23K640T-I/SN [MICROCHIP]
64K SPI Bus Low-Power Serial SRAM; 64K SPI总线的低功耗串行SRAM型号: | 23K640T-I/SN |
厂家: | MICROCHIP |
描述: | 64K SPI Bus Low-Power Serial SRAM |
文件: | 总26页 (文件大小:346K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
23A640/23K640
64K SPI Bus Low-Power Serial SRAM
Device Selection Table
Part Number
VCC Range
Page Size
Temp. Ranges
Packages
23K640
23A640
2.7-3.6V
32 Byte
32 Byte
I, E
I
P, SN, ST
P, SN, ST
1.5-1.95V
Features:
Description:
• Max. Clock 20 MHz
The Microchip Technology Inc. 23X640 are 64 Kbit
Serial SRAM devices. The memory is accessed via a
simple Serial Peripheral Interface (SPI) compatible
serial bus. The bus signals required are a clock input
(SCK) plus separate data in (SI) and data out (SO)
lines. Access to the device is controlled through a Chip
Select (CS) input.
• Low-Power CMOS Technology:
- Read Current: 3 mA at 1 MHz
- Standby Current: 4 μA Max. at +85°C
• 8192 x 8-bit Organization
• 32-Byte Page
• HOLD pin
Communication to the device can be paused via the
hold pin (HOLD). While the device is paused,
transitions on its inputs will be ignored, with the
exception of Chip Select, allowing the host to service
higher priority interrupts.
• Flexible Operating modes:
- Byte read and write
- Page mode (32 Byte Page)
- Sequential mode
The 23X640 is available in standard packages
including 8-lead PDIP and SOIC, and advanced
packaging including 8-lead TSSOP.
• Sequential Read/Write
• High Reliability
• Temperature Ranges Supported:
- Industrial (I):
-40°C to +85°C
-40°C to +125°C
Package Types (not to scale)
- Automotive (E):
• Pb-Free and RoHS Compliant, Halogen Free
Pin Function Table
Name
Function
PDIP/SOIC/TSSOP
(P, SN, ST)
CS
SO
Chip Select Input
Serial Data Output
Ground
VSS
SI
CS
SO
VCC
1
2
8
7
Serial Data Input
Serial Clock Input
Hold Input
HOLD
SCK
SI
SCK
HOLD
VCC
3
4
6
5
NC
V
SS
Supply Voltage
© 2009 Microchip Technology Inc.
DS22126C-page 1
23A640/23K640
1.0
ELECTRICAL CHARACTERISTICS
(†)
Absolute Maximum Ratings
VCC.............................................................................................................................................................................4.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +0.3V
Storage temperature .................................................................................................................................-65°C to 150°C
Ambient temperature under bias...............................................................................................................-40°C to 125°C
ESD protection on all pins...........................................................................................................................................2kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for an
extended period of time may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
Industrial (I):
Automotive (E): TA = -40°C to +125°C
TA = -40°C to +85°C
DC CHARACTERISTICS
Param.
No.
Sym.
Characteristic
Min.
Typ(1)
Max. Units
Test Conditions
D001
D001
D002
VCC
Supply voltage
Supply voltage
1.5
2.7
—
—
—
1.95
3.6
V
V
V
23A640 (I-Temp)
VCC
VIH
23K640 (I, E-Temp)
High-level input
voltage
.7 VCC
VCC
+0.3
D003
D004
D005
D006
D007
D008
VIL
Low-level input
voltage
-0.3
—
—
—
—
—
—
0.2xVCC
V
V
VOL
Low-level output
voltage
0.2
IOL = 1 mA
VOH
ILI
High-level output
voltage
VCC -0.5
—
—
V
IOH = -400 μA
Input leakage
current
±0.5
±0.5
μA
μA
CS = VCC, VIN = VSS OR VCC
CS = VCC, VOUT = VSS OR VCC
ILO
Output leakage
current
—
ICC Read
—
—
—
—
—
—
3
6
10
mA FCLK = 1 MHz; SO = O
mA FCLK = 10 MHz; SO = O
mA FCLK = 20 MHz; SO = O
Operating current
Standby current
D009
ICCS
—
—
—
200
500
nA CS = VCC = 1.8V, Inputs tied to VCC
or VSS
μA CS = VCC = 3.6V, Inputs tied to VCC
or VSS
μA CS = VCC = 3.6V, Inputs tied to VCC
or VSS @ 125°C
1
4
5
10
D010
D011
CINT
VDR
Input capacitance
7
pF VCC = 0V, f = 1 MHz, Ta = 25°C
(Note 1)
RAM data retention
voltage (2)
—
1.2
—
V
Note 1: This parameter is periodically sampled and not 100% tested. Typical measurements taken at room
temperature (25°C).
2: This is the limit to which VDD can be lowered without losing RAM data. This parameter is periodically
sampled and not 100% tested.
DS22126C-page 2
© 2009 Microchip Technology Inc.
23A640/23K640
TABLE 1-2:
AC CHARACTERISTICS
Industrial (I):
Automotive (E): TA = -40°C to +125°C
TA = -40°C to +85°C
AC CHARACTERISTICS
Param.
Sym.
Characteristic
Min.
Max.
Units
Test Conditions
No.
