MAX3042BCUE-T [MAXIM]
Line Driver, 4 Func, 4 Driver, CMOS, PDSO16, ULTRA SMALL, TSSOP-16;
| 型号： | MAX3042BCUE-T |
| 厂家： | 
MAXIM INTEGRATED PRODUCTS |
| 描述： | Line Driver, 4 Func, 4 Driver, CMOS, PDSO16, ULTRA SMALL, TSSOP-16 驱动 光电二极管 接口集成电路 驱动器 |
| 文件： | 总15页 (文件大小：250K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
19-2143; Rev 1; 12/01
±±0ꢀk ꢁEDꢂ-rotected, Quad 5k REꢂ485/REꢂ422
Transmitters
General Description
Features
The MAX3040–MAX3045 is a family of 5V quad RS-
485/RS-422 transmitters designed for digital data trans-
mission over twisted-pair balanced lines. All transmitter
outputs are protected to ±±0ꢀV using the ꢁuman ꢂody
Model. In addition the MAX3040–MAX3045 withstand
±4ꢀV per IꢃE ±000-4-4 ꢃlectrical ꢄast Transient/ꢂurst
Stressing. The MAX3040/MAX3043 (250ꢀbps) and the
MAX304±/MAX3044 (2.5Mbps) are slew-rate limited
transmitters that minimize ꢃMI and reduce reflections
caused by improperly terminated cables, thus allowing
error-free transmission.
♦ ESD Protection: ±±10kV—Humn ꢀoꢁd ꢂoꢁeꢃ
♦ Singꢃe +5k Opermtion
♦ GHmrmnteeꢁ Device-to-Device S0ew
(ꢂAX3141/ꢂAX314±/ꢂAX3143/ꢂAX3144)
♦ Pin-Coupmtibꢃe with ‘SN75±74, ‘26LS3±C mnꢁ
LTC487
♦ —ot-Swmppmbꢃe for Teꢃecou Appꢃicmtions
♦ Up to 21ꢂbps Dmtm Rmte (ꢂAX3142ꢀ/ꢂAX3145ꢀ)
♦ Sꢃew-Rmte Liuiteꢁ (Dmtm Rmtes mt 2.5ꢂbps mnꢁ
2510bps)
The MAX3040–MAX3045 feature a hot-swap capability
that eliminates false transitions on the data cable during
power-up or hot insertion. The MAX3042ꢂ/MAX3045ꢂ
are optimized for data transfer rates up to 20Mbps, the
MAX304±/MAX3044 for data rates up to 2.5Mbps, and
the MAX3040/MAX3043 for data rates up to 250ꢀbps.
The MAX3040–MAX3045 offer optimum performance
when used with the MAX3093ꢃ or MAX3095 5V quad
differential line receivers or MAX3094ꢃ/MAX3096 3V
quad differential line receivers.
♦ 2nA Low-Power ShHtꢁown ꢂoꢁe
♦ ±uA Opermting SHppꢃd CHrrent
♦ ±40k EꢄT ꢄmst Trmnsient ꢀHrst ꢅuuHnitd per ꢅEC
±111-4-4
♦ Leveꢃ 2 SHrge ꢅuuHnitd per ꢅEC ±111-4-5,
Unshieꢃꢁeꢁ Cmbꢃe ꢂoꢁeꢃ
♦ Uꢃtrm-Sumꢃꢃ ±6-Pin TSSOP, ±6-Pin Nmrrow SO, mnꢁ
Wiꢁe ±6-Pin SO
The MAX3040–MAX3045 are ꢃSD-protected pin-compat-
ible, low-power upgrades to the industry-standard
‘SN75±74 and ‘DS26LS3±E. They are available in space-
saving TSSOP, narrow SO, and wide SO pacꢀages.
Ordering Information
DATA
PART
TEꢂP RANGE PꢅN-PACKAGE
RATE
ꢂAX3141EUꢃ
MAX3040ESꢃ
MAX3040EWꢃ
0°E to +70°E ±6 TSSOP
0°E to +70°E ±6 Narrow SO
0°E to +70°E ±6 Wide SO
250ꢀbps
250ꢀbps
250ꢀbps
250ꢀbps
250ꢀbps
250ꢀbps
Applications
Telecommunications ꢃquipment
Industrial Motor Eontrol
MAX3040ꢃUꢃ -40°E to +85°E ±6 TSSOP
MAX3040ꢃSꢃ -40°E to +85°E ±6 Narrow SO
MAX3040ꢃWꢃ -40°E to +85°E ±6 Wide SO
Transmitter for ꢃSD-Sensitive Applications
ꢁand-ꢁeld ꢃquipment
Ordering Information continued at end of data sheet.
Industrial PLEs
Networꢀing
-in Configurations
Eelector Guide
DATA RATE
(bps)
ꢅNDUSTRY STANDARD
PꢅNOUT
TOP VIEW
PART
T1IN
Y1
1
2
3
4
5
6
7
8
16 V
CC
MAX3040
MAX304±
MAX3042ꢂ
MAX3043
MAX3044
MAX3045ꢂ
250ꢀ
2.5M
20M
250ꢀ
2.5M
20M
75±74, 34E87, LTE487
75±74, 34E87, LTE487
75±74, 34E87, LTE487
26LS3±
15 T4IN
14 Y4
13 Z4
Z1
EN12
Z2
MAX3040
MAX3041
MAX3042B
12 EN34
11 Z3
26LS3±
Y2
26LS3±
T2IN
GND
10 Y3
9
T3IN
±6 TSSOP/SO
Pin Configurations continued at end of data sheet.
