MAX6629MUT [MAXIM]
12-Bit + Sign Digital Temperature Sensors with Serial Interface; 12位+符号位数字温度传感器，串行接口
| 型号： | MAX6629MUT |
| 厂家： | 
MAXIM INTEGRATED PRODUCTS |
| 描述： | 12-Bit + Sign Digital Temperature Sensors with Serial Interface |
| 文件： | 总8页 (文件大小：153K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
19-2047; Rev 4; 5/10
12-Bit + Sign Digital Temperature Sensors
with Serial Interface
9–MAX632
General Description
Features
The MAX6629–MAX6632 are local digital temperature
sensors with an SPI™-compatible serial interface. The
temperature is converted to a 12-bit + sign word with a
resolution of 0.0625°C/LSB. An extended temperature
range provides useful readings up to +150°C.
♦ Low Power Consumption
32µA typ (MAX6631/MAX6632)
200µA typ (MAX6629/MAX6630)
♦ 12-Bit + Sign Resolution with 0.0625°C/LSB
These sensors are 3-wire serial interface SPI compati-
ble, allowing the MAX6629–MAX6632 to be readily con-
nected to a variety of microcontrollers (µCs). The
MAX6629–MAX6632 are read-only devices, simplifying
their use in systems where only temperature data is
required.
♦ Accuracy
1°C (max) from 0°C to +70°C
♦ +150°C Extended Temperature Range
♦ SPI-Compatible Serial Interface
♦ +3.0V to +5.5V Supply Range
♦ 6-Pin TDFN and SOT23 Packages
♦ Lead-Free Version Available (TDFN Package)
All four digital temperature sensors require very little
supply current, making them ideal for portable systems.
The MAX6631/MAX6632 perform a temperature-to-digi-
tal conversion once every 8s and require minimal aver-
age supply current, 32µA (typ). The MAX6629/
MAX6630 perform a conversion once every 0.5s and
require only 200µA (typ) supply current. Any of these
temperature sensors can perform conversions more
often—up to approximately four conversions per sec-
ond by reading the conversion results more often.
Ordering Information
PART
TEMP RANGE
-55°C to +125°C
-55°C to +125°C
-55°C to +125°C
-55°C to +125°C
-55°C to +125°C
-55°C to +125°C
-55°C to +125°C
-55°C to +125°C
PIN-PACKAGE
6 TDFN-EP*
6 SOT23-6
MAX6629MTT+
MAX6629MUT
MAX6630MTT+
MAX6630MUT
MAX6631MTT+
MAX6631MUT
MAX6632MTT+
MAX6632MUT
6 TDFN-EP*
6 SOT23-6
Applications
6 TDFN-EP*
6 SOT23-6
Cellular
Automotive
Hard Disk Drive
HVAC
Industrial Control
Systems
6 TDFN-EP*
6 SOT23-6
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
SPI is a trademark of Motorola, Inc.
Typical Application Circuit
Pin Configurations
TOP VIEW
+3V TO +5.5V
V
CC
MAX6629
MAX6630
MAX6631
MAX6632
N.C.
GND
1
2
3
6
5
4
SO
GND
N.C.