1
2
3
4
5
6
FCLK Clock frequency
—
—
—
—
10
16
16
20
MHz VCC = 1.5V (I-Temp)
MHz VCC = 1.8V (I-Temp)
MHz VCC = 3V (E-Temp)
MHz VCC = 3.0V (I-Temp)
VCC = 1.5V (I-Temp)
VCC = 1.8V (I-Temp)
VCC = 3.0V (E-Temp)
VCC = 3.0V (I-Temp)
TCSS CS setup time
TCSH CS hold time
TCSD CS disable time
50
32
32
25
—
—
—
—
ns
ns
ns
ns
VCC = 1.5V (I-Temp)
VCC = 1.8V (I-Temp)
VCC = 3.0V (E-Temp)
VCC = 3.0V (I-Temp)
50
50
50
50
—
—
—
—
ns
ns
ns
ns
VCC = 1.5V (I-Temp)
VCC = 1.8V (I-Temp)
VCC = 3.0V (E-Temp)
VCC = 3.0V (I-Temp)
50
32
32
25
—
—
—
—
ns
ns
ns
ns
Tsu
Data setup time
Data hold time
10
10
10
10
—
—
—
—
ns
ns
ns
ns
VCC = 1.5V (I-Temp)
VCC = 1.8V (I-Temp)
VCC = 3.0V (E-Temp)
VCC = 3.0V (I-Temp)
THD
10
10
10
10
—
—
—
—
ns
ns
ns
ns
VCC = 1.5V (I-Temp)
VCC = 1.8V (I-Temp)
VCC = 3.0V (E-Temp)
VCC = 3.0V (I-Temp)
7
8
9
TR
TF
CLK rise time
CLK fall time
Clock high time
—
—
2
2
us
us
Note 1
Note 1
THI
VCC = 1.5V (I-Temp)
VCC = 1.8V (I-Temp)
VCC = 3.0V (E-Temp)
VCC = 3.0V (I-Temp)
50
32
32
25
—
—
—
—
ns
ns
ns
ns
10
11
12
13
TLO
Clock low time
VCC = 1.5V (I-Temp)
VCC = 1.8V (I-Temp)
VCC = 3.0V (E-Temp)
VCC = 3.0V (I-Temp)
50
32
32
25
—
—
—
—
ns
ns
ns
ns
TCLD Clock delay time
VCC = 1.5V (I-Temp)
VCC = 1.8V (I-Temp)
VCC = 3.0V (E-Temp)
VCC = 3.0V (I-Temp)
50
32
32
25
—
—
—
—
ns
ns
ns
ns
TV
Output valid from clock low
VCC = 1.5V (I-Temp)
VCC = 1.8V (I-Temp)
VCC = 3.0V (E-Temp)
VCC = 3.0V (I-Temp)
—
—
—
—
50
32
32
25
ns
ns
ns
ns
THO
Output hold time
0
—
ns
Note 1
Note 1: This parameter is periodically sampled and not 100% tested.
© 2009 Microchip Technology Inc.
DS22126C-page 3
23A640/23K640
TABLE 1-2:
AC CHARACTERISTICS (CONTINUED)
Industrial (I):
Automotive (E): TA = -40°C to +125°C
TA = -40°C to +85°C
AC CHARACTERISTICS
Param.
Sym.
Characteristic
Min.
Max.
Units
Test Conditions
VCC = 1.5V (I-Temp)
No.
14
TDIS
Output disable time
—
—
—
—
20
20
20
20
ns
ns
ns
ns
VCC = 1.8V (I-Temp)
VCC = 3.0V (E-Temp)
VCC = 3.0V (I-Temp)
15
16
17
18
THS
THH
THZ
THV
HOLD setup time
10
10
10
—
—
—
—
50
ns
ns
ns
ns
—
—
—
—
HOLD hold time
HOLD low to output High-Z
HOLD high to output valid
Note 1: This parameter is periodically sampled and not 100% tested.
TABLE 1-3:
AC TEST CONDITIONS
AC Waveform:
Input pulse level
Input rise/fall time
0.1 VCC to 0.9 VCC
5 ns
-40°C to +125°C
—
Operating temperature
CL = 100 pF
Timing Measurement Reference Level:
Input
0.5 VCC
0.5 VCC
Output
DS22126C-page 4
© 2009 Microchip Technology Inc.
23A640/23K640
FIGURE 1-1: HOLD TIMING
CS
16
16
15
15
SCK
17
18
High-Impedance
Don’t Care
n
SO
n + 2
n + 2
n + 1
n
n - 1
5
n
n + 1
n
n - 1
SI
HOLD
FIGURE 1-2: SERIAL INPUT TIMING
4
CS
2
11
7
3
8
SCK
5
6
SI
MSB in
LSB in
High-Impedance
SO
FIGURE 1-3: SERIAL OUTPUT TIMING
CS
3
9
10
SCK
12
14
LSB out
13
MSB out
SO
SI
Don’t Care
© 2009 Microchip Technology Inc.
DS22126C-page 5
23A640/23K640
2.3
Read Sequence
2.0
2.1
FUNCTIONAL DESCRIPTION
Principles of Operation
The device is selected by pulling CS low. The 8-bit
READinstruction is transmitted to the 23X640 followed
by the 16-bit address, with the first MSB of the address
being a “don’t care” bit. After the correct READ
instruction and address are sent, the data stored in the
memory at the selected address is shifted out on the
SO pin.
