24AA32AT-ESM [MICROCHIP]
32K I2C™ Serial EEPROM; 32K I2C ™串行EEPROM
| 型号： | 24AA32AT-ESM |
| 厂家： | 
MICROCHIP |
| 描述： | 32K I2C™ Serial EEPROM |
| 文件： | 总36页 (文件大小：628K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
24AA32A/24LC32A
32K I2C™ Serial EEPROM
Description:
Device Selection Table
Part
Number
VCC
Range
Max. Clock
Frequency
Temp.
Ranges
The Microchip Technology Inc. 24AA32A/24LC32A
(24XX32A*) is a 32 Kbit Electrically Erasable PROM.
The device is organized as a single block of 4K x 8-bit
memory with a 2-wire serial interface. Low-voltage
design permits operation down to 1.7V, with standby
and active currents of only 1 A and 1 mA,
respectively. It has been developed for advanced, low-
power applications such as personal communications
or data acquisition. The 24XX32A also has a page write
capability for up to 32 bytes of data. Functional address
lines allow up to eight devices on the same bus, for up
to 256 Kbits address space. The 24XX32A is available
in the standard 8-pin PDIP, surface mount SOIC, SOIJ,
TSSOP, DFN, TDFN and MSOP packages. The
24XX32A is also available in the 5-lead SOT-23 and
Chip Scale packages.
24AA32A
24LC32A
1.7-5.5
2.5-5.5
400 kHz(1)
400 kHz
I
I, E
Note 1: 100 kHz for VCC <2.5V.
Features:
• Single Supply with Operation down to 1.7V for
24AA32A devices, 2.5V for 24LC32A devices
• Low-Power CMOS Technology:
- Active current 1 mA, typical
- Standby current 1 A, typical
• 2-Wire Serial Interface, I2C™ Compatible
• Schmitt Trigger Inputs for Noise Suppression
• Output Slope Control to Eliminate Ground Bounce
• 100 kHz and 400 kHz Clock Compatibility
• Page Write Time 5 ms max.
Block Diagram
WP
A0 A1 A2
HV Generator
• Self-Timed Erase/Write Cycle
• 32-Byte Page Write Buffer
I/O
Control
Logic
Memory
Control
Logic
EEPROM
Array
XDEC
• Hardware Write-Protect
• ESD Protection > 4,000V
Page Latches
• More than 1 Million Erase/Write Cycles
• Data Retention > 200 Years
I/O SCL
• Factory Programming Available
YDEC
• Packages Include 8-lead PDIP, SOIC, SOIJ,
TSSOP, MSOP, DFN, TDFN, 5-lead SOT-23 and
Chip Scale
SDA
Vcc
Sense Amp.
R/W Control
• Pb-Free and RoHS Compliant
• Temperature Ranges:
VSS
- Industrial (I):
-40°C to +85°C
- Automotive (E): -40°C to +125°C
Package Types
CS (Chip Scale)(2)
PDIP/MSOP/SOIC/SOIJ/TSSOP
DFN/TDFN
SOT-23
A0
1
8
VCC
SCL
VSS
WP
5
4
1
2
VCC
1
A0
A1
VCC
8
7
6
5
1
4
VSS
2
5
WP
3
WP
SCL
2
3
4
A1
A2
2
3
7
6
WP
SDA
SCL
SDA
A2
SCL
VSS
VCC
3
(Top Down View,
Balls Not Visible)
SDA
VSS
4
5
SDA
Note 1: Pins A0, A1 and A2 are not used by the 24XX32A (no internal connections).
2: Available in I-temp, “AA” only.
*24XX32A is used in this document as a generic part number for the 24AA32A/24LC32A devices.
2009 Microchip Technology Inc.
DS21713K-page 1
24AA32A/24LC32A
1.0
ELECTRICAL CHARACTERISTICS
(†)
Absolute Maximum Ratings
VCC.............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied................................................................................................-40°C to +125°C
ESD protection on all pins 4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at those or any other conditions
above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
Industrial (I):
TA = -40°C to +85°C, VCC = +1.7V to +5.5V
DC CHARACTERISTICS
Automotive (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V
Param.
Symbol
No.
Characteristic
Min.
Typ.
Max.
Units
Conditions
D1
—
A0, A1, A2, WP, SCL
and SDA pins
—
—
—
—
—
—
D2
D3
VIH
VIL
High-level input voltage
Low-level input voltage
0.7 VCC
—
—
—
—
V
0.3 VCC
0.2 VCC
V
V
VCC 2.5V
VCC < 2.5V
D4
D5
VHYS
VOL
Hysteresis of Schmitt
Trigger inputs (SDA,
SCL pins)
0.05 VCC
—
—
—
—
V
VCC 2.5V (Note 1)
Low-level output voltage
0.40
V
IOL = 3.0 mA, VCC = 4.5V
IOL = 2.1 mA, Vcc = 2.5V
D6
D7
D8
ILI
Input leakage current
Output leakage current
—
—
—
—
—
—
±1
±1
10
A
A
pF
VIN = VSS or VCC
ILO
VOUT = VSS or VCC
CIN,
Pin capacitance
VCC = 5.0V (Note 1)
COUT
(all inputs/outputs)
TA = 25°C, FCLK = 1 MHz
D9
ICC write Operating current
—
—
0.1
3
mA
VCC = 5.5V, SCL = 400 kHz
D10
D11
ICC read
0.05
400
A
ICCS
Standby current
—
—
0.01
—
1
5
A
A
Industrial
Automotive
SDA = SCL = VCC = 5.5V
A0, A1, A2, WP = VSS
Note 1: This parameter is periodically sampled and not 100% tested.
2: Typical measurements taken at room temperature.
DS21713K-page 2
2009 Microchip Technology Inc.
24AA32A/24LC32A
TABLE 1-2:
AC CHARACTERISTICS
Industrial (I):
Automotive (E):
TA = -40°C to +85°C, VCC = +1.7V to +5.5V
TA = -40°C to +125°C, VCC = +2.5V to +5.5V
AC CHARACTERISTICS
Param.
