24AA044T-E/P [MICROCHIP]
4K I2C⢠Serial EEPROM;型号: | 24AA044T-E/P |
厂家: | MICROCHIP |
描述: | 4K I2C⢠Serial EEPROM 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 |
文件: | 总32页 (文件大小:931K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
24AA044
4K I2C™ Serial EEPROM
Device Selection Table
Description:
Part
Max Clock
Frequency
Temp.
Range
The Microchip Technology Inc. 24AA044 is a 4 Kbit
Serial Electrically Erasable PROM with a voltage
range of 1.7V to 5.5V. The device is organized as two
blocks of 256 x 8-bit memory with a 2-wire serial
interface. Low-current design permits operation with
standby and active currents of only 1 A and 400 A,
respectively. The device has a page write capability for
up to 16 bytes of data. Functional address lines allow
the connection of up to four 24AA044 devices on the
same bus for up to 16K bits of contiguous EEPROM
memory. The device is available in the standard 8-pin
PDIP, 8-pin SOIC (3.90 mm), TSSOP, 2x3 UDFN and
MSOP packages.
VCC Range
Number
24AA044
1.7V-5.5V
1 MHz(1)
I, E
Note 1: 400 kHz for 1.8V ≤ VCC < 2.2V
100 kHz for VCC < 1.8V
Features:
• Single Supply with Operation from 1.7V to 5.5V
• Low-Power CMOS Technology:
- Read current 400 A, max
- Standby current 1 A, max at 85°C
• 2-Wire Serial Interface, I2C™ Compatible
• Cascadable up to Four Devices
• Schmitt Trigger Inputs for Noise Suppression
• Output Slope Control to Eliminate Ground Bounce
• 1 MHz, 400 kHz, and 100 kHz Clock Compatibility
• Page Write Time 5 ms Maximum
• Self-timed Erase/Write Cycle
Package Types
PDIP/SOIC/TSSOP/MSOP
UDFN
NC
A1
1
VCC
WP
8
7
6
5
NC
1
8
VCC
2
3
4
A1
A2
2
3
4
7
6
5
WP
SCL
SDA
A2
VSS
SCL
SDA
VSS
• 16-Byte Page Write Buffer
• Hardware Write-Protect
• ESD Protection >4,000V
Block Diagram
• More than 1 Million Erase/Write Cycles
• Data Retention >200 Years
A1A2
WP
HV Generator
• Factory Programming Available
• Packages include 8-lead PDIP, SOIC, TSSOP,
UDFN and MSOP
I/O
Control
Logic
Memory
Control
Logic
EEPROM
Array
• RoHS Compliant
XDEC
• Temperature Ranges:
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
SDA
SCL
Write-Protect
Circuitry
VCC
VSS
YDEC
Sense Amp.
R/W Control
2014 Microchip Technology Inc.
DS20005286A-page 1
24AA044
1.0
ELECTRICAL CHARACTERISTICS
(†)
Absolute Maximum Ratings
VCC.............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ...................................................................................................................-0.3V to 6.5V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied................................................................................................-40°C to +125°C
ESD protection on all pins 4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. These are stress ratings only and functional operation of the device at these or any other conditions above
those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating
conditions for extended periods may affect device reliability.
TABLE 1-1:
DC SPECIFICATIONS
Industrial (I):
TA = -40°C to +85°C, VCC = +1.7V to +5.5V
DC CHARACTERISTICS
Automotive (E): TA = -40°C to +125°C, VCC = +1.7V to +5.5V
Param.
Symbol
No.
Characteristic
Min.
Max.
Units
Conditions
—
A1, A2, SCL, SDA and WP
pins
—
—
—
—
—
D1
D2
VIH
VIL
High-level input voltage
Low-level input voltage
0.7 VCC
—
VCC + 0.5
V
0.3 VCC
0.2 VCC
V
V
VCC ≥ 2.5V
VCC < 2.5V
D3
VHYS
Hysteresis of Schmitt
Trigger inputs
0.05 VCC
—
V
(Note)
D4
D5
D6
D7
VOL
ILI
Low-level output voltage
Input leakage current
Output leakage current
—
—
—
—
0.40
±1
V
IOL = 3.0 mA, VCC = 2.5V
VIN = VSS or VCC
A
A
pF
ILO
±1
VOUT = VSS or VCC
CIN, COUT Pin capacitance
(all inputs/outputs)
10
VCC = 5.5V (Note)
TA = 25°C, FCLK = 1 MHz
D8
ICC write Operating current
ICC read
—
—
3
mA
VCC = 5.5V
D9
400
A
VCC = 5.5V, SCL = 1 MHz
D10
ICCS
Standby current
—
—
1
5
A
A
Industrial
Automotive
SDA, SCL = VCC
A1, A2, WP = VSS
Note: This parameter is periodically sampled and not 100% tested.
