MAX6629_V01 [MAXIM]
12-Bit Sign Digital Temperature Sensors with Serial Interface;
| 型号： | MAX6629_V01 |
| 厂家： | 
MAXIM INTEGRATED PRODUCTS |
| 描述： | 12-Bit Sign Digital Temperature Sensors with Serial Interface |
| 文件： | 总8页 (文件大小：859K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MAX6629–MAX6632
12-Bit + Sign Digital Temperature Sensors
with Serial Interface
General Description
Features
● Low Power Consumption
The MAX6629–MAX6632 are local digital temperature
sensors with an SPI-compatible serial interface. The
temperature is converted to a 12-bit + sign word with a
resolution of 0.0625°C/LSB. An extended temperature
range provides useful readings up to +150°C.
• 32μA typ (MAX6631/MAX6632)
• 200μA typ (MAX6629/MAX6630)
● 12-Bit + Sign Resolution with 0.0625°C/LSB
● Accuracy
These sensors are 3-wire serial interface SPI compatible,
allowing the MAX6629–MAX6632 to be readily connected
to a variety of microcontrollers (μCs). The MAX6629–
MAX6632 are read-only devices, simplifying their use in
systems where only temperature data is required.
• ±1°C (max) from 0°C to +70°C
● +150°C Extended Temperature Range
● SPI-Compatible Serial Interface
● +3.0V to +5.5V Supply Range
All four digital temperature sensors require very little
supply current, making them ideal for portable systems.
The MAX6631/MAX6632 perform a temperature-to-digital
conversion once every 8s and require minimal average
supply current, 32μA (typ). The MAX6629/MAX6630
perform a conversion once every 0.5s and require only
200μA (typ) supply current. Any of these temperature
sensors can perform conversions more often—up to
approximately four conversions per second by reading the
conversion results more often.
● 6-Pin TDFN and SOT23 Packages
● Lead-Free Version Available (TDFN Package)
Ordering Information
PART
TEMP RANGE
-55°C to +125°C
-55°C to +125°C
-55°C to +125°C
-55°C to +125°C
-55°C to +125°C
-55°C to +125°C
-55°C to +125°C
PIN-PACKAGE
6 TDFN-EP*
6 SOT23
MAX6629MTT+
MAX6629MUT#G16
MAX6630MTT+
MAX6630MUT#G16
MAX6631MTT+
MAX6632MTT+
MAX6632MUT#G16
6 TDFN-EP*
6 SOT23
Applications
6 TDFN-EP*
6 TDFN-EP*
6 SOT23
● Cellular
● Industrial Control
● Systems
● Hard Disk Drive
● HVACs
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
Typical Application Circuit
+3V TO +5.5V
Pin Configurations
V
CC
MAX6629
MAX6630
MAX6631
MAX6632
TOP VIEW
N.C.
1
2
3
6
5
4
SO
GND
N.C.
1
2
3
6
5
4
SO
SO
0.1µF
MAX6629
MAX6631
MAX6630
MAX6632
GND
CS
CS
µC
CS
GND
V
SCK
V
SCK
CC
CC
SCK
SOT23
TDFN
SOT23
TDFN
19-2047; Rev 6; 11/16
MAX6629–MAX6632
12-Bit + Sign Digital Temperature Sensors
with Serial Interface
Absolute Maximum Ratings
All voltages referenced to GND.
