MAX8559ETAG2 [MAXIM]
Dual, 300mA, Low-Noise Linear Regulator with Independent Shutdown in UCSP or TDFN; 双通道, 300mA,低噪声线性稳压器在UCSP或TDFN独立的关断型号: | MAX8559ETAG2 |
厂家: | MAXIM INTEGRATED PRODUCTS |
描述: | Dual, 300mA, Low-Noise Linear Regulator with Independent Shutdown in UCSP or TDFN |
文件: | 总12页 (文件大小:267K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
19-3121; Rev 0; 1/04
Dual, 300mA, Low-Noise Linear Regulator
with Independent Shutdown in UCSP or TDFN
General Description
Features
The MAX8559 dual, low-noise, low-dropout (LDO) linear
regulator operates from a 2.5V to 6.5V input voltage
and delivers at least 300mA of continuous output cur-
rent. It offers low output noise and low dropout of only
60mV at 100mA. Typical output noise for this device is
♦ Two Low-Dropout-Voltage Regulators
♦ Low 32µV Output Noise
RMS
♦ 300mA Output Current for Each LDO
♦ 70dB PSRR at 10kHz
32µV
, and PSRR is 70dB at 10kHz. Designed with
RMS
♦ Independent Shutdown Controls
♦ Low 60mV Dropout at 100mA Load
an internal P-channel MOSFET pass transistor, the
MAX8559 maintains a low 115µA supply current per
LDO, independent of the load current and dropout volt-
age. Other features include short-circuit protection and
thermal-shutdown protection. The MAX8559 includes
two independent logic-controlled shutdown inputs and
is capable of operating without a bypass capacitor to
further reduce total solution size. The MAX8559 is avail-
able in a miniature 8-bump UCSP (2mm x 1mm) or
8-pin TDFN (3mm x 3mm) package.
♦ 115µA Operating Supply Current per LDO
♦ 1.5V to 3.3V Factory-Preset Output
♦ Small Ceramic Output Capacitors
♦ Output Current Limit
♦ Thermal-Overload and Short-Circuit Protection
♦ 1.95W Power-Dissipation Capability (TDFN)
♦ 2mm2 Footprint (UCSP)
Applications
Cellular and Cordless Phones
PDAs and Palmtop Computers
Notebook Computers
Digital Cameras
Ordering Information
PART
TEMP RANGE
-40°C to +85°C
-40°C to +85°C
PIN-PACKAGE
8 UCSP (B8-1)
8 TDFN-EP**
MAX8559EBAxy*†
MAX8559ETAxy*
PCMCIA Cards
*xy = Output voltage code (see the Output Voltage
Selector Guide).
Wireless LAN Cards
**EP = Exposed pad.
†Future product—contact factory for availability.
Hand-Held Instruments
Typical Operating Circuit
Pin Configurations
TOP VIEW
INPUT
8
7
6
5
2.5V TO 6.5V
2.2µF
min
1.5V TO 3.3V
INA
INB
OUTA
OUTB
BP
2.2µF/150mA
4.7µF/300mA
MAX8559ETA
1.5V TO 3.3V
ON
ON
MAX8559
GND
SHDNA
SHDNB
2.2µF/150mA
4.7µF/300mA
OFF
OFF
2
3
1
4
0.01µF
(OPTIONAL)
TDFN
3mm x 3mm
Pin Configurations continued at end of data sheet.
Output Voltage Selector Guide appears at end of data sheet.