DS20005286A-page 2
2014 Microchip Technology Inc.
24AA044
TABLE 1-2:
AC CHARACTERISTICS
Industrial (I):
TA = -40°C to +85°C, VCC = +1.7V to +5.5V
AC CHARACTERISTICS
Automotive (E): TA = -40°C to +125°C, VCC = +1.7V to +5.5V
Param.
Symbol
No.
Characteristic
Clock frequency
Min.
Max.
Units
Conditions
1
2
3
4
5
6
7
FCLK
THIGH
TLOW
TR
—
—
—
100
400
1000
kHz
1.7V VCC < 1.8V
1.8V VCC < 2.2V
2.2V VCC < 5.5V
Clock high time
4000
600
500
—
—
—
ns
ns
ns
ns
ns
ns
1.7V VCC < 1.8V
1.8V VCC < 2.2V
2.2V VCC < 5.5V
Clock low time
4700
1300
500
—
—
—
1.7V VCC < 1.8V
1.8V VCC < 2.2V
2.2V VCC < 5.5V
SDA and SCL rise time (Note 1)
SDA and SCL fall time (Note 1)
Start condition hold time
Start condition setup time
—
—
—
1000
300
300
1.7V VCC < 1.8V
1.8V VCC < 2.2V
2.2V VCC < 5.5V
TF
—
—
—
300
300
100
1.7V VCC < 1.8V
1.8V VCC < 2.2V
2.2V VCC < 5.5V
THD:STA
TSU:STA
4000
600
250
—
—
—
1.7V VCC < 1.8V
1.8V VCC < 2.2V
2.2V VCC < 5.5V
4700
600
250
—
—
—
1.7V VCC < 1.8V
1.8V VCC < 2.2V
2.2V VCC < 5.5V
8
9
THD:DAT
TSU:DAT
Data input hold time
Data input setup time
0
—
ns
ns
(Note 2)
250
100
100
—
—
—
1.7V VCC < 1.8V
1.8V VCC < 2.2V
2.2V VCC < 5.5V
10
11
12
13
14
15
TSU:STO
TSU:WP
THD:WP
TAA
Stop condition setup time
WP setup time
4000
600
250
—
—
—
ns
ns
ns
ns
ns
1.7V VCC < 1.8V
1.8V VCC < 2.2V
2.2V VCC < 5.5V
4000
600
600
—
—
—
1.7V VCC < 1.8V
1.8V VCC < 2.2V
2.2V VCC < 5.5V
WP hold time
4700
1300
1300
—
—
—
1.7V VCC < 1.8V
1.8V VCC < 2.2V
2.2V VCC < 5.5V
Output valid from clock (Note 2)
—
—
—
3500
900
400
1.7V VCC < 1.8V
1.8V VCC < 2.2V
2.2V VCC < 5.5V
TBUF
Bus free time: Time the bus must
be free before a new transmission
can start
4700
1300
500
—
—
1.7V VCC < 1.8V
1.8V VCC < 2.2V
2.2V VCC < 5.5V
TSP
Input filter spike suppression
(SDA and SCL pins)
—
50
ns
(Note 1)
16
17
TWC
—
Write cycle time (byte or page)
Endurance
—
5
ms
—
1M
—
cycles Page mode, 25°C, VCC = 5.5V
(Note 3)
Note 1: Not 100% tested.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum
200 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please
consult the Total Endurance™ Model which can be obtained from Microchip’s web site at www.microchip.com.
2014 Microchip Technology Inc.
DS20005286A-page 3
24AA044
FIGURE 1-1:
BUS TIMING DATA
5
4
D3
2
SCL
7
3
10
8
9
SDA
In
6
15
14
12
13
SDA
Out
(protected)
WP
11
(unprotected)
DS20005286A-page 4
2014 Microchip Technology Inc.
24AA044
2.0
PIN DESCRIPTIONS
Pin Function Table
Name
PDIP
SOIC
TSSOP
UDFN
MSOP
Description
NC
A1
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
Not Connected
Chip Address Input
Chip Address Input
Ground
A2
VSS
SDA
SCL
WP
VCC
Serial Address/Data I/O
Serial Clock
Write-Protect Input
+1.7 to 5.5V Power Supply
2.1
Serial Data (SDA)
2.5
Noise Protection
SDA is a bidirectional pin used to transfer addresses
and data into and out of the device. It is an open-drain
terminal; therefore, the SDA bus requires a pull-up
resistor to VCC (typical 10 k for 100 kHz, 2 k for
400 kHz and 1 MHz).