1
2
3
6
5
4
SO
MAX6629
MAX6631
MAX6630
MAX6632
CS
CS
SO
CS
0.1μF
V
SCK
V
SCK
CC
CC
μC
SOT23
TDFN
SOT23
TDFN
GND
SCK
________________________________________________________________ Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
12-Bit + Sign Digital Temperature Sensors
with Serial Interface
ABSOLUTE MAXIMUM RATINGS
All Voltages Referenced to GND
Junction Temperature......................................................+150°C
V
...........................................................................-0.3V, +6.0V
Operating Temperature Range (Note 1) ...........-55°C to +150°C
Storage Temperature Range.............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow)
CC
SO, SCK, CS ....................................................-0.3V, V + 0.3V
SO .......................................................................-1mA to +50mA
Current into Any Pin ............................................................10mA
CC
Continuous Power Dissipation (T = +70°C)
A
6-Pin SOT23 (derate 9.10mW/°C above +70°C)..........727mW
6-Pin TDFN (derate 24.4mW/°C above +70°C) .........1951mW
TDFN............................................................................+260°C
SOT23 (Ordering Information contains “#”).................+245°C
SOT23 (Ordering Information contains “-”)..................+240°C
Note: It is not recommended to operate the device above +125°C for extended periods of time.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
CC
= +3.0V to +5.5V, T = -55°C to +125°C, unless otherwise noted. Typical values are at V
= +3.3V and T = +25°C.) (Notes 2
CC A
A
and 3)
9–MAX632
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
TEMPERATURE
T
= room temp, V = +3.3V
-0.8
-1.0
-1.6
-2.3
-3.2
-1.0
-5.0
0.2
0.2
+0.8
+1.0
+1.6
+2.3
+3.2
+3.5
+6.5
0.6
A
CC
0°C ꢀ T ꢀ +70°C, V = +3.3V
A
CC
-20°C ꢀ T ꢀ +85°C, V = +3.3V
+0.3
+0.5
+0.8
+1.5
+1.5
0.2
A
CC
Accuracy
-20°C ꢀ T ꢀ +100°C, V = +3.3V
°C
A
CC
-40°C ꢀ T ꢀ +125°C, V = +3.3V
A
CC
T
A
T
A
ꢁ -55°C, V = +3.3V
CC
= +150°C, V = +3.3V
CC
Power-Supply Sensitivity
Resolution
PSS
°C/V
°C
0.0625
0.37
5.9
MAX6629, MAX6630, CS high
MAX6631, MAX6632, CS high
0.5
8
0.65
10.5
320
Time Between Conversion
Starts
t
s
SAMPLE
Conversion Time
t
180
250
ms
CONV
POWER SUPPLY
Supply Voltage Range
V
3.0
5.5
5
V
CC
I
Shutdown (Note 3), V = +0.8V
CC
SD
Supply Current, SCK Idle
Average Operating Current
μA
I
ADC idle (Figure 2), CS = low
ADC converting (Figure 2)
MAX6629, MAX6630
6
20
IDLE
CONV
I
360
200
32
650
400
50
I
μA
V
CC
MAX6631, MAX6632
Power-On Reset (POR)
Threshold
V
CC
falling
1.6
2
_______________________________________________________________________________________
12-Bit + Sign Digital Temperature Sensors
with Serial Interface
9–MAX632
ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= +3.0V to +5.5V, T = -55°C to +125°C, unless otherwise noted. Typical values are at V
= +3.3V and T = +25°C.) (Notes 2
CC A
A
and 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
LOGIC INPUTS (CS, SCK)
0.3 x
Logic Input Low Voltage
V
V
IL
V
CC
0.7 x
Logic Input High Voltage
V
V
IH
V
CC
Input Leakage Current
LOGIC OUTPUTS (SO)
Output Low Voltage
Output High Voltage
I
V
= V or +5.5V
GND
±1
5
μA
LEAK
IN
V
I
I
= 1.6mA
0.4
V
V
OL
SINK
V
= 1.6mA
V
CC
- 0.4
OH
SOURCE
TIMING CHARACTERISTICS (Notes 4 and 5)
Serial Clock Frequency
SCK Pulse Width High
SCK Pulse Width Low
f
5
MHz
ns
SCL
t
100
100
80
CH
t
CL
ns
CS Fall to SCK Rise
t
C
LOAD
C
LOAD
C
LOAD
C
LOAD
= 10pF
ns
CSS
CS Fall to Output Enable
CS Rise to Output Disable
SCK Fall to Output Data Valid
t
= 10pF
= 10pF
= 10pF
80
50
80
ns
DV
t
ns
TR
t
ns
DO
Note 2: Tested at a single temperature. Specifications over temperature are guaranteed by design.
