24AA128T-I/MSG [MICROCHIP]
16K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, ROHS COMPLIANT, PLASTIC, MSOP-8;
| 型号： | 24AA128T-I/MSG |
| 厂家： | 
MICROCHIP |
| 描述： | 16K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, ROHS COMPLIANT, PLASTIC, MSOP-8 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 时钟 双倍数据速率 光电二极管 内存集成电路 |
| 文件： | 总26页 (文件大小：330K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
24AA128/24LC128/24FC128
128K I2C™ CMOS Serial EEPROM
Device Selection Table
Description
The Microchip Technology Inc. 24AA128/24LC128/
24FC128 (24XX128*) is a 16K x 8 (128 Kbit) Serial
Electrically Erasable PROM (EEPROM), capable of
operation across a broad voltage range (1.8V to 5.5V).
It has been developed for advanced, low-power
applications such as personal communications or data
acquisition. This device also has a page write capabil-
ity of up to 64 bytes of data. This device is capable of
both random and sequential reads up to the 128K
boundary. Functional address lines allow up to eight
devices on the same bus, for up to 1 Mbit address
space. This device is available in the standard 8-pin
plastic DIP, SOIC (150 and 208 mil), TSSOP, MSOP,
DFN and 14-lead TSSOP packages.
Part
Number
VCC
Range
Max. Clock
Frequency
Temp.
Ranges
24AA128
1.8-5.5V
400 kHz(1)
I
24LC128
24FC128
2.5-5.5V
1.8-5.5V
400 kHz
1 MHz(2)
I, E
I
Note 1: 100 kHz for VCC < 2.5V.
2: 400 kHz for VCC < 2.5V.
Features
• Low-power CMOS technology:
- Maximum write current 3 mA at 5.5V
- Maximum read current 400 µA at 5.5V
- Standby current 100 nA typical at 5.5V
Block Diagram
• 2-wire serial interface bus, I2C™ compatible
• Cascadable for up to eight devices
• Self-timed erase/write cycle
A0 A1 A2WP
HV Generator
• 64-byte Page Write mode available
• 5 ms max write cycle time
I/O
Control
Logic
Memory
Control
Logic
EEPROM
Array
XDEC
• Hardware write-protect for entire array
• Output slope control to eliminate ground bounce
• Schmitt Trigger inputs for noise suppression
• 1,000,000 erase/write cycles
Page Latches
I/O
SCL
YDEC
SDA
• Electrostatic discharge protection > 4000V
• Data retention > 200 years
VCC
• 8-pin PDIP, SOIC, TSSOP, MSOP and DFN
packages, 14-lead TSSOP package
Sense Amp.
R/W Control
VSS
• Standard and Pb-free finishes available
• Temperature ranges:
- Industrial (I):
- Automotive (E):
-40°C to +85°C
-40°C to +125°C
Package Types
PDIP/SOIC
TSSOP/MSOP *
TSSOP
DFN
14
1
2
3
4
5
6
7
VCC
A0
A1
A0
1
8
VCC
1
2
3
4
A0
A1
8
7
6
5
VCC
WP
1
2
8
7
A0
A1
VCC
WP
13
12
11
10
9
WP
NC
NC
NC
A1
A2
2
3
7
6
WP
NC
NC
NC
A2
A2
SCL
SDA
SCL
3
4
6
5
A2
SCL
SDA
VSS
SCL
SDA
VSS
4
5
SDA
VSS
8
VSS
Note: * Pins A0 and A1 are no-connects for the MSOP package only.
*24XX128 is used in this document as a generic part number for the 24AA128/24LC128/24FC128 devices.
2004 Microchip Technology Inc.
DS21191M-page 1
24AA128/24LC128/24FC128
1.0
ELECTRICAL CHARACTERISTICS
(†)
Absolute Maximum Ratings
VCC.............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied................................................................................................-40°C to +125°C
ESD protection on all pins ......................................................................................................................................................≥ 4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
Electrical Characteristics:
DC CHARACTERISTICS
Industrial (I):
VCC = +1.8V to 5.5V TA = -40°C to +85°C
Automotive (E): VCC = +2.5V to 5.5V TA = -40°C to 125°C
Param.
Sym.
No.
Characteristic
Min.
Max.
Units
Conditions
D1
—
A0, A1, A2, SCL, SDA, and
WP pins:
—
—
—
—
—
D2
D3
VIH
VIL
High-level input voltage
Low-level input voltage
0.7 VCC
—
—
V
0.3 VCC
0.2 VCC
V
V
VCC ≥ 2.5V
VCC < 2.5V
D4
D5
D6
VHYS
VOL
ILI
Hysteresis of Schmitt Trigger 0.05 VCC
inputs (SDA, SCL pins)
—
0.40
±1
V
VCC ≥ 2.5V (Note 1)
Low-level output voltage
Input leakage current
Output leakage current
—
V
IOL = 3.0 mA @ VCC = 4.5V
IOL = 2.1 mA @ VCC = 2.5V
—
µA
VIN = VSS or VCC, WP = VSS
VIN = VSS or VCC, WP = VCC
D7
D8
ILO
—
—
±1
10
µA
VOUT = VSS or VCC
CIN,
Pin capacitance
pF
VCC = 5.0V (Note 1)
COUT
(all inputs/outputs)
TA = 25°C, fC = 1 MHz
D9
ICC Read Operating current
ICC Write
—
—
—
400
3
µA
mA
µA
VCC = 5.5V, SCL = 400 kHz
VCC = 5.5V
D10
ICCS
Standby current
1
TA = -40°C to +85°C
SCL = SDA = VCC = 5.5V
A0, A1, A2, WP = VSS
—
5
µA
TA = -40°C to 125°C
SCL = SDA = VCC = 5.5V
A0, A1, A2, WP = VSS
Note 1: This parameter is periodically sampled and not 100% tested.
