SY58024UMGTR [MICREL]
ULTRA-LOW JITTER DUAL 2 】 2 CROSSPOINT SWITCH w/ CML OUTPUTS AND INTERNAL I/O TERMINATION; 超低抖动双2 】 2交叉点开关W / CML输出和内部I / O终端型号: | SY58024UMGTR |
厂家: | MICREL SEMICONDUCTOR |
描述: | ULTRA-LOW JITTER DUAL 2 】 2 CROSSPOINT SWITCH w/ CML OUTPUTS AND INTERNAL I/O TERMINATION |
文件: | 总11页 (文件大小:129K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ULTRA-LOW JITTER DUAL 2 × 2
CROSSPOINT SWITCH w/ CML OUTPUTS
AND INTERNAL I/O TERMINATION
®
Precision Edge
SY58024U
FEATURES
■ Guaranteed AC performance over temperature and
®
Precision Edge
voltage:
• >10.7Gbps data throughput
DESCRIPTION
• <60ps t /t times
r f
• <350ps t (IN-to-Q)
pd
The SY58024U is a 2.5V/3.3V precision, high-speed, fully
differential dual CML crosspoint switch. The SY58024U is
optimized to provide two identical output copies with less
than 20ps of skew and ultra-low jitter. The SY58024U can
process clock signals as fast as 6GHz or data patterns up
to 10.7Gbps.
• <20ps skew
■ Low jitter:
• <10ps total jitter (clock)
PP
• <1ps
random jitter (data)
RMS
• <10ps deterministic jitter (data)
PP
The differential input includes Micrel’s unique, 3-pin input
termination architecture that allows the SY58024U to directly
interface to LVPECL, LVDS, and CML differential signal
(AC- or DC-coupled) without any level-shifting or termination
resistor networks in the signal path. The CML outputs
features a 400mV typical swing into 50Ω loads, and provides
an extremely fast rise/fall time guaranteed to be less than
60ps.
■ Crosstalk induced jitter: <0.7ps
RMS
■ Unique, patent-pending input isolation minimizes
adjacent channel crosstalk
■ Accepts an input signal as low as 100mV
■ Unique, patent-pending input termination and VT pin
accepts DC-coupled and AC-coupled differential
inputs: LVPECL, LVDS, and CML
The SY58024U operates from a 2.5V ±5% supply or
3.3V ±10% supply and is guaranteed over the full industrial
temperature range (–40°C to +85°C). For applications that
require high-speed single channel CML switches, consider
the SY58023U. The SY58024U is part of Micrel’s high-
■ Fully differential inputs/outputs
■ 50Ω source terminated CML outputs
■ Power supply 2.5V ±5% and 3.3V ±10%
■ Industrial –40°C to +85°C temperature range
®
speed, Precision Edge product line.
®
■ Available in 32-pin (5mm × 5mm) MLF package
Datasheets and support documentation can be found on
Micrel’s website at www.micrel.com.
APPLICATIONS
■ Gigabit Ethernet data/clock routing
■ SONET data/clocking routing
■ Switch fabric clock routing
■ Redundant switchover
■ Backplane redundancy
Precision Edge is a registered trademark of Micrel, Inc.
MLF and MicroLeadFrame are registered trademarks of Amkor Technology.
Rev.: G
Amendment: /0
M9999-020207
hbwhelp@micrel.com or (408) 955-1690
1
Issue Date: February 2007
Precision Edge®
SY58024U
Micrel, Inc.