________________________________________________________________ Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
Dual, 300mA, Low-Noise Linear Regulator
with Independent Shutdown in UCSP or TDFN
ABSOLUTE MAXIMUM RATINGS
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range.............................-65°C to +150°C
8-Pin TDFN Lead Temperature (soldering, 10s)..............+300°C
8-Bump UCSP Solder Profile...........................................(Note 1)
INA, INB, SHDNA, SHDNB, BP to GND ...................-0.3V to +7V
INA to INB..............................................................-0.3V to +0.3V
OUTA, OUTB to GND ..................................-0.3V to (V + 0.3V)
IN
Output Short-Circuit Duration.....................................Continuous
Continuous Power Dissipation (T = +70°C)
A
8-Bump UCSP (derate 4.7mW/°C above +70°C)..........379mW
8-Pin TDFN (derate 24.4mW/°C above +70°C) ..........1951mW
Note 1: For UCSP solder profile information, please refer to the application note APP_1891 on the Maxim website, www.maxim-ic.com.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V = 3.8V, SHDNA = SHDNB = IN_, T = -40°C to +85°C, unless otherwise noted. Typical values are at T = +25°C.) (Note 1)
IN
A
A
PARAMETER
SYMBOL
CONDITIONS
MIN
2.5
2.15
-1
TYP
MAX
6.5
UNITS
Input Voltage
V
V
V
IN
Undervoltage-Lockout Threshold
V
V
rising, hysteresis is 40mV (typ)
IN
2.35
2.45
+1
UVLO
T
T
T
= +25°C, I
= I
= 1mA
A
A
OUTA
OUTB
= -40°C to +85°C, I
= I
= 1mA
=
OUTB
-2
+2
OUTA
OUTA
OUTB
Output Voltage Accuracy
%
= -40°C to +85°C, I
or I
A
-3
+3
0.1mA to 300mA
Maximum Output Current
Output Current Limit
I
300
310
mA
mA
OUT_
I
550
180
115
220
0.6
60
920
290
LIM_
No load
Ground Current
I
µA
No load, one LDO shutdown
Q
I
I
I
= I
= 100mA
OUTA
OUT_
OUT_
OUTB
= 1mA
= 100mA
= (V + 0.1V) to 6.5V, I
Dropout Voltage
(Note 2)
V
-
OUT_
mV
V
IN_
120
Line Regulation
∆V
V
= 1mA
-0.15
0
+0.15
%/V
LNR
IN_
OUT_
OUT_
100Hz to 100kHz, C
= 10µF,
OUT_
32
254
70
I
= 1mA, C = 0.01µF
BP
OUT_
Output Voltage Noise
µV
RMS
100Hz to 100kHz, C
= 10µF,
OUT_
I
= 1mA, C = not installed
BP
OUT_
V
C
C
= V
= 0.01µF,
+ 1V,
OUT_
10kHz
IN_
BP
Power-Supply Ripple Rejection
PSRR
dB
= 2.2µF,
OUT_
100kHz
54
I
= 50mA
OUT_
SHUTDOWN
T
T
= +25°C
0.01
0.1
1
A
Shutdown Supply Current
I
SHDN_ = 0V
µA
V
SHDN
= -40°C to +85°C
A
V
Input high voltage
Input low voltage
1.6
IH
SHDN Input Threshold
V
0.4
IL
2
_______________________________________________________________________________________
Dual, 300mA, Low-Noise Linear Regulator
with Independent Shutdown in UCSP or TDFN
ELECTRICAL CHARACTERISTICS (continued)
(V = 3.8V, SHDNA = SHDNB = IN_, T = -40°C to +85°C, unless otherwise noted. Typical values are at T = +25°C.) (Note 1)
IN
A
A
PARAMETER
SHDN Input Bias Current
Discharge Resistance in
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
T
A
T
A
= +25°C
10
100
SHDN_ = IN or
GND
I
nA
SHDN
= -40°C to +85°C
100
V
OUT_
SHDN_ = GND
385
Ω
Shutdown
THERMAL PROTECTION
Thermal-Shutdown Temperature
Thermal-Shutdown Hysteresis
T
T rising
J
+160
10
°C
°C
SHDN
∆T
SHDN
Note 1: All units are 100% production tested at T = +25°C. Limits over the operating temperature range are guaranteed by design.
A
Note 2: The dropout voltage is defined as V - V
when V
is 100mV below the nominal value of V
. Specification only
IN
OUT
OUT
OUT
applies when V
≥ 2.5V.