The 23X640 is a 8192-byte Serial SRAM designed to
interface directly with the Serial Peripheral Interface
(SPI) port of many of today’s popular microcontroller
families, including Microchip’s PIC® microcontrollers. It
may also interface with microcontrollers that do not
have a built-in SPI port by using discrete I/O lines
programmed properly in firmware to match the SPI
protocol.
If operating in Page mode, after the first byte of data is
shifted out, the next memory location on the page can
be read out by continuing to provide clock pulses. This
allows for 32 consecutive address reads. After the
32nd address read the internal address counter wraps
back to the byte 0 address in that page.
The 23X640 contains an 8-bit instruction register. The
device is accessed via the SI pin, with data being
clocked in on the rising edge of SCK. The CS pin must
be low and the HOLD pin must be high for the entire
operation.
If operating in Sequential mode, the data stored in the
memory at the next address can be read sequentially
by continuing to provide clock pulses. The internal
Address Pointer is automatically incremented to the
next higher address after each byte of data is shifted
out. When the highest address is reached (1FFFh),
the address counter rolls over to address 0000h,
allowing the read cycle to be continued indefinitely.
The read operation is terminated by raising the CS pin
(Figure 2-1).
Table 2-1 contains a list of the possible instruction
bytes and format for device operation. All instructions,
addresses and data are transferred MSB first, LSB last.
Data (SI) is sampled on the first rising edge of SCK
after CS goes low. If the clock line is shared with other
peripheral devices on the SPI bus, the user can assert
the HOLD input and place the 23X640 in ‘HOLD’ mode.
After releasing the HOLD pin, operation will resume
from the point when the HOLD was asserted.
2.4
Write Sequence
Prior to any attempt to write data to the 23X640, the
device must be selected by bringing CS low.
2.2
Modes of Operation
The 23A256/23K256 has three modes of operation that
are selected by setting bits 7 and 6 in the STATUS
register. The modes of operation are Byte, Page and
Burst.
Once the device is selected, the Write command can
be started by issuing a WRITE instruction, followed by
the 16-bit address, with the first three MSBs of the
address being a “don’t care” bit, and then the data to be
written. A write is terminated by the CS being brought
high.
Byte Operation – is selected when bits 7 and 6 in the
STATUS register are set to 00. In this mode, the read/
write operations are limited to only one byte. The
Command followed by the 16-bit address is clocked into
the device and the data to/from the device is transferred
on the next 8 clocks (Figure 2-1, Figure 2-2).
If operating in Page mode, after the initial data byte is
shifted in, additional bytes can be shifted into the
device. The Address Pointer is automatically
incremented. This operation can continue for the entire
page (32 Bytes) before data will start to be overwritten.
Page Operation – is selected when bits 7 and 6 in the
STATUS register are set to 10. The 23A640/23K640 has
1024 pages of 32 Bytes. In this mode, the read and write
operations are limited to within the addressed page (the
address is automatically incremented internally). If the
data being read or written reaches the page boundary,
then the internal address counter will increment to the
start of the page (Figure 2-3, Figure 2-4).
If operating in Sequential mode, after the initial data
byte is shifted in, additional bytes can be clocked into
the device. The internal Address Pointer is automati-
cally incremented. When the Address Pointer reaches
the highest address (1FFFh), the address counter rolls
over to (0000h). This allows the operation to continue
indefinitely, however, previous data will be overwritten.
Sequential Operation – is selected when bits 7 and 6
in the STATUS register are set to 01. Sequential opera-
tion allows the entire array to be written to and read
from. The internal address counter is automatically
incremented and page boundaries are ignored. When
the internal address counter reaches the end of the
array, the address counter will roll over to 0x0000
(Figure 2-5, Figure 2-6).
DS22126C-page 6
© 2009 Microchip Technology Inc.
23A640/23K640
TABLE 2-1:
INSTRUCTION SET
Instruction Name
READ
Instruction Format
Description
Read data from memory array beginning at selected address
Write data to memory array beginning at selected address
Read STATUS register
0000 0011
0000 0010
0000 0101
0000 0001
WRITE
RDSR
WRSR
Write STATUS register
FIGURE 2-1: BYTE READ SEQUENCE
CS
0
1
2
3
4
5
6
7
8
9 10 11
21 22 23 24 25 26 27 28 29 30 31
SCK
SI
Instruction
16-bit Address
1 15 14 13 12
0
0
0
0
0
0
1
2
1
0
Data Out
High-Impedance
7
6
5
4
3
2
1
0
SO
FIGURE 2-2: BYTE WRITE SEQUENCE
CS
0
1
2
3
4
5
6
7
8
9 10 11
21 22 23 24 25 26 27 28 29 30 31
Data Byte
SCK
SI
Instruction
16-bit Address
15 14 13 12
0
0
0
0
0
0
1
0
2
1
0
7
6
5
4
3
2
1
0
High-Impedance
SO
© 2009 Microchip Technology Inc.