PACKAGE/ORDERING INFORMATION
Ordering Information(1)
Package
Type
Operating
Range
Package
Marking
Lead
Finish
32 31 30 29 28 27 26 25
Part Number
SY58024UMI
SY58024UMITR
1
24
23
GND
VCC
QA0
/QA0
VCC
QA1
/QA1
VCC
INB1
VTB1
/INB1
SELB0
INB0
VTB0
/INB0
SELB1
MLF-32
MLF-32
MLF-32
Industrial
Industrial
Industrial
SY58024U
SY58024U
Sn-Pb
Sn-Pb
2
3
4
5
6
7
(2)
22
21
20
19
18
SY58024UMG(3)
SY58024U with
Pb-Free bar-line indicator
Pb-Free
NiPdAu
SY58024UMGTR(2, 3) MLF-32
Industrial
SY58024U with
Pb-Free bar-line indicator
Pb-Free
NiPdAu
8
17
9
10 11 12 13 14 15 16
Notes:
1. Contact factory for die availability. Dice are guaranteed at TA = 25°C, DC electricals only.
2. Tape and Reel.
®
32-Pin MLF (MLF-32)
3. Pb-Free package recommended for new designs.
PIN DESCRIPTION
Pin Number
Pin Name
Pin Function
25, 27
29, 31,
1, 3,
INA0, /INA0,
INA1, /INA1,
INB1, /INB1
INB0, /INB0
Differential Signal: Each pin of this pair internally terminates with 50Ω to the VT pin. The
input will default to an indeterminate state if left open. See “Input Interface Application”
section.
5, 7
26, 30
2, 6
VTA0, VTA1,
VTB1, VTB0
Input Termination Center-Tap: Each input terminates to this pin. The VT pin provides a
center-tap for each input (IN, /IN) to a termination network for maximum interface flexibility.
See “Input Interface Application” section.
32, 28,
8, 4
SELA0, SELA1,
SELB1, SELB0
Select Input: TTL/CMOS select input controls that selects inputs IN0, or IN1, for their
respective banks A and B. Each input is internally connected to a 25kΩ pull-up
resistor and will default to a logic high state if left open.
9,24
GND,
Exposed Pad
Ground. Exposed pad must be connected to a ground plane that is the same potential as the
device ground pins.
10,13,16,
17, 20, 23
VCC
Positive Power Supply: Bypass with 0.1µF 0.01µF low ESR capacitors as close to the VCC
pins as possible.
11, 12,
14, 15
18, 19,
21, 22
/QB0, QB0,
/QB1, QB1,
/QA1, QA1,
/QA0, QA0
CML Differential Output Pairs: Differential buffered output copy of the selected input signal.
The CML single-ended output swing is typically 400mV into 50Ω or 100Ω across the pair.
Unused output pairs may be left floating with no impact on jitter. See “CML Output
Termination” section.
TRUTH TABLE
SELA0
SELA1
QA0
INA0
INA0
INA1
INA1
QA1
INA0
INA1
INA0
INA1
SELB0
SELB1
QB0
INB0
INB1
INB1
INB1
QB1
INB0
INB1
INB0
INB1
0
0
1
1
0
1
0
1
0
0
1
1
0
1
0
1
M9999-020207
hbwhelp@micrel.com or (408) 955-1690
2
Precision Edge®
SY58024U
Micrel, Inc.
FUNCTIONAL BLOCK DIAGRAM
SY58024U Dual 2 × 2 Crosspoint Switch
Bank A
SELA0
0
1
INA0
VTA0
QA0
50Ω
50Ω
/QA0
/INA0
SELA1
INA1
VTA1
0
1
QA1
50Ω
50Ω
/QA1
/INA1
Bank B
SELB0
0
1
INB0
VTB0
QB0
50Ω
50Ω
/QB0
/INB0
SELB1
INB1
VTB1
0
1
QB1
50Ω
50Ω
/QB1
/INB1
M9999-020207
hbwhelp@micrel.com or (408) 955-1690
3
Precision Edge®
SY58024U
Micrel, Inc.