DS21191M-page 2
2004 Microchip Technology Inc.
24AA128/24LC128/24FC128
TABLE 1-2:
AC CHARACTERISTICS
Electrical Characteristics:
AC CHARACTERISTICS
Param.
Industrial (I):
VCC = +1.8V to 5.5V TA = -40°C to +85°C
Automotive (E): VCC = +2.5V to 5.5V TA = -40°C to 125°C
Sym.
Characteristic
Min.
Max.
Units
Conditions
No.
1
2
3
4
FCLK
Clock frequency
—
—
—
—
100
400
400
kHz 1.8V ≤ VCC < 2.5V
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V 24FC128
2.5V ≤ VCC ≤ 5.5V 24FC128
1000
THIGH Clock high time
TLOW Clock low time
4000
600
600
500
—
—
—
—
ns
ns
ns
1.8V ≤ VCC < 2.5V
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V 24FC128
2.5V ≤ VCC ≤ 5.5V 24FC128
4700
1300
1300
500
—
—
—
—
1.8V ≤ VCC < 2.5V
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V 24FC128
2.5V ≤ VCC ≤ 5.5V 24FC128
TR
TF
SDA and SCL rise time
(Note 1)
—
—
—
1000
300
300
1.8V ≤ VCC < 2.5V
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC ≤ 5.5V 24FC128
5
6
SDA and SCL fall time
(Note 1)
—
—
300
100
ns
ns
All except, 24FC128
1.8V ≤ VCC ≤ 5.5V 24FC128
THD:ST Start condition hold time
A
4000
600
600
250
—
—
—
—
1.8V ≤ VCC < 2.5V
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V 24FC128
2.5V ≤ VCC ≤ 5.5V 24FC128
7
TSU:ST Start condition setup time
A
4700
600
600
250
—
—
—
—
ns
1.8V ≤ VCC < 2.5V
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V 24FC128
2.5V ≤ VCC ≤ 5.5V 24FC128
8
9
THD:DA Data input hold time
T
0
—
ns
ns
(Note 2)
TSU:DA Data input setup time
T
250
100
100
—
—
—
1.8V ≤ VCC < 2.5V
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC ≤ 5.5V 24FC128
10
11
TSU:ST Stop condition setup time
O
4000
600
600
250
—
—
—
—
ns
ns
1.8 V ≤ VCC < 2.5V
2.5 V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V 24FC128
2.5 V ≤ VCC ≤ 5.5V 24FC128
TSU:WP WP setup time
4000
600
600
—
—
—
1.8V ≤ VCC < 2.5V
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC ≤ 5.5V 24FC128
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs, which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model, which can be obtained from Microchip’s web site:
www.microchip.com.
2004 Microchip Technology Inc.
DS21191M-page 3
24AA128/24LC128/24FC128
TABLE 1-2:
AC CHARACTERISTICS (CONTINUED)
Electrical Characteristics:
AC CHARACTERISTICS
Param.
Industrial (I): VCC = +1.8V to 5.5V TA = -40°C to +85°C
Automotive (E): VCC = +2.5V to 5.5V TA = -40°C to 125°C
Sym.
Characteristic
Min.
Max.
Units
Conditions
No.
12
THD:WP WP hold time
4700
1300
1300
—
—
—
ns
1.8V ≤ VCC < 2.5V
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC ≤ 5.5V 24FC128
13
14
15
TAA
Output valid from clock
(Note 2)
—
—
—
—
3500
900
900
400
ns
ns
ns
1.8V ≤ VCC < 2.5V
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V 24FC128
2.5V ≤ VCC ≤ 5.5V 24FC128
TBUF
TOF
Bus free time: Time the bus
must be free before a new
transmission can start
4700
1300
1300
500
—
—
—
—
1.8V ≤ VCC < 2.5V
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V 24FC128
2.5V ≤ VCC ≤ 5.5V 24FC128
Output fall time from VIH
minimum to VIL maximum
CB ≤ 100 pF
10 + 0.1CB
250
250
All except, 24FC128 (Note 1)
24FC128 (Note 1)
16
17
18
TSP
TWC
—
Input filter spike suppression
(SDA and SCL pins)
—
—
50
5
ns
All except, 24FC128 (Notes 1
and 3)
Write cycle time (byte or
page)
ms
—
Endurance
1,000,000
—
cycles 25°C (Note 4)
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs, which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model, which can be obtained from Microchip’s web site:
www.microchip.com.
FIGURE 1-1:
BUS TIMING DATA
5
4
D4
2
SCL
7
3
10
8
9
SDA
IN
6
16
14
12
13
SDA
OUT
(protected)
WP
11
(unprotected)
DS21191M-page 4
2004 Microchip Technology Inc.
24AA128/24LC128/24FC128
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Name
PIN FUNCTION TABLE
8-pin
PDIP
8-pin
SOIC
8-pin
TSSOP
14-pin
TSSOP
8-pin
MSOP
8-pin
DFN
Function
A0
1
2
1
2
1
2
1
—
—
1, 2
3
1
2
User Configurable Chip Select
User Configurable Chip Select
Not Connected
A1
2
(NC)
A2
—
3
—
3
—
3
3, 4, 5
—
3
6
User Configurable Chip Select
Ground
VSS
SDA
SCL
(NC)
WP
VCC
4
4
4
7
4
4
5
5
5
8
5
5
Serial Data
6
6
6
9
10, 11,12
13
6
6
Serial Clock
—
7
—
7
—
7
—
7
—
7
Not Connected
Write-Protect Input
8
8
8
14
8
8
+1.8V to 5.5V (24AA128)
+2.5V to 5.5V (24LC128)
+1.8V to 5.5V (24FC128)
2.1
A0, A1, A2 Chip Address Inputs
2.3
Serial Clock (SCL)
The A0, A1 and A2 inputs are used by the 24XX128 for
multiple device operations. The levels on these inputs
are compared with the corresponding bits in the slave
address. The chip is selected if the compare is true.