________________________________________________________________ Maxim Integrated Products
±
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
±±0ꢀkV ESD-Potected,VQuadV5kVRED485/RED422
TPansmittePs
ABSOLUTE MAXIMUM RATINGS
All voltages referenced to ground (GND).
16-Pin Narrow SO (derate 8.70mW/°C above +70°C) ..696mW
16-Pin Wide SO (derate 9.52mW/°C above +70°C) .....762mW
Operating ꢁemperature Range
MAX304_C_E.......................................................0°C to +70°C
MAX304_E_E ....................................................-40°C to +85°C
Maximum Junction ꢁemperature .....................................+150°C
Storage ꢁemperature Range.............................-65°C to +150°C
Lead ꢁemperature (soldering% 10s) .................................+300°C
Supply Voltage (V ).............................................................+7V
CC
Control Input Voltage (EN% EN% EN_) .........-0.3V to (V
Driver Input Voltage (ꢁ_IN).........................-0.3V to (V
Driver Output Voltage (Y_% Z_)
(Driver Disabled) .............................................-7.5V to +12.5V
Driver Output Voltage (Y_% Z_)
+ 0.3V)
+ 0.3V)
CC
CC
(Driver Enabled) .................................................-7.5V to +10V
Continuous Power Dissipation (ꢁ = +70°C)
A
16-Pin ꢁSSOP (derate 9.4mW/°C above +70°C) ..........755mW
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
= +5V 5ꢀ% ꢁ = ꢁ
A
to ꢁ
% unless otherwise noted. ꢁypical values are at V
= +5V and ꢁ = +25°C.) (Note 1)
CC A
CC
MIN
MAX
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DRIVER
Figure 1% R = 50Ω
2.0
1.5
Driver Differential Output
V
V
V
V
V
OD
Figure 1% R = 27Ω
Change in Magnitude of
Differential Output Voltage
∆V
Figure 1% R = 50Ω or 27Ω (Note 2)
0.2
3
OD
Driver Common-Mode Output
Voltage
V
Figure 1% R = 50Ω or 27Ω
V
/ 2
CC
OC
Change In Magnitude of
Common-Mode Voltage
∆V
Figure 1% R = 50Ω or 27Ω (Note 2)
0.2
OC
Input High Voltage
Input Low Voltage
V
ꢁ_IN% EN_% EN% EN
ꢁ_IN% EN_% EN% EN
2.0
V
V
IH
V
0.8
200
1
IL
I
HOꢁ
Hot-Swap Driver Input Current
EN_% EN% EN (Note 3)
ꢁ_IN% EN_% EN% EN
µA
µA
SWAP
Driver Input Current
I
IN
Driver Short-Circuit Output
Current
I
-7V < V
< +10V (Note 4)
25
250
mA
SC
OUꢁ
MAX3040/MAX3041/MAX3042B
EN_ = GND
Output Leakage (Y_% Z_)
when Disabled
1
µA
MAX3043/MAX3044/MAX3045B
EN = GND% EN = V
CC
ESD Protection (Y_% Z_)
Human Body Model
IEC 1000-4-4
10
kV
kV
Electrical Fast ꢁransient/Burst
Immunity
4
SUPPLY CURRENT
Supply Current
I
No load
1
2
mA
µA
CC
MAX3040/MAX3041/MAX3042B
EN_ = GND% ꢁ = +25°C
A
Supply Current in Shutdown
Mode
I
0.002
10
SHDN
MAX3043/MAX3044/MAX3045B
EN = GND% EN = V % ꢁ = +25°C
CC
A
2
_______________________________________________________________________________________
±±0ꢀkV ESD-Potected,VQuadV5kVRED485/RED422
TPansmittePs
SWITCHING CHARACTERISTICS—MAX3040/MAX3043
(V
= +5V 5ꢀ% ꢁ = ꢁ
A
to ꢁ
% unless otherwise noted. ꢁypical values are at V
= +5V and ꢁ = +25°C.)
CC A
CC
MIN
MAX
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Maximum Data Rate
f
250
kbps
MAX
t
0.7
0.7
1.5
1.5
PLH
PHL
Figures 2 and 3%
= 54Ω% C
Driver Propagation Delay
µs
µs
R
= 50pF
= 50pF
DIFF
DIFF
t
t
0.48
0.48
0.75
0.75
1.33
1.33
F
Driver Differential Output
Rise-ꢁime/Fall-ꢁime
Figures 2 and 3%
= 54Ω% C
R
DIFF
DIFF
t
R
t
t
Different chips
Same chip
Figures 2 and 3%
350
100
DSKEW
SSKEW
Skew Driver to Driver
R
DIFF
= 54Ω%
ns
C
DIFF
= 50pF
Driver Differential Output Skew
| t - t
Figures 2 and 3%
= 54Ω% C
t
100
2.0
ns
µs
µs
µs
µs
ns
ns
SKEW
|
R
= 50pF
DIFF
PLH PHL
DIFF
MAX3040% Figures 4 and 5% S2 closed%
R = 500Ω% C = 100pF
Driver Enable to Output High
t
ZH
L
L
Driver Enable from Shutdown to
Output High
Figures 4 and 5% S2 closed%
R = 500Ω% C = 100pF
t
2.0
ZH(SHDN)
L
L
MAX3040% Figures 4 and 5% S1 closed%
R = 500Ω% C = 100pF
Driver Enable to Output Low
t
2.0
ZL
L
L
Driver Enable from Shutdown to
Output Low
Figures 4 and 5% S1 closed%
R = 500Ω% C = 100pF
t
2.0
ZL(SHDN)
L
L
Figures 4 and 5% S1 closed%
R = 500Ω% C = 15pF
Driver Disable ꢁime from Low
Driver Disable ꢁime from High
t
500
500
LZ
L
L
Figures 4 and 5% S2 closed%
R = 500Ω% C = 15pF
t
HZ
L
L
SWITCHING CHARACTERISTICS—MAX3041/MAX3044
(V
= +5V 5ꢀ% ꢁ = ꢁ
A
to ꢁ
% unless otherwise noted. ꢁypical values are at V
= +5V and ꢁ = +25°C.)