Symbol
No.
Characteristic
Clock Frequency
Min.
Max.
Units
Conditions
1
2
3
4
FCLK
THIGH
TLOW
TR
—
—
400
100
kHz 2.5V VCC 5.5V
1.7V VCC 2.5V (24AA32A)
2.5V VCC 5.5V
Clock High Time
Clock Low Time
600
4000
—
—
ns
ns
ns
1.7V VCC 2.5V (24AA32A)
1300
4700
—
—
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA32A)
SDA and SCL Rise Time
(Note 1)
—
—
300
1000
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA32A)
5
6
TF
SDA and SCL Fall Time
—
300
ns
ns
(Note 1)
THD:STA Start Condition Hold Time
600
4000
—
—
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA32A)
7
TSU:STA Start Condition Setup Time
600
4700
—
—
ns
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA32A)
8
9
THD:DAT Data Input Hold Time
TSU:DAT Data Input Setup Time
0
—
ns
ns
(Note 2)
100
250
—
—
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA32A)
10
11
12
13
14
TSU:STO Stop Condition Setup Time
600
4000
—
—
ns
ns
ns
ns
ns
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA32A)
TSU:WP
THD:WP
TAA
WP Setup Time
WP Hold Time
600
4000
—
—
2.5V VCC 5.5V
1.7V VCC < 2.5V (24AA32A)
1300
4700
—
—
2.5V VCC 5.5V
1.7V VCC < 2.5V (24AA32A)
Output Valid from Clock
—
—
900
3500
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA32A)
(Note 2)
TBUF
Bus free time: Time the bus
must be free before a new
transmission can start
1300
4700
—
—
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA32A)
15
16
17
18
TOF
TSP
TWC
—
Output Fall Time from VIH
Minimum to VIL Maximum
20+0.1CB
—
250
250
ns
ns
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA32A)
Input Filter Spike Suppression
(SDA and SCL pins)
—
50
(Notes 1 and 3)
Write Cycle Time (byte or
page)
—
5
ms
—
Endurance
1M
—
cycles Page mode, 25°C, VCC 5.5V
(Note 4)
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which can be obtained on Microchip’s web site at
www.microchip.com.
2009 Microchip Technology Inc.
DS21713K-page 3
24AA32A/24LC32A
FIGURE 1-1:
BUS TIMING DATA
5
4
D4
2
SCL
7
3
10
8
9
SDA
IN
6
16
14
12
13
SDA
OUT
(protected)
WP
11
(unprotected)
FIGURE 1-2:
BUS TIMING START/STOP
D4
SCL
SDA
6
7
10
Start
Stop
DS21713K-page 4
2009 Microchip Technology Inc.
24AA32A/24LC32A
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Name PDIP SOIC SOIJ TSSOP DFN TDFN MSOP SOT-23
CS
Description
A0
A1
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
—
—
—
2
—
—
—
2
Chip Address Input
Chip Address Input
Chip Address Input
Ground
A2
VSS
SDA
SCL
WP
VCC
3
5
Serial Address/Data I/O
Serial Clock
1
4
5
3
Write-Protect Input
+1.7V to 5.5V Power Supply
4
1
2.1
A0, A1, A2 Chip Address Inputs
2.3
Serial Clock (SCL)
The A0, A1 and A2 inputs are used by the 24XX32A for
multiple device operation. The levels on these inputs
are compared with the corresponding bits in the slave
address. The chip is selected if the comparison is true.
The SCL input is used to synchronize the data transfer
to and from the device.
2.4
Write-Protect (WP)
Up to eight devices may be connected to the same bus
by using different Chip Select bit combinations. These
inputs must be connected to either VCC or VSS.
This pin must be connected to either VSS or VCC. If tied
to VSS, write operations are enabled. If tied to VCC,
write operations are inhibited but read operations are
not affected.
In most applications, the chip address inputs A0, A1
and A2 are hard-wired to logic ‘0’ or logic ‘1’. For
applications in which these pins are controlled by a
microcontroller or other programmable device, the chip
address pins must be driven to logic ‘0’ or logic ‘1’
before normal device operation can proceed. Address
pins are not available in the SOT-23 and chip scale
packages.
2.2
Serial Data (SDA)
SDA is a bidirectional pin used to transfer addresses
and data into and out of the device. It is an open-drain
terminal, therefore, the SDA bus requires a pull-up
resistor to VCC (typical 10 k for 100 kHz, 2 k for
400 kHz)
For normal data transfer, SDA is allowed to change
only during SCL low. Changes during SCL high are
reserved for indicating Start and Stop conditions.
2009 Microchip Technology Inc.
DS21713K-page 5
24AA32A/24LC32A
4.4
Data Valid (D)
3.0
FUNCTIONAL DESCRIPTION
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
The 24XX32A supports a bidirectional, 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as transmitter, while a device
receiving data is defined as a receiver. The bus has to
be controlled by a master device which generates the
Serial Clock (SCL), controls the bus access and gener-
ates the Start and Stop conditions, while the 24XX32A
works as slave. Both master and slave can operate as
transmitter or receiver, but the master device
determines which mode is activated.
The data on the line must be changed during the low
period of the clock signal. There is one clock pulse per
bit of data.
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of data
bytes transferred between Start and Stop conditions is
determined by the master device and is, theoretically,
unlimited (although only the last thirty-two bytes will be
stored when doing a write operation). When an over-
write does occur, it will replace data in a first-in first-out
(FIFO) fashion.
4.0
BUS CHARACTERISTICS
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus
is not busy.
4.5
Acknowledge
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
Each receiving device, when addressed, is obliged to
generate an Acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse which is associated with this Acknowledge bit.
Accordingly, the following bus conditions have been
defined (Figure 4-1).
Note: The 24XX32A does not generate any
Acknowledge
bits
if
an
internal
programming cycle is in progress.