This input is used to synchronize the data transfer to
and from the device.
2.4
Write-Protect (WP)
For the MSOP package only, pins A0 and A1 are not
connected.
This pin can be connected to either VSS, VCC or left
floating. Internal pull-down circuitry on this pin will keep
the device in the unprotected state if left floating. If tied
to VSS or left floating, normal memory operation is
enabled (read/write the entire memory 0000-3FFF).
Up to eight devices (two for the MSOP package) may
be connected to the same bus by using different Chip
Select bit combinations. If these pins are left uncon-
nected, the inputs will be pulled down internally to
VSS. If they are tied to VCC or driven high, the internal
pull-down circuitry is disabled.
If tied to VCC, write operations are inhibited. Read
operations are not affected.
In most applications, the chip address inputs A0, A1,
and A2 are hard-wired to logic ‘0’ or logic ‘1’. For
applications in which these pins are controlled by a
microcontroller or other programmable device, the chip
address pins must be driven to logic ‘0’ or logic ‘1’
before normal device operation can proceed.
3.0
FUNCTIONAL DESCRIPTION
The 24XX128 supports a bidirectional 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as a transmitter and a device
receiving data as a receiver. The bus must be
controlled by a master device which generates the
serial clock (SCL), controls the bus access and
generates the Start and Stop conditions while the
24XX128 works as a slave. Both master and slave can
operate as a transmitter or receiver, but the master
device determines which mode is activated.
2.2
Serial Data (SDA)
This is a bidirectional pin used to transfer addresses
and data into and out of the device. It is an open drain
terminal. Therefore, the SDA bus requires a pull-up
resistor to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for
400 kHz and 1 MHz).
For normal data transfer, SDA is allowed to change
only during SCL low. Changes during SCL high are
reserved for indicating the Start and Stop conditions.
2004 Microchip Technology Inc.
DS21191M-page 5
24AA128/24LC128/24FC128
The data on the line must be changed during the low
period of the clock signal. There is one bit of data per
clock pulse.
4.0
BUS CHARACTERISTICS
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus
is not busy.
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of the
data bytes transferred between the Start and Stop
conditions is determined by the master device.
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
4.5
Acknowledge
Accordingly, the following bus conditions have been
defined (Figure 4-1).
Each receiving device, when addressed, is obliged to
generate an Acknowledge signal after the reception of
each byte. The master device must generate an extra
clock pulse, which is associated with this Acknowledge
bit.
4.1
Bus not Busy (A)
Both data and clock lines remain high.
Note: The 24XX128 does not generate any
Acknowledge bits if an internal
programming cycle is in progress.
4.2
Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
A device that acknowledges must pull down the SDA
line during the acknowledge clock pulse in such a way
that the SDA line is stable low during the high period of
the acknowledge related clock pulse. Of course, setup
and hold times must be taken into account. During
reads, a master must signal an end of data to the slave
by NOT generating an Acknowledge bit on the last byte
that has been clocked out of the slave. In this case, the
slave (24XX128) will leave the data line high to enable
the master to generate the Stop condition.
4.3
Stop Data Transfer (C)
A low-to-high transition of the SDA line, while the clock
(SCL) is high, determines a Stop condition. All
operations must end with a Stop condition.
4.4
Data Valid (D)
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
FIGURE 4-1:
DATA TRANSFER SEQUENCE ON THE SERIAL BUS
(A)
(B)
(D)
(D)
(C) (A)
SCL
SDA
Start
Condition
Address or
Acknowledge
Valid
Data
Allowed
to Change
Stop
Condition
FIGURE 4-2:
ACKNOWLEDGE TIMING
Acknowledge
Bit
1
2
3
4
5
6
7
8
9
1
2
3
SCL
SDA
Data from transmitter
Data from transmitter
Transmitter must release the SDA line at this point,
allowing the Receiver to pull the SDA line low to
acknowledge the previous eight bits of data.
Receiver must release the SDA line
at this point so the Transmitter can
continue sending data.
DS21191M-page 6
2004 Microchip Technology Inc.
24AA128/24LC128/24FC128
FIGURE 5-1:
CONTROL BYTE
FORMAT
5.0
DEVICE ADDRESSING
A control byte is the first byte received following the
Start condition from the master device (Figure 5-1).
The control byte consists of a 4-bit control code. For the
24XX128, this is set as ‘1010’ binary for read and write
operations. The next three bits of the control byte are
the Chip Select bits (A2, A1, A0). The Chip Select bits
allow the use of up to eight 24XX128 devices on the
same bus and are used to select which device is
accessed. The Chip Select bits in the control byte must
correspond to the logic levels on the corresponding A2,
A1 and A0 pins for the device to respond. These bits
are, in effect, the three Most Significant bits of the word
address.