OUT
Typical Operating Characteristics
(V
= V
= 2.85V, V
= V
= 3.8V, C
= 2.2µF (or 4.7µF for 300mA), C = 0.01µF, and C = 2.2µF (or 4.7µF for
OUT BP IN
OUTA
OUTB
INA
INB
300mA), unless otherwise noted.)
GROUND CURRENT
vs. LOAD CURRENT
GROUND CURRENT
vs. SUPPLY VOLTAGE
GROUND CURRENT
vs. TEMPERATURE
250
225
200
175
150
125
100
75
225
200
175
150
125
100
75
300
100mA LOAD, BOTH OUTPUTS
100mA LOAD, BOTH OUTPUTS
250
BOTH OUTPUTS LOADED
200
150
100
NO LOAD, BOTH OUTPUTS
NO LOAD, BOTH OUTPUTS
50
50
50
0
25
25
0
0
0
1
2
3
4
5
6
0
50
100
150
200
250
300
-40
-15
10
35
60
85
SUPPLY VOLTAGE (V)
LOAD CURRENT (mA)
TEMPERATURE (°C)
_______________________________________________________________________________________
3
Dual, 300mA, Low-Noise Linear Regulator
with Independent Shutdown in UCSP or TDFN
Typical Operating Characteristics (continued)
(V
= V
= 2.85V, V
= V
= 3.8V, C
= 2.2µF (or 4.7µF for 300mA), C = 0.01µF, and C = 2.2µF (or 4.7µF for
OUTA
OUTB
INA
INB
OUT
BP
IN
300mA), unless otherwise noted.)
DROPOUT VOLTAGE
vs. LOAD CURRENT
OUTPUT VOLTAGE ACCURACY
vs. LOAD CURRENT
200
180
160
140
120
100
80
0
-0.1
-0.2
-0.3
-0.4
-0.5
-0.6
-0.7
60
40
20
0
250
0
50
100
150
200
300
0
50
100
150
200
250
300
LOAD CURRENT (mA)
LOAD CURRENT (mA)
OUTPUT VOLTAGE ACCURACY
vs. TEMPERATURE
PSRR vs. FREQUENCY
0.4
0.3
80
70
60
50
40
30
20
10
0
0.2
100mA LOAD, BOTH OUTPUTS
0.1
0
-0.1
-0.2
-0.3
-0.4
-0.5
-0.6
100mA LOAD, BOTH OUTPUTS
I
= 50mA
OUTA
0.01
0.1
1
10
100
1000
-40
-15
10
35
60
85
FREQUENCY (kHz)
TEMPERATURE (°C)
CHANNEL-TO-CHANNEL ISOLATION
vs. FREQUENCY
OUTPUT-NOISE SPECTRAL DENSITY
vs. FREQUENCY
100
90
80
70
60
50
40
30
20
10
0
10,000
1000
100
R
= 100Ω
LOAD
I
= 10mA
OUTA
10
0.01
0.1
1
10
100
1000
0.01
0.1
1
10
100
FREQUENCY (kHz)
FREQUENCY (kHz)
4
_______________________________________________________________________________________
Dual, 300mA, Low-Noise Linear Regulator
with Independent Shutdown in UCSP or TDFN
Typical Operating Characteristics (continued)
(V
= V
= 2.85V, V
= V
= 3.8V, C
= 2.2µF (or 4.7µF for 300mA), C = 0.01µF, and C = 2.2µF (or 4.7µF for
OUT BP IN
OUTA
OUTB
INA
INB
300mA), unless otherwise noted.)
