-536-4818

Fax: 886-7-536-4803

Los Angeles

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

China - Shunde

Tel: 86-757-2839-5507

Fax: 86-757-2839-5571

Taiwan - Taipei

Tel: 886-2-2500-6610

Fax: 886-2-2508-0102

Santa Clara

Santa Clara, CA

Tel: 408-961-6444

Fax: 408-961-6445

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

Toronto

Mississauga, Ontario,

Canada

Tel: 905-673-0699

Fax: 905-673-6509

China - Xian

Tel: 86-29-8833-7250

Fax: 86-29-8833-7256

12/08/06

DS21202G-page 24


型号：	24C02CI/ST
厂家：	MICROCHIP
描述：	2K 5.0V I2C⑩ Serial EEPROM 2K 5.0V I2C⑩串行EEPROM 存储内存集成电路光电二极管可编程只读存储器电动程控只读存储器电可擦编程只读存储器时钟
文件：	总24页 (文件大小：380K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

24C02CI/ST [MICROCHIP]

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