4.1
Bus Not Busy (A)
The device that acknowledges, has to pull down the
SDA line during the Acknowledge clock pulse in such a
way that the SDA line is stable low during the high
period of the Acknowledge related clock pulse. Of
course, setup and hold times must be taken into
account. During reads, a master must signal an end of
data to the slave by not generating an Acknowledge bit
on the last byte that has been clocked out of the slave.
In this case, the slave (24XX32A) will leave the data
line high to enable the master to generate the Stop
condition.
Both data and clock lines remain high.
4.2
Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
4.3
Stop Data Transfer (C)
A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.
FIGURE 4-1:
DATA TRANSFER SEQUENCE ON THE SERIAL BUS
(A)
(B)
(D)
(D)
(C) (A)
SCL
SDA
Start
Condition
Stop
Condition
Address or
Acknowledge
Valid
Data
Allowed
to Change
DS21713K-page 6
2009 Microchip Technology Inc.
24AA32A/24LC32A
an Acknowledge signal on the SDA line. Depending on
the state of the R/W bit, the 24XX32A will select a read
or write operation.
5.0
DEVICE ADDRESSING
A control byte is the first byte received following the
Start condition from the master device (Figure 5-1).
The control byte consists of a four-bit control code. For
the 24XX32A, this is set as ‘1010’ binary for read and
write operations. The next three bits of the control byte
are the Chip Select bits (A2, A1, A0). The Chip Select
bits allow the use of up to eight 24XX32A devices on
the same bus and are used to select which device is
accessed. The Chip Select bits in the control byte must
correspond to the logic levels on the corresponding A2,
A1 and A0 pins for the device to respond. These bits
are in effect the three Most Significant bits of the word
address.
FIGURE 5-1:
CONTROL BYTE FORMAT
Read/Write Bit
Chip Select
Control Code
Bits
S
1
0
1
0
A2 A1 A0 R/W ACK
Slave Address
Acknowledge Bit
Start Bit
For the SOT-23 and chip scale packages, the address
pins are not available. During device addressing, the
A1, A2, and A0 Chip Selects bits (Figure 5-2) should be
set to ‘0’.
5.1
Contiguous Addressing Across
Multiple Devices
The last bit of the control byte defines the operation to
be performed. When set to a ‘1’, a read operation is
selected. When set to a zero, a write operation is
selected. The next two bytes received define the
address of the first data byte (Figure 5-2). Because
only A11 to A0 are used, the upper four address bits are
“don’t care” bits. The upper address bits are transferred
first, followed by the Less Significant bits.
The Chip Select bits A2, A1 and A0 can be used to
expand the contiguous address space for up to 256K
bits by adding up to eight 24XX32A devices on the
same bus. In this case, software can use A0 of the con-
trol byte as address bit A12; A1 as address bit A13; and
A2 as address bit A14. It is not possible to sequentially
read across device boundaries.
Following the Start condition, the 24XX32A monitors
the SDA bus checking the device type identifier being
transmitted and, upon receiving a ‘1010’ code and
appropriate device select bits, the slave device outputs
The SOT-23 and chip scale packages do not support
multiple device addressing on the same bus.
FIGURE 5-2:
ADDRESS SEQUENCE BIT ASSIGNMENTS
Address High Byte
Control Byte
Address Low Byte
A
2
A
1
A
0
A
11
A
10
A
9
A
8
A
7
A
0
•
•
•
•
•
•
1
0
1
0
R/W
x
x
x
x
Control
Code
Chip
Select
Bits
x= “don’t care” bit
2009 Microchip Technology Inc.
DS21713K-page 7
24AA32A/24LC32A
6.2
Page Write
6.0
6.1
WRITE OPERATIONS
Byte Write
The write control byte, word address and the first data
byte are transmitted to the 24XX32A in the same way
as in a byte write. However, instead of generating a
Stop condition, the master transmits up to 31 additional
bytes which are temporarily stored in the on-chip page
buffer and will be written into memory once the master
has transmitted a Stop condition. Upon receipt of each
word, the five lower Address Pointer bits are internally
incremented by ‘1’. If the master should transmit more
than 32 bytes prior to generating the Stop condition, the
address counter will roll over and the previously
received data will be overwritten. As with the byte write
operation, once the Stop condition is received, an
internal write cycle will begin (Figure 6-2). If an attempt
is made to write to the array with the WP pin held high,
the device will acknowledge the command, but no write
cycle will occur, no data will be written, and the device
will immediately accept a new command.
Following the Start condition from the master, the
control code (4 bits), the Chip Select (3 bits), and the
R/W bit (which is a logic low) are clocked onto the bus
by the master transmitter. This indicates to the
addressed slave receiver that the address high byte
will follow once it has generated an Acknowledge bit
during the ninth clock cycle. Therefore, the next byte
transmitted by the master is the high-order byte of the
word address and will be written into the Address
Pointer of the 24XX32A. The next byte is the Least
Significant Address Byte. After receiving another
Acknowledge signal from the 24XX32A, the master
device will transmit the data word to be written into the
addressed memory location. The 24XX32A acknowl-
edges again and the master generates a Stop
condition. This initiates the internal write cycle and,
during this time, the 24XX32A will not generate
Acknowledge signals (Figure 6-1). If an attempt is
made to write to the array with the WP pin held high,
the device will acknowledge the command, but no
write cycle will occur. No data will be written and the
device will immediately accept a new command. After
a byte Write command, the internal address counter
will point to the address location following the one that
was just written.
Note:
Page write operations are limited to writing
bytes within a single physical page,
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buffer size (or
‘page size’) and end at addresses that are
integer multiples of [page size – 1]. If a
Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page as might be
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.
Note:
When doing a write of less than 32 bytes
the data in the rest of the page is refreshed
along with the data bytes being written.
This will force the entire page to endure a
write cycle, for this reason endurance is
specified per page.