DS22126C-page 7
23A640/23K640
FIGURE 2-3: PAGE READ SEQUENCE
CS
0
1
2
3
4
5
6
7
8
9 10 11
21 22 23 24 25 26 27 28 29 30 31
SCK
SI
Instruction
16-bit Address
1 15 14 13 12
Page X, Word Y
0
0
0
0
0
0
1
2
1
0
Page X, Word Y
High Impedance
SO
7
6
5
4
3
2
1
0
CS
32 33 34 35 36 37 38 39
SCK
SI
Page X, Word Y+1
Page X, Word 31
Page X, Word 0
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
SO
FIGURE 2-4:
PAGE WRITE SEQUENCE
CS
0
1
2
3
4
5
6
7
8
9 10 11
21 22 23 24 25 26 27 28 29 30 31
Page X, Word Y
SCK
Instruction
16-bit Address
0 15 14 13 12
Page X, Word Y
0
0
0
0
0
0
1
2
1
0
7
6
5
4
3
2
1
0
SI
CS
SCK
SI
32 33 34 35 36 37 38 39
Page X, Word Y+1
Page X, Word 31
Page X, Word 0
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
DS22126C-page 8
© 2009 Microchip Technology Inc.
23A640/23K640
FIGURE 2-5:
SEQUENTIAL READ SEQUENCE
CS
0
1
2
3
4
5
6
7
8
9 10 11
21 22 23 24 25 26 27 28 29 30 31
SCK
Instruction
16-bit Address
15 14 13 12
0
0
0
0
0
0
1
1
2
1
0
SI
Page X, Word Y
7
6
5
4
3
2
1
0
SO
CS
SCK
SI
Page X, Word 31
Page X+1, Word 0
Page X+1, Word 1
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
SO
CS
SCK
SI
Page X+1, Word 31
Page X+n, Word 1
Page X+n, Word 31
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
SO
© 2009 Microchip Technology Inc.
DS22126C-page 9
23A640/23K640
FIGURE 2-6:
SEQUENTIAL WRITE SEQUENCE
CS
0
1
2
3
4
5
6
7
8
9 10 11
21 22 23 24 25 26 27 28 29 30 31
Data Byte 1
SCK
Instruction
16-bit Address
0 15 14 13 12
0
0
0
0
0
0
1
2
1
0
7
6
5
4
3
2
1
0
SI
CS
32 33 34 35 36 37 38 39
Data Byte 2
41 42 43 44 45 46 47
Data Byte 3
40
7
SCK
SI
Data Byte n
7
6
5
4
3
2
1
0
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
DS22126C-page 10
© 2009 Microchip Technology Inc.
23A640/23K640
The mode bits indicate the operating mode of the
SRAM. The possible modes of operation are:
2.5
Read Status Register Instruction
(RDSR)
0 0= Byte mode (default operation)
1 0= Page mode
The Read Status Register instruction (RDSR) provides
access to the STATUS register. The STATUS register
may be read at any time. The STATUS register is
formatted as follows:
0 1= Sequential mode
1 1= Reserved
Write and read commands are shown in Figure 2-7 and
Figure 2-8.
TABLE 2-2:
STATUS REGISTER
7
6
5
–
0
4
–
0
3
–
0
2
–
0
1
–
1
0
The HOLD bit enables the Hold pin functionality. It must
be set to a ‘0’ before HOLD pin is brought low for HOLD
function to work properly. Setting HOLD to ‘1’ disables
feature.
W/R
W/R
W/R
HOLD
MODE MODE
W/R = writable/readable.
Bits 2 through 5 are reserved and should always be set
to ‘0’. Bit 1 will read back as ‘1’ but should always be
written as ‘0’.
See Figure 2-7 for the RDSRtiming sequence.
FIGURE 2-7: READ STATUS REGISTER TIMING SEQUENCE (RDSR)
CS
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
SCK
Instruction
0
0
0
0
0
1
0
1
SI
Data from STATUS Register
High-Impedance
7
6
5
4
3
2
1
0
SO
© 2009 Microchip Technology Inc.
DS22126C-page 11
23A640/23K640
2.6
Write Status Register Instruction
(WRSR)
The Write Status Register instruction (WRSR) allows the
user to write to the bits in the STATUS register as
shown in Table 2-2. This allows for setting of the Device
operating mode. Several of the bits in the STATUS
register must be cleared to ‘0’. See Figure 2-8 for the
WRSRtiming sequence.
FIGURE 2-8: WRITE STATUS REGISTER TIMING SEQUENCE (WRSR)
CS
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
1
15
0
SCK
SI
Instruction
Data to STATUS Register
7
6
5
4
3
2
0
0
0
0
0
0
0
1
High-Impedance
SO
2.7
Power-On State
The 23X640 powers on in the following state:
• The device is in low-power Standby mode
(CS= 1)
• A high-to-low-level transition on CS is required to
enter active state
DS22126C-page 12
© 2009 Microchip Technology Inc.
23A640/23K640
3.5
Hold (HOLD)
3.0
PIN DESCRIPTIONS
The HOLD pin is used to suspend transmission to the
23X640 while in the middle of a serial sequence without
having to retransmit the entire sequence again. It must
be held high any time this function is not being used.
Once the device is selected and a serial sequence is
underway, the HOLD pin may be pulled low to pause
further serial communication without resetting the
serial sequence. The HOLD pin must be brought low
while SCK is low, otherwise the HOLD function will not
be invoked until the next SCK high-to-low transition.
The 23X640 must remain selected during this
sequence. The SI, SCK and SO pins are in a high-
impedance state during the time the device is paused
and transitions on these pins will be ignored. To resume
serial communication, HOLD must be brought high
while the SCK pin is low, otherwise serial
communication will not resume. Lowering the HOLD
line at any time will tri-state the SO line.