Read/Write Bit
Chip Select
Bits
Control Code
S
1
0
1
0
A2 A1 A0 R/W ACK
Slave Address
Start Bit
Acknowledge Bit
5.1
Contiguous Addressing Across
Multiple Devices
For the MSOP package, the A0 and A1 pins are not
connected. During device addressing, the A0 and A1
Chip Select bits (Figures 5-1 and 5-2) should be set to
‘0’. Only two 24XX128 MSOP packages can be
connected to the same bus.
The Chip Select bits A2, A1,and A0 can be used to
expand the contiguous address space for up to 1 Mbit
by adding up to eight 24XX128s on the same bus. In
this case, software can use A0 of the control byte as
address bit A14; A1 as address bit A15; and A2 as
address bit A16. It is not possible to sequentially read
across device boundaries.
The last bit of the control byte defines the operation to
be performed. When set to a one, a read operation is
selected. When set to a zero, a write operation is
selected. The next two bytes received define the
address of the first data byte (Figure 5-2). Because
only A13…A0 are used, the upper two address bits are
“don’t care” bits. The upper address bits are transferred
first, followed by the less significant bits.
For the MSOP package, up to two 24XX128 devices
can be added for up to 256 Kbit of address space. In
this case, software can use A2 of the control byte as
address bit A16. Bits A0 (A14) and A1 (A15) of the
control byte must always be set to logic ‘0’ for the
MSOP.
Following the Start condition, the 24XX128 monitors
the SDA bus checking the device type identifier being
transmitted. Upon receiving a ‘1010’ code and
appropriate device select bits, the slave device outputs
an Acknowledge signal on the SDA line. Depending on
the state of the R/W bit, the 24XX128 will select a read
or write operation.
FIGURE 5-2:
ADDRESS SEQUENCE BIT ASSIGNMENTS
Control Byte
Address High Byte
Address Low Byte
A
A
13
A
2
A
1
A
0
A
A
10
A
9
A
8
A
7
A
0
•
•
•
•
•
•
1
0
1
0
R/W
X
X
12 11
Control
Code
Chip
Select
Bits
X = don’t care bit
2004 Microchip Technology Inc.
DS21191M-page 7
24AA128/24LC128/24FC128
master should transmit more than 64 bytes prior to
generating the Stop condition, the address counter will
roll over and the previously received data will be over-
written. As with the byte write operation, once the Stop
condition is received, an internal write cycle will begin
(Figure 6-2). If an attempt is made to write to the array
with the WP pin held high, the device will acknowledge
the command, but no write cycle will occur, no data will
be written and the device will immediately accept a new
command.
6.0
6.1
WRITE OPERATIONS
Byte Write
Following the Start condition from the master, the
control code (four bits), the Chip Select (three bits) and
the R/W bit (which is a logic low) are clocked onto the
bus by the master transmitter. This indicates to the
addressed slave receiver that the address high byte will
follow after it has generated an Acknowledge bit during
the ninth clock cycle. Therefore, the next byte
transmitted by the master is the high-order byte of the
word address and will be written into the address
pointer of the 24XX128. The next byte is the Least
Significant Address Byte. After receiving another
Acknowledge signal from the 24XX128, the master
device will transmit the data word to be written into the
addressed memory location. The 24XX128 acknowl-
edges again and the master generates a Stop
condition. This initiates the internal write cycle and
during this time, the 24XX128 will not generate
Acknowledge signals (Figure 6-1). If an attempt is
made to write to the array with the WP pin held high, the
device will acknowledge the command, but no write
cycle will occur, no data will be written, and the device
will immediately accept a new command. After a byte
Write command, the internal address counter will point
to the address location following the one that was just
written.
6.3
Write-Protection
The WP pin allows the user to write-protect the entire
array (0000-3FFF) when the pin is tied to VCC. If tied to
VSS or left floating, the write protection is disabled. The
WP pin is sampled at the Stop bit for every Write
command (Figure 1-1). Toggling the WP pin after the
Stop bit will have no effect on the execution of the write
cycle.
Note: Page write operations are limited to
writing bytes within a single physical
page, regardless of the number of
bytes actually being written. Physical
page boundaries start at addresses
that are integer multiples of the page
buffer size (or ‘page size’) and end at
addresses that are integer multiples of
[page size - 1]. If a Page Write
command attempts to write across a
physical page boundary, the result is
that the data wraps around to the
beginning of the current page (over-
writing data previously stored there),
instead of being written to the next
page, as might be expected. It is,
therefore, necessary for the applica-
tion software to prevent page write
operations that would attempt to cross
a page boundary.
6.2
Page Write
The write control byte, word address, and the first data
byte are transmitted to the 24XX128 in much the same
way as in a byte write. The exception is that instead of
generating a Stop condition, the master transmits up to
63 additional bytes, which are temporarily stored in the
on-chip page buffer, and will be written into memory
once the master has transmitted a Stop condition.
Upon receipt of each word, the six lower address
pointer bits are internally incremented by ‘1’. If the
FIGURE 6-1:
BYTE WRITE
S
BUS ACTIVITY
MASTER
T
A
R
T
S
Control
Byte
Address
High Byte
Address
Low Byte
T
Data
O
P
A A A
SDA LINE
X X
S 1 0 1 0
0
P
2 1 0
A
C
K
A
C
K
A
C
K
A
C
K
BUS ACTIVITY
X = don’t care bit
FIGURE 6-2:
PAGE WRITE
S
T
A
R
T
S
T
O
P
Control
Byte
Address
High Byte
Address
Low Byte
BUS ACTIVITY
MASTER
Data Byte 0
Data Byte 63
A A A
SDA LINE
X X
P
S 1 0 1 0
0
2 1 0
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
BUS ACTIVITY
X = don’t care bit
DS21191M-page 8
2004 Microchip Technology Inc.
24AA128/24LC128/24FC128
FIGURE 7-1:
ACKNOWLEDGE
POLLING FLOW
7.0
ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (This feature can be used to maximize bus
throughput). Once the Stop condition for a Write
command has been issued from the master, the device
initiates the internally timed write cycle. ACK polling
can be initiated immediately. This involves the master
sending a Start condition, followed by the control byte
for a Write command (R/W = 0). If the device is still
busy with the write cycle, then no ACK will be returned.