CC A
CC
MIN
MAX
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Maximum Data Rate
f
2.5
Mbps
MAX
t
70
70
70
70
150
150
133
133
PLH
PHL
Figures 2 and 3%
= 54Ω% C
DIFF
Driver Propagation Delay
ns
ns
R
= 50pF
= 50pF
t
DIFF
t
33
33
Driver Differential Output
Rise-ꢁime/Fall-ꢁime
F
Figures 2 and 3%
= 54Ω% C
DIFF
R
t
DIFF
R
t
t
Different chips
Same chip
Figures 2 and 3%
52
15
DSKEW
SSKEW
Skew Driver to Driver
R
DIFF
= 54Ω%
ns
C
DIFF
= 50pF
Driver Differential Output Skew
| t - t
Figures 2 and 3%
= 54Ω% C
t
15
ns
ns
SKEW
|
R
DIFF
= 50pF
DIFF
PLH PHL
Driver Enable to Output High
MAX3041% Figures 4 and 5% S2 closed%
R = 500Ω% C = 100pF
t
400
ZH
L
L
_______________________________________________________________________________________
3
±±0ꢀkV ESD-Potected,VQuadV5kVRED485/RED422
TPansmittePs
SWITCHING CHARACTERISTICS—MAX3041/MAX3044 (continued)
(V
CC
= +5V 5ꢀ% ꢁ = ꢁ
A
to ꢁ
% unless otherwise noted. ꢁypical values are at V
= +5V and ꢁ = +25°C.)
CC A
MIN
MAX
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Driver Enable from Shutdown to
Output High
Figures 4 and 5% S2 closed%
t
400
ns
ZH(SHDN)
R = 500Ω% C = 100pF
L
L
MAX3041% Figures 4 and 5% S1 closed%
R = 500Ω% C = 100pF
Driver Enable to Output Low
t
400
400
500
500
ns
ns
ns
ns
ZL
L
L
Driver Enable from Shutdown to
Output Low
Figures 4 and 5% S1 closed%
R = 500Ω% C = 100pF
t
ZL(SHDN)
L
L
Figures 4 and 5% S1 closed%
R = 500Ω% C = 15pF
Driver Disable ꢁime from Low
Driver Disable ꢁime from High
t
LZ
L
L
Figures 4 and 5% S2 closed%
R = 500Ω% C = 15pF
t
HZ
L
L
SWITCHING CHARACTERISTICS—MAX3042B/MAX3045B
(V
CC
= +5V 5ꢀ% ꢁ = ꢁ
A
to ꢁ
% unless otherwise noted. ꢁypical values are at V
= +5V and ꢁ = +25°C.)
CC A
MIN
MAX
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Maximum Data Rate
f
20
Mbps
MAX
t
23
23
40
40
17
17
PLH
PHL
Figures 2 and 3%
= 54Ω% C
DIFF
Driver Propagation Delay
ns
ns
R
= 50pF
= 50pF
t
DIFF
t
t
Driver Differential Output
Rise-ꢁime/Fall-ꢁime
F
Figures 2 and 3%
= 54Ω% C
R
DIFF
DIFF
R
Figures 2 and 3%
t
Different chips
Same chip
8
DSKEW
Skew Driver to Driver
R
DIFF
C
DIFF
= 54Ω%
= 50pF
ns
t
8
8
SSKEW
Differential Driver Output Skew
| t - t
Figures 2 and 3%
= 54Ω% C = 50pF
DIFF
t
ns
ns
ns
SKEW
|
R
DIFF
PLH PHL
MAX3042B% Figures 4 and 5% S2 closed%
R = 500Ω% C = 100pF
Driver Enable to Output High
t
300
ZH
L
L
Driver Enable from Shutdown to
Output High
Figures 4 and 5% S2 closed%
R = 500Ω% C = 100pF
t
300
300
300
400
400
ZH(SHDN)
L
L
MAX3042B% Figures 4 and 5% S1 closed%
R = 500Ω% C = 100pF
Driver Enable to Output Low
t
ns
ns
ns
ns
ZL
L
L
Driver Enable from Shutdown to
Output Low
Figures 4 and 5% S1 closed%
R = 500Ω% C = 100pF
t
ZL(SHDN)
L
L
Figures 4 and 5% S1 closed%
R = 500Ω% C = 15pF
Driver Disable ꢁime from Low
Driver Disable ꢁime from High
t
t
LZ
L
L
Figures 4 and 5% S2 closed%
R = 500Ω% C = 15pF
HZ
L
L
Note 1: All currents into the device are positive; all currents out of the device are negative. All voltages are referenced to device
ground unless otherwise noted.
Note 2: ∆V
and ∆V
are the changes in V
and V % respectively% when the transmitter input changes state.
OD OC
OD
OC
Note 3: ꢁhis input current level is for the hot-swap enable (EN_% EN% EN) inputs and is present until the first transition only. After the
first transition the input reverts to a standard high-impedance CMOS input with input current I . For the first 20µs the input
IN
current may be as high as 1mA. During this period the input is disabled.
Note 4: Maximum current level applies to peak current just prior to foldback-current limiting. Minimum current level applies during
current limiting.
4
_______________________________________________________________________________________
±±0ꢀkV ESD-Potected,VQuadV5kVRED485/RED422
TPansmittePs
TypicalVOpePatingVChaPactePistics
(V
CC
= +5V% ꢁ = +25°C% unless otherwise noted.)