Absolute Maximum Ratings(1)
Operating Ratings(2)
Supply Voltage (V ) .................................. –0.5V to +4.0V Supply Voltage (V ) ............................ +2.375V to +3.60V
CC
CC
Input Voltage (V ) ......................................... –0.5V to V
Ambient Temperature (T ) ......................... –40°C to +85°C
IN
CC
A
(3)
CML Output Voltage (V
)......... V –1.0V to V +0.5V Package Thermal Resistance
OUT
CC CC
®
MLF (θ
)
Current (V )
JA
T
Still-Air .............................................................35°C/W
Source or Sink Current on VT pin .................. ±100mA
500lfpm............................................................28°C/W
Input Current (V )
T
®
MLF (ψ
)
JB
Source or Sink Current on IN, /IN.....................±50mA
Junction-to-board resistance ...........................20°C/W
Lead Temperature (soldering, 20 sec.) ..................... 260°C
Storage Temperature (T ) ........................... –65°C +150°C
S
(4)
DC ELECTRICAL CHARACTERISTICS
TA = –40°C to +85°C.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply Voltage
2.5V nominal
3.3V nominal
2.375
3.0
2.5
3.3
2.625
3.60
V
V
ICC
Power Supply Current
VCC = max., current through internal
50Ω source termination resistor included.
200
250
mA
VIH
Input HIGH Voltage
Input LOW Voltage
Input Voltage Swing
Differential Input Swing
IN-to-VT Resistance
IN, /IN
VCC –1.2
VCC
VIH –0.1
1.7
V
V
V
V
Ω
V
VIL
IN, /IN
0
VIN
IN, /IN, see Figure 1a.
IN, /IN, see Figure 1b.
0.1
0.2
40
VDIFF_IN
RIN
50
60
IN to VT
1.28
(4)
LVTTL/CMOS DC ELECTRICAL CHARACTERISTICS
VCC = 2.5V ±5% or 3.3V ±10%; TA= -40°C to 85°C
Symbol
VIH
Parameter
Condition
Min
Typ
Max
Units
V
Input HIGH Voltage
Input LOW Voltage
Input HIGH Current
Input LOW Current
2.0
VIL
0.8
40
V
IIH
µA
µA
IIL
–300
Notes:
1. Permanent device damage may occur if ratings in the “Absolute Maximum Ratings” section are exceeded. This is a stress rating only and functional
operation is not implied for conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings
conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Thermal performance assumes exposed pad is soldered (or equivalent) to the device's most negative potential (GND) on the PCB. θ uses 4-layer
JA
in still-air, unless otherwise stated.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
M9999-020207
hbwhelp@micrel.com or (408) 955-1690
4
Precision Edge®
SY58024U
Micrel, Inc.
(6)
CML OUTPUT DC ELECTRICAL CHARACTERISTICS
VCC = +3.3V ±10% or +2.5V ±5%; RL = 100Ω across each pair; TA = –40°C to +85°C, unless otherwise stated.
Symbol
VOH
Parameter
Condition
Min
VCC–0.020
325
Typ
Max
VCC
500
1000
60
Units
V
Output HIGH Voltage
Output Voltage Swing
Differential Voltage Swing
Output Source Impedance
Q0, /Q0; Q1, /Q1
VOUT
Q0, /Q0; Q1, /Q1; see Figure 1a.
Q0, /Q0; Q1, /Q1; see Figure 1b.
Q0, /Q0; Q1, /Q1
400
800
50
mV
mV
Ω
VDIFF_OUT
ROUT
650
40
Notes:
6. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
(7)
AC ELECTRICAL CHARACTERISTICS
VCC = +2.5V ±5% or +3.3V ±10%; RL = 100Ω across each output pair; TA = –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
IN ≥ 100mV; VOUT ≥ 200mV
Min
Typ
Max
Units
GHz
Gbps
ps
fMAX
Maximum Operating Frequency
V
Clock
6
NRZ Data 10.7
tpd
Propagation Delay
IN-to-Q
200
100
350
400
SEL-to-Q
ps
tSKEW
Channel-to-Channel Skew
(Within Bank)
Note 8
Note 9
20
75
1
ps
Part-to-Part Skew
ps
tJITTER
Clock
Cycle-to-Cycle Jitter Note 10
Total Jitter Note 11
psRMS
psPP
psRMS
psPP
psRMS
10
1
Data
Random Jitter Note 12
Deterministic Jitter Note 13
10
0.7
Crosstalk Induced Jitter Note 14
Adjacent Channel
tr, tf
Output Rise/Fall Time
20% to 80% at full swing.