The 24AA044 employs a VCC threshold detector circuit
which disables the internal erase/write logic if the VCC
is below 1.35V at nominal conditions.
The SCL and SDA inputs have Schmitt Trigger and
filter circuits which suppress noise spikes to assure
proper device operation, even on a noisy bus.
For normal data transfer, SDA is allowed to change
only during SCL low. Changes during SCL high are
reserved for indicating the Start and Stop conditions.
3.0
FUNCTIONAL DESCRIPTION
The 24AA044 supports a bidirectional, 2-wire bus
and data transmission protocol. A device that sends
data onto the bus is defined as transmitter, while a
device receiving data is defined as receiver. The bus
has to be controlled by a master device that gener-
ates the Serial Clock (SCL), controls the bus access
and generates the Start and Stop conditions, while
the 24AA044 works as slave. Both master and slave
can operate as transmitter or receiver, but the master
device determines which mode is activated.
2.2
Serial Clock (SCL)
The SCL input is used to synchronize the data transfer
from and to the device.
2.3
Chip Address Inputs (A1, A2)
The levels on the A1 and A2 inputs are compared with
the corresponding bits in the slave address. The chip is
selected if the compare is true.
Up to four 24AA044 devices may be connected to the
same bus by using different Chip Select bit combina-
tions. These inputs must be connected to either VCC or
VSS.
2.4
Write-Protect (WP)
WP is the hardware write-protect pin. It must be tied to
VCC or VSS. If tied to Vcc, hardware write protection is
enabled. If WP is tied to Vss, the hardware write
protection is disabled.
2014 Microchip Technology Inc.
DS20005286A-page 5
24AA044
The data on the line must be changed during the low
period of the clock signal. There is one bit of data per
clock pulse.
4.0
BUS CHARACTERISTICS
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus
is not busy.
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of the
data bytes transferred between the Start and Stop
conditions is determined by the master device and is,
theoretically, unlimited (though only the last sixteen will
be stored when performing a write operation). When an
overwrite does occur, it will replace data in a first-in
first-out fashion.
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
Accordingly, the following bus conditions have been
defined (Figure 4-1).
4.5
Acknowledge
4.1
Bus Not Busy (A)
Each receiving device, when addressed, is required to
generate an acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse, which is associated with this Acknowledge bit.
Both data and clock lines remain high.
4.2
Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
Note:
The 24AA044 does not generate any
Acknowledge bits if an internal program-
ming cycle is in progress.
The device that acknowledges has to pull down the SDA
line during the acknowledge clock pulse in such a way
that the SDA line is stable-low during the high period of
the acknowledge-related clock pulse. Of course, setup
and hold times must be taken into account. A master
must signal an end of data to the slave by not generating
an Acknowledge bit on the last byte that has been
clocked out of the slave. In this case, the slave must
leave the data line high to enable the master to generate
the Stop condition (Figure 4-2).
4.3
Stop Data Transfer (C)
A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.
4.4
Data Valid (D)
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
FIGURE 4-1:
DATA TRANSFER SEQUENCE ON THE SERIAL BUS CHARACTERISTICS
(A)
(B)
(C)
(D)
(C) (A)
SCL
SDA
Start
Condition
Stop
Condition
Address or
Acknowledge
Valid
Data
Allowed
to Change
FIGURE 4-2:
ACKNOWLEDGE TIMING
Acknowledge
Bit
1
2
3
4
5
6
7
8
9
1
2
3
SCL
SDA
Data from transmitter
Data from transmitter
Transmitter must release the SDA line at this point allowing
the Receiver to pull the SDA line low to acknowledge the
previous eight bits of data.
Receiver must release the SDA line at this
point so the Transmitter can continue
sending data.
DS20005286A-page 6
2014 Microchip Technology Inc.
24AA044
FIGURE 5-1:
CONTROL BYTE FORMAT
5.0
DEVICE ADDRESSING
Read/Write Bit
A control byte is the first byte received following the
Start condition from the master device (Figure 5-1).
The control byte consists of a 4-bit control code. For the
24AA044, this is set as ‘1010’ binary for read and write
operations. The next two bits of the control byte are the
Chip Select bits (A2, A1). The Chip Select bits allow the
use of up to four 24AA044 devices on the same bus
and are used to select which device is accessed. The
Chip Select bits in the control byte must correspond to
the logic levels on the corresponding A2 and A1 pins
for the device to respond. These bits are in effect the
two Most Significant bits of the array address.