A
MAX3040/MAX3043
SUPPLY CURRENT vs. DATA RATE
MAX3042B/MAX3045B
SUPPLY CURRENT vs. DATA RATE
MAX3041/MAX3044
SUPPLY CURRENT vs. DATA RATE
45
40
60
50
NO LOAD
NO LOAD
NO LOAD
ALL FOUR TRANSMITTERS
SWITCHING
40
35
30
25
20
15
10
5
35
30
25
20
15
10
5
ALL FOUR TRANSMITTERS
SWITCHING
ALL FOUR TRANSMITTERS
SWITCHING
40
30
20
10
0
0
0
0.1
1
10
100
1000
0.1
1
10
100
1000
10,000
0.1
1
10
100 1000 10,000 100,000
DATA RATE (kbps)
DATA RATE (kbps)
DATA RATE (kbps)
OUTPUT CURRENT vs. TRANSMITTER
OUTPUT HIGH VOLTAGE
OUTPUT CURRENT vs. TRANSMITTER
OUTPUT LOW VOLTAGE
SUPPLY CURRENT vs. TEMPERATURE
80
70
60
50
40
30
20
10
0
1.2
1.1
1.0
0.9
0.8
0.7
70
60
50
40
30
20
10
0
V
= 5.25V
CC
V
= 5V
CC
V
= 4.75V
CC
NO LOAD
NO SWITCHING
0
10
20
30
40
50
60
70
-7 -6 -5 -4 -3 -2 -1
0
1
2
3
4
5
6
0
2
4
6
8
10
TEMPERATURE (°C)
OUTPUT LOW VOLTAGE (V)
OUTPUT LOW VOLTAGE (V)
OUTPUT CURRENT
vs. DIFFERENTIAL OUTPUT VOLTAGE
TRANSMITTER DIFFERENTIAL OUTPUT
VOLTAGE vs. TEMPERATURE
70
60
50
40
30
20
10
2.55
2.50
2.45
2.40
2.35
2.30
2.25
2.20
2.15
2.10
R
= 54Ω
DIFF
0
0
1
2
3
4
5
0
10
20
30
40
50
60
70
DIFFERENTIAL OUTPUT VOLTAGE (V)
TEMPERATURE (°C)
_______________________________________________________________________________________
5
±±0ꢀkV ESD-Potected,VQuadV5kVRED485/RED422
TPansmittePs
-inVSescPiption
PIN
NAME
FUNCTION
MAX3040/MAX3041/
MAX3042B
MAX3043/MAX3044/
MAX3045B
1
2
3
1
2
3
ꢁ1IN
Y1
ꢁransmitter 1 Input
Noninverting ꢁransmitter 1 Output
Inverting ꢁransmitter 1 Output
Z1
ꢁransmitter Enable High Input. Drive EN high to enable all four
transmitters. When EN is low and EN is high% all transmitters are
disabled and the part enters a low-power shutdown state. ꢁhe
transmitter outputs are high impedance when disabled.
—
4
EN
ꢁransmitter Enable Input to Control ꢁransmitters 1 and 2. Drive EN12
high to enable transmitters 1 and 2. Drive EN12 low to disable
transmitters 1 and 2. ꢁhe transmitter outputs are high impedance
when disabled. ꢁhe part enters a low-power shutdown state when
both EN12 and EN34 are low.
4
—
EN12
5
6
5
6
Z2
Y2
Inverting ꢁransmitter 2 Output
Noninverting ꢁransmitter 2 Output
ꢁransmitter 2 Input
7
7
ꢁ2IN
GND
ꢁ3IN
Y3
8
8
Ground
9
9
ꢁransmitter 3 Input
10
11
10
11
Noninverting ꢁransmitter 3 Output
Inverting ꢁransmitter 3 Output
Z3
ꢁransmitter Enable Low Input. Drive EN low to enable all four
transmitters. When EN is low and EN is high% all transmitters are
disabled and the part enters a low-power shutdown state. ꢁhe
transmitter outputs are high impedance when disabled.
—
12
EN
ꢁransmitter Enable Input to Control ꢁransmitters 3 and 4. Drive EN34
high to enable transmitters 3 and 4. Drive EN34 low to disable
transmitters 3 and 4. ꢁhe transmitter outputs are high impedance
when disabled. ꢁhe part enters a low-power shutdown state when
both EN12 and EN34 are low.
12
—
EN34
13
14
15
16
13
14
15
16
Z4
Y4
Inverting ꢁransmitter 4 Output
Noninverting ꢁransmitter 4 Output
ꢁransmitter 4 Input
ꢁ4IN
V
CC
Positive Supply. Bypass with a 0.1µF capacitor to GND.
6
_______________________________________________________________________________________
±±0ꢀkV ESD-Potected,VQuadV5kVRED485/RED422
TPansmittePs
ESD Test Conditions
SetailedVSescPiption
ESD performance depends on a number of conditions.
ꢁhe MAX3040–MAX3045 are quad RS-485/RS-422 trans-
Contact Maxim for a reliability report that documents
test setup% methodology% and results.
mitters. ꢁhey operate from a single +5V power supply
and are designed to give optimum performance when
used with the MAX3093E/MAX3095 5V quad RS-485/
RS-422 receivers or MAX3094E/MAX3096 3V quad
RS-485/RS-422 receivers. ꢁhe MAX3040–MAX3045 only
need 1mA of operating supply current and consume 2nA
when they enter a low-power shutdown mode. ꢁhe
MAX3040–MAX3045 also feature a hot-swap capability
allowing line insertion without erroneous data transfer.
