RS3MBG [MDD]
SURFACE MOUNT FAST RECOVERY RECTIFIER;型号: | RS3MBG |
厂家: | Chendahang Electronics Co., Ltd |
描述: | SURFACE MOUNT FAST RECOVERY RECTIFIER 快速恢复二极管 |
文件: | 总3页 (文件大小:770K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
RS3ABG THRU RS3MBG
Reverse Voltage - 50 to 1000 Volts Forward Current - 3.0 Ampere
SURFACE MOUNT FAST RECOVERY RECTIFIER
Features
DO-214AA/SMB
The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
Idea for printed circuit board
0.155(3.94)
0.130(3.30)
0.086 (2.20)
0.071 (1.80)
Open Junction chip
Low reverse leakage
0.185(4.70)
0.160(4.06)
High forward surge current capability
High temperature soldering guaranteed:
250℃/ 10 seconds at terminals
Glass passivated chip junction
0.012(0.305)
0.006(0.152)
0.096(2.44)
0.084(2.13)
Mechanical Data
0.060(1.52)
0.030(0.76)
0.008(0.203)MAX.
Case : JEDEC DO-214AA/SMB Molded plastic body
Terminals : Solder plated, solderable per MIL-STD-750,Method 2026
Polarity : Polarity symbol marking on body
Mounting Position: Any
0.220(5.59)
0.200(5.08)
Weight
: 0.003 ounce, 0.098 grams
Dimensions in inches and (millimeters)
Maximum Ratings And Electrical Characteristics
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
RS3ABG RS3BBG RS3DBG RS3GBG RS3JBG RS3KBG RS3MBG
Parameter
SYMBOLS
UNITS
MDD
MDD
MDD
MDD
MDD
MDD
MDD
Marking Code
RS3AB RS3BB RS3DB RS3GB RS3JB RS3KB RS3MB
50
35
50
100
70
200
140
200
400
280
400
600
420
600
800
560
800
1000
700
V
V
V
V
RMM
RMS
DC
Maximum repetitive peak reverse voltage
Maximum RMS voltage
V
100
1000
Maximum DC blocking voltage
V
Maximum average forward rectified current
I
(AV)
3.0
A
A
at TL=90
℃
Peak forward surge current
90
I
FSM
8.3ms single half sine-wave
superimposed onrated load (JEDEC Method)
Maximum instantaneous forward voltage at 3.0A
V
F
1.30
V
5.0
100.0
Maximum DCreverse current
at rated DCblocking voltage
T
A
=25
TA=125℃
(NOTE 1)
℃
I
R
μA
t
rr
150
250
500
ns
Maximum reverserecovery time
40.0
60.0
pF
Typical junction capacitance (NOTE 2)
Typical thermal resistance (NOTE 3)
C
J
℃/
W
R
JA
STG
-55 to +150
℃
Operating junction and storage temperature range T T
J,
Note:1.Reverse recovery condition IF=0.5A,IR=1.0A,Irr=0.25A
2.P.C.B. mounted with 2.0x2.0”(5x5cm) copper pad areas
3.The typical data above is for reference only.
DN:T19709A0
https://www.microdiode.com
Rev:2019A0
Page :1
RS3ABG THRU RS3MBG
Reverse Voltage - 50 to 1000 Volts Forward Current - 3.0 Ampere
Ratings And Characteristic Curves
Fig.2 Typical Reverse Characteristics
100
Fig.1 Maximum Average Forward Current Rating
4.0
3.5
3.0
2.5
TJ=125°C
10
2.0
1.5
1.0
1.0
TJ=25°C
0.5
0.0
Single phase half-wave 60 Hz
resistive or inductive load
0.1
25
50
75
100
125
150
175
00
20
40
60
80
100 120
140
Case Temperature (°C)
percent of Rated Peak Reverse Voltage (%)
Fig.3 Typical Instaneous Forward
Characteristics
Fig.4 Typical Junction Capacitance
10
TJ=25°C
TJ=25°C
100
10
1
1.0
0.1
TJ=25°C
f = 1.0MHz
Vsig = 50mVp-p
pulse with 300μs
1% duty cycle
0.01
0.0
0.5
1.0
1.5
2.0
2.5
0.1
1.0
10
100
Instaneous Forward Voltage (V)
Reverse Voltage (V)
Fig.5 Maximum Non-Repetitive Peak
Forward Surge Current
120
100
80
60
40
20
8.3 ms Single Half Sine Wave
(JEDEC Method)
00
1
10
100
Number of Cycles
The curve above is for reference only.
https://www.microdiode.com
Rev:2019A0
Page :2
RS3ABG THRU RS3MBG
Reverse Voltage - 50 to 1000 Volts Forward Current - 3.0 Ampere
Packing information
P0
P1
unit:mm
d
E
F
Symbol
Item
Tolerance
SMB
W
B
Carrier width
Carrier length
Carrier depth
Sprocket hole
A
B
C
d
D
0.1
0.1
0.1
0.05
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
3.81
5.41
2.42
1 5.0
330.00
50.00
13.00
1.75
5.55
8.00
4.00
2.00
A
P
13" Reel outside diameter
13" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
D1
D2
E
F
P
P0
P1
D2
D1
T
C
W1
D
T
W
W1
0.30
12.00
12.30
Reel width
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
Reel packing
APPROX.
GROSS WEIGHT
COMPONENT
SPACING
INNER
BOX
(mm)
REEL
DIA,
(mm)
CARTON
SIZE
(mm)
BOX
(pcs)
CARTON
(pcs)
REEL
(pcs)
PACKAGE
REEL SIZE
(kg)
(mm)
SMB
4.0
13"
3,000
190*190*41
330
365*365*360
10,000
80,000
14.0
Suggested Pad Layout
Symbol
Unit (mm)
Unit (inch)
0.110
A
B
C
D
E
2.8
2.4
4.6
2.2
7.0
0.094
0.181
0.086
0.276
Important Notice and Disclaimer
Microdiode Electronics (Jiangsu) reserves the right to make changes to this document and its products and
specifications at any time without notice. Customers should obtain and confirm the latest product information and
specifications before final design,purchase or use.
Microdiode Electronics (Jiangsu) makes no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, not does Microdiode Electronics (Jiangsu) assume any liability for application
assistance or customer product design. Microdiode Electronics (Jiangsu) does not warrant or accept any liability with
products which are purchased or used for any unintended or unauthorized application.
No license is granted by implication or otherwise under any intellectual property rights of Microdiode
Electronics (Jiangsu).
Microdiode Electronics (Jiangsu) products are not authorized for use as critical components in life support
devices or systems without express written approval of Microdiode Electronics (Jiangsu).
https://www.microdiode.com
Rev:2019A0
Page :3
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