Note 3: The MAX6629–MAX6632 are not specifically equipped with a shutdown function. Their low supply current permits powering
them from the output of a logic gate. This specification is given to ensure that the MAX6629–MAX6632 do not draw
excessive currents at low supply voltages, ensuring reliable operation from a gate output.
Note 4: Timing characteristics are guaranteed by design and are not production tested.
Note 5: C
= total capacitance of one bus line in picofarads.
LOAD
_______________________________________________________________________________________
3
12-Bit + Sign Digital Temperature Sensors
with Serial Interface
Typical Operating Characteristics
(V = +3.3V, T = +25°C, unless otherwise noted.)
CC
A
OPERATING SUPPLY CURRENT
vs. TEMPERATURE
POWER-ON RESET (POR)
THRESHOLD vs.TEMPERATURE
TEMPERATURE ERROR
vs. TEMPERATURE
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
400
3
V
= +5.5V
CC
V
CC
= +4.5V
V
= +5.0V
CC
2
1
350
300
0
V
CC
= +3.3V
250
200
150
100
V
= +3.6V
CC
-1
V
= +3.0V
CC
-2
-3
MAX6629
MAX6629
-4
-55 -30 -5 20 45 70 95 120 145
-55 -30 -5 20 45 70 95 120 145
-55 -30 -5 20 45 70 95 120 145
TEMPERATURE (°C)
TEMPERATURE (°C)
TEMPERATURE (°C)
9–MAX632
TEMPERATURE ERROR
vs. POWER-SUPPLY NOISE FREQUENCY
RESPONSE TO THERMAL SHOCK
12
10
8
V
= SQUARE WAVE
IN
APPLIED TO V WITH NO
0.1μF CAPACITOR
125
100
75
50
25
0
CC
6
V
= 250mV
P-P
IN
4
2
0
10 100 1k 10k 100k 1M 10M 100M
FREQUENCY (Hz)
-2
0
2
4
6
8
10 12 14
TIME (s)
Pin Description
PIN
NAME
FUNCTION
MAX6629
MAX6631
MAX6630
MAX6632
1
2
2
1
N.C.
GND
No Connect. Connect to ground plane for better thermal performance to the PC board.
Ground
Supply Voltage Input. Bypass V to GND with a 0.1μF capacitor. V can also be
CC
CC
powered from a logic output as long as the voltage level is greater than 3.0V and the
logic output is not noisy. Setting the logic output low provides a hardware shutdown
mode.
3
3
V
CC
4
5
4
5
SCK
Serial Clock Input
Chip-Select Input. Enables the interface. A rising edge off CS initiates the next
conversion. Pulling CS low initiates an idle state.
CS
6
6
SO
EP
Serial Data Output
—
—
Exposed Pad (TDFN only). Connect to GND or leave unconnected.
4
_______________________________________________________________________________________
12-Bit + Sign Digital Temperature Sensors
with Serial Interface
9–MAX632
Detailed Description
LOGIC LINE WHERE V
> 3V
LOGIC
The MAX6629–MAX6632 are local digital temperature
sensors with a serial bus. The MAX6629–MAX6632 are
typically interfaced to a µC in temperature sensing and
control applications. The MAX6629–MAX6632 convert
temperature to a 12-bit + sign word with a 0.0625°C
LSB. The data is communicated through a simple serial
interface with a CS (chip select) line, SO (data) line,
and SCK (clock) line. This interface can be directly
connected to, and is fully compatible with, SPI inter-
faces. This interface can also be connected to virtually
any processor, which has at least three general-pur-
pose input/output (GPIO) lines available to implement
software “bit banging.”
V
CC
MAX6629
MAX6630
MAX6631
MAX6632
SO
SCK
CS
GND
The high resolution of the MAX6629–MAX6632 makes
them especially useful in thermal control loops, HVAC
systems, or in any system where quick anticipation of
temperature trends is useful. The MAX6629–MAX6632
can produce temperature data in excess of +150°C,
although they are specified for a maximum operating
temperature of +150°C. This extended temperature
range makes it especially useful in automotive under-
hood applications. The low power consumption is also
ideal in battery-operated and portable applications.