Junction Temperature......................................................+150°C
Operating Temperature Range (Note 1)...........-55°C to +150°C
Storage Temperature Range.............................-65°C to +150°C
Lead Temperature (soldering, 10s).................................+300°C
Soldering Temperature (reflow)
V
...........................................................................-0.3V, +6.0V
CC
SO, SCK, CS....................................................-0.3V, V
SO .......................................................................-1mA to +50mA
Current into Any Pin ............................................................10mA
+ 0.3V
CC
Continuous Power Dissipation (T = +70°C)
6-Pin SOT23 (derate 9.10mW/°C above +70°C).........727mW
6-Pin TDFN (derate 24.4mW/°C above +70°C).........1951mW
TDFN............................................................................+260°C
SOT23 (Ordering Information contains “#”).................+245°C
SOT23 (Ordering Information contains “-”)..................+240°C
A
Note 1: It is not recommended to operate the device above +125°C for extended periods of time.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Electrical Characteristics
(V
= +3.0V to +5.5V, T = -55°C to +125°C, unless otherwise noted. Typical values are at V
= +3.3V and T = +25°C.) (Notes
CC
A
CC A
2 and 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
TEMPERATURE
T
= room temp, V
= +3.3V
-0.8
-1.0
-1.6
-2.3
-3.2
-1.0
-5.0
±0.2
±0.2
+0.3
+0.5
+0.8
+1.5
+1.5
0.2
+0.8
+1.0
+1.6
+2.3
+3.2
+3.5
+6.5
0.6
A
CC
0°C ≤ T ≤ +70°C, V
= +3.3V
A
CC
-20°C ≤ T ≤ +85°C, V
= +3.3V
A
CC
Accuracy
-20°C ≤ T ≤ +100°C, V
= +3.3V
= +3.3V
°C
A
CC
-40°C ≤ T ≤ +125°C, V
A
CC
T
T
≥ -55°C, V
= +3.3V
A
CC
= +150°C, V
= +3.3V
A
CC
Power-Supply Sensitivity
Resolution
PSS
°C/V
°C
0.0625
0.37
5.9
MAX6629, MAX6630, CS high
MAX6631, MAX6632, CS high
0.5
8
0.65
10.5
320
Time Between Conversion
Starts
t
s
SAMPLE
Conversion Time
t
180
250
ms
CONV
POWER SUPPLY
Supply Voltage Range
V
3.0
5.5
5
V
CC
I
Shutdown (Note 3), V
= +0.8V
CC
SD
Supply Current, SCK Idle
Average Operating Current
I
ADC idle (Figure 2), CS = low
ADC converting (Figure 2)
MAX6629, MAX6630
6
20
µA
IDLE
I
360
200
32
650
400
50
CONV
I
µA
V
CC
MAX6631, MAX6632
Power-On Reset (POR)
Threshold
V
CC
falling
1.6
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MAX6629–MAX6632
12-Bit + Sign Digital Temperature Sensors
with Serial Interface
Electrical Characteristics (continued)
(V
= +3.0V to +5.5V, T = -55°C to +125°C, unless otherwise noted. Typical values are at V
= +3.3V and T = +25°C.) (Notes
CC
A
CC A
2 and 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
LOGIC INPUTS (CS, SCK)
0.3 x
Logic Input Low Voltage
V
IL
V
V
CC
0.7 x
Logic Input High Voltage
V
V
IH
V
CC
Input Leakage Current
LOGIC OUTPUTS (SO)
Output Low Voltage
Output High Voltage
I
V
= V or +5.5V
GND
±1
±5
µA
LEAK
IN
V
I
I
= 1.6mA
0.4
V
V
OL
SINK
V
= 1.6mA
SOURCE
V
- 0.4
OH
CC
TIMING CHARACTERISTICS (Notes 4 and 5)
Serial Clock Frequency
SCK Pulse Width High
SCK Pulse Width Low
CS Fall to SCK Rise
f
5
MHz
ns
SCL
t
100
100
80
CH
t
ns
CL
t
C
C
C
C
= 10pF
ns
CSS
LOAD
LOAD
LOAD
LOAD
CS Fall to Output Enable
CS Rise to Output Disable
SCK Fall to Output Data Valid
t
= 10pF
= 10pF
= 10pF
80
50
80
ns
DV
t
ns
TR
t
ns
DO
Note 2: Tested at a single temperature. Specifications over temperature are guaranteed by design.