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Function
PDIP/SOIC
Name
TSSOP
CS
SO
1
Chip Select Input
Serial Data Output
Ground
2
4
5
6
7
8
VSS
SI
Serial Data Input
Serial Clock Input
Hold Input
SCK
HOLD
VCC
Supply Voltage
3.1
Chip Select (CS)
A low level on this pin selects the device. A high level
deselects the device and forces it into Standby mode.
When the device is deselected, SO goes to the high-
impedance state, allowing multiple parts to share the
same SPI bus. After power-up, a low level on CS is
required, prior to any sequence being initiated.
Hold functionality is disabled by the STATUS register
bit.
3.2
Serial Output (SO)
The SO pin is used to transfer data out of the 23X640.
During a read cycle, data is shifted out on this pin after
the falling edge of the serial clock.
3.3
Serial Input (SI)
The SI pin is used to transfer data into the device. It
receives instructions, addresses and data. Data is
latched on the rising edge of the serial clock.
3.4
Serial Clock (SCK)
The SCK is used to synchronize the communication
between a master and the 23X640. Instructions,
addresses or data present on the SI pin are latched on
the rising edge of the clock input, while data on the SO
pin is updated after the falling edge of the clock input.
© 2009 Microchip Technology Inc.
DS22126C-page 13
23A640/23K640
4.0
4.1
PACKAGING INFORMATION
Package Marking Information
Example:
8-Lead PDIP
23K640
I/P 1L7
XXXXXXXX
T/XXXNNN
e
3
0528
YYWW
Example:
23K640I
8-Lead SOIC (3.90 mm)
XXXXXXXT
SN
0528
e
3
XXXXYYWW
1L7
NNN
Example:
K640
8-Lead TSSOP
XXXX
TYWW
I837
1L7
NNN
Legend: XX...X Part number or part number code
T
Temperature (I, E)
Y
Year code (last digit of calendar year)
YY
WW
NNN
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
e
3
Note: For very small packages with no room for the Pb-free JEDEC designator
, the marking will only appear on the outer carton or reel label.
e
3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
DS22126C-page 14
© 2009 Microchip Technology Inc.
23A640/23K640
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢆꢏꢐꢁꢂꢋꢐꢃꢆꢑꢇꢒꢆMꢆꢓꢔꢔꢆꢕꢋꢈꢆꢖꢗꢅꢘꢆꢙꢇꢍꢏꢇꢚ
ꢛꢗꢊꢃꢜ 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ
N
NOTE 1
E1
3
1
2
D
E
A2
A
L
A1
c
e
eB
b1
b
6ꢄꢃ&!
ꢚ7,8.ꢐ
ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢅ9ꢃ'ꢃ&!
ꢔꢚ7
7:ꢔ
<
ꢁꢀꢕꢕꢅ1ꢐ,
M
ꢁꢀ-ꢕ
M
ꢁ-ꢀꢕ
ꢁꢎꢘꢕ
ꢁ-?ꢘ
ꢁꢀ-ꢕ
ꢁꢕꢀꢕ
ꢁꢕ?ꢕ
ꢁꢕꢀ<
M
ꢔꢗ;
7"')ꢈꢉꢅꢋ%ꢅꢂꢃꢄ!
ꢂꢃ&ꢌꢍ
ꢙꢋꢓꢅ&ꢋꢅꢐꢈꢆ&ꢃꢄꢑꢅꢂꢇꢆꢄꢈ
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅꢙꢍꢃꢌ4ꢄꢈ!!
1ꢆ!ꢈꢅ&ꢋꢅꢐꢈꢆ&ꢃꢄꢑꢅꢂꢇꢆꢄꢈ
ꢐꢍꢋ"ꢇ#ꢈꢉꢅ&ꢋꢅꢐꢍꢋ"ꢇ#ꢈꢉꢅ>ꢃ#&ꢍ
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅ>ꢃ#&ꢍ
: ꢈꢉꢆꢇꢇꢅ9ꢈꢄꢑ&ꢍ
7
ꢈ
ꢗ
ꢗꢎ
ꢗꢀ
.
.ꢀ
ꢒ
9
ꢌ
)ꢀ
)
ꢈ1
M
ꢁꢎꢀꢕ
ꢁꢀꢛꢘ
M
ꢁꢀꢀꢘ
ꢁꢕꢀꢘ
ꢁꢎꢛꢕ
ꢁꢎꢖꢕ
ꢁ-ꢖ<
ꢁꢀꢀꢘ
ꢁꢕꢕ<
ꢁꢕꢖꢕ
ꢁꢕꢀꢖ
M
ꢁ-ꢎꢘ
ꢁꢎ<ꢕ
ꢁꢖꢕꢕ
ꢁꢀꢘꢕ
ꢁꢕꢀꢘ
ꢁꢕꢜꢕ
ꢁꢕꢎꢎ
ꢁꢖ-ꢕ
ꢙꢃꢓꢅ&ꢋꢅꢐꢈꢆ&ꢃꢄꢑꢅꢂꢇꢆꢄꢈ
9ꢈꢆ#ꢅꢙꢍꢃꢌ4ꢄꢈ!!