Figure 1. Powering the Sensor from a Logic Gate
is not noisy, as excessive noise on V
perature measurement accuracy.
can affect tem-
CC
ADC Conversion Sequence
The MAX6629–MAX6632 continuously convert temper-
ature to digital data. Setting CS low stops any conver-
sion in progress, places the device in idle mode, and
makes data available for reading. Setting CS high starts
a new conversion. CS must remain high for at least 0.3s
to allow for the conversion to be completed. Figure 2
shows the timing relationship between conversion time
and conversion rate.
The MAX6631/MAX6632 are optimized for minimum
power consumption with their 8s conversions. The
MAX6629/MAX6630 provide faster conversions, 0.5s, at
the expense of power consumption. The low quiescent
supply current enables the device to be powered from
a logic line or the output of a gate where the high level
exceeds 3V, as shown in Figure 1.While the
MAX6629–MAX6632 are not specifically equipped with
a software shutdown mode, the hardware shutdown
can easily be implemented by setting the gate output to
low. Pulling CS low without a clock also puts the device
in idle mode. Take care to ensure that the logic output
SPI Digital Interface
The MAX6629–MAX6632 are compatible with SPI seri-
al-interface standards (Figure 3) and are designed to
be read-only devices. CS’s rising edge always starts a
new conversion and resets the interface. CS must stay
high for a minimum of 300ms to allow the conversion to
MAX6629
MAX6630
MAX6629
MAX6630
CONVERSION PERIOD
0.5s
0.25s ADC CONVERSION TIME
MAX6631
MAX6632
MAX6631
MAX6632
0.25s ADC CONVERSION TIME
CONVERSION PERIOD
8s
Figure 2. Conversion Time and Rate Relationships
_______________________________________________________________________________________
5
12-Bit + Sign Digital Temperature Sensors
with Serial Interface
t
CSS
CS
SCK
SO
t
DV
t
DO
t
TR
D15
D3
D2
D1
D0
Figure 3. SPI Timing Diagram
Table 1. Data Output Format
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
MSB
Data
LSB
Data
Sign
Low
High-Z
High-Z
9–MAX632
undefined and are always in high-impedance mode
(Table 1). The power-up state for SO is high imped-
ance. Figure 3 shows the detailed serial timing specifi-
cations for the SPI port. The temperature data format is
in two's complement format (Table 2).
Table 2. Temperature Data Format
(Two’s Complement)
DIGITAL OUTPUT (BINARY)
TEMPERATURE
(°C)
D15–D3
D2
0
D1, D0
XX
Power Shutdown Mode
The MAX6629–MAX6632 do not have a built-in power
software shutdown mode. However, a power shutdown
mode is easily implemented utilizing an unused logic
gate. A typical CMOS or TTL logic output has enough
drive capability to serve as the power source if its out-
put voltage level exceeds 3V, as shown in Figure 1.
Drive the logic output low to provide a hardware shut-
down mode.
150
125
0,1001,0110,0000
0,0111,1101,0000
0,0001,1001,0000
0,0000,0000,0001
0,0000,0000,0000
1,1111,1111,1111
1,1110,0111,0000
1,1100,1001,0000
0
XX
25
0
XX
0.0625
0
0
XX
0
XX
-0.0625
-25
0
XX
0
XX
-55
0
XX
Idle Mode
The MAX6629–MAX6632 can be put into idle mode by
pulling CS low. Data can be clocked out when the
device is in idle mode.
finish. CS’s falling edge stops any conversion in
progress, and data is latched into the shift register.
Then the data clocks out at SO on SCK’s falling edge
with the sign bit (D15) first, followed by the MSB. Data
is sent in one 16-bit word, and CS must remain low until
all 16 bits are transferred. If CS goes high in the middle
of a transmission, it is necessary to wait the conversion
time (less than 300ms) before attempting a new read.