Note 3: The MAX6629–MAX6632 are not specifically equipped with a shutdown function. Their low supply current permits powering
them from the output of a logic gate. This specification is given to ensure that the MAX6629–MAX6632 do not draw exces-
sive currents at low supply voltages, ensuring reliable operation from a gate output.
Note 4: Timing characteristics are guaranteed by design and are not production tested.
Note 5: C
= total capacitance of one bus line in picofarads.
LOAD
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MAX6629–MAX6632
12-Bit + Sign Digital Temperature Sensors
with Serial Interface
Typical Operating Characteristics
(V
= +3.3V, T = +25°C, unless otherwise noted.)
CC
A
OPERATING SUPPLY CURRENT
vs. TEMPERATURE
POWER-ON RESET (POR)
THRESHOLD vs.TEMPERATURE
TEMPERATURE ERROR
vs. TEMPERATURE
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
400
3
V
CC
= +5.5V
V
= +4.5V
CC
V
CC
= +5.0V
2
1
350
300
0
V
CC
= +3.3V
250
200
150
100
V
CC
= +3.6V
-1
V
CC
= +3.0V
-2
-3
MAX6629
MAX6629
-4
-55 -30 -5 20 45 70 95 120 145
TEMPERATURE (°C)
-55 -30 -5 20 45 70 95 120 145
TEMPERATURE (°C)
-55 -30 -5 20 45 70 95 120 145
TEMPERATURE (°C)
TEMPERATURE ERROR
RESPONSE TO THERMAL SHOCK
vs. POWER-SUPPLY NOISE FREQUENCY
12
10
8
V
= SQUARE WAVE
IN
APPLIED TO V WITH NO
0.1µF CAPACITOR
125
100
75
50
25
0
CC
6
V
IN
= 250mV
P-P
4
2
0
10 100 1k 10k 100k 1M 10M 100M
FREQUENCY (Hz)
-2
0
2
4
6
8
10 12 14
TIME (s)
Pin Description
PIN
NAME
FUNCTION
MAX6629
MAX6631
MAX6630
MAX6632
1
2
2
1
N.C.
No Connect. Connect to ground plane for better thermal performance to the PC board.
Ground
GND
Supply Voltage Input. Bypass V
to GND with a 0.1µF capacitor. V
can also be
CC
CC
3
3
V
CC
powered from a logic output as long as the voltage level is greater than 3.0V and the logic
output is not noisy. Setting the logic output low provides a hardware shutdown mode.
4
5
4
5
SCK
Serial Clock Input
Chip-Select Input. Enables the interface. A rising edge off CS initiates the next conversion.
Pulling CS low initiates an idle state.
CS
6
6
SO
EP
Serial Data Output
—
—
Exposed Pad (TDFN only). Connect to GND or leave unconnected.
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MAX6629–MAX6632
12-Bit + Sign Digital Temperature Sensors
with Serial Interface
Detailed Description
LOGIC LINE WHERE V
> 3V
LOGIC
The MAX6629–MAX6632 are local digital temperature
sensors with a serial bus. The MAX6629–MAX6632 are
typically interfaced to a μC in temperature sensing and
control applications. The MAX6629–MAX6632 convert
temperature to a 12-bit + sign word with a 0.0625°C LSB.
The data is communicated through a simple serial inter-
face with a CS (chip select) line, SO (data) line, and SCK
(clock) line. This interface can be directly connected to,
and is fully compatible with, SPI interfaces. This interface
can also be connected to virtually any processor, which
has at least three general-purpose input/output (GPIO)
lines available to implement software “bit banging.”
V
CC
MAX6629
MAX6630
MAX6631
MAX6632
SO
SCK
CS
GND
The high resolution of the MAX6629–MAX6632 makes
them especially useful in thermal control loops, HVAC
systems, or in any system where quick anticipation of
temperature trends is useful. The MAX6629–MAX6632
can produce temperature data in excess of +150°C,
although they are specified for a maximum operating
temperature of +150°C. The low power consumption is
also ideal in battery-operated and portable applications.