If no ACK is returned, the Start bit and control byte must
be resent. If the cycle is complete, then the device will
return the ACK and the master can then proceed with
the next Read or Write command. See Figure 7-1 for
flow diagram.
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
No
Yes
Next
Operation
2004 Microchip Technology Inc.
DS21191M-page 9
24AA128/24LC128/24FC128
8.2
Random Read
8.0
READ OPERATION
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, the word address must first
be set. This is done by sending the word address to the
24XX128 as part of a write operation (R/W bit set to
‘0’). Once the word address is sent, the master gener-
ates a Start condition following the acknowledge. This
terminates the write operation, but not before the inter-
nal address pointer is set. The master then issues the
control byte again, but with the R/W bit set to a ‘1’. The
24XX128 will then issue an acknowledge and transmit
the 8-bit data word. The master will not acknowledge
the transfer but does generate a Stop condition, which
causes the 24XX128 to discontinue transmission
(Figure 8-2). After a random Read command, the
internal address counter will point to the address
location following the one that was just read.
Read operations are initiated in much the same way as
write operations with the exception that the R/W bit of
the control byte is set to ‘1’. There are three basic types
of read operations: current address read, random read
and sequential read.
8.1
Current Address Read
The 24XX128 contains an address counter that main-
tains the address of the last word accessed, internally
incremented by ‘1’. Therefore, if the previous read
access was to address ‘n’ (nis any legal address), the
next current address read operation would access data
from address n + 1.
Upon receipt of the control byte with R/W bit set to ‘1’,
the 24XX128 issues an acknowledge and transmits the
8-bit data word. The master will not acknowledge the
transfer, but does generate a Stop condition and the
24XX128 discontinues transmission (Figure 8-1).
8.3
Sequential Read
Sequential reads are initiated in the same way as a
random read except that after the 24XX128 transmits
the first data byte, the master issues an acknowledge
as opposed to the Stop condition used in a random
read. This acknowledge directs the 24XX128 to
transmit the next sequentially addressed 8-bit word
(Figure 8-3). Following the final byte transmitted to the
master, the master will NOT generate an acknowledge
but will generate a Stop condition. To provide
sequential reads, the 24XX128 contains an internal
address pointer which is incremented by one at the
completion of each operation. This address pointer
allows the entire memory contents to be serially read
during one operation. The internal address pointer will
automatically roll over from address 3FFF to address
0000 if the master acknowledges the byte received
from the array address 3FFF.
FIGURE 8-1:
CURRENT ADDRESS
READ
S
T
A
R
T
S
T
O
P
BUS ACTIVITY
MASTER
Control
Byte
Data
Byte
A A A
2 1 0
SDA LINE
S 1 0 1 0
1
P
A
C
K
N
O
BUS ACTIVITY
A
C
K
FIGURE 8-2:
RANDOM READ
S
T
A
R
T
S
BUS ACTIVITY
MASTER
T
A
R
T
S
T
O
P
Control
Byte
Address
High Byte
Address
Low Byte
Control
Byte
Data
Byte
A A A
2 1 0
A A A
2 1 0
SDA LINE
X X
S 1 0 1 0
0
S 1 0 1 0
1
P
N
O
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
BUS ACTIVITY
X = don’t care bit
FIGURE 8-3:
SEQUENTIAL READ
S
Control
Byte
BUS ACTIVITY
MASTER
T
Data (n)
Data (n + 1)
Data (n + X)
Data (n + 2)
O
P
P
SDA LINE
N
O
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
BUS ACTIVITY
DS21191M-page 10
2004 Microchip Technology Inc.
24AA128/24LC128/24FC128
9.0
9.1
PACKAGING INFORMATION
Package Marking Information
8-Lead PDIP (300 mil)
Example:
24AA128
I/P017
0310
XXXXXXXX
T/XXXNNN
YYWW
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
T/XXYYWW
24LC128
I/SN0310
NNN
017
8-Lead SOIC (208 mil)
Example:
XXXXXXXX
T/XXXXXX
YYWWNNN
24LC128
I/SM
0310017
Example:
8-Lead TSSOP
XXXX
TYWW
4LC
I301
NNN
017
2004 Microchip Technology Inc.
DS21191M-page 11
24AA128/24LC128/24FC128
Package Marking Information (Continued)
8-Lead MSOP
Example:
XXXXXT
4L128I
101017
YWWNNN
8-Lead DFN-S
Example:
24LC128
XXXXXXX
T/XXXXX
YYWW
I/MF
YYWW
NNN
NNN
14-Lead TSSOP
Example:
XXXXXXXT
YYWW
24LC128I
0110
NNN
017
Legend: XX...X Customer specific information*
T
Temperature grade (I, E)
Y
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
YY
WW
NNN
Note:In the event the full Microchip part number cannot be marked on one line, it will be
carried over to the next line thus limiting the number of available characters for customer
specific information.
*Standard device marking consists of Microchip part number, year code, week code, and traceability code. For
device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office.
