SY87700 [MICREL]

CDR EVALUATION KIT; CDR评估套件
SY87700
型号: SY87700
厂家: MICREL SEMICONDUCTOR    MICREL SEMICONDUCTOR
描述:

CDR EVALUATION KIT
CDR评估套件

CD
文件: 总8页 (文件大小:61K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SY87700/SY87701 CDR  
EVALUATION KIT  
SY87700/SY87701  
EVALUATION BOARD  
FEATURES  
DESCRIPTION  
3.3V power supply:  
The SY87700 and SY87701 Clock and Data Recovery  
(CDR) chips are both high-performance ICs that are  
designed to provide protocol-independent clock and data  
recovery at any data rate between 32Mbps and 175Mbps  
for the SY87700 and 32Mbps to 1.25Gbps for the SY87701.  
Split V = +2V, GND = 0V  
CC  
V
V
= –1.3V for 3.3V  
= –3V for 5.0V  
EE  
EE  
Simple switch configuration  
PECL signal outputs  
This document provides design and implementation  
information, as well as a detailed description of the SY87700/  
701 evaluation board.  
Simple RDIN+, RDIN– PECL inputs  
Simple REFCLK TTL input  
The evaluation board is intended to provide a convenient  
test and evaluation platform for the SY87700/701 CDR  
device. This board can be used for many types of jitter  
tests, including SONET compliance of the SY87700/701,  
as well as PLL characterization.  
SY87700: Clock and data recovery from 32Mbps up  
to 175Mbps NRZ data stream, clock generation from  
32Mbps to 175Mbps  
SY87701: Clock and data recovery from 32Mbps up  
to 1.25Gbps NRZ data stream, clock generation from  
32Mbps to 1.25Gbps  
FUNCTIONAL BLOCK DIAGRAM  
CH1  
CH2  
Scope  
TRIG  
CLKOUT  
BERT Stack DATAIN  
150 ps TTC*  
DATAOUT–  
CLKIN  
150 ps TTC*  
VCC +2V  
LED ON - LOCK  
LFIN  
J1  
50Term.  
50Term.  
J12  
J11  
PECL  
PECL  
RDOUT+  
J4  
J5  
J2  
PECL  
PECL  
RDIN+ (PECL)  
RDOUT—  
RDIN— (PECL)  
PECL  
PECL  
J10  
J9  
RCLK+  
SY87700  
SY87701  
RCLK—  
J8  
J7  
PECL  
PECL  
TCLK+  
J6  
J3  
TTL  
REFCLK (TTL)  
GND 0V  
250 ps TTC*  
TCLK—  
50Term.  
VEE  
ZO = 50  
(—1.3V for 3.3V)  
(—3V for 5.0V)  
32 EP-TQFP  
Pulse  
Generator  
*Note: TTC = HP / Agilent Transition Time Converter  
150ps:HP15435A  
Spectrum  
Analyzer  
2000ps: HP15438A  
Figure 1. SY87700/SY87701 Evaluation Board and Test Set-Up  
Rev.: A  
Amendment: /0  
1
Issue Date: July 2002  
SY87700/701  
Evaluation Board  
Micrel  
FUNCTIONAL DESCRIPTION  
RDIN-BERT  
The evaluation board simplifies test and measurement of  
the SY87700 and SY87701. This section covers the various  
parts of the SY87700/701 evaluation board, and includes  
detailed information about these blocks. Performance of  
the SY87700/701 can be easily evaluated by following the  
step-by-step instructions found in the “Test Configuration”  
section.  
If you are using a high frequency bit error rate tester  
(such as the Agilent 70843B Error Performance Analyzer)  
to drive RDIN±, you will need to insert a 250ps Transition  
Time Converter (TTC) to slow its edge down.  
REFCLK  
If you are using a high frequency clock or pulse generator  
such as the Agilent 8133 to drive REFCLK, you will need to  
insert a 2000ps Transition Time Converter (TTC) to slow its  
edge down.  
Power Supply  
The SY87700L and SY87701L are 3.3V devices.  
Therefore, V  
should all be connected to 2.0V, and GND  
CC  
connected to 0V, and V should be connected to –1.3V.  
The SY87700V and SY87701V are 5.0V devices, therefore,  
Signal Outputs  
EE  
The SY87700/701 features PECL outputs for both  
RDOUT± and RCLK± and TCLK±. Unused pins should be  
left FLOATING.  
V
should be connected to 2V, and GND to 0V, and V  
CC  
EE  
should be connected to –3V.  
Board Design and Layout  
Test Configuration  
The evaluation board uses a force-sense design on the  
signal inputs where the signal pins (source pins) on the  
SY87700/701 are located on 50line, on the last layer.  