6ꢓꢓꢈꢉꢅ9ꢈꢆ#ꢅ>ꢃ#&ꢍ
9ꢋ*ꢈꢉꢅ9ꢈꢆ#ꢅ>ꢃ#&ꢍ
: ꢈꢉꢆꢇꢇꢅꢝꢋ*ꢅꢐꢓꢆꢌꢃꢄꢑꢅꢅꢏ
ꢛꢗꢊꢃꢉꢜ
ꢀꢁ ꢂꢃꢄꢅꢀꢅ ꢃ!"ꢆꢇꢅꢃꢄ#ꢈ$ꢅ%ꢈꢆ&"ꢉꢈꢅ'ꢆꢊꢅ ꢆꢉꢊ(ꢅ)"&ꢅ'"!&ꢅ)ꢈꢅꢇꢋꢌꢆ&ꢈ#ꢅ*ꢃ&ꢍꢅ&ꢍꢈꢅꢍꢆ&ꢌꢍꢈ#ꢅꢆꢉꢈꢆꢁ
ꢎꢁ ꢏꢅꢐꢃꢑꢄꢃ%ꢃꢌꢆꢄ&ꢅ,ꢍꢆꢉꢆꢌ&ꢈꢉꢃ!&ꢃꢌꢁ
-ꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄ!ꢅꢒꢅꢆꢄ#ꢅ.ꢀꢅ#ꢋꢅꢄꢋ&ꢅꢃꢄꢌꢇ"#ꢈꢅ'ꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢁꢅꢔꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢅ!ꢍꢆꢇꢇꢅꢄꢋ&ꢅꢈ$ꢌꢈꢈ#ꢅꢁꢕꢀꢕ/ꢅꢓꢈꢉꢅ!ꢃ#ꢈꢁ
ꢖꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢃꢄꢑꢅꢆꢄ#ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢃꢄꢑꢅꢓꢈꢉꢅꢗꢐꢔ.ꢅ0ꢀꢖꢁꢘꢔꢁ
1ꢐ,2ꢅ1ꢆ!ꢃꢌꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄꢁꢅꢙꢍꢈꢋꢉꢈ&ꢃꢌꢆꢇꢇꢊꢅꢈ$ꢆꢌ&ꢅ ꢆꢇ"ꢈꢅ!ꢍꢋ*ꢄꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ!ꢁ
ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢙꢈꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢕꢀ<1
© 2009 Microchip Technology Inc.
DS22126C-page 15
23A640/23K640
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆ ꢕꢄꢈꢈꢆ!ꢎꢊꢈꢋꢐꢃꢆꢑ ꢛꢒꢆMꢆꢛꢄ""ꢗ#$ꢆꢓ%&ꢔꢆꢕꢕꢆꢖꢗꢅꢘꢆꢙ !ꢏ'ꢚ
ꢛꢗꢊꢃꢜ 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ
D
e
N
E
E1
NOTE 1
1
2
3
α
h
b
h
c
φ
A2
A
L
A1
L1
β
6ꢄꢃ&!
ꢔꢚ99ꢚꢔ.ꢙ.ꢝꢐ
ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢅ9ꢃ'ꢃ&!
ꢔꢚ7
7:ꢔ
ꢔꢗ;
7"')ꢈꢉꢅꢋ%ꢅꢂꢃꢄ!
ꢂꢃ&ꢌꢍ
7
ꢈ
<
ꢀꢁꢎꢜꢅ1ꢐ,
: ꢈꢉꢆꢇꢇꢅ8ꢈꢃꢑꢍ&
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅꢙꢍꢃꢌ4ꢄꢈ!!
ꢐ&ꢆꢄ#ꢋ%%ꢅꢅꢏ
ꢗ
M
ꢀꢁꢎꢘ
ꢕꢁꢀꢕ
M
M
M
ꢀꢁꢜꢘ
M
ꢕꢁꢎꢘ
ꢗꢎ
ꢗꢀ
.
: ꢈꢉꢆꢇꢇꢅ>ꢃ#&ꢍ
?ꢁꢕꢕꢅ1ꢐ,
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅ>ꢃ#&ꢍ
: ꢈꢉꢆꢇꢇꢅ9ꢈꢄꢑ&ꢍ
,ꢍꢆ'%ꢈꢉꢅ@ꢋꢓ&ꢃꢋꢄꢆꢇA
3ꢋꢋ&ꢅ9ꢈꢄꢑ&ꢍ
.ꢀ
ꢒ
ꢍ
-ꢁꢛꢕꢅ1ꢐ,
ꢖꢁꢛꢕꢅ1ꢐ,
ꢕꢁꢎꢘ
ꢕꢁꢖꢕ
M
M
ꢕꢁꢘꢕ
ꢀꢁꢎꢜ
9
3ꢋꢋ&ꢓꢉꢃꢄ&
3ꢋꢋ&ꢅꢗꢄꢑꢇꢈ
9ꢈꢆ#ꢅꢙꢍꢃꢌ4ꢄꢈ!!