25
60
ps
Notes:
7. High frequency AC-parameters are guaranteed by design and characterization.
8. Skew is measured between outputs of the same bank under identical transitions.
9. Skew is defined for two parts with identical power supply voltages at the same temperature and with no skew of the edges at the respective inputs.
10. Cycle-to-cycle jitter definition: The variation of periods between adjacent cycles, T –T
where T is the time between rising edges of the output
n
n–1
signal.
12
11. Total jitter definition: With an ideal clock input of frequency ≤ f
, no more than one output edge in 10 output edges will deviate by more than the
MAX
specified peak-to-peak jitter value.
12. Random jitter is measured with a K28.7 comma detect character pattern, measured at 2.5Gbps–3.2Gbps.
23
13. Deterministic jitter is measured at 2.5Gbps–3.2Gbps with both K28.5 and 2 –1 PRBS pattern.
14. Crosstalk induced jitter is defined as the added jitter that results from signals applied to two adjacent channels. It is measured at the output while
applying similar, differential clock frequencies that are asynchronous with respect to each other at inputs.
M9999-020207
hbwhelp@micrel.com or (408) 955-1690
5
Precision Edge®
SY58024U
Micrel, Inc.
SINGLE-ENDED AND DIFFERENTIAL SWINGS
VDIFF_IN
,
VIN,
VOUT
Typ. 400mV
VDIFF_OUT (Typ. 800mV)
Figure 1b. Differential Voltage Swing
Figure 1a. Single-Ended Voltage Swing
TIMING DIAGRAM
/IN
IN
/Q
Q
VOUT = 400mV (typ.)
(50Ω load)
tpd
tpd
VOUT = 400mV (typ.)
(50Ω load)
Figure 2a. AC Timing Diagram IN-to-Q
VCC/2
VCC/2
SEL
/Q
tpd
tpd
VOUT = 400mV (typ.)
(50Ω load)
Q
IN0, /IN1 = LOW, /IN0, IN1 = HIGH
Figure 2b. AC Timing Diagram SEL-to-Q
M9999-020207
hbwhelp@micrel.com or (408) 955-1690
6
Precision Edge®
SY58024U
Micrel, Inc.
TYPICAL OPERATING CHARACTERISTICS
VCC = 2.5V, VIN = 100mV, TA = 25°C, unless otherwise noted.
Propagation Delay vs.
Temperature
Frequency vs. Amplitude
500
205
204
203
202
201
200
199
198
197
196
195
450
400
350
300
250
200
150
100
50
0
0
2000 4000 6000 8000 10000
FREQUENCY (MHz)
-60 -40 -20
0
20 40 60 80 100
TEMPERATURE (°C)
Propagation Delay vs.
Input Voltage Swing
Within Device Skew vs.
Temperature
215
210
205
200
195
190
185
180
175
3.5
3
2.5
2
1.5
1
0.5
0
0
200 400 600 800 1000 1200
INPUT VOLTAGE SWING (mV)
-60 -40 -20
0
20 40 60 80 100
TEMPERATURE (¡C)
M9999-020207
hbwhelp@micrel.com or (408) 955-1690
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Precision Edge®
SY58024U
Micrel, Inc.
FUNCTIONAL CHARACTERISTICS
VCC = 2.5V, VIN = 100mV, TA = 25°C, unless otherwise noted.
5Gbps Output
2.5GHz Output
223–1 PRBS
TIME (50ps/div.)
TIME (50ps/div.)
1.25GHz Output
200MHz Output
TIME (600ps/div.)