ꢁhe MAX3042B/MAX3045B are capable of transferring
data up to 20Mbps% the MAX3041/MAX3044 for data
rates up to 2.5Mbps% and the MAX3040/MAX3043 for
data rates up to 250kbps. All transmitter outputs are pro-
tected to 10kV using the Human Body Model.
Human Body Model
Figure 6a shows the Human Body Model% and Figure
6b shows the current waveform it generates when dis-
charged into low impedance. ꢁhis model consists of a
100pF capacitor charged to the ESD voltage of interest%
which is then discharged into the device through a
1.5kΩ resistor.
3V
DI
1.5V
1.5V
0
t
t
PHL
PLH
1/2 V
O
±±0ꢀkV ESV-Potection
As with all Maxim devices% ESD-protection structures
are incorporated on all pins to protect against electro-
static discharges (ESD) encountered during handling
and assembly. ꢁhe MAX3040–MAX3045 transmitter
outputs have extra protection against electrostatic dis-
charges found in normal operation. Maxim’s engineers
have developed state-of-the-art structures to protect
these pins against the application of 10kV ESD
(Human Body Model)% without damage.
Z
V
O
Y
1/2 V
O
V
= V (Y) - V (Z)
DIFF
V
O
0
O
V
DIFF
90%
90%
10%
10%
-V
t
R
t
F
t
t
- t
SKEW = | PLH PHL |
Figure 3. Driver Propagation Delays
Y
V
CC
S1
S2
R
L
R
OUTPUT
UNDER TEST
V
OD
C
L
V
OC
R
Z
Figure 4. Driver Enable/Disable Timing Test Load
Figure 1. Driver DC Test Circuit
3V
DE
1.5V
1.5V
0
5V
DE
t
t
, t
LZ
ZL(SHDN) ZL
Y, Z
Y
2.5V
V
V
+0.5V
-0.5V
OUTPUT NORMALLY LOW
OUTPUT NORMALLY HIGH
OL
DI
V
OL
R
C
DIFF
DIFF
V
OD
Z
Y, Z
2.5V
OH
0
t
, t
t
HZ
ZH(SHDN) ZH
Figure 5. Driver Enable and Disable Times
_______________________________________________________________________________________
Figure 2. Driver Timing Test Circuit
7
±±0ꢀkV ESD-Potected,VQuadV5kVRED485/RED422
TPansmittePs
Machine Model
R
R
D
C
ꢁhe Machine Model for ESD testing uses a 200pF stor-
age capacitor and zero-discharge resistance. It mimics
the stress caused by handling during manufacturing
and assembly. Of course% all pins (not just RS-485
inputs) require this protection during manufacturing.
ꢁherefore% the Machine Model is less relevant to the I/O
ports than are the Human Body Model.
1.5kΩ
1MΩ
DISCHARGE
RESISTANCE
CHARGE-CURRENT
LIMIT RESISTOR
HIGH-
VOLTAGE
DC
DEVICE
UNDER
TEST
C
STORAGE
CAPACITOR
s
100pF
SOURCE
±±4k Electꢀical ꢁast TꢀansientꢂBuꢀst Testinꢃ
(IEC 1000-±-±)
IEC 1000-4-4 Electrical Fast ꢁransient/Burst (EFꢁ/B) is
an immunity test for the evaluation of electrical and
electronic systems during operating conditions. ꢁhe
test was adapted for evaluation of integrated circuits
with power applied. Repetitive fast transients with
severe pulsed EMI were applied to signal and control
ports. Over 15%000 distinct discharges per minute are
sent to each interface port of the IC or equipment under
test (EUꢁ) simultaneously with a minimum test duration
time of one minute. ꢁhis simulates stress due to dis-
placement current from electrical transients on AC
mains% or other telecommunication lines in close prox-
imity. Short rise times and very specific repetition rates
are essential to the validity of the test.
Figure 6a. Human Body ESD Test Model
I
P
100%
90%
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
I
r
AMPERES
36.8%
10%
0
TIME
0
t
RL
t
DL
Stress placed on the EUꢁ is severe. In addition to the
controlled individual discharges placed on the EUꢁ%
extraneous noise and ringing on the transmission line
can multiply the number of discharges as well as
increase the magnitude of each discharge. All cabling
was left unterminated to simulate worst-case reflections.
CURRENT WAVEFORM
Figure 6b. Human Body Model Current Waveform
ꢁhe MAX3040–MAX3045 were setup as specified in
IEC 1000-4-4 and the Typical Operating Circuit of this
data sheet. ꢁhe amplitude% pulse rise time% pulse dura-
tion% pulse repetition period% burst duration% and burst
period (Figure 8) of the burst generator were all verified
with a digital oscilloscope according to the specifica-
tions in IEC 1000-4-4 sections 6.1.1 and 6.1.2. A simpli-
fied diagram of the EFꢁ/B generator is shown in Figure
7. ꢁhe burst stresses were applied to Y1–Y4 and Z1–Z4
simultaneously.
Table 1. Test Severity Levels for
Communication Lines
ON I/O,
SIGNAL, DATA
EFT
INDUSTRIAL
ELECTRO-
MAGNETIC
AND CONTROL
LEVEL
PORTS
ENVIROMENT
PEAK
VOLTAGE
REPETITION
RATE (kHz)
IEC 1000-4-4 provides several levels of test severity
(see ꢁable 1). ꢁhe MAX3040–MAX3045 pass the 4000V
stress% a special category “X” beyond the highest level
for severe (transient) industrial environments for
telecommunication lines.