TSSOP Package Codes
MSOP Package Codes
Part No.
24AA128
24LC128
24FC128
STD
4AC
4LC
4FC
Pb-free
STD
Pb-free
G4AC
G4LC
G4FC
G4AC
G4LC
G4FC
4A128
4L128
4F128
DS21191M-page 12
2004 Microchip Technology Inc.
24AA128/24LC128/24FC128
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
1
n
α
E
A2
A
L
c
A1
β
B1
B
p
eB
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.100
.155
.130
2.54
Top to Seating Plane
A
.140
.170
3.56
2.92
3.94
3.30
4.32
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
A2
A1
E
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
.145
3.68
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
.313
.250
.373
.130
.012
.058
.018
.370
10
.325
.260
.385
.135
.015
.070
.022
.430
15
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
E1
D
Tip to Seating Plane
Lead Thickness
L
c
Upper Lead Width
B1
B
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
§
eB
α
β
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
2004 Microchip Technology Inc.
DS21191M-page 13
24AA128/24LC128/24FC128
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
h
α
45°
c
A2
A
φ
β
L
A1
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
1.27
Overall Height
A
.053
.069
1.35
1.32
1.55
1.42
0.18
6.02
3.91
4.90
0.38
0.62
4
1.75
Molded Package Thickness
Standoff
A2
A1
E
.052
.004
.228
.146
.189
.010
.019
0
.061
.010
.244
.157
.197
.020
.030
8
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
§
0.10
5.79
3.71
4.80
0.25
0.48
0
Overall Width
Molded Package Width
Overall Length
E1
D
Chamfer Distance
Foot Length
h
L
φ
Foot Angle
c
Lead Thickness
Lead Width
.008
.013
0
.009
.017
12
.010
.020
15
0.20
0.33
0
0.23
0.42
12
0.25
0.51
15
B
α
Mold Draft Angle Top
Mold Draft Angle Bottom
β
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
DS21191M-page 14
2004 Microchip Technology Inc.
24AA128/24LC128/24FC128
8-Lead Plastic Small Outline (SM) – Medium, 208 mil (SOIC)
E
E1
p
D
2
1
n
B
α
c
A2
A
φ
A1
L
β
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.050
.075
.074
.005
.313
.208
.205
.025
4
1.27
Overall Height
A
.070
.080
1.78
1.75
1.97
1.88
0.13
7.95
5.28
5.21
0.64
4
2.03
Molded Package Thickness
Standoff
A2
A1
E
.069
.002
.300
.078
.010
.325
.212
.210
.030
8
1.98
0.25
8.26
5.38
5.33
0.76
8
§
0.05
7.62
5.11
5.13
0.51
0
Overall Width
Molded Package Width
Overall Length
E1
D
.201
.202
.020
0
Foot Length
L
φ
Foot Angle
c
Lead Thickness
Lead Width
.008
.014
0
.009
.017
12
.010
.020
15
0.20
0.36
0
0.23
0.43
12
0.25
0.51
15
B
α
Mold Draft Angle Top
Mold Draft Angle Bottom
β
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
Drawing No. C04-056
2004 Microchip Technology Inc.
DS21191M-page 15
24AA128/24LC128/24FC128
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
E
E1
p
D
2
1
n
B
α
A
c
A1
A2
φ
β
L
Units
INCHES
NOM
MILLIMETERS*
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.026
0.65
Overall Height
A
.043
1.10
0.95
0.15
6.50
4.50
3.10
0.70
8
Molded Package Thickness
Standoff
A2
A1
E
.033
.035
.004
.251
.173
.118
.024
4
.037
.006
.256
.177
.122
.028
8
0.85
0.05
0.90
0.10
6.38
4.40
3.00
0.60
4
§
.002
.246
.169
.114
.020
0
Overall Width
6.25
4.30
2.90
0.50
0
Molded Package Width
Molded Package Length
Foot Length
E1
D
L
φ
Foot Angle
c
Lead Thickness
.004
.007
0
.006
.010
5
.008
.012
10
0.09
0.19
0
0.15
0.25
5
0.20
0.30
10
Lead Width
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
0
5
10
0
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086
DS21191M-page 16
2004 Microchip Technology Inc.
24AA128/24LC128/24FC128
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
E
E1
p
D
2
1
n
B
α
A
c
φ
A1
A2
β
L
Units
INCHES
NOM
MILLIMETERS*
Dimension Limits
MIN
MAX
MIN
NOM
14
MAX
n
p
Number of Pins
Pitch
14
.026
0.65
Overall Height
A
.043
1.10
0.95
0.15
6.50
4.50
5.10
0.70
8
Molded Package Thickness
Standoff
A2
A1
E
.033
.002
.246
.169
.193
.020
0
.035
.004
.251
.173
.197
.024
4
.037
.006
.256
.177
.201
.028
8
0.85
0.05
0.90
0.10
6.38
4.40
5.00
0.60
4
§
Overall Width
6.25
4.30
4.90
0.50
0
Molded Package Width
Molded Package Length
Foot Length
E1
D
L
φ
Foot Angle
c
Lead Thickness
.004
.007
0
.006
.010
5
.008
.012
10
0.09
0.19
0
0.15
0.25
5
0.20
0.30
10
Lead Width
B
α
Mold Draft Angle Top
Mold Draft Angle Bottom
β
0
5
10
0
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-087
2004 Microchip Technology Inc.
DS21191M-page 17
24AA128/24LC128/24FC128
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
E
E1
p
D
2
B
n
1
α
A2
A
c
φ
A1
(F)
L
β
Units
Dimension Limits
INCHES
NOM
MILLIMETERS*
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.026 BSC
0.65 BSC
Overall Height
A
A2
A1
E
-
-
.043
-
-
0.85
-
1.10
Molded Package Thickness
Standoff
.030
.000
.033
-
.037
.006
0.75
0.95
0.15
0.00
Overall Width
.193 TYP.