Block
Select Select
Bits
Chip
Control Code
Bit
S
1
0
1
0
A2 A1 B0 R/W ACK
Slave Address
Acknowledge Bit
Start Bit
5.1
Contiguous Addressing Across
Multiple Devices
The next bit of the control byte is the block select bit
(B0). This bit acts as the A8 address bit for accessing
the entire array.
The Chip Select bits A2 and A1 can be used to expand
the contiguous address space for up to 16K bits by add-
ing up to four 24AA044 devices on the same bus. In this
case, software can use A1 of the control byte as
address bit A9, and A2 as address bit A10. It is not
possible to sequentially read across device
boundaries.
The last bit of the control byte defines the operation to
be performed. When set to a one, a read operation is
selected. When set to a zero, a write operation is
selected. Following the Start condition, the 24AA044
monitors the SDA bus checking the control byte being
transmitted. Upon receiving a ‘1010’ code and appro-
priate Chip Select bits, the slave device outputs an
Acknowledge signal on the SDA line. Depending on the
state of the R/W bit, the 24AA044 will select a read or
write operation.
2014 Microchip Technology Inc.
DS20005286A-page 7
24AA044
received data will be overwritten. As with the byte-write
operation, once the Stop condition is received, an
internal write cycle will begin (Figure 6-2). If an attempt
is made to write to the protected portion of the array
when the hardware write protection has been enabled,
the device will acknowledge the command, but no data
will be written.
6.0
6.1
WRITE OPERATIONS
Byte Write
Following the Start signal from the master, the device
code (4 bits), the Chip Select bits (2 bits), the block
select bit (1 bit), and the R/W bit (which is a logic-low)
is placed onto the bus by the master transmitter. The
device will acknowledge this control byte during the
ninth clock pulse. The next byte transmitted by the
master is the array address and will be written into the
Address Pointer of the 24AA044. After receiving
another Acknowledge signal from the 24AA044, the
master device will transmit the data byte to be written
into the addressed memory location. The 24AA044
acknowledges again and the master generates a Stop
condition. This initiates the internal write cycle and,
during this time, the 24AA044 will not generate
Acknowledge signals (Figure 6-1). If an attempt is
made to write to the protected portion of the array when
the hardware write protection has been enabled, the
device will acknowledge the command, but no data will
be written.
Note:
When doing a write of less than 16 bytes,
the data in the rest of the page is
refreshed along with the data bytes being
written. This will force the entire page to
endure a write cycle. For this reason,
endurance is specified per page.
Note:
Page write operations are limited to writ-
ing bytes within a single physical page,
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buffer size
(or ‘page size’) and end at addresses that
are integer multiples of [page size – 1]. If
a Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page, as might be
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.
6.2
Page Write
The write control byte, array address and the first data
byte are transmitted to the 24AA044 in the same way
as in a byte write. However, instead of generating a
Stop condition, the master transmits up to 15 additional
data bytes to the 24AA044, which are temporarily
stored in the on-chip page buffer and will be written into
the memory once the master has transmitted a Stop
condition. Upon receipt of each byte, the four lower-
order Address Pointer bits are internally incremented
by one.
6.3
Write Protection
The higher-order five bits of the array address remain
constant. If the master should transmit more than 16
bytes prior to generating the Stop condition, the
address counter will roll over and the previously
The WP pin must be tied to VCC or VSS. If tied to VCC,
the entire array will be write-protected. If the WP pin is
tied to VSS, write operations to all address locations are
allowed.
FIGURE 6-1:
BYTE WRITE
S
T
A
R
T
S
BUS ACTIVITY
MASTER
Control
Byte
Array
Address
T
Data
O
P
SDA LINE
S
P
A
C
K
A
C
K
A
C
K
BUS ACTIVITY
FIGURE 6-2:
PAGE WRITE
S
T
A
R
T
S
T
O
P
BUS ACTIVITY
MASTER
Control
Byte
Array
Address (n)
Data (n)
Data (n +1)
Data (n + 15)
SDA LINE
S
P
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
BUS ACTIVITY
DS20005286A-page 8
2014 Microchip Technology Inc.
24AA044
FIGURE 7-1:
ACKNOWLEDGE
POLLING FLOW
7.0
ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a Write
command has been issued from the master, the device
initiates the internally-timed write cycle, with ACK
polling being initiated immediately. This involves the
master sending a Start condition followed by the control
byte for a Write command (R/W = 0). If the device is still
busy with the write cycle, no ACK will be returned. If no
ACK is returned, the Start bit and control byte must be
re-sent. If the cycle is complete, the device will return
the ACK and the master can then proceed with the next
Read or Write command. See Figure 7-1 for a flow
diagram of this operation.