1
2
3
4
X
250
500
5
5
5
5
5
Well protected
Protected
ꢁypical
1000
2000
4000
Severe
MAX3040–MAX3045
8
_______________________________________________________________________________________
±±0ꢀkV ESD-Potected,VQuadV5kVRED485/RED422
TPansmittePs
I CV±000D4D4VBuPst/ lectPicalVFast
TPansientVTestVLevelsV
(FoPVCommunicationVLines)
SPARK GAP
COAXIAL
R
R
C
D
C
M
OUTPUT
ꢁhe stresses are applied while the MAX3040–MAX3045
are powered up. ꢁest results are reported as:
50Ω
1) Normal performance within the specification limits.
U
R
S
C
E
2) ꢁemporary degradation or loss of function or perfor-
mance which is self-recoverable.
3) ꢁemporary degradation% loss of function or perfor-
mance requiring operator intervention% such as sys-
tem reset.
U = HIGH-VOLTAGE SOURCE
= CHARGING RESISTOR
R
C
C = ENERGY STORAGE CAPACITOR
E
S
M
D
4) Degradation or loss of function not recoverable due
to damage.
R
R
= PULSE DURATION SHAPING RESISTOR
= IMPEDANCE MATCHING RESISTOR
= DC BLOCKING CAPACITOR
C
ꢁhe MAX3040–MAX3045 meets classification 2 listed
above. Additionally% the MAX3040–MAX3045 will not
latchup during the IEC burst stress events.
Figure 7. Simplified Circuit Diagram of a Fast Transient/Burst
Generator
HotDEwapVCapability
Hot-Swap Inputs
When circuit boards are plugged into a “hot” back-
plane% there can be disturbances to the differential sig-
nal levels that could be detected by receivers
connected to the transmission line. ꢁhis erroneous data
could cause data errors to an RS-485/RS-422 system.
ꢁo avoid this% the MAX3040–MAX3045 have hot-swap
capable inputs.
PULSE
REPETITION PERIOD (DEPENDS ON THE TEST VOLTAGE LEVER,
IN CONFORMITY WITH THE VALUES INDICATED IN 6.1.2).
When a circuit board is plugged into a “hot” backplane
there is an interval during which the processor is going
through its power-up sequence. During this time% the
processor’s output drivers are high impedance and will
be unable to drive the enable inputs of the
MAX3040–MAX3045 (EN% EN% EN_) to defined logic lev-
els. Leakage currents from these high impedance dri-
vers% of as much as 10µA% could cause the enable
inputs of the MAX3040–MAX3045 to drift high or low.
Additionally% parasitic capacitance of the circuit board
could cause capacitive coupling of the enable inputs to
BURST
15ms
BURST DURATION
BURST PERIOD 300ms
Figure 8. General Graph of a Fast Transient Burst
either GND or V . ꢁhese factors could cause the
CC
enable inputs of the MAX3040–MAX3045 to drift to lev-
els that may enable the transmitter outputs (Y_ and Z_).
ꢁo avoid this problem% the hot-swap input provides a
method of holding the enable inputs of the
devices% Q1 and Q2 (Figure 9). When V
is ramping
CC
up from 0% an internal 10µs timer turns on Q2 and sets
the SR latch% which also turns on Q1. ꢁransistors Q2% a
700µA current sink% and Q1% an 85µA current sink% pull
EN to GND through a 5.6kΩ resistor. Q2 is designed to
pull the EN input to the disabled state against an exter-
nal parasitic capacitance of up to 100pF that is trying to
enable the EN input. After 10µs% the timer turns Q2 off
and Q1 remains on% holding the EN input low against
three-state output leakages that might enable EN. Q1
remains on until an external source overcomes the
MAX3040–MAX3045 in the disabled state as V
CC
ramps up. ꢁhis hot-swap input is able to overcome the
leakage currents and parasitic capacitances that may
pull the enable inputs to the enabled state.
Hot-Swap Input Ciꢀcuitꢀy
In the MAX3040–MAX3045 the enable inputs feature
hot-swap capability. At the input there are two NMOS
_______________________________________________________________________________________
9
±±0ꢀkV ESD-Potected,VQuadV5kVRED485/RED422
TPansmittePs
V
CC
10µs
TIMER
TIMER
5.6kΩ
EN
EN
(HOT SWAP)
700µA
85µA
Q1
Q2
Figure 9. Simplified Structure of the Driver Enable Pin (EN)
required input current. At this time the SR latch resets
and Q1 turns off. When Q1 turns off% EN reverts to a
OpePationVofV nableV-ins
ꢁhe MAX3040–MAX3045 family has two enable-func-
standard% high-impedance CMOS input. Whenever V
CC
tional versions:
drops below 1V% the hot-swap input is reset.
ꢁhe MAX3040/MAX3041/MAX3042B have two transmit-
ter enable inputs EN12 and EN34. EN12 controls the
transmitters 1 and 2% and EN34 controls transmitters 3
and 4. EN12 and EN34 are active-high and the part will
enter the low-power shutdown mode when both are
pulled low. ꢁhe transmitter outputs are high impedance
when disabled (ꢁable 2).
ꢁhe EN12 and EN34 input structures are identical to the
EN input. For the EN input% there is a complimentary cir-
cuit employing two PMOS devices pulling the EN input
to V
.
CC
Hot-Swap Line Tꢀansient
ꢁhe circuit of Figure 10 shows a typical offset termina-
tion used to guarantee a greater than 200mV offset
when a line is not driven. ꢁhe 50pF represents the mini-
mum parasitic capacitance which would exist in a typi-
cal application. In most cases% more capacitance exists
in the system and will reduce the magnitude of the
glitch. During a “hot-swap” event when the driver is
connected to the line and is powered up% the driver
must not cause the differential signal to drop below
200mV. Figures 11 and 12 show the results of the
MAX3040–MAX3045 during power-up for two different
ꢁhe MAX3043/MAX3044/MAX3045B have two transmit-
ter enable inputs EN and EN% which are active-high and
active-low% respectively. When EN is logic high or EN is
logic low all transmitters are active. When EN is pulled
low and EN is driven high% all transmitters are disabled
and the part enters the low-power shutdown mode. ꢁhe
transmitter outputs are high impedance when disabled
(ꢁable 3).