OUTPUT NOISE
(10Hz to 100kHz)
LINE TRANSIENT
MAX8559 toc10
MAX8559 toc11
4.5V
V
INA
3.5V
1V/div
V
500µV/div
OUT_
10mV/div
AC-COUPLED
V
OUTA
I
= 100mA
OUTA
1ms/div
40µs/div
LOAD TRANSIENT
NEAR DROPOUT
LOAD TRANSIENT
MAX8559 toc13
MAX8559 toc12
V
OUTA
V
20mV/div
AC-COUPLED
OUTA
20mV/div
AC-COUPLED
100mA/div
0
100mA/div
0
I
OUTA
I
OUTA
10µs/div
10µs/div
SHUTDOWN RESPONSE
MAX8559 toc14
V
OUTA
1V/div
0
1V/div
0
V
SHDNA
1ms/div
_______________________________________________________________________________________
5
Dual, 300mA, Low-Noise Linear Regulator
with Independent Shutdown in UCSP or TDFN
Pin Description
PIN
NAME
FUNCTION
TDFN
UCSP
LDO A Regulator Input. Connect to INB. Input voltage can range from 2.5V to 6.5V. Bypass INA
with a ceramic capacitor to GND (see the Capacitor Selection and Regulator Stability section).
1
A1
INA
Shutdown A Input. A logic-low on SHDNA shuts down regulator A. If SHDNA and SHDNB are both
low, both regulators and the internal reference are off and the supply current is reduced to 10nA
(typ). If either SHDNA or SHDNB is a logic high, the internal reference is on. Connect SHDNA to
INA for always-on operation of regulator A.
2
3
A2
A3
SHDNA
SHDNB
Shutdown B Input. A logic-low on SHDNB shuts down regulator B. If SHDNA and SHDNB are both
low, both regulators and the internal reference are off and the supply current is reduced to 10nA
(typ). If either SHDNA or SHDNB is a logic high, the internal reference is on. Connect SHDNB to
INB for always-on operation of regulator B.
LDO B Regulator Input. Connect to INA. Input voltage can range from 2.5V to 6.5V. Bypass INB
with a ceramic capacitor to GND (see the Capacitor Selection and Regulator Stability section).
4
5
A4
B4
INB
Regulator B Output. OUTB can source up to 300mA continuous current. Bypass OUTB with a
ceramic capacitor to GND (see the Capacitor Selection and Regulator Stability section). During
shutdown, OUTB is internally discharged to GND through a 385Ω resistor.
OUTB
6
7
B3
B2
GND
BP
Ground
Reference Noise Bypass. Bypass BP with a low-leakage 0.01µF ceramic capacitor for reduced
noise at both outputs.
Regulator A Output. OUTA can source up to 300mA continuous current. Bypass OUTA with a
ceramic capacitor to GND (see the Capacitor Selection and Regulator Stability section). During
shutdown, OUTB is internally discharged to GND through a 385Ω resistor.
8
B1
—
OUTA
Exposed Connect to ground plane. EP also functions as a heatsink. Solder to the circuit-board ground
Paddle plane to maximize thermal dissipation.
EP
lower, allowing more current to pass to the output and
Detailed Description
increasing the output voltage. If the feedback voltage is
too high, the pass-transistor gate is pulled up, allowing
less current to pass to the output. The output voltage is
fed back through an internal resistor voltage-divider
connected to OUT_.
The MAX8559 is a dual, low-noise, low-dropout, low-qui-
escent-current linear regulator designed primarily for
battery-powered applications. The regulators are avail-
able with preset 1.5V to 3.3V output voltages. These out-
puts can supply loads up to 300mA with a 4.7µF output
capacitor, or up to 150mA with a 2.2µF output capacitor.
As illustrated in the Functional Diagram, the MAX8559
consists of a 1.25V reference, error amplifiers, P-chan-
nel pass transistors, internal feedback voltage-dividers,
and autodischarge circuitry.
Internal P-Channel Pass Transistor
The MAX8559 features two 0.6Ω P-channel MOSFET
pass transistors. A P-channel MOSFET provides sever-
al advantages over similar designs using PNP pass
transistors, including longer battery life. It requires no
base drive, reducing quiescent current considerably.