The sense lines, however, are located on layer 1. The force-  
sense design is handy for monitoring inputs to the SY87700/  
701 (such as input jitter). However, a 50terminator needs  
to be added to all unused sense outputs or the line will act  
as a quarter wave stub notch filter.  
This section contains step-by-step instructions for  
configuring the SY87700 and SY87701 for clock and data  
from the data stream of a BERT stack.  
1. Set switches on evaluation board for desired data and  
clock frequencies. There are seven switches in SW1:  
1. FREQSEL1  
2. FREQSEL2  
3. FREQSEL3  
4. CLKSEL  
5. DIVSEL2  
6. DIVSEL1  
7. CD  
LED  
The SY87700/701 evaluation board features one LED  
for monitoring the Link Fault Indicator (LFIN) pin. The LED  
will turn on when the PLL has locked-on to the RDIN input  
data stream, which indicates that LFIN has gone active  
HIGH. Additionally, LFIN can only go active when CD is  
HIGH and RDIN is within the 1000ppm frequency range of  
the PLL.  
See All Possible Legal Frequency and Divide Selec-  
tionssection on page 5, on how to set these switches. In  
addition, CLKSEL should be set HIGH which configures  
TCLK output as the recovered CLK from RDIN. If CLKSEL  
is low, TCLK will be the synthesized clock output. Addition-  
ally, CD should be set HIGH to allow the PLL to recover  
RDIN. If CD is low, RDIN is forced low.  
Signal Inputs  
Signal RDIN is 3.3V/5V PECL DC-coupled. Therefore,  
the current level for DC-coupled applications is V –2V.  
CC  
RDIN-DRIVEN  
2. Connect GND to 0V.  
3. Connect VCC to +2V.  
VCC  
VCC  
VCC +2V  
R1  
R1  
4. For 3.3V operation, connect VEE = 1.3V.  
For 5.0V operation, connect VEE = 3.0V.  
Z=50  
Z=50Ω  
J4  
J5  
RDIN+  
RDIN–  
5. Connect REFCLK (TTL) inputs to reference clock.  
Note: If using Agilent 8133A Pulse Generator, use  
250ps Time Transistion Converters on the 8133  
outputs.  
R2  
R2  
GND 0V  
VEE  
Note: For +5V systems  
VT = VCC 2  
(1.3V for 3.3V)  
(3V for 5.0V)  
R1 = 82, R2 = 130Ω  
For +3V systems  
R1 = 150, R2 = 75Ω  
6. Connect TCLK (PECL) outputs to data inputs on test  
equipment.  
7. Connect RDINV (PECL) inputs to data source.  
Figure 2. Test Set-Up  
8. Connect RDOUT (PECL) to outputs on test equipment.  
9. Connect RCLK outputs to clock inputs on test  
equipment.  
2
SY87700/701  
Evaluation Board  
Micrel  
FREQUENTLY ASKED QUESTIONS  
What is the Time Domain Reflectometry Test?  
What Do I Do with the Exposed Pad on the Bottom of  
the Package?  
TDR (Time Domain Reflectometry) is used to verify  
impedance continuity along a signal path. Many  
interconnects, such as SMA, if not launched correctly onto  
the PCB will exhibit inductive-like resonance with an abrupt  
capacitive discontinuity. This discontinuity will subtract signal  
from the inputs and outputs and effectively close the resulting  
data eye.  
The purpose of the exposed pad at the bottom of the  
package is to conduct heat more efficiently out of the  
package. Solder or use thermal conductive epoxy. Although  
the pad is connected to V , will not be any degradation in  
EE  
either output generated jitter or input jitter tolerance  
performance.  
What Should I Use to Generate REFCLK in My Design?  
I Just Got my Evaluation Board and I Cannot Get  
Anything to Work.  
This depends on data rate, jitter budget, and cost.  
However, REFCLK input jitter will affect the overall jitter  
performance of the system. A fundamental tone crystal-  
based oscillator is ideal. Measure the jitter of the oscillator  
with a Wavecrest DTS2077. A measurement above the  
3ps noise floor of the instrument is too high. Remember  
that the REFCLK input is multiplied by the DIVSEL selected  
value, so the resulting jitter increases by 20log (divide ratio).  
If you use a clock derived from an ASIC, verify the single  
cycle and accumulated cycle jitter.  