ApplicationsVInfoPmation
V
ramp rates (0.1V/µs and 1V/µs). ꢁhe photos show
TypicalVApplications
ꢁhe MAX3040–MAX3045 offer optimum performance
when used with the MAX3093E/MAX3095 5V quad
receivers or MAX3094E/MAX3096 3V quad differential
line receivers. Figure 13 shows a typical RS-485 con-
nection for transmitting and receiving data and Figure
14 shows a typical multi-point connection.
CC
the V
ramp% the single-ended signal on each side of
CC
the 100Ω termination% the differential signal across the
termination% and shows the hot-swap line transient
stays above the 200mV RS-485 specification.
10 ______________________________________________________________________________________
±±0ꢀkV ESD-Potected,VQuadV5kVRED485/RED422
TPansmittePs
Table 2. Function Table for MAX3040/
MAX3041/MAX3042B
Table 3. Function Table for MAX3043/
MAX3044/MAX3045B
(Each Pair of Transmitters)
(All Transmitters)
OUTPUTS
OUTPUTS
INPUT
EN
EN
INPUT
EN_
Y
Z
Y_
H
Z_
L
H
L
H
H
X
X
L
X
X
L
H
L
H
L
H
H
L
L
H
L
L
H
H
L
H
L
L
H
X
High-Z
High-Z
X
H
High-Z
High-Z
H = Logic High
L = Logic Low
X = Don’t Care
High-Z = High Impedance
H = Logic High
L = Logic Low
X = Don’t Care
High-Z = High Impedance
V
5V
CC
1kΩ
Y
Z
V
CC
2V/div
T
Y
IN
0.1kΩ
1kΩ
50pF
(V OR GND)
200mV/div
Z
CC
200mV/div
Y-Z
(20mV/div)
238mV
Figure 10. Differential Power-Up Glitch (Hot Swap)
Figure 11. Differential Power-Up Glitch (0.1V/µs)
V
CC
2V/div
Y
50mV/div
Z
50mV/div
Y-Z
(5mV/div)
238mV
1µs/div
Figure 12. Differential Power-Up Glitch (1V/µs)
______________________________________________________________________________________ 11
±±0ꢀkV ESD-Potected,VQuadV5kVRED485/RED422
TPansmittePs
MAX3043–MAX3045
D1
MAX3095
R1
R1OUT
R2OUT
T1IN
T2IN
RT
RT
D2
R2
R3OUT
R4OUT
T3IN
T4IN
RT
RT
D3
D4
R3
R4
EN
EN
G
G
GND
GND
V
CC
V
CC
Figure 13. Typical Connection of a Quad Transmitter and a Quad Receiver as a Pair
impedance of the cable% reflections will occur as the
signal is traveling down the cable. Although some
reflections are inevitable due to the cable and resistor
tolerances% large mismatches can cause significant
reflections resulting in errors in the data. With this in
mind% it is very important to match the terminating resis-
tance and the characteristic impedance as closely as
possible. As a general rule in a multi-drop system% termi-
nation resistors should always be placed at both ends of
the cable.
TypicalVMultipleD-ointVConnection
Figure 14 shows a typical multiple-point connection for
the MAX3040–MAX3045 with the MAX3095. Because of
the high frequencies and the distances involved% high
attention must be paid to transmission-line effects while
using termination resistors. A terminating resistor (Rꢁ)
is simply a resistor that should be placed at the
extreme ends of the cable to match the characteristic
impedance of the cable. When the termination resis-
tance is not the same value as the characteristic
12 ______________________________________________________________________________________
±±0ꢀkV ESD-Potected,VQuadV5kVRED485/RED422
TPansmittePs
1/4 MAX3040–MAX3045
1/4 MAX3040–MAX3045
RT
RT
1/4 MAX3095
1/4 MAX3095
UP TO 32 RS-485
UNIT LOADS
1/4 MAX3040–MAX3045
1/4 MAX3040–MAX3045
1/4 MAX3095
1/4 MAX3095
Figure 12. Typical Connection for Multiple-Point RS-485 Bus
OPdePingVInfoPmationV(continued)
DATA
RATE
DATA
PART
TEMP RANGE PIN-PACKAGE
PART
TEMP RANGE PIN-PACKAGE
RATE
20Mbps
20Mbps
20Mbps
20Mbps
20Mbps
20Mbps
MAX3045BCUE 0°C to +70°C 16 ꢁSSOP
MAX3045BCSE 0°C to +70°C 16 Narrow SO
MAX3041CUE
MAX3041CSE
MAX3041CWE
0°C to +70°C 16 ꢁSSOP
0°C to +70°C 16 Narrow SO
0°C to +70°C 16 Wide SO
2.5Mbps