The serial data is composed of 12 + 1 data bits
(D15–D3) and 3 trailing bits (D2–D0). D2 is always low,
serving as the confirmation bit that the device has been
communicated with. The last 2 bits, D0 and D1, are
Power-On Reset (POR)
The POR supply voltage of the MAX6629–MAX6632 is
typically 1.6V. Below this supply voltage, the interface
is inactive and the data register is set to the POR state,
0°C.
When power is first applied and V
rises above 1.6V
CC
(typ), the device starts to convert, although temperature
reading is not recommended at V levels below 3.0V.
CC
6
_______________________________________________________________________________________
12-Bit + Sign Digital Temperature Sensors
with Serial Interface
9–MAX632
Applications Information
Functional Diagram
Thermal Considerations
The key to accurate temperature monitoring is good
thermal contact between the MAX6629–MAX6632 pack-
age and the object being monitored. In some applica-
tions, the 6-pin SOT23 package is small enough to fit
underneath a socketed µP, allowing the device to moni-
tor the µP’s temperature directly. Accurate temperature
monitoring depends on the thermal resistance between
the object being monitored and the MAX6629–MAX6632
die. Heat flows in and out of plastic packages primarily
through the leads. If the sensor is intended to measure
the temperature of a heat-generating component on the
circuit board, it should be mounted as close as possible
to that component and should share supply and ground
traces (if they are not noisy) with that component where
possible. This maximizes the heat transfer from the com-
ponent to the sensor.
VOLTAGE
REFERENCE
MAX6629
MAX6630
MAX6631
MAX6632
TEMPERATURE
SENSOR
12-BIT + SIGN
∑Δ ADC
CS
SCK
SO
SPI-COMPATIBLE
INTERFACE
The MAX6629/MAX6630 supply current is typically
200µA, and the MAX6631/MAX6632 supply current is
typically 32µA. When used to drive high-impedance
loads, the device dissipates negligible power.
Therefore, the die temperature is essentially the same
as the package temperature.
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
The rise in die temperature due to self-heating is given
by the following formula:
ΔT = P
x θ
JA
J
DISSIPATION
where P
is the power dissipated by the
DISSIPATION
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
MAX6629–MAX6632, and θ is the package’s thermal
JA
6 SOT23
U6FH-6
21-0058
21-0137
resistance.
6 TDFN-EP
T633+2
The typical thermal resistance is +110°C/W for the
6-pin SOT23 package. To limit the effects of self-heat-
ing, minimize the output currents. For example, if the
MAX6629–MAX6632 sink 1mA, the output voltage is
guaranteed to be less than 0.4V. Therefore, an addi-
tional 0.4mW of power is dissipated within the IC. This
corresponds to a 0.044°C shift in the die temperature in
the 6-pin SOT23.
_______________________________________________________________________________________
7
12-Bit + Sign Digital Temperature Sensors
with Serial Interface
Revision History
REVISION REVISION
PAGES
CHANGED
DESCRIPTION
NUMBER
DATE
0
5/01
Initial release of MAX6629
—
Initial release of MAX3360, MAX3361, and MAX3362; changed I
to 650μA (max) in the Electrical Characteristics table
from 600μA (max)
CONV
1
7/01
1, 2
Changed the lead temperature in the Absolute Maximum Ratings section, replacing Note
2 with +300°C (removed the JEDEC solder reflow boiler plating due to high temp solder
paste for flip chips now in production)
2
3
4/04
8/05
2
Added the TDFN package
1, 2, 9
Added “+” to TDFN packages in the Ordering Information table
Added soldering information to the Absolute Maximum Ratings section
Added the TDFN exposed pad information to the Pin Description table
1
2
4
4
5/10
9–MAX632
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
8 _____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2010 Maxim Integrated Products
Maxim is a registered trademark of Maxim Integrated Products, Inc.
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