First check the power supplies. This evaluation board  
uses one power supply. You should see a current draw of  
about 200mA when the part is running normally. After that,  
check voltage swing levels of REFCLK. It is important to  
focus on getting the synthesizer (CMU) to work first (REFCLK  
to TCLK), before the data recovery side. TCLK synthesizer  
sets up the coarse adjust for the VCO in the CDR (or CRU),  
so if TCLK is not oscillating at the right frequency, the CDR  
will not lock. Another tip: use a frequency counter like  
HP53132A to measure frequency of TCLKit is often more  
foolproof than using the DSO. If using a DSO scope, like  
the Agilent CSA803, or the 11801 from Tektronix, trigger off  
of the REFCLK clock source.  
Crystal based oscillators typically have poor AC power  
supply rejection ratio, and if you are providing board power  
via 400kHz switching supplies you may have to provide  
some level of filtering, not just bypassing, for the supplies.  
Also verify that the oscillator output has no pedestalsin  
the response due to improper impedance matching and/or  
inadequate drive capability of the oscillator.  
After the synthesizer is operating as expected, make sure  
to change the trigger on the oscilloscope to trigger on the  
data generation instrument, such as second HP8133A, a  
Microwave Logic 1400, or HP70004A,70841 BERT stack.  
The BERT stack has a clock output, that be used to trigger  
the scope. The instrument generating REFCLK is not phase/  
frequency locked to the data generation side, so it would be  
impossible to examine an eyediagram.  
Do not use CMOS-based PLLs. They almost always have  
too much high frequency deterministic jitter for this  
application. Also fanning out one oscillator to several  
locations on your board is not a good idea. Crosstalk and  
inadequate drive can adversely affect performance. We  
recommend Raltron, Mutron, CTS, Plantronics, Frequency  
Management, etc., as vendors of crystal-based fundamental  
tone oscillators.  
Check the eye of the output source directly first, before  
going into the device. Most data generation instruments  
have deskew capability. It is important to deskew both the  
instrument and the ± coaxial cables into the DSO, otherwise  
youll have too much apparent deterministic jitter.  
Can you Suggest a Bypass/Decoupling Scheme?  
The SY87700/701 data sheet contains the evaluation  
board schematic, and a bill of materials list is included in  
this document. We have found this arrangement to be an  
excellent starting point. In addition, most system designs  
could be dramatically improved by spacing the power planes  
between ground planes to lower the self-inductance of the  
power distribution.  
Aside from setting the DIVSEL, and FREQSEL incorrectly,  
everything should operate as expected at this point.  
3
SY87700/701  
Evaluation Board  
Micrel  
What Layout Tips Do You Have?  
How Do You Suggest We Qualify and Evaluate  
Performance?  
1.  
Establish controlled impedance stripline, microstrip,  
or co-planar construction techniques for high-speed  
signal paths.  
Evaluation should start by measuring the jitter of the  
REFCLK input. The Clock Multiplier Unit (CMU) is simply a  
PLL. It multiplies the incoming REFCLK frequency, and jitter  
will usually worsen. The HP8133A pulse generator is ideal,  
and the user should include a Transition Time Converter on  
the 8133s output to slow its edges down. Make sure the  
rise/fall times are reasonable (not 28ps rise/fall found on  
the 12Gbps HP BERT clocks!) and 150ps TTCs will ensure  
this. Measure the TCLK output jitter using either the ± side,  
with the other side terminated. Suitable instruments for  
measuring the TCLK jitter are the CSA803, 11801, or the  
Wavecrest 2077. See Figure 1 for descriptions of set-up.  
Characterization of the jitter must include accumulation of  
many cycles or periods down to a specified low pass corner  
frequency. Wavecrest makes this easy with their 6.1 version  
software since the user can specify a low pass corner for  
the collected jitter. The Wavecrest instrument cannot be set  
up for single period measurements, but must look at the  
difference between the rising edges of the REFCLK and  
the TCLK using both channels and performing a histogram  
of the propagation time between the input REFCLK (which  
is the HP8133A trigger divided by one) and the output TCLK.  
2.  
3.  
All differential paths are critical timing paths, and  
skew should be matched to within ±10psec.  
Signal trace impedance should not vary more than  
±5%. If in doubt, perform TDR analysis of signal  
traces.  
4.  
5.  
Maintain compact filter networks as close to filter  
pins as possible.  
Provide ground plane relief under the filter path to  
reduce stray capacitance and be careful of crosstalk  
coupling into the filter network.  
6.  
Maintain low jitter on the REFCLK input by isolating  
the XTAL oscillator from power supply noise by  
adequately decoupling.  
7.  
8.  
Keep the XTAL oscillator close to SY87700/701.  
High speed operation may require use of  
fundamental-tone crystal-based oscillator for  
optimum performance. (Third overtone oscillators  
typically have more jitter.)  