TIME (100ps/div.)
M9999-020207
hbwhelp@micrel.com or (408) 955-1690
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Precision Edge®
SY58024U
Micrel, Inc.
INPUT STAGE
VCC
IN
VT
50Ω
50Ω
GND
/IN
Figure 3. Simplified Differential Input Buffer
INPUT INTERFACE APPLICATIONS
VCC
VCC
VCC
VCC
VCC
VCC
IN
IN
LVPECL
CML
/IN
/IN
IN
SY58024U
CML
SY58024U
/IN
0.01µF
R1
R2
VT
0.01µF
SY58024U
VT
Rpd
NC
VT
For 2.5V, Rpd = 19Ω.
For 3.3V, Rpd = 50Ω.
For 2.5V, R1 = 1kΩ, R2 = 1.1kΩ.
For 3.3V, R1 = 649Ω, R2 = 1kΩ.
Figure 4c. DC-Coupled LVPECL
Input Interface
Figure 4a. DC-Coupled CML
Input Interface
Option: may connect VT to VCC
Figure 4b. AC-Coupled CML
Input Interface
VCC
VCC
IN
VCC
VCC
LVPECL
/IN
Rpd
Rpd
IN
SY58024U
LVDS
/IN
R1
R2
0.01µF
VT
SY58024U
NC
VT
For 2.5V, Rpd = 50Ω, R1 = 1kΩ, R2 = 1.1kΩ.
For 3.3V, Rpd = 100Ω, R1 = 649Ω, R2 = 1kΩ.
Figure 4d. AC-Coupled LVPECL
Input Interface
Figure 4e. LVDS
Input Interface
M9999-020207
hbwhelp@micrel.com or (408) 955-1690
9
Precision Edge®
SY58024U
Micrel, Inc.
CML OUTPUT TERMINATION
Figures 5 and Figure 6 illustrates how to terminate a configuration. All outputs of the SY58024U are 50Ω with a
CML output using both the AC-coupled and DC-coupled 16mA current source.
VCC
VCC
DC-bias
per application
50Ω
50Ω
Q
50Ω
50Ω
Q
50Ω
50Ω
100Ω
/Q
/Q
16mA
16mA
GND
GND
Figure 5. CML
DC-Coupled Termination
Figure 6. CML
AC-Coupled Termination
RELATED PRODUCT AND SUPPORT DOCUMENTATION
Part Number
Function
Data Sheet Link
SY58023U
Ultra-low Jitter 2x2 Crosspoint Switch
w/CML Outputs and Internal I/O Termination
http://www.micrel.com/product-info/products/SY58023U.shtml
http://www.micrel.com/product-info/products/sy58024u.shtml
www.amkor.com/products/notes_papers/MLF_AppNote.pdf
http://www.micrel.com/product-info/as/solutions.shtml
SY58024U
Ultra-low Jitter Dual 2x2 Crosspoint Switch
w/CML Outputs and Internal I/O Termination
32-MLF Manufactering Guidelines
Exposed Pad Application Note
HBW Solutions
M9999-020207
hbwhelp@micrel.com or (408) 955-1690
10
Precision Edge®
SY58024U
Micrel, Inc.
®
32-PIN MicroLeadFrame (MLF-32)
Package
EP- Exposed Pad
Die
CompSide Island
Heat Dissipation
Heat Dissipation
VEE
Heavy Copper Plane
Heavy Copper Plane
®
VEE
PCB Thermal Consideration for 32-Pin MLF Package
(Always solder, or equivalent, the exposed pad to the PCB)
Package Notes:
1. Package meets Level 2 qualification.
2. All parts are dry-packaged before shipment.
3. Exposed pads must be soldered to a ground for proper thermal management.
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL + 1 (408) 944-0800 FAX + 1 (408) 474-1000 WEB http://www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify
Micrel for any damages resulting from such use or sale.
© 2005 Micrel, Incorporated.
M9999-020207
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11
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