PNP-based regulators waste considerable current in
dropout when the pass transistor saturates, and they
also use high base-drive currents under large loads.
The MAX8559 does not suffer from these problems,
and with both outputs on it only consumes 180µA of
Feedback Control Loop
The 1.25V bandgap reference is connected to the error
amplifier’s inverting input. The error amplifier compares
this reference with the feedback voltage and amplifies
the difference. If the feedback voltage is lower than the
reference voltage, the pass-transistor gate is pulled
6
_______________________________________________________________________________________
Dual, 300mA, Low-Noise Linear Regulator
with Independent Shutdown in UCSP or TDFN
quiescent current at no load and 220µA with 100mA
load current on both outputs (see the Typical Operating
Characteristics). A PNP-based regulator has a high
dropout voltage that is independent of the load. A P-
channel MOSFET’s dropout voltage is proportional to
load current, providing for low dropout voltage at heavy
loads and extremely low dropout at lighter loads.
The maximum power dissipation allowed is:
= (T - T ) / (R + R
P
)
θBA
MAX
J
A
θJB
where T - T is the temperature difference between
J
A
the MAX8559 die junction and the surrounding air,
(R ) is the thermal resistance of the package,
R
θJB
and R
θJC
is the thermal resistance through the printed
θBA
circuit board, copper traces, and other materials to the
surrounding air.
Current Limit
The MAX8559 contains two independent current lim-
iters, one for each regulator output, monitoring and
controlling the pass transistor’s gate voltage and limit-
ing the output current to 310mA (min). The outputs can
be shorted to ground continuously without damaging
the part.
The exposed paddle of the TDFN package performs
the function of channeling heat away. Connect the
exposed paddle to the board ground plane.
Applications Information
Capacitor Selection and
Regulator Stability
Low-Noise Operation
An external 0.01µF bypass capacitor at BP in conjunc-
tion with an internal resistor creates a lowpass filter.
For load currents up to 150mA, use a single 2.2µF
capacitor to bypass both inputs of the MAX8559 and a
2.2µF capacitor to bypass each output. Larger input-
capacitor values and lower ESRs provide better supply-
noise rejection and line-transient response. To reduce
output noise and improve load-transient voltage dips,
use larger output capacitors up to 10µF. For stable oper-
ation over the full temperature range with load currents
up to 300mA, input and output capacitors should be a
minimum of 4.7µF.
The MAX8559 exhibits less than 32µV
voltage noise with C = 0.01µF and C
of output
RMS
= 10µF. The
BP
OUT
Typical Operating Characteristics show a graph of
Output-Noise Spectral Density with these values. If out-
put noise is not critical, the BP capacitor can be
removed to reduce total solution size and cost.
Shutdown
The MAX8559 has independent shutdown control
inputs (SHDNA and SHDNB). Drive SHDNA low to shut
down OUTA. Drive SHNDB low to shut down OUTB.
Drive both SHDNA and SHDNB low to shut down the
entire chip, reducing supply current to 0.01µA. Connect
SHDNA or SHDNB to a logic high or IN_ for always-on
operation of the corresponding LDO. Each LDO output
is internally discharged to ground through a 385Ω
resistor in shutdown mode.
Note that some ceramic dielectrics exhibit large capaci-
tance and ESR variation with temperature. With
dielectrics such as Z5U and Y5V, it may be necessary to
use 4.7µF or more for up to 150mA load current to
ensure stability at temperatures below -10°C. With X7R
or X5R dielectrics, 2.2µF is sufficient at all operating tem-
peratures. These regulators are optimized for ceramic
capacitors. Tantalum capacitors are not recommended.
Use a 0.01µF bypass capacitor at BP for low-output volt-
age noise. Increasing the capacitance slightly decreas-
es the output noise, but increases the startup time.