9.  
Isolate the input, output, and REFCLK signal traces  
from other clock and data signals on your board if  
these other traces are within 3x the trace width.  
Isolation can be achieved by putting ground traces  
in between.  
Evaluation of the CDR is similar, except that the RCLK  
and RDOUT outputs are used instead. The procedure for  
measuring the RCLK jitter is identical to the above procedure  
for TCLK jitter.  
Evaluation of the output jitter on RDOUT using RCLK as  
a trigger source isnt trivial, as the minimum time between  
the scope trigger and measurement is 24ns for the Agilent  
86100A scope. Therefore the user must delay the data by  
the same amount, so that the jitter on RDOUT is measured  
with respect to the correct clock edge. This is important, as  
the SY87700/701 will retime the edges on RDOUT so that  
they better align with RCLK. The Wavecrest DTS2077 can  
also be used.  
Should I Adjust the Loop Lilter?  
The values found in the data sheets are the result of  
extensive modeling as well as lab testing. Therefore, we  
recommend starting with those values. Selecting values to  
simply reduce jitter does not work since there is a trade-off  
in jitter generation and jitter tolerance. However, for telecom  
applications under Bellcore,ITU/CCIT specifications it may  
be advantageous to adjust the values to trade off jitter  
transfer for jitter generation.  
The setup for SONET jitter compliance tests is shown in  
Figure 1. Agilent provides software for automated Bellcore  
jitter compliance tests. Contact Agilent for details.  
4
SY87700/701  
Evaluation Board  
Micrel  
DESCRIPTION OF CONNECTORS  
Connects to  
Connector  
Name  
Type  
PECL  
PECL  
TTL  
28-pin SOIC  
32-pin TQFP  
Pin 2  
Description  
J1  
RDIN+_S  
RDIN_S  
REFCLKS  
RDIN+_F  
RDIN_F  
REFCLK_F  
TCLK–  
Pin 4  
RDIN+ (Sense)  
RDIN(Sense)  
REFCLK(Sense)  
RDIN+ (Force)  
RDIN(Force)  
J2  
Pin 5  
Pin 3  
J3  
Pin 7  
Pin 5  
J4  
PECL  
PECL  
PECL  
PECL  
PECL  
PECL  
PECL  
PECL  
PECL  
Pin 4  
Pin 2  
J5  
Pin 5  
Pin 3  
J6  
Pin 7  
Pin 5  
REFCLK(Force)  
TCLK(Output)  
TCLK+ (Output)  
RCLK(Output)  
RCLK+ (Output)  
RDOUT(Output)  
RDOUT+ (Output)  
J7  
Pin 18  
Pin 19  
Pin 21  
Pin 22  
Pin 24  
Pin 25  
Pin 17  
Pin 18  
Pin 20  
Pin 21  
Pin 23  
Pin 24  
J8  
TCLK+  
J9  
RCLK–  
J10  
J11  
J12  
RCLK+  
RDOUT–  
RDOUT+  
ALL POSSIBLE LEGAL FREQUENCY AND DIVIDER SELECTIONS  
FREQSEL1  
FREQSEL2  
FREQSEL3  
fVCO/fRCLK  
fRCLK Data Rates (Mbps)  
125 175  
0
1
1
1
1
0
0
1
0
0
1
1
1
0
1
0
6
8
94 157  
1
12  
16  
24  
63 104  
0
47 78  
1
32 52  
0
undefined  
X(2)  
undefined  
NOTES:  
1. SY87700L operates from 32-175MHz. For higher speed applications, the SY87701L operates from 32-1250MHz.  
2. X is a DON'T CARE.  
DIVSEL1  
DIVSEL2  
fRCLK / fREFCLK  
0
0
1
1
0
1
0
1
8
10  
16  
20  
Table 1. M-Divider, f  
/ f  
Divider Setting  
RCLK REFCLK  
5
SY87700/701  
Evaluation Board  
Micrel  
32-PIN APPLICATION EXAMPLE  
R13  
VCC  
LED  
D2  
R12  
Q1  
2N2222A  
VEE  
DIODE  
D1  
32 31  
30 29 28 27 26 25  
VCC  
RDOUTP  
RDOUTN  
VCCO  
NC  
24  
23  
22  
1
2
3
4
5
6
7
8
1N4148  
RDINP  
R10  
RDINN  
FREQSEL1  
REFCLK  
1
2
3
4
5
6
7
RCLKP  
RCLKN  
VCCO  
21  
20  
19  
18  
FREQSEL2  
FREQSEL3  
CLKSEL  
DIVSEL1  
DIVSEL2  
TCLKP  
TCLKN  
NC  
17  
9
10  
11 12 13 14 15 16  
CD  
VEE R11 SW1  
1k  
C3  
C4  
GND  
R1  
R2  
C2  
C1  
Ferrite Bead  
BLM21A102  
VCCO (+2V)  
VCC (+2V)  
VCC  
L3  
L2  
L1  
VCCA (+2V)  
C5  
22 F  
C6  
0.1 F  
C7  
6.8 F  
C11  
0.1 F  
C12  
0.01 F  
C8  
6.8 F  
C13  
0.1 F  
C14  
0.01 F  
C9  
C15  
C16  
6.8 F  
0.1 F  
0.01 F  
GND  
C10  
6.8 F  
C17  
0.1 F  
C18  
0.01 F  
VEE (3V)  
VEE  
Note: VEE = 3.0V for 5.0V applications.  