4.90 BSC
Molded Package Width
Overall Length
Foot Length
E1
D
.118 BSC
.118 BSC
3.00 BSC
3.00 BSC
L
.016
.024
.037 REF
.031
0.40
0.60
0.95 REF
0.80
Footprint (Reference)
Foot Angle
F
φ
c
0°
.003
.009
5°
-
8°
.009
.016
15°
0°
0.08
0.22
5°
-
-
-
-
-
8°
0.23
0.40
15°
Lead Thickness
Lead Width
.006
B
α
β
.012
Mold Draft Angle Top
Mold Draft Angle Bottom
*Controlling Parameter
Notes:
-
-
5°
15°
5°
15°
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC Equivalent: MO-187
Drawing No. C04-111
DS21191M-page 18
2004 Microchip Technology Inc.
24AA128/24LC128/24FC128
8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S)
E
p
B
E1
n
L
R
D1
D
D2
PIN 1
EXPOSED
METAL
PADS
ID
1
2
E2
BOTTOM VIEW
TOP VIEW
α
A2
A3
A
A1
Units
Dimension Limits
INCHES
MILLIMETERS*
MIN
NOM
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.050 BSC
1.27 BSC
0.85
Overall Height
A
A2
A1
A3
E
.033
.039
1.00
Molded Package Thickness
Standoff
.026
.0004
.031
.002
0.65
0.80
0.05
.000
.152
0.00
0.01
0.20 REF.
Base Thickness
Overall Length
.008 REF.
.194 BSC
.184 BSC
.158
4.92 BSC
4.67 BSC
Molded Package Length
Exposed Pad Length
Overall Width
E1
E2
D
.163
3.85
4.00
4.15
.236 BSC
.226 BSC
.091
5.99 BSC
5.74 BSC
Molded Package Width
Exposed Pad Width
Lead Width
D1
D2
B
.085
.014
.020
.097
.019
.030
2.16
0.35
0.50
2.31
2.46
0.47
0.75
.016
0.40
0.60
.356
Lead Length
L
.024
Tie Bar Width
R
.014
α
Mold Draft Angle Top
12
12
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC equivalent: pending
Drawing No. C04-113
2004 Microchip Technology Inc.
DS21191M-page 19
24AA128/24LC128/24FC128
APPENDIX A: REVISION HISTORY
Revision L
Corrections to Section 1.0, Electrical Characteristics.
Revision M
Added 1.8V 400 kHz option for 24FC128.
DS21191M-page 20
2004 Microchip Technology Inc.
24AA128/24LC128/24FC128
ON-LINE SUPPORT
SYSTEMS INFORMATION AND
UPGRADE HOT LINE
Microchip provides on-line support on the Microchip
World Wide Web site.
The Systems Information and Upgrade Line provides
system users a listing of the latest versions of all of
Microchip's development systems software products.
Plus, this line provides information on how customers
can receive the most current upgrade kits. The Hot Line
Numbers are:
The web site is used by Microchip as a means to make
files and information easily available to customers. To
view the site, the user must have access to the Internet
and a web browser, such as Netscape® or Microsoft®
Internet Explorer. Files are also available for FTP
download from our FTP site.
1-800-755-2345 for U.S. and most of Canada, and
1-480-792-7302 for the rest of the world.
Connecting to the Microchip Internet
Web Site
042003
The Microchip web site is available at the following
URL:
www.microchip.com
The file transfer site is available by using an FTP
service to connect to:
ftp://ftp.microchip.com
The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User's Guides, Articles and Sample Programs. A vari-
ety of Microchip specific business information is also
available, including listings of Microchip sales offices,
distributors and factory representatives. Other data
available for consideration is:
• Latest Microchip Press Releases
• Technical Support Section with Frequently Asked
Questions
• Design Tips
• Device Errata
• Job Postings
• Microchip Consultant Program Member Listing
• Links to other useful web sites related to
Microchip Products
• Conferences for products, Development Systems,
technical information and more
• Listing of seminars and events
2004 Microchip Technology Inc.
DS21191M-page 21
24AA128/24LC128/24FC128
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
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24AA128/24LC128/24FC128
DS21191M
Literature Number:
Device:
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21191M-page 22
2004 Microchip Technology Inc.
24AA128/24LC128/24FC128
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X
/XX
X
a) 24AA128-I/P:
Industrial Temp.,
Temperature
Range
Package
Lead
Finish
1.8V, PDIP package.
b) 24AA128T-I/SN: Tape and Reel,
Industrial Temp., 1.8V, SOIC
package.
Device:
24AA128:
128 Kbit 1.8V I2C Serial
EEPROM
c) 24AA128-I/ST:
Industrial Temp.,
24AA128T: 128 Kbit 1.8V I2C Serial
1.8V, TSSOP package.
EEPROM (Tape and Reel)
128 Kbit 2.5V I2C Serial
EEPROM
d) 24AA128-I/MS: Industrial Temp.,
1.8V, MSOP package.
24LC128:
24LC128T: 128 Kbit 2.5V I2C Serial
EEPROM (Tape and Reel)
24FC128:
e) 24LC128-E/P:
Extended Temp.,
2.5V, PDIP package.