Thermal-Overload Protection
Thermal-overload protection limits total power dissipa-
tion in the MAX8559. Each regulator has its own inde-
pendent thermal detector. When one of the regulators’
PSRR and Operation from Sources Other
than Batteries
junction temperature exceeds T = +160°C, that regu-
J
lator’s pass transistor is turned off allowing the IC to
cool. The thermal sensor turns the pass transistor on
again after the IC’s junction temperature cools by 10°C.
This results in a pulsed output during continuous ther-
mal-overload conditions.
The MAX8559 is designed to deliver low-dropout volt-
ages and low quiescent currents in battery-powered
systems. Power-supply rejection ratio is 70dB at 10kHz
(see Power-Supply Rejection Ratio vs. Frequency in
the Typical Operating Characteristics). When operat-
ing from sources other than batteries, improved sup-
ply-noise rejection and transient response is achieved
by increasing the values of the input and output
bypass capacitors and through passive RC or CRC fil-
tering techniques.
Operating Region and Power Dissipation
The MAX8559 maximum power dissipation depends on
the thermal resistance of the case and the circuit board,
the temperature difference between the die junction and
ambient air, and the rate of airflow. The power dissipa-
tion across the device is P = I
x (V - V
).
OUT
OUT
IN
_______________________________________________________________________________________
7
Dual, 300mA, Low-Noise Linear Regulator
with Independent Shutdown in UCSP or TDFN
where:
Load-Transient Considerations
The MAX8559 load-transient response graphs (see the
Typical Operating Characteristics) show two compo-
nents of the output response: a DC shift in the output
voltage due to the different load currents and the tran-
sient response. Typical overshoot for step changes in
the load current from 10µA to 100mA is 15mV. Increase
the output capacitor’s value and decrease its ESR to
attenuate transient spikes.
V
P
= maximum input voltage
IN(MAX)
= maximum power dissipation of the package
MAX
(379mW for the UCSP and 1951mW for the TDFN)
V
V
= output voltage of OUTA
OUTA
OUTB
OUTA
OUTB
= output voltage of OUTB
I
I
= maximum output current of OUTA
= maximum output current of OUTB
Dropout Voltage
A regulator’s minimum input-output voltage differential
(or dropout voltage) determines the lowest usable sup-
ply voltage. In battery-powered systems, this determines
the useful end-of-life battery voltage. Because the
MAX8559 uses an internal P-channel MOSFET pass
transistor, its dropout voltage is a function of the drain-
P should be less than P
consider the TDFN.
. If P is greater than P
,
MAX
MAX
Layout Guidelines
Due to the low output noise and tight output voltage
accuracy required by most applications, careful PC
board layout is required. An evaluation kit
(MAX8559EVKIT) is available to speed design.
to-source on-resistance (R
) multiplied by the load
DS(ON)
current (see the Typical Operating Characteristics).
Follow these guidelines for good PC board layout:
Calculating the Maximum Output Power
in UCSP
• Keep the input and output paths short and wide if
possible, especially at the ground terminals.
The maximum output power of the MAX8559 is limited
by the maximum power dissipation of the package. By
calculating the power dissipation of the package as a
function of the input voltage, output voltages, and out-
put currents, the maximum input voltage can be
obtained. The maximum power dissipation should not
exceed the package’s maximum power rating.
• Use thick copper PC boards (2oz vs. 1oz) to
enhance thermal capabilities.
• Place output, input, and bypass capacitors as close
as possible to the IC.
• Ensure traces to BP and the BP capacitor are away
from noisy sources to ensure low output voltage noise.