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
No
Yes
Next
Operation
2014 Microchip Technology Inc.
DS20005286A-page 9
24AA044
8.3
Sequential Read
8.0
READ OPERATIONS
Sequential reads are initiated in the same way as a
random read except that after the 24AA044 transmits
the first data byte, the master issues an acknowledge
(as opposed to a Stop condition in a random read). This
directs the 24AA044 to transmit the next sequentially-
addressed 8-bit value (Figure 8-3).
Read operations are initiated in the same way as write
operations, with the exception that the R/W bit of the
slave address is set to ‘1’. There are three basic types
of read operations: current address read, random read
and sequential read.
8.1
Current Address Read
To provide sequential reads, the 24AA044 contains an
internal Address Pointer that is incremented by one
upon completion of each operation. This Address
Pointer allows the entire memory contents to be serially
read during one operation. The internal Address
Pointer will automatically roll over from address 1FFh
to address 000h.
The 24AA044 contains an address counter that main-
tains the address of the last data byte accessed, inter-
nally incremented by one. Therefore, if the previous
read access was to address n, the next current address
read operation would access data from address n + 1.
Upon receipt of the slave address with the R/W bit set to
‘1’, the 24AA044 issues an acknowledge and transmits
the 8-bit data value. The master will not acknowledge
the transfer, but does generate a Stop condition and the
24AA044 discontinues transmission (Figure 8-1).
FIGURE 8-1:
CURRENT ADDRESS
READ
S
T
A
R
T
S
T
Control
Data
Byte
BUS ACTIVITY
MASTER
8.2
Random Read
O
P
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, the array address must first
be set. This is accomplished by sending the array
address to the 24AA044 as part of a write operation.
Once the array address is sent, the master generates a
Start condition following the acknowledge. This termi-
nates the write operation, but not before the internal
Address Pointer is set. The master then issues the con-
trol byte again, but with the R/W bit set to a ‘1’. The
24AA044 will then issue an acknowledge and transmits
the 8-bit data value. The master will not acknowledge
the transfer but does generate a Stop condition and the
24AA044 discontinues transmission (Figure 8-2). After
this command, the internal address counter will point to
the address location following the one that was just
read.
SDA LINE
P
S
N
O
A
C
K
A
C
K
BUS ACTIVITY
DS20005286A-page 10
2014 Microchip Technology Inc.
24AA044
FIGURE 8-2:
RANDOM READ
S
T
A
R
T
S
T
A
R
T
S
T
O
P
BUS ACTIVITY
MASTER
Control
Byte
Array
Address (n)
Control
Byte
Data (n)
S
P
S
SDA LINE
N
O
A
C
K
A
C
K
A
C
K
A
C
K
BUS ACTIVITY
FIGURE 8-3:
SEQUENTIAL READ
S
T
O
P
BUS ACTIVITY
MASTER
Control
Data (n)
Byte
Data (n + 1)
Data (n + 2)
Data (n + x)
P
SDA LINE
N
O
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
BUS ACTIVITY
2014 Microchip Technology Inc.
DS20005286A-page 11
24AA044
9.0
9.1
PACKAGING INFORMATION
Package Marking Information
8-Lead PDIP (300 mil)
Example:
XXXXXXXX
XXXXXNNN
24AA044
13F
e
3
YYWW
1411
8-Lead SOIC (3.90 mm)
Example:
24AA044
XXXXXXXX
XXXXYYWW
1411
e
3
13F
NNN
Example:
Example:
8-Lead TSSOP
AACL
1411
13F
XXXX
YYWW
NNN
8-Lead MSOP
4A4414
1113F
XXXXYY
WWNNN
8-Lead 2x3 UDFN
Example:
XXX
YWW
NN
CAD
411
13
DS20005286A-page 12
2014 Microchip Technology Inc.
24AA044
1st Line Marking Codes
Part Number
PDIP
SOIC
24AA044
TSSOP
MSOP
4A44YY
UDFN
CAD
24AA024
24AA044
AACL
Legend: XX...X Part number or part number code
Y
YY
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
WW
NNN
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code (2 characters for small packages)
JEDEC® designator for Matte Tin (Sn)
e
3
Note: For very small packages with no room for the Pb-free JEDEC designator
, the marking will only appear on the outer carton or reel label.