EE = 1.3V for 3.3V applications.  
Low voltage parts have L designators.  
The V designator is for 5.0V applications,  
i.e., SY87700L = 3.3V, SY87700V = 5.0V.  
C21  
0.01 F  
C19  
1.0 F  
C20  
0.1 F  
V
VEEA (3V)  
Note:  
C3, C4 are optional  
C1 = C2 = 0.47µF  
R1 = 820Ω  
R2 = 1.2kΩ  
R3 through R10 = 5kΩ  
R12 = 12kΩ  
R13 = 130Ω  
6
SY87700/701  
Evaluation Board  
Micrel  
BILL OF MATERIALS  
Item  
C1  
Part Number  
Manufacturer  
Panasonic(1)  
Panasonic(1)  
Description  
Qty.  
Digi-Key PCC2147CT-ND  
Digi-Key PCC2147CT-ND  
Optional  
0.47µF, size 0.603  
0.47µF, size 0.603  
1
1
2
1
6
C2  
C3, C4  
C5  
Digi-Key PCC223BVCT-ND  
Digi-Key PCC1762CT-ND  
Panasonic(1)  
Panasonic(1)  
0.1µF, size 0.603  
0.47µF, size 0.603  
C6, C11, C13  
C15, C17, C20  
C7, C8, C9, C10  
Digi-Key PCC1800CT-ND  
Digi-Key PCC100CVCT-ND  
Panasonic(1)  
Panasonic(1)  
6.8µF, size 0.603  
0.01µF, size 0.603  
4
5
C12, C14, C16  
C18, C21  
C19  
R1  
Digi-Key PCC1787CT-ND  
Digi-Key P825HCT-ND  
Digi-Key P1.21KHCT-ND  
Digi-Key P5.11KHCT-ND  
Digi-Key P1KHCT-ND  
Digi-Key P12.1KHCT-ND  
Digi-Key P130HCT-ND  
SY87700/701  
Panasonic(1)  
Panasonic(1)  
Panasonic(1)  
Panasonic(1)  
Panasonic(1)  
Panasonic(1)  
Panasonic(1)  
1.0µF, size 0.603  
825, size 0.603  
1.21k, size 0.603  
5.11k, size 0.603  
1k, size 0.603  
1
1
1
8
1
1
1
1
R2  
R3 R10  
R11  
R12  
R13  
U1  
12.1k, size 0.603  
130, size 0.603  
Micrel Semiconductor(2) 5V/3.3V 32175Mbps AnyRate™  
Clock and Data Recovery  
Note 1. Panasonic, tel: 714-373-7366, http://www.panasonic.com  
Note 2. Micrel, tel: 408-944-0800, http://www.micrel.com  
(1), (3)  
SPECIAL CONSIDERATIONS  
θ
(°C/W) by Velocity (LFPM)  
JA  
Package  
0
200  
500  
28-Pin SOIC(2)  
80  
32-Pin EP-TQFP(3)  
27.6  
22.6  
20.7  
Note 1. Airflow of 500lfpm recommended for 28-pin SOIC.  
Note 2. The 28-pin SOIC package is NOT recommended for new designs.  
Note 3. Please use appropriate heat sink/thermal grease to insure device  
reliability.  
7
SY87700/701  
Evaluation Board  
Micrel  
MICREL, INC. 1849 FORTUNE DRIVE SAN JOSE, CA 95131 USA  
TEL + 1 (408) 944-0800 FAX + 1 (408) 944-0970 WEB http://www.micrel.com  
This information is believed to be accurate and reliable, however no responsibility is assumed by Micrel for its use nor for any infringement of patents or  
other rights of third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent right of Micrel, Inc.  
© 2002 Micrel, Incorporated.  
8

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