P = (V
- V
OUTA
- V
OUTB
) x I
) x I
IN(MAX)
OUTA
OUTB
+ (
VIN(MAX)
8
_______________________________________________________________________________________
Dual, 300mA, Low-Noise Linear Regulator
with Independent Shutdown in UCSP or TDFN
Functional Diagram
INA
MAX8559
SHDNA
SHUTDOWN
AND POWER-ON
CONTROL
SHDNB
MOS DRIVER
ERROR
AMP
P
WITH I
LIMIT
OUTA
1.25V
REF
THERMAL
SENSOR
LDOA
SHDNA
GND
INB
BP
OUTB
LDOB
_______________________________________________________________________________________
9
Dual, 300mA, Low-Noise Linear Regulator
with Independent Shutdown in UCSP or TDFN
Output Voltage Selector Guide
Pin Configurations (continued)
PART
V
V
TOP MARK
AAE
AAF
AAG
AAH
AAC
AAI
OUTA (x)
1.50
1.80
2.50
2.80
2.85
2.85
2.90
3.00
3.00
3.00
1.50
1.80
2.50
2.80
2.80
2.85
2.85
2.85
2.90
3.00
3.00
OUTB (y)
3.30
3.00
1.80
1.80
2.85
3.00
2.90
1.80
2.85
3.00
3.30
3.00
1.80
1.80
3.00
1.80
2.85
3.00
2.90
1.80
3.00
TOP VIEW
MAX8559EBA8A
MAX8559EBA2G
MAX8559EBAP2
MAX8559EBAK2
MAX8559EBAJJ
MAX8559EBAJG
MAX8559EBAII
MAX8559EBAG2
MAX8559EBAGJ
MAX8559EBAGG
MAX8559ETA8A
MAX8559ETA2G
MAX8559ETAP2
MAX8559ETAK2
MAX8559ETAKG
MAX8559ETAJ2
MAX8559ETAJJ
MAX8559ETAJG
MAX8559ETAII
A1
B1
A2
A3
A4
B4
MAX8559EBA
AAB
AAJ
B3
B2
AAD
AAA
AIM
UCSP
(2.06mm x 1.03mm)
ALK
ALL
ALM
AIN
ALD
AIG
Chip Information
ALN
AIF
TRANSISTOR COUNT: 634
PROCESS: BiCMOS
MAX8559ETAG2
MAX8559ETAGG
ALO
AIE
Note: Standard voltage options, shown in bold, are available.
Contact the factory for other output voltages between 1.5V and
3.3V. Minimum order quantity is 15,000 units.
10 ______________________________________________________________________________________
Dual, 300mA, Low-Noise Linear Regulator
with Independent Shutdown in UCSP or TDFN
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
PACKAGE OUTLINE, 4x2 UCSP
1
21-0156
A
1
______________________________________________________________________________________ 11
Dual, 300mA, Low-Noise Linear Regulator
with Independent Shutdown in UCSP or TDFN
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
L
A
D2
D
A2
PIN 1 ID
1
N
1
C0.35
b
[(N/2)-1] x e
REF.
E
E2
PIN 1
INDEX
AREA
DETAIL A
e
k
A1
C
L
C
L
L
L
e
e
A
DALLAS
SEMICONDUCTOR
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE, 6, 8 & 10L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
APPROVAL
DOCUMENT CONTROL NO.
REV.
NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY
1
2
21-0137
D
COMMON DIMENSIONS
SYMBOL
MIN.
0.70
2.90
2.90
0.00
0.20
MAX.
A
0.80
3.10
3.10
0.05
0.40
D
E
A1
L
k
0.25 MIN.
0.20 REF.
A2
PACKAGE VARIATIONS
PKG. CODE
T633-1
N
6
D2
E2
e
JEDEC SPEC
b
[(N/2)-1] x e
1.90 REF
1.95 REF
2.00 REF
1.50±0.10 2.30±0.10 0.95 BSC
1.50±0.10 2.30±0.10 0.65 BSC
MO229 / WEEA
MO229 / WEEC
0.40±0.05
0.30±0.05
T833-1
8
T1033-1
10
1.50±0.10 2.30±0.10 0.50 BSC MO229 / WEED-3 0.25±0.05
DALLAS
SEMICONDUCTOR
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE, 6, 8 & 10L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
APPROVAL
DOCUMENT CONTROL NO.
REV.
2
2
21-0137
D
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2004 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.
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