9ꢈꢆ#ꢅ>ꢃ#&ꢍ
ꢔꢋꢇ#ꢅꢒꢉꢆ%&ꢅꢗꢄꢑꢇꢈꢅꢙꢋꢓ
ꢔꢋꢇ#ꢅꢒꢉꢆ%&ꢅꢗꢄꢑꢇꢈꢅ1ꢋ&&ꢋ'
9ꢀ
ꢀ
ꢀꢁꢕꢖꢅꢝ.3
ꢕꢟ
ꢕꢁꢀꢜ
ꢕꢁ-ꢀ
ꢘꢟ
M
M
M
M
M
<ꢟ
ꢌ
)
ꢁ
ꢕꢁꢎꢘ
ꢕꢁꢘꢀ
ꢀꢘꢟ
ꢂ
ꢘꢟ
ꢀꢘꢟ
ꢛꢗꢊꢃꢉꢜ
ꢀꢁ ꢂꢃꢄꢅꢀꢅ ꢃ!"ꢆꢇꢅꢃꢄ#ꢈ$ꢅ%ꢈꢆ&"ꢉꢈꢅ'ꢆꢊꢅ ꢆꢉꢊ(ꢅ)"&ꢅ'"!&ꢅ)ꢈꢅꢇꢋꢌꢆ&ꢈ#ꢅ*ꢃ&ꢍꢃꢄꢅ&ꢍꢈꢅꢍꢆ&ꢌꢍꢈ#ꢅꢆꢉꢈꢆꢁ
ꢎꢁ ꢏꢅꢐꢃꢑꢄꢃ%ꢃꢌꢆꢄ&ꢅ,ꢍꢆꢉꢆꢌ&ꢈꢉꢃ!&ꢃꢌꢁ
-ꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄ!ꢅꢒꢅꢆꢄ#ꢅ.ꢀꢅ#ꢋꢅꢄꢋ&ꢅꢃꢄꢌꢇ"#ꢈꢅ'ꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢁꢅꢔꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢅ!ꢍꢆꢇꢇꢅꢄꢋ&ꢅꢈ$ꢌꢈꢈ#ꢅꢕꢁꢀꢘꢅ''ꢅꢓꢈꢉꢅ!ꢃ#ꢈꢁ
ꢖꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢃꢄꢑꢅꢆꢄ#ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢃꢄꢑꢅꢓꢈꢉꢅꢗꢐꢔ.ꢅ0ꢀꢖꢁꢘꢔꢁ
1ꢐ,2 1ꢆ!ꢃꢌꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄꢁꢅꢙꢍꢈꢋꢉꢈ&ꢃꢌꢆꢇꢇꢊꢅꢈ$ꢆꢌ&ꢅ ꢆꢇ"ꢈꢅ!ꢍꢋ*ꢄꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ!ꢁ
ꢝ.32 ꢝꢈ%ꢈꢉꢈꢄꢌꢈꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄ(ꢅ"!"ꢆꢇꢇꢊꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ(ꢅ%ꢋꢉꢅꢃꢄ%ꢋꢉ'ꢆ&ꢃꢋꢄꢅꢓ"ꢉꢓꢋ!ꢈ!ꢅꢋꢄꢇꢊꢁ
ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢙꢈꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢕꢘꢜ1
DS22126C-page 16
© 2009 Microchip Technology Inc.
23A640/23K640
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆ ꢕꢄꢈꢈꢆ!ꢎꢊꢈꢋꢐꢃꢆꢑ ꢛꢒꢆMꢆꢛꢄ""ꢗ#$ꢆꢓ%&ꢔꢆꢕꢕꢆꢖꢗꢅꢘꢆꢙ !ꢏ'ꢚ
ꢛꢗꢊꢃꢜ 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ
© 2009 Microchip Technology Inc.
DS22126C-page 17
23A640/23K640
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆ()ꢋꢐꢆ )"ꢋꢐ*ꢆ ꢕꢄꢈꢈꢆ!ꢎꢊꢈꢋꢐꢃꢆꢑ (ꢒꢆMꢆ+%+ꢆꢕꢕꢆꢖꢗꢅꢘꢆꢙ( !ꢇꢚ
ꢛꢗꢊꢃꢜ 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ
D
N
E
E1
NOTE 1
1
2
b
e
c
φ
A
A2
A1
L
L1
6ꢄꢃ&!
ꢔꢚ99ꢚꢔ.ꢙ.ꢝꢐ
ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢅ9ꢃ'ꢃ&!
ꢔꢚ7
7:ꢔ
ꢔꢗ;
7"')ꢈꢉꢅꢋ%ꢅꢂꢃꢄ!
ꢂꢃ&ꢌꢍ
7
ꢈ
<
ꢕꢁ?ꢘꢅ1ꢐ,
: ꢈꢉꢆꢇꢇꢅ8ꢈꢃꢑꢍ&
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅꢙꢍꢃꢌ4ꢄꢈ!!
ꢐ&ꢆꢄ#ꢋ%%ꢅ
ꢗ
M
ꢕꢁ<ꢕ
ꢕꢁꢕꢘ
M
ꢀꢁꢕꢕ
M
ꢀꢁꢎꢕ
ꢀꢁꢕꢘ
ꢕꢁꢀꢘ
ꢗꢎ
ꢗꢀ
.
: ꢈꢉꢆꢇꢇꢅ>ꢃ#&ꢍ
?ꢁꢖꢕꢅ1ꢐ,
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅ>ꢃ#&ꢍ
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅ9ꢈꢄꢑ&ꢍ
3ꢋꢋ&ꢅ9ꢈꢄꢑ&ꢍ
.ꢀ
ꢒ
9
ꢖꢁ-ꢕ
ꢎꢁꢛꢕ
ꢕꢁꢖꢘ
ꢖꢁꢖꢕ
-ꢁꢕꢕ
ꢕꢁ?ꢕ
ꢖꢁꢘꢕ
-ꢁꢀꢕ
ꢕꢁꢜꢘ
3ꢋꢋ&ꢓꢉꢃꢄ&
3ꢋꢋ&ꢅꢗꢄꢑꢇꢈ
9ꢈꢆ#ꢅꢙꢍꢃꢌ4ꢄꢈ!!