Figure 1. Powering the Sensor from a Logic Gate
ADC Conversion Sequence
The MAX6629–MAX6632 continuously convert tempera-
ture to digital data. Setting CS low stops any conversion
in progress, places the device in idle mode, and makes
data available for reading. Setting CS high starts a new
conversion. CS must remain high for at least 0.3s to allow
for the conversion to be completed. Figure 2 shows the
timing relationship between conversion time and conver-
sion rate.
The MAX6631/MAX6632 are optimized for minimum
power consumption with their 8s conversions. The
MAX6629/MAX6630 provide faster conversions, 0.5s, at
the expense of power consumption. The low quiescent
supply current enables the device to be powered from
a logic line or the output of a gate where the high level
exceeds 3V, as shown in Figure 1. While the MAX6629–
MAX6632 are not specifically equipped with a software
shutdown mode, the hardware shutdown can easily be
implemented by setting the gate output to low. Pulling
CS low without a clock also puts the device in idle mode.
Take care to ensure that the logic output is not noisy, as
SPI Digital Interface
The MAX6629–MAX6632 are compatible with SPI serial-
interface standards (Figure 3) and are designed to be
read-only devices. CS’s rising edge always starts a new
conversion and resets the interface. CS must stay high
for a minimum of 300ms to allow the conversion to finish.
CS’s falling edge stops any conversion in progress, and
data is latched into the shift register. Then the data clocks
excessive noise on V
ment accuracy.
can affect temperature measure-
CC
MAX6629
MAX6630
MAX6629
MAX6630
CONVERSION PERIOD
0.5s
0.25s ADC
CONVERSION TIME
MAX6631
MAX6632
MAX6631
MAX6632
0.25s ADC
CONVERSION TIME
CONVERSION PERIOD
8s
Figure 2. Conversion Time and Rate Relationships
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MAX6629–MAX6632
12-Bit + Sign Digital Temperature Sensors
with Serial Interface
t
CSS
CS
SCK
SO
t
DV
t
DO
t
TR
D15
D3
D2
D1
D0
Figure 3. SPI Timing Diagram
Table 1. Data Output Format
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
Low
D1
D0
MSB
Data
LSB
Data
Sign
High-Z
High-Z
Figure 3 shows the detailed serial timing specifications
for the SPI port. The temperature data format is in two’s
complement format (Table 2).
Table 2. Temperature Data Format
(Two’s Complement)
DIGITAL OUTPUT (BINARY)
TEMPERATURE
(°C)
Power Shutdown Mode
D15–D3
D2
0
D1, D0
XX
The MAX6629–MAX6632 do not have a built-in power
software shutdown mode. However, a power shutdown
mode is easily implemented utilizing an unused logic
gate. A typical CMOS or TTL logic output has enough
drive capability to serve as the power source if its output
voltage level exceeds 3V, as shown in Figure 1. Drive the
logic output low to provide a hardware shutdown mode.
150
125
0,1001,0110,0000
0,0111,1101,0000
0,0001,1001,0000
0,0000,0000,0001
0,0000,0000,0000
1,1111,1111,1111
1,1110,0111,0000
1,1100,1001,0000
0
XX
25
0
XX
0.0625
0
0
XX
0
XX
-0.0625
-25
0
XX
Idle Mode
0
XX
The MAX6629–MAX6632 can be put into idle mode by
pulling CS low. Data can be clocked out when the device
is in idle mode.
-55
0
XX
out at SO on SCK’s falling edge with the sign bit (D15)
first, followed by the MSB. Data is sent in one 16-bit word,
and CS must remain low until all 16 bits are transferred. If
CS goes high in the middle of a transmission, it is neces-
sary to wait the conversion time (less than 300ms) before
attempting a new read. The serial data is composed of 12
+ 1 data bits (D15–D3) and 3 trailing bits (D2–D0). D2 is
always low, serving as the confirmation bit that the device
has been communicated with. The last 2 bits, D0 and D1,
are undefined and are always in high-impedance mode
(Table 1). The power-up state for SO is high impedance.