e
3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
2014 Microchip Technology Inc.
DS20005286A-page 13
24AA044
8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
N
B
E1
NOTE 1
1
2
TOP VIEW
E
A2
A
C
PLANE
L
c
A1
e
eB
8X b1
8X b
.010
C
SIDE VIEW
END VIEW
Microchip Technology Drawing No. C04-018D Sheet 1 of 2
DS20005286A-page 14
2014 Microchip Technology Inc.
24AA044
8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
ALTERNATE LEAD DESIGN
(VENDOR DEPENDENT)
DATUM A
DATUM A
b
b
e
2
e
2
e
e
Units
Dimension Limits
INCHES
NOM
8
.100 BSC
-
MIN
MAX
Number of Pins
Pitch
N
e
A
Top to Seating Plane
-
.210
.195
-
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
A2
A1
E
E1
D
L
c
b1
b
eB
.115
.015
.290
.240
.348
.115
.008
.040
.014
-
.130
-
.310
.250
.365
.130
.010
.060
.018
-
.325
.280
.400
.150
.015
.070
.022
.430
Lower Lead Width
Overall Row Spacing
§
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-018D Sheet 2 of 2
2014 Microchip Technology Inc.
DS20005286A-page 15
24AA044
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20005286A-page 16
2014 Microchip Technology Inc.
24AA044
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2014 Microchip Technology Inc.
DS20005286A-page 17
24AA044
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢈꢆꢏꢐꢊꢈꢋꢑꢃꢆꢒꢍꢓꢔꢆꢕꢆꢓꢄꢖꢖꢗꢘꢙꢆꢚꢛꢜꢝꢆꢎꢎꢆꢞꢗꢅꢟꢆꢠꢍꢏꢡꢢꢣ
ꢓꢗꢊꢃꢤ ꢀꢁꢂꢃꢄꢅꢆꢃ!ꢁ"ꢄꢃꢇ#ꢂꢂꢆꢈꢄꢃꢉꢊꢇ$ꢊꢋꢆꢃ%ꢂꢊ&ꢌꢈꢋ"'ꢃꢉꢍꢆꢊ"ꢆꢃ"ꢆꢆꢃꢄꢅꢆꢃꢎꢌꢇꢂꢁꢇꢅꢌꢉꢃ(ꢊꢇ$ꢊꢋꢌꢈꢋꢃꢏꢉꢆꢇꢌ)ꢌꢇꢊꢄꢌꢁꢈꢃꢍꢁꢇꢊꢄꢆ%ꢃꢊꢄꢃ
ꢅꢄꢄꢉ*++&&&ꢐ!ꢌꢇꢂꢁꢇꢅꢌꢉꢐꢇꢁ!+ꢉꢊꢇ$ꢊꢋꢌꢈꢋ
DS20005286A-page 18
2014 Microchip Technology Inc.
24AA044
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢥꢦꢋꢑꢆꢍꢦꢖꢋꢑꢧꢆꢍꢎꢄꢈꢈꢆꢏꢐꢊꢈꢋꢑꢃꢆꢒꢍꢥꢔꢆꢕꢆꢨꢛꢨꢆꢎꢎꢆꢞꢗꢅꢟꢆꢠꢥꢍꢍꢏꢇꢣ
ꢓꢗꢊꢃꢤ ꢀꢁꢂꢃꢄꢅꢆꢃ!ꢁ"ꢄꢃꢇ#ꢂꢂꢆꢈꢄꢃꢉꢊꢇ$ꢊꢋꢆꢃ%ꢂꢊ&ꢌꢈꢋ"'ꢃꢉꢍꢆꢊ"ꢆꢃ"ꢆꢆꢃꢄꢅꢆꢃꢎꢌꢇꢂꢁꢇꢅꢌꢉꢃ(ꢊꢇ$ꢊꢋꢌꢈꢋꢃꢏꢉꢆꢇꢌ)ꢌꢇꢊꢄꢌꢁꢈꢃꢍꢁꢇꢊꢄꢆ%ꢃꢊꢄꢃ
ꢅꢄꢄꢉ*++&&&ꢐ!ꢌꢇꢂꢁꢇꢅꢌꢉꢐꢇꢁ!+ꢉꢊꢇ$ꢊꢋꢌꢈꢋ
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N
E
E1
NOTE 1
1
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b
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c
φ
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A2
A1
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L1
@ꢈꢌꢄ"
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ꢓꢌ!ꢆꢈ"ꢌꢁꢈꢃAꢌ!ꢌꢄ"
ꢎꢙE
EGꢎ
ꢎꢕH
E#!7ꢆꢂꢃꢁ)ꢃ(ꢌꢈ"
(ꢌꢄꢇꢅ
E
ꢆ
ꢚ
ꢔꢐJ;ꢃ>ꢏ?