6.3
Write Protection
The WP pin allows the user to write-protect the entire
array (000-FFF) when the pin is tied to VCC. If tied to
VSS the write protection is disabled. The WP pin is
sampled at the Stop bit for every Write command
(Figure 4-1). Toggling the WP pin after the Stop bit will
have no effect on the execution of the write cycle.
DS21713K-page 8
2009 Microchip Technology Inc.
24AA32A/24LC32A
FIGURE 6-1:
BYTE WRITE
S
Bus Activity
Master
T
A
R
T
S
Control
Byte
Address
High Byte
Address
T
Low Byte
Data
O
P
A AA
SDA Line
xxxx
S 1010
0
P
2 1 0
A
C
K
A
C
K
A
C
K
A
C
K
Bus Activity
x= “don’t care” bit
FIGURE 6-2:
PAGE WRITE
S
T
A
R
T
S
T
O
P
Control
Byte
Address
High Byte
Address
Low Byte
Bus Activity
Master
Data Byte 0
Data Byte 31
A A A
SDA Line
xxxx
P
S 1010
0
2 1 0
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
Bus Activity
x= “don’t care” bit
2009 Microchip Technology Inc.
DS21713K-page 9
24AA32A/24LC32A
FIGURE 7-1:
ACKNOWLEDGE POLLING
FLOW
7.0
ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a Write
command has been issued from the master, the device
initiates the internally-timed write cycle. ACK polling
can then be initiated immediately. This involves the
master sending a Start condition followed by the control
byte for a Write command (R/W = 0). If the device is still
busy with the write cycle, then no ACK will be returned.
If no ACK is returned, the Start bit and control byte must
be re-sent. If the cycle is complete, the device will
return the ACK and the master can then proceed with
the next Read or Write command. See Figure 7-1 for
flow diagram of this operation.
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
No
Yes
Next
Operation
DS21713K-page 10
2009 Microchip Technology Inc.
24AA32A/24LC32A
8.3
Sequential Read
8.0
READ OPERATION
Sequential reads are initiated in the same way as a
random read, except that once the 24XX32A transmits
the first data byte, the master issues an acknowledge
as opposed to the Stop condition used in a random
read. This acknowledge directs the 24XX32A to
transmit the next sequentially addressed 8-bit word
(Figure 8-3). Following the final byte transmitted to the
master, the master will NOT generate an acknowledge,
but will generate a Stop condition. To provide sequen-
tial reads, the 24XX32A contains an internal Address
Pointer which is incremented by ‘1’ upon completion of
each operation. This Address Pointer allows the entire
memory contents to be serially read during one
operation. The internal Address Pointer will automati-
cally roll over from address FFF to address 000 if the
master acknowledges the byte received from the array
address FFF.
Read operations are initiated in the same way as write
operations, with the exception that the R/W bit of the
control byte is set to ‘1’. There are three basic types of
read operations: current address read, random read
and sequential read.
8.1
Current Address Read
The 24XX32A contains an address counter that main-
tains the address of the last word accessed, internally
incremented by ‘1’. Therefore, if the previous read
access was to address ‘n’ (n is any legal address), the
next current address read operation would access data
from address n + 1.
Upon receipt of the control byte with R/W bit set to ‘1’,
the 24XX32A issues an acknowledge and transmits the
8-bit data word. The master will not acknowledge the
transfer, but does generate a Stop condition and the
24XX32A discontinues transmission (Figure 8-1).
8.2
Random Read
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, the word address must
first be set. This is accomplished by sending the word
address to the 24XX32A as part of a write operation
(R/W bit set to ‘0’). Once the word address is sent, the
master generates a Start condition following the
acknowledge. This terminates the write operation, but
not before the internal Address Pointer is set. The
master issues the control byte again, but with the R/W
bit set to a ‘1’. The 24XX32A will then issue an
acknowledge and transmit the 8-bit data word. The
master will not acknowledge the transfer, but does
generate a Stop condition which causes the 24XX32A
to discontinue transmission (Figure 8-2). After a
random Read command, the internal address counter
will point to the address location following the one that
was just read.
FIGURE 8-1:
CURRENT ADDRESS READ
S
T
A
R
Bus Activity
Master
Control
Byte
S
T
Data (n)
O
P
T
SDA Line
S
P
A
C
K
N
O
Bus Activity
A
C
K
2009 Microchip Technology Inc.
DS21713K-page 11
24AA32A/24LC32A
FIGURE 8-2:
RANDOM READ
S
T
A
R
T
S
T
A
R
T
Bus Activity
Master
S
T
Control
Byte
Address
High Byte
Address
Low Byte
Control
Byte
Data
Byte
O
P
A A A
2 1 0
A A A
2 1 0
SDA Line
xxxx
0
S 1010
S 1010
1
P
A
C
K
A
C
K
A
C
K
A
C
K
N
O
A
C
K
Bus Activity
x= “don’t care” bit
FIGURE 8-3:
SEQUENTIAL READ
S
Bus Activity
Master
T
Control
Data n
Byte
Data n + 1
Data n + 2
Data n + x
O
P
P
SDA Line
A
C
K
A
C
K
A
C
K
A
C
K
N
O
Bus Activity
A
C
K
DS21713K-page 12
2009 Microchip Technology Inc.
24AA32A/24LC32A
9.0
9.1
PACKAGING INFORMATION
Package Marking Information
Example:
8-Lead PDIP (300 mil)
24LC32A
XXXXXXXX
T/XXXNNN
I/P
13F
3
e
YYWW
0527
Example:
24LC32AI
8-Lead SOIC (3.90 mm)
XXXXXXXT
SN
0527
XXXXYYWW
e
3
NNN
13F
Example:
24LC32A
8-Lead SOIC (5.28 mm)
XXXXXXXX
T/XXXXXX
YYWWNNN
I/SM
052713F
e3
Example:
8-Lead TSSOP
4LA
I527
13F
XXXX
TYWW
NNN
Example:
8-Lead 2x3 DFN
264
527
13
XXX
YWW
NN
8-Lead MSOP
Example:
XXXXXT
YWWNNN
4L32AI
52713F
2009 Microchip Technology Inc.
DS21713K-page 13
24AA32A/24LC32A
Example:
8-Lead 2x3 TDFN
A64
527
I3
XXX
YWW
NN
Example:
M6NN
5-Lead SOT-23
XXNN
5-Lead Chip Scale
XW
Example:
67
1st Line Marking Codes
DFN TDFN
E Temp.