Power-On Reset (POR)
The POR supply voltage of the MAX6629–MAX6632 is
typically 1.6V. Below this supply voltage, the interface is
inactive and the data register is set to the POR state, 0°C.
When power is first applied and V
(typ), the device starts to convert, although temperature
reading is not recommended at V levels below 3.0V.
rises above 1.6V
CC
CC
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MAX6629–MAX6632
12-Bit + Sign Digital Temperature Sensors
with Serial Interface
Applications Information
Functional Diagram
Thermal Considerations
The key to accurate temperature monitoring is good ther-
mal contact between the MAX6629–MAX6632 package
and the object being monitored. In some applications, the
6-pin SOT23 package is small enough to fit underneath
a socketed μP, allowing the device to monitor the μP’s
temperature directly. Accurate temperature monitoring
depends on the thermal resistance between the object
being monitored and the MAX6629–MAX6632 die. Heat
flows in and out of plastic packages primarily through
the leads. If the sensor is intended to measure the tem-
perature of a heat-generating component on the circuit
board, it should be mounted as close as possible to that
component and should share supply and ground traces (if
they are not noisy) with that component where possible.
This maximizes the heat transfer from the component to
the sensor.
MAX6629
MAX6630
MAX6631
MAX6632
VOLTAGE
REFERENCE
TEMPERATURE
SENSOR
12-BIT + SIGN
∑∆ ADC
CS
SCK
SO
SPI-COMPATIBLE
INTERFACE
The MAX6629/MAX6630 supply current is typically
200μA, and the MAX6631/MAX6632 supply current is
typically 32μA. When used to drive high-impedance
loads, the device dissipates negligible power. Therefore,
the die temperature is essentially the same as the pack-
age temperature.
Chip Information
PROCESS: BiCMOS
Package Information
The rise in die temperature due to self-heating is given by
the following formula:
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
ΔT = P
x θ
JA
J
DISSIPATION
where P
is the power dissipated by the
DISSIPATION
MAX6629–MAX6632, and θ is the package’s thermal
JA
resistance.
PACKAGE
TYPE
PACKAGE
CODE
DOCUMENT
NO.
LAND
PATTERN NO.
The typical thermal resistance is +110°C/W for the 6-pin
SOT23 package. To limit the effects of self-heating, mini-
mize the output currents. For example, if the MAX6629–
MAX6632 sink 1mA, the output voltage is guaranteed
to be less than 0.4V. Therefore, an additional 0.4mW of
power is dissipated within the IC. This corresponds to a
0.044°C shift in the die temperature in the 6-pin SOT23.
6 SOT23
U6FH-6
T633+2
21-0058
21-0137
90-0175
90-0058
6 TDFN-EP
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MAX6629–MAX6632
12-Bit + Sign Digital Temperature Sensors
with Serial Interface
Revision History
REVISION REVISION
PAGES
DESCRIPTION
CHANGED
NUMBER
DATE
0
5/01
Initial release of MAX6629
—
Initial release of MAX3360, MAX3361, and MAX3362; changed I
650µA (max) in the Electrical Characteristics table
from 600µA (max) to
CONV
1
7/01
1, 2
Changed the lead temperature in the Absolute Maximum Ratings section, replacing Note
2 with +300°C (removed the JEDEC solder reflow boiler plating due to high temp solder
paste for flip chips now in production)
2
3
4/04
8/05
2
Added the TDFN package
1, 2, 9
Added “+” to TDFN packages in the Ordering Information table
Added soldering information to the Absolute Maximum Ratings section
Added the TDFN exposed pad information to the Pin Description table
Removed automotive reference from data sheet
1
2
4
5/10
4
5
6
10/14
11/16
1, 5
Removed MAX6631MUT from Ordering Information table, changed non lead-free parts to
lead-free parts
1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com.
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
©
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
2016 Maxim Integrated Products, Inc.
│ 8
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