9ꢈꢆ#ꢅ>ꢃ#&ꢍ
9ꢀ
ꢀ
ꢀꢁꢕꢕꢅꢝ.3
ꢕꢟ
ꢕꢁꢕꢛ
ꢕꢁꢀꢛ
M
M
M
<ꢟ
ꢌ
)
ꢕꢁꢎꢕ
ꢕꢁ-ꢕ
ꢛꢗꢊꢃꢉꢜ
ꢀꢁ ꢂꢃꢄꢅꢀꢅ ꢃ!"ꢆꢇꢅꢃꢄ#ꢈ$ꢅ%ꢈꢆ&"ꢉꢈꢅ'ꢆꢊꢅ ꢆꢉꢊ(ꢅ)"&ꢅ'"!&ꢅ)ꢈꢅꢇꢋꢌꢆ&ꢈ#ꢅ*ꢃ&ꢍꢃꢄꢅ&ꢍꢈꢅꢍꢆ&ꢌꢍꢈ#ꢅꢆꢉꢈꢆꢁ
ꢎꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄ!ꢅꢒꢅꢆꢄ#ꢅ.ꢀꢅ#ꢋꢅꢄꢋ&ꢅꢃꢄꢌꢇ"#ꢈꢅ'ꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢁꢅꢔꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢅ!ꢍꢆꢇꢇꢅꢄꢋ&ꢅꢈ$ꢌꢈꢈ#ꢅꢕꢁꢀꢘꢅ''ꢅꢓꢈꢉꢅ!ꢃ#ꢈꢁ
-ꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢃꢄꢑꢅꢆꢄ#ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢃꢄꢑꢅꢓꢈꢉꢅꢗꢐꢔ.ꢅ0ꢀꢖꢁꢘꢔꢁ
1ꢐ,2 1ꢆ!ꢃꢌꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄꢁꢅꢙꢍꢈꢋꢉꢈ&ꢃꢌꢆꢇꢇꢊꢅꢈ$ꢆꢌ&ꢅ ꢆꢇ"ꢈꢅ!ꢍꢋ*ꢄꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ!ꢁ
ꢝ.32 ꢝꢈ%ꢈꢉꢈꢄꢌꢈꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄ(ꢅ"!"ꢆꢇꢇꢊꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ(ꢅ%ꢋꢉꢅꢃꢄ%ꢋꢉ'ꢆ&ꢃꢋꢄꢅꢓ"ꢉꢓꢋ!ꢈ!ꢅꢋꢄꢇꢊꢁ
ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢙꢈꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢕ<?1
DS22126C-page 18
© 2009 Microchip Technology Inc.
23A640/23K640
APPENDIX A: REVISION HISTORY
Revision A (12/2008)
Original Release.
Revision B (01/2009)
Revised Section 2.5: Added a paragraph.
Revision C (04/2009)
Removed Preliminary status; Revised Standby
Current; Revised Table 1-1, Param. No. D009; Revised
TSSOP Package marking information; Revised
Product ID.
© 2009 Microchip Technology Inc.
DS22126C-page 19
23A640/23K640
NOTES:
DS22126C-page 20
© 2009 Microchip Technology Inc.
23A640/23K640
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
Technical support is available through the web site
at: http://support.microchip.com
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com, click on Customer Change
Notification and follow the registration instructions.
© 2009 Microchip Technology Inc.
DS22126C-page 21
23A640/23K640
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
Technical Publications Manager
Reader Response
Total Pages Sent ________
RE:
From:
Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Y
N
23A640/23K640
DS22126C
Literature Number:
Device:
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS22126C-page 22
© 2009 Microchip Technology Inc.
23A640/23K640
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
/XX
X
–
Examples:
Tape & Reel
Package
Temp Range
a)
b)
c)
23K640-I/ST = 64 Kbit, 3.6V Serial SRAM,
Industrial temp., TSSOP package
23A640T-I/SN = 64 Kbit, 1.8V Serial SRAM,
Industrial temp., Tape & Reel, SOIC package
23K640-E/ST = 64 Kbit, 3.6V Serial SRAM,
Automotive temp., TSSOP package
Device:
23A640 =
23K640 =
64 Kbit, 1.8V, SPI Serial SRAM
64 Kbit, 3.6V, SPI Serial SRAM
Tape & Reel:
Blank
T
=
=
Standard packaging (tube)
Tape & Reel
Temperature
Range:
I
E
=
=
-40°C to+85°C
-40°C to +125°C
Package:
P
SN
ST
=
=
=
Plastic PDIP (300 mil body), 8-lead
Plastic SOIC (3.90 mm body), 8-lead
TSSOP, 8-lead
© 2009 Microchip Technology Inc.
DS22126C-page 23
23A640/23K640
NOTES:
DS22126C-page 24
© 2009 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, rfPIC, SmartShunt and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
FilterLab, Linear Active Thermistor, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, In-Circuit Serial
Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, nanoWatt XLP,
32
PICkit, PICDEM, PICDEM.net, PICtail, PIC logo, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select
Mode, Total Endurance, TSHARC, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2009, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2009 Microchip Technology Inc.
DS22126C-page 25
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4080
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Boston
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Seoul
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Cleveland
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Detroit
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-6578-300
Fax: 886-3-6578-370
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Santa Clara
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
03/26/09
DS22126C-page 26
© 2009 Microchip Technology Inc.
相关型号:
©2020 ICPDF网 联系我们和版权申明