2.5Mbps
2.5Mbps
2.5Mbps
2.5Mbps
2.5Mbps
20Mbps
20Mbps
20Mbps
20Mbps
20Mbps
20Mbps
250kbps
250kbps
250kbps
250kbps
250kbps
250kbps
2.5Mbps
2.5Mbps
2.5Mbps
2.5Mbps
2.5Mbps
2.5Mbps
MAX3045BCWE 0°C to +70°C 16 Wide SO
MAX3045BEUE -40°C to +85°C 16 ꢁSSOP
MAX3045BESE -40°C to +85°C 16 Narrow SO
MAX3045BEWE -40°C to +85°C 16 Wide SO
MAX3041EUE -40°C to +85°C 16 ꢁSSOP
MAX3041ESE -40°C to +85°C 16 Narrow SO
MAX3041EWE -40°C to +85°C 16 Wide SO
MAX3042BCUE 0°C to +70°C 16 ꢁSSOP
-inVConfiguPationsV(continued)
MAX3042BCSE
0°C to +70°C 16 Narrow SO
MAX3042BCWE 0°C to +70°C 16 Wide SO
MAX3042BEUE -40°C to +85°C 16 ꢁSSOP
MAX3042BESE -40°C to +85°C 16 Narrow SO
MAX3042BEWE -40°C to +85°C 16 Wide SO
TOP VIEW
T1IN
Y1
1
2
3
4
5
6
7
8
16 V
CC
15 T4IN
14 Y4
13 Z4
12 EN
11 Z3
10 Y3
Z1
MAX3043CUE
MAX3043CSE
MAX3043EWE
0°C to +70°C 16 ꢁSSOP
0°C to +70°C 16 Narrow SO
0°C to +70°C 16 Wide SO
EN
MAX3043
MAX3044
MAX3045B
Z2
MAX3043EUE -40°C to +85°C 16 ꢁSSOP
MAX3043ESE -40°C to +85°C 16 Narrow SO
MAX3043EWE -40°C to +85°C 16 Wide SO
Y2
T2IN
GND
9
T3IN
MAX3044CUE
MAX3044CSE
MAX3044CWE
0°C to +70°C 16 ꢁSSOP
0°C to +70°C 16 Narrow SO
0°C to +70°C 16 Wide SO
16 TSSOP/SO
ChipVInfoPmation
MAX3044EUE -40°C to +85°C 16 ꢁSSOP
MAX3044ESE -40°C to +85°C 16 Narrow SO
MAX3044EWE -40°C to +85°C 16 Wide SO
ꢁRANSISꢁOR COUNꢁ: 545
PROCESS: CMOS
______________________________________________________________________________________ 13
±1 0 k V ES D-P ro t e c t e d , Qu a d 5 V RS -4 8 5 /4 2 2
Tra n s m it t e rs
Ord e rin g In fo rm a t io n (c o n t in u e d )
TEMP.
RANGE
DATA
RATE
TEMP.
RANGE
DATA
RATE
PART
PIN-PACKAGE
PART
PIN-PACKAGE
MAX3044CUE
MAX3044CSE
MAX3044CWE
0°C to +70°C 16 TSSOP
0°C to +70°C 16 Narrow SO
0°C to +70°C 16 Wide SO
2.5Mbps
2.5Mbps
2.5Mbps
2.5Mbps
2.5Mbps
2.5Mbps
20Mbps
20Mbps
20Mbps
20Mbps
20Mbps
20Mbps
MAX3041CUE
MAX3041CSE
MAX3041CWE
0°C to +70°C 16 TSSOP
0°C to +70°C 16 Narrow SO
0°C to +70°C 16 Wide SO
2.5Mbps
2.5Mbps
2.5Mbps
2.5Mbps
2.5Mbps
2.5Mbps
20Mbps
20Mbps
20Mbps
20Mbps
20Mbps
20Mbps
250kbps
250kbps
250kbps
250kbps
250kbps
250kbps
MAX3044EUE -40°C to +85°C 16 TSSOP
MAX3044ESE -40°C to +85°C 16 Narrow SO
MAX3044EWE -40°C to +85°C 16 Wide SO
MAX3045BCUE 0°C to +70°C 16 TSSOP
MAX3045BCSE 0°C to +70°C 16 Narrow SO
MAX3045BCWE 0°C to +70°C 16 Wide SO
MAX3045BEUE -40°C to +85°C 16 TSSOP
MAX3045BESE -40°C to +85°C 16 Narrow SO
MAX3045BEWE -40°C to +85°C 16 Wide SO
MAX3041EUE -40°C to +85°C 16 TSSOP
MAX3041ESE -40°C to +85°C 16 Narrow SO
MAX3041EWE -40°C to +85°C 16 Wide SO
MAX3042BCUE 0°C to +70°C 16 TSSOP
MAX3042BCSE
0°C to +70°C 16 Narrow SO
MAX3042BCWE 0°C to +70°C 16 Wide SO
MAX3042BEUE -40°C to +85°C 16 TSSOP
MAX3042BESE -40°C to +85°C 16 Narrow SO
MAX3042BEWE -40°C to +85°C 16 Wide SO
MAX3043CUE
MAX3043CSE
MAX3043EWE
0°C to +70°C 16 TSSOP
0°C to +70°C 16 Narrow SO
0°C to +70°C 16 Wide SO
MAX3043EUE -40°C to +85°C 16 TSSOP
MAX3043ESE -40°C to +85°C 16 Narrow SO
MAX3043EWE -40°C to +85°C 16 Wide SO
P in Co n fig u ra t io n s (c o n t in u e d )
TOP VIEW
T1IN
Y1
1
2
3
4
5
6
7
8
16 V
CC
15 T4IN
14 Y4
13 Z4
12 EN
11 Z3
10 Y3
Z1
EN
MAX3043
MAX3044
MAX3045B
Z2
Y2
T2IN
GND
9
T3IN
16 TSSOP/SO
14 ______________________________________________________________________________________
±±0ꢀkV ESD-Potected,VQuadV5kVRED485/RED422
TPansmittePs
-acꢀageVInfoPmationV(continued)
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
MaximVIntegPatedV-Poducts,V±20VEanVGabPielVSPive,VEunnyvale,VCAVV94086V408D737D7600V ____________________ 15
© 2001 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.
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