Part Number
TSSOP
MSOP
SOT-23
I Temp.
261
I Temp.
A61
E Temp.
—
I Temp.
E Temp.
—
24AA32A
24LC32A
4AA
4LA
4A32AT
4L32AT
—
B6NN
M6NN
264
265
A64
A65
N6NN
Note:
T = Temperature grade (I, E).
Legend: XX...X Part number or part number code
T
Temperature (I, E)
Y
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
YY
WW
NNN
Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
e
3
Note: For very small packages with no room for the Pb-free JEDEC designator
, the marking will only appear on the outer carton or reel label.
e
3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
Note:
Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.
*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
DS21713K-page 14
2009 Microchip Technology Inc.
24AA32A/24LC32A
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ꢀꢁ ꢂꢃꢄꢅꢀꢅ ꢃ!"ꢆꢇꢅꢃꢄ#ꢈ$ꢅ%ꢈꢆ&"ꢉꢈꢅ'ꢆꢊꢅ ꢆꢉꢊ(ꢅ)"&ꢅ'"!&ꢅ)ꢈꢅꢇꢋꢌꢆ&ꢈ#ꢅ*ꢃ&ꢍꢅ&ꢍꢈꢅꢍꢆ&ꢌꢍꢈ#ꢅꢆꢉꢈꢆꢁ
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1ꢐ,2ꢅ1ꢆ!ꢃꢌꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄꢁꢅꢙꢍꢈꢋꢉꢈ&ꢃꢌꢆꢇꢇꢊꢅꢈ$ꢆꢌ&ꢅ ꢆꢇ"ꢈꢅ!ꢍꢋ*ꢄꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ!ꢁ
ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢙꢈꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢕꢀ<1
2009 Microchip Technology Inc.
DS21713K-page 15
24AA32A/24LC32A
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆ ꢕꢄꢈꢈꢆ!ꢎꢊꢈꢋꢐꢃꢆꢑ ꢛꢒꢆMꢆꢛꢄ""ꢗ#$ꢆꢓ%&ꢔꢆꢕꢕꢆꢖꢗꢅꢘꢆꢙ !ꢏ'ꢚ
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ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ
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ꢝ.32 ꢝꢈ%ꢈꢉꢈꢄꢌꢈꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄ(ꢅ"!"ꢆꢇꢇꢊꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ(ꢅ%ꢋꢉꢅꢃꢄ%ꢋꢉ'ꢆ&ꢃꢋꢄꢅꢓ"ꢉꢓꢋ!ꢈ!ꢅꢋꢄꢇꢊꢁ
ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢙꢈꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢕꢘꢜ1
DS21713K-page 16
2009 Microchip Technology Inc.
24AA32A/24LC32A
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆ ꢕꢄꢈꢈꢆ!ꢎꢊꢈꢋꢐꢃꢆꢑ ꢛꢒꢆMꢆꢛꢄ""ꢗ#$ꢆꢓ%&ꢔꢆꢕꢕꢆꢖꢗꢅꢘꢆꢙ !ꢏ'ꢚ
ꢛꢗꢊꢃꢜ 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ
2009 Microchip Technology Inc.
DS21713K-page 17
24AA32A/24LC32A
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆ ꢕꢄꢈꢈꢆ!ꢎꢊꢈꢋꢐꢃꢆꢑ (ꢒꢆMꢆ(ꢃꢅꢋꢎꢕ$ꢆ)%*ꢀꢆꢕꢕꢆꢖꢗꢅꢘꢆꢙ !ꢏ+ꢚ
ꢛꢗꢊꢃꢜ 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ
D
N
E
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1
2
e
b
α
c
φ
A2
A
β
A1
L
6ꢄꢃ&!
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ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢅ9ꢃ'ꢃ&!
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ꢂꢃ&ꢌꢍ
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ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅꢙꢍꢃꢌ4ꢄꢈ!!
ꢐ&ꢆꢄ#ꢋ%%ꢅꢅꢏ
: ꢈꢉꢆꢇꢇꢅ>ꢃ#&ꢍ
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅ>ꢃ#&ꢍ
: ꢈꢉꢆꢇꢇꢅ9ꢈꢄꢑ&ꢍ
3ꢋꢋ&ꢅ9ꢈꢄꢑ&ꢍ
3ꢋꢋ&ꢅꢗꢄꢑꢇꢈ
9ꢈꢆ#ꢅꢙꢍꢃꢌ4ꢄꢈ!!
9ꢈꢆ#ꢅ>ꢃ#&ꢍ
ꢔꢋꢇ#ꢅꢒꢉꢆ%&ꢅꢗꢄꢑꢇꢈꢅꢙꢋꢓ
ꢔꢋꢇ#ꢅꢒꢉꢆ%&ꢅꢗꢄꢑꢇꢈꢅ1ꢋ&&ꢋ'
ꢗ
ꢀꢁꢜꢜ
ꢀꢁꢜꢘ
ꢕꢁꢕꢘ
ꢜꢁ?ꢎ
ꢘꢁꢀꢀ
ꢘꢁꢀ-
ꢕꢁꢘꢀ
ꢕꢟ
M
M
M
M
M
M
M
M
M
M
M
M
ꢎꢁꢕ-
ꢀꢁꢛ<
ꢕꢁꢎꢘ
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ꢘꢁ-<
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.ꢀ
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ꢀꢁ ꢐ:ꢚC(ꢅC.ꢚꢙꢗ5.ꢚꢗCꢅꢐ&ꢆꢄ#ꢆꢉ#(ꢅ%ꢋꢉ'ꢈꢉꢇꢊꢅꢌꢆꢇꢇꢈ#ꢅꢐ:ꢚ,ꢁ
ꢎꢁ ꢏꢅꢐꢃꢑꢄꢃ%ꢃꢌꢆꢄ&ꢅ,ꢍꢆꢉꢆꢌ&ꢈꢉꢃ!&ꢃꢌꢁ
-ꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄ!ꢅꢒꢅꢆꢄ#ꢅ.ꢀꢅ#ꢋꢅꢄꢋ&ꢅꢃꢄꢌꢇ"#ꢈꢅ'ꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢁꢅꢔꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢅ!ꢍꢆꢇꢇꢅꢄꢋ&ꢅꢈ$ꢌꢈꢈ#ꢅꢕꢁꢎꢘꢅ''ꢅꢓꢈꢉꢅ!ꢃ#ꢈꢁ
ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢙꢈꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢕꢘ?1