G3ꢆꢂꢊꢍꢍꢃKꢆꢌꢋꢅꢄ
ꢎꢁꢍ%ꢆ%ꢃ(ꢊꢇ$ꢊꢋꢆꢃꢗꢅꢌꢇ$ꢈꢆ""
ꢏꢄꢊꢈ%ꢁ))ꢃ
ꢕ
ꢛ
ꢔꢐꢚꢔ
ꢔꢐꢔ;
ꢛ
1ꢐꢔꢔ
ꢛ
1ꢐꢒꢔ
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ꢕ1
8
G3ꢆꢂꢊꢍꢍꢃNꢌ%ꢄꢅ
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ꢎꢁꢍ%ꢆ%ꢃ(ꢊꢇ$ꢊꢋꢆꢃAꢆꢈꢋꢄꢅ
ꢀꢁꢁꢄꢃAꢆꢈꢋꢄꢅ
81
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A
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ꢀꢁꢁꢄꢉꢂꢌꢈꢄ
ꢀꢁꢁꢄꢃꢕꢈꢋꢍꢆ
Aꢆꢊ%ꢃꢗꢅꢌꢇ$ꢈꢆ""
Aꢆꢊ%ꢃNꢌ%ꢄꢅ
A1
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1ꢐꢔꢔꢃꢘ8ꢀ
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ꢒꢐ ꢓꢌ!ꢆꢈ"ꢌꢁꢈ"ꢃꢓꢃꢊꢈ%ꢃ81ꢃ%ꢁꢃꢈꢁꢄꢃꢌꢈꢇꢍ#%ꢆꢃ!ꢁꢍ%ꢃ)ꢍꢊ"ꢅꢃꢁꢂꢃꢉꢂꢁꢄꢂ#"ꢌꢁꢈ"ꢐꢃꢎꢁꢍ%ꢃ)ꢍꢊ"ꢅꢃꢁꢂꢃꢉꢂꢁꢄꢂ#"ꢌꢁꢈ"ꢃ"ꢅꢊꢍꢍꢃꢈꢁꢄꢃꢆ6ꢇꢆꢆ%ꢃꢔꢐ1;ꢃ!!ꢃꢉꢆꢂꢃ"ꢌ%ꢆꢐ
<ꢐ ꢓꢌ!ꢆꢈ"ꢌꢁꢈꢌꢈꢋꢃꢊꢈ%ꢃꢄꢁꢍꢆꢂꢊꢈꢇꢌꢈꢋꢃꢉꢆꢂꢃꢕꢏꢎ8ꢃ=1ꢖꢐ;ꢎꢐ
>ꢏ?* >ꢊ"ꢌꢇꢃꢓꢌ!ꢆꢈ"ꢌꢁꢈꢐꢃꢗꢅꢆꢁꢂꢆꢄꢌꢇꢊꢍꢍꢑꢃꢆ6ꢊꢇꢄꢃ3ꢊꢍ#ꢆꢃ"ꢅꢁ&ꢈꢃ&ꢌꢄꢅꢁ#ꢄꢃꢄꢁꢍꢆꢂꢊꢈꢇꢆ"ꢐ
ꢘ8ꢀ* ꢘꢆ)ꢆꢂꢆꢈꢇꢆꢃꢓꢌ!ꢆꢈ"ꢌꢁꢈ'ꢃ#"#ꢊꢍꢍꢑꢃ&ꢌꢄꢅꢁ#ꢄꢃꢄꢁꢍꢆꢂꢊꢈꢇꢆ'ꢃ)ꢁꢂꢃꢌꢈ)ꢁꢂ!ꢊꢄꢌꢁꢈꢃꢉ#ꢂꢉꢁ"ꢆ"ꢃꢁꢈꢍꢑꢐ
ꢎꢌꢇꢂꢁꢇꢅꢌꢉ ꢗꢆꢇꢅꢈꢁꢍꢁꢋꢑ ꢓꢂꢊ&ꢌꢈꢋ ?ꢔꢖꢟꢔꢚJ>
2014 Microchip Technology Inc.
DS20005286A-page 19
24AA044
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20005286A-page 20
2014 Microchip Technology Inc.
24AA044
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2014 Microchip Technology Inc.
DS20005286A-page 21
24AA044
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20005286A-page 22
2014 Microchip Technology Inc.
24AA044
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2014 Microchip Technology Inc.