128 Kbit High Speed I2C Serial
EEPROM
f) 24LC128-I/SN: Industrial Temp.,
2.5V, SOIC package.
24FC128T: 128 Kbit High Speed I2C Serial
EEPROM (Tape and Reel)
g) 24LC128T-I/SN: Tape and Reel,
Industrial Temp., 2.5V, SOIC
package.
Temperature
Range:
I
E
=
=
-40°C to +85°C
-40°C to +125°C
h) 24LC128-I/MS: Industrial Temp.,
2.5V, MSOP package.
i) 24FC128-I/P:
Industrial Temp.,
Package:
P
= Plastic DIP (300 mil body), 8-lead
1.8V, High Speed, PDIP package.
SN = Plastic SOIC (150 mil body), 8-lead
SM = Plastic SOIC (208 mil body), 8-lead
ST = Plastic TSSOP (4.4 mm), 8-lead
ST14 = Plastic TSSOP (4.4 mm), 14-lead
MF = Dual, Flat, No Lead (DFN)(6x5 mm
body), 8-lead
j) 24FC128-I/SN: Industrial Temp.,
1.8V, High Speed, SOIC package.
k) 24FC128T-I/SN: Tape and Reel,
Industrial Temp., 1.8V, High Speed,
SOIC package
l) 24LC128T-I/STG: Industrial Temp.,
2.5V, TSSOP package, Tape & Reel,
Pb-free
MS = Plastic Micro Small Outline (MSOP),
8-lead
Lead Finish
Blank= Standard 63%/37% Sn/Pb
m) 24LC128-I/PG: Industrial Temp.,
2.5V, PDIP package, Pb-free
G
= Pb-free (Pure Matte Sn)
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2004 Microchip Technology Inc.
DS21191M-page23
24AA128/24LC128/24FC128
NOTES:
DS21191M-page24
2004 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL,
SmartSensor and The Embedded Control Solutions Company
are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Migratable Memory, MPASM,
MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net,
PICLAB, PICtail, PowerCal, PowerInfo, PowerMate,
PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial,
SmartTel and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2004, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
2004 Microchip Technology Inc.
DS21191M-page 25
WORLDWIDE SALES AND SERVICE
China - Beijing
Korea
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: www.microchip.com
Unit 706B
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Wan Tai Bei Hai Bldg.
No. 6 Chaoyangmen Bei Str.
Beijing, 100027, China
Tel: 86-10-85282100
Fax: 86-10-85282104
Tel: 82-2-554-7200 Fax: 82-2-558-5932 or
82-2-558-5934
Singapore
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
China - Chengdu
Rm. 2401-2402, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-86766200
Atlanta
3780 Mansell Road, Suite 130
Alpharetta, GA 30022
Tel: 770-640-0034
Fax: 770-640-0307
Taiwan
Kaohsiung Branch
30F - 1 No. 8
Fax: 86-28-86766599
Boston
Min Chuan 2nd Road
Kaohsiung 806, Taiwan
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Fuzhou
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506
Fax: 86-591-7503521
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848
Fax: 978-692-3821
Taiwan
Taiwan Branch
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Chicago
333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071
Fax: 630-285-0075
China - Hong Kong SAR
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
Dallas
EUROPE
Austria
Durisolstrasse 2
A-4600 Wels
Austria
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark
Regus Business Centre
Lautrup hoj 1-3
4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423
Fax: 972-818-2924
China - Shanghai
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Detroit
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250
Tel: 86-21-6275-5700
Fax: 86-21-6275-5060
China - Shenzhen
Rm. 1812, 18/F, Building A, United Plaza
No. 5022 Binhe Road, Futian District
Shenzhen 518033, China
Tel: 86-755-82901380
Fax: 86-755-8295-1393
China - Shunde
Fax: 248-538-2260
Ballerup DK-2750 Denmark
Tel: 45-4420-9895 Fax: 45-4420-9910
Kokomo
France
2767 S. Albright Road
Kokomo, IN 46902
Tel: 765-864-8360
Fax: 765-864-8387
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Room 401, Hongjian Building, No. 2
Los Angeles
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888
Fax: 949-263-1338
Fengxiangnan Road, Ronggui Town, Shunde
District, Foshan City, Guangdong 528303, China
Tel: 86-757-28395507 Fax: 86-757-28395571
Germany
China - Qingdao
Rm. B505A, Fullhope Plaza,
No. 12 Hong Kong Central Rd.
Qingdao 266071, China
Tel: 86-532-5027355 Fax: 86-532-5027205
Steinheilstrasse 10
D-85737 Ismaning, Germany
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
San Jose
1300 Terra Bella Avenue
Mountain View, CA 94043
Tel: 650-215-1444
Italy
India
Via Quasimodo, 12
20025 Legnano (MI)
Milan, Italy
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-22290061 Fax: 91-80-22290062
Japan
Fax: 650-961-0286
Toronto
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands
Waegenburghtplein 4
NL-5152 JR, Drunen, Netherlands
Tel: 31-416-690399
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699
Fax: 905-673-6509
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
ASIA/PACIFIC
Australia
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Fax: 31-416-690340
United Kingdom
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44-118-921-5869
Fax: 44-118-921-5820
05/28/04
DS21191M-page 26
2004 Microchip Technology Inc.
相关型号：
24AA128T-I/ST14
16K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO14, 4.40 MM, LEAD FREE, PLASTIC, MO-153, TSSOP-14
MICROCHIP
24AA128T-I/ST14G
16K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO14, 4.40 MM, LEAD FREE, PLASTIC, MO-153, TSSOP-14
MICROCHIP
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