DS21713K-page 18
2009 Microchip Technology Inc.
24AA32A/24LC32A
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2009 Microchip Technology Inc.
DS21713K-page 19
24AA32A/24LC32A
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆ,-ꢋꢐꢆ -"ꢋꢐ.ꢆ ꢕꢄꢈꢈꢆ!ꢎꢊꢈꢋꢐꢃꢆꢑ ,ꢒꢆMꢆ/%/ꢆꢕꢕꢆꢖꢗꢅꢘꢆꢙ, !ꢇꢚ
ꢛꢗꢊꢃꢜ 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ
D
N
E
E1
NOTE 1
1
2
b
e
c
φ
A
A2
A1
L
L1
6ꢄꢃ&!
ꢔꢚ99ꢚꢔ.ꢙ.ꢝꢐ
ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢅ9ꢃ'ꢃ&!
ꢔꢚ7
7:ꢔ
ꢔꢗ;
7"')ꢈꢉꢅꢋ%ꢅꢂꢃꢄ!
ꢂꢃ&ꢌꢍ
7
ꢈ
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ꢕꢁ?ꢘꢅ1ꢐ,
: ꢈꢉꢆꢇꢇꢅ8ꢈꢃꢑꢍ&
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅꢙꢍꢃꢌ4ꢄꢈ!!
ꢐ&ꢆꢄ#ꢋ%%ꢅ
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M
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ꢕꢁꢕꢘ
M
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ꢗꢀ
.
: ꢈꢉꢆꢇꢇꢅ>ꢃ#&ꢍ
?ꢁꢖꢕꢅ1ꢐ,
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅ>ꢃ#&ꢍ
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅ9ꢈꢄꢑ&ꢍ
3ꢋꢋ&ꢅ9ꢈꢄꢑ&ꢍ
.ꢀ
ꢒ
9
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ꢎꢁꢛꢕ
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ꢖꢁꢖꢕ
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3ꢋꢋ&ꢅꢗꢄꢑꢇꢈ
9ꢈꢆ#ꢅꢙꢍꢃꢌ4ꢄꢈ!!
9ꢈꢆ#ꢅ>ꢃ#&ꢍ
9ꢀ
ꢀ
ꢀꢁꢕꢕꢅꢝ.3
ꢕꢟ
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M
M
M
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ꢕꢁꢎꢕ
ꢕꢁ-ꢕ
ꢛꢗꢊꢃꢉꢜ
ꢀꢁ ꢂꢃꢄꢅꢀꢅ ꢃ!"ꢆꢇꢅꢃꢄ#ꢈ$ꢅ%ꢈꢆ&"ꢉꢈꢅ'ꢆꢊꢅ ꢆꢉꢊ(ꢅ)"&ꢅ'"!&ꢅ)ꢈꢅꢇꢋꢌꢆ&ꢈ#ꢅ*ꢃ&ꢍꢃꢄꢅ&ꢍꢈꢅꢍꢆ&ꢌꢍꢈ#ꢅꢆꢉꢈꢆꢁ
ꢎꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄ!ꢅꢒꢅꢆꢄ#ꢅ.ꢀꢅ#ꢋꢅꢄꢋ&ꢅꢃꢄꢌꢇ"#ꢈꢅ'ꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢁꢅꢔꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢅ!ꢍꢆꢇꢇꢅꢄꢋ&ꢅꢈ$ꢌꢈꢈ#ꢅꢕꢁꢀꢘꢅ''ꢅꢓꢈꢉꢅ!ꢃ#ꢈꢁ
-ꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢃꢄꢑꢅꢆꢄ#ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢃꢄꢑꢅꢓꢈꢉꢅꢗꢐꢔ.ꢅ0ꢀꢖꢁꢘꢔꢁ
1ꢐ,2 1ꢆ!ꢃꢌꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄꢁꢅꢙꢍꢈꢋꢉꢈ&ꢃꢌꢆꢇꢇꢊꢅꢈ$ꢆꢌ&ꢅ ꢆꢇ"ꢈꢅ!ꢍꢋ*ꢄꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ!ꢁ
ꢝ.32 ꢝꢈ%ꢈꢉꢈꢄꢌꢈꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄ(ꢅ"!"ꢆꢇꢇꢊꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ(ꢅ%ꢋꢉꢅꢃꢄ%ꢋꢉ'ꢆ&ꢃꢋꢄꢅꢓ"ꢉꢓꢋ!ꢈ!ꢅꢋꢄꢇꢊꢁ
ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢙꢈꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢕ<?1
DS21713K-page 20
2009 Microchip Technology Inc.
24AA32A/24LC32A
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢆ0ꢈꢄꢊ$ꢆꢛꢗꢆꢂꢃꢄꢅꢆꢇꢄꢌ.ꢄ1ꢃꢆꢑ('ꢒꢆMꢆ*2ꢓ2ꢔ%&ꢆꢕꢕꢆꢖꢗꢅꢘꢆꢙꢍ0ꢛꢚ
ꢛꢗꢊꢃꢜ 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ
e
D
b
N
N
L
K
E2
E
EXPOSED PAD
NOTE 1
NOTE 1
2
1
1
2
D2
BOTTOM VIEW
TOP VIEW
A
NOTE 2
A3
A1
6ꢄꢃ&!