DS20005286A-page 23
24AA044
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢩꢐꢄꢈꢆꢪꢈꢄꢊꢙꢆꢓꢗꢆꢂꢃꢄꢅꢆꢇꢄꢌꢧꢄꢫꢃꢆꢒꢬꢭꢔꢆꢕꢆꢮꢯꢚꢯꢝꢛꢰꢆꢎꢎꢆꢞꢗꢅꢟꢆꢠꢭꢩꢪꢓꢣ
ꢓꢗꢊꢃꢤ ꢀꢁꢂꢃꢄꢅꢆꢃ!ꢁ"ꢄꢃꢇ#ꢂꢂꢆꢈꢄꢃꢉꢊꢇ$ꢊꢋꢆꢃ%ꢂꢊ&ꢌꢈꢋ"'ꢃꢉꢍꢆꢊ"ꢆꢃ"ꢆꢆꢃꢄꢅꢆꢃꢎꢌꢇꢂꢁꢇꢅꢌꢉꢃ(ꢊꢇ$ꢊꢋꢌꢈꢋꢃꢏꢉꢆꢇꢌ)ꢌꢇꢊꢄꢌꢁꢈꢃꢍꢁꢇꢊꢄꢆ%ꢃꢊꢄꢃ
ꢅꢄꢄꢉ*++&&&ꢐ!ꢌꢇꢂꢁꢇꢅꢌꢉꢐꢇꢁ!+ꢉꢊꢇ$ꢊꢋꢌꢈꢋ
DS20005286A-page 24
2014 Microchip Technology Inc.
24AA044
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢩꢐꢄꢈꢆꢪꢈꢄꢊꢙꢆꢓꢗꢆꢂꢃꢄꢅꢆꢇꢄꢌꢧꢄꢫꢃꢆꢒꢬꢭꢔꢆꢕꢆꢮꢯꢚꢯꢝꢛꢰꢆꢎꢎꢆꢞꢗꢅꢟꢆꢠꢭꢩꢪꢓꢣ
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ꢅꢄꢄꢉ*++&&&ꢐ!ꢌꢇꢂꢁꢇꢅꢌꢉꢐꢇꢁ!+ꢉꢊꢇ$ꢊꢋꢌꢈꢋ
2014 Microchip Technology Inc.
DS20005286A-page 25
24AA044
APPENDIX A: REVISION HISTORY
Revision A (04/2014)
Initial release of the document.
DS20005286A-page 26
2014 Microchip Technology Inc.
24AA044
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
Customers
should
contact
their
distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
Technical support is available through the web site
at: http://microchip.com/support
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
2014 Microchip Technology Inc.
DS20005286A-page 27
24AA044
NOTES:
DS20005286A-page 28
2014 Microchip Technology Inc.
24AA044
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X
/XX
a) 24AA044-I/P: Industrial Temperature, 1.7V,
PDIP Package
Temperature Package
Range
b) 24AA044-I/SN: Industrial Temperature,
1.7V, SOIC Package
c) 24AA044T-I/ST: Industrial Temperature,
1.7V, TSSOP Package, Tape and Reel
d) 24AA044T-E/MUY: Automotive Tempera-
ture, 1.7V, UDFN Package, Tape and Reel
e) 24AA044T-E/MS: Automotive Temperature,
1.7V, MSOP Package, Tape and Reel
Device:
24AA044: 1.7V, 4 Kbit Addressable Serial EEPROM.
24AA044T:1.7V, 4 Kbit Addressable Serial EEPROM
(Tape and Reel).
Temperature Range:
Package:
I
E
=
=
-40°C to +85°C
-40°C to +125°C
P
SN
ST
MS
MUY
=
=
=
=
=
Plastic DIP, (300 mil Body), 8-lead
Plastic SOIC, (3.90 mm Body)
TSSOP, 8-lead
MSOP, 8-lead
Plastic Dual Flat (UDFN), No lead package,
2x3 mm body, 8-lead
(1)
Note 1: “Y” indicates a Nickel Palladium Gold (NiPdAu) finish.
2014 Microchip Technology Inc.
DS20005286A-page 29
24AA044
NOTES:
DS20005286A-page 30
2014 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
32
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2014, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-63276-162-0
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
== ISO/TS 16949 ==
2014 Microchip Technology Inc.
DS20005286A-page 31
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-3019-1500
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
www.microchip.com
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Germany - Dusseldorf
Tel: 49-2129-3766400
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Austin, TX
Tel: 512-257-3370
Germany - Pforzheim
Tel: 49-7231-424750
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Boston
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
Italy - Venice
Tel: 39-049-7625286
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Poland - Warsaw
Tel: 48-22-3325737
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Sweden - Stockholm
Tel: 46-8-5090-4654
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Detroit
Novi, MI
Tel: 248-848-4000
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Houston, TX
Tel: 281-894-5983
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Taiwan - Kaohsiung
Tel: 886-7-213-7830
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Los Angeles
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
03/25/14
DS20005286A-page 32
2014 Microchip Technology Inc.
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