ꢔꢚ99ꢚꢔ.ꢙ.ꢝꢐ
ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢅ9ꢃ'ꢃ&!
ꢔꢚ7
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ꢕꢁꢘꢕꢅ1ꢐ,
ꢕꢁꢛꢕ
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ꢂꢃ&ꢌꢍ
: ꢈꢉꢆꢇꢇꢅ8ꢈꢃꢑꢍ&
ꢐ&ꢆꢄ#ꢋ%%ꢅ
,ꢋꢄ&ꢆꢌ&ꢅꢙꢍꢃꢌ4ꢄꢈ!!
: ꢈꢉꢆꢇꢇꢅ9ꢈꢄꢑ&ꢍ
: ꢈꢉꢆꢇꢇꢅ>ꢃ#&ꢍ
7
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ꢗ
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ꢕꢁꢕꢘ
ꢕꢁꢕꢎ
ꢕꢁꢎꢕꢅꢝ.3
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-ꢁꢕꢕꢅ1ꢐ,
M
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.
.$ꢓꢋ!ꢈ#ꢅꢂꢆ#ꢅ9ꢈꢄꢑ&ꢍ
.$ꢓꢋ!ꢈ#ꢅꢂꢆ#ꢅ>ꢃ#&ꢍ
,ꢋꢄ&ꢆꢌ&ꢅ>ꢃ#&ꢍ
,ꢋꢄ&ꢆꢌ&ꢅ9ꢈꢄꢑ&ꢍ
,ꢋꢄ&ꢆꢌ&ꢞ&ꢋꢞ.$ꢓꢋ!ꢈ#ꢅꢂꢆ#
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.ꢎ
)
9
D
ꢀꢁ-ꢕ
ꢀꢁꢘꢕ
ꢕꢁꢎꢕ
ꢕꢁ-ꢕ
ꢕꢁꢎꢕ
ꢀꢁꢘꢘ
ꢀꢁꢜꢘ
ꢕꢁ-ꢕ
ꢕꢁꢘꢕ
M
ꢕꢁꢖꢕ
M
ꢛꢗꢊꢃꢉꢜ
ꢀꢁ ꢂꢃꢄꢅꢀꢅ ꢃ!"ꢆꢇꢅꢃꢄ#ꢈ$ꢅ%ꢈꢆ&"ꢉꢈꢅ'ꢆꢊꢅ ꢆꢉꢊ(ꢅ)"&ꢅ'"!&ꢅ)ꢈꢅꢇꢋꢌꢆ&ꢈ#ꢅ*ꢃ&ꢍꢃꢄꢅ&ꢍꢈꢅꢍꢆ&ꢌꢍꢈ#ꢅꢆꢉꢈꢆꢁ
ꢎꢁ ꢂꢆꢌ4ꢆꢑꢈꢅ'ꢆꢊꢅꢍꢆ ꢈꢅꢋꢄꢈꢅꢋꢉꢅ'ꢋꢉꢈꢅꢈ$ꢓꢋ!ꢈ#ꢅ&ꢃꢈꢅ)ꢆꢉ!ꢅꢆ&ꢅꢈꢄ#!ꢁ
-ꢁ ꢂꢆꢌ4ꢆꢑꢈꢅꢃ!ꢅ!ꢆ*ꢅ!ꢃꢄꢑ"ꢇꢆ&ꢈ#ꢁ
ꢖꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢃꢄꢑꢅꢆꢄ#ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢃꢄꢑꢅꢓꢈꢉꢅꢗꢐꢔ.ꢅ0ꢀꢖꢁꢘꢔꢁ
1ꢐ,2 1ꢆ!ꢃꢌꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄꢁꢅꢙꢍꢈꢋꢉꢈ&ꢃꢌꢆꢇꢇꢊꢅꢈ$ꢆꢌ&ꢅ ꢆꢇ"ꢈꢅ!ꢍꢋ*ꢄꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ!ꢁ
ꢝ.32 ꢝꢈ%ꢈꢉꢈꢄꢌꢈꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄ(ꢅ"!"ꢆꢇꢇꢊꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ(ꢅ%ꢋꢉꢅꢃꢄ%ꢋꢉ'ꢆ&ꢃꢋꢄꢅꢓ"ꢉꢓꢋ!ꢈ!ꢅꢋꢄꢇꢊꢁ
ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢙꢈꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢀꢎ-,
2009 Microchip Technology Inc.
DS21713K-page 21
24AA32A/24LC32A
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢆ0ꢈꢄꢊ$ꢆꢛꢗꢆꢂꢃꢄꢅꢆꢇꢄꢌ.ꢄ1ꢃꢆꢑ('ꢒꢆMꢆ*2ꢓ2ꢔ%&ꢆꢕꢕꢆꢖꢗꢅꢘꢆꢙꢍ0ꢛꢚ
ꢛꢗꢊꢃꢜ 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ
DS21713K-page 22
2009 Microchip Technology Inc.
24AA32A/24LC32A
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢆ0ꢈꢄꢊ$ꢆꢛꢗꢆꢂꢃꢄꢅꢆꢇꢄꢌ.ꢄ1ꢃꢆꢑ(ꢛꢒꢆMꢆ*2ꢓ2ꢔ%3)ꢆꢕꢕꢆꢖꢗꢅꢘꢆꢙ,ꢍ0ꢛꢚ
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2009 Microchip Technology Inc.
DS21713K-page 23
24AA32A/24LC32A
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DS21713K-page 24
2009 Microchip Technology Inc.
24AA32A/24LC32A
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ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ
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ꢝ.32 ꢝꢈ%ꢈꢉꢈꢄꢌꢈꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄ(ꢅ"!"ꢆꢇꢇꢊꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ(ꢅ%ꢋꢉꢅꢃꢄ%ꢋꢉ'ꢆ&ꢃꢋꢄꢅꢓ"ꢉꢓꢋ!ꢈ!ꢅꢋꢄꢇꢊꢁ
ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢙꢈꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢀꢀꢀ1
2009 Microchip Technology Inc.
DS21713K-page 25
24AA32A/24LC32A
)ꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆ ꢕꢄꢈꢈꢆ!ꢎꢊꢈꢋꢐꢃꢆ,"ꢄꢐꢉꢋꢉꢊꢗ"ꢆꢑ!,ꢒꢆꢙ !,ꢁ*ꢓꢚ
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ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ
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ꢀꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄ!ꢅꢒꢅꢆꢄ#ꢅ.ꢀꢅ#ꢋꢅꢄꢋ&ꢅꢃꢄꢌꢇ"#ꢈꢅ'ꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢁꢅꢔꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢅ!ꢍꢆꢇꢇꢅꢄꢋ&ꢅꢈ$ꢌꢈꢈ#ꢅꢕꢁꢀꢎꢜꢅ''ꢅꢓꢈꢉꢅ!ꢃ#ꢈꢁ
ꢎꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢃꢄꢑꢅꢆꢄ#ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢃꢄꢑꢅꢓꢈꢉꢅꢗꢐꢔ.ꢅ0ꢀꢖꢁꢘꢔꢁ
1ꢐ,2 1ꢆ!ꢃꢌꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄꢁꢅꢙꢍꢈꢋꢉꢈ&ꢃꢌꢆꢇꢇꢊꢅꢈ$ꢆꢌ&ꢅ ꢆꢇ"ꢈꢅ!ꢍꢋ*ꢄꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ!ꢁ
ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢙꢈꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢕꢛꢀ1
DS21713K-page 26
2009 Microchip Technology Inc.
24AA32A/24LC32A
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2009 Microchip Technology Inc.
DS21713K-page 27
24AA32A/24LC32A
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21713K-page 28
2009 Microchip Technology Inc.
24AA32A/24LC32A
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2009 Microchip Technology Inc.
DS21713K-page 29
24AA32A/24LC32A
APPENDIX A: REVISION HISTORY
Revision D
Corrections to Section 1.0, Electrical Characteristics.
Revision E
Added DFN package.
Revision F
Revised Sections 4.3, 7.2 and 7.4.
Revision G
Replaced 2x3 DFN (MC) Package
Revision H
Changed 1.8V to 1.7V; Revised Features Section;
Replaced Package Drawings; Deleted Rotated
TSSOP; Revised Product ID Section.
Revision J
Added TDFN and SOT-23 packages; Updated
Package Drawings; Moved Pin Descriptions to Section
2.0; Renumbered Sections.
Revision K (12/2009)
Added Chip Scale Package.
DS21713K-page 30
2009 Microchip Technology Inc.
24AA32A/24LC32A
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
Technical support is available through the web site
at: http://support.microchip.com
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com, click on Customer Change
Notification and follow the registration instructions.
2009 Microchip Technology Inc.
DS21713K-page 31
24AA32A/24LC32A
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
Technical Publications Manager
Reader Response
Total Pages Sent ________
RE:
From:
Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Y
N
24AA32A/24LC32A
DS21713K
Literature Number:
Device:
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21713K-page 32
2009 Microchip Technology Inc.
24AA32A/24LC32A
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
X
/XX
PART NO.
Device
a) 24AA32A-I/P: Industrial Temperature,1.7V,
Temperature Package
Range
PDIP package
b) 24AA32A-I/SN: Industrial Temperature,1.7V,
SOIC package
2
Device:
24AA32A: 1.7V, 32 Kbit I C Serial EEPROM
24AA32AT: 1.7V, 32 Kbit I C Serial EEPROM
c) 24AA32A-I/SM: Industrial Temperature.,1.7V,
SOIJ (5.28 mm) package
2
(Tape and Reel)
d) 24AA32A-I/ST: Industrial Temperature.,1.7V,
TSSOP package
2
24LC32A: 2.5V, 32 Kbit I C Serial EEPROM
24LC32AT: 2.5V, 32 Kbit I C Serial EEPROM
2
e) 24LC32A-I/P: Industrial Temperature, 2.5V,
PDIP package
(Tape and Reel)
f)
24LC32A-E/SN: Automotive Temperature,
2.5V SOIC package
Temperature I
=
=
-40°C to +85°C
-40°C to +125°C
Range:
E
g) 24LC32A-E/SM: Automotive Temperature,
2.5V SOIJ (5.28 mm) package
Package:
P
=
Plastic DIP (300 mil body), 8-lead
Plastic SOIC (3.90 mm body), 8-lead
Plastic SOIJ (5.28 mm body), 8-lead
Plastic TSSOP (4.4 mm), 8-lead
Plastic Micro Small Outline (MSOP), 8-lead
2x3 DFN, 8-lead
TDFN (2x3x0.75mm body), 8-lead
SOT-23 (Tape and Reel only), 5-lead
Chip Scale (CS), 5-lead (I-temp, “AA” Tape
and Reel only)
h) 24LC32AT-I/ST: Industrial Temperature, 2.5V,
TSSOP package, Tape and Reel
SN
SM
ST
MS
MC
MNY
OT
=
=
=
=
=
=
=
=
(1)
(2)
CS16K
Note 1: “Y” indicates a Nickel Palladium Gold (NiPdAu) finish.
2: “16K” indicates 160K technology.
2009 Microchip Technology Inc.
DS21713K-page 33
24AA32A/24LC32A
NOTES:
DS21713K-page 34
2009 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
rfPIC and UNI/O are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
32
PICtail, PIC logo, REAL ICE, rfLAB, Select Mode, Total
Endurance, TSHARC, UniWinDriver, WiperLock and ZENA
are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2009, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
2009 Microchip Technology Inc.
DS21713K-page 35
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4080
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Boston
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Seoul
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Cleveland
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Detroit
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-6578-300
Fax: 886-3-6578-370
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Santa Clara
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
03/26/09
DS21713K-page 36
2009 Microchip Technology Inc.
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